Automatic teaching method, device and equipment of mechanical arm of rotary processing device and medium
By automatically calculating the difference between the wafer center and the robotic arm, and combining it with the automatic wafer alignment function, the robotic arm of the rotating processing device is automatically taught. This solves the problem of teaching relying on manpower and tools in the existing technology, improves the accuracy and efficiency of teaching, and reduces costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KINGSEMI CO LTD
- Filing Date
- 2023-07-10
- Publication Date
- 2026-06-02
AI Technical Summary
In existing semiconductor equipment, the teaching work of robotic arms relies on human labor, which is cumbersome, has poor accuracy and stability, high cost, and the teaching tools are expensive and easily damaged.
By obtaining the initial position of the robotic arm, calculating the difference between the starting position and the offset position of the wafer center on the robotic arm, adjusting the position of the robotic arm until the difference is less than the preset value, and combining the wafer automatic alignment function, automatically calculating the reference position of the rotating processing device, thus realizing the automatic teaching of the robotic arm.
It improves the accuracy and efficiency of teaching without the need for expensive tools, reduces costs, and simplifies the teaching process.
Smart Images
Figure CN116779515B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic semiconductors, and more particularly to an automatic teaching method, apparatus, device, and medium for a robotic arm of a rotating processing device. Background Technology
[0002] Currently, in semiconductor equipment, the transfer of wafers between various processing units mainly relies on robotic arms. Due to the high precision requirements of semiconductor equipment, robotic arms need to achieve very high positioning accuracy when placing and picking up wafers from various processing units. However, there are many factors that affect whether robotic arms can accurately place and pick up wafers from various processing units. The most important of these is the teaching process, which refers to the wafer handling robotic arm finding the reference position of each processing unit while carrying the wafer. The processing units include rotary processing units suitable for liquid processing components and non-rotary processing units. For example, rotary processing units include coating units, developing units, forward washing units, back washing units, and edge exposure units, while non-rotary processing units include thermal processing units, cooling units, through-wall units, and buffer units.
[0003] Current teaching methods primarily rely on a teach pendant. The operator uses a robotic arm to hold the teach pendant and visually locates the vertical teaching position. The position is determined when the teach pendant is in contact with the surface of the processing device. Horizontal teaching positions require the aid of the teach pendant; the horizontal position is determined when the center of the teach pendant is aligned with the mechanical center of the processing device. This method has the following drawbacks:
[0004] 1. It mainly relies on manpower, the teaching process is cumbersome, the teaching work is difficult, and the accuracy of the teaching position depends mainly on the experience of the teaching personnel. Therefore, the reliability and stability of the teaching results are poor.
[0005] 2. Existing teaching tools are expensive, inefficient, and have poor accuracy. They are also prone to damage during use, requiring regular inspection and calibration, which results in low teaching efficiency and high teaching costs.
[0006] Therefore, there is an urgent need for an automatic teaching method, device, equipment, and medium for a rotating processing robot to improve the above-mentioned problems. Summary of the Invention
[0007] The purpose of this invention is to provide an automatic teaching method, device, equipment and medium for a rotating processing apparatus, so as to achieve automatic alignment between the wafer center and the reference position of the rotating processing apparatus, which is highly efficient and low cost.
[0008] In a first aspect, an automatic teaching method for a robotic arm of a rotating processing device includes:
[0009] Obtain the initial position of the robotic arm;
[0010] When the robotic arm places the wafer onto the rotating processing device according to the initial position, it obtains the initial position of the wafer center on the robotic arm; and when the robotic arm retrieves the wafer from the rotating processing device according to the initial position after the rotating processing device drives the wafer to rotate by a first preset angle, it obtains the deviation position of the wafer center on the robotic arm from the initial position.
[0011] Calculate the difference between the starting position and the deviation position, and determine whether the difference is less than or equal to a first preset value; if not, adjust the initial position of the robot until the adjusted difference is less than or equal to the first preset value, and take the adjusted position of the robot as the first coordinate of the wafer center;
[0012] After the rotating processing device drives the wafer to rotate by a second preset angle, it obtains the second coordinate of the wafer on the robot arm that deviates from the first coordinate, where the first preset angle is smaller than the second preset angle.
