Photosensitive assembly, camera module and manufacturing method thereof

Abstract

The application discloses a photosensitive assembly, a camera module and a manufacturing method thereof. The application relates to a photosensitive assembly, a camera module and a manufacturing method thereof. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component arranged on the circuit board, and a molding body integrally formed on the circuit board. The molding body has at least one slot recessed therein, and the slot is located outside the photosensitive chip. In this way, the stress of the molding body acting on the photosensitive chip is reduced by arranging the slot on the molding body, so that the deformation amount of the photosensitive chip caused by the stress is effectively reduced.

Description

[0001] This application is a divisional application of Chinese invention patent application No. 2019107090514, filed on August 1, 2019, entitled "Photosensitive Component, Camera Module and Manufacturing Method Thereof". Technical Field

[0002] This application relates to the field of camera modules, and more particularly to photosensitive components, camera modules, and methods for manufacturing the same. Background Technology

[0003] To adapt to the trend of miniaturization and thinning of electronic devices, the size of camera modules has gradually decreased. Correspondingly, the packaging technology of camera modules has also gradually evolved from the traditional COB (Chip on Board) process to molding process.

[0004] Figure 1 The diagram illustrates the structure of an existing camera module manufactured using a molding process. For example... Figure 1 As shown, the camera module is manufactured using a MOC (Molding on Chip) molding process, and includes a photosensitive component and an optical lens 1P held in the photosensitive path of the photosensitive component. The photosensitive component includes a circuit board 2P, a photosensitive chip 3P, and a molded body 4P, wherein the molded body 4P is integrally formed on the circuit board 2P to integrally cover at least a portion of the circuit board 2P and at least a portion of the non-photosensitive area of ​​the photosensitive chip 3P. However, the molding packaging process also introduces some new technical problems, such as deformation of the photosensitive chip due to excessive stress, leading to deterioration in image quality.

[0005] Therefore, an improved molding and packaging process and a structural design for the camera module are needed. Summary of the Invention

[0006] The main objective of this application is to provide a photosensitive component, a camera module, and a method for manufacturing the same, which can effectively reduce the bending of the photosensitive chip due to stress, thereby improving the imaging quality of the camera module.

[0007] Another objective of this application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the stress exerted on the photosensitive chip by the molded body is reduced by setting grooves on the molded body, so as to effectively reduce the deformation of the photosensitive chip caused by stress.

[0008] Another objective of this application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the slot is recessed in the molded body and the slot is located on the outside of the photosensitive chip, thereby severing the stress transmission chain formed between the molded body and the photosensitive chip, or reducing the magnitude of the stress transmitted on the stress transmission chain formed between the molded body and the photosensitive chip.

[0009] Another objective of this application is to provide a camera module and a photosensitive component, and a method for manufacturing the same, wherein the slotting divides the molded body into a first molding portion and a second molding portion. Compared to existing molding processes, this reduces the volume of the molding portion covering the photosensitive chip, thereby reducing the shrinkage of the molding portion covering the photosensitive chip at the same shrinkage rate. Consequently, the stress generated in the molding portion is also reduced, thereby reducing the bending of the photosensitive chip.

[0010] Another objective of this application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the slotted design increases the overall exposed surface area of ​​the molded body, so that the stress generated by the molded body can be distributed relatively more to the outer surface of the molded body, thereby relatively reducing the stress exerted by the molded body on the photosensitive chip.

[0011] Another objective of this application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the slotted design increases the overall exposed surface area of ​​the molded body, which is beneficial to improving the heat dissipation performance of the photosensitive component.

[0012] Another objective of this application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the slot provides a heat dissipation channel through which the heat generated by the photosensitive component during operation can be dissipated.

[0013] Another objective of this application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the slot can provide an overflow space for adhesive when an optical lens is mounted on the photosensitive component and / or a filter element is mounted on a molded body or a filter element bracket, so as to contain the overflowing adhesive.

[0014] Another objective of this application is to provide a camera module and a photosensitive component and a method for manufacturing the same. In one embodiment of this application, a filter element bracket is pre-installed on the circuit board and integrally joined to the first and second molded portions of the molded body after molding. The filter element bracket can not only be used to install the filter element, but also prevent the stress generated by the second molded portion from being transmitted to the photosensitive chip, and maintain the shape of the first molded portion to ensure that the internal stress generated by the first molded portion is not sufficient to excessively change the shape of the photosensitive chip.

[0015] Other advantages and features of this application will become apparent from the following description and can be realized by means and combinations particularly pointed out in the claims.

[0016] To achieve at least one of the above objectives or advantages, this application provides a photosensitive component comprising:

[0017] Circuit board;

[0018] A photosensitive chip electrically connected to the circuit board;

[0019] At least one electronic component disposed on the circuit board; and

[0020] A molded body integrally formed on the circuit board, wherein the molded body has at least one groove recessed therein, the groove being located on the outer side of the photosensitive chip.

[0021] In the photosensitive assembly according to this application, the molded body includes a first molded portion and a second molded portion divided by the slot, the first molded portion covering at least a portion of the circuit board and at least a portion of the non-photosensitive area of ​​the photosensitive chip.

[0022] In the photosensitive component according to this application, the depth of the groove is greater than or equal to 30% of the height of the molded body.

[0023] In the photosensitive component according to this application, the slot is formed through the molded body to expose the corresponding area of ​​the circuit board.

[0024] In the photosensitive component according to this application, the first molded portion and the second molded portion are connected by a molding channel.

[0025] In the photosensitive assembly according to this application, the at least one slot includes a first slot and a second slot, the first slot and the second slot being arranged symmetrically with respect to the centerline of the photosensitive chip, wherein the molding channel is formed between the first slot and the second slot during the molding process.

[0026] In the photosensitive component according to this application, the slot is a closed annular groove surrounding the first molded portion to divide the molded body into the first molded portion and the second molded portion, which are independent of each other.

[0027] In the photosensitive component according to this application, the first molded portion and the second molded portion are formed by two molding processes.

[0028] In the photosensitive assembly according to this application, the photosensitive assembly further includes a filter element holder disposed within the slot, wherein the filter element holder is configured to mount a filter element thereon.

[0029] In the photosensitive assembly according to this application, the photosensitive assembly further includes a filter element holder disposed in the slot, wherein the filter element holder is configured to mount a filter element thereon.

[0030] In the photosensitive assembly according to this application, the filter element holder has a through channel therethrough, wherein the filter element holder is pre-set on the circuit board and integrally joined to the first molded portion and the second molded portion of the molded body after the molded body is integrally formed.

[0031] In the photosensitive assembly according to this application, the photosensitive assembly further includes side coating adhesive that covers the side portion of the photosensitive chip.

[0032] In the photosensitive assembly according to this application, the side coating covers at least a portion of the leads used for electrically connecting the photosensitive chip and the circuit board.

