Crossflow air deflector for high density individual airflow control

Abstract

A crossflow air deflector component for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first rear lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second rear lateral edge of the airflow deflector opposite the first rear lateral edge. Such an airflow deflector can be implemented into a storage server positioned between a pair of laterally adjacent data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector is used to direct airflow from one of the lateral DSD chambers into a lower fan and to direct airflow from the other lateral DSD chamber into an upper fan. Independent airflow control is thereby provided for each DSD chamber and each corresponding DSD.

Description

Technical Field

[0001] Embodiments of the present invention relate generally to electronic cooling, and more particularly to crossflow air deflectors for independent airflow control. Background Technology

[0002] As the number and functionality of networked computer systems increase, the demand for storage system capacity also grows. Cloud computing and large-scale data processing further increase the need for digital data storage systems capable of transmitting and accommodating massive amounts of data. Data centers typically consist of numerous rack-mountable storage units for storing large volumes of data.

[0003] One approach to providing sufficient data storage for a data center is to use data storage device arrays. Many data storage devices can be housed in electronic enclosures (sometimes called "racks"), which are typically modular units that hold and operate individual data storage devices within arrays, computer processors, routers, and other electronic equipment. Data storage devices are often mounted close together within the electronic enclosure—a densely packed or "high-density" system—allowing many devices to fit within a limited volume. Operating many data storage devices close together within an electronic enclosure can create thermal problems, which can then lead to premature failure of the data storage devices. Rack systems typically include fans or other cooling equipment. Therefore, for rack-mounted equipment cooled using forced air convection, controlling airflow throughout the system is crucial. Similarly, but in contrast to rack storage systems, controlling airflow throughout a storage device testing system can also be beneficial in controlling the heating of the equipment in the context of high-temperature testing processes.

[0004] Any method described in this section is a feasible method, but not necessarily one that has been previously conceived or implemented. Therefore, unless otherwise stated, no method described in this section should be considered prior art simply because it is included in this section. Attached Figure Description

[0005] The embodiments are illustrated in the accompanying drawings by way of example rather than limitation, in which the same reference numerals refer to similar elements and wherein:

[0006] Figure 1 This is a diagram illustrating a typical high-availability storage server layout;

[0007] Figure 2 This is a diagram illustrating a storage server arrangement including a cross-flow air deflector according to one embodiment;

[0008] Figure 3 This is a perspective view showing a crossflow air deflector according to one embodiment;

[0009] Figures 4A to 4B This illustrates an implementation scheme. Figure 3 An orthogonal view of a crossflow air deflector, and Figure 4C It is a sectional view;

[0010] Figure 5A This is a first perspective view showing a pair of drive chambers according to one embodiment;

[0011] Figure 5B This illustrates an implementation scheme. Figure 5A A second perspective view of a pair of drive chambers;

[0012] Figure 6 It is an exploded view of a driver test unit according to an implementation scheme; and

[0013] Figure 7 This is a flowchart illustrating a method for controlling airflow in a data storage device assembly according to one embodiment. Detailed Implementation

[0014] Generally, methods for managing airflow within electronic enclosures (such as data storage systems or storage servers) are described. In the following description, numerous specific details are set forth for purposes of explanation in order to provide a thorough understanding of the embodiments of the invention described herein. However, it will be apparent, however, that the embodiments of the invention described herein can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the embodiments of the invention described herein.

[0015] introduction

[0016] the term

[0017] References to "implementation," "an embodiment," etc., herein are intended to mean that a particular feature, structure, or characteristic described is included in at least one embodiment of the invention. However, instances of such phrases do not necessarily refer to the same embodiment.

[0018] The term "substantially" should be understood as describing features that are mostly or nearly structured, constructed, or dimensionally defined, but in practice, manufacturing tolerances and other factors may cause the structure, configuration, dimensions, etc., to not always or necessarily be as precise as described. For example, describing a structure as "substantially vertical" would give the term its general meaning, implying that the sidewalls are vertical for all practical purposes, but may not be precisely at 90 degrees throughout.

[0019] While terms such as “optimal,” “minimum,” “maximum,” “maximize” may not have certain values ​​associated with them, if used herein, it is intended that those skilled in the art will understand that such terms will encompass values, parameters, measures, etc., that influence in a beneficial direction consistent with the whole of this disclosure. For example, describing the value of something as “minimum” does not require that the value is actually equal to some theoretical minimum (e.g., zero), but should be understood in a practical sense as the corresponding objective being to move that value toward the theoretical minimum in a beneficial direction.

