Substrate processing apparatus

Abstract

The present application relates to a substrate processing apparatus. A developing apparatus is provided with a housing, an airflow forming portion, and a substrate holding device. The airflow forming portion forms a clean descending airflow in an internal space of the housing. The developing apparatus is also provided with a plurality of nozzles and a partitioning mechanism. The plurality of nozzles supply a processing liquid to a substrate held by the substrate holding device. The partitioning mechanism, in a state in which the substrate is held by the substrate holding device, divides the internal space of the housing into a processing space and a non-processing space. The processing space is a space that contains the substrate held by the substrate holding device. The partitioning mechanism includes a cup that catches the processing liquid scattered from the substrate, a partitioning plate that has a nozzle opening and a plurality of through-holes and is disposed above the cup, and a cover member that covers the nozzle opening.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus for treating a substrate using a processing solution. Background Technology

[0002] In the past, substrate processing apparatuses were used to perform specific processing with processing solutions on various substrates such as FPD (Flat Panel Display) substrates, semiconductor substrates, optical disc substrates, magnetic disc substrates, magneto-optical disc substrates, photomask substrates, ceramic substrates, or solar cell substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices.

[0003] As such a substrate processing apparatus, there is a developing apparatus that uses a developing solution to develop photosensitive films. When the developing solution has a strong odor, the comfort of the working environment around the developing apparatus decreases when the atmosphere containing the developing solution leaks to the outside of the developing apparatus. To suppress this decrease in working environment comfort, a configuration for suppressing leakage of the atmosphere containing the developing solution is proposed (for example, see Japanese Patent Application Publication No. 2021-86994).

[0004] The developing apparatus disclosed in Japanese Patent Application Publication No. 2021-86994 comprises a substrate holding part, a nozzle, a nozzle cover, a receiving container, and a cup, all housed within a housing. The substrate holding part is configured to hold the substrate in a horizontal position. The nozzle is positioned above the substrate holding part and is configured to supply developing solution to the substrate held by the substrate holding part. The nozzle cover has a cylindrical shape and is arranged such that it surrounds the nozzle when viewed from above and overlaps at least a portion of the nozzle when viewed from the side.

[0005] The receiving container is positioned below the nozzle cover, away from the nozzle cover, and houses the lower part of the substrate holding section. Furthermore, the receiving container has an exhaust section to expel air from the housing to the outside. The cup has a cylindrical shape surrounding the substrate holding section when viewed from above and is vertically movable.

[0006] During substrate development, the cup is held so that it overlaps with the lower end of the nozzle shroud and the upper end of the receiving container when viewed from the side. This creates a processing space within the housing, surrounded by the nozzle shroud, the cup, and the receiving container, and also creates a non-processing space surrounding the processing space. In this state, a downward airflow is generated within the housing. Summary of the Invention

[0007] [The problem the invention aims to solve]

[0008] In the developing apparatus disclosed in Japanese Patent Application Publication No. 2021-86994 with the aforementioned configuration, by making the pressure inside the processing space lower than the pressure inside the non-processing space, leakage of the atmosphere containing the developing solution through the non-processing space to the outside of the housing can be suppressed. However, in the developing apparatus described in Japanese Patent Application Publication No. 2021-86994, it is practically difficult to make the pressure in the processing space lower than the pressure in the non-processing space to a level that prevents the atmosphere inside the processing space from leaking into the non-processing space.

[0009] The purpose of this invention is to provide a substrate processing apparatus that can suppress the reduction of comfort in the working environment around the substrate processing apparatus.

[0010] [Technical means to solve the problem]

[0011] (1) A substrate processing apparatus according to one aspect of the present invention comprises: a chamber having an internal space; an airflow forming section for supplying gas into the chamber to form a downflow; a substrate holding section for holding a substrate in the chamber; a nozzle for supplying processing liquid to the substrate from a processing position above the substrate held by the substrate holding section; and a dividing mechanism for dividing the internal space of the chamber into a processing space including the substrate held by the substrate holding section and a non-processing space surrounding at least a portion of the processing space when the substrate is held by the substrate holding section, and the dividing mechanism comprises: a processing cup that surrounds the substrate held by the substrate holding section in a top view and is arranged to overlap the substrate held by the substrate holding section in a side view to form a processing space; a dividing plate that is disposed above the processing cup and has a through hole for guiding a portion of the downflow to the processing space and a nozzle opening that overlaps the processing position in a top view; and a cover member configured to allow the supply of processing liquid from the nozzle to the substrate and cover the nozzle opening when the substrate is held by the substrate holding section and the nozzle is in the processing position.

[0012] In the substrate processing apparatus, with the substrate held by the substrate holding unit, the internal space of the chamber is divided into a processing space and a non-processing space by a processing cup and a dividing plate. A portion of the descending airflow is guided into the processing space through multiple through holes in the dividing plate. In this case, the amount of gas supplied to the processing space is less than the amount of gas supplied to the non-processing space. As a result, the pressure in the processing space is lower than the pressure in the non-processing space.

[0013] If the pressure in the processing space is lower than that in the non-processing space, the atmosphere in the processing space is less likely to enter the non-processing space. Therefore, even if an odor originating from the processing liquid is generated in the processing space, the odor is less likely to leak to the outside of the chamber.

[0014] Furthermore, in this configuration, nozzle openings are formed on the dividing plate. According to this configuration, when the nozzle is in the processing position, the nozzle and the cover member do not interfere with each other. Moreover, when the nozzle is in the processing position, the nozzle openings formed on the dividing plate are covered by the cover member. Therefore, when supplying processing liquid from the nozzle to the substrate, leakage of atmosphere from the processing space into the non-processing space is reduced.

[0015] As a result, these measures can suppress the reduction in comfort of the working environment around the substrate processing device.

[0016] (2) The substrate processing apparatus may also include a nozzle driving unit that moves the nozzle between a processing position and a standby position on the side of the substrate held by the substrate holding unit. In this case, the nozzle can be held in the standby position when the substrate is not being processed. Thus, virtual dispensing and other processing can be performed while the nozzle is in the standby position. Therefore, unwanted processing liquid is prevented from falling from the nozzle in the processing position, and the tip of the nozzle in the processing position is prevented from drying out, thus suppressing the occurrence of substrate processing defects.

[0017] (3) The substrate processing apparatus may also include a support body that supports the nozzle and the cover component. The nozzle drive unit moves the nozzle and the cover component by moving or rotating the support body. In this case, when the nozzle moves between the standby position and the processing position, the nozzle and the cover component move together. Therefore, interference between the nozzle and the cover component can be prevented.

[0018] (4) The substrate processing apparatus may also include an exhaust section that discharges the atmosphere of the processing space to the outside of the chamber. In this case, by discharging the atmosphere of the processing space, the pressure of the processing space can be easily reduced to a lower pressure than that of the non-processing space.

[0019] (5) The dividing plate has a first wall portion extending upward from the inner edge of the nozzle opening, and the cover member has a cover body portion larger than the nozzle opening when viewed from above, and a second wall portion extending downward from the outer edge of the cover body portion. When the nozzle opening is covered by the cover member, the second wall portion can also surround at least a portion of the first wall portion when viewed from above, and is maintained in a manner that overlaps with at least a portion of the first wall portion and does not contact the dividing plate when viewed from the side.

[0020] In this configuration, because the cover member does not contact the dividing plate when the nozzle opening is covered, particles generated due to contact between multiple components are suppressed. Furthermore, according to this configuration, when the nozzle opening is covered by the cover member, a gap space formed between the space inside the first wall of the dividing plate and the space to the side of the second wall of the cover member, sandwiched between the first and second walls, is created. Therefore, compared to the case where the first and second walls are absent, the amount of air from the processing space flowing out into the non-processing space through the nozzle opening is reduced.

[0021] (6) The dividing mechanism also includes a cylindrical component, which is formed in a way that surrounds the dividing plate from a top view, extends downward from the outer edge of the dividing plate and surrounds the upper part of the processing cup from a top view. The processing cup is configured to be able to move up and down in a way that changes to a first state in which the upper part of the processing cup is away from the cylindrical component from a side view and a second state in which the upper part of the processing cup overlaps with the cylindrical component from a side view.

[0022] In this configuration, with the substrate held by the substrate holding member, the processing cup enters a second state. Here, the processing cup, the dividing plate, and the cylindrical member divide the processing space surrounding the substrate from the non-processing space. At this time, a gap space is formed between the processing space and the non-processing space, held by the cylindrical member and the upper part of the processing cup. Therefore, compared to the case without the cylindrical member, the amount of air flowing from between the processing cup and the dividing plate into the non-processing space is reduced. Furthermore, according to this configuration, by setting the processing cup to the first state, the substrate can be transferred to the substrate holding member.

