Laser control method and laser processing apparatus

Abstract

Embodiments of the present application provide a laser control method and a laser processing device, the laser processing device comprising a 3D camera and a laser. The method comprises: controlling the 3D camera to scan a workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed; processing the global point cloud and a preset workpiece processing pattern to obtain a three-dimensional processing track, determining a height of the laser relative to the workpiece to be processed or a focusing distance of the laser according to coordinate information and a mapping relationship of the three-dimensional processing track, and controlling the laser to process the workpiece to be processed according to the three-dimensional processing track and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser. The present scheme provides a low-cost three-dimensional scanning scheme, which can efficiently complete three-dimensional scanning and reconstruction of the surface profile of the workpiece to be processed, greatly improves the efficiency and effect of laser processing, and is simple to operate and low in cost.

Description

Technical Field

[0001] This application relates to the field of optics, and more specifically, to a laser control method and a laser processing device. Background Technology

[0002] Laser processing equipment is a device that uses laser technology to process and treat workpieces. Utilizing the high energy and high focusing properties of lasers, it can perform operations such as cutting, engraving, welding, drilling, and surface modification on the workpiece surface through heating, melting, evaporation, and burning. It has wide applications in manufacturing, electronics, automotive, medical devices, aerospace, and other fields.

[0003] For example, for a curved object composed of multiple planes, the laser processing equipment can perform laser processing on the curved object in a layered processing manner; for certain cylindrical or spherical curved objects, the laser processing equipment can perform laser processing on the curved object in a combination of rotation and movement; in some cases, the focal position, worktable position and angle of the laser processing equipment can be adjusted to adapt to the shape of the curved object and achieve a uniform processing effect across the entire curved surface as much as possible.

[0004] However, the above methods have significant limitations on the surface shape of the workpiece, low laser processing efficiency, complex manual operation, inability to guarantee accurate laser focus, and the need for additional rotating equipment to hold the workpiece. Summary of the Invention

[0005] This application provides a laser control method and a laser processing equipment, which can effectively realize laser processing on curved objects, improve laser processing efficiency and accuracy, and are easy to operate.

[0006] In a first aspect, a laser control method is provided, applied to a laser processing equipment including a 3D camera and a laser, for processing a workpiece. The method includes: controlling the 3D camera to scan the workpiece according to a preset scanning path to obtain a global point cloud of the workpiece; processing the global point cloud and a preset pattern to be processed to obtain a three-dimensional processing trajectory; determining the height of the laser relative to the workpiece or the focusing distance of the laser based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, wherein the mapping relationship represents the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser; and controlling the laser to emit a laser beam to process the workpiece based on the three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser.

[0007] Based on the solution provided in this application, a low-cost 3D scanning solution is provided, which can efficiently complete the scanning of the surface contour of the workpiece to be processed and the reconstruction of the 3D model. The 3D height information of the surface of the workpiece to be processed (e.g., height value or focusing distance) can be obtained in advance. Based on the obtained 3D height information, the position and focal length of the laser can be automatically adjusted so that the laser maintains a suitable focal position and processing depth, ensuring that the laser focus can be accurately focused. Thus, the laser is in the optimal position to process workpieces with different surface heights, which greatly improves the efficiency and effect of laser processing. The operation is simple and the cost is low.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, scanning the workpiece to be processed according to a preset scanning path and acquiring the global point cloud of the workpiece to be processed includes: acquiring multiple frames of local point clouds of the workpiece to be processed; fusing the multiple frames of local point clouds to obtain the global point cloud of the workpiece to be processed.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, multiple frames of local point clouds are fused to obtain the global point cloud of the workpiece to be processed. This includes preprocessing the local point cloud data of each frame in the multiple frames of local point clouds; aligning the preprocessed local point cloud data of each frame with the world coordinate system; and using a fusion algorithm to fuse the aligned local point cloud data of each frame to obtain the global point cloud.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the global point cloud and the preset pattern to be processed are processed to obtain a three-dimensional processing trajectory, including: generating the original processing trajectory of the laser processing equipment based on the path information in the pre-imported pattern to be processed and graphic file of the laser processing equipment; merging the global point cloud and the original processing trajectory to obtain a three-dimensional processing trajectory.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the method further includes: adjusting the position and focus of the laser based on the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, so that the focused spot of the laser beam is always located on the surface of the workpiece to be processed.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, the laser is controlled to process the workpiece according to the three-dimensional processing trajectory, the height of the laser relative to the workpiece to be processed, or the focusing distance of the laser, including: controlling the lateral movement of the laser according to the three-dimensional processing trajectory; and controlling the longitudinal distance of the laser according to the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, so as to complete the processing of the workpiece to be processed.

[0013] Secondly, a laser control device is provided, comprising: a control unit for controlling a 3D camera to scan a workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece; a processing unit for processing the global point cloud and a preset pattern to be processed to obtain a three-dimensional processing trajectory; the processing unit is further configured to determine the height of the laser relative to the workpiece or the focusing distance of the laser in the laser processing equipment according to the coordinate information and mapping relationship of the three-dimensional processing trajectory, wherein the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser; and a control unit for controlling the laser to emit a laser beam to process the workpiece according to the three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser.

[0014] Thirdly, a laser processing device is provided for processing a workpiece. The device includes a work platform, a laser, a 3D camera, and a host computer. The workpiece is placed on the work platform. The laser emits a laser beam to the workpiece for processing. The 3D camera scans the workpiece according to a preset scanning path to obtain a global point cloud. The host computer processes the global point cloud and the preset processing pattern to obtain a three-dimensional processing trajectory. Based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, the height of the laser relative to the workpiece or the focusing distance of the laser is determined. The mapping relationship represents the mapping between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser. Based on the three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser, the laser is controlled to process the workpiece.

[0015] Fourthly, a computer-readable storage medium is provided for storing a computer program that, when run on a computer, causes the computer to perform the methods described in the first aspect and any possible implementation thereof.

[0016] Fifthly, a chip is provided, including a processor for calling and running a computer program from a memory, causing a device on which the chip is mounted to perform the laser control method as described in the first aspect.

[0017] In a sixth aspect, a computer program is provided that causes a computer to perform the control methods described in the first aspect.

