Load terminal device and relay with heat dissipation function

Abstract

A load terminal device, a relay, and an electric meter with a heat dissipation function include a load terminal, the load terminal is provided with a clearance groove for pushing a card, and the load terminal is equipped with a heat sink. The specific heat capacity of the heat sink is higher than that of the load terminal. Under the conditions of the same mass and the same rising temperature, the heat sink can absorb more heat than the load terminal, ensuring that the heat of the load terminal can be dissipated through the heat sink.

Description

Technical Field

[0001] The present invention relates to the technical field of relays, and in particular to a load terminal device and a relay with a heat dissipation function. Background Art

[0002] At present, most electricity meters are of closed structure, which can effectively prevent the entry of rainwater, pests, dust and other foreign objects, and ensure the normal operation of the electricity meter.

[0003] However, the enclosed structure places higher demands on the heat dissipation of the meter. The relay is the largest heat source in the meter, and the largest heat sources of the relay include the contacts and the copper metal part, which are too small to carry too much current. The current conventional solutions include:

[0004] 1) Increasing the contact area will significantly increase production costs; increasing the contact size will increase costs significantly.

[0005] 2) Increase the area at the location where the copper metal cross-section is too small. However, in actual operation, the area of ​​the corresponding location cannot be increased due to the setting of the giveway groove. Therefore, the area must be increased at a location close to the location. Usually, the increased area is large, and the production cost also increases significantly. Summary of the Invention

[0006] In view of the shortcomings of the background technology, the object of the present invention is to provide a load terminal device and a relay with heat dissipation function.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A load terminal device with a heat dissipation function is used for a relay, comprising a load terminal having a high heat zone. A heat sink having a higher specific heat capacity than the load terminal is provided near the high heat zone, so that the heat of the load terminal can be dissipated through the heat sink.

[0009] Furthermore, the high-heat zone is a clearance groove for pushing the card, and at least part of the heat sink is attached to the position around the clearance groove. The heat sink includes a main heat dissipation part and an auxiliary heat dissipation part. The two sides of the auxiliary heat dissipation part are connected to the main heat dissipation part. The two main heat dissipation parts and the auxiliary heat dissipation parts can be bent, and the ends of the two main heat dissipation parts are provided with a bendable overlapping part.

[0010] Furthermore, the two overlapping portions are arranged in a staggered manner.

[0011] Furthermore, the width of the auxiliary heat dissipation portion is adapted to the thickness of the load terminal, the height of the main heat dissipation portion is adapted to the height of the load terminal, and the length of the overlap portion is not shorter than the thickness of the load terminal, so that the heat sink is completely close to the load terminal.

[0012] Furthermore, the gap between the heat sink and the load terminal is filled with thermally conductive silica gel.

[0013] Furthermore, the surface of the heat sink is coated with a nano coating, and the nano coating is composed of carbon elements.

[0014] Furthermore, the connection method of the load terminal includes any one or more of riveting, welding, bonding, screw connection and bolt assembly connection.

[0015] Furthermore, the load terminal is made of copper, and the heat sink is made of aluminum.

[0016] A relay comprises the load terminal device with heat dissipation function as described above, wherein one end of the load terminal provided with a heat sink is located inside the relay, and the other end is located outside the relay to form a lead-out end.

[0017] Furthermore, the heat sink is located on a side of the clearance groove close to the lead-out end.

[0018] The beneficial effects of the present invention are:

[0019] 1. The present invention proposes a load terminal device with a heat dissipation function, in which a heat sink is provided near a high-temperature zone on the load terminal, and the heat sink has a higher specific heat capacity than the load terminal. Under the conditions of the same mass and the same rising temperature, the heat sink can absorb more heat than the load terminal, ensuring that the heat of the load terminal can be dissipated through the heat sink.

[0020] 2. The present invention proposes a load terminal device with a heat dissipation function. The high-heat area is a clearance groove for pushing the card. The heat sink has an external dimension that matches the load terminal, so that the heat sink fits tightly to the surface of the load terminal. The gap between the heat sink and the load terminal is filled with other heat-conducting materials such as thermal silica gel to reduce the air in the gap. The thermal silica gel contains a certain proportion of thermal conductive particles to accelerate the heat conduction from the load terminal to the heat sink.

[0021] 3. The present invention proposes a load terminal device with heat dissipation function, in which the surface of the heat sink is coated with a nano-coating composed of carbon elements, so that the heat sink is isolated from the air. Relying on the stability of the carbon element, the heat sink is prevented from undergoing oxidation reaction under high temperature conditions, thereby affecting the thermal conductivity of the heat sink.

