A semiconductor power cycle test system and test method
The modular semiconductor power cycling test system, utilizing a control terminal and independent, detachable test modules, enables efficient multi-condition testing, solving the problems of poor applicability and inconvenient operation of existing systems, and improving testing efficiency and space utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LEADRIVE TECH (SHANGHAI) CO LTD
- Filing Date
- 2023-05-05
- Publication Date
- 2026-06-23
AI Technical Summary
Existing semiconductor power cycle testing systems are fixed in assembly, have poor applicability, require multiple testing systems or repeated testing, and are inconvenient to operate.
The test system employs a control terminal and multiple independent, detachable test modules. The control terminal establishes communication with each test module to achieve modularity and scalability. Each test module shares a cooling supply pipeline, and the test conditions are uniformly managed and configured through the control terminal.
It improves testing efficiency, enables synchronous or asynchronous testing under various testing conditions, reduces equipment space and cost, and simplifies the operation process.
Smart Images
Figure CN116819267B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor module testing, in particular to a semiconductor power cycle test system and a test method. BACKGROUND
[0002] Power semiconductor devices are core components of new energy, rail transit, electric vehicles, industrial applications, and household appliances. Due to the characteristics of high operating junction temperature, high power density, and high switching frequency, and the more severe use environment, the reliability of the device is particularly important, so it needs to be tested for reliability. Power cycle test simulates the junction temperature fluctuation in the device operation by load current heating and switching off action, and changes the temperature to accelerate aging to expose the weak points of the device package in advance, and evaluate the influence of the difference of the thermal expansion coefficient of the packaging material on the device life. However, the existing semiconductor power cycle test system is fixedly assembled, and when multiple test conditions need to be executed, multiple test systems or repeated tests are required, which is inconvenient to operate. SUMMARY
[0003] In order to overcome the above technical defects, the purpose of the present application is to provide a semiconductor power cycle test system and a test method, which solves the problem of poor adaptability of the existing semiconductor power cycle test system fixedly assembled.
[0004] The present application discloses a semiconductor power cycle test system,
[0005] The control terminal and a plurality of independently detachable test modules are included.
[0006] The control terminal and each test module establish communication to transmit instructions and data.
[0007] Each test module includes:
[0008] A load module for controlling the load parameters of the power cycle test process.
[0009] A temperature control module for controlling the temperature parameters of the power cycle test process.
[0010] A sampling module for sampling the test object during the power cycle test process to obtain the state parameters.
[0011] The control terminal sends instructions to the load module and the temperature control module to control the load parameters and the temperature parameters of each test module. The sampling module of each test module collects the state parameters of the test object during the power cycle test process and sends them to the control terminal. The control terminal receives the state parameters and performs data processing and data display.
[0012] Preferably, the temperature control modules of each test module are connected to the same cooling supply pipe;
[0013] The control terminal determines the coolant flow rate allocated by the cooling supply pipeline to the temperature control module of each test module.
[0014] Preferably, the control terminal selects to control the on / off states between each test module.
[0015] Preferably, the control terminal autonomously configures the temperature parameters and load current parameters of each test module according to the test object information, and sends instructions to each test module so that each test module can perform tests under different conditions synchronously or in stages, and generates a life model report based on the status parameters returned by each test module.
[0016] Preferably, the control terminal sends instructions to each test module, enabling each test module to be configured with different test conditions to perform temperature and voltage change relationship tests or junction temperature delay calibration.
[0017] The present invention also provides a semiconductor power cycling test method, which uses the test system described in any of the above claims, comprising:
[0018] Obtain test object information, determine the number of test modules based on the test object information, and assemble the test system;
[0019] The control terminal receives test signals containing test conditions and generates instructions corresponding to different test modules;
[0020] Each test module receives instructions from the control terminal and configures the corresponding load and temperature parameters according to the instructions, so that each test module is subjected to different / same test conditions.
[0021] Each test module is tested under corresponding test conditions, and status parameters are collected through the sampling module and returned to the control terminal;
[0022] The control terminal receives the status parameters from each test module, processes the data, and displays the data.
[0023] Preferably, the control terminal controls each test module to perform tests synchronously or asynchronously.
