Semiconductor hot press apparatus and control method thereof

Abstract

This disclosure provides a semiconductor hot pressing device and its control method, relating to the field of semiconductor technology. The device includes: a first pressing part and a second pressing part. The first pressing part includes a first working surface disposed relative to a substrate. The second pressing part includes a main body and a plurality of sub-pressing parts. The main body includes a second working surface and a third working surface disposed opposite to each other, the third working surface being disposed relative to the substrate, and the second working surface being connected to the first working surface. The plurality of sub-pressing parts are spaced apart within the main body in a direction parallel to the substrate, and each sub-pressing part applies a different pressure to the pressing component. In the device provided by this disclosure, the second pressing part has a plurality of sub-pressing parts with adjustable pressure. The second pressing part acts on the pressing component to adjust the pressure applied to the second pressing component, thereby ensuring that the pressing component can be fully connected to the substrate and preventing plastic deformation or breakage of the metal bumps on the pressing component, resulting in high connection reliability of the device.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more specifically, to a semiconductor hot pressing apparatus and its control method. Background Technology

[0002] Thermal Compression Bonding (TCB) utilizes advanced technology and precision equipment to achieve high-precision welding while reducing defects present in traditional processes. In the TCB process, metal bumps are formed on the surface of electrical components such as chips, and then welding techniques are used to electrically connect the metal bumps on the package substrate and the surface of the electrical components. TCB technology is widely used in applications such as high-performance chips, 3D packaging, and system-in-package (SIP).

[0003] Currently, in thermocompression bonding equipment, rigid thermocompression connectors such as metal or ceramic are usually used to thermocompress chips and substrates. However, during the thermocompression process, the metal bumps on different parts of the chip are subjected to different pressures and temperatures, which can cause some metal bumps to deform or even break, reducing the reliability of the connection.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] In view of this, a semiconductor hot pressing device and its control method are provided. The device provides a plurality of sub-pressing parts and adjusts the pressure applied to the pressing component by the plurality of sub-pressing parts to adjust the pressure borne by the metal bumps on the pressing component, thereby avoiding plastic deformation or even breakage of the metal bumps due to uneven force and improving the connection reliability of the device.

[0006] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0007] According to one aspect of this disclosure, a semiconductor hot pressing apparatus is provided for connecting a substrate and a pressing component, the apparatus comprising:

[0008] A first pressing portion, the first pressing portion including a first working surface, the first working surface being disposed relative to the substrate;

[0009] The second pressing part includes a main body and a plurality of sub-pressing parts. The main body includes a second working surface and a third working surface disposed opposite to each other. The third working surface is disposed relative to the substrate. The second working surface is connected to the first working surface.

[0010] The plurality of sub-crimping portions are spaced apart in the main body portion along a direction parallel to the substrate, and each of the sub-crimping portions applies a different pressure to the crimping member.

[0011] In some embodiments of this disclosure, based on the foregoing scheme, each of the sub-pressing portions is an elastic component, and each of the sub-pressing portions is embedded in the main body portion.

[0012] In some embodiments of this disclosure, based on the foregoing scheme, the stiffness of each of the sub-pressing portions increases sequentially in the direction from the center region to the edge region within the main body.

[0013] In some embodiments of this disclosure, based on the foregoing scheme, the main body is provided with a plurality of cavities, each cavity corresponding to a sub-pressing part, and each sub-pressing part being an inflatable component disposed within the cavity.

[0014] In some embodiments of this disclosure, based on the foregoing scheme, the inflation pressure of each of the sub-pressing portions increases sequentially in the direction from the central region to the edge region within the main body.

[0015] In some embodiments of this disclosure, based on the foregoing scheme, the device further includes a third pressing part, the third pressing part having a fourth working surface and a fifth working surface disposed opposite to each other, the fifth working surface being disposed opposite to the pressing component, the fourth working surface being connected to the third working surface, the third pressing part applying pressure to the pressing component through the fifth working surface, and the third pressing part being made of a thermally conductive material.

[0016] In some embodiments of this disclosure, based on the foregoing scheme, the third crimping portion includes a sensor disposed on the fourth working surface, and the sensor is used to sense the pressure on each of the sub-crimping portions.

[0017] According to another aspect of this disclosure, a method for controlling a semiconductor hot pressing apparatus is provided for connecting a substrate and a pressing component, the method comprising:

[0018] A semiconductor hot pressing apparatus is provided, the apparatus including a first pressing part and a second pressing part connected together, the second pressing part including a main body and a plurality of sub-pressing parts, the plurality of sub-pressing parts being distributed at intervals within the main body in a direction parallel to the substrate;

[0019] Pressure is applied to the crimping component through each of the sub-crimping portions;

[0020] Obtain the pressure on each of the sub-crimping parts;

[0021] Adjust the pressure on each of the sub-pressing portions to make the substrate electrically connected to the pressing component.