[0033] According to another aspect of this application, this application also provides a camera module, which includes:

[0034] Optical lenses; and

[0035] In the photosensitive assembly described above, the optical lens is held in the photosensitive path of the photosensitive assembly.

[0036] According to another aspect of this application, this application also provides a method for manufacturing a photosensitive component, comprising the steps of:

[0037] A circuit board is provided, wherein at least one electronic component and at least one photosensitive chip are electrically connected to the circuit board;

[0038] The circuit board is housed in a molding space formed by the closing of the upper and lower molds of the molding die, wherein the molding die includes protrusions;

[0039] A molded body is formed within the molding space; and

[0040] Separate the upper and lower molds of the molding die to form a groove recessed into the molded body at the position corresponding to the protrusion.

[0041] In the method for manufacturing a photosensitive component according to this application, the process of forming the molded body includes:

[0042] The circuit board is placed in the lower mold of the molding die;

[0043] The upper mold and the lower mold of the molding die are closed, wherein the upper mold includes a mold body and a first protrusion and a second protrusion that are spaced apart from and extend downward from the mold body, wherein when the upper mold and the lower mold are closed, the first protrusion of the upper mold is attached to the circuit board, and the second protrusion of the upper mold is attached to the non-photosensitive area of ​​the photosensitive chip, so as to form a second molding space between the first protrusion and the mold body, and a first molding space between the second protrusion and the first protrusion, wherein the first protrusion also has a molding channel connecting the first molding space and the second molding space;

[0044] Molding material is filled into the first molding space and the second molding space to form a first molding portion in the first molding space and a second molding portion in the second molding space after the molding material has cured; and the second molding portion and the second molding portion are connected through the molding channel; and

[0045] Separate the upper mold and the lower mold to form the slot at the position corresponding to the first protrusion.

[0046] In the method for manufacturing a photosensitive component according to this application, the process of forming the molded body includes:

[0047] Apply a molding material to the circuit board;

[0048] The circuit board is placed in the lower mold of the molding die;

[0049] The upper mold and the lower mold of the molding die are closed, wherein the upper mold includes a mold body and a first protrusion that is spaced apart from and extends downward from the mold body, wherein when the upper mold and the lower mold are closed, the first protrusion of the upper mold is attached to the circuit board to form a first molding space between the first protrusion and the mold body, wherein the molding material is located within the first molding space;

[0050] The first molded part is formed in the first molding space by a molding process;

[0051] Separate the upper mold and the lower mold;

[0052] Apply a molding material to the circuit board;

[0053] The lower mold and the second upper mold of the molding die are closed together, wherein the second upper mold includes a second mold body and a second protrusion that is spaced apart from and extends downward from the second mold body, wherein when the second upper mold and the lower mold are closed together, the second protrusion of the second upper mold is attached to the circuit board to form a second molding space between the second protrusion and the second mold body, wherein the molding material is located in the second molding space;

[0054] The second molded portion is formed within the second molding space by a molding process;

[0055] Separate the upper mold and the lower mold to form the groove recessed into the molded body at the corresponding position of the second protrusion.

[0056] In the method for manufacturing a photosensitive component according to this application, before forming the molded body, the method further includes:

[0057] At least one filter element bracket is pre-set on the circuit board. The filter element bracket has a through channel therethrough so that the filter element bracket is integrally joined to the first molded part and the second molded part of the molded body after the molded body is integrally formed.

[0058] In the method for manufacturing a photosensitive component according to this application, the circuit board is implemented as a circuit board panel.

[0059] According to another aspect of this application, this application also provides a method for manufacturing a camera module, comprising:

[0060] According to the manufacturing method of the photosensitive component as described above, a molded body is formed, wherein the molded body has a recessed groove formed therein, wherein the groove divides the molded body into a first molded portion and a second molded portion; and

[0061] An optical lens is mounted on the second molding portion of the molded body.

[0062] The further objectives and advantages of this application will become fully apparent from the following description and accompanying drawings.

[0063] These and other objects, features and advantages of this application are fully apparent from the following detailed description, the accompanying drawings and the claims. Attached Figure Description

[0064] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0065] Figure 1 The diagram illustrates the structure of an existing camera module manufactured using a molding process.

[0066] Figure 2 The diagram illustrates the deformation of the photosensitive chip under stress in an existing photosensitive component fabricated using a molding process.

[0067] Figure 3 The illustration shows a schematic diagram of a camera module according to an embodiment of this application.

[0068] Figure 4 The illustration shows a schematic diagram of the photosensitive component of the camera module according to an embodiment of this application.

[0069] Figure 5 Another schematic diagram of the photosensitive component according to an embodiment of this application is shown.

[0070] Figure 6A and Figure 6B The illustration shows a schematic diagram of a modified embodiment of the photosensitive component according to an embodiment of this application.

[0071] Figure 7A and Figure 7B The illustration shows a schematic diagram of a modified embodiment of the photosensitive component according to an embodiment of this application.

[0072] Figure 8A and Figure 8B The illustration shows a schematic diagram of a modified embodiment of the photosensitive component according to an embodiment of this application.

[0073] Figure 9A and Figure 9B A schematic diagram of a photosensitive component according to another embodiment of this application is shown.

[0074] Figure 10 The figure shows a schematic diagram of another modified embodiment of the photosensitive component according to an embodiment of this application.

[0075] Figure 11 The figure shows a schematic diagram of another modified embodiment of the photosensitive component according to an embodiment of this application.

[0076] Figure 12 The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component according to an embodiment of this application.

[0077] Figure 13 A schematic diagram of a photosensitive component according to yet another embodiment of this application is illustrated.

[0078] Figure 14 The illustration shows a schematic diagram of yet another modified embodiment of the present application.

[0079] Figure 15 The illustration shows a schematic diagram of the manufacturing process of a photosensitive component according to an embodiment of this application.

[0080] Figure 16A and Figure 16B The illustration shows a schematic diagram of the manufacturing process of a photosensitive component according to another embodiment of this application.

[0081] Figure 17 The illustration shows a schematic diagram of the manufacturing process of a photosensitive component according to another embodiment of this application. Detailed Implementation

[0082] Hereinafter, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.

[0083] Application Overview

[0084] As mentioned above, while molding processes such as MOC (Molding on Chip) can make camera modules smaller, the molding packaging process also introduces some new technical problems.

