Packaging structure, packaging structure manufacturing method, camera module and electronic device

Abstract

The application provides a packaging structure, a packaging structure manufacturing method, a camera module and an electronic device. The packaging structure comprises a substrate, a light-emitting assembly, a light-sensing assembly and a packaging body. The light-emitting assembly comprises a light-emitting element, a first light-filtering element and a plurality of first dams. The light-emitting element is connected to the substrate. The plurality of first dams are arranged around the light-emitting element on the substrate. The first light-filtering element is arranged on a side of the first dam away from the substrate. The first light-filtering element is arranged opposite to the light-emitting element. The light-sensing assembly is arranged apart from the light-emitting assembly. The light-sensing assembly comprises a light-sensing element, a second light-filtering element and a plurality of second dams. The light-sensing element is connected to the substrate. The light-sensing element has a light-sensing area and a non-light-sensing area surrounding the light-sensing area. The plurality of second dams are arranged on the non-light-sensing area. The second light-filtering element is arranged on a side of the second dam away from the light-sensing element. The second light-filtering element is arranged corresponding to the light-sensing area. The packaging body is arranged on the substrate and covers the light-emitting assembly and the light-sensing assembly.

Description

Technical Field

[0001] This application relates to a packaging structure, a method for manufacturing the packaging structure, a camera module, and an electronic device. Background Technology

[0002] Currently, packaging structures that simultaneously incorporate light-emitting elements and photosensitive elements have broad application prospects, such as distance measurement, proximity sensing, posture sensing, and imaging.

[0003] In the prior art, the packaging process of this type of packaging structure is usually as follows: first, the light-emitting element and the photosensitive element are attached to the substrate using surface mount technology (SMT), then the substrate and the light-emitting element, and the substrate and the photosensitive element are electrically connected, and finally a light-transmitting cover is formed on the substrate using injection molding technology. This light-transmitting cover connects the light-emitting element, the photosensitive element and the substrate into one unit to obtain the packaging structure.

[0004] However, because the light-transmitting cover is manufactured using injection molding technology, its minimum achievable thickness is 0.3mm, which is not conducive to the current demand for miniaturization of camera modules. Furthermore, when the light-transmitting cover is placed on the substrate, an error of approximately 0.03mm occurs in the width direction. This error affects the wire bonding position of the light-emitting element or photosensitive element, increasing the difficulty of the entire packaging process. Additionally, due to the small sealing area of ​​the light-transmitting cover, it cannot effectively achieve the waterproof and moisture-proof performance of the packaging structure. Summary of the Invention

[0005] The purpose of this application is to provide a packaging structure that can solve the above-mentioned problems.

[0006] The purpose of this application is also to provide a method for manufacturing the above-mentioned packaging structure.

[0007] The purpose of this application is also to provide a camera module including the above-described packaging structure.

[0008] The purpose of this application is also to provide an electronic device including the above-mentioned camera module.

[0009] This application provides a packaging structure including a substrate, a light-emitting component, a photosensitive component, and a package. The light-emitting component includes a light-emitting element, a first filter element, and a plurality of first barriers. The light-emitting element is connected to the substrate. The plurality of first barriers surround the light-emitting element on the substrate. The first filter element is disposed on the side of the first barriers facing away from the substrate and is opposite to the light-emitting element. The photosensitive component is spaced apart from the light-emitting component. The photosensitive component includes a photosensitive element, a second filter element, and a plurality of second barriers. The photosensitive element is connected to the substrate and has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. The plurality of second barriers are disposed in the non-photosensitive area. The second filter element is disposed on the side of the second barriers facing away from the photosensitive element and corresponds to the photosensitive area. The package is disposed on the substrate and covers the substrate, the first barriers, the second barriers, the first filter element, and the outer side of the second filter element.

[0010] In a preferred embodiment, the first filter element includes a first light-transmitting area located at the center of the first filter element, and the second filter element includes a second light-transmitting area located at the center of the second filter element. A plurality of third barriers are disposed around the first light-transmitting area, and a plurality of fourth barriers are disposed around the second light-transmitting area. The encapsulation body covers the outer sides of the third and fourth barriers.

[0011] In a preferred embodiment, the light-emitting element is electrically connected to the substrate via a wire, and the photosensitive element is electrically connected to the substrate via a wire.

