A method of curved conformal antenna or circuit transfer printing and a curved conformal antenna or circuit

By photolithographically lithographically forming the surface contour and integrating the target antenna/circuit on a planar substrate, and using the sectional facet to approximate the non-stretchable surface to construct the polyhedral gap, the antenna/circuit on the non-stretchable substrate is transferred and bonded, thus solving the problem of low antenna/circuit accuracy on non-stretchable surfaces and achieving high-precision mass production and cost reduction.

CN116799473BActive Publication Date: 2026-06-19SUZHOU UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUZHOU UNIV
Filing Date
2023-05-16
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

When manufacturing antennas or circuits on large-area, complex curvature non-extensible curved surfaces, existing technologies suffer from low positional and dimensional accuracy, resulting in high product defect rates and increased costs.

Method used

By photolithographically tracing the surface contour and integrating the target antenna/circuit on a planar substrate, a polyhedral gap is constructed by approximating the non-stretchable surface with a sectional surface, which is then transferred to a flexible substrate and conformally bonded to the non-stretchable surface. The flexible substrate is then removed, achieving high-precision transfer.

Benefits of technology

This improved the positional and dimensional accuracy of antennas/circuits on non-stretchable surfaces, reduced the defect rate, enabled mass production, and lowered costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to a method for transferring curved conformal antennas / circuits and to a curved conformal antenna / circuit. The method involves approximating a non-stretchable surface using facets, with all facets forming a polyhedron of a stretchable surface. The gaps between the polyhedron and the non-stretchable surface constitute a surface profile. A curved micro / nano structure is obtained on a planar substrate through photolithography. This curved micro / nano structure is then transferred to a flexible substrate to fabricate a flexible curved micro / nano structure. A target antenna / circuit is fabricated on the flexible curved micro / nano structure to obtain a flexible curved antenna / circuit, which is then mass-produced. The flexible curved micro / nano structure with the target antenna / circuit is conformally bonded to the non-stretchable surface, and the target antenna / circuit is transferred to the non-stretchable surface. The flexible substrate is then removed, and the flexible curved antenna / circuit is transferred in parallel. This invention yields products with large surface area and high dimensional and positional accuracy, improving product yield, reducing costs, and enabling parallel transfer of curved conformal antennas / circuits.
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Description

Technical Field

[0001] This invention relates to the technical field of curved antenna or circuit manufacturing, and in particular to a method for transferring a curved conformal antenna or circuit and a curved conformal antenna or circuit. Background Technology

[0002] With the promotion of curved electronic products and the continuous development and improvement of microelectronic manufacturing processes, many new application areas have emerged, such as curved displays and wearable smart products.

[0003] Currently, curved integrated circuits are manufactured by spin-coating photoresist onto a curved substrate, followed by exposure, development, and etching using laser projection. While this method employs the patterning concept of etching technology and utilizes laser technology to improve projection stability, or by direct bonding and transfer methods, it cannot meet the requirements for manufacturing antennas / circuits on large-area, complex curvature non-ductile surfaces. Because non-ductile surfaces have multiple surfaces with different curvatures, these methods result in low positional and dimensional accuracy of antennas / circuits, easily leading to defective products and increasing costs. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the shortcomings of existing technologies, such as patterning with etching technology and improving projection stability with laser technology, or direct bonding and transfer methods, which cannot meet the requirements for manufacturing antennas or circuits on large-area, complex curvature non-ductile surfaces. Since non-ductile surfaces have multiple surfaces with different curvatures, the positional and dimensional accuracy of the manufactured antennas or circuits is low.

[0005] To solve the above-mentioned technical problems, the present invention provides a method for transferring curved conformal antennas or circuits, including...

[0006] S1: Using tangents to approximate non-extensible surfaces, all the tangents form a polyhedron of extensible surfaces, and the gap between the polyhedron and the non-extensible surfaces forms the surface profile.

