An optical module

Abstract

Disclosed is an optical module, comprising: a housing assembly and a PCB assembly located in the housing assembly, the PCB assembly comprising a mainboard PCB assembly and a daughterboard PCB assembly; wherein the mainboard PCB assembly comprises a first PCB board and a first connector provided on the first PCB board, the daughterboard PCB assembly comprises a second PCB board and a second connector provided on the second PCB board, and the daughterboard PCB assembly is assembled on the mainboard PCB assembly through mating plug-in assembly of the first connector and the second connector.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] An optical module (OPM) is an integrated module used for photoelectric conversion, converting optical signals into electrical signals or vice versa, playing a crucial role in optical communication. An OPM typically consists of a housing assembly (base and top cover) and a PCB assembly located within the housing assembly. The PCB assembly includes the PCB board and various components integrated on it. If any component fails, the entire PCB assembly needs to be disassembled for repair or replacement, increasing maintenance costs. Summary of the Invention

[0003] This disclosure provides an optical module, including:

[0004] The housing assembly and the PCB assembly located within the housing assembly, the PCB assembly including a motherboard PCB assembly and a daughterboard PCB assembly; wherein...

[0005] The motherboard PCB assembly includes a first PCB board and a first connector disposed on the first PCB board. The daughterboard PCB assembly includes a second PCB board and a second connector disposed on the second PCB board. The daughterboard PCB assembly is assembled onto the motherboard PCB assembly through the mating and interlocking of the first connector and the second connector.

[0006] In some embodiments, the first connector is a male terminal and the second connector is a female terminal.

[0007] In some embodiments, a first clearance notch is provided at one end of the first PCB board, the first PCB board includes a first region and a second region located on both sides of the first clearance notch and disposed opposite to each other, and other regions other than the first region and the second region, the other regions being defined as a third region, and the second PCB board at least covers a portion of the first region or a portion of the second region.

[0008] In some embodiments, the first connector is disposed at the end of the first region or the second region away from the third region.

[0009] In some embodiments, the second connector is disposed at the end of the second PCB board away from the third region.

[0010] In some embodiments, the optical module further includes an optical port adapter disposed within the first clearance notch.

[0011] In some embodiments, the optical module further includes: a fiber coiling frame disposed on the first PCB board, the fiber coiling frame at least partially covering the third region, and the fiber coiling frame having a fiber coiling path for coiling optical fibers.

[0012] In some embodiments, the optical module further includes: a fiber routing box, which is located between the fiber tray and the optical port adapter and disposed within the first clearance notch. The fiber routing box is provided with a fiber routing groove, through which the optical fiber connected to the optical port adapter passes into the fiber tray's fiber routing path.

[0013] In some embodiments, a third connector is further provided on the first PCB board, the third connector being disposed near the first clearance notch; the optical module further includes: a laser, the laser being mounted above the fiber optic box and electrically connected to the first PCB board through the third connector.

[0014] In some embodiments, the housing assembly includes a base and a cover plate located above the base, the cover plate being disposed above the PCB assembly, the base being disposed below the PCB assembly, and the PCB assembly being disposed within a cavity enclosed by the cover plate and the base.

[0015] This disclosure provides an optical module, comprising: a housing assembly and a PCB assembly located within the housing assembly. The PCB assembly includes a motherboard PCB assembly and a daughterboard PCB assembly. The motherboard PCB assembly includes a first PCB board and a first connector disposed on the first PCB board. The daughterboard PCB assembly includes a second PCB board and a second connector disposed on the second PCB board. The daughterboard PCB assembly is assembled onto the motherboard PCB assembly via the mating of the first connector and the second connector. The PCB assembly provided in this disclosure includes a motherboard PCB assembly and a daughterboard PCB assembly mounted on the motherboard PCB assembly. This disclosure separates the PCB assembly into a motherboard PCB assembly and a daughterboard PCB assembly, allowing for separate manufacturing, rework, and repair of the motherboard PCB assembly and the daughterboard PCB assembly. This disperses the failure risks of the PCB assembly during manufacturing, rework, and repair. Simultaneously, vulnerable components (such as optical attenuators, pump lasers, etc.) can be integrated onto the daughterboard PCB assembly. When these vulnerable components fail, only the daughterboard PCB assembly needs to be repaired or replaced, reducing repair costs.

