Mounting structure for microvibrator

Abstract

In an installation structure, a microvibrator (2) has a curved surface portion (21) with a semispherical surface, a connecting portion (22) extending from the curved surface portion toward a semispherical center of the curved surface portion, and a surface electrode (23) covering at least a portion of the connecting portion and at least a portion of the curved surface portion. An installation substrate (3) has two or more wirings (42), and a portion of the microvibrator is connected to the installation substrate. The wirings each have an electrode connecting portion (421) connected to the surface electrode covering a portion of the connecting portion at an end portion. The two or more wirings include a voltage application wiring (42A) for applying a voltage to the surface electrode and a voltage detection wiring (42B) for detecting the voltage applied to the surface electrode. The voltage application wiring is spaced apart from the voltage detection wiring on the installation substrate.

Description

Technical Field

[0001] This disclosure relates to a mounting structure for a micro-vibrator with a three-dimensional curved surface. Background Technology

[0002] In recent years, a system for autonomous driving of vehicles has been developed. This system requires technology for high-precision position estimation. For example, a self-position estimation system equipped with a Global Navigation Satellite System (GNSS) and an Internal Measurement Unit (IMU) has been developed for so-called Level 3 autonomous driving. The IMU is, for example, a six-axis inertial sensor consisting of a three-axis gyroscope sensor and a three-axis accelerometer sensor. In the future, to achieve Level 4 or higher levels of autonomous driving, IMUs with higher sensitivity than current systems will be needed.

[0003] To achieve such a high-sensitivity IMU, the bird-bowl resonator gyroscope (BRG) is considered a promising gyroscope sensor. The BRG has a mounting base and a micro-vibrator mounted on the mounting base. The micro-vibrator has a substantially hemispherical three-dimensional surface and vibrates in a wine glass mode. This micro-vibrator has a Q-factor of 10, representing the vibrational state. 6 Or even greater. Therefore, it is expected that this micro-vibrator will achieve higher sensitivity than previous micro-vibrators.

[0004] For example, US2019 / 0094024A1 discloses a mounting structure for this type of micro-vibrator on a mounting substrate. In the disclosed mounting structure, the micro-vibrator has a substantially hemispherical three-dimensional curved surface and a connecting portion extending from near the top of the hemispherical three-dimensional shape toward the center of the hemispherical shape. The connecting portion is shaped like a bottomed tube and defines a recess that is recessed from the top of the hemispherical three-dimensional shape of the curved surface. The connecting portion is inserted into a connecting region of a mounting substrate surrounded by a substantially annular frame. In this mounting structure, surface electrodes covering the entire surface of the micro-vibrator and wiring formed in the connecting region of the mounting substrate are coupled to each other, such that a predetermined voltage can be applied to the surface electrodes of the micro-vibrator via the wiring of the mounting substrate. Summary of the Invention

[0005] In the disclosed BRG, the micro-vibrator is bonded to a bonding area on the mounting substrate that is electrically connected to wiring, such that voltage is applied to the surface electrode of the micro-vibrator via wiring on the mounting substrate. Therefore, the reliability of the bonding between the micro-vibrator and the mounting substrate is important to ensure the stability of voltage application. Furthermore, in this mounting structure, to confirm whether voltage is applied to the surface electrode of the micro-vibrator, it is necessary to detect the voltage by connecting a probe to a portion of the surface electrode other than the bonding portion with the mounting substrate.

[0006] However, if the probe comes into direct contact with the surface electrode of the micro-vibrator, the surface electrode or the substrate covering the surface electrode may be damaged. If the surface electrode or the substrate is damaged, the Q factor of the micro-vibrator may be reduced. In addition, for example, when the cover is attached to the mounting substrate and the micro-vibrator is closed, the probe cannot come into contact with the surface electrode of the micro-vibrator, and therefore the voltage applied to the surface electrode cannot be detected.

[0007] The purpose of this disclosure is to provide a mounting structure for a micro-vibrator on a mounting substrate, the micro-vibrator having a three-dimensional curved shape and including a surface electrode covering its surface, which is capable of detecting the applied voltage to the surface electrode without needing to contact any part of the surface electrode other than the portion that is bonded to the mounting substrate.

[0008] According to one aspect of this disclosure, the mounting structure includes a micro-vibrator and a mounting substrate. The micro-vibrator has a curved portion with a hemispherical surface, a connecting portion extending from the curved portion toward the hemispherical center of the curved portion, and a surface electrode that at least partially covers the connecting portion and at least partially covers the curved portion. The mounting substrate has two or more wirings, and a portion of the micro-vibrator is connected to the mounting substrate. Each of the two or more wirings has an electrode connecting portion that is connected to a portion of the surface electrode whose ends cover the connecting portion. The two or more wirings include voltage application wiring for applying a voltage to the surface electrode and voltage detection wiring for detecting the voltage applied to the surface electrode. The voltage application wiring is spaced apart from the voltage detection wiring on the mounting substrate.

[0009] In the mounting structure according to the above aspects, a portion of the connection portion of the surface electrode covering the micro-vibrator is coupled to an electrode connection portion defined by the end of a voltage detection wire provided on the mounting substrate. The voltage detection wire is spaced apart from the voltage application wire, which is used to apply voltage to the surface electrode of the micro-vibrator. Furthermore, the voltage detection wire is electrically independent of the voltage application wire on the mounting substrate. Therefore, in this mounting structure, the voltage of the surface electrode can be detected by the voltage detection wire. That is, when detecting the voltage of the surface electrode, direct contact with the surface electrode of the micro-vibrator is not required except at the coupling portion of the mounting substrate. Therefore, in this mounting structure, the reliability of the connection between the micro-vibrator and the mounting substrate can be confirmed based on electrical characteristics such as the resistance of the paths having the voltage application wire and the voltage detection wire. Simultaneously, damage to the surface electrode and the substrate covered by the surface electrode is suppressed, or a decrease in the Q factor is suppressed. Attached Figure Description

[0010] The above and other objects, features and advantages of this disclosure will become more apparent from the following detailed description with reference to the accompanying drawings, in which like parts are indicated by like reference numerals, and in the drawings:

[0011] Figure 1 This is a top layout diagram showing the mounting structure according to the first embodiment;

[0012] Figure 2 This is a perspective cross-sectional view of the micro-vibrator according to the first embodiment;

[0013] Figure 3 It shows along Figure 2 A cross-sectional view of the micro-vibrator taken from line III-III in the diagram;

[0014] Figure 4A This is a cross-sectional view showing the component fabrication steps in the process of forming a micro-vibrator with a three-dimensional curved surface;

[0015] Figure 4B It is shown in Figure 4A Cross-sectional view of the subsequent micro-vibrator fabrication process;

[0016] Figure 4C It is shown in Figure 4B Cross-sectional view of the subsequent micro-vibrator fabrication process;

[0017] Figure 5 This is a top layout view of the mounting substrate according to the first embodiment;

