Heat dissipation structure, heat dissipation method, electronic device, and storage medium

Abstract

The present disclosure relates to a heat dissipation structure, a heat dissipation method, an electronic device and a storage medium. The heat dissipation structure comprises: a heat dissipation channel; the heat dissipation channel is arranged in a bearing part of the electronic device and surrounds a heat generating device of the electronic device; a first channel opening of the heat dissipation channel is communicated with an audio device of the electronic device, and sound waves output by the audio device can drive air in the heat dissipation channel to vibrate; a second channel opening of the heat dissipation channel is communicated with an external environment, and is used for dissipating heat in the heat dissipation channel to the external environment; wherein the first channel opening and the second channel opening are two channel openings of the heat dissipation channel. In the present application, the heat dissipation channel is arranged in the bearing part around the heat generating device, the heat in the heat dissipation channel is dissipated to the external environment by driving the air to vibrate by the sound waves, and the heat dissipation of the electronic device is realized, thereby improving the heat dissipation efficiency of the electronic device without occupying the space in the electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of information processing technology, and in particular to a heat dissipation structure, heat dissipation method, electronic device, and storage medium. Background Technology

[0002] With the application of 5G and the continuous improvement of charging power, electronic devices are experiencing increasingly severe heat generation. When the temperature rises above a threshold, the system limits the performance of the electronic device and reduces the charging power to prevent overheating. Therefore, improving the heat dissipation efficiency of electronic devices can allow them to maintain high performance / high charging speed for longer periods, significantly enhancing product competitiveness. However, due to the extremely compact internal space of electronic devices, active cooling fans and other similar devices cannot be applied, which is detrimental to improving heat dissipation efficiency. Summary of the Invention

[0003] This disclosure provides a heat dissipation structure, a heat dissipation method, an electronic device, and a storage medium.

[0004] A first aspect of this disclosure provides a heat dissipation structure used in an electronic device, comprising:

[0005] Heat dissipation channel; the heat dissipation channel is formed on the carrier of the electronic device and surrounds the heat-generating components of the electronic device;

[0006] The first channel opening of the heat dissipation channel is connected to the audio device of the electronic device, and the sound waves output by the audio device can cause the air in the heat dissipation channel to vibrate.

[0007] The second channel opening of the heat dissipation channel is connected to the external environment and is used to dissipate the heat in the heat dissipation channel to the external environment; wherein the first channel opening and the second channel opening are two channels connected to the heat dissipation channel.

[0008] In some embodiments, a groove is formed on the carrier surrounding the heating device; a heat dissipation component is encapsulated in the upper opening of the groove; and a heat dissipation channel is formed in the groove.

[0009] In some embodiments, the carrier of the electronic device is further provided with an air intake channel communicating with the external environment; the air intake channel is connected to the heat dissipation channel and is used to input air from the external environment into the heat dissipation channel.

[0010] In some embodiments, it also includes:

[0011] A compression structure is located at the air inlet of the air intake channel. When the compression structure is in a compressed state, it closes the air inlet of the air intake channel and compresses the air in the air intake channel into the heat dissipation channel.

[0012] When the compression structure is in an uncompressed state, the air intake channel is connected to the external environment through the air intake port.

[0013] In some embodiments, the compression structure is located in the edge region of the carrier near the electronic device; the compression structure exposes a first surface of the electronic device for bearing a pressing force; the compression structure is embedded in a second surface of the carrier opposite the first surface, which has an elastic structure;

[0014] The elastic structure is used to restore the compression structure to the non-compressed state when the compression structure is not bearing the pressing force.

[0015] In some embodiments, the side of the compression structure that contacts the carrier has a sealing structure; when the compression structure is in a compressed state, the sealing structure contacts the air inlet of the air intake channel to seal the air inlet.

[0016] In some embodiments, the side of the compression structure that contacts the carrier has a limiting structure; the limiting structure is inserted into a limiting groove corresponding to the carrier; the limiting structure is movable within the limiting groove.

[0017] A second aspect of this disclosure provides a heat dissipation method, wherein a heat dissipation channel is provided on the carrier of the electronic device, the heat dissipation channel surrounds the heat-generating device of the electronic device; a first channel opening of the heat dissipation channel is connected to the audio device of the electronic device; a second channel opening of the heat dissipation channel is connected to the external environment; wherein the first channel opening and the second channel opening are two channel openings connected to each other in the heat dissipation channel.