[0018] In a seventh aspect, a program product is provided, including computer-readable code or a non-volatile computer-readable storage medium carrying the computer-readable code, wherein when the computer-readable code is run in an electronic device, a processor in the electronic device executes the laser control method as described in the first aspect. Attached Figure Description

[0019] Figure 1 and Figure 2 This is a front view of the laser processing equipment provided in the embodiments of this application.

[0020] Figure 3 This is a schematic diagram illustrating the working principle of the 3D camera provided in the embodiments of this application.

[0021] Figure 4 This is a schematic flowchart of a laser control method provided in an embodiment of this application.

[0022] Figure 5 and Figure 6 This is a schematic diagram of the area to be scanned of the workpiece to be processed, provided in an embodiment of this application.

[0023] Figure 7 This is a schematic diagram of a three-dimensional contour of the surface of a workpiece to be processed, provided in an embodiment of this application.

[0024] Figure 8 This is a schematic diagram of the original processing trajectory corresponding to the pattern to be processed by a laser processing equipment provided in this application embodiment.

[0025] Figure 9 This is a schematic diagram of a three-dimensional machining trajectory that maps a pattern to be processed onto the surface of a workpiece, as provided in an embodiment of this application.

[0026] Figures 10 to 12 This is a schematic diagram illustrating the control of the longitudinal distance between the laser and the surface of the workpiece to be processed, provided in an embodiment of this application.

[0027] Figure 13 This is a schematic block diagram of a laser control device provided in an embodiment of this application.

[0028] Figure 14 This is a schematic diagram of the structure of a laser processing device provided in an embodiment of this application. Detailed Implementation

[0029] To facilitate understanding of the technical solution of this application, the following points are provided.

[0030] In this application, "at least one" means one or more, and "more than one" means two or more. In the textual description of this application, the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0031] In this application, the terms "first," "second," and various numerical designations are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. The sequence numbers of the processes below do not imply the order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0032] In this application, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0033] In this application, terms such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Embodiments or designs described as "exemplary" or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. The use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner to facilitate understanding.

[0034] In this application, the terms “center,” “upper,” and “lower” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0035] In this application, unless otherwise expressly specified and limited, the terms "installed," "fixed," "set," etc., shall be interpreted broadly. When an element is referred to as being "fixed to" or "set on" another element, it may be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intervening element present.

[0036] In this application, unless otherwise expressly specified and limited, the term "point cloud" may be replaced by "point cloud data", "point cloud information", "point cloud coordinates", etc.

[0037] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0038] Laser processing equipment is a type of equipment that uses laser technology to process and treat workpieces. It utilizes the high energy and high focusing properties of lasers to perform operations such as cutting, engraving, welding, drilling, and surface modification on the workpiece surface through heating, melting, evaporation, and combustion. Laser processing equipment can be applied to the processing and treatment of a variety of materials, including metals, plastics, ceramics, glass, and textiles. It has wide applications in manufacturing, electronics, automotive, medical devices, and aerospace industries, enabling high-precision, high-efficiency, and non-contact processing operations.

[0039] The processing effect and depth range of laser processing equipment at different surface heights mainly depend on the focusing performance of the laser beam in the vertical direction. Generally, during laser processing, it is sufficient to ensure that the laser's focal point falls on the surface of the object to be processed. Laser depth of field refers to the focal range of the laser beam in the direction perpendicular to the working surface. However, the laser depth of field of laser processing equipment is finite and relatively short, depending on factors such as the characteristics of the laser, the design of the optical system, and the working distance. If the laser beam is not accurately focused or the laser depth of field is small, it may lead to uneven processing or failure to process deeper layers of the material. Therefore, when using laser processing equipment, it is necessary to reasonably adjust the laser's focal position and processing parameters according to the material's characteristics and requirements to ensure the desired processing effect is obtained.

[0040] Currently, laser processing equipment typically employs methods such as layered processing, rotary processing, and manual adjustment when performing laser processing on curved objects.

[0041] (1) Layered processing: For a curved object composed of multiple planes, the curved surface can be decomposed into a series of planes, and then the position and angle of the worktable or the focal length of the laser can be adjusted to process each plane separately.

[0042] (2) Rotational processing: For certain cylindrical or spherical curved objects, the curved object can be fixed on a rotating device, and the laser can be moved along the rotation axis of the object to process the curved object. By combining rotation and movement, a uniform processing effect can be achieved on the entire curved surface.

[0043] (3) Manual adjustment: In some special cases, the focal position, worktable position and angle of the laser processing equipment can be manually adjusted to adapt to the shape of the curved object and then process the curved object. This usually requires adjusting the focal position, worktable position and angle of the laser processing equipment based on experience and practice to obtain the best processing effect.

[0044] Therefore, the processing methods described above have significant limitations on the surface shape of the workpiece to be processed, and the applicable workpieces are restricted. In addition, the overall laser processing operation is complex, inefficient, and requires additional rotating equipment to hold the workpiece, making laser processing equipment complex and costly.

[0045] In view of this, this application provides a laser control method, device, and laser processing equipment, which can efficiently complete the scanning of the surface contour of the workpiece to be processed and the reconstruction of the three-dimensional model, obtain the three-dimensional height information of the surface of the workpiece to be processed in advance, and then automatically adjust the position and focal length of the laser so that the laser is in the optimal position to process the workpieces with different surface heights, greatly improving the efficiency and effect of laser processing, and is simple to operate and low in cost.

[0046] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings. The embodiments provided in this application can be applied to laser processing equipment, such as... Figure 1 and Figure 2 The laser processing equipment shown.

[0047] Figure 1 This is a front view of the first type of laser processing equipment provided in the embodiments of this application. For example... Figure 1 As shown, the laser processing equipment 100 includes a laser 110 and a 3D camera 120. The 3D camera 120 and the laser 110 are fixed together, and the 3D camera 120 can move along the X / Y / Z axes following the laser 110; that is, the 3D camera 120 is a mobile 3D camera. It should be understood that this installation method is more suitable for solutions where a single measurement can only measure a small local area. For example, the 3D camera 120 can be a single-point rangefinder or a single-line 3D camera.