[0085] Specifically, in the molded camera module, the bonding between the circuit board 2P and the molded body 4P, and the bonding between the molded body 4P and the photosensitive chip 3P, are rigid bondings with high strength, requiring destructive methods to remove. In contrast, the photosensitive chip 3P is bonded to the circuit board 2P with adhesive, a flexible bonding. Furthermore, the circuit board 2P, the molded body 4P, and the photosensitive chip 3P have different coefficients of thermal expansion. Those skilled in the art should know that the molding process involves significant and frequent changes in ambient temperature (molding materials require temperatures above 150 degrees Celsius), causing varying degrees of expansion and contraction in the photosensitive chip 3P, circuit board 2P, and molded body 4P. Moreover, the rates of expansion and contraction are inconsistent among the circuit board 2P, molded body 4P, and photosensitive chip 3P, resulting in minimal shrinkage of the final photosensitive chip 3P.

[0086] Since the bonding between circuit board 2P and molded body 4P, and between molded body 4P and photosensitive chip 3P, is a rigid bonding, stress will be generated between circuit board 2P and molded body 4P, and between photosensitive chip 3P and molded body 4P. Furthermore, because photosensitive chip 3P has the smallest shrinkage, the stress will be concentrated on photosensitive chip 3P, causing significant deformation of photosensitive chip 3P, the deformation effect of which is as follows... Figure 2 As shown. It is worth mentioning that, as Figure 2 The distortion effect shown is exaggerated and is only intended to indicate the direction and characteristics of the deformation; it does not represent the specific size of the deformation. The bent 3P sensor chip will significantly impact image quality, manifesting in the camera module's performance as follows: excessive field curvature in the camera module results in normal center image quality but poor edge image quality.

[0087] Meanwhile, imaging components formed through molding processes also have defects such as poor heat dissipation performance.

[0088] To address the aforementioned technical problems, the basic concept of this application is to reduce the stress exerted by the molded body on the photosensitive chip by setting grooves on the molded body, thereby effectively reducing the deformation of the photosensitive chip caused by stress.

[0089] Based on this, this application proposes a photosensitive assembly, comprising: a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on the circuit board, and a molded body integrally formed on the circuit board, wherein the molded body has at least one recessed slot formed therein, the slot being located on the outer side of the photosensitive chip. Thus, by providing a slot in the molded body, the stress exerted by the molded body on the photosensitive chip is reduced, thereby effectively reducing the deformation of the photosensitive chip due to stress.

[0090] After introducing the basic principles of this application, various non-limiting embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0091] Exemplary camera module

[0092] like Figure 3 - Figure 5 As shown, a camera module based on an embodiment of this application is illustrated. The camera module includes an optical lens 10 and a photosensitive component 20. The optical lens 10 is positioned along the photosensitive path of the photosensitive component 20, so that light collected by the optical lens 10 can be imaged in the photosensitive component 20 along the photosensitive path. It should be noted that, as... Figure 3The camera module shown is a fixed-focus camera module. Of course, those skilled in the art should know that the camera module involved in this application can also be implemented as a dynamic-focus camera module. That is, the camera module further includes a driving element (e.g., a motor) disposed between the optical lens 10 and the photosensitive component 20, so as to carry the optical lens 10 to move along the photosensitive path through the driving element, so as to change the distance between the optical lens 10 and the photosensitive component 20.

[0093] like Figure 4 As shown in this embodiment, the photosensitive component 20 includes a circuit board 21, a photosensitive chip 22, at least one electronic component 23, and a molded body 24. The photosensitive chip 22 is electrically connected to the circuit board 21. The at least one electronic component 23 is disposed around the photosensitive chip 22 and electrically connected to the circuit board 21. The molded body 24 is integrally formed on the circuit board 21 by a molding process to cover at least a portion of the circuit board 21. In particular, in this embodiment, the molded body 24 has a recessed groove 240 therein to reduce the stress exerted by the molded body 24 on the photosensitive chip 22, thereby effectively reducing the deformation of the photosensitive chip 22 due to stress.

[0094] Specifically, in this embodiment, the at least one electronic component 23 can be mounted on the upper surface of the circuit board 21 using surface mounting technology. Typically, the at least one electronic component 23 is mounted around the photosensitive chip 22. Alternatively, the at least one electronic component 23 can be embedded in the circuit board 21 to reduce its protrusion from the circuit board 21. It should be understood that the mounting process for the at least one electronic component 23 is not limited to this application. Furthermore, in this embodiment, the type of the at least one electronic component 23 is not limited to this application, and it includes, but is not limited to, capacitors, inductors, transistors, thyristors, resistors, etc.

[0095] like Figure 4As shown in the embodiment of this application, the electrical connection between the photosensitive chip 22 and the circuit board 21 is achieved through leads 25. Specifically, in this embodiment, each lead 25 extends curvedly between the photosensitive chip 22 and the circuit board 21 to electrically connect the photosensitive chip 22 to the circuit board 21. Thus, the circuit board 21 can supply power to the photosensitive chip 22 based on the leads 25, and the photosensitive chip 22 can transmit the collected signals based on the leads 25. It is worth noting that the type of lead 25 is not limited to that of this application; for example, the lead 25 can be gold wire, silver wire, or copper wire. Furthermore, the lead 25 can be installed between the circuit board 21 and the photosensitive chip 22 using a "gold wire bonding" process to achieve the electrical connection between them.

[0096] Specifically, the "gold wire bonding" process is generally divided into two types: "positive gold wire bonding" and "reverse gold wire bonding". The "positive gold wire bonding" process refers to the process of forming one end of the lead 25 on the conductive end of the circuit board 21 during the laying of the lead 25, then extending the lead 25 in a curved manner, and finally forming the other end of the lead 25 on the conductive end of the photosensitive chip 22. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. The "reverse gold wire bonding" process refers to the process of forming one end of the lead 25 on the conductive end of the photosensitive chip 22 during the laying of the lead 25, then extending the lead 25 in a curved manner, and finally forming the other end of the lead 25 on the conductive end of the circuit board 21. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. It is worth mentioning that the height of the upward protrusion of the lead wire 25 formed by the "reverse gold wire" process is relatively higher than the height of the upward protrusion of the lead wire 25 formed by the "positive gold wire" process. Therefore, preferably, in this specific implementation, the "reverse gold wire" process is used to form the lead wire 25.

[0097] Of course, those skilled in the art will recognize that in other examples of this application, the photosensitive chip 22 and the circuit board 21 can be connected in other ways, such as through a back-to-back connection. This is not a limitation of this application.

[0098] like Figure 4As shown in this embodiment, the molded body 24 is integrally formed on the circuit board 21 to integrally cover at least a portion of the circuit board 21, at least a portion of the non-photosensitive area of ​​the photosensitive chip 22, and at least a portion of the at least one electronic component 23. Specifically, in this embodiment, the molded body 24 has at least one recessed slot 240. From its positional arrangement, the slot 240 is located on the outer side of the photosensitive chip 22. This positioning effectively reduces the stress exerted by the molded body 24 on the photosensitive chip 22, thereby effectively reducing the deformation of the photosensitive chip 22 due to stress.