[0018] The method includes:

[0019] Based on the heat generated by the heating element of the terminal device, determine the parameters of the sound waves to be emitted by the audio device;

[0020] According to the parameters, the audio device is controlled to emit sound waves; the sound waves drive the air in the heat dissipation channel to vibrate through the first channel opening of the heat dissipation channel, and dissipate the heat in the heat dissipation channel to the external environment through the second channel opening of the heat dissipation channel.

[0021] In some embodiments, the parameters of the sound wave include at least the frequency of the sound wave;

[0022] The method of determining the parameters for the audio device to emit sound waves based on the heat generated by the heating element of the terminal device includes:

[0023] The frequency of the sound waves to be emitted by the audio device is determined based on the heat generated by the heating element of the terminal device.

[0024] In some embodiments, determining the frequency of the sound waves to be emitted by the audio device based on the heat generated by the heating element of the terminal device includes at least:

[0025] When it is determined that the heat generated by the heating device exceeds a first preset threshold, the frequency at which the audio device emits the sound wave is determined to be the first frequency.

[0026] When it is determined that the heat generated by the heating device exceeds the second preset threshold, the frequency at which the audio device will emit the sound wave is determined to be the second frequency; wherein the second preset threshold is greater than the first preset threshold, and the second frequency is greater than the first frequency.

[0027] In some embodiments, it also includes:

[0028] When the heat generated by the heating device exceeds a first preset threshold, the compression structure is controlled to enter a compression state, and the air in the compressed air intake channel enters the heat dissipation channel; the air entering the heat dissipation channel is used to expel the air in the heat dissipation channel to the external environment;

[0029] When the heat generated by the heating device does not exceed the first preset threshold, the compression structure is controlled to be in an uncompressed state, and air from the external environment enters the air intake channel through the air inlet of the air intake channel; wherein, the air intake channel is opened on the carrier of the electronic device and communicates with the external environment, and the air intake channel is connected to the heat dissipation channel.

[0030] In some embodiments, determining the heat generated by the heating device includes:

[0031] By determining the power and operating time of the heating device, the heat generated by the heating device is determined, and / or,

[0032] The heat generated by the heating device is monitored by a thermal sensor.

[0033] A third aspect of the present disclosure provides an electronic device, including: a carrier, a heat-generating device, an audio device, and the heat dissipation structure described in the first aspect;

[0034] A processor and a memory for storing a computer program capable of running on the processor, wherein the processor, when running the computer program, performs the steps of the method described in the second aspect.

[0035] A fourth aspect of this disclosure provides a computer-readable storage medium having a computer program stored thereon, characterized in that the computer program, when executed by a processor, implements the steps of the method described in the second aspect.

[0036] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0037] The heat dissipation structure in this embodiment includes: a heat dissipation channel; the heat dissipation channel is formed on the carrier of the electronic device, surrounding the heat-generating component of the electronic device; a first channel opening of the heat dissipation channel is connected to the audio device of the electronic device, and the sound waves output by the audio device can cause the air inside the heat dissipation channel to vibrate; a second channel opening of the heat dissipation channel is connected to the external environment, used to dissipate the heat inside the heat dissipation channel to the external environment; wherein the first channel opening and the second channel opening are two connected channels of the heat dissipation channel. This application achieves heat dissipation of the electronic device by forming a heat dissipation channel on the carrier around the heat-generating component, and by using sound waves to drive air vibration to dissipate the heat inside the heat dissipation channel to the external environment, thereby improving the heat dissipation efficiency of the electronic device without occupying internal space.

[0038] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0039] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0040] Figure 1 This is a schematic diagram of a heat dissipation structure according to an exemplary embodiment.

[0041] Figure 2 This is a schematic diagram of the structure of an audio device in a heat dissipation structure according to an exemplary embodiment.

[0042] Figure 3 This is a schematic diagram of the compression structure in a heat dissipation structure according to an exemplary embodiment.

[0043] Figure 4 This is a flowchart illustrating a heat dissipation method according to an exemplary embodiment.