[0020] Data storage system context

[0021] Recall that for high-density data storage systems or storage servers that utilize forced air convection for cooling, as well as high-density storage device testing systems, controlling airflow throughout the system is crucial. Such systems typically lack independent airflow control for each storage device (generally, each "drive"). To accommodate a separate cooling fan for each drive to implement independent airflow control would require increasing slot width, which is undesirable. Specific to the context of the testing system, dual-sided heating for devices used in higher-temperature testing (such as solid-state drives (SSDs)) is often not implemented due to space constraints and the use of radial fans, and therefore, temperature and airflow control may be less than expected.

[0022] Figure 1This is a diagram illustrating a typical high-availability storage server layout. Storage server 100 includes multiple data storage devices (“DSDs”) 102 (e.g., solid-state drives, or “SSDs”) for storing digital data, and multiple adjacent cooling fans 104 (e.g., radial fans) operating to at least cool the DSDs 102. Storage servers such as storage server 100 may also include one or more power supply units (“PSUs”) 106 and one or more compute nodes 108, wherein the PSUs 106 operate to power the powered components constituting storage server 100 (e.g., DSDs 102, compute nodes 108), and the compute nodes 108 are typically configured to perform computational processing, storage / memory management (e.g., JBOF or “Just a Bunch of Flash”), network / switching infrastructure, and so on, within storage server 100. Here, in the high-density storage system 100, the number of DSDs 102 is shown as greater than the number of fans 104, and therefore each DSD 102 is not matched with a corresponding fan 104 that provides independent airflow for each DSD 102; that is, the fans 104 are shared or common. Furthermore, the fans 104 require high CFM (cubic feet per minute) to, for example, cool high-power SSDs, and need to operate at relatively high speeds, even if all SSDs 102 are not always operating simultaneously. Therefore, these fans 104 typically consume a relatively large amount of power and may unnecessarily generate noise. Furthermore, it is only expected that the power requirements of high-power DSDs / SSDs will increase over time, and therefore shared (or even independent) radial fans providing relatively low airflow are less likely to adequately cool the array of DSDs 102.

[0023] Crossflow air deflector

[0024] Considering the aforementioned issues, storage servers with increased DSD drive density and independent airflow control for each drive are likely desirable. Generally, and according to one embodiment, one approach to achieving this involves designing a system architecture arrangement such that drives are positioned horizontally adjacent to each other (e.g., vertically in a horizontally adjacent arrangement), and a pair of fans serving a corresponding pair of drives are positioned vertically adjacent to each other, an arrangement illustrated and described in more detail elsewhere in this document. An auxiliary component of this arrangement, referred to herein as a "crossflow air deflector," enables crossflow of airflow that enters the storage system horizontally and exits the system vertically.

[0025] Figure 2 This diagram illustrates a storage server arrangement including a cross-flow air deflector according to one embodiment. The configuration of storage server 200 is largely similar to... Figure 1 The storage system 100 includes multiple data storage devices (“DSDs”) 202 (e.g., solid-state drives or “SSDs”) for storing digital data, and multiple adjacent cooling fans 204 (e.g., axial fans) operating to at least cool the DSDs 202. Similarly, storage servers such as storage server 200 may also include one or more power supply units (“PSUs”) 206 and one or more compute nodes 208. Here, in this high-density storage system 200, the number of fans 204 is equal to the number of DSDs 202, and therefore each DSD 202 is matched with a corresponding fan 204 to provide independent airflow to each DSD 202. As discussed, this is facilitated by using multiple crossflow air deflectors 203 (or simply “air deflectors 203”) positioned between the DSDs 202 and the fans 204, for example, as depicted, one air deflector 203 for each pair of DSDs 202 and each pair of corresponding fans 204.

[0026] Figure 3 This is a perspective view showing a crossflow air deflector according to one embodiment, and Figures 4A to 4B It is an orthographic view, and Figure 4C It is shown Figure 3 A cross-sectional view (AA) of a cross-flow air deflector. The cross-flow air deflector 300 (or simply "air deflector 300") indicates... Figure 2 A specific embodiment of the air deflector 203 of the storage system 200 is configured to guide airflow. For purposes of reference and explanation, and by way of example, Figure 3 The left-facing portion of the air deflector 300 (and) Figure 4B The surfaces observed in Figure 4A The side facing right (from the center) is called the proximal side, while Figure 3 The relative right-facing portion of the air deflector 300 (and Figure 4A The side facing left from the center is called the distal side.