[0016] Details of one or more embodiments of this disclosure are set forth in the following drawings and description. Other features and advantages of this disclosure will become apparent from the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an optical module provided in an embodiment of this disclosure;

[0019] Figure 2 An exploded view of the optical module provided in the embodiments of this disclosure;

[0020] Figure 3 This is a cross-sectional structural diagram of an optical module provided in an embodiment of this disclosure.

[0021] Figure 4 This is a schematic diagram of the structure of the base in the optical module provided in this embodiment of the disclosure;

[0022] Figure 5 This is a schematic diagram of the structure of the cover plate in the optical module provided in an embodiment of this disclosure;

[0023] Figure 6 This is a schematic diagram of the structure of the motherboard PCB assembly in the optical module provided in the embodiments of this disclosure;

[0024] Figure 7 This is a schematic diagram of the structure of the sub-board PCB assembly in the optical module provided in this embodiment of the disclosure;

[0025] Figure 8 This is a schematic diagram of the PCB assembly in the optical module provided in the embodiments of this disclosure;

[0026] Figure 9 This is a schematic diagram of the structure of the optical port adapter in the optical module provided in the embodiments of this disclosure;

[0027] Figure 10 This is a schematic diagram of the structure of the optical port pressure block in the optical module provided in the embodiments of this disclosure;

[0028] Figure 11 This is a schematic diagram of the fiber optic cassette in an optical module provided in an embodiment of this disclosure;

[0029] Figure 12 This is a schematic diagram of the structure of the tailstock fiber rack in the optical module provided in the embodiments of this disclosure;

[0030] Figure 13 This is a schematic diagram of the main fiber optic cable frame in an optical module provided in an embodiment of this disclosure;

[0031] Figure 14This is a schematic diagram of the assembly structure of the motherboard PCB assembly, daughterboard PCB assembly, main fiber tray, tail fiber tray, fiber routing box, and optical port adapter in the optical module provided in the embodiments of this disclosure;

[0032] Figure 15 for Figure 14 A structural diagram from another perspective;

[0033] Figure 16 for Figure 14 A top-down view;

[0034] Figure 17 for Figure 14 A schematic diagram of a partial cross-sectional structure;

[0035] Explanation of reference numerals in the attached figures:

[0036] 100-Housing assembly; 200-Cavity; D1-First end region; D2-Second end region; 1-Cover plate; 11-First heat dissipation boss; 12-First cover plate mounting boss; 13-Second cover plate mounting boss; 14-Avoidance pit; 15-Laser mounting boss; 16-Second heat dissipation boss; 18-Soft strip pressurizing boss; 19-Groove; 2-Base; 21-Subboard support boss; 22-First base mounting boss; 231-First motherboard support boss; 232-Second motherboard support boss; 233-Third motherboard support boss; 24-Fiber optic cable holder support 25-Shielding adhesive dot; 26-Optical port anti-rotation groove; 27-Second base assembly boss; 40-Fiber reel; 3-Tail fiber reel; 36-Main body; 37-Connecting part; 31-Mounting fixing foot; 311-Third fiber reel fixing hole; 32-Fiber reel fixing boss; 33-Fourth clearance notch; 34-Fiber reel boss; 35-First path; 4-Main fiber reel; 41-Second path; 42-Heat dissipation through hole; 43-Fiber winding turntable; 44-Inner ring path; 45-Outer ring path; 46-Device baffle; 47-Fiber optic baffle; 48-First fiber inlet. 49-Second fiber inlet; 410-Third fiber inlet; 411-First fiber optic spool mounting hole; 412-Second fiber optic spool mounting hole; 413-Through hole; 414-Opening; 415-Second fiber stop cover; 20-PCB assembly; 5-Main board PCB assembly; 51-Digital signal processor; 52-Receiver and emitter assembly; 53-First connector; 54-Third connector; 55-First clearance notch; 561-First main board mounting hole; 562-Second main board mounting hole; 57-First PCB board; 58-Second clearance notch; 59-Third clearance notch R1 - First area; R2 - Second area; R3 - Third area; 6 - Sub-board PCB assembly; 61 - Second connector; 62 - Sub-board optoelectronic device; 63 - Sub-board mounting hole; 64 - Second PCB board; 7 - Laser; 71 - Flexible tape; 8 - Optical port clamp; 81 - Cover; 82 - Pressing hole; 83 - Optical port clamp mounting hole; 9 - Fiber optic box; 91 - Fiber optic channel; 92 - Limiting wall; 93 - First fiber optic cover; 94 - Fiber optic box mounting hole; 95 - Fourth fiber optic inlet; 10 - Optical port adapter; 101 - Flat surface; 102 - Pigtail; 103 - Curved surface. Detailed Implementation