[0044] Figure 5 This is a device block diagram illustrating an electronic device according to an exemplary embodiment. Detailed Implementation

[0045] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0046] With the application of 5G and the continuous improvement of charging power, electronic devices are experiencing increasingly severe heat generation. When the temperature rises above a threshold, the system limits the performance of the electronic device and reduces the charging power to prevent overheating. Therefore, improving the heat dissipation efficiency of electronic devices can allow them to maintain high performance / high charging speed for longer periods, significantly enhancing product competitiveness. However, due to the extremely compact internal space of electronic devices, active cooling fans and other similar devices cannot be applied, which is detrimental to improving heat dissipation efficiency.

[0047] This disclosure provides a heat dissipation structure. Figure 1 This is a schematic diagram illustrating a heat dissipation structure according to an exemplary embodiment. For example... Figure 1 As shown,

[0048] Heat dissipation structures, used in electronic devices, include:

[0049] Heat dissipation channel 10; the heat dissipation channel 10 is formed on the carrier of the electronic device and surrounds the heat-generating device 14 of the electronic device;

[0050] The first channel opening 12 of the heat dissipation channel 10 is connected to the audio device 11 of the electronic device, and the sound waves output by the audio device 11 can drive the air in the heat dissipation channel 10 to vibrate.

[0051] The second channel opening 13 of the heat dissipation channel 10 is connected to the external environment and is used to dissipate the heat in the heat dissipation channel 10 to the external environment; wherein the first channel opening 12 and the second channel opening 13 are two channels connected to the heat dissipation channel.

[0052] In this embodiment, the electronic device can be a mobile phone, iPad, laptop, or other terminal device. The audio device can include an audio output device or an audio input device; the audio output device can include a speaker, earpiece, or other device capable of emitting sound waves; the audio input device can include a microphone, etc. The first channel port is connected to the sound wave output port of the audio device. The vibration of the diaphragm of the earpiece or speaker can cause the air in the heat dissipation channel to vibrate. The second channel port can be a heat dissipation hole opened on the carrier, or a speaker hole or microphone hole on the top of the electronic device, etc. In this embodiment, the carrier can be the middle frame of the electronic device used to support the circuit board or components.

[0053] In this embodiment of the disclosure, the heat dissipation channel is arranged around high heat-generating devices (such as CPU processors / PMIC power management integrated circuits / WIFI wireless network modules / RF modules / screen driver chips and cameras, etc.). Figure 1(This is just an example; the actual location of the heat source device shall prevail.) The heat generated by the heat source is conducted to the heat dissipation channel through the carrier. When the user needs the audio device (earpiece / speaker) to produce sound, the diaphragm vibrates, causing the air in the heat dissipation channel to vibrate, dissipating the heat to the second channel opening of the heat dissipation channel without increasing additional power consumption to achieve the purpose of heat dissipation. When the user does not need the earpiece / speaker to produce sound, the system can control the audio device to emit ultrasonic / infrasonic vibrations (without affecting the user's experience of using electronic devices) according to the amount of heat, to dissipate the heat.

[0054] The heat dissipation structure in this embodiment includes: a heat dissipation channel; the heat dissipation channel is formed on the carrier of the electronic device, surrounding the heat-generating component of the electronic device; a first channel opening of the heat dissipation channel is connected to the audio device of the electronic device, and the sound waves output by the audio device can cause the air inside the heat dissipation channel to vibrate; a second channel opening of the heat dissipation channel is connected to the external environment, used to dissipate the heat inside the heat dissipation channel to the external environment; wherein the first channel opening and the second channel opening are two connected channels of the heat dissipation channel. This application achieves heat dissipation of the electronic device by forming a heat dissipation channel on the carrier around the heat-generating component, and by using sound waves to drive air vibration to dissipate the heat inside the heat dissipation channel to the external environment, thereby improving the heat dissipation efficiency of the electronic device without occupying internal space.

[0055] In some embodiments, such as Figure 1 As shown, the carrier has a groove surrounding the heating device; a heat sink 15 is encapsulated in the upper opening of the groove 19; and a heat dissipation channel 10 is formed in the groove 19.