[0022] In some embodiments of this disclosure, based on the foregoing scheme, each of the sub-crimping portions is an elastic component, and adjusting the pressure on each of the sub-crimping portions includes:

[0023] The stiffness of each of the sub-pressing parts is adjusted so that the pressure exerted by each of the sub-pressing parts on the pressing member increases sequentially from the center region to the edge region within the main body.

[0024] In some embodiments of this disclosure, based on the foregoing scheme, the main body is provided with a plurality of cavities, each cavity corresponding to a sub-pressing part, each sub-pressing part being an inflatable component disposed within the cavity, and adjusting the pressure on each sub-pressing part including:

[0025] Adjust the inflation pressure in each of the sub-crimping parts so that the pressure exerted by each of the sub-crimping parts on the crimping component increases sequentially from the center region to the edge region within the main body.

[0026] This disclosure provides a semiconductor hot pressing device, which includes a first pressing part and a second pressing part connected together. The second pressing part includes a main body and a plurality of sub-pressing parts. The plurality of sub-pressing parts are spaced apart inside the main body, and each sub-pressing part can apply different pressures to different parts of the pressing component at different times, so as to adjust the pressure borne by the metal bumps on the pressing component. This prevents the metal bumps on the pressing component from undergoing plastic deformation or even cracking when the pressing component is connected to the substrate, thereby improving the reliability of the device and thus increasing the yield of the device.

[0027] This disclosure also provides a control method for a semiconductor hot pressing device. The method applies pressure to the pressing component through each sub-pressing part of the second pressing part, and obtains and adjusts the pressure on each sub-pressing part to enable the pressing component to make effective electrical connection with the substrate. This avoids connection failure caused by plastic deformation or cracking of the metal bumps on the pressing component, and improves the connection reliability of the device.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0030] Figure 1This is a schematic diagram of the structure of a pre-bonding crimping component in an exemplary embodiment of the present disclosure.

[0031] Figure 2 This is a schematic diagram of the structure of a bonding crimping component in the prior art, as shown in an exemplary embodiment of this disclosure.

[0032] Figure 3 This is a schematic diagram of the structure of a semiconductor hot pressing device according to an exemplary embodiment of the present disclosure.

[0033] Figure 4 This is a top view of a semiconductor hot pressing apparatus according to an exemplary embodiment of the present disclosure.

[0034] Figure 5 This is a flowchart of a control method for a semiconductor hot pressing apparatus according to an exemplary embodiment of the present disclosure.

[0035] The reference numerals in the attached figures are explained as follows:

[0036] 100, Semiconductor hot pressing device; 200, Pressing component; 201, Metal bump; 300, Substrate; 110, First pressing part; 120, Second pressing part; 121, Main body part; 122, Sub-pressing part; 130, Third pressing part; 140, Sensor; 150, Control unit; 101, First working surface; 102, Second working surface; 103, Third working surface; 104, Fourth working surface; 105, Fifth working surface. Detailed Implementation

[0037] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0038] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0039] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0040] In related technologies, integrated circuits can be packaged in three dimensions to further improve their integration. During semiconductor manufacturing, thermal chip bumping (TCB) is used to connect the chip to the packaging substrate, enabling electrical and heat transfer. TCB technology is a high-precision chip mounting method that uses tiny metal bumps to connect the chip to the substrate. TCB technology mainly involves two steps: first, a layer of thermally conductive adhesive is coated on the chip; then, the chip is placed on the substrate, and heat and pressure are used to form connections between the metal bumps. TCB technology has wide applications in semiconductor packaging, especially in high-power and high-temperature environments. It can improve chip reliability and performance, and helps reduce package size and increase the overall system integration.

[0041] like Figure 1 As shown, at room temperature, the metal bumps 201 on the unbonded chip have the same height. However, during the TCB process, as... Figure 2 As shown, the combined effects of temperature and pressure on the chip cause deformation of the metal bumps 201. The chip exhibits a temperature distribution with higher temperatures in the central region and lower temperatures at the edges. To ensure that each metal bump 201 can bond to the substrate 300, significant pressure needs to be applied to the chip. Simultaneously, due to the high temperature, the metal bumps 201 located in the central region of the chip expand and deform. When uniform pressure is applied to all areas of the chip, the metal bumps 201 in the central region bear greater pressure, making them prone to plastic deformation or even breakage, resulting in poor bonding between the chip and the substrate 300.

[0042] Based on this, the present disclosure provides a semiconductor hot pressing apparatus, such as... Figure 3 As shown, the semiconductor hot pressing device 100 includes: a first pressing part 110 and a second pressing part 120.