[0027] According to one embodiment, the crossflow air deflector 300 includes a proximal central ridge 302, a first arcuate wall 304a (or "deflector panel") extending from the ridge 302 to a first distal lateral edge 305a of the airflow deflector 300, and a second arcuate wall 304b (or "deflector panel") extending from the ridge 302 to an opposing second distal lateral edge 305b of the airflow deflector 300. While the use of arcuate or curved walls 304a, 304b enhances the guidance of airflow along the desired corresponding crossflow direction, other shapes of walls 304a, 304b or panels can also be implemented and still fall within the scope of the embodiment. According to one embodiment, the airflow deflector 300 also includes a closure cap 306 and a closure base 308, to which the ridge 302 and the first arcuate wall 304a are coupled, and to which the ridge 302 and the second arcuate wall 304b are coupled. As shown in the figure, the first arcuate wall 304a and the second arcuate wall 304b are configured to guide airflow from a first lateral (e.g., horizontal) position to a lower vertical position and from a second lateral position to an upper vertical position, as described in other parts of this document, such as references. Figures 5A to 5B More detailed examples and descriptions were provided.

[0028] Data storage drive room

[0029] Figure 5A This is a first perspective view showing a pair of drive chambers according to one embodiment, and Figure 5B It is shown Figure 5A A second perspective view of a pair of drive compartments. In other words, Figures 5A to 5B A pair of data storage compartments or compartment assemblies are shown for housing DSDs for any number of purposes, such as for installation in a data storage system or a data storage device test system. As described below and according to one embodiment, a single compartment can house a single DSD, thereby allowing multiple compartments (two adjacent compartments depicted herein) and pairs of compartments to be assembled / installed together (along with DSD / fan arrays extending laterally and vertically, such as 3×3, 4×4, etc. configurations) into one or more racks of a system enclosure to meet specific needs. For reference and explanation purposes and by way of example, a coordinate system is shown, where the x-direction is along the width of the compartment and is referred to as "lateral," the y-direction is along the length of the compartment from the proximal end to the distal end and is referred to as "longitudinal," and the z-direction is along the height of the compartment and is referred to as "vertical." However, in practice and according to the embodiment, the compartments can be positioned in alternative configurations in any given system while operating similarly as described, but for illustrative purposes, reference is made to... Figures 5A to 5B The aforementioned coordinate system is adopted.

[0030] refer to Figure 5AThe right-hand perspective view depicts a drive chamber assembly 500, which represents a first data storage device (DSD) chamber 502a extending longitudinally to accommodate a first DSD 504a (e.g., an SSD for a non-limiting example), and a second data storage device (DSD) chamber 502b extending longitudinally adjacent to the first DSD chamber 502a to accommodate a second DSD 504b (e.g., an SSD for a non-limiting example). The chamber assembly 500 further includes: a lower first fan 506a, which is positioned at the distal end of the chamber assembly 500 and spans the lateral width of the chamber assembly; an upper second fan 506b, which is positioned at the distal end of the chamber assembly 500 and spans the lateral width of the chamber assembly and is located vertically above the first fan 506a; and a crossflow air deflector 300, which is positioned between the distal ends or portions of the first DSD chamber 502a and the second DSD chamber 502b and the first fan 506a and the second fan 506b.