[0056] In this embodiment of the present disclosure, the heat sink can accelerate the conduction of heat generated by the heat source to the heat dissipation channel through the carrier, thereby improving the heat dissipation efficiency of the heat dissipation channel. Figure 2 This is a schematic diagram illustrating the structure of an audio device in a heat dissipation structure according to an exemplary embodiment. For example... Figure 2 As shown, the audio device communicates with the heat dissipation channel 10, and the heat sink 15 is encapsulated in the upper opening of the recess. The audio device includes at least a decorative element 18 and a diaphragm 17. The diaphragm is used to vibrate and generate sound, driving the air in the heat dissipation channel to vibrate. The decorative element 18 is used to seal the sound wave output hole in the carrier corresponding to the audio device. The heat sink may include graphite sheets, graphene, or a heat spreader, etc.

[0057] In some embodiments, the carrier of the electronic device is further provided with an air intake channel communicating with the external environment; the air intake channel is connected to the heat dissipation channel and is used to input air from the external environment into the heat dissipation channel.

[0058] In this embodiment, the air intake channel is located on the support member and does not occupy the internal space of the electronic device. The air intake channel is connected to the heat dissipation channel, which helps to accelerate air circulation inside the electronic device, thereby improving the heat dissipation efficiency of the heat dissipation channel.

[0059] In some embodiments, it also includes:

[0060] Compression structure; Figure 3 This is a schematic diagram of the compression structure in a heat dissipation structure according to an exemplary embodiment. For example... Figure 3 As shown, the compression structure 20 is located at the air inlet 21 of the air intake channel; when the compression structure 20 is in a compressed state, the compression structure 20 closes the air inlet 21 of the air intake channel and compresses the air in the air intake channel 16 into the heat dissipation channel.

[0061] When the compression structure 20 is in an uncompressed state, the air intake channel 16 is connected to the external environment through the air intake port 21.

[0062] In this embodiment, the compression structure is located near the air inlet within the air intake channel and can move within the air intake channel to compress the air within it. When the compression structure is in a compressed state, it closes the air inlet of the air intake channel and compresses the air in the air intake channel into the heat dissipation channel. When the compression structure is in a non-compressed state, air from the external environment enters the air intake channel through the air inlet, thereby facilitating airflow within the heat dissipation channel through the compression structure and improving the heat dissipation efficiency of the heat dissipation channel. This compression structure is a physical structure and can be manually pressed into the electronic device without increasing power consumption. The compression structure can also be electrically controlled to compress the air in the air intake channel into the heat dissipation channel.

[0063] When the compression structure is manually pressed into the electronic device, a pressing force is applied to the compression structure, causing it to compress the air in the intake channel into the heat dissipation channel.

[0064] In this embodiment, the audio device and the compression structure can be used together, and the user can use any method to accelerate heat dissipation. For example, when the user is using the earpiece / speaker to emit sound, manually activating the compression structure can achieve rapid heat dissipation without increasing additional power consumption.

[0065] When users do not need the earpiece / speaker to produce sound, but still want to dissipate heat quickly, they can choose to activate the compression structure separately as needed.

[0066] In some embodiments, such as Figure 3As shown, the compression structure is located in the edge region of the carrier near the electronic device; the compression structure exposes a first surface of the electronic device to bear the pressing force; the compression structure is embedded in a second surface of the carrier opposite the first surface, which has an elastic structure 23.

[0067] The elastic structure 23 is used to restore the compression structure to the non-compressed state when the compression structure is not bearing the pressing force.

[0068] In this embodiment, when the compression structure moves through the air intake channel under external pressing force, the compression structure exposes a first surface of the electronic device capable of withstanding the pressing force. When the pressing force is released, the elastic structure 23 allows the compression structure to return to an uncompressed state. The elastic structure may include a spring.

[0069] In some embodiments, such as Figure 3 As shown, the side of the compression structure 20 that contacts the carrier has a sealing structure 22; when the compression structure is in a compressed state, the sealing structure 22 contacts the air inlet 21 of the air intake channel and seals the air inlet 21.

[0070] In this embodiment, the sealing structure may surround the side of the compression structure that contacts the carrier. The sealing structure may be silicone sealant, used to seal the air inlet when the compression structure is in a compressed state, so that the compressed gas can enter the heat dissipation channel.

[0071] In this embodiment of the present disclosure, the air inlet of the air intake channel can be located at the bottom of the compression structure, and the sealing structure just seals the air inlet when the compression structure is in a compressed state.