[0043] The first pressing part 110 includes a first working surface 101, which is disposed relative to the substrate 300. The second pressing part 120 includes a main body 121 and a plurality of sub-pressing parts 122. The main body 121 includes a second working surface 102 and a third working surface 103 disposed opposite to each other. The third working surface 103 is disposed relative to the substrate 300. The second working surface 102 is connected to the first working surface 101. The plurality of sub-pressing parts 122 are distributed at intervals in the main body 121 along a direction parallel to the substrate 300, and each sub-pressing part 122 applies different pressures to the pressing member 200.

[0044] The semiconductor hot pressing apparatus 100 provided in this disclosure provides a first pressing part 110 and a second pressing part 120 connected in the apparatus. The second pressing part 120 includes a main body 121 and a plurality of sub-pressing parts 122. The plurality of sub-pressing parts 122 are spaced apart inside the main body 121, and each sub-pressing part 122 can apply different pressures to different parts of the pressing component 200 at different times, so as to adjust the pressure borne by the metal bumps 201 on the pressing component 200. This allows each metal bump 201 to be effectively bonded to the substrate 300 when the pressing component 200 is connected to the substrate 300, avoiding plastic deformation or even breakage of the metal bumps 201 on the pressing component 200, improving the reliability of the device, and thus improving the yield of the device.

[0045] The various parts of the semiconductor hot pressing apparatus provided in the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings:

[0046] In the embodiments provided in this disclosure, the semiconductor hot pressing device 100 is used to connect the substrate 300 and the pressing component 200. The substrate 300 can be a packaging substrate 300, which is the base material for connecting the chip and external circuitry. The substrate 300 provides electrical connections and physical support, as well as heat dissipation and chip protection. In this disclosure, the substrate 300 can be a printed circuit board (PCB), a multilayer board, a silicon substrate 300, a ceramic substrate, or other packaging substrates. The selection of the substrate 300 depends on factors such as chip characteristics, application requirements, and cost, and can be selected according to the specific circumstances of the device; this disclosure does not impose specific limitations.

[0047] In the embodiments provided in this disclosure, the crimping component 200 can be a chip, which can be a structure integrating electronic components such as transistors, resistors, and inductors. Of course, the crimping component 200 can also be other components for connecting to the substrate 300. For example, the crimping component 200 can also be a capacitor, inductor, variable resistor, crystal oscillator, connector, etc. The specific type of the crimping component 200 can be selected according to the actual structure and function of the device, and this disclosure does not make specific limitations.

[0048] However, it should be noted that the number of crimping components 200 can be one or more, and multiple crimping components 200 can be electrically connected to the substrate 300 using TCB technology. This disclosure only uses one crimping component 200 as an example for illustration, but the number of crimping components 200 and their arrangement on the substrate 300 can be selected according to actual needs. In addition, the crimping component 200 has a crimping portion, which can be a metal bump 201. Multiple metal bumps 201 are distributed on the side of the crimping component 200 facing the substrate 300. The substrate 300 is provided with a connecting surface, and the crimping component 200 is electrically connected to the substrate 300 through its crimping portion.

[0049] In the embodiments provided in this disclosure, such as Figure 3 As shown, the first pressing portion 110 includes a first working surface 101, which is disposed relative to the substrate 300. The first pressing portion 110 can be the main force-applying part of the pressing member 200 by a hot pressing device, and the first working surface 101 is the side of the first pressing portion 110 facing the substrate 300. Since the connection between the pressing member 200 and the substrate 300 requires the simultaneous action of pressure and temperature, the first pressing portion 110 needs to provide pressure to the pressing member 200 while also possessing thermal conductivity so that heat can be transferred to the pressing member 200 through the first pressing portion 110. In this disclosure, the first pressing portion 110 can be made of a thermally conductive material, for example, the first pressing portion 110 can be made of ceramic, hard alloy, tungsten, or other materials. The first pressing portion 110 has characteristics such as heat resistance and high hardness to provide sufficient pressure to the pressing member 200 while being able to withstand high temperature and high pressure.

[0050] like Figure 3As shown, the semiconductor hot pressing apparatus 100 also includes a control unit 150, which can be connected to the first pressing part 110. The control unit 150 can control the first pressing part 110 to move in a direction closer to or farther from the substrate 300, so that the first pressing part 110 provides the pressure required for the pressing member 200 to connect with the substrate 300. Furthermore, the semiconductor hot pressing apparatus 100 may also include a heat source, which can provide heat to the first pressing part 110 and transfer the heat to the pressing member 200 through the first pressing part 110, providing the required temperature for the connection between the pressing member 200 and the substrate 300. The control unit 150 can control the heat transferred by the heat source to ensure that the temperature provided by the apparatus meets the hot pressing temperature requirements without exceeding the operating temperature limits of the apparatus, the pressing member 200, and the substrate 300, thus ensuring the safety of the apparatus operation and the reliability of the connection between the substrate 300 and the pressing member 200. The control unit 150 can be an intelligent terminal that integrates functions such as data collection, data analysis, data output and control. For example, it can be a computer, tablet computer, smartphone or other device.