[0031] like Figures 5A to 5B As shown and according to one embodiment, the air deflector 300 is configured and positioned to guide the airflow 508a (by) entering and from the first (left) chamber 502a and flowing along the length of the first DSD 504a. Figure 5B (As depicted by the arrow in the image) enters the lower first fan 506a, and guides the airflow 508b into and from the second (right) chamber 502b and flows along the length of the second DSD 504b (by... Figure 5A (As depicted by the arrow in the image) enters into the upper second fan 506b, thereby achieving cross-flow of air. According to one embodiment, each DSD chamber 502a, DSD chamber 502b has a lateral width, which is defined on the inner and / or outer surfaces or panels of the DSD chamber 502a, DSD chamber 502b (in...). Figures 5A to 5BA gap is provided between the outer panel (with the outer panel removed) and its corresponding DSD 504a, DSD 504b, thereby facilitating the respective airflow 508a, 508b (e.g., length) along each DSD 504a, DSD 504b. According to one embodiment, the air deflector 300 is configured and positioned to guide the respective airflows 508a, 508b in the aforementioned manner, while also preventing or inhibiting the flow of the left airflow 508a to and into the upper second fan 506b, and preventing or inhibiting the flow of the right airflow 508b to and into the lower first fan 506a. It should be noted that the configuration of the air deflector 300 can be reversed, thereby configuring and positioning the air deflector 300 to guide the airflow 508a, which enters the first (left) chamber 502a and flows along the length of the first DSD 504a, into the upper second fan 506b, and to guide the airflow 508b, which enters the second (right) chamber 502b and flows along the length of the second DSD 504b, into the lower first fan 506a, thereby still achieving the desired cross-flow of air and independent cooling airflow for each drive.

[0032] Therefore, each DSD 504a, DSD 504b is effectively cooled independently of the others by the corresponding airflow 508a, 508b directed by the crossflow air guide 300 through the DSD chambers 502a, DSD chamber 502b to its corresponding individual (e.g., non-shared) cooling fans 506a, 506b. Thus, the chamber assembly 500 can be effectively “tuned” according to the individual cooling needs of the respective DSD 504a, DSD 504b at any given time and / or performance level (e.g., based on temperature sensor feedback) to optimize the amount of power dissipated (e.g., in terms of the heat dissipated) based on the heat generated by each respective DSD 504a, 504b. That is, the lower the required power / heat dissipation of the DSD 504a, DSD 504b, the lower the required speed of the fans 506a, 506b, and the system power requirements can be effectively minimized / optimized and fan noise reduced. Furthermore, high-density storage device systems or storage servers can be facilitated by using pairs of vertically stacked, independently operating cooling fans, each matched to a corresponding DSD (with minimal, negligible, and no airflow mixing) to guide airflow from different lateral directions. This allows for the adaptation of high-power DSDs / SSDs without compromising drive density. Additionally, more readily available and higher CFM axial fans can be implemented because, by using air deflectors 300, the width of each fan unit can now essentially span the width of a pair of DSD chambers 502a and 502b, rather than just the width of a single drive chamber, as is often the case in situations where geometric / spatial constraints necessitate the use of radial fans without air deflectors 300. Thus, a wider selection of commercial fans (i.e., axial fans) can be implemented into the system while also reducing or at least maintaining the width of a system that would otherwise employ radial fans. According to one implementation, a dual-rotor counter-rotating (CR) fan (e.g., two axial fans in series) can be implemented as fans 506a and 506b to mitigate the problems associated with a single fan failure, which in the case of a single fan configuration could lead to a corresponding driver failure.

[0033] According to one embodiment, the air deflector 300 of the chamber assembly 500 includes a ridge, such as a proximal central ridge 302, extending vertically and positioned between the first chamber 502a and the second chamber 502b. Figure 3 ), extending longitudinally from the ridge 302 to the first distal lateral corner, such as the first lateral edge 305a ( Figure 3 The first panel, such as the first wall 304a ( Figure 3 ), and extending longitudinally from the ridge 302 to the second distal lateral corner, such as the second lateral edge 305b. Figure 3The second panel, such as the second wall 304b, is a second panel. Figure 3 ).

[0034] Data storage device testing system

[0035] As discussed, for test systems of high-density storage devices that utilize forced air convection for cooling, controlling airflow throughout the system is crucial, and such test systems typically lack independent airflow control for each storage device (generally, each "drive"). As with storage servers discussed elsewhere in this paper, accommodating a separate cooling fan for each drive to implement independent airflow control would require increased slot width, which is undesirable. Furthermore, and specifically for the context of the test system, dual-sided heating for devices used in higher-temperature testing (such as solid-state drives (SSDs)) is often not employed due to space constraints, and therefore temperature and airflow control may be less than desired.