[0023] (7) The substrate holding part is configured such that when the processing liquid is supplied to the substrate from the nozzle, the substrate being held can be rotated in a horizontal position. The dividing plate has a circular plate shape that is larger than the substrate held by the substrate holding part. When the dividing plate defines a central region with a circular shape that includes the center of the dividing plate and has a radius when viewed from above, and an outer peripheral region with an annular shape that includes the outer peripheral end of the dividing plate and has a width equal to a radius in the radial direction of the dividing plate, a plurality of through holes are dispersedly formed on the dividing plate. The number of through holes formed on the outer peripheral region of the dividing plate may be greater than the number of through holes formed on the central region of the dividing plate.

[0024] In this configuration, within the processing space, the amount of downward airflow directed to the vicinity of the inner circumferential surface of the processing cup can be increased relative to the amount of downward airflow directed to the central portion of the substrate. This suppresses the generation of upward airflow near the inner circumferential surface of the processing cup when the substrate rotates. Consequently, within the processing space, upward dispersion of the processing liquid supplied to the substrate near the outer circumferential end of the substrate is prevented.

[0025] (8) The substrate holding part is configured such that when the processing liquid is supplied from the nozzle to the substrate, the substrate being held can be rotated in a horizontal position. The dividing plate has a circular shape larger than that of the substrate held by the substrate holding part. The nozzle opening of the dividing plate faces the central portion of the substrate held by the substrate holding part. When the dividing plate defines an imaginary circle that is referenced to the center of the dividing plate and surrounds the nozzle opening when viewed from above, a portion of the multiple through holes can be distributed in a way that leaves a fixed or large fixed interval throughout the imaginary circle.

[0026] In this configuration, within the processing space, the amount of downward airflow directed to the vicinity of the inner circumferential surface of the processing cup is increased relative to the amount of downward airflow directed to the central portion of the substrate opposite the nozzle opening of the dividing plate. This suppresses the generation of upward airflow near the inner circumferential surface of the processing cup when the substrate rotates. Consequently, within the processing space, upward dispersion of the processing liquid supplied to the substrate near the outer circumferential end of the substrate is prevented.

[0027] (9) The nozzle may also include a dual-fluid nozzle that sprays a mixture of droplets containing gas and processing liquid onto the substrate held by the substrate holder. In this case, processing can be performed on the substrate using the mixture of gas and liquid.

[0028] (10) The processing liquid supplied from the nozzle to the substrate may also contain an organic solvent. In this case, the substrate can be processed using a processing liquid containing an organic solvent. Attached Figure Description

[0029] Figure 1 This is a schematic perspective view illustrating the general configuration of a developing apparatus according to one embodiment of the present invention.

[0030] Figure 2 It is used for explanation Figure 1 An exploded perspective view of a portion of the liquid processing unit.

[0031] Figure 3 It is used for explanation Figure 2 A schematic top view of the composition of a portion of the liquid handling unit.

[0032] Figure 4 It is used for explanation Figure 2 A schematic longitudinal sectional view of a portion of the liquid processing unit.

[0033] Figure 5 yes Figure 2 A three-dimensional view of the nozzle arm unit.

[0034] Figure 6 This is a longitudinal sectional view of a specific vertical cutting nozzle arm unit.

[0035] Figure 7 yes Figure 2 A three-dimensional view of the dividing plate and cylindrical components.

[0036] Figure 8 yes Figure 2 Top view of the dividing plate and cylindrical components.

[0037] Figure 9 This is a diagram illustrating the movement of a nozzle arm unit as multiple nozzles move between a standby position and a processing position.

[0038] Figure 10 This is a diagram illustrating the movement of a nozzle arm unit as multiple nozzles move between a standby position and a processing position.

[0039] Figure 11 This is a diagram illustrating the movement of a nozzle arm unit as multiple nozzles move between a standby position and a processing position.

[0040] Figure 12 This is a diagram illustrating the movement of a nozzle arm unit as multiple nozzles move between a standby position and a processing position.

[0041] Figure 13 This is a schematic longitudinal sectional view of the developing apparatus when the cup of the liquid processing unit is in state 1.

[0042] Figure 14 This is a schematic longitudinal sectional view of the developing apparatus when the cup of the liquid processing unit is in state 2.

[0043] Figure 15 This is a schematic longitudinal sectional view of the developing apparatus used in the development process of the substrate.

[0044] Figure 16 This is a top view showing an example of a state where the nozzle opening of the dividing plate is covered by a cover component.

[0045] Figure 17 yes Figure 16 A longitudinal sectional view of the dividing plate, cylinder component, and nozzle arm unit at the KK line.

[0046] Figure 18 It means Figure 1 A block diagram showing the configuration of the control unit of the developing apparatus.

[0047] Figure 19 This is a flowchart illustrating the basic operations of the developing apparatus during the development process of the substrate. Detailed Implementation

[0048] Hereinafter, the substrate processing apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, substrate means substrate for FPD (Flat Panel Display), semiconductor substrate, optical disk substrate, magnetic disk substrate, magneto-optical disk substrate, photomask substrate, ceramic substrate, or solar cell substrate, etc., used in liquid crystal display devices or organic EL (Electro Luminescence) display devices.

[0049] As an example of a substrate processing apparatus, a developing apparatus will be described. In this embodiment, the substrate to be developed has a front side and a back side. Furthermore, in the developing apparatus of this embodiment, with the front side of the substrate facing upwards and the back side of the substrate facing downwards, the back side (lower surface) of the substrate is held while the front side (upper surface) of the substrate is developed.

[0050] An exposed photosensitive film is formed at least in the central portion of the front side of a substrate. The photosensitive film is, for example, a negative photosensitive polyimide film. An organic solvent containing cyclohexanone or cyclopentanone can be used as the developing solution to dissolve the exposed negative photosensitive polyimide film. Furthermore, an organic solvent containing isopropanol or propylene glycol monomethyl ether acetate (PGMEA) can be used as the cleaning solution.

[0051] In addition, in this embodiment, "development treatment of the substrate" means dissolving a portion of the photosensitive film by supplying a developer to the exposed photosensitive film formed on the front side of the substrate.

[0052] <1> Composition of the developing apparatus

[0053] Figure 1 This is a schematic perspective view illustrating the general configuration of a developing apparatus according to one embodiment of the present invention. Figure 1 As shown, the developing apparatus 1 basically has a configuration in which two liquid processing units, LPA and LPB, are housed within a housing CA. Figure 1 In the diagram, the approximate shapes of the two liquid processing units LPA and LPB are represented by dashed lines. The details of the structure of the liquid processing units LPA and LPB will be described later.

[0054] The housing CA has a generally cuboid box shape extending in one direction within a horizontal plane. Specifically, the housing CA is formed by mounting a first side wall plate 1w, a second side wall plate 2w, a third side wall plate 3w, a fourth side wall plate 4w, a bottom plate 5w, and a top plate 6w onto a frame (not shown). In the following description, the direction parallel to the direction in which the housing CA extends in the horizontal plane will be appropriately referred to as the first direction D1, and the direction orthogonal to the first direction D1 in the horizontal plane will be appropriately referred to as the second direction D2. Two liquid handling units, LPA and LPB, are arranged on the bottom plate 5w within the housing CA in the first direction.

[0055] The first and second sidewall panels 1w and 2w have rectangular plate shapes and are arranged in a manner that is parallel to each other in the vertical direction and the first direction D1. The third and fourth sidewall panels 3w and 4w have rectangular plate shapes and are arranged in a manner that is parallel to each other in the vertical direction and the second direction D2.

[0056] On the second sidewall 2w, two inlet / outlet ports ph are formed for transferring the substrate between the inside and outside of the housing CA. The two inlet / outlet ports ph are respectively formed in two portions of the second sidewall 2w in the second direction D2, opposite to the liquid processing units LPA and LPB. Two openings op1 are formed in the top plate 6w arranged in the first direction D1. The opening ratio of the two openings op1 in the top plate 6w is set sufficiently large to be the same as the state where the entire upper end of the housing CA is open upwards.

[0057] Two filters FL are installed above the top plate 6w, respectively, by closing the two openings op1 of the top plate 6w. Alternatively, the two filters FL can be installed directly below the top plate 6w. Figure 1 In the diagram, the two filters FL are indicated by thick dashed lines. These two filters FL are, for example, ULPA (Ultra Low Penetration Air) filters, mounted on a frame or top plate 6w (not shown) that constitutes the housing CA. Air guides AG are arranged on the top plate 6w of the housing CA, surrounding the two filters FL. Figure 1 In the middle, the air guide AG is represented by a double-dotted line.

[0058] A gas supply unit 10 is provided on the exterior of the housing CA. The gas supply unit 10, for example, is an air control unit that adjusts the air conditions, such as temperature and humidity, to meet preset conditions during the power-on period of the developing apparatus 1. Furthermore, the gas supply unit 10 supplies the adjusted air to the air guide AG through the pipe DU. In this case, the air guide AG guides the air supplied from the gas supply unit 10 through two filters FL to the two openings op1 of the top plate 6w. Thus, clean air with adjusted temperature and humidity is supplied into the housing CA, generating a downward airflow throughout the internal space SP of the housing CA.