[0037] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0038] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that this disclosure may be practiced without one or more of these details. In other instances, to avoid confusion with this disclosure, certain technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0039] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0040] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this disclosure, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this disclosure.

[0041] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0042] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprise” and / or “comprising,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0043] An optical module (OPM) is an integrated module used for photoelectric conversion, converting optical signals into electrical signals or vice versa, playing a crucial role in optical communication. An OPM typically consists of a housing assembly (base and top cover) and a PCB assembly located within the housing assembly. The PCB assembly includes the PCB board and various components integrated on it. If any component fails, the entire PCB assembly needs to be disassembled for repair or replacement, increasing maintenance costs.

[0044] Based on this, the following technical solutions of the embodiments of this disclosure are proposed. The specific implementation methods of this disclosure will be described in detail below with reference to the accompanying drawings. In the detailed description of the embodiments of this disclosure, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to general proportions, and the schematic diagrams are merely examples and should not limit the scope of protection of this disclosure.

[0045] See appendix Figure 1 To be continued Figure 17 This disclosure provides an optical module, including: a housing assembly 100 and a PCB assembly 20 located within the housing assembly 100. The PCB assembly 20 includes a mainboard PCB assembly 5 and a daughterboard PCB assembly 6. The mainboard PCB assembly 5 includes a first PCB board 57 and a first connector 53 disposed on the first PCB board 57. The daughterboard PCB assembly 6 includes a second PCB board 64 and a second connector 61 disposed on the second PCB board 64. The daughterboard PCB assembly 6 is assembled onto the mainboard PCB assembly 5 through the mating and interlocking of the first connector 53 and the second connector 61.

[0046] In practice, the optical module can be a coherent optical module, such as a digital coherent optical module or an analog coherent optical module in a CFP2 package. However, it is not limited to these; the optical module can also be any type of optical module.

[0047] like Figures 1 to 3As shown, in one embodiment, the housing assembly 100 includes a base 2 and a cover plate 1 located above the base 2. The cover plate 1 is disposed above the PCB assembly 20, and the base 2 is disposed below the PCB assembly 20. The PCB assembly 20 is disposed within a cavity 200 enclosed by the cover plate 1 and the base 2, which is the interior of the housing assembly 100.

[0048] like Figure 4 As shown, a first base mounting boss 22 is provided on the side of the base 2 facing the cover plate 1, and the first base mounting boss 22 is provided with a threaded hole on its inner wall. Correspondingly, as Figure 5 As shown, a first cover plate mounting boss 12 is provided on the side of the cover plate 1 facing the base 2, opposite to the first base mounting boss 22. The first cover plate mounting boss 12 has a through hole, and the cover plate 1 is fixed to the first base mounting boss 22 by screws passing through the first cover plate mounting boss 12. In one embodiment, the first base mounting boss 22 and the first cover plate mounting boss 12 are respectively provided on both sides of the middle area between the base 2 and the cover plate 1.