[0048] Figure 2 This is a front view of the second type of laser processing equipment provided in the embodiments of this application. For example... Figure 2 As shown, the laser processing equipment 200 includes a laser 210 and a 3D camera 220. The laser 210 can move along the X / Y / Z axes, and the 3D camera 220 is fixedly mounted on the top or side of the laser processing equipment 200 for downward measurement; that is, the 3D camera 220 is a fixed 3D camera. It should be understood that this mounting method is more suitable for solutions where a large area can be measured in a single measurement.

[0049] In the embodiments of this application, Figure 1 or Figure 2The laser processing equipment shown (e.g., 100 or 200) includes a work platform, lasers 110 / 210, 3D cameras 120 / 220, and a host computer, with the workpiece to be processed placed on the work platform. Lasers 110 / 210 emit laser beams towards the workpiece 130 / 230. Lasers 110 / 210 can be single-line, multi-line, single-point, or multi-point laser sources, such as tunable continuous-line lasers capable of continuously outputting stable power at different frequencies, or tunable pulsed-line lasers capable of outputting stable power pulsed lasers at different frequencies. This application does not specifically limit the type of laser source. 3D cameras 120 / 220 are used to acquire the global point cloud of the workpiece 130 / 230 to be processed; the host computer is used to process the global point cloud and the preset pattern to be processed to obtain the three-dimensional processing trajectory, as well as the height of the laser 110 / 210 relative to the workpiece 130 / 230 or the focusing distance of the laser 110 / 210. Based on the three-dimensional processing trajectory and the height of the laser 110 / 210 relative to the workpiece 130 / 230 or the focusing distance of the laser 110 / 210, the laser 110 / 210 is controlled to process the workpiece 130 / 230 to obtain the target object.

[0050] It should be noted that the above Figure 1 and Figure 2 The examples provided are merely for ease of understanding; this application does not limit the mounting methods of different 3D cameras. Furthermore, the above... Figure 1 and Figure 2 The two 3D camera mounting methods given can be implemented independently or in combination. For example, in some scenarios, a fixed 3D camera can be used first (e.g., Figure 2 The 3D camera 220 shown is used for a global low-precision scan, and then a mobile 3D camera (e.g., Figure 1 The 3D camera 120 shown may be used for local high-precision scanning, etc., but this application does not limit this.

[0051] Specifically, taking a 3D camera based on the principle of line structured light computing as an example, combined with Figure 3 For the 3D camera in the embodiments of this application (e.g., Figure 1 3D camera 120 Figure 2 The working principle of the 3D camera 220 will be explained in detail.

[0052] Figure 3 This is a schematic diagram illustrating the working principle of the 3D camera provided in the embodiments of this application. For ease of description, as... Figure 3 As shown, the 3D camera 300 includes a line transmitter 310 and a receiver 320. The optical axis of the line transmitter 310 is installed at a certain angle to the optical axis of the receiver 320 or the optical axes are relatively parallel.

[0053] Optionally, the aforementioned line emitter 310 can be a single-line, multi-line, single-point, or multi-point laser source. This is because lasers have the advantages of high collimation and strong directionality, which can improve the accuracy and efficiency of calibration.

[0054] Optionally, this application does not specifically limit the number of line transmitters 310 and receivers 320, the wavelength of the laser emitted by the line transmitter 310, the angle between the optical axis of the line transmitter 310 and the optical axis of the receiver 320, or the orientation of the line transmitter 310 and receiver 320. For example, scenarios where the receiver 320 illuminates vertically downwards and the line transmitter 310 illuminates obliquely downwards, or where the line transmitter 310 illuminates vertically downwards and the receiver 320 illuminates obliquely downwards, or where both the line transmitter 310 and receiver 320 illuminate obliquely downwards, all fall within the protection scope of this application's technical solution.

[0055] Optionally, the receiver 320 can be a charge-coupled device (CCD), a complementary metal-oxide-semiconductor (CMOS), or other photosensitive elements capable of receiving infrared light, ultraviolet light, etc. Furthermore, the processing chip includes independent dedicated circuitry, such as a dedicated SOC chip, FPGA chip, or ASIC chip comprising a CPU, memory, and bus, or it can include general-purpose processing circuitry. For example, when the laser profilometer is integrated into smart terminals such as mobile phones, televisions, computers, scanners, and 3D printers, the processing circuitry in the terminal can serve as at least part of the processor.

[0056] Based on the principle of line laser scanning, a line laser is projected onto the workpiece 330 using a line emitter 310. An image is captured by a receiver 320, and the center line of the line laser is extracted. Then, using the light plane equation and the calibrated intrinsic and extrinsic parameters of the receiver 320, the point cloud of the workpiece 330 in the world coordinate system can be obtained. The change in Z-axis height can be represented as pixel movement in the receiver 320.

[0057] In the first implementation, the line emitter 310 of the 3D camera 300 emits a line laser towards the workpiece 330. This line laser forms a cutting plane, and each cutting plane corresponds to a cutting plane equation, which can be obtained through calibration. The receiver 320 of the 3D camera 300 acquires the line laser reflected from the workpiece 330, forming a line image on the imaging plane. Any point on the line laser in this line image is extracted, and a ray is formed from the optical center of the receiver 320 and this ray intersecting with the cutting plane. The three-dimensional coordinates of this point in the camera coordinate system can be determined by the intersection of this ray and the cutting plane, thus obtaining the point cloud of the workpiece 330 in the camera coordinate system.

[0058] Because the line transmitter 310 uses a single-line laser, its single-frame point cloud is single-line. To obtain the surface contour of the workpiece 330, the surface contour of the workpiece 330 can be scanned by moving the receiver 320 or the workpiece 330 to obtain multiple frames of point clouds. Then, based on the intrinsic and extrinsic parameters of the receiver 320, the acquired multiple frames of point clouds are stitched together to obtain the three-dimensional point cloud information of the surface contour of the workpiece 330 in the world coordinate system. The origin of this world coordinate system can typically be defined as a corner point on the working platform, and the X-axis and Y-axis are the sides intersecting the corner point. Optionally, the world coordinate system can also be constructed in other ways; this application does not impose any restrictions on this.

[0059] In the second implementation, the center line of the line laser in the line image can be extracted using a center line extraction algorithm. Starting from the optical center of the receiving end 320, a ray is formed with any center point of the line laser. The intersection of this ray with the laser cutter plane is then determined, and the three-dimensional coordinates of any center point can be determined, thereby obtaining the point cloud of the workpiece 330 to be processed.