[0036] Figure 6 This is an exploded view of the driver test unit according to one implementation scheme. In other words, Figure 6 A pair of data storage compartments or compartment assemblies are shown for housing DSDs installed in a data storage device test system. As described below and according to one embodiment, a single compartment can house a single DSD, whereby multiple compartments (two adjacent compartments depicted herein) and pairs of compartments can be assembled / installed together (along with DSD / fan arrays extending laterally and vertically, such as 3×3, 4×4, etc. configurations) into one or more racks of the system enclosure to meet specific needs. For purposes of reference and explanation and by way of example, references are made to... Figures 5A to 5B The coordinate system described by the DSD chamber component 500 also applies here.

[0037] Similar to Figure 5AThe DSD chamber 500 is depicted in the right perspective view as a drive test chamber assembly 600, which represents a first data storage device (DSD) chamber 602a extending longitudinally to accommodate a first DSD 604a (e.g., an SSD for a non-limiting example), and a second data storage device (DSD) chamber 602b extending longitudinally adjacent to the first DSD chamber 602a to accommodate a second DSD 604b (e.g., an SSD for a non-limiting example). The driver test chamber assembly 600 further includes: a lower first fan 606a positioned at the distal end of the driver test chamber assembly 600 and spanning the lateral width of the driver test chamber assembly; an upper second fan 606b positioned at the distal end of the driver test chamber assembly 600 and spanning the lateral width of the driver test chamber assembly and located vertically above the first fan 606a; and a crossflow air deflector 300 positioned between the distal ends or portions of the first DSD chamber 602a and the second DSD chamber 602b and the first fan 606a and the second fan 606b.

[0038] Similar to Figures 5A to 5B The DSD chamber 500, and according to one embodiment, the air deflector 300 is configured and positioned to guide airflow entering and from the first (left) chamber 602a and flowing along the length of the first DSD 604a into the lower first fan 606a, and to guide airflow entering and from the second (right) chamber 602b and flowing along the length of the second DSD 604b into the upper second fan 606b, thereby achieving cross-flow of air. According to one embodiment, the air deflector 300 is configured and positioned to guide the respective airflows in the aforementioned manner, while also preventing or inhibiting left-side airflow to and from the upper second fan 606b, and preventing or inhibiting right-side airflow to and from the lower first fan 606a. Similarly, the configuration of the air deflector 300 can be reversed, so that the air deflector 300 is configured and positioned to guide the airflow entering the first (left) chamber 602a and flowing along the length of the first DSD 604a into the lower first fan 606a, and to guide the airflow entering the second (right) chamber 602b and flowing along the length of the second DSD 604b into the upper second fan 606b, thereby still achieving the desired cross-flow of air and independent airflow for each drive.

[0039] According to one embodiment, the driver test chamber assembly 600 also includes a heating device 610b, such as a printed circuit board (PCB) of an embedded heater positioned between the first DSD chamber 602a and the second DSD chamber 602b. According to one embodiment, the driver test chamber assembly 600 includes a first heating device 610a (PCB of an embedded heater according to one embodiment) positioned adjacent to the first DSD chamber 602a and a second heating device 610c (PCB of an embedded heater according to one embodiment) positioned adjacent to the second DSD chamber 602b. Therefore, the surface temperature control and management of each DSD 604a, DSD 604b, including the management of heat applied from the heating device for high-temperature testing purposes, is effectively performed independently of the other by directing the corresponding airflow through the DSD chambers 602a, DSD chamber 602b to their respective individual (e.g., non-shared) temperature-controlled fans 606a, 606b by the crossflow air deflector 300. Similar to... Figures 5A to 5B The DSD chamber 500 and drive test chamber assembly 600 can be used for individualized temperature control and management (e.g., heating) according to the individual test objectives of each of the corresponding DSDs 604a and 604b. For example, individual DSDs can be tested at different temperatures in a common drive test system during testing.

[0040] Method for controlling airflow in data storage device components

[0041] Figure 7 This is a flowchart illustrating a method for controlling airflow in a data storage device assembly according to one embodiment. According to the corresponding embodiment, Figure 7 The method can be combined with reference Figures 5A to 5B And refer to Figure 6 Each of the entities described in the system shall implement it.