[0024] Preferably, the control terminal autonomously configures instructions applied to each test module based on the test object information, wherein the instructions include test conditions for generating a lifetime model of the test object;
[0025] Each test module synchronously executes tests under different test conditions corresponding to the instructions, and collects real-time status parameters through the sampling module and feeds them back to the control terminal;
[0026] The control terminal receives status parameters from each test module to autonomously generate a lifetime model report.
[0027] Preferably, the control terminal sends instructions to each test module, causing each test module to perform tests under different test conditions;
[0028] The control terminal determines the temperature change of the test object under different load voltages based on the status parameters fed back by each test module, and generates voltage-temperature change curves for the test object under different test conditions.
[0029] Preferably, the control terminal acquires the temperature change coefficient of the preset test object;
[0030] The control terminal sends instructions to each test module to test the test objects under each test module;
[0031] For any test module, the control terminal performs junction temperature calibration based on the temperature change coefficient and the real-time voltage fed back by the sampling module.
[0032] Compared with existing technologies, the above technical solution has the following advantages:
[0033] This application provides a semiconductor power cycling test system and method. The system comprises multiple independent and detachable test modules connected by a control terminal, making it modular and scalable. It also shares a cooling supply pipeline, resulting in high space utilization and reduced costs. The control terminal sends commands to each test module, enabling them to perform tests under different conditions. Each module is centrally controlled by the control module, allowing for independent operation and synchronous / asynchronous testing under various conditions. This improves testing efficiency and addresses the limitations of existing semiconductor power cycling test systems, which suffer from fixed assembly, repetitive or multiple-use requirements for certain tests, long testing times, numerous devices, inconvenient operation, and poor applicability. Attached Figure Description
[0034] Figure 1 This is a schematic diagram of the structure of a first embodiment of the semiconductor power cycling test system and test method described in this invention;
[0035] Figure 2 This is a schematic diagram of the modules in Embodiment 1 of the semiconductor power cycling test system and test method of the present invention;
[0036] Figure 3 This is a flowchart of a second embodiment of the semiconductor power cycling test system and test method described in this invention.
[0037] Figure label:
[0038] 1-Semiconductor power cycle test system; 2-Test module; 21-Load module; 22-Temperature control module; 23-Sampling module; 3-Control terminal. Detailed Implementation
[0039] The advantages of the present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments.
[0040] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0041] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.
[0042] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. Depending on the context, the word "if" as used herein can be interpreted as "when," "when," or "in response to determination."
[0043] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0044] In the description of this invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.
[0045] In the following description, suffixes such as "module," "part," or "unit" used to denote elements are used only for the convenience of the description of the invention and have no specific meaning in themselves. Therefore, "module" and "part" can be used interchangeably.
[0046] Example 1: This invention discloses a semiconductor power cycling test system, which differs from existing fixed-assembly power cycling test systems. Specifically, it includes a control terminal and multiple independent, detachable test modules. The control terminal establishes communication with each test module for command and data transmission. By setting up independent, detachable test modules, the test system becomes modular and expandable. The communication between the control terminal and each test module enables the integration of the test modules and the control terminal. The test modules can be arranged side-by-side sequentially to save space, or distributed to suit different application scenarios.
[0047] In this embodiment, each of the test modules includes: a load module (subsystem) for controlling load parameters during the power cycling test process; specifically, the load module controls the load current magnitude, switching time (load parameters), etc.; a temperature control module (subsystem) for controlling temperature parameters during the power cycling test process; specifically, the temperature control module includes case temperature detection, coolant temperature and flow rate control (temperature parameters), etc.; and a sampling module (subsystem) for sampling the test object during the power cycling test to obtain state parameters; specifically, the sampling module can perform tasks including but not limited to obtaining state parameters of the test object such as voltage, current, on-state voltage drop, and thermal resistance during the test process. It should be noted that the load module, temperature control module, and sampling module all include several sub-modules or components such as power supply modules and sensors, as well as connectors such as wires, which are not specifically described here. They can achieve the functions described above, or existing system / module configurations can be used here.