[0012] This application also provides a method for fabricating a packaging structure, which includes the following steps:

[0013] Provide a substrate;

[0014] A light-emitting element and a photosensitive element are disposed at intervals on the substrate, and the substrate and the light-emitting element are electrically connected, as are the substrate and the photosensitive element; the photosensitive element includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area.

[0015] A plurality of first dams are provided around the light-emitting element on the substrate, and a plurality of second dams are provided around the photosensitive area on the non-photosensitive area;

[0016] A first filter element is disposed on the side of the first dam away from the substrate, and the first filter element is disposed opposite to the light-emitting element at a distance; and a second filter element is disposed on the side of the second dam away from the photosensitive element, and the second filter element is disposed corresponding to the photosensitive area.

[0017] An encapsulation body is disposed on the substrate, and the encapsulation body surrounds and covers the outside of the substrate, the first dam, the second dam, the first filter element, and the second filter element.

[0018] In a preferred embodiment, the first filter element includes a first light-transmitting area located at the center of the first filter element, and the second filter element includes a second light-transmitting area located at the center of the second filter element.

[0019] Before the encapsulation body is disposed on the substrate, the method further includes: disposing of a plurality of third dams around the first light-transmitting area and disposing of a plurality of fourth dams around the second light-transmitting area.

[0020] In a preferred embodiment, a passive element is disposed on the substrate, and the passive element is electrically connected to the light-emitting element.

[0021] In a preferred embodiment, the first and second cofferdams are formed by dispensing adhesive.

[0022] In a preferred embodiment, the first and second dams are made of epoxy resin, and the encapsulation body is also made of epoxy resin.

[0023] This application also provides a camera module including the above-described packaging structure.

[0024] This application also provides an electronic device including the above-described camera module.

[0025] Compared with existing technologies, the packaging structure provided in this application, by spaced-apart light-emitting elements and photosensitive elements on a substrate, and then forming the light-emitting elements, photosensitive elements, and substrate into a single unit using a package, results in smaller errors during the forming of the package on the substrate and a larger packaging area, which is beneficial for the miniaturization of the packaging module and the reliability of the packaging structure. Furthermore, by setting multiple first dams and first filter elements to protect the light-emitting elements, and multiple second dams and second filter elements to protect the photosensitive elements, dust accumulation can be prevented, thereby improving the imaging quality of the camera module. Attached Figure Description

[0026] Figure 1 This is a cross-sectional view of a substrate provided in an embodiment of this application.

[0027] Figure 2 In order to be in Figure 1 The diagram shows a cross-sectional view of a substrate on which light-emitting elements and photosensitive elements are disposed.

[0028] Figure 3 A cross-sectional view showing the placement of wires on a substrate.

[0029] Figure 4A cross-sectional view showing the setup of the dam and filter elements.

[0030] Figure 5 A cross-sectional view of a dam being set on a filter element.

[0031] Figure 6 A cross-sectional view showing the encapsulation on a substrate.

[0032] Figure 7 A cross-sectional view of the packaging structure for batch production.

[0033] Figure 8 for Figure 7 The encapsulation structure described herein is cut into a cross-sectional view of a single unit.

[0034] Explanation of main component symbols

[0035] Packaging structure 100

[0036] Substrate 10

[0037] Wire 12

[0038] Light-emitting component 20

[0039] Light-emitting element 21

[0040] Passive component 22

[0041] First dam 23

[0042] First filter element 24

[0043] First light-transmitting zone 25

[0044] Second embankment 26

[0045] Photosensitive element 30

[0046] Photosensitive element 31

[0047] Photosensitive area 32

[0048] Non-photosensitive area 33

[0049] Third Embankment 34

[0050] Second filter element 35

[0051] Second light-transmitting zone 36

[0052] Fourth dam 37

[0053] Package 40

[0054] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0055] The packaging structure and its manufacturing method provided in this application will be further described in detail below with reference to the accompanying drawings.

[0056] It should be noted that when a component is referred to as "fixed to," "set on," or "mounted to" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to that other component. Furthermore, a connection can be for both fixing and circuit connection purposes.

[0057] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0058] Please see Figures 1 to 6 One embodiment of this application provides a method for fabricating a packaging structure, comprising the following steps:

[0059] Step 1: Please refer to Figure 1 A substrate 10 is provided, on which at least one passive element 22 is disposed, and the passive element 22 is electrically connected to the substrate 10. The substrate 10 may be a rigid-flex PCB, a ceramic substrate, a rigid PCB, etc.