[0013] The horizontal coordinates of the reference position of the rotating processing device are calculated based on the first and second coordinates, thus completing the automatic teaching of the robot in the horizontal direction.
[0014] The beneficial effects of the method of the present invention are as follows: For the rotating processing device, before teaching, it is only necessary to determine the initial position of the robot arm based on the approximate position of the rotating processing device. Then, the robot arm can automatically repeat the operation of placing and picking up wafers on the rotating processing device according to the initial position. By calculating the difference in the change of the wafer center on the robot arm before and after placing and picking up the wafer, the initial position of the robot arm is continuously adjusted according to the difference until the adjusted difference is less than or equal to a first preset value. It is considered that the change in the position of the wafer center before and after the wafer rotates on the rotating processing device is small, that is, the wafer center and the reference position of the rotating processing device are close. The adjusted position of the robot arm is taken as the first coordinate of the wafer center. After the rotating processing device drives the wafer to rotate by a second preset angle, the second coordinate of the wafer on the robot arm relative to the first coordinate is obtained. The horizontal coordinate of the reference position of the rotating processing device is calculated based on the first coordinate and the second coordinate, realizing automatic teaching of the robot arm in the horizontal direction without the need for teaching tools, which is low-cost and improves the accuracy and efficiency of teaching.
[0015] Optionally, the starting position and offset position of the wafer center are both determined by the wafer auto-alignment function. The advantage is that by utilizing the inherent functions of the semiconductor device, automatic teaching of the robotic arm is achieved, resulting in low teaching costs.
[0016] Optionally, the first preset angle is an acute angle, and the second preset angle is 180 degrees. The advantage is that by setting the first preset angle to an acute angle, the risk of scratching the wafer and generating debris during rotation can be effectively reduced, and by setting the second preset angle to 180 degrees, the horizontal coordinates of the rotating processing device can be quickly calculated.
[0017] Optionally, the difference satisfies the following formula:
[0018] △X1=(X1-X2) / 2
[0019] △Y1=(Y1-Y2) / 2
[0020] Where (X1, Y1) are the starting position coordinates of the wafer center on the robot, (X2, Y2) are the deviation position coordinates of the wafer center on the robot from the starting position, △X1 is the difference between the first position and the second position on the X-axis, and △Y1 is the difference between the first position and the second position on the Y-axis.
[0021] Optionally, the reference position coordinates of the rotating processing device are ((X3+X4) / 2, (Y3+Y4) / 2), where (X3, Y3) are the first coordinates of the wafer center and (X4, Y4) are the second coordinates of the wafer center.
[0022] Optionally, the method further includes: the robotic arm moving the wafer above the rotary processing device according to the horizontal coordinates of the reference position; setting the single descent distance of the robotic arm; and setting the ascending distance of the robotic arm when the robotic arm cannot detect the wafer after descent, wherein the ascending distance of the robotic arm is greater than the single descent distance; and finding the vertical coordinates of the reference position of the rotary processing device by gradually reducing the difference between the single descent distance and the ascending distance of the robotic arm, thereby completing the automatic teaching of the robotic arm in the vertical direction. Its beneficial effect is that by adding automatic teaching in the vertical direction, it can not only avoid damage to the wafer due to excessive descent distance when the robotic arm places the wafer, but also avoid the problem of reduced processing efficiency due to increased robotic arm movement distance when retrieving the wafer.