[0060] Optionally, the point cloud obtained in this implementation can be a point cloud in the camera coordinate system.

[0061] Compared to the first implementation method mentioned above, which directly calculates the point cloud of the workpiece 330 to be processed through any point on the line laser, the second implementation method obtains the corresponding center point with sub-pixel coordinates by calculating the center line on the line laser, and obtains the point cloud data through the sub-pixel center point, which can improve the accuracy of the point cloud data.

[0062] Optionally, the point clouds obtained by the above two implementation methods or other implementation methods can be filtered to improve the accuracy of the point clouds.

[0063] Optionally, the receiver 320 in the 3D camera 300 can be used independently to acquire two-dimensional images of the workpiece 330 to be processed, so as to further obtain information such as line width, graphics, and texture of the workpiece 330.

[0064] It should be understood that the above-described method of acquiring the point cloud of the workpiece 330 to be processed is mainly described using a single-line scanning method. This application is also applicable to scanning using a surface scanning method by the 3D camera 300. For example, if the beam emitted by the line emitter 310 is a multi-line beam, the receiver 320 can obtain a multi-line image by acquiring the multi-line beam reflected back from the workpiece 330. However, the ray formed by starting from any point on any line in the multi-line image and the optical center of the receiver 320 intersects with the light-cutting plane corresponding to the multi-line beam emitted by the line emitter 310 at multiple points, making it impossible to uniquely determine the light plane equation corresponding to the current line in the multi-line image.

[0065] To determine the laser cutter plane equation corresponding to the current line beam in the multi-line image, each line beam emitted by the line transmitter 310 can be encoded. For example, a unique encoding pattern can be used to encode multiple line beams in the multi-line pattern, or the inherent properties of the multi-line beams (such as color or brightness) can be used to encode each line beam. After the receiver 320 collects the reflected beams, it generates an encoded multi-line image. Subsequently, decoding the encoded multi-line image can identify each line beam, thereby uniquely determining the laser cutter plane equation corresponding to the current line beam. Furthermore, based on the aforementioned line laser scanning principle and combined with the intrinsic and extrinsic parameters of the 3D camera 300, the point cloud information of the workpiece 330 to be processed in the world coordinate system can be obtained.

[0066] Optionally, when the 3D camera 300 uses surface scanning, the line transmitter 310 can also emit a structured light pattern to the workpiece 330 to be processed. The receiver 320 receives the light beam reflected back by the workpiece 330 to generate a structured light image. Based on the principle of structured light, the structured light image is processed and combined with the intrinsic and extrinsic parameters of the 3D camera 300 to obtain the point cloud information of the workpiece 330 in the world coordinate system.

[0067] Optionally, the 3D camera 300 may also include a processing chip (not shown in the figure), which processes the image acquired by the receiver 320 to obtain a point cloud of the workpiece 330 in the camera coordinate system. Optionally, the processing chip may be a processor containing independent dedicated circuitry, such as a dedicated SOC chip, FPGA chip, ASIC chip, etc., consisting of a CPU, memory, and bus. It may also contain general-purpose processing circuitry, for example, when the 3D camera 300 is integrated into laser processing equipment (such as...). Figure 1 The 100 shown or Figure 2 In the case shown in 200), the processing circuit of the host computer in the laser processing equipment 100 / 200 can be used as part of the processing chip.

[0068] It should be noted that, Figure 3The 3D camera 300 shown is merely an example for ease of understanding and does not constitute a limitation on the technical solution of this application. It should be understood that the above description uses a laser profilometer as an example of the 3D camera 300. In other embodiments, the 3D camera 300 may also be a single-point rangefinder based on triangulation or single-point direct time-of-flight, a multi-line rangefinder, a speckle structured light / binocular camera, an indirect time-of-flight camera based on floodlight / speckle / linear array, etc. Any device capable of acquiring 3D information falls within the scope of protection of this application.

[0069] The following is combined Figures 1 to 3 The calibration of the 3D camera 300 in this embodiment is described below. It should be noted that 3D camera calibration is an optional step. For example, the 3D camera 120 / 220 / 300 can be calibrated before each processing operation by the laser processing equipment 100 / 200; or, the 3D camera 120 / 220 / 300 can be calibrated periodically, for example, once every 10 operations of the laser processing equipment; or, the calibration of the 3D camera 120 / 220 / 300 can be determined based on factors such as practical experience, processing results, and actual usage. In short, calibrating the 3D camera 120 / 220 / 300 can ensure the measurement accuracy of the 3D camera 120 / 220 / 300, thereby improving the acquisition accuracy of the laser processing equipment 100 / 200.

[0070] In one implementation, such as Figure 1 or Figure 2 As shown, the calibration board is set to 140 / 240, based on... Figure 3 The working principle of the 3D camera 300 is as follows: the host computer controls the 3D camera 120 / 220 to move above the calibration board 140 / 240, captures images of the calibration board 140 / 240 in multiple poses, and calculates the intrinsic and extrinsic parameters of the 3D camera 120 / 220 to calibrate the 3D camera 120 / 220. For example, the 3D camera 300 can first acquire calibration images including the calibration board 140 / 240, and then calibrate the calibration images according to a preset calibration algorithm to obtain the intrinsic and extrinsic parameters of the 3D camera 120 / 220. The preset calibration algorithm can be the Zhang Zhengyou calibration algorithm or other calibration algorithms.

[0071] Based on the above Figures 1 to 3 The following is combined with Figures 4 to 12 The laser control method provided in this application is described in detail. This method is applicable to... Figure 1 or Figure 2 The laser processing equipment shown is 100 / 200.

[0072] Figure 4 This is a flowchart of a laser control method 400 provided in an embodiment of this application, as shown below. Figure 4As shown, the method includes the following steps.

[0073] S410 controls the 3D camera to scan the workpiece to be processed according to the preset scanning path, and obtains the global point cloud of the workpiece to be processed.

[0074] For example, control such as Figure 3 The 3D camera 300 shown scans the workpiece to be processed according to a preset scanning path, and can obtain the global point cloud of the workpiece. It should be noted that the point cloud involved in this embodiment can be three-dimensional coordinate information, color information, light intensity information, etc. For ease of understanding and description, the following description uses three-dimensional coordinate information as an example.