[0060] The passive component 22 is mounted on the substrate 10 using surface mount technology (SMT). Specifically, the passive component 22 is bonded to and electrically connected to the substrate 10 using solder paste. The passive component 22 can be a resistor, capacitor, diode, transistor, potentiometer, relay, or driver, etc. In this embodiment, the passive component 22 is located at the edge of the substrate 10.

[0061] Step 2: Please refer to Figure 2 and Figure 3 A light-emitting element 21 and a photosensitive element 31 are provided, and the light-emitting element 21 and the photosensitive element 31 are attached to the substrate 10 with adhesive spacers, electrically connecting the substrate 10 and the light-emitting element 21, and electrically connecting the substrate 10 and the photosensitive element 31. The photosensitive element 31 includes a photosensitive area 32 away from the light-emitting element 21 and a non-photosensitive area 33 surrounding the photosensitive area 32. The photosensitive area 32 is used to sense light.

[0062] The passive element 22 is electrically connected to the light-emitting element 21 to realize signal transmission between the light-emitting element 21 and the external circuit.

[0063] In this embodiment, the light-emitting element 21 can be a vertical cavity surface-emitting laser (VCSEL) for emitting light. The photosensitive element 31 can be a complementary metal-oxide-semiconductor (CMOS) image sensor or a charged-coupled device (CCD) for sensing light.

[0064] A wire 12 is disposed on the substrate 10, and the wire 12 electrically connects the light-emitting element 21 and the substrate 10 by wire bonding. The wire 12 also electrically connects the photosensitive element 31 and the substrate 10 by wire bonding. The wire 12 can be gold wire, copper wire, aluminum wire, silver wire, etc. In this embodiment, the wire 12 is a gold wire.

[0065] Step 3: Please refer to Figure 4 A first dam 23 is provided on the substrate 10 to surround the light-emitting element 21, and a third dam 34 is provided on the photosensitive element 31 to surround the photosensitive area 32. The first dam 23 is provided at a distance from the photosensitive element 31.

[0066] Step 4: Please refer to Figure 4 and Figure 5 A first filter element 24 and a second filter element 35 are provided. The first filter element 24 is disposed on the side of the first dam 23 away from the substrate 10, and the first filter element 24 is disposed at a distance from the light-emitting element 21. The second filter element 35 is disposed on the third dam 34, and the second filter element 35 is disposed corresponding to the photosensitive area 32 of the photosensitive element 31.

[0067] The first filter element 24 includes a first light-transmitting area 25 located at the center of the first filter element 24, and the second filter element 35 includes a second light-transmitting area 36 located at the center of the second filter element 35. The first light-transmitting area 25 and the second light-transmitting area 36 are used to filter light.

[0068] In this embodiment, the first filter element 24 and the second filter element 35 are light filters. More preferably, the first filter element 24 and the second filter element 35 can be implemented as infrared cut-off filters, and the corresponding first light-transmitting area 25 and the second light-transmitting area 36 can filter the infrared portion of the light, thereby improving the imaging quality of the camera module (not shown).

[0069] The first dam 23 and the third dam 34 are black, opaque colloids formed by dispensing. In this embodiment, the first dam 23 and the third dam 34 are high-viscosity epoxy resin adhesives to fix and support the first filter element 24 and the second filter element 35. Due to their high viscosity, a rotary dispensing machine can be used for dispensing and forming via rotary extrusion. The width and height of the first dam 23 and the third dam 34 can be controlled by controlling the size and height of the nozzles on the dispensing machine.

[0070] In this application, multiple first dams 23 and first filter elements 24 together house the light-emitting element 21, and the third dam 34 and second filter elements 35 together house the photosensitive area 32 of the photosensitive element 31. Therefore, the light-emitting element 21 and the photosensitive area 32 are not directly exposed to the space and are protected from dust accumulation, thereby improving the imaging quality of the camera module.

[0071] Step 5: Please refer to Figure 5 A plurality of second dams 26 are arranged around the first light-transmitting area 25 of the first filter element 24, and a plurality of fourth dams 37 are arranged around the second light-transmitting area 36 of the second filter element 35, to obtain a semi-finished encapsulation structure. In this embodiment, the manufacturing method and materials of the second dams 26 and the fourth dams 37 are the same as those of the first dams 23 and the third dams 34.

