Edge finishing device
By designing an edge trimming device that includes a processing section and a cleaning section, and utilizing a combination of a worktable and nozzle cleaning fluid, the problem of dirt on the back of the wafer was solved, achieving clean wafer processing and preventing subsequent contamination.
CN116803656BActive Publication Date: 2026-07-10TOKYO SEIMITSU CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TOKYO SEIMITSU CO LTD
- Filing Date
- 2023-03-21
- Publication Date
- 2026-07-10
AI Technical Summary
Technical Problem
During edge trimming, dirt can easily adhere to the back of the wafer, leading to contamination of subsequent processing equipment or wafer surface.
Method used
An edge trimming device is designed, comprising a processing section, a cleaning section, and a transport section. The device uses first and second worktables to hold and clean the wafers respectively, and supplies fluid through nozzles for cleaning to ensure the cleanliness of the back side of the wafers.
Benefits of technology
It effectively suppresses dirt on the back of the wafer, prevents contamination of subsequent process equipment and wafer surface, and improves the cleanliness of the process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116803656B_ABST
Abstract
The present invention provides an edge trimming device capable of inhibiting contamination of the back surface of a wafer. An edge trimming device (10) includes a processing section (14) that performs edge trimming of a wafer (W) held by a first stage (100) using a blade (56), and a cleaning section (16) that supplies fluid for cleaning to a wafer (W) held by a second stage (200) and rotating to perform cleaning. The first stage (100) contacts and holds the wafer (W) in a ring shape along the outer periphery of the back surface of the wafer (W). The second stage (200) contacts and holds the wafer (W) at a region inside the first stage (100) with the back surface of the wafer (W).
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