[0075] based on Figure 3 The working principle of the 3D camera mentioned above is respectively for Figure 1 The mobile 3D camera 120 shown and Figure 2 The fixed 3D camera 220 shown illustrates the implementation of step S410.

[0076] (1) such as Figure 1 The mobile 3D camera 120 shown.

[0077] For example, the 3D camera 120 acquires the global point cloud of the workpiece 130 to be processed by the following steps.

[0078] S411, acquire multiple frames of local point cloud.

[0079] In the host computer interface of the laser processing equipment 100, the scanning area of ​​the workpiece 130 to be processed is selected. The optimal scanning path is automatically generated based on the scanning area, or the scanning path is defined by the user. For example, depending on whether the shape of the workpiece 130 to be processed is regular or irregular, the fine scanning or sparse scanning mode is adaptively selected to obtain the point cloud of the workpiece 130 to be processed.

[0080] In the first implementation, when the workpiece 130 to be processed is regular, the area to be scanned corresponding to the workpiece 130 can be divided into multiple regions. The 3D camera 120 is then controlled to perform a global sparse scan of the center positions of each region of the workpiece 130 to obtain multiple frames of sparse point clouds. This means that the spacing between the multiple regions into which the scanned area is divided is set larger, resulting in a smaller number of regions. For example, the scanned area can be divided into 5*5 identical regions. For a regular workpiece 130, a relatively accurate global point cloud can be fitted using only a limited number of sparse point clouds. Furthermore, the smaller number of regions also shortens the time it takes for the 3D camera 120 to acquire the point cloud. Therefore, sparse scanning of the scanned area by the 3D camera 120 can improve scanning efficiency, thereby saving processing time.

[0081] Figure 5 This is a schematic diagram of the scanning area of ​​the workpiece to be processed, as provided in the first embodiment of this application. For example... Figure 5 As shown, the scanning direction of the 3D camera 120 is from left to right, dividing the area to be scanned into finer-grained regions. The interval between each region can be set to 1mm, meaning that the 3D camera 120 acquires a point cloud every 1mm of movement. It is understandable that, since the 3D camera 120 is fixed to the laser 110, the measurement beam emitted by the laser 110 can simultaneously cover multiple regions, meaning the width of a single measurement is relatively large, typically reaching tens or even hundreds of millimeters. Therefore, the 3D camera 120 will acquire point clouds corresponding to multiple regions every 1mm of movement; for example, a "Z"-shaped scanning pattern can be used.

[0082] In the second implementation, when the workpiece 130 is irregular, the area to be scanned corresponding to the workpiece 130 can be divided into regions with smaller granularity. This means the spacing between the multiple regions is set smaller, resulting in a larger number of regions. This allows the 3D camera 120 to perform a fine scan of the area to be scanned, obtaining a larger number of dense point clouds. Fusing these dense point clouds yields a global point cloud of the workpiece 130, enabling more precise location of uneven surfaces on the workpiece 130. It should be noted that when the workpiece is regular, a fine scanning method can also be used to obtain a more accurate point cloud; this application does not impose any limitations on this.

[0083] Figure 6 This is a schematic diagram of the scanning area of ​​the second type of workpiece to be processed, provided in an embodiment of this application. For example... Figure 6 As shown, the 3D camera 120 moves in a "bow" shaped pattern to acquire dense point clouds corresponding to various regions of the workpiece 130 to be processed. Using a "bow" shaped pattern allows the 3D camera 120 to move without stopping when reaching the edge region of the workpiece 130, enabling continuous scanning. Compared to moving the 3D camera 120 along the same direction, the "bow" shaped pattern saves time in acquiring the point cloud of the workpiece 130.

[0084] In the third implementation, when the regular regions on the surface of the workpiece 130 cannot be accurately determined, or when the irregular regions on the surface of the workpiece 130 are relatively scattered, the 3D camera 120 needs to perform a global fine scan of the entire surface of the workpiece 130. However, when it is known that the workpiece 130 has irregular regions in specific local areas, a sparse scan of the entire surface of the workpiece 130 can be performed first to obtain multiple frames of sparse point clouds and the irregular regions of the workpiece 130. Subsequently, a fine scan of the irregular regions of the workpiece 130 is performed to obtain dense point clouds. By fusing the sparse and dense point clouds, the global point cloud of the workpiece 130 can be obtained. Compared to global fine scanning, by fusing global sparse scanning and local fine scanning, the number of point clouds acquired can be reduced, simplifying the global fine scanning process and thus improving the processing speed of the 3D camera 120.

[0085] Optionally, if a line-scanning 3D camera is used, the host computer controls the 3D camera 120 to move along the scanning path and acquire multiple frames of local point cloud data in real time, as well as record the coordinates [Xw_i, Yw_i, Zw_i] of the 3D camera 120 (usually the optical center of the 3D camera 120) in the world coordinate system (or global coordinate system) when measuring the i-th frame of point cloud data, until the scanning is completed. The j-th point cloud data in the i-th frame of local point cloud can be represented as [x_i_j, y_i_j, z_i_j].

[0086] Optionally, if a 3D camera with area scanning is used, the scanning path can be converted into multiple local rectangular regions to be scanned. The host computer controls the 3D camera 120 to move to the center of the corresponding multiple rectangular regions for measurement, acquire multiple frames of local point cloud data corresponding to multiple regions, and record the coordinates [Xw_i, Yw_i, Zw_i] of the 3D camera 120 in the world coordinate system when measuring the i-th frame of point cloud data.

[0087] S412 fuses multiple frames of local point clouds to obtain a global point cloud.

[0088] For example, a specific implementation of step S412 may include the following steps:

[0089] S4121, preprocess the acquired local point cloud for each frame.

[0090] For example, preprocessing includes, but is not limited to, denoising, filtering, and feature extraction. This approach helps reduce noise and unnecessary points, ensuring the accuracy of laser processing results.

[0091] S4122, based on the coordinates [Xw_i,Yw_i,Zw_i] of the 3D camera 120 in the world coordinate system during each measurement, align each local point cloud with the world coordinate system.