[0099] Specifically, because the combination of the circuit board 21 and the molded body 24, and the combination of the molded body 24 and the photosensitive chip 22, are rigid connections, while the combination between the photosensitive chip 22 and the circuit board 21 is a flexible connection, and because the coefficients of thermal expansion of the circuit board 21, the molded body 24, and the photosensitive chip 22 are different, stress will be generated between the circuit board 21 and the molded body 24, and between the photosensitive chip 22 and the molded body 24. Furthermore, because the photosensitive chip 22 has the least shrinkage, the stress will be concentrated on the photosensitive chip 22. Accordingly, by providing the longitudinal slot 240 on the outer side of the photosensitive chip 22 (or, between the photosensitive chip 22 and the molded body 24), the amount of stress transmission between the molded body 24 and the photosensitive chip 22 can be reduced. Intuitively, as... Figure 4 As shown, by providing a longitudinal slot 240 on the molded body 24, the thickness of the molded portion in the molded body 24 used to transmit stress is reduced, thereby reducing the stress exerted by the molded body 24 on the photosensitive chip 22.

[0100] From the perspective of stress transmission path, the slot 240 disposed between the photosensitive chip 22 and the molded body 24 is equivalent to "cutting" a piece in the stress transmission chain between the molded body 24 and the photosensitive chip 22, thereby disrupting the stress transmission chain. More specifically, the slot 240 can be formed between the electronic component 23 and the lead 25, or between two electronic components 23, or on the outside of the electronic component 23; this is not limited to this application. Preferably, in the embodiment of this application, the slot 240 is formed between the electronic component 23 and the lead 25.

[0101] It should be understood that the ability of the slot 240 to reduce the stress exerted by the molded body 24 on the photosensitive chip 22 is related to the depth of the slot 240. Specifically, as the depth of the slot 240 increases, its ability to reduce the stress exerted by the molded body 24 on the photosensitive chip 22 becomes stronger. In particular, in some examples of this application, the depth of the slot 240 is greater than or equal to 30% of the height of the molded body 24, such as... Figure 6A and Figure 6B As shown. Here, the height of the molded body 24 refers to the height of the molded body 24 at the location where the slot 240 is provided. It should be understood that the height of the molded body 24 may vary at different locations due to the shape configuration of the molded body 24. Preferably, the depth of the slot 240 is greater than or equal to half the height of the molded body 24.

[0102] More preferably, in this embodiment, the depth of the slot 240 is equal to the height of the molded body 24. That is, preferably, the slot 240 is a through-slot formed in the molded body 24 to expose the corresponding area of ​​the circuit board 21. It should be understood that when the slot 240 is a through-slot in the molded body 24, the stress transmission chain between the molded body 24 and the photosensitive chip 22 is completely severed by the slot 240, thereby minimizing the stress exerted by the molded body 24 on the photosensitive chip 22. It is worth mentioning that, in this embodiment, the width of the slot 240 can also be increased as much as possible without excessively compromising the overall structural strength of the molded body 24, to enhance the ability of the slot 240 to reduce the stress exerted by the molded body 24 on the photosensitive chip 22.

[0103] like Figure 3-5 As shown, when the slot 240 is formed on the molded body 24, the molded body 24 is divided into a first molded portion 241 and a second molded portion 242 with the slot 240 as the boundary. The first molded portion 241 covers at least a portion of the circuit board 21 and at least a portion of the non-photosensitive area of ​​the photosensitive chip 22, and the second molded portion 242 covers at least a portion of the at least one electronic component 23 and at least a portion of the circuit board 21.

[0104] It is worth mentioning that, in this embodiment, since the slot 240 divides the molded body 24 into a first molding portion 241 and a second molding portion 242, the volume of the molding portion covering the photosensitive chip 22 is reduced compared to existing molding processes. This results in a smaller shrinkage of the molding portion covering the photosensitive chip 22 under the same shrinkage rate, thereby reducing the stress generated by the molding portion and reducing the bending of the photosensitive chip 22. In particular, in this embodiment, the volume of the first molding portion 241 can be smaller than that of the second molding portion 242 to reduce the stress exerted by the molded body 24 on the photosensitive chip 22.

[0105] In particular, such as Figure 5 As shown in the embodiment of this application, the first molded portion 241 and the second molded portion 242 of the molded body 24 are connected by a molding channel 243. Specifically, as Figure 5 As shown in the embodiment of this application, the at least one slot 240 includes a first slot 2401 and a second slot 2402, wherein the first slot 2401 and the second slot 2402 are respectively formed through the molded body 24. In particular, the first slot 2401 and the second slot 2402 surround the first molded portion 241 and engage at the molding channel 243. That is, in the embodiment of this application, the molding channel 243 is formed between the first slot 2401 and the second slot 2402 so that after the molded body 24 is molded, the molded body 24 is divided into the first molded portion 241 and the second molded portion 242 by the first slot 2401 and the second slot 2402, and the first molded portion 241 and the second molded portion 242 are connected by the molding channel 243. Preferably, in this embodiment of the application, the first slot 2401 and the second slot 2402 are arranged symmetrically with respect to the center line of the photosensitive chip 22, and the first slot 2401 and the second slot 2402 have The shape is not limited to the shape of the letter. Of course, in other examples of embodiments of this application, the first slot 2401 and the second slot 2402 may also be arranged asymmetrically, or when the first slot 2401 and the second slot 2402 are arranged symmetrically, the first slot 2401 and the second slot 2402 may be implemented in other shapes, such as the shape of the letter "I", which is not limited to this application.

[0106] It is worth mentioning that in other examples of this application, the at least one slot 240 may also include a greater number of slots 240 (e.g., a third slot 2403) or only include a first slot 2401 surrounding the first molded portion 241, which is not limited to this application.

[0107] Figure 7A and Figure 7B The illustration shows a schematic diagram of a modified embodiment of the photosensitive component 20 according to an embodiment of this application. For example... Figure 7A and Figure 7B As shown, in this modified embodiment, the first molding portion 241 and the second molding portion 242 of the molded body 24 are connected by a molding channel 243. Specifically, in this modified embodiment, the height of the molding channel 243 is lower than that of the first molding portion 241 and the second molding portion 242, so as to form a third slot 2403 between the molding channel 243, the first molding portion 241, and the second molding portion 242. That is, in this modified embodiment, the slot 240 not only includes the first slot 2401 and the second slot 2402 penetrating the molded body 24, but also includes the third slot 2403 formed by the channel of the molded body 24 and the first molding portion 241 and the second molding portion 242. It should be understood that... Figure 7A and Figure 7B The first molding portion 241 and the second molding portion 242 of the molded body 24 shown can be formed by a single molding process, wherein the molding channel 243 is provided to achieve this process objective.