[0059] Two fluid supply units 11 are also provided on the outside of the housing CA. Each fluid supply unit 11 includes a developer supply source, a cleaning fluid supply source, a gas supply source, and various fluid-related machines, and supplies the developer, cleaning fluid, and gas to the liquid processing units LPA and LPB through the fluid supply path 12. Figure 1 In the diagram, the fluid supply path 12 is represented by a single-dotted line. Furthermore, in this embodiment, the fluid supply path 12 is composed of one or more pipes and valves, etc.

[0060] The developing apparatus 1 also includes a control unit 90. The control unit 90 includes, for example, a CPU (Central Processing Unit) and memory, or a microcomputer, to control the liquid processing units LPA and LPB and the two fluid supply units 11. Details of the control unit 90 will be described later.

[0061] <2> Composition of the liquid handling unit

[0062] (1) Overview of the composition of liquid handling units LPA and LPB

[0063] Figure 1 The two liquid processing units, LPA and LPB, have essentially the same configuration, except that some of their constituent elements are arranged symmetrically with respect to a plane (vertical plane) orthogonal to the first direction D1. The configuration of the liquid processing unit LPA will be described below, using LPA and LPB as examples. Figure 2 It is used for explanation Figure 1 An exploded perspective view of a portion of the components of a liquid handling unit (LPA). Figure 3 It is used for explanation Figure 2 A schematic top view of a portion of the liquid handling unit (LPA). Figure 4 It is used for explanation Figure 2 A schematic longitudinal sectional view of a portion of the liquid handling unit (LPA). Figures 2-4 In the diagram, the substrate W, representing the object being processed, is indicated by a dashed line.

[0064] like Figure 2As shown, the liquid processing unit LPA includes a dividing plate 100, a cylindrical component 200, a nozzle arm unit 300, a nozzle drive unit 400, and a standby compartment 500. Furthermore, the liquid processing unit LPA also includes a cup 40, a lifting drive unit 49, a receiving container 50, an exhaust pipe 61, a drain pipe 62, a substrate holding device 70, and a suction device 78. Figure 2 In order to facilitate understanding of the construction of multiple components, some of the components of the Liquid Processing Unit (LPA) are represented in a state of separation from the other components. Specifically, Figure 2 The above and below separated state indicates that it includes a portion of the components of the dividing plate 100, the cylindrical component 200, the nozzle arm unit 300, the nozzle drive unit 400, and the standby box 500, as well as other components including the cup 40, the receiving container 50, and the substrate holding device 70. Figure 3 and Figure 4 The diagram shows schematic top views and schematic longitudinal sectional views of the cup 40, receiving container 50, and substrate holding device 70, which are part of the liquid handling unit LPA. Additionally, in... Figure 2 In the described dividing plate 100, the multiple through holes H (described later) are omitted. Figure 8 The illustration is shown.

[0065] (2) Cup 40 and receiving container 50

[0066] exist Figure 1 Inside the shell CA, the receiving container 50 is fixed to the base plate 5w. Figure 1 (above) For example Figure 2 As shown, the receiving container 50 includes a side wall portion 51 and a bottom portion 52. The side wall portion 51 has a horizontal cross-section in the shape of an annular shape and is formed in a vertical direction with a fixed inner diameter and a fixed outer diameter. The bottom portion 52 is formed to close the lower end of the side wall portion 51.

[0067] Two through holes are formed at the bottom 52. One of the through holes at the bottom 52 is connected to an exhaust pipe 61. The exhaust pipe 61 guides the atmosphere inside the housing CA to an exhaust device (not shown) located outside the housing CA. In the container 50, the end (open end) of the exhaust pipe 61 is located above the bottom 52.

[0068] Furthermore, at the bottom 52, a drain pipe 62 is connected to another through-hole. During the development process of the substrate W, the drain pipe 62 guides the liquid (developer and cleaning solution) flowing from the cup 40 to the bottom of the receiving container 50 to a drain device (not shown) located outside the housing CA, as described later. In the container 50, the end (open end) of the drain pipe 62 is located below the end of the exhaust pipe 61.

[0069] The substrate holding device 70 is housed within the receiving container 50, including at least its lower portion. Specifically, the substrate holding device 70 includes an adsorption holding portion 71, a rotary motor 72, and a motor cover 79. Figure 4 ).exist Figure 2 and Figure 3 The illustration of the motor cover 79 is omitted. (See image below.) Figure 3 As shown, the rotary motor 72 is fixed to the bottom 52 in a top view, positioned at the center of the receiving container 50. Figure 4 As shown, a rotating shaft 73 is provided on the rotating motor 72, extending upwards. An adsorption holding part 71 is provided at the upper end of the rotating shaft 73. The adsorption holding part 71 protrudes above the upper end of the receiving container 50.

[0070] like Figure 2 As shown, an attraction device 78 is provided on the outside of the receiving container 50. The adsorption and holding part 71 is configured to adsorb the center portion of the back side of the substrate W when the attraction device 78 is activated. By adsorbing the center portion of the back side of the substrate W by the adsorption and holding part 71, the substrate W is held in a horizontal position above the receiving container 50. Furthermore, while the substrate W is adsorbed and held by the adsorption and holding part 71, the rotary motor 72 is activated, and the substrate W rotates in a horizontal position.

[0071] like Figure 4 As shown, the motor cover 79 has a generally bowl-shaped design and is fixed to the receiving container 50 with its open, large-diameter portion facing downwards. A through hole is formed at the center of the upper end of the motor cover 79, through which a rotating shaft 73 can be inserted. With the rotating shaft 73 inserted into the through hole at the center of the upper end of the motor cover 79, the motor cover 79 covers from above the upper end portion of the rotary motor 72 (with the rotating shaft 73 removed) and the space of a fixed width surrounding the rotary motor 72 in the horizontal plane. A gap of a fixed width is formed between the outer peripheral end of the motor cover 79 and the inner peripheral surface of the side wall portion 51.

[0072] Here, the end of the exhaust pipe 61 is located below the motor cover 79. This prevents liquids (developer and cleaning solution) falling from above the receiving container 50 from entering the interior of the exhaust pipe 61 during the development process of the substrate W.

[0073] like Figure 2 As shown, the receiving container 50 houses at least the lower end of the cup 40, in addition to the lower part of the substrate holding device 70. Here, the cup 40 is configured to move vertically within the receiving container 50. Furthermore, the cup 40 includes a cylindrical wall portion 41 and a liquid receiving portion 42. The cylindrical wall portion 41 and the liquid receiving portion 42 each have a horizontally cross-section in an annular shape and are arranged to extend at least in the vertical direction. Figure 3 As shown, the cup 40 is configured to surround the substrate holding device 70 when viewed from above.

[0074] like Figure 4 As shown, the outer and inner diameters of the liquid receiving portion 42 gradually increase from the upper end of the liquid receiving portion 42 downwards. The outer diameter of the lower end of the liquid receiving portion 42 (the maximum outer diameter of the liquid receiving portion 42) is smaller than the inner diameter of the side wall portion 51 of the receiving container 50. Therefore, a gap of a fixed width is formed between the outer peripheral end of the liquid receiving portion 42 and the inner peripheral surface of the side wall portion 51. The cylindrical wall portion 41 is formed to extend upwards from the upper end of the liquid receiving portion 42 with a fixed inner diameter and a fixed outer diameter.

[0075] like Figure 2 As shown, in Figure 1 Inside the housing CA, a lifting drive unit 49 is provided near the receiving container 50. The lifting drive unit 49 includes a drive mechanism such as an electric motor or a cylinder, which supports the cup 40 and moves the cup 40 up and down, causing the cup 40 to change between a first state and a second state. The first state and the second state of the cup 40 will be described later.

[0076] (3) Nozzle drive unit 400 and standby housing 500

[0077] exist Figure 1 Within the housing CA, the nozzle drive unit 400 is arranged adjacent to the receiving container 50 in the first direction D1. The nozzle drive unit 400 includes a motor with a rotation shaft 401 and an actuator. The actuator includes a cylinder, hydraulic cylinder, or motor, etc., and the motor is supported on the base plate 5w in a manner that allows the motor with the rotation shaft 401 to move in the vertical direction. Figure 1 The rotating shaft 401 is located at the upper end of the nozzle drive unit 400.

[0078] exist Figure 1 Inside the casing CA, at the bottom plate 5w ( Figure 1 A standby compartment 500 is also provided on the container 50. The nozzle drive unit 400 and the standby compartment 500 are arranged at intervals on the side of the receiving container 50 in the second direction D2. The standby compartment 500 has a box shape extending a fixed length in the second direction D2. A plurality of standby holes 510 are formed on the upper surface of the standby compartment 500. Figure 10 The standby port 510 is used to accommodate a plurality of nozzles 310 (described later). Figure 6 The injection section 310c ( Figure 6 ).