[0042] At frame 702, a first airflow is drawn through a first data storage device (DSD) chamber at a first lateral position, the first data storage device chamber being configured to accommodate a first DSD. For example, airflow 508a ( Figure 5B ) in room component 500 ( Figures 5A to 5B The DSD504a is aspirated, guided, pulled, or sucked through the left side of the device or along the left side of the device, and is configured to accommodate the first DSD504a. Figure 5B The first DSD chamber 502a Figure 5BAccording to one embodiment, drawing in the first airflow includes drawing in the first airflow (e.g., airflow 508a) across the outer surface of the first DSD (e.g., the first DSD 504a), such as for cooling purposes. According to one embodiment, drawing in the first airflow includes drawing in the first airflow (e.g., airflow 508a) across a first heater (e.g., a first heating device 610a) corresponding to the first DSD (e.g., the first DSD 504a), such as for heating purposes.

[0043] At frame 704, a second airflow is drawn through a second data storage device (DSD) chamber at a second lateral position adjacent to the first DSD chamber, the second data storage device chamber being configured to accommodate a second DSD. For example, airflow 508b ( Figure 5A The second DSD 504b is aspirated, guided, pulled, or sucked through the right-hand side of the chamber assembly 500 or along that right-hand side. Figure 5A The second DSD chamber 502b Figure 5A According to one embodiment, drawing in the second airflow includes drawing in the second airflow (e.g., airflow 508b) across the outer surface of the second DSD (e.g., the second DSD 504b), such as for cooling purposes. According to one embodiment, drawing in the second airflow includes drawing in the second airflow (e.g., airflow 508b) across a second heater (e.g., a second heating device 610c) corresponding to the second DSD (e.g., the first DSD 504b), such as for heating purposes.

[0044] At frame 706, the first airflow is directed from the first lateral position to the lower vertical position. For example, airflow 508a is guided by the crossflow air guide 300 ( Figures 3 to 6 The airflow is directed from the left side of the chamber assembly 500 to the lower vertical position of the first fan 506a. Figures 5A to 5B ).

[0045] At frame 708, the second airflow is directed from the second lateral position to the upper vertical position above the lower vertical position. For example, airflow 508b is directed by the crossflow air deflector 300 from the right side of the chamber assembly 500 to the upper vertical position of the second fan 506b. Figures 5A to 5B ).

[0046] Extended and alternative solutions

[0047] In the foregoing description, embodiments of the invention have been described with reference to numerous specific details, which may vary depending on the specific implementation. Therefore, various modifications and changes can be made without departing from the broad spirit and scope of the embodiments. Accordingly, the invention, and the applicant's intended sole and exclusive indicator of the invention, is the set of claims in the specific form issued by this patent application, including any subsequent amendments. Any definitions of terms expressly set forth herein that are included in these claims shall determine the meaning of those terms as used in the claims. Therefore, any limitations, elements, characteristics, features, advantages, or attributes not expressly cited in the claims shall not in any way limit the scope of these claims. Therefore, this specification and the accompanying drawings are to be considered exemplary rather than restrictive.

[0048] Furthermore, in this description, certain process steps may be shown in a specific order, and alphanumeric labels may be used to identify certain steps. Unless explicitly specified in the specification, the implementation is not necessarily limited to any particular order in which such steps are performed. Specifically, these labels are used only for the convenience of identifying the steps and are not intended to specify or require a particular order in which such steps are performed.

Claims

1. A data storage device component, namely a DSD component, the DSD component having a lateral width direction, a vertical height direction, and a proximal end and a distal end along the longitudinal length direction, the DSD component comprising: A first DSD chamber, extending along the longitudinal direction, is used to house a first data storage device; A second DSD chamber extends along the longitudinal direction and is adjacent to the first DSD chamber along the transverse direction, and is used to accommodate a second data storage device; A lower first fan is positioned at the distal end of the assembly and spans the lateral width of the assembly; An upper second fan is positioned at the distal end of the assembly and spans the lateral width of the assembly, and is located above the first fan in the vertical height direction; and A crossflow air deflector is positioned between the distal ends of the first DSD chamber and the second DSD chamber and the first fan and the second fan.

2. The DSD assembly of claim 1, wherein the crossflow air deflector is configured to direct airflow from the first DSD chamber to the lower first fan and to direct airflow from the second DSD chamber to the upper second fan.

3. The DSD assembly of claim 2, wherein the crossflow air deflector comprises: A proximal central ridge, which extends along the vertical height direction and is positioned between the first DSD chamber and the second DSD chamber; A first panel extends along the longitudinal direction from the ridge to a first distal transverse corner; and The second panel extends along the longitudinal direction from the ridge to a second distal lateral corner opposite the first distal lateral corner.