[0108] Figure 8A and Figure 8B The illustration shows a schematic diagram of a modified embodiment of the photosensitive component 20 according to an embodiment of this application. For example... Figure 8A and Figure 8B As shown, in this modified embodiment, the first molding portion 241 and the second molding portion 242 of the molded body 24 are connected by a molding channel 243. Specifically, in this modified embodiment, the molded body 24 includes only one molding channel 243, and the height of the molding channel 243 may be lower than or equal to that of the first molding portion 241 and the second molding portion 242. Figure 8B As shown in the embodiment of this application, the slot 240 has The font. This should be understandable. Figure 8A and Figure 8B The first molding portion 241 and the second molding portion 242 of the molded body 24 shown can be formed by a single molding process, wherein the molding channel 243 is provided to achieve this process objective.

[0109] Figure 9A and Figure 9B A schematic diagram of a photosensitive component 20 according to another embodiment of this application is illustrated. Figure 9A and 9B As shown, compared to Figure 4 In the schematic diagram of the photosensitive component 20, in this embodiment of the application, the slot 240A is a closed annular slot completely surrounding the first molded portion 241A. That is, in this embodiment of the application, the first molded portion 241A and the second molded portion 242A of the molded body 24A are divided into two independent molded portions by the slot 240A. In other words, in this embodiment of the application, the slot 240A can completely isolate the connection between the first molded portion 241A and the second molded portion 242A, so that the stress generated by the second molded portion 242A will not be transmitted to the first molded portion 241A, and consequently, will not be transmitted to the photosensitive chip 22A. Specifically, in this embodiment of the application, the first molded portion 241A and the second molded portion 242A are formed through two molding processes. That is, in this embodiment of the application, the first molded portion 241A and the second molded portion 242A are formed separately in batches, while... Figure 4 The molded body 24 shown can be formed in a single molding process. This part will be described in more detail later in the manufacturing process of the photosensitive component 20A, and will be omitted here.

[0110] To prevent the photosensitive chip 22 from shifting position due to impact from the injected molding material during the molding process, in some examples of embodiments of this application, the photosensitive component 20 further includes a side coating 28 that covers at least a portion of the side of the photosensitive chip 22 and the lead 25, to prevent the photosensitive chip 22 from shifting position during the molding process. The effect is as follows: Figure 10 As shown. It should be understood that the side coating 28 not only prevents the photosensitive chip 22 from shifting position, but also effectively reduces the stress generated by the molded body 24 from being transmitted to the photosensitive chip 22. At the same time, it also prevents the lead wire 25 from collapsing due to impact from the molding material.

[0111] Furthermore, such as Figure 4As shown in this embodiment, the photosensitive component 20 further includes a filter element 26 held in the photosensitive path of the photosensitive chip 22. The filter element 26 corresponds to at least the photosensitive area of ​​the photosensitive chip 22 and is used to filter light entering the photosensitive chip 22 to improve image quality. Specifically, in this embodiment, the filter element 26 is attached to the first molding portion 241 of the molded body 24 to be held in the photosensitive path of the photosensitive chip 22. It is worth noting that when the slot 240 is located between the electronic component 23 and the lead 25, the slot 240 is adjacent to the first molding portion 241, so that when the filter element 26 is attached to the first molding portion 241, excess adhesive can be contained in the slot 240 to prevent excess adhesive from contaminating other components (especially the photosensitive chip 22). That is, in this embodiment, the slot 240 also functions as an overflow groove. It should be understood that, in order to better guide the flow of adhesive, in some examples of the embodiments of this application, a guide channel communicating with the slot 240 may be further formed recessed on the upper surface of the first molding portion 241 to guide excess adhesive to flow to the slot 240.

[0112] In some examples of embodiments of this application, such as Figure 11 As shown, the first molding portion 241 further includes a mounting platform 260 recessed on the upper surface of the first molding portion 241, the mounting platform 260 being configured to mount the filter element 26 thereon. It should be understood that, compared to directly attaching the filter element 26 to the upper surface of the first molding portion 241, mounting the filter element 26 on the mounting platform 260 helps to reduce the size of the filter element 26, thereby reducing its cost. Furthermore, this mounting method can shorten the distance between the filter element 26 and the photosensitive chip 22, thus reducing the overall thickness of the photosensitive assembly 20. It is worth mentioning that, in this embodiment, the inner surface of the first molding portion 241 can be perpendicular to or inclined to the photosensitive chip 22, wherein different configurations of the inner surface correspond to different protrusion parameter configurations of the molding die 90, and this is not limited to this application.

[0113] Those skilled in the art will understand that, in the embodiments of this application, the filter element 26 can be implemented in different types, including but not limited to, the filter element 26 can be implemented as an infrared cut-off filter, a full-transmission filter, and other filters or combinations of multiple filters. Specifically, for example, when the filter element 26 is implemented as a combination of an infrared cut-off filter and a full-transmission filter, that is, the infrared cut-off filter and the full-transmission filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 22. In this way, when used in environments with sufficient light, such as during the day, the infrared cut-off filter can be switched to the photosensitive path of the photosensitive chip 22 to filter out infrared rays in the light reflected by objects entering the photosensitive chip 22. And when used in environments with low light, such as at night, the full-transmission filter can be switched to the photosensitive path of the photosensitive chip 22 to allow the infrared portion of the light reflected by objects entering the photosensitive chip 22 to pass through.

[0114] Figure 12 The illustration shows a schematic diagram of yet another modified embodiment of the photosensitive component 20 according to an embodiment of this application. For example... Figure 12 As shown, in this modified embodiment, the photosensitive assembly 20 further includes a filter element support 27, wherein the filter element support 27 is disposed in the slot 240 and configured to mount the filter element 26 thereon. Specifically, in this modified embodiment, the filter element support 27 includes a support body and a support arm extending inward from the support body, wherein the support arm forms a through-hole corresponding to at least a photosensitive area of ​​the photosensitive chip 22. Accordingly, when the filter element 26 is mounted on the support arm, the filter element 26 covers the through-hole so that light is filtered by the filter element 26 before reaching the photosensitive chip 22 through the through-hole, thereby improving image quality. It should be understood that, through the support arm of the filter element support 27, the size of the filter element 26 can be further reduced, thereby further reducing the cost of the filter element 26. It is worth mentioning that, in other examples of embodiments of this application, the filter element 26 can also be maintained in the photosensitive path of the photosensitive chip 22 in other ways. For example, the filter element 26 can be directly stacked on the photosensitive chip 22 and participate in the molding process, so that the first molded portion 241 of the molded body 24 after molding covers a portion of the filter element 26 and at least a portion of the circuit board 21. Furthermore, the filter element 26 can also be supported within the optical lens 10, or formed on the surface of the lens in the optical lens 10 in the form of a coating. This is not limited to the present application.