[0079] The standby housing 500 is connected to multiple nozzles 310 ( Figure 6 During standby, multiple nozzles 310 ( Figure 6 A drain pipe (not shown) discharges sprayed or dripping liquid to the outside of the housing CA. Additionally, an exhaust pipe (not shown) is connected to the standby compartment 500 to discharge the atmosphere inside the standby compartment 500 to the outside of the housing CA.

[0080] (4) Nozzle arm unit 300

[0081] A nozzle arm unit 300 is mounted on the upper end of the rotation shaft 401. The nozzle arm unit 300 has an elongated shape that extends linearly in a direction different from the rotation shaft 401 when mounted on the upper end of the rotation shaft 401. The nozzle arm unit 300 is mainly composed of multiple (six in this example) nozzles 310, a support body 320, and a cover component 330.

[0082] Figure 5 yes Figure 2 A perspective view of the nozzle arm unit 300. Figure 6 It is a longitudinal sectional view of the nozzle arm unit 300 cut off from a specific vertical plane (a vertical plane parallel to the direction in which the nozzle arm unit 300 extends). Figure 5 In order to facilitate understanding of the internal structure of the nozzle arm unit 300, the state in which the cover component 330 is separated from other components is shown.

[0083] The support body 320 is manufactured, for example, by appropriately bending a metal plate that has been sheared or laser-processed into a specific shape. Alternatively, it is manufactured by connecting multiple metal plates processed into a specific shape by means of screwing or welding. Furthermore, the support body 320 is formed extending in one direction, having one end 321 and another end 322. Additionally, the support body 320 has three nozzle fixing portions 323 arranged with gaps from the vicinity of one end 321 toward the other end 322. Two nozzles 310 are mounted in each of the three nozzle fixing portions 323. Furthermore, the support body 320 has a pipe fixing portion 324 and two cover mounting portions 325. The pipe fixing portion 324 is located near the other end 322. The pipe fixing portion 324 and the cover mounting portion 325 will be described later.

[0084] One of the two nozzles 310 provided in each nozzle fixing portion 323 is used to supply developer to the substrate W. Furthermore, the other of the two nozzles 310 provided in each nozzle fixing portion 323 is used to supply cleaning solution to the substrate W. In addition, each of all nozzles 310 in this embodiment is a soft-spray type dual-fluid nozzle capable of spraying a mixture of liquid and gas. Therefore, each nozzle 310 has two fluid inlet portions 310a and 310b for introducing liquid and gas into the nozzle 310, and a spray portion 310c for spraying the mixed fluid.

[0085] Each nozzle 310 is fixed to the support 320 with its spray portion 310c facing downwards. In this state, a fluid inlet portion 310a for introducing liquid into the nozzle 310 is provided at the upper end of each nozzle 310. In addition, a fluid inlet portion 310b for introducing gas into the nozzle 310 is provided on the side of each nozzle 310.

[0086] Each nozzle 310 has a fluid inlet 310a connected to one end of a pipe 311 for supplying liquid (in this example, developer or cleaning solution) to the nozzle 310. Furthermore, each nozzle 310 has a fluid inlet 310a connected to one end of a pipe 312 for supplying gas (in this example, nitrogen) to the nozzle 310. Pipes 311 and 312 are formed of a flexible resin material. Examples of such resin materials include PTFE (polytetrafluoroethylene), PVC (polyvinyl chloride), PPS (polyphenylene sulfide), and PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer).

[0087] The other end 322 of the support body 320 is mounted on the upper end of the rotation shaft 401 of the nozzle drive unit 400. In this state, a horizontal and flat support surface SS is formed approximately at the center of the support body 320 along its length. A portion of each of the plurality of pipes 311, 312 is arranged on the support surface SS such that it extends from the nozzle 310 connected to the pipe toward the pipe fixing part 324.

[0088] The pipe fixing part 324 is formed by a portion of the support surface SS. Multiple pipes 311 and 312 are bundled within the pipe fixing part 324. In this state, a pipe fixing piece 329 with an inverted U-shape is screwed onto the support surface SS constituting the pipe fixing part 324. Thus, the multiple pipes 311 and 312 are fixed near the other end 322 of the support body 320. The portions of the multiple pipes 311 and 312 extending from the pipe fixing part 324 towards the outside of the support body 320 are received in a bundled state inside a cylindrical bundling member 391. The cylindrical bundling member 391 is formed, for example, of rubber or resin, and is flexible.

[0089] The cover component 330 has a box shape with an open bottom. Specifically, in this example, the cover component 330 is composed of an upper surface portion 331, one end portion 332, another end portion 333, one side portion 334, and another side portion 335. The upper surface portion 331 has a nozzle opening 110 that is larger than the dividing plate 100 described later when viewed from above. Figure 7It has a large rectangular shape. One end face 332, another end face 333, one side face 334, and another side face 335 extend downward from the four sides of the outer edge of the upper surface 331. One end face 332 and the other end face 333 face each other, and one side face 334 and the other side face 335 face each other. A notch 333N is formed on the other end face 333.

[0090] As described above, the support body 320 has two cover mounting portions 325. The two cover mounting portions 325 are located at the upper end of the support body 320. Screw holes are formed in each cover mounting portion 325. In the upper surface portion 331 of the cover member 330, through holes 331h are formed in two portions of the support body 320 corresponding to the two cover mounting portions 325.

[0091] With multiple nozzles 310 installed on the support body 320, and multiple pipes 311 and 312 connected and fixed to the multiple nozzles 310, the cover component 330 is installed on the support body 320. Specifically, the two through holes 331h of the cover component 330 are positioned on the two cover mounting portions 325 of the support body 320, and the cover component 330 is screwed to the support body 320.

[0092] Thus, the cover member 330 covers the portion of the support body 320 from one end 321 to near the other end 322 from above and from the side. On the other hand, the remaining portion of the support body 320 is led out through a notch 333N formed on the other end face 333 of the cover member 330. In this way, a portion of the support body 320 is housed within the cover member 330. Furthermore, a portion of the plurality of nozzles 310 supported by the support body 320 is housed within the cover member 330. In addition, a portion of the plurality of pipes 311, 312 supported by the support body 320 is housed within the cover member 330. Figure 5 In the diagram, a double-dotted line indicates the state of the cover component 330 when it is installed on the support body 320.

[0093] Here, in the support 320, the pipe fixing part 324 is located between the other end 322 of the support 320 and the other end face 333 of the cover member 330. The pipe fixing piece 329 binds and fixes the multiple pipes 311, 312 leading out from the cover member 330 to the pipe fixing part 324 in such a way that the multiple pipes 311, 312 do not contact the inner edge of the notch 333N of the other end face 333.

[0094] like Figure 6 As shown, with the cover component 330 mounted on the support body 320, most of each nozzle 310, except for the fluid inlet portion 310a, protrudes downwards from the cover component 330.

[0095] (5) Dividing plate 100 and cylindrical component 200

[0096] Figure 7 yes Figure 2 A perspective view of the dividing plate 100 and the cylindrical component 200. Figure 8 yes Figure 2 A top view of the dividing plate 100 and the cylindrical component 200. (See attached image.) Figure 7 and Figure 8 As shown, the cylindrical component 200 has a cylindrical shape and is fixed to the housing CA via a bracket (not shown). Figure 1 Part of the cylindrical component 200. The inner diameter of the cylindrical component 200 is larger than the cylindrical wall portion 41 of the cup 40. Figure 3 The outer diameter of the cylindrical component 200. Furthermore, the central axis of the cylindrical component 200 is positioned such that, when viewed from above, it coincides with or substantially coincides with the central axis of the cup 40. Thus, for example, when the cup 40 is raised, it is possible to prevent the cup 40 from contacting the cylindrical component 200 and to insert the upper end of the cup 40 into the cylindrical component 200.

[0097] The dividing plate 100 has a generally circular shape and is mounted on the cylindrical member 200 near its upper end and integrally connected to the inner circumferential surface of the cylindrical member 200. A rectangular nozzle opening 110 extending in the first direction D1 is formed approximately at the center of the dividing plate 100. During the development process of the substrate W, the nozzle opening 110 faces the central portion of the substrate W held by the substrate holding device 70. Figure 7 As shown, the portion forming the nozzle opening 110 in the dividing plate 100 has a wall portion 111 that extends upward from the inner edge of the nozzle opening 110 for a fixed length (e.g., about 5 mm to 10 mm).

[0098] In addition, such as Figure 8 As shown, multiple through holes H are formed on the dividing plate 100 in a manner that is distributed throughout the dividing plate 100 except for the nozzle opening 110. The number and size of the multiple through holes H formed on the dividing plate 100 are considered in the processing space SPa (described later). Figure 15 ) and non-processing space SPb( Figure 15 It is determined by the relationship between the pressures between them.