[0023] Optionally, finding the vertical coordinates of the reference position by gradually reducing the difference between the single descent distance and the ascending distance of the robotic arm includes: after the robotic arm ascends according to the ascending distance, setting a new single descent distance to half of the ascending distance; when the robotic arm cannot detect the wafer after descending according to the new single descent distance, setting a new ascending distance of the robotic arm to half of the new descent distance; until the difference between the new ascending distance and the new single descent distance is less than or equal to a second preset value, using the vertical coordinates of the robotic arm's position as the vertical coordinates of the reference position. Its advantage lies in that by gradually reducing the difference between the single descent distance and the ascending distance of the robotic arm until the difference is less than or equal to a second preset value, and using the vertical coordinates of the robotic arm's position as the vertical coordinates of the reference position, automatic teaching of the robotic arm in the vertical direction is achieved with high accuracy.
[0024] In a second aspect, the present invention provides an automatic teaching device for a robotic arm of a rotary processing apparatus, comprising:
[0025] The acquisition unit is used to acquire the initial position of the robotic arm;
[0026] The acquisition unit is used to acquire the initial position of the wafer center on the robot arm when the robot arm places the wafer on the rotating processing device according to the initial position; the acquisition unit is used to acquire the deviation position of the wafer center on the robot arm from the initial position when the robot arm retrieves the wafer from the rotating processing device according to the initial position after the rotating processing device drives the wafer to rotate by a first preset angle.
[0027] The processing unit is used to calculate the difference between the starting position and the deviation position, and determine whether the difference is less than or equal to a first preset value; if not, the initial position of the robot is adjusted until the adjusted difference is less than or equal to the first preset value, and the adjusted position of the robot is used as the first coordinate of the wafer center.
[0028] The acquisition unit is used to acquire the second coordinate of the wafer relative to the first coordinate after the rotating processing device drives the wafer to rotate by a second preset angle, wherein the first preset angle is smaller than the second preset angle.
[0029] The processing unit is used to calculate the horizontal coordinates of the reference position of the rotating processing device based on the first coordinates and the second coordinates, and to complete the automatic teaching of the robot in the horizontal direction.
[0030] Thirdly, the present invention provides an electronic device including a memory and a processor, wherein the memory stores a program executable on the processor, and when the program is executed by the processor, the electronic device implements a method for performing any of the possible designs described above.
[0031] Fourthly, the present invention provides a readable storage medium storing a program, which, when executed, implements a method of any possible design of any of the above aspects. Attached Figure Description
[0032] Figure 1 A flowchart illustrating the automatic teaching method for the robotic arm of the rotary processing device provided in an embodiment of the present invention;
[0033] Figure 2 This is a schematic diagram of the rotating processing device provided in an embodiment of the present invention driving the wafer to rotate by a first preset angle;
[0034] Figure 3 This is a schematic diagram of the rotating processing device provided in an embodiment of the present invention driving the wafer to rotate by a second preset angle;
[0035] Figure 4 This is a schematic diagram of the automatic Z-axis teaching process provided in an embodiment of the present invention;
[0036] Figure 5 This is a schematic diagram of the structure of the robotic arm automatic teaching device of the rotary processing apparatus provided in an embodiment of the present invention;
[0037] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation
[0038] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.
[0039] like Figure 1As shown, to address the problems existing in the prior art, this invention provides an automatic teaching method for a robotic arm in a rotating processing device, used to realize automatic teaching of a rotating processing device by a robotic arm in a semiconductor device, such as a coating unit, developing unit, forward washing unit, back washing unit, and edge exposure unit, etc., including:
[0040] S101, Obtain the initial position of the robotic arm.
[0041] In some embodiments, a corresponding coordinate system is established before obtaining the initial position of the robot arm. For example, a three-dimensional coordinate system is established in the semiconductor device, the coordinates of the rotating chucks of each rotating processing device in the three-dimensional coordinate system are determined, and these coordinates are used as the initial position of the robot arm. It is only necessary to ensure that the initial position of the robot arm is above the rotating chucks. It should be noted that the coordinates of the rotating chucks of each rotating processing device obtained after establishing the three-dimensional coordinate system in the semiconductor device are theoretical coordinates, and there will be errors in reality. The purpose of teaching is to determine the actual coordinates of each rotating processing device and then modify the stored theoretical coordinates to the actual coordinates. In this embodiment, the reference position of the rotating processing device mainly refers to the rotation center.
