Method and system for determining the break position of a coplanar waveguide transmission line

Abstract

The present application discloses a method, system, storage medium and electronic device for determining the break position of a coplanar waveguide transmission line, which belongs to the field of superconducting circuit technology. The method for determining the break position of a coplanar waveguide transmission line comprises: first obtaining characteristic information of multiple positions of the central transmission conductor, wherein the multiple positions are distributed along the path direction of the central transmission conductor; and then determining the break position of the central transmission conductor in the multiple positions based on the fluctuation of the characteristic information. Compared with the prior art, the technical solution provided by the present application can identify the break defect position of each coplanar waveguide transmission line on a quantum chip, and can achieve rapid positioning, thereby facilitating the accurate and efficient implementation of the repair process for the break defect.

Description

Technical Field

[0001] The present application belongs to the field of superconducting circuits, especially the field of superconducting quantum computing technology. In particular, the present application relates to a method, system, storage medium and electronic device for determining the break position of a coplanar waveguide transmission line. Background Art

[0002] The qubits (qubits) on a quantum chip are the fundamental units for performing quantum computations. Surrounding these qubits are various superconducting circuits with diverse functions, such as drive control signal lines, flux control signal lines, and readout signal lines, all built on coplanar waveguide transmission lines. Quantum chips fabricated using current fabrication processes often experience unexpected disconnections in the coplanar waveguide transmission lines, causing the superconducting circuits to fail to meet their design objectives. Consequently, repairing these disconnections is often necessary, but identifying and locating these locations is a challenging problem. Summary of the Invention

[0003] The purpose of the present application is to provide a method, system, storage medium and electronic device for determining the break position of a coplanar waveguide transmission line, which can identify and determine the break defect position of the coplanar waveguide transmission line.

[0004] One embodiment of the present application provides a method for determining a break position of a coplanar waveguide transmission line, wherein the coplanar waveguide transmission line includes a central transmission conductor. The method includes: first obtaining characteristic information of multiple positions of the central transmission conductor, wherein the multiple positions are distributed along the path direction of the central transmission conductor; and then determining, based on fluctuations in the characteristic information, a break position where the central transmission conductor is broken among the multiple positions.

[0005] In the method for determining the position of a broken circuit as described above, in some embodiments, the characteristic information includes film thickness, and the step of obtaining the characteristic information of multiple positions of the central transmission conductor includes: providing a substrate on which the coplanar waveguide transmission line is formed, the coplanar waveguide transmission line including the central transmission conductor; on the substrate, determining multiple positions of the central transmission conductor along the path direction of the central transmission conductor, and scanning the central transmission conductor to obtain the film thickness at each position.

[0006] In some embodiments of the method for determining the position of a broken circuit as described above, the step of scanning the central transmission conductor to obtain the film thickness at each position includes: moving a detection probe along the path direction of the central transmission conductor in a plane parallel to the coplanar waveguide transmission line and transmitting a detection signal to each position of the central transmission conductor; and determining the film thickness at each position based on a feedback signal of the detection signal at each position.

[0007] In the above-described method for determining a break position, in some embodiments, the characteristic information includes a grayscale value, and the step of obtaining characteristic information of multiple positions of the central transmission conductor includes: generating a photograph of the coplanar waveguide transmission line based on a substrate on which the coplanar waveguide transmission line is formed; performing grayscale processing on the photograph to obtain a comparison photograph; on the comparison photograph, determining multiple positions of the central transmission conductor along the path direction of the central transmission conductor, and scanning the central transmission conductor to obtain the grayscale value of each position.

[0008] In the above-described method for determining a break position, in some embodiments, the photograph comprises at least one of a light microscope photograph and an electron microscope photograph.

[0009] In some embodiments of the method for determining the break position as described above, the step of determining multiple positions of the center transmission conductor along the path direction of the center transmission conductor includes: providing a standard diagram, the standard diagram including a standard transmission line corresponding to the coplanar waveguide transmission line, the standard transmission line including a standard transmission conductor; determining multiple reference positions on the standard transmission conductor according to scanning requirements; and determining multiple positions of the center transmission conductor corresponding to the multiple reference positions.

[0010] In the above-mentioned method for determining the position of a broken circuit, in some embodiments, the standard diagram includes at least one of a photograph of a standard chip and a design diagram of a standard chip.