[0092] For example, iterative closest point (ICP) or other registration algorithms are typically used to estimate the transformation relationship between each local point cloud and the global point cloud.

[0093] S4123 performs point cloud fusion on the local point cloud of each frame to obtain the global point cloud.

[0094] For example, after aligning the local point cloud to the world coordinate system, different fusion algorithms can be used to fuse multiple frames of local point clouds into a single complete global point cloud frame. It should be understood that point cloud fusion is a key step in fusing multiple local point cloud data into a single complete global point cloud frame. This implementation method can obtain contour information at different locations on the surface of the workpiece 130 to be processed, providing basic data for subsequent processing tasks.

[0095] Examples of commonly used fusion methods include, but are not limited to: voxel grid filtering, Euclidean clustering, and KD-tree-based nearest neighbor search.

[0096] Optionally, the fused global point cloud may contain some imperfections or inaccuracies. Optimization algorithms, such as nonlinear least squares or ICP iteration, can be applied to further improve the fitting and accuracy of the global point cloud.

[0097] Figure 7 This is a three-dimensional contour information of the surface of a workpiece to be processed, provided in an embodiment of this application. For example... Figure 7 As shown, the coordinate information of different positions on the surface of the workpiece 130 in the X / Y / Z axis directions can be obtained by the 3D camera 120 scanning the workpiece 130 according to the preset scanning path, which provides basic data for subsequent laser processing.

[0098] (2) such as Figure 2 The fixed 3D camera 220 shown.

[0099] For example, the 3D camera 220 acquires the global point cloud of the workpiece 230 to be processed, including: the 3D camera 220 acquires a frame of point cloud data, which is the global point cloud.

[0100] It should be understood that the above methods one and two are examples provided for ease of understanding and should not constitute any limitation on the technical solution of this application. Optionally, the point cloud acquisition and processing method of the workpiece 130 / 230 to be processed can be selected and adjusted according to the actual situation, and this application does not make specific limitations in this regard.

[0101] S420 processes the global point cloud and the preset pattern to be processed to obtain the three-dimensional processing trajectory.

[0102] For example, the host computer can merge the global point cloud with the preset pattern to be processed to obtain a three-dimensional processing trajectory.

[0103] S430, based on the coordinate information and mapping relationship of the three-dimensional machining trajectory, determine the height of the laser 110 / 210 relative to the workpiece 130 / 230 or the focusing distance of the laser 110 / 210. The mapping relationship represents the relationship between the pre-established coordinate information of the three-dimensional machining trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser.

[0104] Optionally, the mapping relationship can be represented in the form of a table, function, text, or string, etc., and this application does not limit this. For example, the host computer can look up the height of the laser 110 / 210 relative to the workpiece 130 / 230 or the focusing distance of the laser 110 / 210 from a preset table based on the coordinate information of the three-dimensional machining trajectory.

[0105] First, by importing the pattern to be processed from the laser processing equipment 100 / 200 into the host computer beforehand, the host computer software will generate the corresponding original processing trajectory based on the path information in the graphic file, such as... Figure 8 As shown, the coordinates of each point on the two-dimensional trajectory can be represented as [X_i, Y_i]. The path defines the path and sequence of movement of the laser processing equipment 100 / 200 during processing, and may also include laser power, operating speed, and scanning mode. These point coordinates do not contain Z-axis information, or in other words, the Z-axis values ​​of different point coordinates are the same. The pattern to be processed is typically in vector graphics format, with common formats including but not limited to: Scalable Vector Graphics (SVG), Drawing Exchange Format (DXF), and Adobe Illustrator (AI).

[0106] Secondly, merge the global point cloud into Figure 8 The original machining trajectory shown is modified by adding a Z-axis height information to the machining trajectory, resulting in a three-dimensional machining trajectory, as shown below. Figure 9 As shown, the coordinates of each point on the three-dimensional machining trajectory can be represented as three-dimensional coordinates [X_i,Y_i,Z_i], which means the three-dimensional coordinates of the pattern to be processed mapped onto the surface of the workpiece 130 / 230.

[0107] Then, using a pre-established lookup table mapping Z_i to the height of laser 110 / 210 relative to workpiece 130 / 230 or the focusing distance of laser 110 / 210, the height of laser 110 / 210 relative to workpiece 130 / 230 or the focusing distance of laser 110 / 210 is determined. This lookup table indicates that when the distance Z_i of a certain area of ​​workpiece 130 / 230 relative to the work platform is Z_i, the height of laser 110 / 210 relative to workpiece 130 / 230 is... h_i, or at this time the focusing distance of laser 110 / 210 is f_i allows the laser 110 / 210 to achieve the best processing effect on the workpiece 130 / 230 in this area. In other words, based on the known height Z_i in the three-dimensional processing trajectory, the height value of the laser 110 / 210 relative to the workpiece 130 / 230 can be found in the lookup table. h_i or focusing distance of laser 110 / 210 f_i.

[0108] Furthermore, based on the obtained height value h_i or focusing distance f_i adjusts the position and / or focus of lasers 110 / 210 so that they can be positioned optimally to process workpieces 130 / 230, achieving the best processing results. For example, when lasers 110 / 210 move to coordinates [X_i,Y_i], the height or focusing distance that needs to be adjusted for lasers 110 / 210 can be found based on the Z_i value in the three-dimensional processing trajectory [X_i,Y_i,Z_i]. The host computer then controls the height movement of lasers 110 / 210. h_i, or adjust the focal length of laser 110 / 210. f_i, thereby ensuring that the focused spot of the laser 110 / 210 is always located on the surface of the workpiece 130 / 230 to be processed.

[0109] S440, based on the three-dimensional machining trajectory, the height of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed, or the focusing distance of the laser 110 / 210, controls the laser 110 / 210 to emit a laser beam to process the workpiece 130 / 230.

[0110] It should be understood that once the three-dimensional machining trajectory of the workpiece 130 / 230 is generated (e.g., Figure 9As shown, the laser can be sent to the laser processing equipment 100 / 200 for actual processing. The laser processing equipment 100 / 200 can move the laser 110 / 210 laterally according to the three-dimensional processing trajectory, and control the longitudinal distance of the laser 110 / 210 according to the height of the laser 110 / 210 relative to the workpiece 130 / 230 or the focusing distance of the laser 110 / 210 corresponding to the three-dimensional processing trajectory to complete the processing of the workpiece 130 / 230.