[0018] Figure 6 It shows along Figure 5 A cross-sectional view taken from line VI-VI in the diagram;

[0019] Figure 7 It shows along Figure 5 A cross-sectional view taken from line VII-VII in the diagram;

[0020] Figure 8 It shows along Figure 1 A cross-sectional view taken from line VIII-VIII in the diagram;

[0021] Figure 9 It shows along Figure 1 A cross-sectional view taken from line Ix-Ix in the diagram;

[0022] Figure 10 This is a top layout view showing an enlarged view of a predetermined area including the facing area of ​​the mounting substrate, used to illustrate another example of separating the inner frame portion and the electrode connection portion;

[0023] Figure 11 It shows the corresponding Figure 10 The top layout diagram of the section is used to show another example of the separation between the inner frame section and the electrode connection section;

[0024] Figure 12 It shows the corresponding Figure 10The top layout diagram of the section is used to show yet another example of separating the inner frame section and the electrode connection section;

[0025] Figure 13 This is an explanatory diagram illustrating the electrical connection between the surface electrode and the bridging wiring in the mounting structure according to the first embodiment;

[0026] Figure 14 It shows the corresponding Figure 10 The top layout diagram is used to illustrate a variation of the mounting substrate according to the first embodiment;

[0027] Figure 15 It is shown in Figure 14 The mounting base shown is equipped with a micro-vibrator along the path. Figure 14 A cross-sectional view taken from the line xV-xV in the diagram;

[0028] Figure 16 This is a perspective view showing the connection between the micro-vibrator and the mounting substrate in the mounting structure according to the second embodiment;

[0029] Figure 17 This is a perspective view showing the connection portion of the micro-vibrator according to the second embodiment;

[0030] Figure 18 It shows when it forms Figure 17 A perspective view of the cap mask used when creating the patterned surface electrodes shown;

[0031] Figure 19 This is a perspective view showing the connection portion of a micro-vibrator according to a variant of the second embodiment;

[0032] Figure 20 It is shown that... Figure 10 The corresponding top layout diagram is used to show the structure of a portion of the mounting substrate according to the variant of the second embodiment;

[0033] Figure 21 This is a diagram showing the connection between the micro-vibrator and the mounting substrate in a modified mounting structure according to the second embodiment, and is along... Figure 20 A cross-sectional view taken from line xxI-xxI in the diagram;

[0034] Figure 22 This illustrates another variation of the second embodiment corresponding to Figure 21 A diagram of the installation structure;

[0035] Figure 23 This is a cross-sectional view showing the joint between the micro-vibrator and the mounting substrate in the mounting structure according to the third embodiment;

[0036] Figure 24This illustrates a variation corresponding to the third embodiment. Figure 10 Top layout diagram of the mounting substrate;

[0037] Figure 25 This is a cross-sectional view illustrating an example of an installation structure according to a variant embodiment;

[0038] Figure 26 This is a top layout view of a mounting substrate according to another variant embodiment;

[0039] Figure 27 This illustrates a corresponding variant embodiment. Figure 14 A diagram showing the connection structure between the surface electrode of the micro-vibrator and the wiring of the mounting substrate.

[0040] Figure 28 This illustrates a corresponding variant embodiment. Figure 14 A diagram showing the connection structure between the surface electrode of the micro-vibrator and the wiring on the mounting substrate; and

[0041] Figure 29 This illustrates a corresponding embodiment according to yet another variant. Figure 14 The diagram shows the connection structure between the surface electrode of the micro-vibrator and the wiring of the mounting substrate. Detailed Implementation

[0042] Embodiments of this disclosure will be described below with reference to the accompanying drawings. In the following description of the embodiments, the same or equivalent parts are indicated by the same reference numerals.

[0043] (First Embodiment)

[0044] The mounting structure 1 of the first embodiment will be described with reference to the accompanying drawings. The mounting structure 1 of this embodiment includes a micro-vibrator 2 that vibrates in a wine glass pattern and can be applied to various devices utilizing the vibration characteristics of the micro-vibrator 2, such as gyroscope sensors including BRGs and clock devices. In this specification, the application of the mounting structure 1 to a BRG will be described as a representative example. However, the mounting structure 1 is not limited to this application and can be applied to other sensors, such as inertial sensors other than gyroscope sensors.

[0045] exist Figure 2 In order to make the structure of the micro-vibrator 2 easier to understand, the micro-vibrator 2 is shown in cross-section, while a portion is omitted, and the outline of a portion of the micro-vibrator 2 (which is shown in cross-section) is also shown. Figure 2 (The angle cannot be directly observed) is shown with dashed lines. Figures 10 to 12 In this example, to facilitate understanding of other structural examples of the bridging wiring 42 and the inner frame portion 51 of the mounting substrate 3, a predetermined area including the inner frame portion 51 is shown, and other portions of the mounting substrate 3 are omitted. Furthermore, although... Figures 10 to 12 This is not a cross-sectional view, but the bridging wiring 42 is shown in shaded lines.

[0046] In the following text, for ease of explanation, such as Figure 1 As shown, the direction along the left and right sides in the view is called the "x-direction," and the direction orthogonal to the x-direction in the view is called the "y-direction." Furthermore, the normal direction of the xy-plane, which includes both the x and y directions, is called the "z-direction." Figure 3 The x, y, and z directions in the following figures correspond to... Figure 1 The x, y, and z directions are specified in the diagram. In this specification, "up" or "upward" indicates the direction along the z-direction in the view, and also indicates the direction along the arrow; "down" or "downward" indicates the opposite direction to "up" or "upward." Furthermore, in this specification, as... Figure 1 The view shown along the z-direction from the top of the mounting structure 1 or mounting base plate 3 is called the "top view".

[0047] For example, such as Figure 1 As shown, the mounting structure 1 of this embodiment includes a micro-vibrator 2 and a mounting substrate 3. A portion of the micro-vibrator 2 is attached to the mounting substrate 3. The mounting structure 1 detects the angular velocity applied thereto based on the capacitance change between the micro-vibrator 2 (which is thin and vibrates in a wine glass pattern) and a plurality of electrode portions 53 (described later) on the mounting substrate 3.

[0048] For example, such as Figure 2 As shown, the micro-vibrator 2 includes a curved portion 21 and a connecting portion 22. The curved portion 21 has a profile defined by a hemispherical three-dimensional curved surface, and the connecting portion 22 extends from a virtual vertex of the hemispherical curved portion 21 toward the center of the hemispherical shape. The connecting portion 22 has a bottomed tubular shape and defines, for example, a recess. In the micro-vibrator 2, for example, the curved portion 21 has a bowl-shaped three-dimensional curved surface. The micro-vibrator 2 presents 10 5 Or a larger vibrational Q factor.