[0011] Another embodiment of the present application provides a system for determining a break position of a coplanar waveguide transmission line, wherein the coplanar waveguide transmission line includes a central transmission conductor. The system includes: an information acquisition module for acquiring characteristic information of multiple positions of the central transmission conductor, wherein the multiple positions are distributed along the path direction of the central transmission conductor; and a break identification module for determining a break position of the central transmission conductor among the multiple positions based on fluctuations in the characteristic information.

[0012] A third embodiment of the present application provides a storage medium, wherein the storage medium stores a computer program, wherein the computer program is configured to execute the above-mentioned method for determining a disconnection position when running.

[0013] A fourth embodiment of the present application provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the above-described method for determining a circuit breaker position.

[0014] Compared with the prior art, the present application provides a method for determining the break position of a coplanar waveguide transmission line, which first obtains characteristic information of multiple positions of the central transmission conductor distributed along the path direction, and then determines the break position of the central transmission conductor among the multiple positions based on the fluctuation of the characteristic information. This allows the position of the break defect of each coplanar waveguide transmission line on the quantum chip to be identified and quickly located, thereby facilitating the accurate and efficient implementation of the repair process for the break defect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the structure of a superconducting circuit prepared in the related art;

[0016] Figure 2 A flowchart of a method for determining a break position of a coplanar waveguide transmission line according to an embodiment of the present application;

[0017] Figure 3 A schematic structural diagram of a superconducting circuit in an embodiment provided in this application;

[0018] Figure 4 A schematic diagram of multi-point parallel scanning in an embodiment provided in this application;

[0019] Figure 5 This is a structural diagram of a system for determining a break position in a coplanar waveguide transmission line in an embodiment provided in the present application.

[0020] Description of reference numerals:

[0021] 1 - first coplanar waveguide transmission line, 11 - first central transmission conductor, 12 - first ground layer, 111 - first standard area conductor, 112 - disconnection area conductor, 101 - first standard interval, 102 - first disconnection sensitive interval, 103 - second disconnection sensitive interval;

[0022] 2 - second coplanar waveguide transmission line, 21 - second central transmission conductor, 22 - second ground layer, 211 - second standard area conductor, 212 - short-circuit area conductor, 201 - second standard interval, 202 - first short-circuit sensitive interval, 203 - second short-circuit sensitive interval. DETAILED DESCRIPTION

[0023] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

[0024] To make the purpose, technical solutions, and advantages of the embodiments of the present application clearer, one or more embodiments are now described with reference to the accompanying drawings, wherein similar reference numerals are used throughout the text to refer to similar components. In the following description, for the purpose of explanation, many specific details are set forth in order to provide a more thorough understanding of one or more embodiments. However, it is obvious that in various cases, one or more embodiments can be practiced without these specific details, and the various embodiments can be combined and referenced with each other without contradiction.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in a sequence other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0026] In addition, it should be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a substrate, layer (or film), region, and / or pattern, it can be directly on another layer or substrate, and / or intervening layers can also be present. In addition, it should be understood that when a layer is referred to as being "under" another layer, it can be directly under another layer, and / or one or more intervening layers can also be present. In addition, references to being "on" and "under" various layers can be made based on the accompanying drawings.

[0027] Quantum computing is a new discipline that considers computational processes from the perspective of fundamental quantum mechanical principles. The implementation of quantum computers requires quantum bits (qubits), which adhere to the laws of quantum mechanics, as their basic unit. Specifically, a qubit, a two-level system that follows the laws of quantum mechanics, can exist in any superposition of 0 and 1. The physical implementation of a qubit varies depending on the physical system used to construct it. A superconducting quantum chip consists of qubits and superconducting circuit structures, such as microwave cavities. A qubit is a two-level system constructed using a capacitor and a Josephson junction with nonlinear inductance.

[0028] Around the qubits are various circuit structures with different functions, including the drive control signal lines (xy-control lines, also known as xy control lines or pulse control signal lines) for XY rotation of the qubits, couplers for coupling between qubits, readout resonant cavities coupled to the qubits, and readout signal lines coupled to the readout cavities. Furthermore, the Z rotation of the qubits is performed by control signal lines near the superconducting quantum interference device (SQID), called the flux control signal lines (z-control lines, also known as z-control signal lines or frequency control signal lines). The flux control signal lines are arranged near the SQID and drive current, coupling with the SQID through magnetic flux. It should be noted that the readout signal lines, flux control signal lines, and drive control lines are all part of the superconducting circuitry on the quantum chip, generally employing a coplanar waveguide transmission line structure for transmitting microwave signals. A coplanar waveguide transmission line consists of a central transmission conductor and ground planes on either side of the central transmission conductor. The gap between the central transmission conductor and the ground plane is called the ground clearance.