[0007] S2: A curved micro / nano structure is obtained on a planar substrate by photolithography. The curved micro / nano structure includes a target antenna / circuit and the surface contour. The target antenna / circuit and the surface contour are fabricated as an integral unit. The curved micro / nano structure is transferred onto a flexible substrate to batch-produce flexible curved micro / nano structures. The target antenna / circuit is fabricated on the flexible curved micro / nano structure to obtain a flexible curved antenna / circuit. The flexible curved antenna / circuit is mass-grown.

[0008] S3: A flexible curved micro / nano structure with a target antenna / circuit is conformally bonded to a non-stretchable curved surface. The target antenna / circuit is transferred to the non-stretchable curved surface, and the flexible substrate is removed. The flexible curved antenna / circuit can be transferred in parallel.

[0009] In one embodiment of the present invention, in step S1, the surface profile is obtained by computer modeling, and there is a gap between the polyhedron and the non-extensible curved surface. The polyhedron is unfolded into a two-dimensional plane, and the shape of the gap forms the surface profile on the two-dimensional plane.

[0010] In one embodiment of the present invention, step S2, which involves transferring the curved micro / nano structure onto a flexible substrate to obtain the flexible micro / nano structure, includes:

[0011] A nickel template corresponding to the curved micro-nano structure is obtained by electroplating on the curved micro-nano structure, and the appearance on the nickel template is complementary to the surface contour on the curved micro-nano structure.

[0012] A flexible curved micro / nano structure is fabricated by transferring the nickel template onto the UV adhesive of the flexible substrate using ultraviolet nanoimprinting. The morphology on the flexible curved micro / nano structure is complementary to the morphology on the nickel template.

[0013] In one embodiment of the present invention, in step S2, the flexible micro-nano structure is pre-treated with conductive paste, and after surface treatment, it is placed in an electroplating tank for electroplating. After a set time and current, when the set parameter index is reached, the target antenna / circuit is obtained at the flexible curved micro-nano structure.

[0014] In one embodiment of the present invention, in step S3, the flexible curved micro / nano structure with the target antenna / circuit is conformally bonded to the non-stretchable curved surface. After bonding for a set time with the aid of external means, the flexible substrate is removed.

[0015] In one embodiment of the present invention, the surface treatment includes surface cleaning and surface wiping.

[0016] In one embodiment of the present invention, the planar substrate includes a glass substrate and a plastic substrate.

[0017] In one embodiment of the present invention, the flexible substrate includes a PET film, a PMMA film, or a polyimide film.

[0018] A curved conformal antenna / circuit is fabricated using the curved conformal antenna / circuit transfer method as described in any of the above embodiments.

[0019] In one embodiment of the present invention, a target substrate and an antenna / circuit are included, the antenna / circuit being disposed on the target substrate.

[0020] The technical solution of the present invention has the following advantages compared with the prior art:

[0021] The curved conformal antenna / circuit transfer method and the curved conformal antenna / circuit described in this invention utilize tangential surfaces to approximate a non-stretchable surface. Multiple tangential surfaces are formed on the non-stretchable surface, and all tangential surfaces constitute a polyhedron of the stretchable surface, which can be unfolded into a two-dimensional plane. A surface profile is constructed by filling the gap between the surfaces of this polyhedron and the non-stretchable surface. During bonding, this surface profile can achieve complete bonding with the non-stretchable surface, overcoming the problem of difficulty in transferring antennas / circuits due to boundaries on non-stretchable surfaces. Simultaneously, the surface profile and the target antenna / circuit are photolithographically etched on a planar substrate to obtain a curved micro / nano structure. That is, the surface profile and the target antenna / circuit are integrally formed, ensuring the positional and dimensional accuracy of the antenna / circuit. Furthermore, photolithography technology offers high precision, enabling the realization of large-amplitude curved micro / nano structures. The high-precision fabrication of the structure is suitable for both large-scale and small-scale manufacturing, exhibiting strong versatility. Transferring this curved micro / nano structure onto a flexible substrate allows for the mass production of flexible curved micro / nano structures. The flexible material facilitates bonding to non-stretchable surfaces. Target antennas / circuits are fabricated on the flexible curved micro / nano structure, resulting in flexible curved antennas / circuits that can be mass-produced. Subsequently, the flexible curved micro / nano structure with the target antenna / circuit is bonded to the non-stretchable surface. Because its surface profile perfectly matches the non-stretchable surface, and the surface profile is integrated with the target antenna / circuit, the positional and dimensional accuracy of the target antenna / circuit transferred onto the non-stretchable surface is significantly improved. Finally, the flexible substrate is removed, and the flexible curved antennas / circuits can be transferred in parallel to obtain a conformal curved antenna / circuit. This transfer printing method produces products with large surface areas and high dimensional and positional accuracy, improving product yield and reducing costs. Furthermore, the use of nanotechnology enables the mass production of flexible curved micro / nano structures and the mass growth of flexible curved circuits, thereby achieving parallel transfer printing of conformal antennas / circuits and providing a technical solution and process foundation for the large-scale application of conformal antennas / circuits. Attached Figure Description

[0022] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0023] Figure 1 This is a flowchart of the conformal antenna / circuit transfer method of the present invention;

[0024] Figure 2 This is a schematic diagram of step S2 in the curved conformal antenna / circuit transfer method of the present invention;

[0025] Figure 3This is a three-dimensional schematic diagram of step S1 in the curved conformal antenna / circuit transfer method of the present invention;

[0026] Figure 4 This is a three-dimensional schematic diagram of step S2 in the curved conformal antenna / circuit transfer method of the present invention;

[0027] Figure 5 This is a three-dimensional schematic diagram of step S3 in the curved conformal antenna / circuit transfer method of the present invention;

[0028] Explanation of reference numerals in the accompanying drawings: 1. Non-stretchable surface; 2. Polyhedron; 4. Surface profile; 5. Target antenna / circuit; 6. Planar substrate; 61. Photoresist; 7. Nickel template; 8. Flexible substrate; 81. UV adhesive. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention. Example 1

[0030] Please refer to Figures 1-5 As shown, this invention provides a method for transferring curved conformal antennas / circuits, including...

[0031] S1: Using the tangent to approximate the non-extendable surface 1, all the tangents form a polyhedron 2 of an extensible surface, and the gap between the polyhedron 2 and the non-extendable surface 1 forms the surface profile 4.

[0032] S2: A curved micro / nano structure is obtained on a planar substrate 6 by photolithography. The curved micro / nano structure includes a target antenna / circuit 5 and the above-mentioned surface contour 4. The target antenna / circuit 5 and the surface contour 4 are fabricated as an integral unit. The curved micro / nano structure is transferred onto a flexible substrate 8 to obtain a batch of flexible curved micro / nano structures. The target antenna / circuit 5 is fabricated on the flexible curved micro / nano structure to obtain a flexible curved antenna / circuit. The flexible curved antenna / circuit is mass-grown.

[0033] S3: The flexible curved micro / nano structure with the target antenna / circuit 5 is conformally bonded to the non-stretchable curved surface 1, and the target antenna / circuit 5 is transferred to the non-stretchable curved surface 1. The flexible substrate 8 is removed, and the flexible curved antenna / circuit can be transferred in parallel.

[0034] In this invention, the extensible surface is a developable surface, that is, a surface that can be unfolded into a plane, such as a cylindrical surface or a conical surface. The non-extensible surface is a non-developable surface, that is, a surface that cannot be unfolded into a plane, such as an ellipse or an elliptic parabola.