[0099] Regarding the configuration of multiple through holes H, specifically, as follows: Figure 8As shown by the dashed lines, concentric circles (multiple imaginary circles vc1) with a specific spacing are defined based on the center 100C of the dividing plate when viewed from above. In this case, multiple through holes H are distributed and formed at equal intervals on each imaginary circle vc1. Furthermore, the number of through holes H formed on the largest imaginary circle vc1 is greater than the number of through holes H formed on the other imaginary circles vc1. In addition, in this example, only the largest imaginary circle vc1 surrounds the entire nozzle opening 110. Therefore, multiple through holes H are formed on the largest imaginary circle vc1, with a fixed interval left throughout the entire imaginary circle vc1.

[0100] In addition, such as Figure 8 As shown by a thick double-dotted line, an imaginary circle vc2 is defined with a radius equal to half the radius of the dividing plate 100, centered at the center 100C. Here, with the inner region of the imaginary circle vc2 designated as the central region A1 and the outer region of the imaginary circle vc2 designated as the outer peripheral region A2, the number of through holes H formed in the outer peripheral region A2 is greater than the number of through holes H formed in the central region A1.

[0101] (6) Operation of nozzle arm unit 300

[0102] As described above, the nozzle arm unit 300 is mounted on the rotation shaft 401 of the nozzle drive unit 400. Therefore, when the motor of the nozzle drive unit 400 moves in the vertical direction, the nozzle arm unit 300 moves in the vertical direction. Furthermore, when the motor of the nozzle drive unit 400 is activated, the nozzle arm unit 300 rotates in the horizontal plane around the rotation shaft 401. Thus, during periods when no development processing of the substrate W is being performed, the plurality of nozzles 310 of the nozzle arm unit 300 are held in a standby position P1, sideways to the substrate W held by the substrate holding device 70. Furthermore, during periods when development processing of the substrate W is being performed, the plurality of nozzles 310 are held in a processing position P2, above the substrate W held by the substrate holding device 70. Figure 2 The standby position P1 and the processing position P2 are represented by blank arrows, respectively.

[0103] Figures 9-12 This diagram illustrates the operation of the nozzle arm unit 300 when multiple nozzles 310 move between the standby position P1 and the processing position P2. Figures 9-12 In the diagram, the states of the nozzle arm unit 300 and its surrounding components as multiple nozzles 310 move from the standby position P1 to the processing position P2 are shown in a three-dimensional view in chronological order. Additionally, in... Figures 9-12 In the recorded division plate 100, and Figure 2 Similarly, the illustration of multiple through holes H is omitted.

[0104] First, such as Figure 9 As shown, with the multiple nozzles 310 in the standby position P1, the nozzle arm unit 300 is located to the side of the dividing plate 100 and the cylinder component 200, and is held in a state extending parallel to the second direction D2. At this time, the nozzle arm unit 300 is positioned with the spray portion 310c of the multiple nozzles 310... Figure 6 Multiple standby ports 510 housed in the standby receiver 500 Figure 10 Positioning within the range of )

[0105] When the nozzle drive unit 400 is in Figure 9 When starting an action in a certain state, such as Figure 10 As indicated by the thick solid arrow, the nozzle arm unit 300, together with the rotation shaft 401, rises to a height higher than the cylinder component 200. Consequently, the injection portions 310c of the multiple nozzles 310 ( Figure 6 From the multiple standby holes 510 of the standby casing 500 ( Figure 10 (This leads to the conclusion.)

[0106] Secondly, the rotating shaft 401 of the nozzle drive unit 400 rotates by a specific angle (90° in this example). Thus, as... Figure 11 As indicated by the thick solid arrow, the nozzle arm unit 300 rotates about the rotation axis 401. Thus, the nozzle arm unit 300 is held in a state extending parallel to the first direction D1. At this time, the nozzle arm unit 300 is positioned such that, when viewed from above, the lower cover member 330 overlaps with the nozzle opening 110 of the dividing plate 100.

[0107] Next, the rotating shaft 401 of the nozzle drive unit 400 descends. Thus, as... Figure 12 As indicated by the thick solid arrow, the cover member 330 descends. At this time, the height position of the nozzle arm unit 300 is adjusted so that the cover member 330 is not in contact with the dividing plate 100 but is sufficiently close. This reduces the flow of gas in the nozzle opening 110. Thus, with the nozzle opening 110 of the dividing plate 100 covered by the cover member 330, the multiple nozzles 310 are held in the processing position P2.

[0108] Multiple sections of pipes 311, 312 extending outward from the nozzle arm unit 300 are secured by a tubular bundling member 391. For example... Figures 9-12 As shown, in Figure 1 Within the housing CA, a fixing part 392 for securing a portion of the tubular bundling member 391 is provided on a portion of the housing CA (e.g., the base plate 5w). The fixing part 392 secures a portion of the tubular bundling member 391, extending from the nozzle arm unit 300, to the housing CA. Thus, a plurality of pipes 311, 312 located between the nozzle arm unit 300 and the fixing part 392 are deformably bundled by the tubular bundling member 391. Therefore, Figure 1The maneuverability of the multiple pipes 311, 312 inside the housing CA is improved. Furthermore, because the tubular bundling member 391 is flexible, the freedom of movement and rotation of the nozzle arm unit 300 is not restricted by the tubular bundling member 391. Additionally, the multiple pipes 311, 312 bundled by the tubular bundling member 391 extend from the tubular bundling member 391 near the fixing part 392 and connect to... Figure 1 The fluid supply path 12 of the fluid supply section 11.

[0109] (7) The action of cup 40

[0110] In the developing apparatus 1, when the substrate W is being moved in and out of the liquid processing units LPA and LPB, the cup 40 maintains a first state. On the other hand, during the developing process of the substrate W held by the substrate holding device 70, the cup 40 maintains a second state. The first and second states of the cup 40 will be explained.

[0111] Figure 13 This is a schematic longitudinal sectional view of the developing apparatus 1 when the cups 40 of the liquid processing units LPA and LPB are in the first state. Figure 14 This is a schematic longitudinal sectional view of the developing apparatus 1 when the cups 40 of the liquid processing units LPA and LPB are in the second state. Figure 13 and Figure 14 In the diagram, the nozzle arm unit 300, located in the standby position P1, is indicated by a dashed line. Furthermore, in... Figure 13 and Figure 14 The diagrams of some of the components of the liquid handling units LPA and LPB are omitted.

[0112] like Figure 13 As shown, when the cup 40 is in the first state, it is located inside the receiving container 50. That is, when the cup 40 is in the first state, it overlaps with the receiving container 50 in a side view and is separated from the cylindrical component 200. Therefore, when the cup 40 is in the first state, the substrate holding device 70 can be picked up from the side of the cup 40 and the receiving container 50. As a result, the substrate W brought in from outside the developing apparatus 1 can be placed on the adsorption and holding section 71 of the liquid processing units LPA and LPB. Furthermore, the substrate W placed on the adsorption and holding section 71 of the liquid processing units LPA and LPB can be removed and moved out of the developing apparatus 1.

[0113] The height of cup 40 (vertical dimension) is set such that it is greater than the distance between the cylindrical component 200 and the receiving container 50 in the vertical direction. For example... Figure 14As shown, when the cup 40 is in the second state, it overlaps with the lower end of the cylindrical component 200 and the upper end of the receiving container 50 when viewed from the side. At this time, the upper end of the cup 40 is close to the inner circumferential surface near the lower end of the cylindrical component 200. In addition, the lower end of the cup 40 is close to the inner circumferential surface near the upper end of the receiving container 50.

[0114] (8) Processing space and non-processing space formed within the shell CA

[0115] During the development process of substrate W, cup 40 remains in the second state, and the plurality of nozzles 310 of nozzle arm unit 300 are arranged at processing position P2. Figure 15 This is a schematic longitudinal sectional view of the developing apparatus 1 used in the developing process of substrate W. (See attached image.) Figure 15 As shown, during the development process of substrate W, in each of the liquid processing units LPA and LPB, multiple nozzles 310 are arranged at processing position P2. Figure 12 The cover component 330 covers the nozzle opening 110 of the dividing plate 100. Thus, the internal space SP of the housing CA is divided into a processing space SPA and a non-processing space SPb by the dividing plate 100 of the liquid processing units LPA and LPB, the cylinder component 200, the cover component 330, the cup 40, and the container 50. The processing space SPA is the space containing the substrate W held by the substrate holding device 70, and the non-processing space SPb is the space surrounding the processing space SPA.

[0116] like Figure 15 As indicated by the blank arrows, clean air is continuously supplied from above to the non-processing space SPb. Furthermore, a portion of the clean air supplied to the non-processing space SPb passes through multiple through-holes H in the dividing plate 100. Figure 8 The airflow is supplied to the processing space SPa. As a result, clean downward airflow is formed in the two processing spaces SPa and the non-processing space SPb within the housing CA.