[0022] 4. A relay proposed by the present invention includes all the beneficial effects of the aforementioned load terminal device with heat dissipation function. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is one of the schematic diagrams of a load terminal device with heat dissipation function according to the present invention;

[0025] Figure 2 This is a second schematic diagram of a load terminal device with heat dissipation function according to the present invention;

[0026] Figure 3 It is a side view of a load terminal device with heat dissipation function according to the present invention;

[0027] Figure 4 for Figure 3 AA section view;

[0028] Figure 5 This is a schematic diagram of a heat sink of a load terminal device with heat dissipation function according to the present invention;

[0029] Figure 6 This is a second schematic diagram of a heat sink of a load terminal device with heat dissipation function according to the present invention;

[0030] In the figure, 10 is a load terminal; 101 is a recess; 20 is a heat sink; 201 is a main heat dissipation part; 202 is a secondary heat dissipation part; 203 is a lap joint. DETAILED DESCRIPTION

[0031] The following combination Figure 1-6 The present invention will be described in detail.

[0032] A load terminal device with a heat dissipation function is used for a relay, including a load terminal 10. The load terminal 10 has a high heat area. A heat sink 20 is installed near the high heat area on the load terminal 10. The specific heat capacity of the heat sink 20 is higher than the specific heat capacity of the load terminal 10, so that the heat of the load terminal 10 can be dissipated through the heat sink 20.

[0033] In this embodiment, the high-heat area is the clearance groove 101 used to push the card. Since the cross-sectional area of ​​the load terminal 10 changes suddenly at the clearance groove 101, it is easy for the current to be too large at this location to cause a heat dissipation. The heat generated by the load terminal 10 is absorbed by the heat sink 20. Since the specific heat capacity of the heat sink 20 is higher than that of the load terminal 10, the heat sink 20 needs to absorb more heat when the temperature rises by 1 degree Celsius compared to the load terminal 10 under the same mass. Compared with the traditional technology, the load terminal 10 is usually made of copper. Increasing the cross-sectional area of ​​the load terminal 10 directly at the position of the load terminal 10 near the clearance groove 101 usually results in a larger increase in area. The heat sink is made of aluminum, and the specific heat capacity of copper is 385 J·Kg. -1 ℃ -1 , the specific heat capacity of aluminum is 880J·Kg -1 ℃ -1 Therefore, using aluminum as a heat sink can reduce the volume of the heat sink and reduce the requirements for installation space. In addition, the price of aluminum is significantly lower than that of copper, which can greatly reduce production costs.

[0034] In this embodiment, at least a portion of the heat sink 20 is attached to the outside of the load terminal 10. The heat sink 20 includes a main heat sink 201 and an auxiliary heat sink 202. The main heat sink 201 is connected to both sides of the auxiliary heat sink 202. The two main heat sinks 201 and the auxiliary heat sink 202 are bendable. Bendable overlapping portions 203 are provided at the ends of the two main heat sinks 201. Furthermore, the two overlapping portions 203 are arranged in an alternating manner.

[0035] In this embodiment, the heat sink 20 has dimensions that are compatible with the load terminal 10. Specifically, the width B1 of the secondary heat sink 202 is compatible with the thickness A1 of the load terminal 10, the height B2 of the main heat sink 201 is compatible with the height A2 of the load terminal 10, and the length B3 of the overlap portion 203 is not shorter than the thickness A1 of the load terminal 10, so that the heat sink 20 can fit tightly against the load terminal 10, ensuring its heat dissipation effect. Furthermore, the gap between the heat sink 20 and the load terminal 10 is filled with thermally conductive silicone, which contains a certain proportion of thermally conductive particles. The thermally conductive particles are usually copper, but their properties are relatively active and easily oxidized by air, which affects their thermal conductivity. According to the order of metal activity, common metals with lower activity than copper include mercury, silver, platinum, and gold. Mercury is toxic, and the thermal conductivity of platinum is much lower than that of copper. Therefore, mercury and platinum are excluded as thermally conductive particles. According to the thermal conductivity of common metals, the top three are silver, copper, and gold. Therefore, you can also choose to add a certain proportion of silver particles to the thermal conductive silicone. However, considering that the chemical properties of gold are extremely stable and its thermal conductivity is close to that of copper, in some working conditions where operational stability is the primary consideration, the thermal conductive silicone also contains gold particles.