[0049] The end of the curved portion 21 opposite to the connecting portion 22 is referred to as edge 211. Edge 211 has, for example, a basic tubular shape. The microvibrator 2 is mounted on the mounting substrate 3 in such a way that the front surface 2A of edge 211 faces the plurality of electrode portions 53 (described later) of the mounting substrate 3, and the distance between edge 211 and the plurality of electrode portions 53 is uniform. In the mounting structure 1, the microvibrator 2 is a component in which, when mounted on the mounting substrate 3, the curved portion 21 including edge 211 is in a hollow state or in mid-air without contacting other components. The microvibrator 2 has a structure in which, when mounted on the mounting substrate 3, edge 211 in the mid-air state vibrates in a wine glass pattern.

[0050] The micro-vibrator 2 has a front surface 2a and a rear surface 2b opposite to the front surface 2a. The front surface 2a can also be referred to as the outer surface 2a. The diameter of the front surface 2a is larger than the diameter of the rear surface 2b. Figure 2 and Figure 3 As shown, the micro-vibrator 2 has a surface electrode 23, which, for example, covers part or all of the front surface 2a and the rear surface 2b. The micro-vibrator 2 has a mounting surface 22b on the rear surface 2b side of the connecting portion 22. The mounting surface 22b faces the mounting substrate 3. In this embodiment, for example, the bottom surface of the connecting portion 22 opposite to the mounting surface 22b serves as a suction surface 22a for suction delivery of the micro-vibrator 2.

[0051] While not particularly limited, the surface electrode 23 is provided, for example, by a laminated film or a monolayer film, wherein the laminated film comprises a chromium (Cr) or titanium (Ti) film on the substrate side and a film of any conductive material such as gold (Au) and platinum (Pt), and the monolayer film comprises a substrate material such as titanium nitride (TiN) and a film made of a conductive material that is adhesive to the substrate material. The surface electrode 23 is formed on the front surface 2a and the rear surface 2b of the micro-vibrator 2 by any film deposition method such as sputtering, vapor deposition, or atomic layer deposition (ALD). In this embodiment, the surface electrode 23 is formed at least on the mounting surface 22b and the front surface 2a of the edge 211, and these portions are electrically connected. The surface electrode 23 may have a solid shape that completely covers the front and rear surfaces of the micro-vibrator 2, or it may be patterned to have the above-described configuration, thereby partially covering the front surface 2a and the rear surface 2b. In the micro-vibrator 2, a portion of the mounting surface 22b of the cover connection portion 22 of the surface electrode 23 is connected to the electrode connection portion 421 of the mounting substrate 3 via the bonding member 52, which will be described later.

[0052] The micro-vibrator 2 is made of, for example, quartz, glass containing additives such as borosilicate glass, metallic glass, silicon, ceramic, etc. Note that the material of the micro-vibrator 2 is not limited to these materials, as long as the micro-vibrator 2 is formed with a curved surface portion 21 and a connecting portion 22 having a three-dimensional curved shape and can vibrate in a wine glass mode. The micro-vibrator 2 is a thin component and is formed, for example, by processing a thin substrate made of the aforementioned materials in a forming process described later, such that the curved surface portion 21 and the connecting portion 22 are on the order of micrometers, such as in the range of 10 micrometers (μm) to 100 micrometers. The micro-vibrator 2 has a shape with millimeter dimensions. The dimension of the micro-vibrator 2 along the thickness direction of the mounting substrate 3, that is, the dimension in the direction orthogonal to the mounting substrate 3, is called the height. For example, the height of the micro-vibrator 2 is 2.5 mm, and the outer diameter of the edge 211 defined by the front surface 2a is 5 mm.

[0053] The micro-vibrator 2 is formed, for example, by the following process.

[0054] First, for example, such as Figure 4A As shown, a quartz plate 20, a mold M for forming a three-dimensional curved surface shape, and a cooling body C for cooling the mold M are prepared. For example, the mold M has a recessed portion M1 and a support portion M2. The recessed portion M1 defines a space for forming a three-dimensional curved surface shape on the quartz plate 20. The support portion M2 is located at the center of the recessed portion M1 and extends along the depth direction of the recessed portion M1, supporting a portion of the quartz plate 20 during processing. The mold M has a through hole M11 for decompression in the bottom surface of the recessed portion M1. The cooling body C has an assembly portion C1 for assembling the mold M, and a discharge port C11 formed at the bottom of the assembly portion C1 for discharge. The cooling body C is configured to cool the mold M during the processing of the quartz plate 20. The quartz plate 20 is arranged to cover the entire area of ​​the recessed portion M1 of the mold M.

[0055] Then, for example, such as Figure 4B As shown, a flame F is applied from a welding torch T to the quartz plate 20 to melt it. At this time, the recessed portion M1 of the mold M is evacuated by a vacuum mechanism (not shown) through the discharge port C11 of the cooling body C. As a result, the molten portion of the quartz plate 20 is stretched towards the bottom surface of the recessed portion M1. Furthermore, the center and peripheral regions of the molten portion of the quartz plate 20 are supported by a support portion M2. Heating of the quartz plate 20 is then stopped, and the quartz plate 20 is cooled. As a result, the quartz plate 20 is formed into a shape including a curved portion 201 having a substantially hemispherical three-dimensional curved surface shape and a recess 202, the recess 202 being recessed from the center portion of the curved portion 201 when supported by the support portion M2. Furthermore, the portion of the quartz plate 20 located outside the recessed portion M1 is formed as an end 203, which is located at the outer peripheral edge of the curved portion 201 and has a flat shape.

[0056] Next, the recessed portion M1 of mold M is restored to its normal pressure state, and the processed quartz plate 20 is removed from mold M. (As follows) Figure 4C As shown, the quartz plate 20 is encapsulated, for example, with an encapsulation material E made of any curable resin material. Then, the encapsulation material E is polished from the surface adjacent to the end 203 to the end by chemical mechanical polishing (CMP). Figure 4C The area indicated by the dotted line is ground and polished, so that the end 203 is removed together with the encapsulation material E. As a result, the quartz plate 20 is formed into a shape having a curved portion 21 with an annular surface and a connecting portion 22 recessed from the top of the curved portion 21.

[0057] Then, all the encapsulation material E is removed by methods such as heating or melting with a chemical solution, and the quartz plate 20 is removed. Finally, surface electrodes 23 are formed on the front and rear surfaces of the quartz plate 20, which has been processed as described above by film deposition processes such as sputtering or vapor deposition. If necessary, the surface electrodes 23 can be patterned by known methods such as using a mask (not shown).

[0058] The micro-vibrator 2 is manufactured, for example, by the manufacturing process described above; however, the manufacturing process of the micro-vibrator 2 is not limited to the examples described so far. For example, instead of... Figure 4B The flame F of the welding torch T shown, used to melt the quartz plate 20, can be supplied by a heater configured to heat the quartz plate 20 in the same area as when using flame F. In this way, the manufacturing process of the micro-vibrator 2 can be appropriately modified, and other known methods can be employed.