[0111] There are several ways for the laser processing equipment 100 / 200 to control the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230, including the following implementation methods.

[0112] Method 1:

[0113] In one example, such as Figure 10 As shown, laser 110 / 210 includes a laser source and a focusing lens. The focusing lens is used to focus the laser beam emitted by the laser source. By adjusting the focusing lens of laser 110 / 210, the focal point position of the laser beam can be changed. Generally, moving the focusing lens closer to the laser source moves the focal point of the laser beam to a greater distance, while moving the focusing lens away from the laser source moves the focal point of the laser beam to a shorter distance, thereby controlling the longitudinal distance between laser 110 / 210 and the surface of workpiece 130 / 230.

[0114] In another example, laser 110 / 210 includes a laser source and a zoom lens, which may include a liquid lens, a superlens, etc. The zoom lens has a variable focal length and is used to focus the laser beam emitted by the laser source. By changing the focal length of the zoom lens, the laser beam emitted by the laser source can be focused onto the surface of the workpiece 130 / 230 to be processed, thereby controlling the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230.

[0115] Method 2:

[0116] In one example, such as Figure 11 As shown, the height of the laser 110 / 210 on the Z-axis can be adjusted by the Z-axis drive shaft, thereby controlling the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230 to be processed.

[0117] Method 3:

[0118] In one example, such as Figure 12As shown, by adjusting the height of the height-adjustable work platform on which the workpieces 130 / 230 are placed, the distance of the laser focus relative to the work platform on the Z-axis can be changed. For example, moving the work platform upward (from position 2 to position 1) will bring the focus closer to the work platform, while moving the work platform downward (from position 1 to position 2) will move the focus away from the work platform, thereby controlling the longitudinal distance between the laser 110 / 210 and the surface of the workpieces 130 / 230.

[0119] It should be understood that the implementation methods provided above are merely examples for ease of understanding and should not constitute any limitation on the technical solutions of this application.

[0120] In summary, to ensure accurate laser focusing when processing objects with varying surface heights, a low-cost 3D scanning solution is proposed. Using a 3D camera, the 3D contour of the workpiece surface can be efficiently scanned and reconstructed, obtaining the 3D contour information in advance. This information can then be used to assist in real-time adjustment of the laser's position and focal length during processing, maintaining a suitable focal position and processing depth, thereby significantly improving the efficiency and effectiveness of laser processing.

[0121] The above text combined Figures 1 to 12 The laser control method in the embodiments of this application has been described in detail. The following will combine... Figure 13 and Figure 14 This application describes a laser control device and a laser processing apparatus according to embodiments of the present application. It should be understood that the descriptions of the device embodiments correspond to the descriptions of the method embodiments; therefore, any parts not described in detail can be referred to the foregoing method embodiments.

[0122] Figure 13 This is a schematic block diagram of a laser control device provided in an embodiment of this application. Figure 13 As shown, the device 1000 may include a processing unit 1020 and a control unit 1010, wherein the processing unit 1020 is used for data processing.

[0123] In one possible design, the device 1000 can implement the steps or processes corresponding to those performed by the laser processing equipment 100 / 200 in the above method embodiments, wherein the processing unit 1020 is used to perform processing-related operations of the laser processing equipment 100 / 200 in the above method embodiments, and the control unit 1010 is used to perform transmission-reception-related operations of the laser processing equipment 100 / 200 in the above method embodiments.

[0124] For example, the control unit 1010 is used to control the 3D camera to scan the workpiece to be processed according to the preset scanning path to obtain the global point cloud of the workpiece to be processed.

[0125] The processing unit 1020 is used to process the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory; based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, the height of the laser relative to the workpiece to be processed or the focusing distance of the laser is determined. The mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser.

[0126] The control unit 1010 is also used to control the laser to emit a laser beam to process the workpiece based on the three-dimensional machining trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser.

[0127] It should be understood that the device 1000 here is embodied in the form of a functional unit. The term "unit" here may refer to application-specific integrated circuits (ASICs), electronic circuits, processors (e.g., shared processors, proprietary processors, or group processors) and memories for executing one or more software or firmware programs, combined logic circuits, and / or other suitable components that support the described functions.

[0128] The functionality can be implemented through hardware or by hardware executing corresponding software. The hardware or software includes one or more modules corresponding to the aforementioned functionality; for example, a processing unit can be replaced by a processor to perform the processing operations in the above method embodiments.

[0129] Furthermore, the aforementioned processing unit can be a processing circuit. In embodiments of this application, Figure 9 The device mentioned can be the laser processing equipment described in the foregoing embodiments, or it can be a chip or a chip system, such as a system on chip (SoC). The processing unit is a processor, microprocessor, or integrated circuit integrated on the chip. No limitation is made here.

[0130] Figure 14 This is a schematic block diagram of the laser processing equipment 2000 provided in an embodiment of this application. Figure 14 As shown, the laser processing equipment 2000 includes a 3D camera 2010, a work platform 2020, a laser 2030, and a host computer 2040. The workpiece to be processed is placed on the work platform 2020. The laser 2030 can be a single-line, multi-line, single-point, or multi-point laser source, such as a tunable continuous line laser that can continuously output lasers of different frequencies with stable power, or a tunable pulsed line laser that can output pulsed lasers of different frequencies with stable power. This application does not make specific limitations on this.

[0131] For example, a laser emits a laser beam to the workpiece to be processed; a 3D camera scans the workpiece according to a preset scanning path and acquires a global point cloud of the workpiece; a host computer processes the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory; based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, the height of the laser relative to the workpiece or the focusing distance of the laser is determined, and the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser; based on the three-dimensional processing trajectory and the height of the laser relative to the workpiece or the focusing distance of the laser, the laser is controlled to emit a laser beam to process the workpiece.

[0132] In one embodiment, the host computer 2040 includes a processor for sending control signals to control various components and for executing the laser control method provided in the embodiments of this application. Optionally, as Figure 14 As shown, the host computer 2040 may further include a memory. The host computer 2040 can retrieve and run the laser control program from the memory to implement the method described in this embodiment. The memory may be a separate device independent of the host computer, or it may be integrated into the host computer.