[0051] In the embodiments provided in this disclosure, such as Figure 3 As shown, combined with Figure 4 The second crimping portion 120 includes a main body 121 and a plurality of sub-crimping portions 122. The main body 121 includes a second working surface 102 and a third working surface 103 disposed opposite to each other. The third working surface 103 is disposed relative to the substrate 300. The second working surface 102 is connected to the first working surface 101 of the first crimping portion 110. The plurality of sub-crimping portions 122 are distributed at intervals inside the main body 121 along a direction parallel to the substrate 300, and each sub-crimping portion 122 applies a different pressure to the crimping member 200.

[0052] The first pressing part 110 and the second pressing part 120 are connected via a first working surface 101 and a second working surface 102, with the first working surface 101 and the second working surface 102 in contact. The first pressing part 110 and the second pressing part 120 can be connected by adhesive bonding. For example, a thermally conductive adhesive with adhesion can be applied between the first working surface 101 and the second working surface 102 to connect the first pressing part 110 and the second pressing part 120, achieving both bonding and thermal conductivity. Alternatively, the first pressing part 110 and the second pressing part 120 can be detachably connected. For example, the first pressing part 110 and the second pressing part 120 can be connected by screws, allowing the second pressing part 120 to be replaced according to actual needs in practical applications. Alternatively, the first pressing part 110 and the second pressing part 120 can be slidably connected. For example, a slide rail and a slider can be respectively provided on the first working surface 101 and the second working surface 102 to achieve the connection between the two. Of course, the first crimping part 110 and the second crimping part 120 can also be other connection methods, which will not be listed here.

[0053] like Figure 4 As shown, the second crimping portion 120 includes a main body 121. The main body 121 of the second crimping portion 120 can have the same shape and be made of the same material as the first crimping portion 110. For example, the main body 121 of the second crimping portion 120 can also be made of materials such as ceramic, hard alloy, or tungsten, which have both hardness and thermal conductivity. In the embodiments provided in this disclosure, the first crimping portion 110 and the second crimping portion 120 are made of the same material, such as ceramic, so that the first crimping portion 110 and the second crimping portion 120 have the same thermal conductivity, so that the heat from the first crimping portion 110 can be well transferred to the second crimping portion 120. Of course, the second crimping portion 120 can also be made of a different material than the first crimping portion 110, which can be selected according to the actual design requirements of the device. This disclosure does not make specific limitations.

[0054] The second pressing portion 120 further includes a plurality of sub-pressing portions 122, which are spaced apart within the main body portion 121 along a direction parallel to the substrate 300, and each sub-pressing portion 122 can apply different pressures to the pressing member 200. In this disclosure, to facilitate the application of pressure to the pressing member 200 by the first pressing portion 110 and the second pressing portion 120, the first working surface 101 of the first pressing portion 110, the second working surface 102 and the third working surface 103 of the second pressing portion 120 are typically arranged parallel to the surface of the substrate 300, which is beneficial for the connection between the substrate 300 and the pressing member 200. Of course, the parallelism mentioned here is not parallel in a strict sense. Due to manufacturing process limitations, the three planes may also be at a certain angle. For example, the included angle between the three planes can be between 0° and 5°, such as 0°, 1°, 2°, 3°, 4° or 5°. Preferably, the included angle between the three planes is 0°.

[0055] In one embodiment provided in this disclosure, each sub-pressing portion 122 is an elastic member, and the sub-pressing portion 122 is embedded inside the main body portion 121. In some embodiments, each sub-pressing portion 122 is embedded inside the main body portion 121, and the main body portion 121 covers each sub-pressing portion 122. In some embodiments, each sub-pressing portion 122 is embedded inside the main body portion 121, and a plurality of openings may be provided on the third working surface 103, each opening corresponding to each sub-pressing portion 122 to expose the end of the sub-pressing portion 122. The end of the sub-pressing portion 122 may be flush with the third working surface 103 or the end of the sub-pressing portion 122 may protrude from the third working surface 103. Each sub-pressing portion 122 may be cubic in shape, for example, a cube or a cuboid. Or each sub-pressing portion 122 may be spherical. Of course, each sub-pressing portion 122 may also be other irregular shapes. The shapes of each sub-crimping part 122 may be the same or different. This disclosure does not specifically limit the shape of each sub-crimping part 122, and it can be selected according to actual needs.