[0072] In some embodiments, such as Figure 3 As shown, the side of the compression structure 20 that contacts the carrier has a limiting structure 24; the limiting structure 24 is inserted into the limiting groove corresponding to the carrier; the limiting structure 24 can move in the limiting groove.

[0073] In this embodiment, the limiting structure is part of the compression structure and is inserted into the limiting groove corresponding to the bearing member. It is used to limit the compression structure and prevent the compression structure from moving arbitrarily in the air intake channel, so that the compression structure can only move in the direction of the pressing force to compress the air in the air intake channel into the heat dissipation channel.

[0074] The active cooling solution provided in this application does not occupy additional space in the already limited motherboard area. The audio device effectively utilizes the wall thickness of the supporting components, improving space utilization. Meanwhile, a compression structure is added to the side button area where there is ample space.

[0075] The compression structure can significantly improve active heat dissipation efficiency without increasing additional power consumption, and allows users to independently control the heat dissipation speed and the temperature of electronic devices.

[0076] A second aspect of the present disclosure provides a heat dissipation method. Figure 4 This is a flowchart illustrating a heat dissipation method according to an exemplary embodiment. Figure 4 As shown, the heat dissipation method is applied in electronic devices.

[0077] The electronic device carrier has a heat dissipation channel that surrounds the heat-generating components of the electronic device; the first channel opening of the heat dissipation channel is connected to the audio device of the electronic device; the second channel opening of the heat dissipation channel is connected to the external environment; wherein the first channel opening and the second channel opening are two interconnected channels of the heat dissipation channel.

[0078] The method includes:

[0079] Step 10: Determine the parameters of the sound waves to be emitted by the audio device based on the heat generated by the heating element of the terminal device;

[0080] Step 11: According to the parameters, control the audio device to emit sound waves; the sound waves drive the air in the heat dissipation channel to vibrate through the first channel opening of the heat dissipation channel, and dissipate the heat in the heat dissipation channel to the external environment through the second channel opening of the heat dissipation channel.

[0081] In this embodiment, the electronic device can be a mobile phone, iPad, laptop, or other terminal device. The audio device can include a handset, speaker, or other device capable of emitting sound waves. The first channel port is connected to the sound wave output port of the audio device. The vibration of the diaphragm of the handset or speaker can cause the air in the heat dissipation channel to vibrate. The second channel port can be a heat dissipation hole opened on the carrier, or a speaker hole or microphone hole on the top of the electronic device.

[0082] In this embodiment of the disclosure, the heat dissipation channel is arranged around high heat-generating devices (such as CPU processors / PMIC power management integrated circuits / WIFI wireless network modules / RF modules / screen driver chips and cameras, etc.). Figure 1 (This is just an example; the actual location of the heat source device shall prevail.) The heat generated by the heat source is conducted to the heat dissipation channel through the carrier. When the user needs the audio device (earpiece / speaker) to produce sound, the diaphragm vibrates, causing the air in the heat dissipation channel to vibrate, dissipating the heat to the second channel opening of the heat dissipation channel without increasing additional power consumption to achieve the purpose of heat dissipation. When the user does not need the earpiece / speaker to produce sound, the system can control the audio device to emit ultrasonic / infrasonic vibrations (without affecting the user's experience of using electronic devices) according to the amount of heat, to dissipate the heat.

[0083] In this embodiment of the disclosure, the parameters of the sound wave include at least frequency. Since the heat generated by the heating device is different, sound waves of different frequencies can be used to drive air vibration in order to reasonably improve heat dissipation efficiency.

[0084] In this embodiment, a heat dissipation channel is provided. The heat dissipation channel is formed on the carrier of the electronic device, surrounding the heat-generating components of the electronic device. A first channel opening of the heat dissipation channel communicates with the audio device of the electronic device, and the sound waves output by the audio device can cause the air within the heat dissipation channel to vibrate. A second channel opening of the heat dissipation channel communicates with the external environment, used to dissipate the heat within the heat dissipation channel to the external environment. The first and second channel openings are two interconnected channels of the heat dissipation channel. This application achieves heat dissipation of the electronic device by forming a heat dissipation channel on the carrier around the heat-generating components and dissipating the heat within the heat dissipation channel to the external environment through sound wave-driven air vibration, thereby improving the heat dissipation efficiency of the electronic device without occupying internal space.