[0036] In this embodiment, the surface of the heat sink 20 is coated with a nano-coating composed of carbon. Applying the nano-coating to the surface of the heat sink 20 isolates the heat sink 20 from the air. The stability of the carbon element prevents oxidation of the heat sink 20 at high temperatures, which could affect its thermal conductivity.

[0037] In this embodiment, the heat sink 20 and the load terminal 10 are connected by riveting, welding (including resistance welding, brazing, soldering, etc.), bonding, screw connection (i.e., connection with screws) and bolt assembly connection (i.e., connection with bolts and nuts), or a combination of the above connection methods.

[0038] The present invention proposes a load terminal device with heat dissipation function, and its installation method is as follows:

[0039] First, bend the main heat dissipation part 201 on both sides of the auxiliary heat dissipation part 202 so that the heat sink 20 forms a mounting groove adapted to the load terminal 10; then, install the heat sink 20 in front of the load terminal 10, evenly apply thermal conductive silicone on the main heat dissipation part 201, the auxiliary heat dissipation part 202 and the inner side of the overlapping part 203, and continue to bend the two main heat dissipation parts 201 so that the main heat dissipation part 201 and the auxiliary heat dissipation part 202 are respectively tightly attached to the side and bottom surfaces of the load terminal 10. Figure 1 Finally, bend the overlapping portion 203 so that it fits tightly against the top of the load terminal 10, completing the installation of the heat sink 20, as shown. Figure 2 shown.

[0040] The present invention also proposes a relay, including a load terminal device with a heat dissipation function as described above, and the load terminal 10 is provided with a heat sink 20 on one side located inside the relay, and the other end located outside the relay to form a lead-out terminal. Furthermore, the heat sink 20 is located on the side of the give way slot 101 close to the lead-out terminal. When the magnetic relay is working, when the load current on the load terminal 10 is large, the high-heat zone suddenly increases the heat generation there and in the surrounding areas due to the reduction in its cross-sectional area. The heat generated by the load terminal 10 is conducted to the heat sink 20 through the thermally conductive silica gel, and is dissipated outwards through the heat sink 20, thereby preventing heat from accumulating at the load terminal 10 for a long time and affecting the performance of the relay.

[0041] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand and implement the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A load terminal device with heat dissipation function, used for a relay, comprising a load terminal, characterized in that: The load terminal has a high heat area, and a heat sink having a higher specific heat capacity than the load terminal is provided at a position of the load terminal close to the high heat area, so that the heat of the load terminal can be dissipated through the heat sink; The high-heat area is a clearance groove for pushing the card, and at least part of the heat sink is attached to the periphery of the clearance groove. The heat sink includes a main heat sink and an auxiliary heat sink. Both sides of the auxiliary heat sink are connected to the main heat sink, and the two main heat sinks and the auxiliary heat sink are bendable. The auxiliary heat dissipation portion extends along the thickness direction of the load terminal, and the main heat dissipation portion extends along the height direction of the load terminal, so that the heat sink circumferentially surrounds the load terminal and is completely in close contact with the load terminal.

2. A load terminal device with heat dissipation function as claimed in claim 1, characterized in that: The ends of the two main heat dissipation parts are provided with bendable overlapping parts.

3. A load terminal device with heat dissipation function as claimed in claim 2, characterized in that: The two overlapping portions are arranged alternately.

4. A load terminal device with heat dissipation function as claimed in claim 3, characterized in that: The width of the auxiliary heat dissipation portion is adapted to the thickness of the load terminal, the height of the main heat dissipation portion is adapted to the height of the load terminal, and the length of the overlapping portion is not shorter than the thickness of the load terminal.

5. A load terminal device with heat dissipation function as claimed in claim 4, characterized in that: The gap between the heat sink and the load terminal is filled with thermal conductive silica gel.

6. The load terminal device with heat dissipation function according to claim 4, characterized in that: The surface of the heat sink is coated with a nano coating, which is composed of carbon elements.

7. A load terminal device with heat dissipation function according to any one of claims 1 to 6, characterized in that: The connection method between the heat sink and the load terminal includes any one or more of riveting, welding, bonding, screw connection and bolt assembly connection.

8. The load terminal device with heat dissipation function according to claim 7, characterized in that: The load terminal is made of copper, and the heat sink is made of aluminum.

9. A relay, characterized in that: The device comprises a load terminal device with heat dissipation function as claimed in any one of claims 1 to 8, wherein one end of the load terminal provided with a heat sink is located inside the relay, and the other end is located outside the relay to form a lead-out terminal.

10. A relay as claimed in claim 9, characterized in that: The heat sink is located on a side of the clearance groove close to the lead-out end.

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