[0059] The micro-vibrator 2 has a substantially semi-annular shape that is rotationally symmetric about the z-direction, which is the axis of rotation. However, the shape of the micro-vibrator 2 is not limited to the shape of the bird's-bowl resonator (BR) described above, as long as the curved portion 21 has a bowl-shaped three-dimensional curved surface and is configured to vibrate in a wine glass mode. For example, the connecting portion 22 can have a cylindrical shape instead of a bottomed tubular shape that defines a concave portion.

[0060] like Figure 5 As shown, for example, the mounting substrate 3 includes a lower substrate 4 and an upper substrate 5 bonded together. For example, the lower substrate 4 is made of borosilicate glass as an insulating material, and the upper substrate 5 is made of silicon (Si) as a semiconductor material. The mounting substrate 3 is formed, for example, by anolyzing the upper substrate 5 to the lower substrate 4. For example, the mounting substrate 3 includes a plurality of inner frame portions 51, a plurality of electrode portions 53, and a plurality of outer frame portions 54 in the upper substrate 5. The electrode portions 53 are arranged separately from each other to surround the inner frame portions 51. The outer frame portions 54 are arranged separately from each other to surround the electrode portions 53. For example, the mounting substrate 3 has an annular groove 41 and a plurality of bridging wires 42 in the lower substrate 4. The annular groove 41 surrounds the inner frame portions 51 and separates the inner frame portions 51 and the electrode portions 53 from each other, and the bridging wires 42 bridge the inner and outer sides of the groove 41.

[0061] For example, such as Figure 6 and 7 As shown, the groove 41 is disposed between the inner frame portion 51 and the electrode portion 53, and is formed by wet etching or the like. For example, as Figure 8 and 9As shown, the groove 41 has a size corresponding to the outer diameter of the edge 211 of the micro-vibrator 2. The groove 41 is configured to prevent the edge 211 from contacting the mounting substrate 3 when the micro-vibrator 2 is mounted on the mounting substrate 3.

[0062] The bridging wiring 42 is formed, for example, of a conductive material such as aluminum (Al). The bridging wiring 42 is arranged to pass between the electrode portions 53. The bridging wiring 42 is electrically independent of the electrode portions 53. For example, as... Figure 7 As shown, bridging wiring 42 spans a slot 41 in the lower substrate 4. Each bridging wiring 42 has a first end connected to the inner frame portion 51 and a second end connected to the outer frame portion 54, thereby electrically connecting the inner frame portion 51 and the outer frame portion 54. For example, the mounting substrate 3 has at least two bridging wirings 42, each connected to a different inner frame portion 51. The mounting substrate 3 defines an inner frame region within the area surrounded by the inner frame portions 51. The bridging wiring 42 has an electrode connection portion 421 that connects to the surface electrode 23 of the micro-vibrator 2 at a first end adjacent to the inner frame region.

[0063] The plurality of bridging wires 42 include at least one voltage application wire 42A for applying voltage to the surface electrode 23 of the micro-vibrator 2 and at least one voltage detection wire 42B for detecting the voltage of the surface electrode 23. The voltage detection wire 42B is arranged separately from the voltage application wire 42A on the mounting substrate 3 and is electrically independent of the voltage application wire 42A before the micro-vibrator 2 is connected. In other words, the electrode connection portion 421 of the voltage detection wire 42B is at least electrically independent of the electrode connection portion 421 of the voltage application wire 42A. For example, a second end of the bridging wire 42 opposite to the electrode connection portion 421 is connected to the outer frame portion 54 or an externally removable terminal (not shown). Therefore, even after the micro-vibrator 2 is sealed with a covering material (not shown), the bridging wire 42 is capable of applying voltage to the surface electrode 23 and / or detecting voltage.

[0064] exist Figure 5 In this configuration, a total of four bridging wires 42, including three voltage application wires 42A and one voltage detection wire 42B, are formed on the mounting substrate 3, and each bridging wire 42 is electrically independent of the others. However, Figure 5 An example is shown, and the bridging cabling 42 is not limited to... Figure 5The example shown illustrates this. The bridging wiring 42 may have at least one voltage application wiring 42A and at least one voltage sensing wiring 42B that are electrically independent of each other, and the number, arrangement, etc., of the bridging wiring 42 may be varied appropriately. Furthermore, when the bridging wiring 42 includes two or more voltage application wirings 42A, the voltage application wiring 42A may be electrically independent of or electrically connected to another voltage application wiring 42A. This also applies to the voltage sensing wiring 42B.

[0065] When viewed from above, the multiple partitioned inner frame sections 51 are, for example, integrally formed as a discontinuous ring and arranged separately from each other. Figure 8 and Figure 9 As shown, at least two inner frame portions 51 are arranged and sized such that their inner and outer ends do not contact the micro-vibrator 2. For example, of the plurality of inner frame portions 51, at least one inner frame portion 51 is connected to voltage application wiring 42A, and at least another inner frame portion 51 is connected to voltage detection wiring 42B. The plurality of inner frame portions 51 may include one that is not connected to bridging wiring 42.

[0066] For example, such as Figure 5 As shown, the multiple inner frame portions 51 have a shape that divides the annular frame into four equal parts. However, the number, arrangement, shape, size, etc., of the inner frame portions 51 can be appropriately changed. For example, as... Figure 10 As shown, the multiple inner frame portions 51 can have a shape that divides the annular frame into two, one connected to voltage application wiring 42A and the other connected to voltage detection wiring 42B. For example, as Figure 11 As shown, the multiple partitioned inner frame portions 51 can have a shape that divides the annular frame into three parts, one of which is connected to the voltage application wiring 42A, another is connected to the voltage detection wiring 42B, and the third is not connected to the bridging wiring 42. For example, as Figure 12 As shown, the plurality of inner frame portions 51 may have three inner frame portions 51, each inner frame portion 51 having an elliptical shape in the top view and being arranged around the facing region R1 while being spaced apart from each other. The facing region R1 is the region of the mounting base 3 facing the connection portion 22 of the micro-vibrator 2.

[0067] Additionally, in this embodiment, for example, Figures 10 to 12As shown, the electrode connection portions 421 of the multiple bridging wirings 42 are arranged spaced apart from each other and partially located in the facing region R1. That is, when viewed from above, the electrode connection portions 421 may have a shape along the inner contour of the inner frame portion 51, or may have other shapes such as circular or elliptical. The shape, arrangement, size, etc. of the electrode connection portions 421 may be appropriately changed according to the inner frame portion 51 and the connection portion 22 of the micro-vibrator 2.

[0068] Multiple electrode portions 53 are arranged separately from each other at the outer periphery of the groove 41 to surround the inner frame portion 51. For example, as Figure 5 As shown, when viewed from above, electrode portions 53 have arcuate sides on their inner and outer circumferential sides. When the inner circumferential sides of electrode portions 53 are connected to each other and the outer circumferential sides of electrode portions 53 are connected to each other, discontinuous circles with different diameters are drawn. In other words, the plurality of electrode portions 53 have a shape configured to be evenly spaced around the inner frame portion 51 by means of rings at predetermined intervals.