[0042] S102, when the robotic arm places the wafer onto the rotating processing device according to the initial position, it obtains the initial position of the wafer center on the robotic arm; and after the rotating processing device rotates the wafer by a first preset angle, when the robotic arm retrieves the wafer from the rotating processing device according to the initial position, it obtains the deviation position of the wafer center on the robotic arm from the initial position, wherein the first preset angle is an acute angle. It should be noted that the smaller the first rotation angle is set, the lower the risk of scratching the wafer and generating debris during the rotation of the rotating processing device.
[0043] In some embodiments, the initial position and offset position of the wafer center are both determined by the automatic wafer alignment function. It should be noted that the automatic wafer alignment function can only determine the wafer center when the wafer is on the robotic arm. Therefore, during the automatic teaching process of the robotic arm, only the initial position coordinates of the robotic arm and the change in the relative position of the wafer center on the robotic arm before and after the wafer is placed or picked up based on this initial position are known. In some specific embodiments, the wafer center and the center of the robotic arm can be set to be on the same straight line. When the robotic arm places the wafer for the first time according to the initial position coordinates, the initial coordinates of the wafer center on the robotic arm are (0,0), that is, the wafer and the robotic arm are concentric.
[0044] S103, calculate the difference between the starting position and the deviation position, and determine whether the difference is less than or equal to a first preset value; if not, adjust the initial position of the robot until the adjusted difference is less than or equal to the first preset value, and then use the adjusted position of the robot as the first coordinate of the wafer center. For example, as... Figure 2 As shown, when the robotic arm places a wafer onto the rotary chuck from its initial position, the automatic wafer alignment function of the semiconductor equipment determines the initial position O1(X1, Y1) of the wafer center on the robotic arm. After the wafer rotates 45 degrees with the rotary chuck, when the robotic arm retrieves the wafer from its original initial position, the automatic wafer alignment function again determines the offset position O2(X2, Y2) of the wafer center on the robotic arm after deviating from the initial position. The initial position O1(X1, Y1) and the offset position O2(X2, Y2) are then calculated. If the difference between the initial position and the offset position is greater than the first preset value, it is considered that the wafer center O1 and the rotary chuck rotation center O are far apart during placement, and the initial position of the robot needs to be adjusted until the difference after adjustment is less than or equal to the first preset value. Then, the adjusted position of the robot is used as the first coordinate of the wafer center. If the difference between the initial position and the offset position is less than or equal to the first preset value, it is considered that the wafer center O1 and the rotary chuck rotation center O are close during placement, and the initial position of the robot can be directly used as the first coordinate of the wafer center.
[0045] In some embodiments, the difference satisfies the following formula:
[0046] △X1=(X1-X2) / 2
[0047] △Y1=(Y1-Y2) / 2
[0048] Where (X1, Y1) are the starting position coordinates of the wafer center on the robot, (X2, Y2) are the deviation position coordinates of the wafer center on the robot from the starting position, △X1 is the difference between the first position and the second position on the X-axis, and △Y1 is the difference between the first position and the second position on the Y-axis.
[0049] Regarding the setting of the first preset value, in some specific embodiments, a common first preset value β1 can be set. Only when the absolute values of ΔX and ΔY are both less than or equal to β1 is it considered that the change in the position of the wafer center before and after wafer rotation is small, that is, the wafer center and the rotation center of the rotary chuck are close to each other. Alternatively, two first preset values β2 and β3 can be set according to actual needs. Only when the absolute value of ΔX is less than or equal to β2 and the absolute value of ΔY is both less than or equal to β3 is it considered that the change in the position of the wafer center before and after wafer rotation is small, that is, the wafer center and the rotation center of the rotary chuck are close to each other.
[0050] S104, after the rotating chuck drives the wafer to rotate by a second preset angle, the second coordinate of the wafer relative to the first coordinate on the robotic arm is obtained, where the first preset angle is less than the second preset angle. The second preset angle is 180 degrees.