[0029] Figure 1 Schematic diagram of the structure of the superconducting circuit prepared in the related technology.

[0030] Combine Figure 1 As shown, the yield rate of quantum chip production is difficult to reach 100%, and the production process often encounters abnormalities in superconducting circuits, such as circuit breaks (such as Figure 1 The first coplanar waveguide transmission line 1) or short circuit (such as Figure 1 A short circuit in the first coplanar waveguide transmission line 1 is often caused by discontinuities in the film morphology of the first central transmission conductor 11 due to the manufacturing process. A short circuit in the second coplanar waveguide transmission line 2 is often caused by adhesion between the film morphology of the second central transmission conductor 21 and the ground. These anomalies render quantum bits and other data uncontrollable or inaccessible, significantly impacting the functionality of the quantum chip. To ensure proper function of the coplanar waveguide transmission line, repair procedures are often required at the abnormal locations.

[0031] To this end, the embodiments of the present application provide a method, system, storage medium and electronic device for determining the break position of a coplanar waveguide transmission line. The present application can identify and determine the break defect position of the coplanar waveguide transmission line, facilitating the implementation of the repair process.

[0032] Figure 2 This is a flow chart of a method for determining a break position in a coplanar waveguide transmission line according to an embodiment of the present application.

[0033] See also Figure 2 , and combined with Figure 1As shown, an embodiment of the present application provides a method for determining a break position of a coplanar waveguide transmission line, wherein the coplanar waveguide transmission line includes a central transmission conductor. The method includes the following steps S201 to S202, wherein:

[0034] Step S201: Acquire characteristic information of multiple positions of the central transmission conductor, wherein the multiple positions are distributed along the path direction of the central transmission conductor, such as Figure 1 In the first coplanar waveguide transmission line 1, multiple positions are determined in the transverse direction (path direction). It should be noted that: Figure 1 Other structures such as qubits are not shown;

[0035] Step S202: Determine, from among the plurality of locations, a location where the central transmission conductor is broken based on fluctuations in characteristic information corresponding to each location. The fluctuation may be based on whether the characteristic information is within a predetermined range, with locations within the predetermined range being determined as the disconnection location. The fluctuation may also be based on a difference in characteristic information at a particular location relative to characteristic information at other locations (e.g., other locations in the plurality of locations, or locations adjacent to the particular location), with locations with a difference greater than a predetermined threshold being determined as the disconnection location.

[0036] Through steps S201 to S202, the position of the short-circuit defect of each coplanar waveguide transmission line on the quantum chip can be identified and quickly located, which helps to accurately and efficiently implement a repair process for the short-circuit defect. The repair process can be coating at the short-circuit position. For example, a transmission layer covering the short-circuit position can be formed by depositing a superconducting material, and the transmission layer makes the coplanar waveguide transmission line connected.

[0037] About the coplanar waveguide transmission line after the process repair for the disconnection defect

[0038] Figure 3 This is a schematic diagram of the structure of a superconducting circuit in an embodiment of the present application, and schematically shows the structure of a coplanar waveguide transmission line after the abnormal position is repaired. The coplanar waveguide transmission line shown in the figure includes a central transmission conductor and ground layers located on both sides of the central transmission conductor. It should be noted that, based on the need to describe the key points of the embodiment, Figure 1 and Figure 3 The structure of the middle portion of the substrate is omitted and not shown.

[0039] In the embodiment of the present application, the open circuit sensitive interval corresponds to the location of the open circuit defect, the short circuit sensitive interval corresponds to the location of the short circuit defect, and the standard interval corresponds to the location of the part of the central conductor without abnormality (meeting the design requirements).

[0040] The following is an example of a coplanar waveguide transmission line that is connected after the process of repairing the disconnection defect, that is, Figure 3 The shape and structure of the first coplanar waveguide transmission line 1 having at least one disconnection sensitive section.

[0041] See also Figure 3 The first coplanar waveguide transmission line 1 includes a first central transmission conductor 11 and a first ground layer 12. A first standard section 101, a first disconnection sensitive section 102, and a second disconnection sensitive section 103 are distributed along the signal transmission direction of the first coplanar waveguide transmission line 1. The line width of the first standard area conductor 111 in the first standard area 101 is recorded as W10, the line width of the disconnection area conductor 112 in the first disconnection sensitive section 102 is recorded as W11, and the line width of the central transmission conductor in the second disconnection sensitive section 103 is recorded as W12. Both W11 and W12 can be greater than or equal to W10.