[0133] Optionally, the memory may include read-only memory and random access memory, and provide instructions and data to the processor. A portion of the memory may also include non-volatile random access memory. For example, the memory may also store device type information. The host computer 2040 can be used to execute instructions stored in the memory, and when the host computer 2040 executes instructions stored in the memory, the host computer 2040 is used to perform various steps and / or processes in the laser control method described above.

[0134] In implementation, each step of the above method can be completed by integrated logic circuits in the processor's hardware or by instructions in software. The steps of the method disclosed in the embodiments of this application can be directly implemented by a hardware processor, or by a combination of hardware and software modules in the processor. The software modules can reside in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. This storage medium is located in memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above method. To avoid repetition, detailed descriptions are omitted here.

[0135] It should be noted that the processor in the embodiments of this application can be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method embodiments can be completed by the integrated logic circuits in the processor's hardware or by instructions in software form. The processor can be a general-purpose processor, a digital signal processor, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The processor in the embodiments of this application can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the methods disclosed in the embodiments of this application can be directly embodied as being executed by a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software modules can be located in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. This storage medium is located in memory; the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above methods.

[0136] It is understood that the memory in the embodiments of this application can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM). It should be noted that the memory used in the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0137] Optionally, embodiments of this application also provide a chip, including a processor, which can call and run computer programs from memory to implement the methods in embodiments of this application.

[0138] Optionally, embodiments of this application also provide a computer-readable storage medium for storing a computer program that causes a computer to perform the methods described in the embodiments of this application.

[0139] Optionally, embodiments of this application also provide a computer program product, including computer program instructions that cause a computer to execute the methods in the embodiments of this application.

[0140] Optionally, embodiments of this application also provide a computer program. The computer program causes a computer to perform the methods described in the embodiments of this application.

[0141] It is understood that the memory in the embodiments of this application can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchlink DRAM (SLDRAM), and Direct Rambus RAM (DR RAM). It should be noted that the memory used in the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0142] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A laser control method, characterized in that, A laser processing apparatus, including a 3D camera and a laser, is used to process a workpiece, wherein the method includes: The 3D camera is controlled to scan the workpiece to be processed according to a preset scanning path to obtain the global point cloud of the workpiece to be processed; The global point cloud and the preset pattern to be processed are processed to obtain a three-dimensional processing trajectory; Based on the coordinate information and mapping relationship of the three-dimensional machining trajectory, the height of the laser relative to the workpiece to be processed or the focusing distance of the laser is determined. The mapping relationship is used to represent the pre-established mapping relationship between the three-dimensional machining trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser. Based on the three-dimensional machining trajectory, control the lateral movement of the laser; The longitudinal distance of the laser is controlled according to the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, so as to complete the processing of the workpiece to be processed; The step of processing the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory includes: Based on the path information in the pre-imported pattern to be processed and graphic file of the laser processing equipment, the original processing trajectory of the laser processing equipment is generated, and the original processing trajectory is a two-dimensional processing trajectory. The global point cloud is merged with the original machining trajectory, so that the original machining trajectory is augmented with Z-axis height information to obtain the three-dimensional machining trajectory.

2. The method according to claim 1, characterized in that, The workpiece to be processed is scanned according to a preset scanning path to obtain a global point cloud of the workpiece, including: Obtain multiple frames of local point cloud data of the workpiece to be processed; The multiple frames of local point clouds are fused to obtain the global point cloud of the workpiece to be processed.

3. The method according to claim 2, characterized in that, The step of fusing the multiple frames of local point clouds to obtain the global point cloud of the workpiece to be processed includes: Preprocessing is performed on each frame of local point cloud data in the multi-frame local point cloud; The preprocessed local point cloud data of each frame is aligned with the world coordinate system, and the aligned local point cloud data of each frame is fused using a fusion algorithm to obtain the global point cloud.

4. The method according to any one of claims 1 to 3, characterized in that, The method further includes: The position and focus of the laser are adjusted based on the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, so that the focused spot of the laser beam is always located on the surface of the workpiece to be processed.

5. A laser processing device, characterized in that, The laser processing equipment is used to process workpieces. It includes a work platform, a laser, a 3D camera, and a host computer. The workpiece is placed on the work platform, wherein: The laser is used to emit a laser beam to the workpiece to be processed; The 3D camera is used to scan the workpiece to be processed according to a preset scanning path to obtain the global point cloud of the workpiece to be processed. The host computer is used to process the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory; based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, it determines the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, wherein the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser; based on the three-dimensional processing trajectory, it controls the lateral movement of the laser; based on the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, it controls the longitudinal distance of the laser to complete the processing of the workpiece to be processed; The host computer is used to process the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory. Specifically, this includes: generating the original processing trajectory of the laser processing equipment based on the path information in the pre-imported pattern to be processed and graphic file of the laser processing equipment, wherein the original processing trajectory is a two-dimensional processing trajectory; merging the global point cloud and the original processing trajectory to obtain a three-dimensional processing trajectory. The trajectory is augmented with Z-axis height information to obtain the three-dimensional machining trajectory.

6. The laser processing equipment according to claim 5, characterized in that, The 3D camera is fixed to the laser and moves along the X / Y / Z axes of the coordinate system following the laser; or, The 3D camera is fixedly mounted on the top or side of the laser processing equipment.

7. The laser processing equipment according to claim 5 or 6, characterized in that, The laser includes a laser source and a focusing lens; the focusing lens is used to focus the laser beam emitted by the laser source to change the focal point position of the laser beam; or, The laser includes a laser source and a zoom lens, the focal length of which is variable; the zoom lens is used to focus the laser beam emitted by the laser source so that the laser beam is focused on the surface of the workpiece to be processed.

8. The laser processing equipment according to claim 5 or 6, characterized in that, The host computer is also used to adjust the height of the laser on the Z-axis via the Z-axis drive shaft to change the distance between the laser beam and the surface of the workpiece to be processed; or, The host computer is also used to change the distance of the focal point of the laser beam relative to the work platform on the Z-axis by adjusting the height of the work platform.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium is used to store a computer program that, when run on a computer, causes the computer to perform the method as described in any one of claims 1 to 4.

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