[0072] The second dam 26 and the fourth dam 37 are used to block the first light-transmitting area 25 and the second light-transmitting area 36 respectively, which can prevent liquid potting compound from overflowing into the first light-transmitting area 25 and the second light-transmitting area 36 during the encapsulation process.

[0073] Step 6: Please refer to Figure 6 Liquid potting compound is injected into the aforementioned encapsulation structure semi-finished product, and after vacuuming, it is baked and cured to form an encapsulation body 40. The encapsulation body 40 is an opaque black colloid, and the encapsulation body 40 surrounds and covers the outer layer of the substrate 10, the first dam 23, the second dam 26, the first filter element 24, the second filter element 35, the third dam 34, and the fourth dam 37. The encapsulation body 40, the light-emitting element 21, the photosensitive element 31, and the substrate 10 are formed as a whole.

[0074] In this embodiment, a fully automatic dispensing machine is used for dispensing, and the material used is a polymer potting compound, specifically epoxy resin. After baking and curing, the encapsulated body 40 is formed. The valve of the fully automatic dispensing machine adopts a non-contact spray dispensing method with high precision, and can spray dispensing in narrow gaps.

[0075] Understandably, a plurality of fifth dams (not shown) are also provided on the outer side of the substrate 10 to prevent the liquid potting compound from flowing out.

[0076] In other embodiments, the package 40 may also be formed by injection molding or compression molding. Injection molding can be performed using materials such as nylon, LCP (Liquid Crystal Polymer), or PP (Polypropylene), while compression molding can use epoxy resin.

[0077] Compared to traditional injection-molded light-transmitting covers, this application uses a method where the light-emitting element 21 and the photosensitive element 31 are spaced apart on the substrate 10, and then the light-emitting element 21, the photosensitive element 31, and the substrate 10 are integrated by forming an encapsulation body 40. The encapsulation body 40 is formed by curing liquid potting compound, which increases the area where wire bonding can be performed on the light-emitting element 21 and the photosensitive element 31, reducing the difficulty of the entire encapsulation process.

[0078] Furthermore, the package 40 covers the outer side of the substrate 10, the first dam 23, the second dam 26, the first filter element 24, the second filter element 35, the third dam 34, and the fourth dam 37, increasing the overall sealing area and extending the path of water vapor intrusion, thereby improving the reliability of the overall package structure 100 and facilitating the miniaturization of the package structure.

[0079] The packaging method described above can be applied to the simultaneous manufacture of multiple packaging structures 100. Please refer to [link / reference]. Figure 7 and Figure 8 Multiple light-emitting elements 21 and photosensitive elements 31 can be simultaneously placed on the same substrate 10, and multiple package structures 100 can be manufactured simultaneously by cutting.

[0080] Please refer to it again. Figure 6 This application provides a packaging structure 100 obtained by the above-described manufacturing method. The packaging structure 100 includes a substrate 10, a light-emitting component 20, a photosensitive component 30, and a package 40. The light-emitting component 20 and the photosensitive component 30 are disposed at intervals on the substrate 10, and the package 40 is disposed on the substrate, covering the light-emitting component 20 and the photosensitive component 30.

[0081] The light-emitting component 20 includes a light-emitting element 21, a passive element 22, a plurality of first dams 23, a first filter element 24, and a plurality of second dams 26. The light-emitting element 21 is electrically connected to the substrate 10, and the passive element 22 is disposed on the substrate 10 and electrically connected to the light-emitting element 21. A plurality of first dams 23 surround the light-emitting element 21 and the passive element 22 on the substrate 10. The first filter element 24 is disposed on the side of the first dam 23 facing away from the substrate 10 and is disposed opposite to the light-emitting element 21. The first filter element 24 includes a first light-transmitting area 25 located at its center, and the second dams 26 surround the first light-transmitting area 25 and are disposed on the first filter element 24.

[0082] The photosensitive assembly 30 includes a photosensitive element 31, a plurality of third barriers 34, a second filter element 35, and a plurality of fourth barriers 37. The photosensitive element 31 is electrically connected to the substrate 10. The photosensitive element 31 has a photosensitive area 32 and a non-photosensitive area 33 surrounding the photosensitive area 32. The plurality of third barriers 34 are disposed in the non-photosensitive area 33 and surround the photosensitive area 32. The second filter element 35 is disposed on the side of the third barriers 34 opposite to the photosensitive element 31, and the second filter element 35 is disposed corresponding to the photosensitive area 32. The second filter element 35 includes a second light-transmitting area 36 located at the center of the second filter element 35, and the fourth barriers 37 are disposed around the second light-transmitting area 36.