[0042] In some embodiments of the present application, the portion of the central transmission conductor within the disconnection-sensitive region may be a transmission layer formed by coating at the disconnection location after step S202. The line width of this portion may be greater than or equal to the line width of the central transmission conductor within the standard region. It will be appreciated that by designing the line width of this portion to be greater than the line width of the central transmission conductor within the standard region, the present application further helps avoid breakage and discontinuities caused by a narrow film during the manufacturing process.

[0043] In some embodiments of the present application, the central transmission conductor includes a first portion located in the standard range and a second portion located in the disconnection sensitive range. The first portion is located in the same film layer and is formed by the same coating process, while the second portion is located in another film layer and is formed by a relatively independent coating process. Specifically, the first portion of the coplanar waveguide transmission line can refer to Figure 3 The first standard area conductor 111, the second part can refer to Figure 2 The disconnected area conductor 112 in the circuit breaker.

[0044] In some embodiments, the line widths of the first standard area conductors 111 are uniform. In other embodiments, the disconnection area conductor 112 is a circular or rectangular film covering the first portion, and the circular or rectangular film is in contact with the first standard area conductor 111 to achieve electrical connection. In still other embodiments, when the central transmission conductor is formed by a coating process, the portion within the disconnection sensitive area is very susceptible to discontinuity (such discontinuity may be caused by factors such as uneven coating or tearing during peeling), which may lead to disconnection of the central transmission conductor. In order to increase the coating space in this area and facilitate increasing the line width of the disconnection area conductor 112 in this space, the first grounding layer 12 within the first disconnection sensitive area 102 may be recessed toward the side away from the central transmission conductor. In one embodiment, the distance between the disconnection zone conductor 112 and the first grounding layer 12 is the same as the distance between the first standard zone conductor 111 and the first grounding layer 12 in the standard area. In a specific implementation, the central transmission conductor in the disconnection sensitive area protrudes toward the first grounding layer 12, and the protrusion and the depression of the first grounding layer 12 maintain the same direction and amplitude.

[0045] In this embodiment, the coplanar waveguide transmission line can be formed of a superconducting material that exhibits superconducting properties at a temperature equal to or lower than a critical temperature, for example, at about 10-100 millikelvin (mK) or about 4K, such as aluminum, niobium, tantalum, or titanium nitride. In specific implementations, the coplanar waveguide transmission line is not limited to these materials. Any material that exhibits superconducting properties at a temperature equal to or lower than the critical temperature can be used to form the coplanar waveguide transmission line. These materials can be deposited using deposition processes such as chemical vapor deposition, physical vapor deposition (e.g., evaporation or sputtering), epitaxial techniques, and other deposition processes, exemplarily including ion beam assisted deposition (IBAD), vacuum evaporation, molecular beam epitaxy (MBE), pulsed laser deposition (PLD), chemical vapor deposition (CVD), sol-gel, and magnetron sputtering.

[0046] Method for determining the break position of coplanar waveguide transmission line

[0047] The characteristic information described above may include the film thickness and grayscale values of the central transmission conductor at the multiple locations. Determination of film thickness can be achieved using equipment such as a step profiler, ellipsometer, film thickness meter, profilometer, and AFM. Determination of grayscale values can be achieved through image processing and recognition. It is understood that the characteristic information of the central transmission conductor at the multiple locations is not limited to film thickness and grayscale values, but may also include other characteristic information that can indicate whether the thin film forming the central transmission conductor has fractured, such as line width.

[0048] The following continues to describe an example of a specific implementation of the method for determining a disconnection position.

[0049] In some embodiments, the characteristic information includes film thickness, and the step of obtaining characteristic information of multiple locations of the central transmission conductor includes: providing a substrate on which the coplanar waveguide transmission line is formed, the coplanar waveguide transmission line including the central transmission conductor; determining multiple locations of the central transmission conductor along the path direction of the central transmission conductor on the substrate, the multiple locations being locations where characteristic information (such as film thickness) needs to be detected and identified, and then scanning the central transmission conductor to obtain the film thickness at each location. This embodiment quickly determines the film thickness of the central transmission conductor at multiple locations by scanning the central transmission conductor, and then determines the location of the short circuit defect based on the fluctuation of the film thickness, such as whether it is within a preset range or the relative change of the film thickness at each location. It can be understood that the film thickness of the continuous portion of the central transmission conductor should be maintained within a certain range, while the film thickness at the location where the break occurs is extremely small or even zero.