4. The DSD assembly of claim 1, wherein the crossflow air deflector comprises: A proximal central ridge, which extends along the vertical height direction and is positioned between the first DSD chamber and the second DSD chamber; A first airflow guide panel extends along the longitudinal direction from the ridge to a first distal lateral corner; and A second flow guide panel extends along the longitudinal direction from the ridge to a second distal lateral corner opposite to the first distal lateral corner.

5. The DSD component according to claim 1, further comprising: Multiple data storage devices, each housed in a corresponding first DSD room or second DSD room; Each DSD chamber has a lateral width that provides a gap between the outer panel of the DSD chamber and the corresponding data storage device.

6. The DSD assembly of claim 1 further comprises a plurality of adjacent pairs of first DSD chambers and second DSD chambers.

7. The DSD component of claim 6, wherein the DSD component is a data storage system comprising a plurality of data storage devices, each data storage device being housed in a corresponding first DSD chamber or second DSD chamber.

8. The DSD component of claim 6, wherein the DSD component is a data storage system comprising a plurality of solid-state drives (SSDs), each SSD being housed in a corresponding first DSD chamber or second DSD chamber.

9. The DSD component of claim 6, wherein the DSD component is a data storage device testing system comprising a plurality of data storage devices, each data storage device being housed in a corresponding first DSD chamber or second DSD chamber, the DSD component further comprising: A heating device positioned between the first DSD chamber and the second DSD chamber.

10. The DSD component of claim 6, wherein the DSD component is a data storage device testing system comprising a plurality of data storage devices, each data storage device being housed in a corresponding first DSD chamber or second DSD chamber, the DSD component further comprising: A first heating device positioned adjacent to the first DSD chamber; as well as A second heating device positioned adjacent to the second DSD chamber.

11. The DSD assembly of claim 1, wherein the crossflow air deflector comprises: Proximal central ridge; A first arc-shaped wall extends from the ridge to the first distal lateral edge of the crossflow air guide; and The second arc-shaped wall extends from the ridge to the second distal lateral edge of the crossflow air guide, which is opposite to the first distal lateral edge.

12. The DSD assembly of claim 11, wherein the crossflow air deflector further comprises: A closed cover, wherein the ridge and the first arcuate wall are connected to the closed cover; and A closed base, wherein the ridge and the second arcuate wall are connected to the closed base.

13. The DSD assembly of claim 11, wherein the first arcuate wall and the second arcuate wall are configured to guide airflow from a first lateral position to a lower vertical position and to guide airflow from a second lateral position to an upper vertical position.

14. A crossflow air deflector for guiding airflow, the crossflow air deflector comprising: Proximal central ridge; A first arc-shaped wall extends from the ridge to the first distal lateral edge of the crossflow air guide; and The second arc-shaped wall extends from the ridge to the second distal lateral edge of the crossflow air guide, which is opposite to the first distal lateral edge.

15. The crossflow air deflector according to claim 14, further comprising: A closed cover, wherein the ridge and the first arcuate wall are connected to the closed cover; and A closed base, wherein the ridge and the second arcuate wall are connected to the closed base.

16. The crossflow air guide of claim 14, wherein the first arcuate wall and the second arcuate wall are configured to guide airflow from a first lateral position to a lower vertical position and to guide airflow from a second lateral position to an upper vertical position.

17. A data storage device chamber assembly, namely a DSD chamber assembly, the DSD chamber assembly comprising the crossflow air deflector according to claim 14.

18. A data storage system comprising the DSD chamber component according to claim 17.

19. A data storage device testing system, the data storage device testing system comprising the DSD chamber component according to claim 17.

20. A method for controlling airflow in a data storage device component, i.e., a DSD component, the method comprising: A first airflow is drawn through a first DSD chamber at a first lateral position, the first DSD chamber being configured to accommodate a first data storage device; A second airflow is drawn through a second DSD chamber at a second lateral position adjacent to the first DSD chamber, the second DSD chamber being configured to accommodate a second data storage device; The first airflow is guided from the first lateral position to the lower vertical position; and The second airflow is directed from the second lateral position to the upper vertical position above the lower vertical position.

21. The method of claim 20, wherein: Drawing the first airflow through the first DSD chamber includes drawing the first airflow across the outer surface of the first data storage device; and Drawing the second airflow through the second DSD chamber includes drawing the second airflow across the outer surface of the second data storage device.