[0069] like Figure 6 As shown, for example, each of the plurality of electrode portions 53 has an electrode film 531 on its upper surface. For example, wires (not shown) are connected to the electrode film 531 on the electrode portions 53, such that the plurality of electrode portions 53 are electrically connected to an external circuit board (not shown) to achieve potential control. Figure 1 and Figure 8 As shown, for example, when the micro-vibrator 2 is mounted, multiple electrode portions 53 are positioned at a predetermined distance from the edge 211 of the micro-vibrator 2, and each of the multiple electrode portions 53 forms a capacitor with the micro-vibrator 1. That is, the mounting substrate 3 is configured to detect the capacitance with the micro-vibrator 2 via the multiple electrode portions 53 and generate an electrostatic attraction with the micro-vibrator 2 so that the micro-vibrator 2 can vibrate in a wine glass mode.

[0070] also, Figure 1 and one The accompanying drawings illustrate an example in which sixteen electrode portions 53 are arranged at equal intervals on the mounting substrate 3 to form a ring. However, this disclosure is not limited to this example. The number and arrangement of the electrode portions 53 can be appropriately modified according to the shape and size of the micro-vibrator 2.

[0071] For example, when viewed from above, each of the outer frame portions 54 has a structure provided by a portion of a frame surrounding the inner frame portion 51 and separated at a plurality of slots 55. Furthermore, as... Figure 5 and 7As shown, the outer frame portion 54 has an electrode film 541 made of Al or the like on its upper surface. For example, multiple outer frame portions 54 are electrically connected to different inner frame portions 51 via different bridging wires 42, and wires (not shown) are connected to the electrode film 541. As a result, multiple outer frame portions 54 are electrically connected to an external circuit board or the like (not shown), so that potential control and voltage detection of the surface electrode 23 of the micro-vibrator 2 can be performed via the outer frame portions 54 using an external power supply or the like (not shown).

[0072] Note that the outer frame portion 54 connected to the voltage detection wiring 42B is at least electrically independent of the outer frame portion 54 connected to the voltage application wiring 42A, and the outer frame portion 54 is not limited to, as shown in the example. Figure 5 The example shown forms four separate outer frame sections 54. The number, arrangement, shape, size, etc. of the separate outer frame sections 54 can be appropriately changed according to the number of bridging cabling sections 42, etc.

[0073] The bonding member 52 is made of a conductive material. The bonding member 52 is used to bond the micro-vibrator 2 and the mounting substrate 3, and electrically connects the electrode connection portion 421 of the bridging wiring 42 to the surface electrode 23 of the micro-vibrator 2. The bonding member 52 is, for example, a paste-like conductive material containing a conductive material such as gold-tin (AuSn), silver (Ag), or gold (Au), and is applied to the electrode connection portion 421 using a syringe or the like. The bonding member 52 is arranged on each electrode connection portion 421 of the mounting substrate 3. For example, as... Figure 8 As shown, the connecting member 52 is arranged in a manner that does not span the electrode connection portion 421 of the voltage detection wiring 42B and the electrode connection portion 421 of the voltage application wiring 42A. This is to prevent the applied voltage of the surface electrode 23 and the applied voltage of the voltage application wiring 42A from merging because the voltage detection wiring 42B is directly connected to the voltage application wiring 42A through the connecting member 52.

[0074] That is, in installation structure 1, for example, Figure 13As shown, voltage application wiring 42A and voltage detection wiring 42B are connected to different locations on the surface electrode 23 of the micro-vibrator 2, but they are electrically connected via the surface electrode 23 and not directly connected to each other. Voltage application wiring 42A and voltage detection wiring 42B are respectively connected to external terminals, allowing voltage application and detection to be performed externally without contacting any part of the surface electrode 23 except for the portion where it connects to the mounting substrate 3. Furthermore, even when the micro-vibrator 2 is surrounded by a cover member (not shown), voltage application wiring 42A and voltage detection wiring 42B are still connected to external terminals, thus allowing voltage to be applied to and voltage to be detected on the surface electrode 23. Multiple electrode portions 53 of the mounting substrate 3 include drive electrodes for driving the micro-vibrator 2 in a wine glass mode and detection electrodes for detecting capacitance. Multiple electrode portions 53 are connected to external terminals via wires (not shown) and are opposite portions of the cover edge 211 of the surface electrode 23. Figure 13 For clarity, an example is shown where a voltage application wiring 42A and a voltage detection wiring 42B are connected to the surface electrode 23. However, this disclosure is not limited to this example, and the mounting structure 1 may have at least one voltage application wiring 42A and at least one voltage detection wiring 42B.

[0075] Mounting substrate 3 can be manufactured by, for example, the following process.

[0076] First, a lower substrate 4, made of, for example, borosilicate glass, is prepared, and an annular groove 41 is formed on the lower substrate 4 using a wet etching process with buffered hydrofluoric acid. Then, bridging wiring 42 is formed, for example, by a lift-off method using Al sputtering. The bridging wiring 42 is formed to bridge the groove 41, and the bridging wiring 42 has an electrode connection portion 421 located further inward from the area where the inner frame portion 51 is to be formed. The thickness of the bridging wiring 42 is, for example, about 0.1 micrometers (μm).

[0077] Subsequently, for example, a Si substrate made of Si (then the upper substrate 5) is prepared and anoly bonded to a lower substrate 4 of borosilicate glass. Next, grooves are formed in the Si substrate using a known etching method to define areas that will later become a plurality of inner frame portions 51, a plurality of electrode portions 53, and a plurality of outer frame portions 54.

[0078] Specifically, for example, trench etching is performed using deep reactive ion etching (DRIE) to expose a portion of the lower substrate 4, and multiple inner frame portions 51, multiple electrode portions 53, and multiple outer frame portions 54 are separated from each other. Thus, the Si substrate becomes an upper substrate 5 having multiple inner frame portions 51, multiple electrode portions 53, and multiple outer frame portions 54 separated from each other. Through this separation process on the Si substrate, the trench 41 formed in the lower substrate 4 is exposed from the upper substrate 5.

[0079] Finally, for example, electrode films 531 and 541 are formed on the upper surfaces of the multiple electrode portions 53 and the separating outer frame portion 54 by sputtering or the like. As a result of these processes, a mounting substrate 3 having the above-described structure is obtained. When the microvibrator 2 is placed on the mounting substrate 3, the bonding member 52 is arranged on the electrode connection portion 421 of the lower substrate 4.

[0080] For example, by forming regions of multiple mounting substrates 3, each having the above-described structure, on a wafer, and separating the multiple mounting substrates 3 into wafers by cutting or the like, a wafer can be obtained. Figure 5 The example shown is a mounting substrate 3. In other words, the mounting substrate 3 can be manufactured at the wafer level.