[0117] The inner peripheral surface of the liquid receiving portion 42 of the cup 40 forming each processing space SPa surrounds the substrate W held by the substrate holding device 70 in the horizontal plane. Thus, during the development process of the substrate W, most of the developer and cleaning solution supplied to the substrate W from the multiple nozzles 310 is caught by the inner peripheral surface of the liquid receiving portion 42 and guided to the receiving container 50. On the other hand, developer or cleaning solution droplets that are not caught by the liquid receiving portion 42 and disperse around the substrate W are guided to the receiving container 50 by the descending airflow formed within the processing space SPa.

[0118] When the substrate W rotates within the processing space SPa via the substrate holding device 70, an upward airflow (rising airflow) is generated near the periphery of the substrate W along the inner circumferential surfaces of the cup 40 and the cylindrical component 200. In this situation, when an atmosphere containing droplets of developer or cleaning solution rises within the processing space SPa, these droplets may adhere to the lower surface of the dividing plate 100 and the inner circumferential surface of the cylindrical component 200. Furthermore, these droplets may re-adhere to the substrate W.

[0119] Therefore, if used Figure 8 As explained, when concentric circles are defined on the substrate W, the dividing plate 100 is manufactured such that the number of through holes H formed on the largest imaginary circle vc1 is greater than the number of through holes H formed on the other imaginary circles vc1. Furthermore, the dividing plate 100 is manufactured such that a plurality of through holes H are distributed at fixed intervals throughout the entire largest imaginary circle vc1 surrounding the nozzle opening 110. Alternatively, when a central region A1 and an outer peripheral region A2 are defined on the dividing plate 100, the dividing plate 100 is manufactured such that the number of through holes H formed in the outer peripheral region A2 is greater than the number of through holes H formed in the central region A1.

[0120] According to the configuration of the dividing plate 100, in the processing space SPa, the amount of downward airflow guided to the vicinity of the inner circumferential surface of the cup 40 can be increased relative to the amount of downward airflow guided to the central portion of the substrate W. In particular, when multiple through holes H are distributed at fixed intervals throughout the largest imaginary circle vc1 surrounding the nozzle opening 110, a downward airflow can be formed around the entire circumference of the inner circumferential surface of the cup 40. As a result, when the substrate W rotates, the generation of upward airflow near the inner circumferential surface of the cup 40 is suppressed. Therefore, in the processing space SPa, the developer or cleaning solution supplied to the substrate W is prevented from scattering upwards near the outer circumferential end of the substrate W. As a result, the adsorption of developer or cleaning solution droplets on the lower surface of the dividing plate 100 and the inner circumferential surface of the barrel component 200 is suppressed. Furthermore, the re-adhesion of developer or cleaning solution to the substrate W is suppressed.

[0121] like Figure 15 As shown, when the processing space SPa and the non-processing space SPb are formed within the shell CA, a pressure difference arises between the processing space SPa and the non-processing space SPb. The reason for this will be explained.

[0122] As described above, clean air is continuously supplied from above to the processing space SPA and the non-processing space SPb. However, the amount of downward airflow that can enter the processing space SPA from above the housing CA is limited by the partition plate 100. Furthermore, in the developing apparatus 1, the end of the exhaust pipe 61 for discharging the air inside the housing CA is located inside the receiving container 50, i.e., the processing space SPA. Therefore, the air inside the processing space SPA is actively discharged to the outside of the housing CA.

[0123] On the other hand, in the non-processing space SPb, no components are provided to restrict the downward airflow, such as the partition plate 100. Furthermore, in the non-processing space SPb, no configuration is provided for actively exhausting the atmosphere within the non-processing space SPb to the outside of the housing CA. In particular, as... Figure 15 As shown, the base plate 5w in this example has a blocking section cp that closes the non-processing space SPb from below the housing CA. Consequently, a portion of the air guided from above the housing CA into the non-processing space SPb is not discharged to the outside of the non-processing space SPb due to the blocking section cp. As a result, the pressure inside the non-processing space SPb is sufficiently high relative to the pressure inside the processing space SPa.

[0124] By ensuring that the pressure in the non-processing space SPb surrounding the processing space SPa is higher than the pressure in the processing space SPa, that is, by ensuring that the pressure in the processing space SPa is lower than the pressure in the non-processing space SPb, the leakage of the atmosphere inside the processing space SPa to the outside of the housing CA through the non-processing space SPb is suppressed.

[0125] Here, when the internal space SP of the housing CA is divided into a processing space SPA and a non-processing space SPb, the cover member 330 preferably closes the nozzle opening 110 in such a way that it completely cuts off the gas flow in the nozzle opening 110. However, whenever the substrate W is developed, the cover member 330 may generate particles by repeatedly contacting and not contacting the dividing plate 100. Therefore, it is preferable that the cover member 330 does not contact the dividing plate 100.

[0126] Therefore, in this embodiment, during the development process of the substrate W, the cover member 330 does not contact the dividing plate 100 and covers the nozzle opening 110. At this time, in order to reduce the gas flow in the nozzle opening 110, the cover member 330 and the dividing plate 100 are formed as follows.

[0127] Figure 16 This is a top view showing an example of the state in which the nozzle opening 110 of the dividing plate 100 is covered by the cover component 330. Figure 17 yes Figure 16 A longitudinal sectional view of the dividing plate 100, the cylinder component 200, and the nozzle arm unit 300 at the KK line. Figure 16 The diagrams of multiple pipes 311 and 312 are omitted.

[0128] like Figure 16 As shown, when the cover member 330 covers the nozzle opening 110, the cover member 330 has its lower upper surface portion 331 viewed from above. Figure 5 The manner in which the entire nozzle opening 110 is completely covered is maintained. When the cover member 330 covers the nozzle opening 110, the multiple end faces and side faces (332-335) of the cover member 330 are formed in such a manner that a small gap is left when viewed from above, surrounding the wall portion 111 of the dividing plate 100.

[0129] In addition, such as Figure 17 As shown, the cover member 330 is held in such a way that a portion of its multiple end faces and side faces (332-335) overlaps with the wall portion 111 of the dividing plate 100 in a side view, but does not contact the dividing plate 100. Figure 17 The image shows an enlarged cross-sectional view of the lower end of one end face 332 of the cover component 330 and its surrounding area, within the white box.

[0130] like Figure 17 As shown in the dialogue box, when the nozzle opening 110 is covered by the cover member 330, a gap space G is formed between the processing space SPa and the non-processing space SPb. The gap space G is the space sandwiched between the wall portion 111 of the dividing plate 100 and the multiple end portions and side portions (332-335) of the cover member 330. Therefore, compared with the case where the wall portion 111 is not formed in the dividing plate 100, or the case where the cover member 330 is only composed of the upper surface portion 331, the flow of gas in the nozzle opening 110 can be reduced. The distance between the wall portion 111 of the dividing plate 100 and the multiple end portions and side portions (332-335) of the cover member 330 (the distance of the gap space G) is preferably set to, for example, about 2 mm to 5 mm.

[0131] Furthermore, in the developing apparatus 1 of this embodiment, when the cup 40 is in the second state, the upper end of the cup 40 is close to the inner circumferential surface near the lower end of the barrel component 200. In this case, a gap space is formed between the barrel component 200 and the upper part of the cup 40. As a result, compared to the case where the barrel component 200 is not present, the leakage of atmosphere from the processing space SPA from between the cup 40 and the dividing plate 100 into the non-processing space SPb can be reduced. The distance between the inner circumferential surface of the barrel component 200 and the outer circumferential surface of the cup 40 (the distance of the gap space between the upper part of the barrel component 200 and the cup 40) viewed from above is preferably set to, for example, about 2 mm to 5 mm.

[0132] <3> Configuration of the control unit of developing apparatus 1

[0133] Figure 18 It means Figure 1 A block diagram showing the configuration of the control unit 90 of the developing apparatus 1. (See diagram below.) Figure 18 As shown, the control unit 90 includes a first lifting control unit 91, a fluid control unit 92, a first rotation control unit 93, a suction control unit 94, a second lifting control unit 95, and a second rotation control unit 96. Figure 18 The functions of each part of the control unit 90 are achieved, for example, by the CPU executing a specific program stored in memory.

[0134] The first lifting control unit 91 controls the operation of the lifting drive units 49 of the liquid processing units LPA and LPB. As a result, the cups 40 of each liquid processing unit LPA and LPB change to the first state and the second state, respectively. The fluid control unit 92 controls... Figure 1 The operation of the two fluid supply units 11. As a result, in each liquid processing unit LPA, LPB, a mixture of developer and gas is sprayed from a portion of the multiple nozzles 310, and a mixture of cleaning fluid and gas is sprayed from the other nozzles 310.

[0135] First rotation control unit 93 control Figure 1 The operation of the rotary motors 72 of the liquid handling units LPA and LPB. Additionally, the suction control unit 94 controls... Figure 1 The suction devices 78 of the liquid processing units LPA and LPB are activated. As a result, in each substrate holding device 70, the substrate W is adsorbed, held, and rotated in a horizontal position.