[0115] Figure 13A schematic diagram of a photosensitive component 20 according to yet another embodiment of this application is illustrated. Figure 13 As shown in this embodiment, the filter element holder 27B is integrally formed between the first molding portion 241B and the second molding portion 242B of the molded body 24B. Specifically, in this embodiment, before performing the molding process, the filter element holder 27B is disposed on the circuit board 21B, and the filter element holder 27B has a through channel (not shown in the figure) configured to allow molding material to flow through. Specifically, the channel may be disposed at the bottom of the filter element holder 27B or formed through the sidewall of the filter element holder 27B. Accordingly, after the molding material is injected into the molding die 90B and the molded body 24B is formed, the filter element holder 27B is integrally formed between the first molding portion 241B and the second molding portion 242B of the molded body 24B. How the filter element 26B is combined between the first molding portion 241B and the second molding portion 242B, and how the molding body 24B is molded, will be further described in the subsequent manufacturing process of the photosensitive component 20B, and will not be elaborated here.

[0116] Preferably, in this embodiment of the application, the filter element holder 27B is made of a rigid material (e.g., metal, PMMA, ceramic, ABS resin, etc.) to give the filter element holder 27B high structural strength. It should be observed that after the molded body 24B is integrally formed, the inner surface of the filter element holder 27B is integrally bonded to the first molded portion 241B, and the outer surface of the filter element 26B is integrally bonded to the second molded portion 242B. Thus, the filter element holder 27B can maintain the shape of the first molded portion 241B, thereby ensuring that the internal stress generated by the first molded portion 241B is insufficient to excessively alter the shape of the photosensitive chip 22B. Furthermore, since the filter element bracket 27B is disposed between the first molding portion 241B and the second molding portion 242B, the stress generated by the second molding portion 242B can be isolated by the filter element bracket 27B, so that the stress generated by the second molding portion 242B cannot affect the photosensitive chip 22B located inside the filter element bracket 27B.

[0117] In other words, in this embodiment, the filter element support 27B integrally integrated with the first molding portion 241B and the second molding portion 242B of the molded body 24B can not only be used to mount the filter element 26B thereon, but also prevent the stress generated by the second molding portion 242B from affecting the photosensitive chip 22B, and maintain the shape of the first molding portion 241B to ensure that the internal stress generated by the first molding portion 241B is not sufficient to excessively change the shape of the photosensitive chip 22B.

[0118] It is worth mentioning that, such as Figure 3 - Figure 13 As shown, the slot 240 not only reduces the stress exerted by the molded body 24 on the photosensitive chip 22, but also increases the overall exposed surface area of ​​the molded body 24. This allows the stress generated by the molded body 24 to be distributed more extensively on the outer surface of the molded body 24, thereby relatively reducing the magnitude of the stress exerted by the molded body 24 on the photosensitive chip 22. It should be understood that the slot 240 increases the overall exposed surface area of ​​the molded body 24, and provides a heat dissipation channel, allowing the heat generated by the photosensitive component 20 during operation to be dissipated through the heat dissipation channel, which is beneficial to improving the heat dissipation performance of the photosensitive component 20. It is also worth mentioning that, in this embodiment, considering the stress effect of the molded body 24, the slot 240 with a certain depth is formed on the molded body. As the depth of the slot 240 increases, the heat dissipation area of ​​the heat dissipation channel also continuously increases, thereby enhancing the heat dissipation performance of the photosensitive component 20. Specifically, as mentioned above, in the embodiments of this application, the depth of the slot 240 is greater than or equal to 30% of the height of the molded body 24.

[0119] It is also worth mentioning that the molded body 24 described in the embodiments of this application can also be formed by compression molding, wherein the compression molding material includes, but is not limited to, powdered or gel-like epoxy resin, etc., and is not limited to this application.

[0120] Figure 14 The illustration shows another modified embodiment of the photosensitive component 20 according to an embodiment of this application. For example... Figure 14As shown, in this modified embodiment, the photosensitive component 20 further includes a reinforcing plate disposed on the lower surface of the circuit board 21 to enhance the structural strength of the circuit board 21. This is because when the slot 240 is formed in the molded body 24, the structural strength of a portion of the circuit board 21 (exposed area) is weakened; the reinforcing plate prevents the circuit board 21 from deforming or even breaking. Preferably, the reinforcing plate is made of a material with high rigidity, such as metal, ceramic, ABS resin, etc.

[0121] In summary, the camera module and its photosensitive component based on the embodiments of this application are explained, which reduces the stress exerted by the molded body on the photosensitive chip by opening grooves in the molded body, so as to prevent the photosensitive chip from undergoing excessive deformation due to large stress, thereby improving the imaging quality of the camera module.

[0122] Schematic diagram of the manufacturing process of the photosensitive component

[0123] Figure 15 The illustration shows a schematic diagram of the manufacturing process of the photosensitive component 20 according to an embodiment of this application, wherein, Figure 15 The manufacturing process of the photosensitive component 20 shown herein is to manufacture as follows: Figure 4 The photosensitive component 20 shown is an example.

[0124] like Figure 15 As shown, the manufacturing process first includes: providing a circuit board panel 210, and electrically connecting at least one electronic component 23 and at least one photosensitive chip 22 to a preset position on the circuit board panel 210.

[0125] Further, the circuit board panel 210 is placed in a molding die 90, wherein the molding die 90 includes an upper die 91 and a matching lower die 92. Specifically, in this example of the application, the circuit board panel 210 is placed in the lower die 92 of the molding die 90, and then the upper die 91 and the lower die 92 are closed, so that the circuit board panel 210 is contained in the molding space defined by the upper die 91 and the lower die 92.

[0126] Specifically, in the embodiment of the present application, the upper mold 91 includes a mold body 911, a first protrusion 912 and a second protrusion 913 that extend downward at intervals from the mold body 911. Among them, the cross-sections of the first protrusion 912 and the second protrusion 913 have a closed ring shape, for example, a "mouth" shape. When the upper mold 91 and the lower mold 92 are closed, the first protrusion 912 of the upper mold 91 is fitted to the circuit board panel 210, and the second protrusion 913 of the upper mold 91 is fitted to the photosensitive chip 22. Specifically, the position where the first protrusion 912 is fitted to the circuit board panel 210 is provided between the lead 25 and the electronic component 23, and the position where the second protrusion 913 is fitted to the photosensitive chip 22 is provided in the non-photosensitive area of the photosensitive chip 22. In this way, a second molding space 915 is formed between the first protrusion 912 and the mold body 911, and a first molding space 914 is formed between the second protrusion 913 and the first protrusion 912. Further, in this example of the present application, a molding channel (not shown in the figure) is further provided on the first protrusion 912 for connecting the first molding space 914 and the second molding space 915.