[0048] Specifically, in this embodiment, the control terminal sends instructions to the load module and temperature control module under each test module to control the load parameters and temperature parameters during the power cycle test under different test modules, forming different test conditions. The sampling module collects the status parameters of the test object in real time during the power cycle test and sends them to the control terminal. After receiving the status parameters, the control terminal processes and displays the data. The control terminal can be a mobile device, server, host computer, etc., and is mainly used to send instructions to each test module. According to the instructions, each test module executes different / same test conditions, and processes and displays the received status parameters. The specific processing and display includes, but is not limited to, comparing and displaying the status parameters under each test module, performing lifetime analysis, establishing a lifetime model, and performing reliability analysis based on the status parameters obtained under different test conditions.
[0049] In this embodiment, a testing system is integrated using multiple test modules. Each test module can set test conditions such as water temperature, flow rate, and load current, and acquire key parameters such as conduction voltage and thermal resistance during the test. To achieve integration of multiple test modules and reduce space occupation, the temperature control modules of each test module are connected to the same cooling supply pipeline. The control terminal determines the coolant flow rate allocated from the cooling supply pipeline to the temperature control modules of each test module, i.e., the inlet and outlet portions of the coolant shared by each test module. It should be noted that since each test module is independent and detachable, when adding / removing test modules, the coolant interface of its temperature control module can be connected / disconnected from the cooling supply pipeline. Unlike existing systems where each additional test process requires the addition of equipment including but not limited to external coolant pipelines, this system allows for unified management of all test modules by autonomously allocating resources based on the temperature parameters of each test module through the control terminal.
[0050] In this embodiment, the test modules form a test system through a control terminal. The test terminal can configure test conditions for different test modules and acquire key test parameters online. It can perform simultaneous testing of multiple test conditions and even test samples. The control terminal can handle hardware design such as electrical and waterway connections, and software design such as a host computer. The software includes control, monitoring, and data post-processing. Therefore, the control terminal can selectively control the connection between each test module, i.e., set the connection status between each test module. Connection between test modules can be achieved through hardware devices such as wires, interfaces, and switches, combined with control commands from the control terminal, such as switching on and off. Connection between test modules enables consistent control of test parameters, such as for life model testing, where synchronous / sequential control of test module execution is used. Disconnection between test modules allows each test module to independently perform different / same tests.
[0051] The testing system provided in this embodiment can be used for lifetime testing of semiconductor modules (test objects). It should be noted that lifetime testing requires determining the state changes of the test object under different test conditions. Existing methods typically utilize multiple testing systems or a single testing system for repeated testing. However, it is impossible to ensure parameter consistency across each testing system or during each test. The testing system provided in this embodiment, however, can autonomously configure the temperature and load current parameters of each test module based on the test object information via a control terminal. Commands are then sent to each test module, enabling them to execute tests under different conditions synchronously or in stages. A lifetime model report is generated based on the state parameters returned by each test module. In other words, the control terminal automatically configures the necessary test DOE conditions for generating a sample lifetime model based on the test sample information and executes them under each test module. Based on the test results of each test module, a corresponding lifetime model report for the sample is automatically generated after the test is completed, effectively improving work efficiency and solving the problems of excessive time consumption and complex equipment in existing solutions.
[0052] In a preferred embodiment, the test system provided in this embodiment can also be used for junction temperature testing of semiconductor modules. Specifically, the control terminal sends instructions to each test module, enabling each test module to be configured with different test conditions to perform temperature-voltage change relationship testing or junction temperature delay calibration. Specifically, as described in Embodiment 2 below, the same test object (i.e., different semiconductor modules with consistent parameters) is tested under different test conditions of each test module, obtaining the voltage change of the test object with temperature under different test conditions, and using this change for real-time junction temperature calibration in other tests. The test is simple and has high execution efficiency.
[0053] The testing system provided in this embodiment consists of multiple independent and detachable test modules connected by a control terminal. The control terminal sends commands to each test module, enabling them to perform tests under different conditions, thus making the testing system modular and scalable. Each module is uniformly controlled by the control module and shares a cooling supply pipeline. During assembly, they are connected via interfaces. Unlike existing multi-test systems that require multiple additional modules or components, this system offers high space utilization and reduced costs. Each test module can operate independently, enabling synchronous / asynchronous DOE testing of the test object under various test conditions, improving testing efficiency. For example, it can automatically configure the necessary test conditions for generating a sample lifetime model based on the test sample information. After testing, it automatically generates the corresponding lifetime model report for the sample, solving the problems of time consumption and equipment bloat in existing lifetime testing methods. It can also perform temperature coefficient calibration tests and junction temperature calibration tests.