[0051] S105, the horizontal coordinates of the reference position of the rotating processing device are calculated based on the first and second coordinates to complete the automatic teaching of the robot in the horizontal direction. In the automatic teaching process of the rotating processing device, only the rotating function of the rotating processing device itself and the automatic wafer alignment function of the semiconductor equipment itself are utilized. No teaching tools are needed, which is low-cost and improves the accuracy and efficiency of the automatic teaching of the robot.
[0052] In some embodiments, the horizontal coordinates of the reference position of the rotating processing device are ((X3+X4) / 2, (Y3+Y4) / 2), where (X3, Y3) are the first coordinates of the wafer center, and (X4, Y4) are the second coordinates of the wafer center. It should be noted that when the difference is less than a first preset value, the coordinates of the starting position O1 (X1, Y1) and the offset position O2 (X2, Y2) can both be equivalent to the first coordinates of the wafer center.
[0053] To facilitate understanding, this embodiment further elaborates on the specific implementation method of the above-mentioned automatic teaching of the rotating processing device by the robotic arm in conjunction with a specific application scenario, such as... Figure 2 and Figure 3 As shown, the specific steps include the following:
[0054] Step a: First, the robotic arm places the wafer on the rotary chuck based on its initial position. The automatic wafer alignment function determines the initial position O1(X1, Y1) of the wafer center on the robotic arm when it places the wafer, i.e., the placement center. After the rotary chuck rotates 45 degrees, when the robotic arm retrieves the wafer based on its original initial position, the automatic wafer alignment function determines the offset position O2(X2, Y2) of the wafer center on the robotic arm after deviating from its initial position, i.e., the retrieval center. The deviations ΔX1 and ΔY1 between the placement center and the retrieval center are then:
[0055] △X1=(X1-X2) / 2
[0056] △Y1=(Y1-Y2) / 2
[0057] If |△X1|≤β and |△Y1|≤β (β is the given maximum deviation), then proceed to step b. If not, adjust the initial position of the robot and repeat step a until the deviation is within the given range.
[0058] Step b: The wafer's offset position O2(X2, Y2) at this point can be used as the first coordinate of the wafer center. After the rotary chuck rotates 180 degrees, the second coordinate O3(X3, Y3) of the wafer's offset relative to the first coordinate on the robotic arm is confirmed by the wafer auto-alignment function. This allows the determination of the coordinates of the rotary chuck's rotation center O(X, Y), where X = (X2 + X3) / 2 and Y = (Y2 + Y3) / 2. Figure 3 As shown, when the chuck rotates 180 degrees around its rotation center, the wafer center O2 before rotation, the wafer center O3 after rotation, and the chuck rotation center O are all located on the same straight line, and the chuck rotation center O is located at the center of the wafer center O2 before rotation and the wafer center O3 after rotation.
[0059] To prevent damage to the wafers due to excessive drop height during wafer placement and to address the issue of reduced processing efficiency caused by long robot arm travel distances during wafer retrieval, some embodiments include an automatic Z-axis teaching process.
[0060] The robotic arm moves the wafer above the rotating processing device according to the horizontal coordinates of the reference position; sets the single descent distance of the robotic arm; and sets the ascending distance of the robotic arm when the robotic arm cannot detect the wafer after descent, the ascending distance of the robotic arm is greater than the single descent distance; by gradually reducing the difference between the single descent distance and the ascending distance of the robotic arm, the vertical coordinates of the reference position of the rotating processing device are found, thus completing the automatic teaching of the robotic arm in the vertical direction.
[0061] In some specific embodiments, finding the vertical coordinates of the reference position by gradually reducing the difference between the single descent distance and the ascending distance of the robotic arm includes: after the robotic arm ascends according to the ascending distance, setting a new single descent distance to half of the ascending distance; when the robotic arm cannot detect the wafer after descending according to the new single descent distance, setting a new ascending distance of the robotic arm to half of the new descent distance; until the difference between the new ascending distance and the new single descent distance is less than or equal to a second preset value, using the vertical coordinates of the robotic arm's position as the vertical coordinates of the reference position. It should be understood that the second preset value can be set according to the actual required accuracy, or it can be directly set to 0.