[0056] Each sub-pressing portion 122 is made of a solid elastic material, and the material of each sub-pressing portion 122 is different from that of the main body 121. Each sub-pressing portion 122 has a different stiffness. For example, each sub-pressing portion 122 can be made of rubber, thermally conductive silicone, carbon fiber composite material, etc., or each sub-pressing portion 122 can be made of a spring or spring-like material. The pressure applied by each sub-pressing portion 122 to the pressing component 200 is adjusted by setting the stiffness of each sub-pressing portion 122.

[0057] In the specific embodiments provided in this disclosure, the stiffness of each sub-pressing portion 122 increases sequentially from the central region to the edge region within the main body portion 121. During the connection process between the pressing member 200 and the substrate 300, in the pressing member 200, due to the faster heat dissipation in the edge region, the metal bumps 201 in the edge region of the pressing member 200 have a lower temperature than the metal bumps 201 in the central region. In order to fully connect the metal bumps 201 in the edge region with the substrate 300, it is necessary to further apply pressure to the pressing member 200. However, this results in the metal bumps 201 in the central region bearing greater pressure than those in the edge region, which can easily cause plastic deformation or even breakage of the metal bumps 201 in the central region. To improve the above phenomenon... According to the law of thermal conduction, the smaller the thermal resistance, the faster the heat conduction. In order to reduce thermal resistance, the pressure can be increased. Therefore, the stiffness of each sub-pressing part 122 in the second pressing part 120 provided in this disclosure increases sequentially from the center region to the edge region in the main body 121, so that the pressure applied by each sub-pressing part 122 to the pressing member 200 decreases sequentially from the center region to the edge region, so as to balance the pressure on the metal protrusion 201 in the center region and the metal protrusion 201 in the edge region, and avoid the phenomenon of deformation and breakage of the metal protrusion 201 due to uneven force.

[0058] In the above embodiments, the pressure and temperature borne by each metal protrusion 201 in the crimping component 200 can be simulated in advance using simulation technology. In the initial stage of applying pressure to the crimping component 200, the stiffness of each sub-crimping part 122 within the second crimping part 120 can be adjusted based on the preliminary simulation results to apply appropriate pressure to the crimping component 200. For example, when the sub-crimping part 122 is made of rubber, the pressure applied by the second crimping part 120 to the crimping component 200 can be adjusted by setting sub-crimping parts 122 with different stiffnesses within the second crimping part 120. Alternatively, when the sub-crimping part 122 is a spring component, the compression amount of each spring can be adjusted by the control unit 150 to apply different pressures to each metal protrusion 201 of the crimping component 200.

[0059] On the other hand, during the bonding process between the substrate 300 and the crimping member 200, the device can also detect the bonding pressure and temperature between the substrate 300 and the crimping member 200 in real time. This allows for real-time adjustment of the pressure applied by the second crimping part 120 to each metal bump 201 of the crimping member 200 based on the feedback pressure and temperature, thereby achieving a reliable connection between the crimping member 200 and the substrate 300. During real-time detection, the stiffness of each sub-crimping part 122 within the second crimping part 120 can be adjusted to regulate the pressure. For example, based on the real-time detected pressure and temperature, the stiffness of some or all of the sub-crimping parts 122 can be adjusted. Of course, the general trend is that the stiffness of each sub-crimping part 122 increases sequentially from the center region to the edge region, but some sub-crimping parts 122 may not follow this trend depending on the actual situation, and this is also within the scope of this disclosure.

[0060] In one embodiment of this disclosure, the main body 121 has multiple cavities inside, each cavity corresponding to a sub-crimping portion 122, and each sub-crimping portion 122 is an inflatable component disposed inside the cavity. Multiple cavities are distributed at intervals along a direction parallel to the substrate 300 within the main body 121 of the second crimping portion 120. Each cavity is independently distributed, and each cavity has a sub-crimping portion 122 disposed therein. The sub-crimping portion 122 can be an inflatable component disposed inside the cavity. An inflatable component is connected to each cavity; for example, the inflatable component can be an inflatable pipe, through which air can be inflated or deflated. The inflation / deflation amount of each sub-crimping portion 122 can be controlled independently, and the inflation / deflation of multiple sub-crimping portions 122 does not interfere with each other. That is, each sub-crimping portion 122 has a separate pipe for inflation / deflation, so as to adjust the pressure inside the sub-crimping portion 122 by adjusting the inflation / deflation amount, thereby adjusting the pressure applied by each sub-crimping portion 122 to the crimping component 200.

