A chip spatial mapping positioning method for waveguide device testing

Abstract

The present invention discloses a chip spatial mapping positioning method for waveguide device testing, comprising the following steps: (1) determining a plurality of markers on a chip; (2) obtaining a design distance between the markers on the chip in a design layout and obtaining an actual distance between the markers on the chip; (3) calculating a correspondence between the design distance and the actual distance between the markers in the design layout; (4) determining a reference point A in the design layout and determining a reference point B in the chip in a chip displacement stage; (5) selecting a target device on the design layout and determining the coordinates of the target device in the design layout relative to the reference point A; and (6) calculating the position coordinates of the target device in the chip displacement stage relative to the reference point B based on the correspondence between the design distance between the markers in the design layout and the actual distance between the markers in the chip displacement stage, thereby realizing spatial mapping positioning of the target device from the design layout to the chip displacement stage.

Description

Technical Field

[0001] The present invention relates to the field of device detection, and in particular to a chip space mapping positioning method for waveguide device testing. Background Art

[0002] Photonic chips use light waves as information carriers. With their high device integration, fast signal transmission speed, good stability, and resistance to electromagnetic interference, they hold great development prospects in fields such as the Internet of Things, communications, and sensing. In recent years, researchers have also conducted extensive development and research using photonic chips. The chip translation stage, a device for controlling chip movement and positioning, is crucial in the chip testing process. When the chip under test is placed on the chip translation stage, the position of the device on the chip is determined by controlling the movement of the translation stage. During the photonic chip testing process, being able to quickly and efficiently locate the device on the chip based on the chip design layout can greatly improve test efficiency and reduce the time required to find and align the device. This is crucial for the development, research, and testing of photonic chips.

[0003] At present, a number of related patents in the field of chip device positioning have been reported. For example, in 2017, Yang Xianqiang and others from Harbin Institute of Technology invented a TR chip positioning method and detection method, which calculated the coordinates of the chip center position by binarizing the chip grayscale image and extracting the contour point set (Chinese invention patent: 201710685989.8); in 2019, Hu Yueming and others from South China University of Technology invented a LED chip positioning method suitable for automatic feeding mechanism, which adopts a laser step for coarse positioning and a camera shooting for fine positioning (Chinese invention patent: 2019105405 21.9); in 2020, Cheng Zhenzhou and others from Tianjin University invented a grating coupler positioning and measurement method based on image recognition. Based on image recognition, the position of the grating coupler in the positioning chip is located, and the program is used to control the movement of the translation stage to achieve the optimal coupling between the optical fiber and the grating coupler (Chinese invention patent: 202110018302.1); in 2021, Hu Songyu and others from Zhejiang University designed a positioning method and device based on Gaussian filtering and chip key points (Chinese invention patent: 202111588922.5).

[0004] However, there is currently no method that uses chip design layouts for spatial mapping to directly locate chip device positions, which to some extent leads to problems such as low flexibility in chip testing. Summary of the Invention

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide a chip spatial mapping positioning method for waveguide device testing.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A chip spatial mapping positioning method for waveguide device testing includes fixing a chip containing a waveguide device on a chip translation stage. The waveguide device can be observed through a microscopic imaging system. A computer is used to observe the chip design layout and control a stepper motor to move the chip translation stage. The method specifically includes the following steps:

[0008] (1) Determine several markers on the chip;

[0009] (2) obtaining the design distance between the markers on the chip in the design layout, and obtaining the actual distance between the markers on the chip in the chip translation stage;

[0010] (3) Calculate the correspondence between the design distances between the markers in the design layout and the actual distances between the markers in the chip displacement stage;

[0011] (4) determining reference point A based on the designed distances between the markers in the design layout, and determining reference point B based on the actual distances between the markers in the chip translation stage;

[0012] (5) Select the target device on the design layout and determine the coordinates of the target device relative to the reference point A in the design layout;

[0013] (6) Based on the correspondence between the design distance between the markers in the design layout and the actual distance between the markers in the chip translation stage, the position coordinates of the target device in the chip translation stage relative to the reference point B are calculated, and the spatial mapping positioning of the target device from the design layout to the chip translation stage is realized, and finally the microscopic image information of the target device is obtained.

[0014] Furthermore, the marker in step (1) is one or more identifying shapes selected from the group consisting of a cross, a circle, a square, and a star.

[0015] Furthermore, the actual distance between the markers on the chip in step (2) can be obtained by measuring with a ruler or by calculating the number of steps and the step length of the stepper motor that controls the chip translation stage.

[0016] Furthermore, the reference point A and the reference point B in step (3) can be selected by taking a position in the line connecting the two markers as the reference point on the chip.

[0017] Furthermore, the reference point A and the reference point B in step (3) can be selected as the incenter, circumcenter, center, centroid, centroid, lateral center, or orthocenter of the polygon formed by several markers.

[0018] Furthermore, in step (6), obtaining the microscopic image information of the target device is achieved by moving the chip displacement stage or by moving the microscopic imaging system.

[0019] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0020] (1) The present invention has the advantage of convenient device positioning. The device on the actual chip can be directly positioned by simply selecting the corresponding device on the chip design layout.

[0021] (2) The present invention has the advantage of high positioning speed. It only needs to calculate the distance that the translation stage needs to move to quickly and accurately find the target device on the chip.

[0022] (3) The present invention has the advantage of high automation. The algorithm automatically controls the movement of the chip to locate the target device without manual operation, which greatly shortens the time of locating the device.

[0023] (4) The present invention has the advantage of a wide range of applications. This method is not only applicable to the test positioning of waveguide devices, but also to the test positioning of micro-nano devices such as metasurfaces.