[0085] In some embodiments, the parameters of the sound wave include at least the frequency of the sound wave;

[0086] The method of determining the parameters for the audio device to emit sound waves based on the heat generated by the heating element of the terminal device includes:

[0087] The frequency of the sound waves to be emitted by the audio device is determined based on the heat generated by the heating element of the terminal device.

[0088] In this embodiment of the disclosure, the higher the frequency of the sound wave, the faster the air will vibrate. Therefore, when the heat generated by the heating device is large, a higher frequency sound wave can be used to drive the air to vibrate in order to accelerate the heat dissipation of the air.

[0089] In some embodiments, determining the frequency of the sound waves to be emitted by the audio device based on the heat generated by the heating element of the terminal device includes at least:

[0090] When it is determined that the heat generated by the heating device exceeds a first preset threshold, the frequency at which the audio device emits the sound wave is determined to be the first frequency.

[0091] When it is determined that the heat generated by the heating device exceeds the second preset threshold, the frequency at which the audio device will emit the sound wave is determined to be the second frequency; wherein the second preset threshold is greater than the first preset threshold, and the second frequency is greater than the first frequency.

[0092] In this embodiment of the disclosure, when determining the frequency of the sound wave, the specific sound wave frequency can be determined based on whether the heat generated by the heating device exceeds a corresponding preset threshold. The more heat generated by the heating device, the higher the corresponding sound wave frequency should be. For example, when the second preset threshold is greater than the first preset threshold, if the heat generated by the heating device exceeds the second preset threshold, ultrasonic waves of a second frequency can be used to drive air vibration. When the heat generated by the heating device is between the first and second preset thresholds, infrasound of a first frequency can be used to drive air vibration.

[0093] In some embodiments, it also includes:

[0094] When the heat generated by the heating device exceeds a first preset threshold, the compression structure is controlled to enter a compression state, and the air in the compressed air intake channel enters the heat dissipation channel; the air entering the heat dissipation channel is used to expel the air in the heat dissipation channel to the external environment;

[0095] When the heat generated by the heating device does not exceed the first preset threshold, the compression structure is controlled to be in an uncompressed state, and air from the external environment enters the air intake channel through the air inlet of the air intake channel; wherein, the air intake channel is opened on the carrier of the electronic device and communicates with the external environment, and the air intake channel is connected to the heat dissipation channel.

[0096] In this embodiment, the compression structure is located near the air inlet within the air intake channel and can move within the air intake channel to compress the air within it. When the compression structure is in a compressed state, it closes the air inlet of the air intake channel and compresses the air in the air intake channel into the heat dissipation channel. When the compression structure is in a non-compressed state, air from the external environment enters the air intake channel through the air inlet, thereby facilitating airflow within the heat dissipation channel through the compression structure and improving the heat dissipation efficiency of the heat dissipation channel. This compression structure is a physical structure and can be manually pressed into the electronic device without increasing power consumption. The compression structure can also be electrically controlled to compress the air in the air intake channel into the heat dissipation channel.

[0097] In this embodiment of the disclosure, the compression structure is located in the edge region of the carrier near the electronic device; the compression structure exposes a first surface of the electronic device to bear the pressing force; the compression structure is embedded in a second surface of the carrier opposite to the first surface, which has an elastic structure.

[0098] The elastic structure is used to restore the compression structure to the non-compressed state when the compression structure is not bearing the pressing force.

[0099] In this embodiment, when the compression structure moves through the air intake channel under external pressing force, the compression structure exposes a first surface of the electronic device capable of bearing the pressing force. When the pressing force is released, an elastic structure allows the compression structure to return to a non-compressed state. The elastic structure may include a spring.

[0100] In some embodiments, determining the heat generated by the heating device includes:

[0101] By determining the power and operating time of the heating device, the heat generated by the heating device is determined, and / or,

[0102] The heat generated by the heating device is monitored by a thermal sensor.

[0103] In this embodiment of the disclosure, the heat generated by the heating device can be determined by calculating the power and operating time, or by directly monitoring the heat generated by the heating device using a heat sensor.