[0050] Exemplarily, the step of scanning the central transmission conductor to obtain the film thickness at various locations may include: moving a detection probe along the path of the central transmission conductor within a plane parallel to the coplanar waveguide transmission line and emitting a detection signal to various locations on the central transmission conductor; and determining the film thickness at each location based on feedback signals from the detection signal at each location. The detection signal may be a terahertz signal or a laser signal. After the detection signal is reflected at different locations, different feedback signals are generated. Based on the collection and processing of these feedback signals, the film thickness at the corresponding location can be obtained. The detection signal may also be other signals that can detect changes in the thickness of a thin film circuit or relative distance.

[0051] In other embodiments, the characteristic information includes grayscale values, and the step of obtaining characteristic information of multiple positions of the central transmission conductor may include: generating a photograph of the coplanar waveguide transmission line based on the substrate on which the coplanar waveguide transmission line is formed; performing grayscale processing on the photograph, i.e., grayscaling the photograph to obtain a comparison photograph, wherein the comparison photograph contains grayscale information; determining multiple positions of the central transmission conductor along the path of the central transmission conductor on the comparison photograph, and scanning the central transmission conductor to obtain grayscale values at each position. The photograph may include at least one of a light microscopy photograph and an electron microscopy photograph. Grayscale value is a parameter that measures the brightness of each pixel in a grayscale image. A specific grayscale value range represents the brightness of a specific pixel. For example, a specific grayscale value range is represented by 0 to 255, with 0 representing the darkest and 255 representing the brightest, with larger grayscale values indicating brighter values. In this embodiment, the grayscale value of each position may be the average of the grayscale values of multiple pixels at the corresponding position.

[0052] It is understood that the grayscale values at locations on the substrate where the thin film is present (the ideal region where the central transmission conductor is located) should be within a first range, while the grayscale values at locations without the thin film (the ideal region where the ground gap is located) should be within a second range. These two ranges are clearly distinct and can both be predetermined. The aforementioned method for determining the location of a short circuit, after obtaining the grayscale values at various locations on the central transmission conductor, can identify locations with grayscale values in the second range as short circuit locations. The second range can be a preset range. Specifically, the step of scanning the central transmission conductor can start from one end of the first central transmission conductor 11 and scan along its path (i.e., the extension direction of the central transmission conductor) to the other end, thereby enabling relatively rapid determination of the short circuit location.

[0053] Only a single point is scanned at a time, and the accuracy of the disconnection position determined based on this is low. For example, when the scanned position happens to be a point-shaped void and the area around the point is a continuous thin film, the central transmission conductor is actually continuously conductive. However, the grayscale value of the scanned point-shaped void fluctuates greatly compared with the surrounding area, and it will be mistakenly identified as a disconnection position. In order to improve the accuracy of disconnection position determination, in a specific implementation, multiple points are scanned in parallel along the line width extension direction of the first central transmission conductor 11, that is, Figure 3 There are multiple points (positions) between the two arrows marked by the symbol W10 that are scanned simultaneously and the grayscale values of each point (position) are recorded, and the grayscale values of each point (position) recorded by a multi-point parallel scan are all in the second range. Only then are they identified as the circuit breaker position. Multi-point parallel scanning can determine the circuit breaker position more accurately. Figure 4 The diagram schematically shows the parallel scanning of three points, and all three points fall on the central transmission conductor. Along the scanning direction, the first scan (scan 1) obtains the grayscale values of the three points (positions), and the second scan (scan 2) also obtains the grayscale values of the three points (positions). If the grayscale values of multiple points (positions) scanned each time are all in the second range, they are identified as the open circuit position.

[0054] In some embodiments, the step of determining multiple positions of the center transmission conductor along the path direction of the center transmission conductor may include: providing a standard diagram, the standard diagram including a standard transmission line corresponding to the coplanar waveguide transmission line, the standard transmission line including a standard transmission conductor; determining multiple reference positions on the standard transmission conductor according to scanning requirements; and determining multiple positions of the center transmission conductor corresponding to the multiple reference positions. The standard diagram includes at least one of a photograph of a standard chip and a design drawing of a standard chip. The photograph of the standard chip may include at least one of an optical microscope photograph and an electron microscope photograph. Using the standard transmission conductor in the standard diagram as a reference standard facilitates determining the position information to be scanned, such as specific coordinates, in advance, to facilitate precise control of the scanning operation.