[0062] To facilitate understanding, this embodiment further elaborates on the specific implementation method of automatic Z-axis teaching in conjunction with a specific application scenario, such as... Figure 4 As shown, the specific steps include the following:
[0063] Step a: After the robot arm 401 carries the wafer 403 to the top of the rotating processing device 402 according to the horizontal coordinate of the reference position, the vacuum of the robot arm 401 is turned off, and then it moves down 2mm. Then the vacuum is turned on to detect whether the wafer 403 is still on the robot arm 401. If it is, the robot arm 401 continues to move down 2mm under the condition of turning off the vacuum. The above operation is repeated until the vacuum can no longer detect the wafer 403, that is, the wafer 403 has been placed on the placement surface of the rotating processing device 402.
[0064] In step b, when the vacuum cannot detect wafer 403, the robot arm 401 automatically rises by 2.4mm, and then changes the 2mm in step a to 1.2mm and repeats the operation of step a.
[0065] Step c: Repeat steps a to b until the position between the wafer 403 and the rotating processing device 402 is confirmed. That is, when the second preset value is 0, the vertical coordinate of the position of the robot 401 is used as the vertical coordinate of the reference position of the rotating processing device 402.
[0066] like Figure 5 As shown, based on the above-mentioned automatic teaching method for a robotic arm of a rotating processing device, this invention provides an automatic teaching device for a robotic arm of a rotating processing device, including an acquisition unit 501 for acquiring the initial position of the robotic arm; the acquisition unit 501 for acquiring the initial position of the wafer center on the robotic arm when the robotic arm places the wafer onto the rotating processing device according to the initial position; the acquisition unit 501 for acquiring the deviation position of the wafer center on the robotic arm from the initial position when the robotic arm retrieves the wafer from the rotating processing device according to the initial position after the rotating processing device rotates the wafer by a first preset angle; and a processing unit 502 for calculating the... The difference between the starting position and the deviation position is determined, and it is determined whether the difference is less than or equal to a first preset value; if not, the initial position of the robot is adjusted until the adjusted difference is less than or equal to the first preset value, and the adjusted position of the robot is taken as the first coordinate of the wafer center; the acquisition unit 501 is used to acquire the second coordinate of the wafer on the robot relative to the first coordinate after the rotating processing device drives the wafer to rotate by a second preset angle, wherein the first preset angle is less than the second preset angle; the processing unit 502 is used to calculate the horizontal coordinate of the reference position of the rotating processing device based on the first coordinate and the second coordinate, and complete the automatic teaching of the robot in the horizontal direction.
[0067] It should be understood that all relevant content of each step involved in the above method embodiments can be referenced to the functional description of the corresponding functional module, and will not be repeated here.
[0068] In other embodiments of the invention, such asFigure 6 As shown, an embodiment of the present invention discloses an electronic device 600, which may include: one or more processors 601; a memory 602; a display 603; one or more application programs (not shown); and one or more computer programs 604. The aforementioned devices can be connected via one or more communication buses 605. The one or more computer programs 604 are stored in the memory 602 and configured to be executed by the one or more processors 601. The one or more computer programs 604 include instructions that can be used to perform actions such as... Figure 1 Each step in the corresponding embodiment.
[0069] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.
Claims
1. An automatic teaching method for a robotic arm of a rotary processing device, characterized in that, include: Obtain the initial position of the robotic arm; When the robotic arm places the wafer onto the rotating processing device according to the initial position, it obtains the starting position of the wafer center on the robotic arm. And after the rotating processing device drives the wafer to rotate by a first preset angle, when the robot arm retrieves the wafer from the rotating processing device according to the initial position, the deviation position of the wafer center from the initial position on the robot arm is obtained; Calculate the difference between the starting position and the deviation position, and determine whether the difference is less than or equal to a first preset value; if not, adjust the initial position of the robot until the adjusted difference is less than or equal to the first preset value, and take the adjusted position of the robot as the first coordinate of the wafer center; After the rotating processing device drives the wafer to rotate by a second preset angle, it obtains the second coordinate of the wafer on the robot arm that deviates from the first coordinate, where the first preset angle is smaller than the second preset angle. The horizontal coordinates of the reference position of the rotating processing device are calculated based on the first and second coordinates, thus completing the automatic teaching of the robot in the horizontal direction.