[0127] In this way, when the molding material is injected into the molding space, the molding material gradually fills the second molding space 915 along the preset flow channel and then fills the first molding space 914 along the molding channel (not shown in the figure). Further, after curing and molding, a first molded part 241 is formed in the first molding space 914, and a second molded part 242 is formed in the second molding space 915. Among them, the first molded part 241 covers at least a part of the circuit board 21 and at least a part of the non-photosensitive area of the photosensitive chip 22, and the second molded part 242 covers at least part of the at least one electronic component 23 and at least a part of the circuit board 21. And the second molded part 242 and the second molded part 242 are connected through the molding channel (not shown in the figure). Further, a slot 240 is formed at the position corresponding to the first protrusion 912, that is, a slot 240 penetrating the molded body 24 is formed between the first molded part 241 and the second molded part 242.

[0128] After obtaining the photosensitive component panel, the photosensitive component panel is cut to obtain a plurality of single photosensitive components 20. Further, a filter element 26 is assembled on the photosensitive component 20 to obtain the photosensitive component 20 as Figure 4 shown in the figure.

[0129] It is worth mentioning that in the embodiment of the present application, Figure 6A and Figure 6B 、 Figure 7Aand Figure 7B , Figure 8A and Figure 8B , Figure 10 , Figure 11 , Figure 12 and Figure 14 The manufacturing process of the photosensitive component 20 shown is similar to Figure 4 The manufacturing process shown is similar to that of the process described, and those skilled in the art should be able to understand it based on this. Figure 6A and Figure 6B , Figure 7A and Figure 7B , Figure 8A and Figure 8B , Figure 10 , Figure 11 , Figure 12 and Figure 14 The manufacturing process of the photosensitive component 20, as shown in the schematic diagram, can be easily deduced, so it will not be described in detail here.

[0130] Figure 16A and Figure 16B The illustration shows a schematic diagram of the manufacturing process of the photosensitive component 20 according to an embodiment of this application, wherein, Figure 16A and Figure 16B The manufacturing process of the photosensitive component 20 shown is to manufacture... Figure 9A and Figure 9B The photosensitive component 20A shown is an example. It is worth mentioning that the molded body 24A in this embodiment is formed by compression molding, wherein the compression molding material 900A includes, but is not limited to, powdered, gel-like or granular epoxy resin, etc., and is not limited to this application.

[0131] like Figure 16A and Figure 16B As shown, the manufacturing process first includes: providing a circuit board panel 210A, and electrically connecting at least one electronic component 23A and at least one photosensitive chip 22A to a predetermined position on the circuit board panel 210A. Further, the molding material 900A is applied to the predetermined position on the circuit board panel 210A.

[0132] Further, the circuit board panel 210A is placed in a molding die 90A, wherein the molding die 90A includes an upper die 91A and a matching lower die 92A. Specifically, in this example of the application, the circuit board panel 210A is placed in the lower die 92A of the molding die 90A, and then the upper die 91A and the lower die 92A are closed, so that the circuit board panel 210A is contained in the molding space defined by the upper die 91A and the lower die 92A.

[0133] Specifically, in this embodiment, the upper mold 91A includes a mold body 911A and a first protrusion 912A extending downward from the mold body 911A at a distance. The cross-section of the first protrusion 912A is a closed ring, for example, a "U" shape. When the upper mold 91A and the lower mold 92A are closed, the first protrusion 912A of the upper mold 91A adheres to the non-photosensitive area of ​​the photosensitive chip 22A to seal at least the photosensitive area of ​​the photosensitive chip 22A and form a first molding space 914A between the first protrusion 912A and the mold body 911A, wherein the molding material 900A is contained within the first molding space 914A.

[0134] Thus, after the molding material 900A is cured and formed, the first molding portion 241A is formed in the first molding space 914A, wherein the first molding portion 241A covers at least a portion of the circuit board 21A and at least a portion of the non-photosensitive area of ​​the photosensitive chip 22A.

[0135] Then, the upper mold 91A is replaced with a second upper mold 91'A, wherein the second upper mold 91'A includes a second mold body 911'A and a second protrusion 913'A extending downward from the second mold body 911'A. Then, the molding material 900A is applied to a predetermined position on the circuit board panel 210A. Then, when the second upper mold 91'A and the lower mold 92A are closed, the second protrusion 913'A of the second upper mold 91'A adheres to the circuit board panel 210A; more specifically, the position of adhesion to the circuit board panel 210A is located between the lead 25A and the electronic component 23A, thus forming a second molding space 915'A between the second protrusion 913'A and the second mold body 911'A, wherein the molding material 900A is contained within the second molding space 915'A.

[0136] Thus, after the molding material is cured, a second molding portion 242A is formed within the second molding space 915'A, wherein the second molding portion 242A covers at least a portion of the at least one electronic component 23A and at least a portion of the circuit board 21A. Furthermore, the slot 240A is formed at the position corresponding to the second protrusion 913A, that is, the slot 240A, penetrating the molded body 24A, is formed in the first molding portion 241A and the second molding portion 242A.

[0137] It should be understood that, in order to prepare the photosensitive component 20A as shown in FIG7 in this application example, two molding processes are required and different upper molds 91A need to be changed in the two different molding processes.

[0138] After obtaining the photosensitive component panel, the panel is cut to obtain multiple individual photosensitive components 20A. Further, a filter element 26A is assembled onto the photosensitive component 20A to obtain... Figure 9A and Figure 9B The photosensitive component 20A shown is illustrated.

[0139] Figure 17 The illustration shows a schematic diagram of the manufacturing process of the photosensitive component 20 according to an embodiment of this application, wherein, Figure 17 The manufacturing process of the photosensitive component 20 shown is to manufacture... Figure 13 The photosensitive component 20 mentioned above is an example.

[0140] like Figure 17 As shown, the manufacturing process first includes: providing a circuit board panel 210B, and electrically connecting at least one electronic component 23B and at least one photosensitive chip 22B to a preset position on the circuit board panel 210B.

[0141] Furthermore, the filter element bracket 27B with a channel (not shown in the figure) is disposed on the circuit board panel 210B. Specifically, the filter element bracket 27B is disposed on the panel of the filter element 26B outside the photosensitive chip 22B, or between the lead 25B and the electronic component 23B.

[0142] Further, the circuit board panel 210B is placed in a molding die 90B, wherein the molding die 90B includes an upper die 91B and a matching lower die 92B. Specifically, in this example of the application, the circuit board panel 210B is placed in the lower die 92B of the molding die 90B, and then the upper die 91B and the lower die 92B are closed, so that the circuit board panel 210B is contained in the molding space defined by the upper die 91B and the lower die 92B.