[0061] In the above embodiments, a gas regulating unit may be provided in the device to control the amount of gas charged or discharged to each sub-crimping part 122. The gas in the sub-crimping part 122 may be an inert gas, such as nitrogen (N2), helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), etc.

[0062] In the specific embodiments provided in this disclosure, the inflation pressure of each sub-crimping portion 122 increases sequentially in the direction from the central region to the edge region within the main body portion 121. During the connection process between the crimping component 200 and the substrate 300, the metal bumps 201 in the edge region of the crimping component 200 have a lower temperature than the metal bumps 201 in the center region due to the faster heat dissipation in the edge region. In order to fully connect the metal bumps 201 in the edge region with the substrate 300, it is necessary to further apply pressure to the crimping component 200, resulting in the metal bumps 201 in the center region bearing greater pressure than those in the edge region. This can easily cause the metal bumps 201 in the center region to undergo plastic deformation or even break. In order to improve the above phenomenon, the inflation pressure of each sub-crimping part 122 provided in this disclosure increases sequentially from the center region to the edge region in the main body 121, so that the pressure applied by each sub-crimping part 122 to the crimping component 200 decreases sequentially from the center region to the edge region, thereby balancing the pressure on the metal bumps 201 in the center region and the metal bumps 201 in the edge region and avoiding the phenomenon of deformation and breakage of the metal bumps 201 due to uneven force.

[0063] In the above embodiments, the pressure and temperature borne by each metal bump 201 in the crimping component 200 can be simulated in advance using simulation technology. In the initial stage of applying pressure to the crimping component 200, the air volume of each sub-crimping part 122 in the second crimping part 120 can be adjusted according to the pre-simulated results to apply appropriate pressure to the crimping component 200. For example, the air volume in each sub-crimping part 122 can be adjusted by the control unit 150 to apply different pressures to each metal bump 201 of the crimping component 200. Furthermore, the device can also detect the bonding pressure and temperature between the substrate 300 and the crimping component 200 in real time, and adjust the pressure exerted by each sub-crimping part 122 in the second crimping part 120 on each metal bump 201 in the crimping component 200 in real time based on the feedback pressure and temperature, thereby achieving a reliable connection between the crimping component 200 and the substrate 300.

[0064] In the above embodiment, the inflation pressure of each sub-crimping part 122 increases sequentially from the center region to the edge region within the main body 121. This can be the distribution trend of the pressure of each sub-crimping part 122 on the main body 121. In some regions, the pressure distribution of some sub-crimping parts 122 may vary according to the actual situation, but the overall trend should conform to the distribution trend on the main body 121.

[0065] It should be noted that the above two embodiments can be combined or modified, all of which are within the protection scope of this disclosure, and will not be specifically described here.

[0066] In the embodiments provided in this disclosure, such as Figure 3 As shown, the semiconductor hot pressing device 100 further includes a third pressing portion 130. The third pressing portion 130 has a fourth working surface 104 and a fifth working surface 105 disposed opposite to each other. The fifth working surface 105 is disposed opposite to the pressing component 200, and the fourth working surface 104 is connected to the third working surface 103. The third pressing portion 130 applies pressure to the pressing component 200 through the fifth working surface 105, and the third pressing portion 130 is made of a thermally conductive material. The third pressing portion 130 is connected to the second pressing portion 120, and the third pressing portion 130 is disposed on the third working surface 103. The third pressing portion 130 and the second pressing portion 120 are detachably connected or fixedly connected, for example, by bonding, screwing, etc. Preferably, they are detachably connected to facilitate replacement and maintenance of the third connection portion. The fifth working surface 105 in the third pressing portion 130 directly acts on the end face of the pressing component 200, and its shape can be fitted to the surface of the pressing component 200.

[0067] Since the main body 121 and each sub-pressing part 122 within the second pressing part 120 are made of different materials, the thermal conductivity inside the second pressing part 120 is different. In order to ensure that heat can be evenly transferred to the pressing member 200, the device provided in this disclosure is provided with a third pressing part 130. The third pressing part 130 is made of a thermally conductive material. Through the third pressing part 130, the heat transferred by the second pressing part 120 can be evenly transferred to the pressing member 200, so that the pressing member 200 is heated evenly. The third pressing part 130 can be made of a material with good thermal conductivity, such as a metal material (e.g., tungsten) or a ceramic material.