22. The method of claim 20, wherein: Drawing the first airflow through the first DSD chamber includes drawing the first airflow across a first heater corresponding to the first data storage device; and Drawing the second airflow through the second DSD chamber includes drawing the second airflow across a second heater corresponding to the second data storage device.

23. The method of claim 20, wherein: Drawing the first airflow through the first DSD chamber includes drawing the first airflow across the outer surface of the first data storage device and across a first heater corresponding to the first data storage device; and Drawing the second airflow through the second DSD chamber includes drawing the second airflow across the outer surface of the second data storage device and across the second heater corresponding to the second data storage device.

24. A method for controlling airflow in a data storage device assembly, i.e., a DSD assembly, the DSD assembly having a lateral width direction, a vertical height direction, and a proximal end and a distal end along a longitudinal length direction, the method comprising: A first airflow is drawn through a first DSD chamber at a first lateral position, the first DSD chamber being configured to accommodate a first data storage device; A second airflow is drawn through a second DSD chamber at a second lateral position adjacent to the first DSD chamber, the second DSD chamber being configured to accommodate a second data storage device; The first airflow is directed from the first lateral position to the lower fan located at the distal end and spanning the lateral width; as well as The second airflow is directed from the second lateral position to an upper fan positioned above the lower fan at the distal end and spanning the lateral width; and The first airflow and the second airflow are directed via a crossflow air deflector located at the distal ends of the first DSD chamber and the second DSD chamber between the lower fan and the upper fan.

25. The method of claim 24, wherein: Drawing the first airflow through the first DSD chamber includes drawing the first airflow across the outer surface of the first data storage device; and Drawing the second airflow through the second DSD chamber includes drawing the second airflow across the outer surface of the second data storage device.

26. The method of claim 24, wherein: Drawing the first airflow through the first DSD chamber includes drawing the first airflow across a first heater corresponding to the first data storage device; and Drawing the second airflow through the second DSD chamber includes drawing the second airflow across a second heater corresponding to the second data storage device.

27. The method of claim 24, wherein: Drawing the first airflow through the first DSD chamber includes drawing the first airflow across the outer surface of the first data storage device and across a first heater corresponding to the first data storage device; and Drawing the second airflow through the second DSD chamber includes drawing the second airflow across the outer surface of the second data storage device and across the second heater corresponding to the second data storage device.

28. The method of claim 24, wherein the crossflow air deflector comprises: Proximal central ridge; A first arc-shaped wall extends from the ridge to the first distal lateral edge of the crossflow air guide; and The second arc-shaped wall extends from the ridge to the second distal lateral edge of the crossflow air guide, which is opposite to the first distal lateral edge.

29. The method of claim 28, wherein the crossflow air deflector further comprises: A closed cover, wherein the ridge and the first arcuate wall are connected to the closed cover; and A closed base, wherein the ridge and the second arcuate wall are connected to the closed base.

30. The method of claim 28, wherein the first arcuate wall and the second arcuate wall are configured to guide airflow from a first lateral position to a lower vertical position and to guide airflow from a second lateral position to an upper vertical position.

31. A crossflow air deflector for guiding airflow, the crossflow air deflector comprising: A proximal central ridge that extends in the vertical direction; A first panel extends from the ridge to a first distal vertical edge in both the longitudinal and transverse directions; and The second panel extends from the ridge in the longitudinal and transverse directions to a second distal vertical edge that is vertically opposite the first distal vertical edge in the transverse plane.

32. The crossflow air guide according to claim 31, further comprising: A closed cover, wherein the ridge and the first panel are connected to the closed cover; and A closed base is provided, and the ridge and the second panel are connected to the closed base.

33. The crossflow air deflector of claim 31, wherein the first panel and the second panel are configured to guide airflow from a first lateral position to a lower vertical position and to guide airflow from a second lateral position to an upper vertical position.

34. The crossflow air deflector of claim 31, wherein at least one of the first panel and the second panel is configured as a non-planar structure.

35. A data storage device chamber assembly, namely a DSD chamber assembly, the DSD chamber assembly comprising the crossflow air deflector according to claim 31.

36. A data storage system comprising the DSD chamber component according to claim 35.

37. A data storage device testing system, the data storage device testing system comprising the DSD chamber component according to claim 35.

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