[0055] Method for determining short-circuit position of coplanar waveguide transmission line

[0056] In practice, to ensure the proper function of a coplanar waveguide transmission line, repair processes are often required at abnormal locations. However, identifying and locating the short-circuit location is a challenging issue. To this end, embodiments of the present application also provide a method for determining the short-circuit location of a coplanar waveguide transmission line, thereby identifying and locating the short-circuit defect location of the coplanar waveguide transmission line and facilitating the implementation of the repair process.

[0057] Combine Figure 1 and Figure 3 As shown, an embodiment of the present application provides a method for determining a short-circuit position of a coplanar waveguide transmission line, wherein the coplanar waveguide transmission line includes a central transmission conductor and grounds located on both sides of the central transmission conductor, and the gap between the central transmission conductor and the ground is a ground gap, comprising: first obtaining characteristic information of multiple positions of the ground gap, wherein the multiple positions are distributed along the extension direction of the ground gap; and then determining the short-circuit position electrically connecting the central transmission conductor and the ground based on the fluctuation of the characteristic information.

[0058] During the specific implementation of the short circuit location determination method, the characteristic information may be the film thickness or grayscale value of the ground gap at the plurality of locations, or other characteristic information that may reflect whether a thin film exists at a certain location of the ground gap.

[0059] In a specific implementation, this characteristic information can be acquired at each location using a scanning method. For example, within a plane parallel to the coplanar waveguide transmission line, a detection probe is moved along the extension direction of the ground gap and a detection signal is transmitted to each location within the ground gap. The film thickness at each location is determined based on the feedback signal of the detection signal at each location. In another example, multiple locations within the ground gap are determined along the extension direction of the ground gap, and the grayscale value of each location is acquired.

[0060] About the coplanar waveguide transmission line after the short circuit defect is repaired

[0061] The following is an example of a coplanar waveguide transmission line obtained after the short-circuit defect is repaired. Figure 3 The shape and structure of the second coplanar waveguide transmission line 2 having at least one short-circuit sensitive section.

[0062] See also Figure 3The second coplanar waveguide transmission line 2 includes a second central transmission conductor 11 and a second ground layer 22. A second standard section 201, a first short-circuit sensitive section 202, and a second short-circuit sensitive section 203 are distributed along the signal transmission direction of the second coplanar waveguide transmission line 2. The distance between the second standard area conductor 211 and the second ground layer 22 in the second standard area 201 is recorded as S20, the distance between the short-circuit area conductor 212 and the second ground layer 22 in the first short-circuit sensitive section 202 is recorded as S21, and the distance between the central transmission conductor and the second ground layer 22 in the second short-circuit sensitive section 103 is recorded as S22. The second coplanar waveguide transmission line 2 in this embodiment also has a structural feature that S21 and S22 are both greater than or equal to S20.

[0063] The specific implementation is not limited to the above form. As long as the second coplanar waveguide transmission line 2 is a coplanar waveguide transmission line having a standard interval and at least one short-circuit sensitive interval, and the spacing between the central transmission conductor and the ground layer in the short-circuit sensitive interval is greater than or equal to the spacing between the central transmission conductor and the ground layer in the standard interval, it can be used. It can be understood that if both S21 and S22 are greater than the spacing limit of S20, it will further help prevent adhesion between the central transmission conductor and the ground layer formed during the coating process, thereby reducing the occurrence of accidental short circuits.

[0064] This structural form in which the spacing is greater than the spacing between the center transmission conductor and the ground layer in the standard range can be achieved in the following manner.

[0065] In some embodiments of the present application, the grounding layer in the short-circuit sensitive area is recessed toward the side away from the center transmission conductor. For example, in combination with the above, the second grounding layer 22 in the first short-circuit sensitive area 202 adopts the above-mentioned recessed structure, and the line width of the short-circuit area conductor 212 can be consistent with the second standard area conductor 211. In this way, the distance between the center transmission conductor and the grounding layer in the short-circuit sensitive area can be relatively increased while maintaining the line width of the center transmission conductor. In another example, in combination with Figure 3 As shown, the second ground layer 22 in the first short-circuit sensitive area 202 adopts the aforementioned recessed structure, and the line width of the short-circuit area conductor 212 can also adopt a structure that is smaller than the line width of the second standard area conductor 211.