[0143] Specifically, in the embodiment of the present application, the upper mold 91B includes a mold body 911B, a first protrusion 912B, and a second protrusion 913B that extend downward at intervals from the mold body 911B. The cross-sections of the first protrusion 912B and the second protrusion 913B are closed rings, for example, in the shape of a "mouth". When the upper mold 91B and the lower mold 92B are closed, the first protrusion 912B of the upper mold 91B abuts against the filter element bracket 27B, and the second protrusion 913B of the upper mold 91B abuts against the non-photosensitive area of the photosensitive chip 22B, so as to form a second molding space 915B between the first protrusion 912B and the mold body 911B, and a first molding space 914B between the second protrusion 913B and the first protrusion 912B. The first molding space 914 and the second molding space 915B are connected through the channel (not shown in the figure) provided on the filter element bracket 27B.

[0144] In this way, when the molding material is injected into the molding space, the molding material gradually fills the second molding space 915B along the preset flow channel and then fills the first molding space 914B along the channel. Further, after curing and molding, the first molded part 241B is formed in the first molding space 914B, the second molded part 242B is formed in the second molding space 915B, and the filter element 26B integrally combined between the two is formed between the second molded part 242B and the second molded part 242B. The first molded part 241B covers at least a part of the circuit board 21B and at least a part of the non-photosensitive area of the photosensitive chip 22B, and the second molded part 242B covers at least a part of the at least one electronic component 23B and at least a part of the circuit board 21B.

[0145] After obtaining the photosensitive component layout, the photosensitive component layout is cut to obtain a plurality of monomeric photosensitive components 20B. Further, assembling the filter element 26B on the photosensitive component 20B gives the photosensitive component 20B as Figure 13 shown.

[0146] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been shown and described in the embodiments. Without departing from the principle, the embodiments of the present invention can have any deformation or modification.

Claims

1. A photosensitive component, characterized in that, include: Circuit board; A photosensitive chip electrically connected to the circuit board; A molded body integrally formed on the circuit board, wherein the molded body has at least one groove recessed therein, and the coefficient of thermal expansion of the molded body is greater than or less than the coefficient of thermal expansion of the photosensitive chip; and At least one electronic component disposed on the circuit board; The molded body is divided into a first molded part and a second molded part located outside the first molded part, with the slot as the boundary. The first molded part covers at least a portion of the circuit board and at least a portion of the non-photosensitive area of ​​the photosensitive chip. The slot is located outside the photosensitive chip to reduce the stress exerted by the molded body on the photosensitive chip. The groove is longitudinal; the groove is a closed annular groove surrounding the first molded part, so as to divide the molded body into the first molded part and the second molded part, which are independent of each other.

2. The photosensitive component according to claim 1, wherein, The second molded portion covers at least a portion of the at least one electronic component and at least a portion of the circuit board.

3. The photosensitive component according to claim 1, wherein, The slot is formed through the molded body to expose the corresponding area of ​​the circuit board.

4. The photosensitive component according to claim 1, wherein, The first molded portion and the second molded portion are formed by two molding processes.

5. The photosensitive assembly according to claim 1, further comprising a filter element support disposed within the slot, wherein, The filter element holder is configured to mount the filter element thereon.

6. The photosensitive assembly according to claim 3, further comprising a filter element holder disposed in the slot, wherein, The filter element holder is configured to mount the filter element thereon.

7. The photosensitive component according to claim 6, wherein, The filter element bracket has a through channel therethrough, wherein the filter element bracket is pre-set on the circuit board and integrally joined to the first molded part and the second molded part of the molded body after the molded body is integrally formed.

8. The photosensitive assembly according to claim 1, further comprising side coating covering the side portion of the photosensitive chip and at least partially covering leads for electrically connecting the photosensitive chip and the circuit board.

9. A camera module, characterized in that, include: Optical lens; The photosensitive component as described in any one of claims 1-8, wherein the optical lens is maintained in the photosensitive path of the photosensitive component.

10. A method for manufacturing a photosensitive component, characterized in that, include: A circuit board is provided, wherein at least one electronic component and at least one photosensitive chip are electrically connected to the circuit board; The circuit board is housed in a molding space formed by the closing of the upper and lower molds of the molding die, wherein the molding die includes protrusions; A molded body is formed within the molding space, wherein the coefficient of thermal expansion of the molded body is greater than or less than the coefficient of thermal expansion of the photosensitive chip; and Separate the upper mold and the lower mold of the molding die to form a groove recessed into the molded body at the position corresponding to the protrusion; Using the groove as a boundary, the molded body is divided into a first molded portion and a second molded portion located outside the first molded portion. The first molded portion covers at least a portion of the circuit board and at least a portion of the non-photosensitive area of ​​the photosensitive chip. The groove is located outside the photosensitive chip to reduce the stress exerted by the molded body on the photosensitive chip. The groove is longitudinal and is a closed annular groove surrounding the first molded portion to divide the molded body into the first molded portion and the second molded portion, which are independent of each other.

11. The method for manufacturing a photosensitive component according to claim 10, wherein, The process of forming the molded body includes: Apply a molding material to the circuit board; The circuit board is placed in the lower mold of the molding die; The upper mold and the lower mold of the molding die are closed, wherein the upper mold includes a mold body and a first protrusion that is spaced apart from and extends downward from the mold body, wherein when the upper mold and the lower mold are closed, the first protrusion of the upper mold is attached to the circuit board to form a first molding space between the first protrusion and the mold body, wherein the molding material is located within the first molding space; The first molded part is formed in the first molding space by a molding process; Separate the upper mold and the lower mold; Apply a molding material to the circuit board; The lower mold and the second upper mold of the molding die are closed together, wherein the second upper mold includes a second mold body and a second protrusion that is spaced apart from and extends downward from the second mold body, wherein when the second upper mold and the lower mold are closed together, the second protrusion of the second upper mold is attached to the circuit board to form a second molding space between the second protrusion and the second mold body, wherein the molding material is located in the second molding space; The second molded portion is formed within the second molding space by a molding process; Separate the second upper mold and the lower mold to form the groove recessed into the molded body at the corresponding position of the second protrusion.

12. The method for manufacturing a photosensitive component according to claim 10, wherein before forming the molded body, the method further comprises: At least one filter element bracket is pre-set on the circuit board. The filter element bracket has a through channel therethrough so that the filter element bracket is integrally joined to the first molded part and the second molded part of the molded body after the molded body is integrally formed.

13. The method for manufacturing a photosensitive component according to claim 10, wherein, The circuit board is implemented as a circuit board panel.

14. A method for manufacturing a camera module, characterized in that, include: The method of manufacturing a photosensitive component according to any one of claims 10-13 includes forming a molded body, wherein the molded body has a recessed groove formed therein, wherein the groove divides the molded body into a first molded portion and a second molded portion; and mounting an optical lens to the second molded portion of the molded body.

Images