[0024] (5) The present invention has the advantage of strong scalability. It can be further used in conjunction with methods such as video acquisition positioning and power measurement positioning to improve the positioning speed and accuracy of the measurement system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the hardware of the chip space mapping positioning method for waveguide device testing in Example 1.

[0026] Figure 2 Schematic diagram of the hardware of the chip space mapping positioning method for waveguide device testing in Example 2.

[0027] Figure 3 Flowchart of a chip spatial mapping positioning method for waveguide device testing. DETAILED DESCRIPTION

[0028] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] Example 1

[0030] Figure 1 The present invention provides a specific embodiment of the present invention, wherein the chip 1 is fixed on the chip displacement stage 2, the movement of the chip displacement stage's X-axis 3 and Y-axis 4 is controlled by a motor 5, and a microscopic imaging system 6 is used to capture images of the device on the chip 1. The implementation process of the specific embodiment is shown in FIG. Figure 3 First, the positions of the three cross-shaped markers on the chip design layout are extracted from the chip design layout, and the distances between the three markers on the design layout are obtained. Chip 1 is fixed to chip displacement stage 2, and the displacement stage is controlled to move. The actual coordinates of the markers on the chip and the distances between the markers are calculated based on the number and step length of the chip displacement stage's stepper motor. Based on the correspondence between the distances between the markers on the design layout and the actual distances between the markers on the chip, the magnification relationship between the design layout size and the actual chip size is obtained. Based on the triangle formed by the three markers on the chip design layout, the center of gravity of the triangle is calculated using a design algorithm and used as reference point A on the chip design layout. Similarly, a triangle can be formed based on the three markers on the chip, and the center of gravity of the triangle is calculated using an algorithm and used as reference point B on the actual chip. Next, the target device is selected on the chip design layout. Based on the reference point A determined on the design layout, the coordinates of the target device on the drawing are found. Then, based on the correspondence between the distances between the markers on the design layout and the distances between the markers on the chip, the actual coordinates of the target device on the chip are calculated. According to the reference point B on the chip and the calculated actual coordinates of the target device, an algorithm is designed to control the translation stage to move to the coordinate position of the target device, so that the device is located at the center of the field of view of the microscopic imaging system 6, thereby achieving the positioning of the target device.

[0031] Example 2

[0032] Figure 2 The embodiment of the present invention is shown in FIG. 1 , wherein the chip 1 is fixed on the chip stage 2 and the microscopic imaging system 6 can be moved by the displacement axes 7, 8 and 9. Figure 3 First, extract the distance between the two star-shaped markers on the chip on the chip design layout, and then select one of the markers as the reference point A. Fix the chip 1 on the chip stage 2, move the microscope system 6, find the two star-shaped markers on the chip, use a ruler to measure the distance between the markers on the chip, and select the marker on the chip corresponding to the reference point A as the reference point B on the actual chip. According to the distance between the two markers on the chip design layout and the actual distance between the two markers on the chip, according to the correspondence between the two, obtain the magnification relationship between the chip drawing size and the actual chip size. Select the target device on the chip design layout, find the coordinates of the target device on the design layout according to the reference point A, and calculate the actual coordinates of the target device on the chip according to the correspondence between the distance between the markers on the design layout and the distance between the markers on the chip. According to the reference point B on the chip and the calculated actual coordinates of the target device, move the microscopic imaging system 6 so that the device is located at the center of the microscopic imaging system's field of view to achieve the positioning of the target device.

[0033] The present invention is not limited to the embodiments described above. The above description of the specific embodiments is intended to describe and illustrate the technical solutions of the present invention. The above specific embodiments are merely illustrative and not restrictive. Without departing from the scope of the present invention and the scope of protection of the claims, those skilled in the art may make various specific modifications based on the teachings of the present invention, all of which fall within the scope of protection of the present invention.

Claims

1. A chip space mapping positioning method for waveguide device testing, characterized in that: The chip containing the waveguide device is fixed on the chip translation stage. The waveguide device can be observed through a microscopic imaging system. The chip design layout is observed by a computer and the stepper motor is controlled to move the chip translation stage. The specific steps include: (1) Determine a number of markers on the chip; the markers are one or more identifying graphics such as a cross, circle, square, or star; (2) Obtaining the design distance between the markers on the chip in the design layout, and obtaining the actual distance between the markers on the chip in the chip translation stage; the actual distance between the markers on the chip can be obtained by measuring with a ruler or by calculating the number of steps and step length of the stepper motor controlling the chip translation stage; (3) Calculate the correspondence between the design distance between the markers in the design layout and the actual distance between the markers in the chip displacement stage; the reference point A and the reference point B can be selected by taking a position in the line connecting the two markers as the reference point on the chip; the reference point A and the reference point B can be selected by taking the incenter, circumcenter, center, centroid, centroid, lateral center, or orthocenter of the polygon formed by several markers; (4) Determine reference point A based on the design distances between several markers in the design layout, and determine reference point B based on the actual distances between the markers in the chip translation stage; (5) Select the target device on the design layout and determine the coordinates of the target device relative to the reference point A in the design layout; (6) Based on the correspondence between the design distance between the markers in the design layout and the actual distance between the markers in the chip translation stage, the position coordinates of the target device in the chip translation stage relative to the reference point B are calculated, and the spatial mapping positioning of the target device from the design layout to the chip translation stage is realized, and finally the microscopic image information of the target device is obtained; the microscopic image information of the target device is obtained by moving the chip translation stage or by moving the microscopic imaging system.

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