[0035] This conformal antenna / circuit transfer method utilizes facets to approximate a non-stretchable surface 1. Multiple facets are formed on the non-stretchable surface 1, and all facets combine to form a polyhedron 2 of a stretchable surface, which can be unfolded into a two-dimensional plane. A surface profile 4 is constructed between the surfaces of the polyhedron 2 and the non-stretchable surface 1. During bonding, this surface profile 4 can achieve complete bonding with the non-stretchable surface 1, overcoming the problem of difficulty in transferring antennas / circuits due to boundaries on the non-stretchable surface 1. Simultaneously, the surface profile 4 and the target antenna / circuit 5 are photolithographically etched on a planar substrate 6 to obtain a curved micro / nano structure. That is, the surface profile 4 and the target antenna / circuit 5 are integrally formed, ensuring the positional and dimensional accuracy of the antenna / circuit. Furthermore, photolithography technology offers high precision, enabling the fabrication of large-scale curved micro / nano structures. It is suitable for both large-scale and small-scale manufacturing and has strong versatility. By transferring this curved micro / nano structure onto a flexible substrate 8, flexible curved micro / nano structures can be mass-produced. The flexible material is easy to attach to the non-stretchable curved surface 1. The target antenna / circuit 5 is fabricated on the flexible curved micro / nano structure to obtain the flexible curved antenna / circuit. The flexible curved antenna / circuit can be mass-grown. Then, the flexible curved micro / nano structure with the target antenna / circuit 5 is attached to the non-stretchable curved surface 1. Since its surface contour 4 completely matches the non-stretchable curved surface 1 and the surface contour 4 is integrated with the target antenna / circuit 5, the positional accuracy and dimensional accuracy of the target antenna / circuit 5 transferred to the non-stretchable curved surface 1 are greatly improved. Finally, the flexible substrate 8 is removed, and the flexible curved antenna / circuit can be transferred in parallel to obtain the curved conformal antenna / circuit. This transfer method produces products with large areas and high dimensional and positional accuracy, improving product yield and reducing costs. Furthermore, nanotechnology enables the mass production of flexible curved micro / nano structures and the mass growth of flexible curved circuits, thereby achieving parallel transfer of curved conformal antennas / circuits and providing a technical solution and process foundation for the large-scale application of curved conformal antennas / circuits.

[0036] Specifically, such as Figure 3 As shown, in step S1, the surface profile 4 obtained in this step is obtained through computer modeling. The specific decomposition process is as follows: multiple cut surfaces are set on the non-extendable surface 1. According to the surface of the non-extendable surface 1 to be transferred antenna / circuit, the appropriate number of cut surfaces is selected. There is a gap between each cut surface and the non-extendable surface 1. The cut surfaces corresponding to each region of the non-extendable surface 1 are connected in sequence to form a polyhedron 2 of the extensible surface. There are multiple gaps between the polyhedron 2 and the non-extendable surface. The polyhedron 2 can be unfolded into a two-dimensional plane. The appearance of the gaps and the undulations on the two-dimensional plane form the surface profile 4. That is, the surface profile 4 can completely match the non-extendable surface.

[0037] Among them, such as Figure 2 and Figure 4As shown, in step S2, photoresist 61 is coated on the planar substrate 6, which can be performed by spin coating. Photolithography can be used to fabricate large-format curved micro / nano structures; specifically, the planar substrate 6 includes a glass substrate and a plastic substrate, which can be PET or PC. After photolithography, the surface contour 4 of the curved micro / nano structure has a distribution pattern of the target antenna / circuit 5. Figure 2 The enlarged image shows the distribution pattern of the target antenna / circuit 5. The steps for mass-producing flexible curved micro / nano structures by transferring the curved micro / nano structure onto the flexible substrate 8 include: obtaining a nickel template 7 corresponding to the curved micro / nano structure through electroplating; and transferring the nickel template 7 onto a UV adhesive 81 of the flexible substrate 8 using ultraviolet nanoimprinting to obtain the flexible curved micro / nano structure. The morphology on the flexible curved micro / nano structure is complementary to the morphology on the nickel template 7, allowing for mass production of the curved micro / nano structure. The flexible curved micro / nano structure with the target antenna / circuit 5 is then conformally bonded to the non-stretchable curved surface 1, thus transferring the target antenna / circuit 5 onto the non-stretchable curved surface. The surface profile 4 obtained in step S1 perfectly matches the target non-stretchable surface 1. That is, the surface profile 4 on the curved micro / nano structure also perfectly matches the non-stretchable surface 1. The appearance of the nickel template 7 obtained through electroplating is complementary to the surface profile 4 on the curved micro / nano structure. The appearance on the nickel template 7 is transferred to the flexible substrate 8 to obtain the flexible micro / nano structure. The appearance on the flexible curved micro / nano structure is complementary to the appearance on the nickel template 7, thus the appearance on the flexible micro / nano structure is consistent with the surface profile 4 on the curved micro / nano structure, i.e., perfectly matches the non-stretchable surface 1. In this embodiment, the metal template obtained through electroplating is a nickel template 7.