[0081] The mounting substrate 3, manufactured using the above process, is suctioned and fixed to a mounting device (not shown), and the micro-vibrator 2 is conveyed by a conveying device (not shown) so that the mounting surface 22b of the connecting portion 22 contacts the bonding member 52. Furthermore, the bonding member 52 is cured. Therefore, the micro-vibrator 2 is mounted on the mounting substrate 3. For example, the micro-vibrator 2 is conveyed by contacting the suction surface 22a of the micro-vibrator 2 with a clamping mechanism (not shown) of the conveying device capable of vacuum suction and performing vacuum suction. Then, the mounting substrate 3 is heated by a heating mechanism (not shown) of the mounting device, and the micro-vibrator 2 is placed on the mounting substrate 3 and cooled to cure the bonding member 52. In this way, the micro-vibrator 2 is bonded to the mounting substrate 3.

[0082] The alignment of the micro-vibrator 2 with respect to the mounting substrate 3 can be performed as follows: the micro-vibrator 2 and the mounting substrate 3 are imaged, feature points are extracted by edge detection using known image processing techniques, and their relative positions are adjusted.

[0083] The basic structure of the mounting structure 1 for the micro-vibrator 2 has been described above. When the mounting structure 1 constitutes a BRG, the micro-vibrator 2 vibrates in a wine glass mode by generating electrostatic attraction between some of the multiple electrode portions 53 and the micro-vibrator 2 during actuation. In this BRG, when a Coriolis force is applied externally while the micro-vibrator 2 is vibrating, the micro-vibrator 2 moves and the position of the node in the vibration mode changes. The BRG detects the change in the node of this vibration mode based on the electrostatic capacitance between the micro-vibrator 2 and the multiple electrode portions 53, thereby detecting the angular velocity applied thereto.

[0084] In this embodiment, the surface electrode 23 of the micro-vibrator 2 is connected to voltage application wiring 42A and voltage detection wiring 42B, which are formed on the mounting substrate 3 and are electrically independent of each other as bridging wiring 42. Therefore, the mounting structure 1 can be electrically connected to an external device via these bridging wiring 42. Thus, after the micro-vibrator 2 is connected to the mounting substrate 3, the voltage of the surface electrode 23 of the micro-vibrator 2 can be detected via the voltage detection wiring 42B. As a result, when detecting the voltage of the surface electrode 23, it is not necessary to apply a probe directly to the portion of the surface electrode 23 other than the portion bonded to the mounting substrate 3. Therefore, in the mounting structure 1, damage to the substrate and surface electrode 23 of the micro-vibrator 2 can be suppressed, and the degradation of the Q factor due to damage can be suppressed. Furthermore, in the BRG having this mounting structure 1, the process of checking the voltage applied to the surface electrode 23 is simplified, and faults caused by the bonding state between the micro-vibrator 2 and the mounting substrate 3 can be detected. Therefore, yield can be improved, and the effects of improved reliability and reduced manufacturing costs can be achieved.

[0085] (Variations of the first embodiment)

[0086] For example, such as Figure 14 As shown, the mounting substrate 3 may have multiple separation grooves 43 that separate the electrode connection portions 421 in the inner frame region R2 surrounded by multiple partitioned inner frame portions 51.

[0087] exist Figure 14 In, with Figure 10 Similarly, a predetermined area including the inner frame portion 51 is shown, but other components of the mounting substrate 3 are omitted to facilitate understanding of the construction of the bridging wiring 42 of the mounting substrate 3 and the inner frame portion 51. Although Figure 14 Cross-sectional views are not shown, but bridging wiring 42 is indicated by shaded lines. These also apply to what will be described later. Figure 20 and 23 .

[0088] Separation grooves 43 are formed near the respective electrode connection portions 421 so that the remaining portion of the bonding member 52, which is used to bond the microvibrator 2 and the mounting substrate 3, can flow therein when the bonding member 52 is wetted and unfolded. For example, a plurality of separation grooves 43 are formed in the same number as the electrode connection portions 421 and are spaced apart from each other to be arranged independently of each other. For example, as Figure 15 As shown, the separation groove 43 allows the remaining portion of the connecting member 52 arranged on the corresponding electrode connection portion 421 to flow into the separation groove 43, thereby restricting the direct electrical connection of different electrode connection portions 421 through the connecting member 52. As a result, the direct connection between the voltage application wiring 42A and the voltage detection wiring 42B can be more appropriately restricted. In addition, voltage detection of the surface electrode 23 of the micro-vibrator 2 can be stably performed. Note that a portion of the mounting surface 22b of the micro-vibrator 2 contacts a portion of the inner frame region R2 of the mounting substrate 3, thus the mounting surface 22b of the micro-vibrator 2 serves as an abutting portion that contacts and abuts against the mounting substrate 3.

[0089] The plurality of separation trenches 43 can be configured such that at least one separation trench 43 formed near the voltage application wiring 42A and at least one separation trench 43 formed near the voltage detection wiring 42B are separated from each other. The number, arrangement, shape, and size (such as width and depth) of the plurality of separation trenches 43 can be appropriately varied. Furthermore, the plurality of separation trenches 43 can be formed by the same process as trench 41 or by a different process such as wet etching.

[0090] Furthermore, in this variant, mounting structure 1 can achieve similar effects to the first embodiment. Additionally, since mounting substrate 3 has multiple separation grooves 43, it can more reliably prevent voltage application wiring 42A and voltage detection wiring 42B from directly connecting to each other due to the flow or misalignment of bonding member 52, which could lead to poor insulation.

[0091] (Second Embodiment)

[0092] The mounting structure 1 according to the second embodiment will be described with reference to the accompanying drawings.

[0093] exist Figure 16 and Figure 20 Only the predetermined area of ​​the mounting base 3, including the inner frame portion 51, is shown, and other parts of the mounting base 3 are not shown, in order to understand the bonding state between the micro-vibrator 2 and the mounting base 3. Figures 16 to 19 and Figure 21 Only the partial structure of the micro-vibrator 2 on the mounting surface 22b side of the connection portion 22 is shown; for clarity, other parts of the micro-vibrator 2 are not shown. Although Figures 16 to 19No cross-sectional view is shown, but to make the pattern shape of surface electrode 23 easier to understand, surface electrode 23 is represented by shaded lines, and the outline of the part not visible from the angle shown in the figure is represented by dashed lines.

[0094] In the installation structure 1 of this embodiment, for example, as Figure 16 As shown, the surface electrode 23 of the micro-vibrator 2 includes a plurality of branch electrodes 231 located at positions covering the sidewall surface of the connecting portion 22. In the mounting structure 1, the plurality of branch electrodes 231 of the micro-vibrator 2 are connected to different partitioned inner frame portions 51 of the mounting substrate 3 via a connecting member 52. This mounting structure 1 differs from the mounting structure 1 of the first embodiment in the above-described aspects. The differences from the first embodiment will be mainly described below.