[0054] Example 2: The present invention also provides a semiconductor power cycling test method, which applies the test system described in any of the above embodiments, specifically including:
[0055] S10: Obtain test object information, determine the number of test modules based on the test object information, and assemble the test system;
[0056] Based on the above testing system, the test modules are configured as multiple independent and detachable units, allowing for independent assembly according to testing requirements to suit different testing scenarios. Specifically, as an example, during assembly, connections between the various test modules can be achieved via ports (with control terminal for on / off control). The connection between the test modules and the control terminal can be hardware-based or wireless, such as via network or Bluetooth. Each test module is connected to the same cooling supply pipe; the control terminal determines the coolant flow allocated from the cooling supply pipe to the temperature control module under each test module.
[0057] S20: The control terminal receives a test signal containing test conditions and generates instructions corresponding to different test modules;
[0058] In the above steps, the test conditions can be configured by the user and sent to the control terminal, or the control terminal can configure them independently according to the test requirements (in the test object information). The above instructions contain different / same test conditions so that they can be sent to the test module to perform tests with the same / different test conditions.
[0059] S30: Each test module receives instructions from the control terminal and configures the corresponding load and temperature parameters according to the instructions, so that each test module corresponds to different / the same test conditions;
[0060] In the above steps, the control terminal uses commands to control the load and temperature parameters of different test modules, executing different or the same test conditions. Specifically, executing the same test conditions can achieve comparative reliability testing for different test objects; executing different test conditions can be as follows: performing life model testing for the test object, or junction temperature change testing. Furthermore, the control terminal can also control each test module to perform tests synchronously or asynchronously, either simultaneously or sequentially, to suit different testing requirements.
[0061] S40: Each test module is tested under the corresponding test conditions, and the status parameters are collected through the sampling module and returned to the control terminal; the control terminal receives the status parameters of each test module for data processing and data display.
[0062] In the above steps, a sampling module is set up under each test module to collect and monitor the status parameters in real time during the test, and return the data to the control terminal for data processing and display, including but not limited to comparison of status parameters under different test objects / test conditions, or analysis of changes in status parameters of a certain test object under different test conditions.
[0063] In a preferred embodiment, based on the aforementioned testing system, lifetime analysis of the test object can be performed. Specifically, the control terminal autonomously configures instructions applied to each test module according to the test object information. These instructions include test conditions for generating a lifetime model of the test object. Each test module synchronously executes tests under different test conditions corresponding to the instructions, and collects real-time status parameters through a sampling module, feeding them back to the control terminal. The control terminal receives the status parameters from each test module to autonomously generate a lifetime model report. It is worth noting that the autonomous configuration of the required test DOE conditions for generating the sample lifetime model for the test object, and the execution by each test module, results in high testing efficiency, eliminating the need for multiple testing systems or multiple executions through a single testing system, as is common in existing systems.
[0064] In a preferred embodiment, based on the above-described testing system, automatic temperature K-coefficient calibration of the semiconductor module can also be performed. Specifically, this includes: the control terminal sending commands to each test module, causing each test module to perform tests under different test conditions; the control terminal determining the temperature variation of the test object under different load voltages based on the status parameters fed back by each test module, and generating voltage-temperature variation curves for the test object under different test conditions. By synchronously executing tests through each test module, the voltage-temperature variation curves can be stored in the control terminal or a preset database for subsequent processing for other tests on the test object or for real-time junction temperature calibration during use.
[0065] In a preferred embodiment, based on the above-described test system and the voltage-temperature change curve mentioned in the above-described temperature coefficient calibration, real-time junction temperature calibration can be performed on the test object during testing or use. Specifically, this also includes: the control terminal acquiring a preset temperature change coefficient acting on the test object (which can be calculated from the above-described voltage-temperature change curve); the control terminal sending instructions to each test module to test the test object under each test module; for any test module, the control terminal performing junction temperature calibration based on the temperature change coefficient and the real-time voltage fed back by the sampling module, i.e., performing automatic Tjmax measurement delay calibration, etc.