[0038] Specifically, the flexible substrate 8 can be any film such as PET film / PMMA film or polyimide film. When it is laminated and transferred onto the non-stretchable curved surface 1, it fits better and is more convenient. Finally, after the antenna / circuit transfer is successful, the film can be removed.

[0039] Furthermore, during the nanoimprinting process, a UV adhesive 81 is coated on the surface of the flexible substrate 8, and a nickel template 7 is used to imprint the UV adhesive 81 onto its surface using pressure. The UV adhesive 81 is an acrylate, vinyl ether, epoxy resin, or thiol / olefin UV imprinting adhesive, and the flexible substrate 8 is a PET film. The UV adhesive 81 is required to have good adhesion to the PET material, good thermal conductivity, and excellent etch resistance. The distribution pattern of the target antenna / circuit 5 appears on the surface of the UV adhesive 81 of the flexible micro / nano structure. Figure 2 The enlarged view of the second process structure is the distribution diagram of target antenna / circuit 5. Figure 2 The enlarged view of the fifth process structure is the target antenna / circuit 5 to be grown.

[0040] Furthermore, in step S2, a functional pretreatment is performed on the flexible micro / nano structure using a conductive paste. After surface treatment, the structure is placed in an electroplating bath for electroplating. After a set time and current are applied, when the set parameters are met, a flexible curved antenna / circuit is grown on the flexible curved micro / nano structure. Specifically, the surface treatment includes surface cleaning and surface erasure. Preferably, the conductive paste can be silver paste, which metallizes the target antenna / circuit 5 for growth.

[0041] In this embodiment, as Figure 5 As shown, in step S3, the flexible curved micro / nano structure with the target antenna / circuit 5 conformally fits to the non-stretchable curved surface 1. After a set time of fitting, the flexible substrate 8 can be removed by applying external pressure, light, electric field, or other auxiliary means. In this process, the appearance of the flexible curved micro / nano structure is the same as the surface contour 4 on the curved micro / nano structure, that is, it can perfectly match the non-stretchable curved surface 1. When the flexible curved micro / nano structure is attached to the non-stretchable curved surface 1, the target antenna / circuit 5 on the curved micro / nano structure can be accurately transferred onto the non-stretchable curved surface 1, which can ensure the positioning accuracy of the transferred antenna / circuit. The target antenna / circuit 5 and the surface contour 4 are integrally formed, which can ensure the positional accuracy and dimensional accuracy of the transferred antenna / circuit. That is, the target antenna / circuit 5 can be completely and accurately transferred onto the non-stretchable curved surface 1, avoiding the occurrence of transferred antennas / circuits with low positional accuracy and dimensional accuracy, improving the manufacturing accuracy of electronic products, thereby ensuring a high product yield and reducing manufacturing costs. Using nanotechnology, the batch preparation of flexible curved micro / nano structures can be realized, and flexible curved circuits can be mass-grown and prepared, thereby realizing the parallel transfer of curved conformal antennas / circuits, providing technical solutions and process foundations for the large-scale application of curved conformal antennas / circuits. Example 2