[0066] In some implementation examples, in order to maintain the consistency of the morphology of the ground layer, the structure of the central transmission conductor can be changed, such as the line width of the central transmission conductor in the short-circuit sensitive area is smaller than that of the central transmission conductor in the standard area. Figure 3As shown, the line width of the short-circuit area conductor 212 is smaller than the line width of the second standard area conductor 211. In some other implementation examples, the central transmission conductor in the short-circuit sensitive area and the central transmission conductor in the standard area are located in the same layer; specifically, Figure 3 As shown, the short-circuit area conductor 212 and the second standard area conductor 211 can be an integrated structure, which is convenient for one-time plating formation.

[0067] It should be noted that the first ground layer 12 and the second ground layer 22 can be the same thin film formed on the substrate. This application distinguishes them when introducing the first coplanar waveguide transmission line 1 and the second coplanar waveguide transmission line 2 for description purposes.

[0068] In addition, the standard interval is an interval where the abnormal portion of the coplanar waveguide transmission line does not appear, the disconnection sensitive interval is an interval where the disconnection portion of the coplanar waveguide transmission line appears, and the short-circuit sensitive interval is an interval where the short-circuit portion of the coplanar waveguide transmission line appears. The portion of the central transmission conductor in the standard interval is referred to herein as a standard zone conductor, the portion of the central transmission conductor in the disconnection sensitive interval is referred to herein as a disconnection zone conductor, and the portion of the central transmission conductor in the short-circuit sensitive interval is referred to herein as a short-circuit zone conductor.

[0069] Figure 5 A schematic structural diagram of a system for determining a break position of a coplanar waveguide transmission line provided in an embodiment of the present application.

[0070] See also Figure 5 Another aspect of the present application further provides a system for determining a break position of a coplanar waveguide transmission line corresponding to the above-mentioned method for determining a break position of a coplanar waveguide transmission line, wherein the system comprises the following modules:

[0071] An information acquisition module 501 is configured to acquire characteristic information of a plurality of positions of the central transmission conductor, wherein the plurality of positions are distributed along a path direction of the central transmission conductor;

[0072] The disconnection identification module 502 is configured to determine a disconnection position where the central transmission conductor is disconnected from the plurality of positions according to fluctuations in the characteristic information.

[0073] Corresponding to the method for determining the break position of a coplanar waveguide transmission line provided in an embodiment of the present application, based on the break position determination system provided in an embodiment of the present application, in order to solve the problem of how to inconvenience in identifying the break defects of the coplanar waveguide transmission line, the embodiment of the present application first obtains the characteristic information of multiple positions distributed along the path direction of the central transmission conductor through the information acquisition module 501, and then uses the break identification module 502 to determine the break position of the central transmission conductor in the multiple positions based on the fluctuation of the characteristic information, thereby being able to identify the break defect position of each coplanar waveguide transmission line on the quantum chip and achieve rapid positioning, which in turn helps to accurately and efficiently implement the repair process for the break defect.

[0074] Based on the above embodiment of a method for determining a break position of a coplanar waveguide transmission line, the present application also proposes a non-temporary computer storage medium having a computer program stored thereon. When the computer program is executed, the above embodiment of the method for determining a break position can be implemented.

[0075] Specifically, in this embodiment, the storage medium may be configured to store a computer program for executing the following steps S201 to S202:

[0076] Step S201: Acquire characteristic information of multiple positions of the central transmission conductor, wherein the multiple positions are distributed along the path direction of the central transmission conductor, such as Figure 1 The first coplanar waveguide transmission line 1, wherein the quantum bit structure is not shown;

[0077] Step S202: Determine a disconnection position where the central transmission conductor is broken from among the multiple positions according to fluctuations in the characteristic information.

[0078] An embodiment of the present application further provides a storage medium, wherein the storage medium stores a computer program, wherein the computer program is configured to execute the method for determining a circuit breaker position when running.

[0079] Specifically, in this embodiment, the above-mentioned storage medium may include but is not limited to: a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and other media that can store computer programs.

[0080] As described above, based on the method for determining the position of a circuit breaker in the above embodiment, the present application proposes an electronic device comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program so that when it is executed, the method for determining the position of a circuit breaker in the above embodiment can be implemented.

[0081] Specifically, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0082] Specifically, in this embodiment, the processor may be configured to execute the following steps S201 to S202 through a computer program:

[0083] Step S201: Acquire characteristic information of multiple positions of the central transmission conductor, wherein the multiple positions are distributed along the path direction of the central transmission conductor, such as Figure 1 The first coplanar waveguide transmission line 1, wherein the quantum bit structure is not shown;

[0084] Step S202: Determine a disconnection position where the central transmission conductor is broken from among the multiple positions according to fluctuations in the characteristic information.