[0083] The package 40 covers the outside of the substrate 10, the first dam 23, the first filter element 24, the second dam 26, the third dam 34, the second filter element 35 and the fourth dam 37, and the package 40, the light-emitting component 20, the photosensitive component 30 and the substrate 10 are formed as one unit.

[0084] This application also provides a camera module including the above-described packaging structure 100. The camera module may be a TOF camera module.

[0085] This application also provides an electronic device including the above-described camera module. The electronic device can be a mobile phone, camera, or smart home device, etc.

[0086] Those skilled in the art may make other changes within the scope of the technical concept of this application. However, all other corresponding changes and modifications made based on the technical concept of this application shall fall within the protection scope of the claims of this application.

Claims

1. A packaging structure, characterized in that, include: substrate; A light-emitting component includes a light-emitting element, a first filter element, and a plurality of first dams. The light-emitting element is connected to the substrate, and the plurality of first dams are disposed around the light-emitting element on the substrate. The first filter element is disposed on the side of the first dam facing away from the substrate, and the first filter element is disposed opposite to the light-emitting element. A photosensitive component is disposed at a distance from the light-emitting component. The photosensitive component includes a photosensitive element, a second filter element, and a plurality of second barriers. The photosensitive element is connected to the substrate. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A plurality of second barriers are disposed in the non-photosensitive area. The second filter element is disposed on the side of the second barrier away from the photosensitive element. The second filter element is disposed corresponding to the photosensitive area. An encapsulation is disposed on the substrate, and the encapsulation covers the outer sides of the substrate, the first dam, the second dam, the first filter element, and the second filter element.

2. The packaging structure as described in claim 1, characterized in that, The first filter element includes a first light-transmitting area located at the center of the first filter element, and the second filter element includes a second light-transmitting area located at the center of the second filter element; Multiple third dams are set around the first light-transmitting area, and multiple fourth dams are set around the second light-transmitting area; The encapsulation body covers the outer sides of the third and fourth cofferdams.

3. The packaging structure as described in claim 1, characterized in that, The light-emitting element is electrically connected to the substrate via a wire, and the photosensitive element is electrically connected to the substrate via a wire.

4. A method for fabricating a packaging structure, characterized in that, Includes the following steps: Provide a substrate; A light-emitting element and a photosensitive element are disposed at intervals on the substrate, and the substrate and the light-emitting element are electrically connected, as are the substrate and the photosensitive element; the photosensitive element includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A plurality of first dams are provided around the light-emitting element on the substrate, and a plurality of second dams are provided around the photosensitive area on the non-photosensitive area; A first filter element is disposed on the side of the first dam away from the substrate, and the first filter element is disposed opposite to the light-emitting element at a distance; and a second filter element is disposed on the side of the second dam away from the photosensitive element, and the second filter element is disposed corresponding to the photosensitive area. An encapsulation body is disposed on the substrate, and the encapsulation body surrounds and covers the outside of the substrate, the first dam, the second dam, the first filter element, and the second filter element.

5. The method for fabricating the packaging structure as described in claim 4, characterized in that, The first filter element includes a first light-transmitting area located at the center of the first filter element, and the second filter element includes a second light-transmitting area located at the center of the second filter element; Before the encapsulation body is disposed on the substrate, the method further includes: disposing of a plurality of third dams around the first light-transmitting area and disposing of a plurality of fourth dams around the second light-transmitting area.

6. The method for fabricating the packaging structure as described in claim 4, characterized in that, A passive element is disposed on the substrate, and the passive element is electrically connected to the light-emitting element.

7. The method for fabricating the packaging structure as described in claim 4, characterized in that, The first and second cofferdams were formed using a dotting method.

8. The method for fabricating the packaging structure as described in claim 4, characterized in that, The first and second dams are made of epoxy resin, and the encapsulation body is also made of epoxy resin.

9. A camera module, characterized in that, Includes the packaging structure as described in any one of claims 1 to 3.

10. An electronic device, characterized in that, Includes the camera module as described in claim 9.

Images