[0042] This invention also provides a curved conformal antenna / circuit, fabricated using the aforementioned curved conformal antenna / circuit transfer method. This method offers high transfer efficiency, ensuring a large transfer area and high positional, dimensional, and positioning accuracy for the transferred antenna / circuit, thereby improving product yield and reducing costs. Utilizing nanotechnology, it enables the mass production of flexible curved micro / nano structures and the batch growth of flexible curved circuits, thus achieving parallel transfer of curved conformal antennas / circuits. This provides a technical solution and process foundation for the large-scale application of curved conformal antennas / circuits. Specifically, the curved conformal antenna / circuit includes a target substrate and an antenna / circuit, with the antenna / circuit mounted on the target substrate. The target substrate can be a non-stretchable surface 1, and the target antenna / circuit 5 can be transferred onto the target substrate using the aforementioned method with high precision and a low error rate. Alternatively, the target substrate can also be a stretchable surface, and the method is equally applicable. This method has a wide range of applications and facilitates the manufacture of high-precision products.

[0043] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A method for transferring a curved conformal antenna, characterized in that: include S1: Using tangents to approximate the non-extensible surface, all the tangents form a polyhedron of the extensible surface. The gap between the polyhedron and the non-extensible surface is used to construct the surface profile. Take a suitable number of tangents. There is a gap between each tangent and the non-extensible surface. The tangents corresponding to each region of the non-extensible surface are connected in sequence to form a polyhedron of the extensible surface. There are multiple gaps between the polyhedron and the non-extensible surface. The polyhedron can be unfolded into a two-dimensional plane. The appearance of the gaps and the undulations on the two-dimensional plane form the surface profile. That is, the surface profile can completely match the non-extensible surface. S2: A curved micro / nanostructure is obtained on a planar substrate by photolithography. The curved micro / nanostructure includes a target antenna and the surface contour. The target antenna and the surface contour are fabricated as an integral unit. The curved micro / nanostructure is transferred onto a flexible substrate to batch-produce flexible curved micro / nanostructures. The target antenna is fabricated on the flexible curved micro / nanostructure to obtain a flexible curved antenna. The flexible curved antenna is mass-grown. S3: A flexible curved micro / nano structure with a target antenna is conformally bonded to a non-stretchable curved surface. The target antenna is transferred to the non-stretchable curved surface, and the flexible substrate is removed. The flexible curved antenna can be transferred in parallel.

2. The transfer method for a conformal antenna with curved surfaces according to claim 1, characterized in that: In step S1, the surface profile is obtained by computer modeling. There is a gap between the polyhedron and the non-extensible curved surface. The polyhedron is unfolded into a two-dimensional plane, and the shape of the gap forms the surface profile on the two-dimensional plane.

3. The transfer method for a conformal antenna with curved surfaces according to claim 1, characterized in that: In step S2, the step of transferring the curved micro / nano structure onto a flexible substrate to obtain a flexible micro / nano structure includes: A nickel template corresponding to the curved micro-nano structure is obtained by electroplating on the curved micro-nano structure, and the appearance on the nickel template is complementary to the surface contour on the curved micro-nano structure. A flexible curved micro / nano structure is fabricated by transferring the nickel template onto the UV adhesive of the flexible substrate using ultraviolet nanoimprinting. The morphology on the flexible curved micro / nano structure is complementary to the morphology on the nickel template.

4. The transfer method for a conformal antenna with curved surfaces according to claim 1, characterized in that: In step S2, the curved micro-nano structure is pre-treated with conductive paste. After surface treatment, it is placed in an electroplating tank for electroplating. After a set time and current, when the set parameter index is reached, the target antenna is obtained at the flexible curved micro-nano structure.

5. The transfer method for a conformal antenna with curved surfaces according to claim 1, characterized in that: In step S3, the flexible curved micro / nano structure with the target antenna is conformally bonded to the non-stretchable curved surface. After a set bonding time with the aid of external means, the flexible substrate is removed.