[0068] In the embodiments provided in this disclosure, such as Figure 4As shown, the semiconductor hot pressing device 100 also includes a sensor 140, which can be disposed on the fourth working surface 104 of the second pressing portion 120. The sensor 140 is used to sense the pressure on each sub-pressing portion 122. The orthographic projection of each sub-pressing portion 122 on the fourth working surface 104 is located within the orthographic projection of the sensor 140 on the fourth working surface 104, ensuring that the sensor 140 can sense the pressure on all sub-pressing portions 122. In this disclosure, the sensor 140 can be a pressure sensing device such as a pressure sensor, piezoelectric sensor, pneumatic pressure switch, or strain gauge. In this disclosure, a sensor 140 can be disposed at the end of each sub-pressing portion 122 to sense the pressure of each sub-pressing portion 122, or a sensor 140 can be disposed on each sub-pressing portion 122 to sense the pressure of each sub-pressing portion 122. In addition, the sensor 140 can also sense temperature. For example, a temperature sensor can be integrated into the sensor 140, so that the sensor 140 can obtain the temperature of each sub-pressing part 122 at the same time as obtaining the pressure of each sub-pressing part 122.

[0069] The sensor 140 can be connected to the control unit 150. The control unit 150 collects the pressure and temperature of each sub-crimping part 122 fed back by the sensor, performs real-time detection and analysis of the connection process between the crimping member 200 and the substrate 300, and adjusts the pressure on each sub-crimping part 122 in real time according to the pressure and temperature to achieve a reliable connection between the substrate 300 and the crimping member 200.

[0070] The semiconductor hot pressing apparatus 100 provided in this disclosure provides a first pressing part 110 and a second pressing part 120 connected in the apparatus. The second pressing part 120 includes a main body 121 and a plurality of sub-pressing parts 122. The plurality of sub-pressing parts 122 are spaced apart inside the main body 121, and each sub-pressing part 122 can apply different pressures to different parts of the pressing component 200 at different times, so as to adjust the pressure borne by the metal bumps 201 on the pressing component 200. This allows each metal bump 201 to be effectively bonded to the substrate 300 when the pressing component 200 is connected to the substrate 300, avoiding plastic deformation or even breakage of the metal bumps 201 on the pressing component 200, improving the reliability of the device, and thus improving the yield of the device.

[0071] This disclosure also provides a control method for a semiconductor hot pressing device, used for connecting a substrate and a pressing component, such as... Figure 5 As shown, combined with Figure 3 and Figure 4 The control method includes steps S100 to S400.

[0072] In step S100: a semiconductor hot pressing device is provided. The device includes a first pressing part and a second pressing part connected together. The second pressing part includes a main body and a plurality of sub-pressing parts. The plurality of sub-pressing parts are distributed at intervals in the main body along a direction parallel to the substrate.

[0073] Step S200: Apply pressure to the crimping component through each sub-crimping part;

[0074] Step S300: Obtain the pressure on each sub-crimping part;

[0075] Step S400: Adjust the pressure on each sub-pressing part to make the substrate electrically connected to the pressing component.

[0076] The control method of the semiconductor hot pressing apparatus 100 provided in this disclosure adjusts the pressure on the multiple sub-pressing portions 122 within the second pressing portion 120 so that the pressure applied by the second pressing portion 120 to the pressing member 200 can be adjusted according to the actual connection between the substrate 300 and the pressing member 200, thereby ensuring the reliability of the connection between the pressing member 200 and the substrate 300 and improving the yield of the device.

[0077] The control method of the semiconductor hot pressing device provided in the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings:

[0078] In step S100, a semiconductor hot pressing device 100 is provided. The device includes a first pressing portion 110 and a second pressing portion 120 connected together. The second pressing portion 120 includes a main body portion 121 and a plurality of sub-pressing portions 122, which are spaced apart within the main body portion 121 along a direction parallel to the substrate 300. The specific structure of the semiconductor hot pressing device 100 is as described in the above embodiments and will not be repeated here.

[0079] In step S200, pressure is applied to the crimping member 200 by each sub-crimping portion 122. The process of connecting the substrate 300 and the crimping member 200 can be simulated using simulation technology to obtain preliminary simulation results. Based on the simulation structure, each sub-crimping portion 122 pre-applies pressure to the crimping member 200. In some embodiments, the pressure pre-applied by each sub-crimping portion 122 to the crimping member 200 generally tends to decrease from the central region of the main body 121 to the edge region, so as to reduce the pressure difference between the central region and the edge region of the metal bump 201 within the crimping member 200.

[0080] In steps S300 and S400, the pressure on each sub-crimping part 122 is obtained; the pressure on each sub-crimping part 122 is adjusted so that the substrate 300 and the crimping member 200 are electrically connected.

[0081] Based on the pre-pressurization value of each sub-pressing part 122 on the pressing component 200, the connection status of each metal bump 201 of the pressing component 200 and the substrate 300 is detected, and the pressure on each sub-pressing part 122 is adjusted in real time according to the connection status, so that each metal bump 201 of the pressing component 200 and the substrate 300 can be reliably connected.