[0104] A third aspect of this disclosure provides an electronic device, including: a carrier, a heat-generating device, an audio device, and a heat dissipation structure as described in the above embodiments;

[0105] A processor and a memory for storing a computer program capable of running on the processor, wherein the processor, when running the computer program, performs the steps of the method described in the above embodiments.

[0106] A fourth aspect of this disclosure provides a computer-readable storage medium having a computer program stored thereon, characterized in that the computer program, when executed by a processor, implements the steps of the method described in the above embodiments.

[0107] This disclosure also provides an electronic device, including a processor and a memory, wherein the memory stores a computer program that can run on the processor, and the processor, when running the computer program, performs the steps of the methods described in the various embodiments.

[0108] This disclosure also provides a computer-readable storage medium storing a computer program thereon, characterized in that the computer program, when executed by a processor, implements the steps of the methods described in the various embodiments.

[0109] Figure 5 This is a device block diagram illustrating an electronic device according to an exemplary embodiment. For example, the electronic device may be a mobile phone, computer, digital broadcasting electronic device, messaging transceiver, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0110] Reference Figure 5The electronic device may include one or more of the following components: a carrier 821, a heat-generating device 823, an audio device 810, and a heat dissipation structure 822, a processing component 802, a memory 804, a power component 806, a multimedia component 808, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816 as described in the above embodiments.

[0111] Processing component 802 typically controls the overall operation of an electronic device, such as operations associated with touch, telephone calls, data communication, camera operation, and recording. Processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0112] Memory 804 is configured to store various types of data to support the operation of an electronic device. Examples of this data include instructions for any application or method operating on the electronic device, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0113] Power component 806 provides power to various components of the electronic device. Power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device.

[0114] Multimedia component 808 includes a screen that provides an output interface between the electronic device and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0115] Audio device 810 is configured to output and / or input audio signals. For example, audio device 810 includes a speaker for outputting audio signals. In some embodiments, audio device 810 may also include a microphone (MIC) configured to receive external audio signals when the electronic device is in an operating mode, such as a call mode, recording mode, or voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816.

[0116] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0117] Sensor assembly 814 includes one or more sensors for providing state assessments of various aspects of the electronic device. For example, sensor assembly 814 can detect the on / off state of the electronic device, the relative positioning of components such as the display and keypad of the electronic device, changes in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, orientation or acceleration / deceleration of the electronic device, and temperature changes of the electronic device. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0118] Communication component 816 is configured to facilitate wired or wireless communication between electronic devices and other devices. The electronic devices can access wireless networks based on communication standards, such as WiFi, 4G, or 5G, or combinations thereof. In one exemplary embodiment, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0119] In an exemplary embodiment, the electronic device may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0120] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0121] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat dissipation structure, characterized in that, Applications in electronic devices include: A heat dissipation channel is formed on the carrier of the electronic device, surrounding the heat-generating device of the electronic device; the heat generated by the heat-generating device is conducted to the heat dissipation channel through the carrier; the carrier is the middle frame of the electronic device used to support circuit boards or components; a groove is formed on the carrier surrounding the heat-generating device; a heat dissipation component is encapsulated in the upper opening of the groove; the heat dissipation channel is formed in the groove; The first channel opening of the heat dissipation channel is connected to the sound wave output port of the audio device of the electronic device, and the sound waves output by the audio device can drive the air in the heat dissipation channel to vibrate; the audio device includes a handset or a speaker. The second channel opening of the heat dissipation channel is connected to the external environment and is used to dissipate the heat in the heat dissipation channel to the external environment; wherein, the first channel opening and the second channel opening are two channels connected to the heat dissipation channel, and the second channel opening includes a heat dissipation hole opened on the carrier, or a speaker hole and a microphone hole located on the top of the electronic device.

2. The heat dissipation structure according to claim 1, characterized in that, The carrier of the electronic device is also provided with an air intake channel that communicates with the external environment; the air intake channel is connected to the heat dissipation channel and is used to input air from the external environment into the heat dissipation channel.

3. The heat dissipation structure according to claim 2, characterized in that, Also includes: Compression structure; The compression structure is located at the air inlet of the air intake channel; when the compression structure is in a compressed state, the compression structure closes the air inlet of the air intake channel and compresses the air in the air intake channel into the heat dissipation channel. When the compression structure is in an uncompressed state, the air intake channel is connected to the external environment through the air intake port.