[0136] The second lifting control unit 95 and the second rotation control unit 96 control Figure 1 The operation of the nozzle drive units 400 of the liquid handling units LPA and LPB is controlled. Specifically, the second lifting control unit 95 controls the operation of the actuators of each nozzle drive unit 400. The second rotation control unit 96 controls the operation of the motors with rotation shafts 401 of each nozzle drive unit 400.

[0137] <4> Basic operation of developing apparatus 1

[0138] The basic operation of the developing apparatus 1 will be explained. Figure 19 This is a flowchart illustrating the basic operation of the substrate W during the development process of the developing apparatus 1. In the initial state, air, after temperature and humidity adjustments, is supplied to the developing apparatus 1 from the gas supply unit 10. Furthermore, the atmosphere within the housing CA is guided from the exhaust pipes 61 of the liquid processing units LPA and LPB to an exhaust device (not shown). A clean, downward airflow is formed within the housing CA. Additionally, in the initial state, the cup 40 remains in the first state. Furthermore, the plurality of nozzles 310 remain in the standby position P1.

[0139] Before the development process of substrate W begins, the substrate W, which will be processed, is first transferred into the liquid processing units LPA and LPB. Furthermore, as... Figure 13As shown, the substrate W is placed on the adsorption and holding portion 71 of the substrate holding device 70. When the development process of the substrate W begins, Figure 18 The suction control unit 94 controls the suction device 78 of the liquid processing units LPA and LPB by adsorbing the substrate W through the adsorption holding unit 71 of the substrate holding device 70 (step S11).

[0140] then, Figure 18 The first lifting control unit 91 controls the lifting drive unit 49 of the liquid handling units LPA and LPB in a manner that causes the cup 40 to change from the first state to the second state (step S12).

[0141] then, Figure 18 The second lifting control unit 95 and the second rotation control unit 96 control the nozzle drive unit 400 of the liquid processing units LPA and LPB in such a way that the plurality of nozzles 310 move from the standby position P1 to the processing position P2 (step S13).

[0142] then, Figure 18 The first rotation control unit 93 controls the rotary motors 72 of the liquid processing units LPA and LPB in such a way that the substrate W rotates around the rotation axis 73 (step S14).

[0143] then, Figure 18 The fluid control unit 92 controls the fluid supply unit 11 of the liquid processing units LPA and LPB to supply developer solution to the substrate W from a portion of the multiple nozzles 310 at a preset time (step S15). Furthermore, Figure 18 The fluid control unit 92 controls the fluid supply unit 11 of the liquid processing units LPA and LPB in a manner that supplies cleaning fluid to the substrate W from other nozzles 310 among the plurality of nozzles 310 at a preset time (step S16).

[0144] then, Figure 18 The first rotation control unit 93 dries the substrate W by continuing to rotate it until a fixed time has elapsed since the cleaning solution supply was stopped. Furthermore, Figure 18 The first rotation control unit 93 controls the rotation motors 72 of the liquid processing units LPA and LPB in a manner that stops the supply of cleaning liquid and stops the rotation of the substrate W after a fixed time (step S17).

[0145] then, Figure 18 The second lifting control unit 95 and the second rotation control unit 96 control the nozzle drive unit 400 of the liquid processing units LPA and LPB in such a way that the plurality of nozzles 310 move from the processing position P2 to the standby position P1 (step S18).

[0146] then, Figure 18The first lifting control unit 91 controls the lifting drive unit 49 of the liquid handling units LPA and LPB in a manner that causes the cup 40 to change from the second state to the first state (step S19).

[0147] at last, Figure 8 The suction control unit 94 controls the suction device 78 of the liquid processing units LPA and LPB to release the adsorption of the substrate W by the adsorption holding unit 71 of the substrate holding device 70 (step S20). Thus, the development process of the substrate W ends. The developed substrate W is removed from the liquid processing units LPA and LPB.

[0148] <5> Effect

[0149] (1) The organic solvents contained in the developing solution and cleaning solution used in the developing process of substrate W have a characteristic strong odor. In the developing apparatus 1, during the developing process of substrate W, the internal space SP of the housing CA is divided into a processing space SPa and a non-processing space SPb by a dividing plate 100, a cylindrical component 200, a cover component 330, a cup 40, and a receiving container 50. A portion of the descending airflow is guided to the processing space SPa through a plurality of through holes H provided in the dividing plate 100. In this case, the amount of gas supplied to the processing space SPa can be less than the amount of gas supplied to the non-processing space SPb. As a result, the pressure in the processing space SPa can be lower than the pressure in the non-processing space SPb.

[0150] If the pressure in the processing space SPPa is lower than the pressure in the non-processing space SPb, then the atmosphere in the processing space SPPa is less likely to enter the non-processing space SPb. Therefore, even if an odor originating from the processing liquid is generated in the processing space SPPa, the odor is less likely to leak to the outside of the housing CA.

[0151] Furthermore, in this configuration, nozzle openings 110 are formed on the dividing plate 100. According to this configuration, when the plurality of nozzles 310 are in the processing position P2, the plurality of nozzles 310 do not interfere with the dividing plate 100. Furthermore, when the plurality of nozzles 310 are in the processing position P2, the nozzle openings 110 formed on the dividing plate 100 are covered by the cover member 330. Therefore, when the developer and cleaning solution are supplied to the substrate W from the plurality of nozzles 310, leakage of atmosphere from the processing space SPA into the non-processing space SPb is reduced.

[0152] As a result, these measures can suppress the decrease in comfort of the working environment around the developing unit 1.

[0153] (2) In the developing apparatus 1, the nozzle drive unit 400 moves and rotates the nozzle arm unit 300, thereby moving the plurality of nozzles 310 between the standby position P1 and the processing position P2. Therefore, when the substrate W is not being developed, the plurality of nozzles 310 can be held in the standby position P1. When the plurality of nozzles 310 are in the standby position P1, virtual dispensing and cleaning of the plurality of nozzles 310 can be performed. This prevents unwanted developer or cleaning solution from falling from the nozzles in the processing position P2 and prevents the tips of the plurality of nozzles 310 in the processing position P2 from drying. As a result, the occurrence of substrate W processing defects is suppressed.

[0154] (3) In the nozzle arm unit 300, a cover member 330 is mounted on the support body 320 that supports the plurality of nozzles 310. Therefore, when the plurality of nozzles 310 move between the standby position P1 and the processing position P2, the plurality of nozzles 310 and the cover member 330 move together. Thus, interference between the plurality of nozzles 310 and the cover member 330 can be prevented. Furthermore, since it is not necessary to separately provide moving mechanisms for the plurality of nozzles 310 and moving mechanisms for the cover member 330, the complexity of the configuration can be reduced.

[0155] (4) In the developing apparatus 1, in each of the liquid processing units LPA and LPB, the atmosphere inside the receiving container 50 is discharged to the outside of the housing CA through the exhaust pipe 61. On the other hand, a blocking part cp is provided on the bottom plate 5w to block the non-processing space SPb from below the housing CA. Therefore, during the development process of the substrate W, it is easy to make the pressure of the processing space SPA lower than the pressure of the non-processing space SPb.

[0156] <6> Other implementation methods

[0157] (1) In the developing apparatus 1 of the above embodiment, an exhaust section may also be provided on the base plate 5w to exhaust the atmosphere in the non-processing space SPb to the outside of the housing CA. In this case, during the development process of the substrate W, in order to maintain the pressure in the processing space SPa lower than the pressure in the non-processing space SPb, it is necessary to control the exhaust volume of the gas discharged from the processing space SPa and the exhaust volume of the gas discharged from the non-processing space SPb.

[0158] (2) In the developing apparatus 1 of the above embodiment, the cover member 330 covering the nozzle opening 110 of the dividing plate 100 is integrally provided with the plurality of nozzles 310, but the present invention is not limited thereto. The cover member 330 may also be provided separately from the plurality of nozzles 310. In this case, the developing apparatus 1 may include a drive unit that covers the nozzle opening 110 when the plurality of nozzles 310 are in the processing position P2 and opens the nozzle opening 110 when the plurality of nozzles 310 are in the standby position P1, thereby actuating the cover member 330.

[0159] (3) In the developing apparatus 1 of the above embodiment, the plurality of nozzles 310 are configured to move between the standby position P1 and the processing position P2, but the present invention is not limited thereto. The plurality of nozzles 310 may also be fixed to the dividing plate 100 and the cylinder component 200 in such a way that they are always present in the processing position P2.

[0160] (4) The described embodiment is an example of applying the present invention to a developing apparatus, but it is not limited thereto. The present invention can also be applied to a substrate processing apparatus that treats a substrate W using an organic solvent with an odor. As such a substrate processing apparatus, there is a coating apparatus that coats a resist containing an organic solvent onto the substrate W.

[0161] (5) In the developing apparatus 1 of the above embodiment, two substrates W are simultaneously developed by liquid processing units LPA and LPB housed in housing CA, but the present invention is not limited thereto. The development of substrate W in liquid processing unit LPA and the development of substrate W in liquid processing unit LPB can be performed simultaneously or at different times.