6. The transfer method for a conformal antenna with curved surfaces according to claim 4, characterized in that: The surface treatment includes surface cleaning and surface wiping.

7. The transfer method for a conformal antenna with curved surfaces according to claim 1, characterized in that: The planar substrate includes a glass substrate and a plastic substrate.

8. The transfer method for a conformal antenna with curved surfaces according to claim 1, characterized in that: The flexible substrate includes PET film, PMMA film, or polyimide film.

9. A method for transferring a conformal circuit on a curved surface, characterized in that: include S1: Using tangents to approximate the non-extensible surface, all the tangents form a polyhedron of the extensible surface. The gap between the polyhedron and the non-extensible surface is used to construct the surface profile. Take a suitable number of tangents. There is a gap between each tangent and the non-extensible surface. The tangents corresponding to each region of the non-extensible surface are connected in sequence to form a polyhedron of the extensible surface. There are multiple gaps between the polyhedron and the non-extensible surface. The polyhedron can be unfolded into a two-dimensional plane. The appearance of the gaps and the undulations on the two-dimensional plane form the surface profile. That is, the surface profile can completely match the non-extensible surface. S2: A curved micro / nanostructure is obtained on a planar substrate by photolithography. The curved micro / nanostructure includes a target circuit and the surface contour, which are integrally fabricated. The curved micro / nanostructure is transferred onto a flexible substrate to batch-produce flexible curved micro / nanostructures. The target circuit is fabricated on the flexible curved micro / nanostructure to obtain a flexible curved circuit. The flexible curved circuit is mass-grown. S3: A flexible curved micro / nano structure with a target circuit is conformally bonded to a non-stretchable curved surface. The target circuit is transferred to the non-stretchable curved surface, and the flexible substrate is removed. The flexible curved surface circuit can be transferred in parallel.

10. The method for transferring a conformal circuit on a curved surface according to claim 9, characterized in that: In step S1, the surface profile is obtained by computer modeling. There is a gap between the polyhedron and the non-extensible curved surface. The polyhedron is unfolded into a two-dimensional plane, and the shape of the gap forms the surface profile on the two-dimensional plane.

11. The method for transferring a conformal circuit on a curved surface according to claim 9, characterized in that: In step S2, the step of transferring the curved micro / nano structure onto a flexible substrate to obtain a flexible micro / nano structure includes: A nickel template corresponding to the curved micro-nano structure is obtained by electroplating on the curved micro-nano structure, and the appearance on the nickel template is complementary to the surface contour on the curved micro-nano structure. A flexible curved micro / nano structure is fabricated by transferring the nickel template onto the UV adhesive of the flexible substrate using ultraviolet nanoimprinting. The morphology on the flexible curved micro / nano structure is complementary to the morphology on the nickel template.

12. The method for transferring a conformal circuit on a curved surface according to claim 9, characterized in that: In step S2, the curved micro-nano structure is pre-treated with conductive paste. After surface treatment, it is placed in an electroplating bath for electroplating. After a set time and current, when the set parameter index is reached, the target circuit is obtained on the flexible curved micro-nano structure.

13. The method for transferring a conformal circuit on a curved surface according to claim 9, characterized in that: In step S3, the flexible curved micro / nano structure with the target circuit is conformally bonded to the non-stretchable curved surface. After bonding for a set time with the aid of external means, the flexible substrate is peeled off.

14. The method for transferring a conformal circuit on a curved surface according to claim 12, characterized in that: The surface treatment includes surface cleaning and surface wiping.

15. The method for transferring a conformal circuit on a curved surface according to claim 9, characterized in that: The planar substrate includes a glass substrate and a plastic substrate.

16. The method for transferring a conformal circuit on a curved surface according to claim 9, characterized in that: The flexible substrate includes PET film, PMMA film, or polyimide film.