4. The heat dissipation structure according to claim 3, characterized in that, The compression structure is located in the edge region of the carrier near the electronic device; the compression structure exposes a first surface of the electronic device to bear the pressing force; the compression structure is embedded in a second surface of the carrier opposite the first surface, which has an elastic structure; The elastic structure is used to restore the compression structure to the non-compressed state when the compression structure is not bearing the pressing force.

5. The heat dissipation structure according to claim 3, characterized in that, The side of the compression structure that contacts the support member has a sealing structure; when the compression structure is in a compressed state, the sealing structure contacts the air inlet of the air intake channel to seal the air inlet.

6. The heat dissipation structure according to claim 3, characterized in that, The side of the compression structure that contacts the carrier has a limiting structure; the limiting structure is inserted into the limiting groove corresponding to the carrier; the limiting structure can move within the limiting groove.

7. A heat dissipation method, characterized in that, In an electronic device, a heat dissipation channel is provided on the carrier of the electronic device, and the heat dissipation channel surrounds the heat-generating device of the electronic device; the heat generated by the heat-generating device is conducted to the heat dissipation channel through the carrier; the carrier is the middle frame of the electronic device used to support the circuit board or components; a groove is provided on the carrier surrounding the heat-generating device; a heat dissipation component is encapsulated in the upper opening of the groove; the heat dissipation channel is formed in the groove; the first channel opening of the heat dissipation channel is connected to the sound wave output port of the audio device of the electronic device; the second channel opening of the heat dissipation channel is connected to the external environment; wherein the first channel opening and the second channel opening are two connected channels of the heat dissipation channel; the audio device includes a handset or a speaker; the second channel opening includes a heat dissipation hole opened on the carrier, or a speaker hole or a microphone hole located on the top of the electronic device; The method includes: Based on the heat generated by the heating element of the terminal device, determine the parameters of the sound waves to be emitted by the audio device; According to the parameters, the audio device is controlled to emit sound waves; the sound waves drive the air in the heat dissipation channel to vibrate through the first channel opening of the heat dissipation channel, and dissipate the heat in the heat dissipation channel to the external environment through the second channel opening of the heat dissipation channel.

8. The heat dissipation method according to claim 7, characterized in that, The parameters of the sound wave include at least the frequency of the sound wave; The method of determining the parameters for the audio device to emit sound waves based on the heat generated by the heating element of the terminal device includes: The frequency of the sound waves to be emitted by the audio device is determined based on the heat generated by the heating element of the terminal device.

9. The heat dissipation method according to claim 8, characterized in that, Determining the frequency of the sound wave to be emitted by the audio device based on the heat generated by the heating element of the terminal device includes at least: When it is determined that the heat generated by the heating device exceeds a first preset threshold, the frequency at which the audio device emits the sound wave is determined to be the first frequency. When it is determined that the heat generated by the heating device exceeds the second preset threshold, the frequency at which the audio device will emit the sound wave is determined to be the second frequency; wherein the second preset threshold is greater than the first preset threshold, and the second frequency is greater than the first frequency.

10. The heat dissipation method according to claim 7, characterized in that, Also includes: When the heat generated by the heating device exceeds a first preset threshold, the compression structure is controlled to enter a compression state, and the air in the compressed air intake channel enters the heat dissipation channel; the air entering the heat dissipation channel is used to expel the air in the heat dissipation channel to the external environment; When the heat generated by the heating device does not exceed the first preset threshold, the compression structure is controlled to be in an uncompressed state, and air from the external environment enters the air intake channel through the air inlet of the air intake channel; wherein, the air intake channel is opened on the carrier of the electronic device and communicates with the external environment, and the air intake channel is connected to the heat dissipation channel.

11. The heat dissipation method according to claim 9, characterized in that, Determining the heat generated by the heating device includes: By determining the power and operating time of the heating device, the heat generated by the heating device is determined, and / or, The heat generated by the heating device is monitored by a thermal sensor.

12. An electronic device, characterized in that, include: The carrier, the heat-generating device, the audio device, and the heat dissipation structure as described in claims 1 to 6; A processor and a memory for storing a computer program capable of running on the processor, wherein the processor, when running the computer program, performs the steps of the method according to any one of claims 7 to 11.

13. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 7 to 11.

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