[0162] For example, suppose that substrate W is developed in one liquid processing unit LPA (LPB), while substrate W is not developed in another liquid processing unit LPB (LPA). In this case, in one liquid processing unit LPA (LPB), the cup 40 remains in the second state, and the plurality of nozzles 310 remain in the processing position P2. Furthermore, in the other liquid processing unit LPB (LPA), the cup 40 remains in the first state, and the plurality of nozzles 310 remain in the standby position P1. Thus, within the housing CA, a processing space SPa is formed within one liquid processing unit LPA (LPB), and the internal space of the other liquid processing unit LPB (LPA) becomes a non-processing space SPb.

[0163] (6) In the dividing plate 100 of the described embodiment, the shape of the nozzle opening 110 is not limited to the rectangle. The nozzle opening 110 may have other shapes such as ellipse, circle, square, triangle, quadrilateral, pentagon or hexagon. In this case, the cover member 330 has a shape corresponding to the shape of the nozzle opening 110 of the dividing plate 100.

[0164] (7) In the developing apparatus 1 of the described embodiment, when the plurality of nozzles 310 are in the processing position P2, the cover member 330 covers the nozzle opening 110 in a manner that does not contact the dividing plate 100, but the present invention is not limited thereto. For example, by making efforts in other configurations to suppress the generation of particles caused by contact and non-contact between the cover member 330 and the dividing plate 100, the cover member 330 may also close the nozzle opening 110 while in contact with the dividing plate 100. Alternatively, if the generation of particles caused by contact and non-contact between the cover member 330 and the dividing plate 100 is to some extent allowed, the cover member 330 may close the nozzle opening 110 while in contact with the dividing plate 100.

[0165] (8) The cup 40 and the cylindrical component 200 of the embodiment each have a horizontal cross-section in the shape of an annular ring, but the present invention is not limited thereto. The cup 40 and the cylindrical component 200 may be configured to surround the substrate holding device 70 when viewed from above, or they may have a horizontal cross-section in the shape of a polygon.

[0166] (9) In the developing apparatus 1 of the above embodiment, two liquid processing units LPA and LPB are provided in one housing CA, but the present invention is not limited thereto. Only one liquid processing unit may be provided in the housing CA, or more than three liquid processing units may be provided.

[0167] (10) In the developing apparatus 1 of the described embodiment, each of the plurality of nozzles 310 is a dual-fluid nozzle, but the present invention is not limited thereto. Each of the plurality of nozzles 310 may also be a type of nozzle other than a dual-fluid nozzle.

[0168] (11) In the cover member 330 of the described embodiment, a notch 333N is formed on the other end face 333 in order to lead out a portion of the support 320 from the cover member 330, but the present invention is not limited thereto. During the development process of the substrate W, as long as the pressure in the processing space SPa is lower than the pressure in the non-processing space SPb, the cover member 330 may not have the other end face 333.

[0169] <7> The correspondence between the constituent elements of the technical solution and the constituent elements of the implementation method

[0170] Hereinafter, examples of the correspondence between the constituent elements of the technical solution and the elements of the implementation method will be described. In the above implementation method, the housing CA is an example of a chamber, the air guide AG and the filter FL are examples of airflow forming parts, the substrate holding device 70 is an example of a substrate holding part, the plurality of nozzles 310 are examples of nozzles, the processing space SPA is an example of a processing space, and the non-processing space SPb is an example of a non-processing space.

[0171] Furthermore, the dividing plate 100, the cylindrical component 200, the cup 40 and the cover component 330 are examples of dividing mechanisms, the cup 40 is an example of a processing cup, the multiple through holes H are examples of multiple through holes, the nozzle opening 110 is an example of a nozzle opening, the dividing plate 100 is an example of a dividing plate, the cover component 330 is an example of a cover component, and the developing apparatus 1 is an example of a substrate processing apparatus.

[0172] Furthermore, the nozzle drive unit 400 is an example of a nozzle drive unit, the support body 320 is an example of a support body, the connection part of the exhaust pipe 61 in the bottom 52 of the receiving container 50 is an example of an exhaust unit, the wall part 111 of the dividing plate 100 is an example of a first wall part, the upper surface part 331 of the cover member 330 is an example of a cover body part, and one end part 332, the other end part 333, one side part 334 and the other side part 335 of the cover member 330 are examples of a second wall part.

[0173] In addition, the cylindrical component 200 is an example of a cylindrical component, the central region A1 defined by the dividing plate 100 is an example of a central region, the outer peripheral region A2 defined by the dividing plate 100 is an example of an outer peripheral region, and the largest imaginary circle among multiple imaginary circles vc1 is an example of an imaginary circle.

[0174] As constituent elements of a technical solution, other elements having the composition or function described in the technical solution may also be used.

Claims

1. A substrate processing apparatus comprising: A chamber, having an internal space; An airflow forming section supplies gas into the chamber to form a descending airflow; A substrate holding section holds the substrate within the cavity; A nozzle supplies processing liquid to the substrate from a processing position above the substrate held by the substrate holder; and The partitioning mechanism, with the substrate held by the substrate holding portion, divides the internal space of the chamber into a processing space including the substrate held by the substrate holding portion and a non-processing space surrounding at least a portion of the processing space; and The division mechanism includes: The processing cup is arranged such that it surrounds the substrate held by the substrate holding portion when viewed from above and overlaps with the substrate held by the substrate holding portion when viewed from the side, thus forming the processing space; A dividing plate, positioned above the processing cup, has multiple through holes that guide a portion of the descending airflow into the processing space, and nozzle openings formed in a manner that overlaps with the processing position when viewed from above; and The cover member is configured to allow the supply of processing liquid from the nozzle to the substrate and cover the nozzle opening when the substrate is held by the substrate holding portion and the nozzle is in the processing position.

2. The substrate processing apparatus according to claim 1, further comprising a nozzle driving unit that moves the nozzle between the processing position and a standby position on the side of the substrate held by the substrate holding unit.

3. The substrate processing apparatus according to claim 2, further comprising a support body that supports the nozzle and the cover member; and The nozzle drive unit moves the nozzle and the cover member by moving or rotating the support.

4. The substrate processing apparatus according to any one of claims 1 to 3, further comprising an exhaust section that exhausts the atmosphere of the processing space to the outside of the chamber.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein The dividing plate has a first wall portion extending upward from the inner edge of the nozzle opening; and The cover component has: The cover body is larger than the nozzle opening when viewed from above; The second wall portion extends downward from the outer edge of the cover body portion; When the nozzle opening is covered by the cover member, the second wall portion is maintained in such a manner that it surrounds at least a portion of the first wall portion in a top view, overlaps at least a portion of the first wall portion in a side view, and does not contact the dividing plate.

6. The substrate processing apparatus according to any one of claims 1 to 5, wherein The dividing mechanism further includes a cylindrical member that surrounds the dividing plate in plan view, extends downward from the outer edge of the dividing plate, and surrounds the upper part of the processing cup in plan view; and The processing cup is configured to move up and down in a manner that allows it to transition between a first state in which the upper part of the processing cup is separated from the cylindrical member when viewed from the side, and a second state in which the upper part of the processing cup overlaps with the cylindrical member when viewed from the side.

7. The substrate processing apparatus according to any one of claims 1 to 6, wherein The substrate holding portion is configured to allow the held substrate to rotate in a horizontal position when the processing liquid is supplied from the nozzle to the substrate. The dividing plate has a circular shape larger than that of the substrate held by the substrate holding portion; and In the case where the dividing plate defines a central region that is circular in shape and has a radius when viewed from above, and an outer peripheral region that is circular in shape and has a width equal to the radius when viewed from above, including the outer peripheral ends of the dividing plate, the dividing plate is radially oriented. The plurality of through holes are dispersedly formed on the dividing plate; The number of through holes formed in the outer peripheral region of the dividing plate is greater than the number of through holes formed in the central region of the dividing plate.

8. The substrate processing apparatus according to any one of claims 1 to 6, wherein The substrate holding portion is configured to allow the held substrate to rotate in a horizontal position when the processing liquid is supplied from the nozzle to the substrate. The dividing plate has a circular shape larger than that of the substrate held by the substrate holding portion; The nozzle opening of the dividing plate faces the central portion of the substrate held by the substrate holding portion; and When the dividing plate defines an imaginary circle that surrounds the nozzle opening from the center of the dividing plate in a top view. A portion of the plurality of through holes are distributed in a manner that leaves a fixed or substantially fixed interval throughout the imaginary circle.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein the nozzle comprises a dual-fluid nozzle that sprays a mixed fluid comprising droplets of gas and the processing liquid onto the substrate held by the substrate holding portion.

10. The substrate processing apparatus according to any one of claims 1 to 9, wherein the processing liquid supplied from the nozzle to the substrate comprises an organic solvent.

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