[0066] The testing method provided in this embodiment, based on the aforementioned testing system, configures the number of test modules according to testing requirements, and assembles the testing system through a control terminal. The control terminal sends instructions to each test module, enabling the test modules to perform tests under different / same test conditions, thereby achieving comparative reliability testing for different test objects. Executing different test conditions can be, as described below, performing lifetime model testing for the test object, or junction temperature change testing, etc. The control terminal can also control each test module to perform tests synchronously / asynchronously, allowing each test module to perform tests synchronously or sequentially to suit different testing requirements. This solves the problems of existing semiconductor power cycle testing relying on fixed assembly testing systems, which have limited applicability, require multiple test executions, are time-consuming, or involve multiple systems testing equipment simultaneously, resulting in complex operations.
[0067] It should be noted that the embodiments of the present invention have better implementability and are not intended to limit the present invention in any way. Any person skilled in the art may use the above-disclosed technical content to change or modify it into equivalent effective embodiments. However, any modifications or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.
Claims
1. A method for cyclic testing of semiconductor power, characterized in that, Applications in semiconductor power cycling test systems, which include: Control terminal and multiple independent, detachable test modules; The control terminal establishes communication with each test module to transmit commands and data. Each of the aforementioned test modules includes: The load module is used to control the load parameters during the power cycling test process; The temperature control module is used to control the temperature parameters during the power cycling test. The sampling module is used to sample the test object during the power cycle test to obtain state parameters. The control terminal sends instructions to the load module and temperature control module to control the load parameters and temperature parameters of each test module. The sampling module of each test module collects the status parameters of the test object in real time during the power cycle test and sends them to the control terminal. After receiving the status parameters, the control terminal processes and displays the data. The temperature control modules of each test module are connected to the same cooling supply pipeline; The control terminal determines the coolant flow rate distributed by the cooling supply pipeline to the temperature control module under each test module; The control terminal can select and control the connection and disconnection between various test modules; The control terminal autonomously configures the temperature and load current parameters of each test module according to the test object information, and sends instructions to each test module so that each test module can perform tests under different conditions synchronously or stepwise, and generates a life model report based on the status parameters returned by each test module. Semiconductor power cycling test methods include: Obtain test object information, determine the number of test modules based on the test object information, and assemble the test system; The control terminal receives test signals containing test conditions and generates instructions corresponding to different test modules; Each test module receives instructions from the control terminal and configures the corresponding load and temperature parameters according to the instructions, so that each test module corresponds to different / same test conditions; Each test module is tested under corresponding test conditions, and status parameters are collected through the sampling module and returned to the control terminal; The control terminal receives the status parameters from each test module, processes the data, and displays the data.
2. The test method according to claim 1, characterized in that: The control terminal sends instructions to each test module, enabling each test module to be configured with different test conditions to perform temperature and voltage change relationship tests or junction temperature delay calibration.
3. The test method according to claim 1, characterized in that: The control terminal controls each test module to perform tests synchronously or asynchronously.
4. The test method according to claim 1, characterized in that: The control terminal autonomously configures instructions applied to each test module based on the test object information, wherein the instructions include test conditions for generating a lifetime model of the test object; Each test module synchronously executes tests under different test conditions corresponding to the instructions, and collects real-time status parameters through the sampling module and feeds them back to the control terminal; The control terminal receives status parameters from each test module to autonomously generate a lifetime model report.
5. The test method according to claim 1, characterized in that: The control terminal sends instructions to each test module, enabling each test module to perform tests under different test conditions; The control terminal determines the temperature change of the test object under different load voltages based on the status parameters fed back by each test module, and generates a set of voltage-temperature change curves for the test object under different test conditions.
6. The test method according to claim 1, characterized in that: The control terminal acquires a preset set of voltage-temperature variation curves of the test object. The control terminal sends instructions to each test module to test the test objects under each test module; For any test module, the control terminal performs junction temperature calibration based on the voltage versus temperature curve set and the real-time voltage fed back by the sampling module.