[0085] It should be noted that the embodiments of the above-described system, storage medium, and electronic device have the same beneficial effects as the embodiments of the above-described method for determining the location of a disconnected circuit, and therefore are not described in detail here. For technical details not disclosed in the embodiments of the present application system, storage medium, and electronic device, those skilled in the art should refer to the description of the above-described preparation method for understanding, and to save space, they are not described here in detail.

[0086] It should be noted that the technical solutions of the embodiments of the present application can be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in the embodiments of the present application. The aforementioned storage medium can be a non-transient storage medium, including: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and other media that can store program code, or a transient storage medium.

[0087] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "embodiments of the present application," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0088] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the invention is defined by the claims and their equivalents.

[0089] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present application.

Claims

1. A method for determining a break position of a coplanar waveguide transmission line, characterized in that: The coplanar waveguide transmission line includes a central transmission conductor, and the method includes: Acquiring characteristic information of a plurality of positions of the central transmission conductor, the plurality of positions being distributed along a path direction of the central transmission conductor, the characteristic information including film thickness or grayscale value; and determining a disconnection position where the central transmission conductor is disconnected from the plurality of positions based on fluctuations in the characteristic information; The step of obtaining characteristic information of multiple positions of the central transmission conductor includes: A plurality of positions of the central transmission conductor are determined along a path direction of the central transmission conductor, and the central transmission conductor is scanned to obtain a film thickness or a grayscale value at each position.

2. The method according to claim 1, characterized in that The characteristic information includes film thickness, and the step of obtaining characteristic information of multiple positions of the central transmission conductor includes: providing a substrate having the coplanar waveguide transmission line formed thereon, the coplanar waveguide transmission line including the central transmission conductor; On the substrate, a plurality of positions of the central transmission conductor are determined along a path direction of the central transmission conductor, and the central transmission conductor is scanned to obtain a film thickness at each position.

3. The method according to claim 2, characterized in that The step of scanning the central transmission conductor to obtain the film thickness at each position includes: In a plane parallel to the coplanar waveguide transmission line, moving the detection probe along the path direction of the central transmission conductor and transmitting a detection signal to various positions of the central transmission conductor; The film thickness at each position is determined according to the feedback signal of the detection signal at each position.

4. The method according to claim 1, wherein The characteristic information includes a grayscale value, and the step of obtaining characteristic information of multiple positions of the central transmission conductor includes: generating a photograph of the coplanar waveguide transmission line based on the substrate on which the coplanar waveguide transmission line is formed; Performing grayscale processing on the photo to obtain a comparison photo; On the comparison photo, multiple positions of the central transmission conductor are determined along the path direction of the central transmission conductor, and the central transmission conductor is scanned to obtain a grayscale value of each position.

5. The method according to claim 4, characterized in that The photographs include at least one of light microscope photographs and electron microscope photographs.

6. The method according to claim 1, characterized in that The step of determining a plurality of positions of the central transmission conductor along the path direction of the central transmission conductor comprises: providing a standard diagram, wherein the standard diagram includes a standard transmission line corresponding to the coplanar waveguide transmission line, and the standard transmission line includes a standard transmission conductor; determining a plurality of reference positions on the standard transmission conductor according to scanning requirements; A plurality of positions of the center transmission conductor corresponding to the plurality of reference positions are determined.

7. The method according to claim 6, characterized in that The standard diagram includes at least one of a photo of a standard chip and a design diagram of a standard chip.

8. A system for determining the break position of a coplanar waveguide transmission line, characterized in that: The coplanar waveguide transmission line includes a central transmission conductor, including: an information acquisition module, configured to acquire characteristic information of a plurality of positions of the central transmission conductor, the plurality of positions being distributed along a path direction of the central transmission conductor, the characteristic information including film thickness or grayscale value; and a disconnection identification module, configured to determine a disconnection position where the central transmission conductor is disconnected from the plurality of positions based on fluctuations in the characteristic information; The information acquisition module is specifically configured to determine a plurality of positions of the central transmission conductor along the path direction of the central transmission conductor, and scan the central transmission conductor to acquire the film thickness or grayscale value of each position.

9. A storage medium, characterized in that: The storage medium stores a computer program, wherein the computer program is configured to execute the method according to any one of claims 1 to 7 when executed.

10. An electronic device comprising a memory and a processor, characterized in that: A computer program is stored in the memory, and the processor is configured to run the computer program to perform the method according to any one of claims 1 to 7.

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