[0095] In the micro-vibrator 2 of this embodiment, the mounting surface 22b of the connection portion 22 is exposed from the surface electrode 23, and the plurality of branch electrodes 231 of the surface electrode 23 are bonded to the mounting substrate 3 by the bonding member 52. In the micro-vibrator 2, the plurality of branch electrodes 231 are respectively connected to the electrode connection portions 421 of different bridging wirings 42 by the bonding member 52. In the micro-vibrator 2 of this embodiment, a portion of the sidewall surface 22c (hereinafter referred to as "sidewall surface 22c") on the rear surface 2b side of the connection portion 22 between adjacent branch electrodes 231 is exposed from the surface electrode 23. As a result, the mounting structure 1 of this embodiment has a similar design to... Figure 13 The electrical connection structure is similar to that of the first embodiment shown.

[0096] In this embodiment, for example, such as Figure 17 As shown, the surface electrode 23 has branch electrodes 231 at the lower end of the sidewall surface 22c near the mounting surface 22b and at a position corresponding to a plurality of partition inner frame portions 51 of the mounting substrate 3. In other words, for example, the surface electrode 23 has the same number of branch electrodes 231 as the partition inner frame portions 51 to which the bridging wiring 42 is connected.

[0097] For example, such as Figure 16 As shown, the width of the branch electrode 231 is smaller than the width of the inner frame portion 51, so that the branch electrode 231 is directly connected to another adjacent branch electrode 231 without via the connecting member 52. For example, as Figure 18 As shown, the branch electrode 231 is manufactured by forming a surface electrode 23 using a vacuum deposition method (such as sputtering) while the cap mask CP is attached to the mounting surface 22b of the connection portion 22. The cap mask CP is made of any material (such as metal or resin).

[0098] Similarly, in this embodiment, an installation structure 1 can be obtained that achieves a similar effect to the first embodiment.

[0099] (Variation of the second embodiment)

[0100] For example, such as Figure 19 As shown, the mounting structure 1 may have a bottom protrusion 24 on the mounting surface 22b for positioning the micro-vibrator 2 relative to the mounting substrate 3. In this case, for example, as... Figure 20 As shown, the mounting base 3 has a mounting recess 44 in the facing area R1 to receive the bottom protrusion 24 of the micro vibrator 2.

[0101] To form the bottom protrusion 24 of the micro-vibrator 2, for example, prepare Figure 4A The mold M, wherein the support portion M2 has an additional protrusion at its end face, and performs a process similar to that performed in the first embodiment. For example, as... Figure 19 As shown, one of the branch electrodes 231 extends onto the surface of the bottom protrusion 24. However, this configuration is not limited to this example, and the bottom protrusion 24 can be exposed from the surface electrode 23. The configuration of the bottom protrusion 24 having a surface electrode 231 extending thereon, as described above, can be produced by using a cap mask CP with a groove connecting a portion of the bottom protrusion 24 and a portion of a forming region where the branch electrode 231 will be formed on the sidewall surface 22c of the connecting portion 22.

[0102] For example, such as Figure 21 As shown, the mounting recess 44 has an inner diameter that is approximately the same as the outer diameter of the bottom protrusion 24, such that when the micro-vibrator 2 is mounted on the mounting substrate 3, the bottom protrusion 24 can be fitted into the mounting recess 44. Furthermore, the depth of the mounting recess 44 is at least equal to or greater than the height of the bottom protrusion 24. For example, similar to the groove 41, the mounting recess 44 is formed by wet etching or the like. For example, as... Figure 22 As shown, in addition to the mounting recess 44, the mounting substrate 3 may also have multiple separation grooves 43. The separation grooves 43 separate the mounting recess 44 from the electrode connection portion 421. In the micro-vibrator 2, a portion of the mounting surface 22b on the periphery of the bottom protrusion 24 serves as an abutment portion, which abuts against the portion of the inner frame region R2 of the mounting substrate 3 on the outer periphery of the mounting recess 44 or on the outer side of the separation groove 43.

[0103] Furthermore, in this modified example, a mounting structure 1 that achieves effects similar to those of the second embodiment described above can be obtained. Moreover, according to this modified example, since the micro-vibrator 2 and the mounting substrate 3 each have a bottom protrusion 24 and a mounting recess 44, respectively, the micro-vibrator 2 and the mounting substrate 3 can be easily positioned, further increasing production output. Therefore, a mounting structure 1 with higher connection reliability can be obtained. Furthermore, when the mounting substrate 3 has multiple separation grooves 43, similar effects to those of the modification in the first embodiment can be achieved.

[0104] (Third Embodiment)

[0105] The installation structure 1 of the third embodiment will be described with reference to the accompanying drawings.

[0106] exist Figure 23 In order to make it easier to understand the connection state between the micro-vibrator 2 and the mounting substrate 3, a predetermined area of ​​the micro-vibrator 2 including the connecting portion 22 and a predetermined area of ​​the mounting substrate 3 including the inner frame portion 51 are shown, and other parts of the micro-vibrator 2 and the mounting substrate 3 are omitted. Figure 24 Only the predetermined area of ​​the mounting base 3, including the inner frame portion 51, is shown, and other parts of the mounting base 3 are omitted.

[0107] For example, such as Figure 23 As shown, the difference between the mounting structure 1 of this embodiment and the mounting structure 1 of the first embodiment is that the surface electrode 23 of the micro-vibrator 2 and the electrode connection portion 421 of the mounting substrate 3 are in contact with each other and are directly coupled without the insertion of the coupling member 52. The differences from the first embodiment will be mainly described below.

[0108] In this embodiment, the surface electrode 23 is bonded to the electrode connection portion 421 of the mounting substrate 3 without inserting other components such as the bonding member 52 therebetween. Although there are no particular limitations, for example, the surface electrode 23 and the electrode connection portion 421 are made of conductive materials such as Al and Cu that are capable of diffusing with each other, and are bonded using diffusion bonding.

[0109] The surface electrode 23 can be bonded to the electrode connection portion 421 via, for example, the following process: The micro-vibrator 2 is placed on the mounting substrate 3, and the surface electrode 23 is brought into contact with the electrode connection portion 421 in an environment such as reduced pressure or an inert gas atmosphere, ensuring that the bonding surfaces of the surface electrode 23 and the electrode connection portion 421 are not oxidized. Then, the mounting substrate 3 is heated so that the temperature of the surface electrode 23 and the electrode connection portion 421 is above the eutectic point of their constituent materials but below their melting point, while pressure is applied to the electrode connection portion 21 through the surface electrode 23. As a result, at the contact portion between the surface electrode 23 and the electrode connection portion 421, the constituent materials diffuse into the other, forming a eutectic layer. At this point, if necessary, a secondary pressurization with a higher pressure than the initial pressurization can be performed. Then, upon cooling, the surface electrode 23 and the electrode connection portion 421 are directly bonded without passing through a liquid phase or inserting any other components between them.

[0110] In this embodiment, the bonding between the surface electrode 23 and the electrode connection portion 421 can be referred to as "direct bonding", "solid bonding", "eutectic bonding", "diffusion bonding", etc.