[0082] In one embodiment, each sub-crimping portion 122 is an elastic component. Adjusting the pressure on each sub-crimping portion 122 includes adjusting the stiffness of each sub-crimping portion 122 so that the pressure applied by each sub-crimping portion 122 to the crimping component 200 increases sequentially from the central region to the edge region within the main body portion 121.

[0083] In another embodiment, the main body 121 is provided with a plurality of cavities, each cavity corresponding to a sub-crimping part 122. Each sub-crimping part 122 is an inflatable component disposed in the cavity. Adjusting the pressure on each sub-crimping part 122 includes adjusting the inflation pressure in each sub-crimping part 122 so that the pressure applied by each sub-crimping part 122 to the crimping component 200 increases sequentially from the central region to the edge region within the main body 121.

[0084] The specific implementation methods of the two embodiments described above are as described in the above apparatus, and will not be repeated here. It should be noted that the two embodiments described above can be modified or combined, all of which are within the protection scope of this disclosure.

[0085] The control method of the semiconductor hot pressing device provided in this disclosure adjusts the pressure on the multiple sub-pressing portions 122 within the second pressing portion 120 so that the pressure applied by the second pressing portion 120 to the pressing member 200 can be adjusted according to the actual connection between the substrate 300 and the pressing member 200, thereby ensuring the reliability of the connection between the pressing member 200 and the substrate 300 and improving the yield of the device.

[0086] It should be noted that although the steps of the control method for the semiconductor hot pressing device in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0087] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A semiconductor hot pressing device for connecting a substrate and a pressing component, characterized in that, include: A first pressing portion, the first pressing portion including a first working surface, the first working surface being disposed relative to the substrate; The second pressing part includes a main body and a plurality of sub-pressing parts. The main body includes a second working surface and a third working surface disposed opposite to each other. The third working surface is disposed relative to the substrate. The second working surface is connected to the first working surface. The plurality of sub-crimping portions are spaced apart in the main body portion along a direction parallel to the substrate, and each of the sub-crimping portions applies a different pressure to the crimping member.

2. The semiconductor hot pressing device according to claim 1, characterized in that, Each of the sub-crimping parts is an elastic component, and each of the sub-crimping parts is embedded in the main body.

3. The semiconductor hot pressing apparatus according to claim 2, characterized in that, The stiffness of each of the sub-pressing parts increases sequentially from the center region to the edge region within the main body.

4. The semiconductor hot pressing apparatus according to claim 1, characterized in that, The main body has multiple cavities, each cavity corresponding to a sub-pressing part, and each sub-pressing part is an inflatable component disposed within the cavity.

5. The semiconductor hot pressing apparatus according to claim 4, characterized in that, The inflation pressure of each of the sub-pressing parts increases sequentially from the center region to the edge region within the main body.

6. The semiconductor hot pressing apparatus according to claim 1, characterized in that, The device further includes a third pressing part, which has a fourth working surface and a fifth working surface disposed opposite to each other. The fifth working surface is disposed opposite to the pressing component, and the fourth working surface is connected to the third working surface. The third pressing part applies pressure to the pressing component through the fifth working surface. The third pressing part is made of a thermally conductive material.

7. The semiconductor hot pressing apparatus according to claim 6, characterized in that, The third crimping part includes a sensor disposed on the fourth working surface, and the sensor is used to sense the pressure on each of the sub-crimping parts.

8. A control method for a semiconductor hot pressing device, used to connect a substrate and a pressing component, characterized in that, include: A semiconductor hot pressing apparatus is provided, the apparatus including a first pressing part and a second pressing part connected together, the second pressing part including a main body and a plurality of sub-pressing parts, the plurality of sub-pressing parts being distributed at intervals within the main body in a direction parallel to the substrate; Pressure is applied to the crimping component through each of the sub-crimping portions; Obtain the pressure on each of the sub-crimping parts; Adjust the pressure on each of the sub-pressing portions to make the substrate electrically connected to the pressing component.

9. The control method for the semiconductor hot pressing device according to claim 8, characterized in that, Each of the sub-crimping parts is an elastic component, and adjusting the pressure on each of the sub-crimping parts includes: The stiffness of each of the sub-pressing parts is adjusted so that the pressure exerted by each of the sub-pressing parts on the pressing member increases sequentially from the center region to the edge region within the main body.

10. The control method for the semiconductor hot pressing device according to claim 8, characterized in that, The main body has multiple cavities, each cavity corresponding to a sub-pressing part. Each sub-pressing part is an inflatable component disposed within the cavity. Adjusting the pressure on each sub-pressing part includes: Adjust the inflation pressure in each of the sub-crimping parts so that the pressure exerted by each of the sub-crimping parts on the crimping component increases sequentially from the center region to the edge region within the main body.

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