2. The method according to claim 1, characterized in that, The starting position and offset position of the wafer center are determined by the wafer automatic centering function.
3. The method according to claim 1, characterized in that, The first preset angle is an acute angle, and the second preset angle is 180 degrees.
4. The method according to claim 1, characterized in that, The difference satisfies the following formula: △X1=(X1-X2) / 2 △Y1=(Y1-Y2) / 2 Where (X1, Y1) are the starting position coordinates of the wafer center on the robot, (X2, Y2) are the deviation position coordinates of the wafer center on the robot from the starting position, △X1 is the difference between the first position and the second position on the X-axis, and △Y1 is the difference between the first position and the second position on the Y-axis.
5. The method according to claim 1, characterized in that, The reference position coordinates of the rotating processing device are ((X3+X4) / 2, (Y3+Y4) / 2), where (X3, Y3) are the first coordinates of the wafer center and (X4, Y4) are the second coordinates of the wafer center.
6. The method according to any one of claims 1-5, characterized in that, Also includes: The robotic arm moves the wafer above the rotary processing device according to the horizontal coordinates of the reference position; Set the single descent distance of the robotic arm; And when the robotic arm cannot detect the wafer after descending, the rising distance of the robotic arm is set to be greater than the single descending distance; By gradually reducing the difference between the single descent and ascent distances of the robotic arm, the vertical coordinates of the reference position of the rotating processing device are found, thus completing the automatic teaching of the robotic arm in the vertical direction.
7. The method according to claim 6, characterized in that, The method of finding the vertical coordinates of the reference position by gradually reducing the difference between the single descent distance and the ascent distance of the robotic arm includes: After the robotic arm ascends according to the stated ascent distance, a new single descent distance is set to half of the stated ascent distance; If the robot arm fails to detect the wafer after descending according to the new single descent distance, the new ascending distance of the robot arm is set to half of the new descent distance; until the difference between the new ascending distance and the new single descent distance is less than or equal to a second preset value, the vertical coordinates of the robot arm's position are used as the vertical coordinates of the reference position.
8. An automatic teaching device for a robotic arm of a rotary processing apparatus, characterized in that, include: The acquisition unit is used to acquire the initial position of the robotic arm; The acquisition unit is used to acquire the initial position of the wafer center on the robot arm when the robot arm places the wafer on the rotating processing device according to the initial position; the acquisition unit is used to acquire the deviation position of the wafer center on the robot arm from the initial position when the robot arm retrieves the wafer from the rotating processing device according to the initial position after the rotating processing device drives the wafer to rotate by a first preset angle. The processing unit is used to calculate the difference between the starting position and the deviation position, and determine whether the difference is less than or equal to a first preset value; if not, the initial position of the robot is adjusted until the adjusted difference is less than or equal to the first preset value, and the adjusted position of the robot is used as the first coordinate of the wafer center. The acquisition unit is used to acquire the second coordinate of the wafer relative to the first coordinate after the rotating processing device drives the wafer to rotate by a second preset angle, wherein the first preset angle is smaller than the second preset angle. The processing unit is used to calculate the horizontal coordinates of the reference position of the rotating processing device based on the first coordinates and the second coordinates, and to complete the automatic teaching of the robot in the horizontal direction.
9. An electronic device, characterized in that, The device includes a memory and a processor, wherein the memory stores a program that can run on the processor, and when the program is executed by the processor, causes the electronic device to perform the method of any one of claims 1 to 7.
10. A readable storage medium storing a program, characterized in that, When the program is executed, it implements the method of any one of claims 1 to 7.