[0111] Furthermore, in this embodiment, an installation structure 1 capable of achieving similar effects to the first embodiment can be obtained. Additionally, since the connecting member 52 is not used in this embodiment, the voltage application wiring 42A and the voltage detection wiring 42B are not directly connected. Therefore, a more reliable effect of suppressing insulation faults can be achieved.

[0112] (Variation of the third embodiment)

[0113] For example, such as Figure 24 As shown, the mounting substrate 3 may have an auxiliary electrode 45 in the facing region R1 facing the micro-vibrator 2, which is surrounded by a plurality of electrode connection portions 421. The auxiliary electrode 45 is arranged, for example, at a certain distance from all electrode connection portions 421 and is electrically independent of the electrode connection portions 421. The auxiliary electrode 45 is used to increase the bonding area between the micro-vibrator 2 and the surface electrode 23 and to improve the bonding strength between the micro-vibrator 2 and the mounting substrate 3. As long as the voltage application wiring 42A and the voltage detection wiring 42B are electrically independent, the auxiliary electrode 45 can be connected to either the voltage application wiring 42A or the voltage detection wiring 42B.

[0114] Furthermore, in this variation, a mounting structure 1 capable of achieving similar effects to the third embodiment can be obtained. Additionally, according to this variation, the auxiliary electrode 45 improves the bonding strength between the micro-vibrator 2 and the mounting substrate 3, thereby further enhancing the bonding reliability.

[0115] (Other embodiments)

[0116] Although this disclosure has been described with reference to embodiments, it should be understood that this disclosure is not limited to these embodiments and structures. This disclosure includes various modifications and variations within the equivalent scope. In addition, various combinations and modes, as well as other combinations and modes including only one element, more elements, or fewer elements, are also within the scope and spirit of this disclosure.

[0117] (1) For example, the mounting structure 1 may have the following configuration: the micro-vibrator 2 does not have a branch electrode 231 but has a bottom protrusion 24 and the mounting substrate 3 has a mating recess 44. In this case, the mounting substrate 3 may have multiple separation grooves, or the electrode connection portion 421 may be directly coupled to the surface electrode 23 without the need to insert a coupling member 52 between them. Thus, the mounting structure 1 can be constructed by freely combining the constituent elements of the above embodiments and their variations, unless they are obviously incompatible.

[0118] (2) In addition, such as Figure 25As shown, for example, mounting structure 1 can have a configuration in which the electrode portion 53 of mounting substrate 3 does not have a base constituting upper substrate 5 and is provided only by metal wiring 532. In this case, electrode portion 53 is the portion of metal wiring 532 facing the lower surface 211a of the edge 211 of micro-vibrator 2, and can vibrate the curved surface portion 21 of micro-vibrator in the z direction. The lower surface 211a of edge 211 is the surface in edge 211 that connects the front surface 2a and rear surface 2b of micro-vibrator 2, and is the portion facing mounting substrate 3. Furthermore, in mounting structure 1, voltage application wiring 42A and voltage detection wiring 42B can be connected to conductive film 46 formed on lower substrate 4, instead of the partition outer frame portion 54 formed by the base of upper substrate 5, such that terminal portions are provided by conductive film 46. Conductive film 46 can be integral with or separate from wiring 42.

[0119] (3) Figure 26 As shown, for example, the mounting structure 1 can be constructed such that the mounting base 3 on which the micro-vibrator 2 is mounted does not have the inner frame portion 51. In this case, for example, as... Figure 27 As shown, the micro-vibrator 2 can be coupled to the electrode connection portion 421 of the wiring 42 via the coupling member 52. Alternatively, as Figure 28 As shown, the micro-vibrator 2 can be mounted such that the surface electrode 23 and the electrode connection portion 421 of the wiring 42 are directly connected to each other. Figure 27 In the previous example shown, from the viewpoint that the voltage application wiring 42A and the voltage detection wiring 42B are directly connected by the bonding member 52, the mounting substrate 3 can preferably be configured to have a separation groove 43 between the electrode connection portions 421.

[0120] (4) In installation structure 1, for example, such as Figure 29 As shown, the electrode connection portion 421 of the wiring 42 may not extend to the facing region R1 of the connection portion 22 facing the micro-vibrator 2 on the mounting substrate 3, and may be connected to the surface electrode 23 via the bonding member 52 and the inner frame portion 51. In this case, for example, one end of the wiring 42 extends to a position directly below the inner frame portion 51 or outside the facing region R1, but does not protrude into the facing region R1 or into the region inside the inner frame portion 51. At this time, the inner frame portion 51 is made of, for example, conductive silicon, and together with the bonding member 52, electrically connects the wiring 42 and the surface electrode 23.

[0121] (5) The components of each of the above embodiments are not necessarily essential unless specifically stated otherwise, or unless the component is obviously necessary in principle. The quantities, values, amounts, ranges, etc., mentioned in the description of the above embodiments are not necessarily limited to such specific values, amounts, ranges, etc., unless specifically described as necessary or understood to be necessary in principle. Furthermore, in each of the above embodiments, when referring to the shape of an element or the positional relationship between elements, unless otherwise specifically stated otherwise or unless this disclosure is limited in principle to a specific shape or positional relationship, this disclosure is not limited to a specific shape or positional relationship.

Claims

1. An installation structure, comprising: A micro-vibrator having a curved portion with a hemispherical surface, a connecting portion extending from the curved portion toward the hemispherical center of the curved portion, and a surface electrode covering at least a portion of the connecting portion and at least a portion of the curved portion; as well as A mounting substrate having two or more wirings, and a portion of the micro-vibrator being connected to the mounting substrate, wherein... Each of the two or more wirings has an electrode connection portion, which is connected at one end to a portion of the surface electrode covering the connection portion. The two or more wirings include voltage application wiring for applying a voltage to the surface electrode and voltage detection wiring for detecting the voltage applied to the surface electrode, and The voltage application wiring is spaced apart from the voltage detection wiring on the mounting substrate.

2. The mounting structure as described in claim 1, wherein... The mounting substrate has a separation groove to separate the voltage detection wiring and the voltage application wiring from each other.

3. The mounting structure as described in claim 1 or 2, wherein... The surface electrode includes multiple branch electrodes, the number of which is the same as the number of electrode connection portions of the two or more wirings. The plurality of branch electrodes are disposed on the sidewall surface covering the connecting portion and at positions corresponding to the electrode connecting portion. The sidewall surface of the connecting portion is exposed from the surface electrode at a location between the plurality of branch electrodes, and Each of the electrode connection portions is connected to a different one of the plurality of branch electrodes via a connecting member.

4. The mounting structure as described in claim 1 or 2, wherein The micro-vibrator has a bottom protrusion on the mounting surface defined at the bottom of the connection portion, and The mounting base plate has a facing area facing the connection portion of the micro vibrator, and The mounting base plate is formed with a mounting recess to receive the bottom protrusion of the connecting portion in the facing area.

5. The mounting structure as described in claim 1 or 2, wherein... The electrode connection portions of the two or more wirings are in contact with and directly bonded to the surface electrode portions.

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