[0049] In one embodiment, a second base mounting boss 27 is also provided on both sides of the base 2, and the second base mounting boss 27 is provided with threaded holes on its inner wall. In some embodiments, the second base mounting boss 27 is provided on both sides of one end of the base 2. Correspondingly, a second cover plate mounting boss 13 is provided on the side of the cover plate 1 facing the base 2 opposite to the second base mounting boss 27, and the second cover plate mounting boss 13 is provided with a through hole. The cover plate 1 is fixed to the second base mounting boss 27 by screws passing through the second cover plate mounting boss 13.

[0050] In one embodiment, the base 2 further includes a shielding adhesive dot surface 25, which is located at the connection between the base 2 and the cover plate 1, and the shielding adhesive dot surface 25 has shielding adhesive. When the cover plate 1 is placed on the base 2, the shielding adhesive is compressed to achieve the electromagnetic shielding function.

[0051] like Figure 4 As shown, in one embodiment, at least one optical port anti-rotation groove 26 is provided at one end of the base 2, and the inner wall of the optical port anti-rotation groove 26 is arc-shaped.

[0052] like Figure 6As shown, in one embodiment, a first clearance notch 55 is provided at one end of the first PCB board 57. The first PCB board 57 includes a first region R1 and a second region R2 located on both sides of the first clearance notch 55 and disposed opposite to each other, as well as other regions besides the first region R1 and the second region R2, which are defined as a third region R3. In some embodiments, the end of the first PCB board 57 with the first clearance notch 55 is correspondingly fitted to the end of the base 2 with the optical port anti-rotation groove 26, and the first clearance notch 55 of the first PCB board 57 exposes the optical port anti-rotation groove 26, with the first region R1 and the second region R2 located on both sides of the optical port anti-rotation groove 26, respectively.

[0053] In one embodiment, the first PCB board 57 is further provided with a first motherboard mounting hole 561 penetrating through the first PCB board 57. The first motherboard mounting hole 561 is located at the edge of the first region R1 and the second region R2. In some embodiments, the base 2 is further provided with a first motherboard support boss 231. The first motherboard support boss 231 is provided with a screw hole with threads machined on its inner wall. The screw hole of the first motherboard support boss 231 is opposite to the first motherboard mounting hole 561. The motherboard PCB assembly 5 is fixed to the first motherboard support boss 231 by screws passing through the first motherboard mounting hole 561 from top to bottom.

[0054] In one embodiment, a second clearance notch 58 is provided at the position corresponding to the first base mounting boss 22 on the first PCB board 57, for avoiding the first base mounting boss 22.

[0055] In one embodiment, the motherboard PCB assembly 5 further includes a motherboard optoelectronic device 30 integrated on the first PCB board 57. In a specific embodiment, the motherboard optoelectronic device 30 includes a light-emitting and light-receiving component 52 disposed on the third region R3. Here, the light-emitting and light-receiving component 52 may include a coherent optical modulator and a coherent optical receiver, which are combined to form an integral light-emitting and light-receiving component 52. In some embodiments, one end of the light-emitting and light-receiving component 52 may be connected to an optical fiber for transmitting optical signals, and the end of the light-emitting and light-receiving component 52 connected to the optical fiber may be oriented towards the first clearance notch 55 to facilitate the coiling of the optical fiber.

[0056] In one embodiment, the motherboard optoelectronic device 30 further includes a digital signal processor 51 integrated on the first PCB board 57. In a specific embodiment, the digital signal processor 51 is disposed on the third region R3, and the light-emitting and receiving component 52 and the digital signal processor 51 are disposed side by side on the third region R3, with the digital signal processor 51 located on the side of the light-emitting and receiving component 52 away from the first clearance notch 55. It should be noted that when the optical module is an analog coherent optical module, the digital signal processor 51 is not disposed on the first PCB board 57. In some embodiments, when the optical module is a digital coherent optical module, an erbium-doped fiber amplifier may also be disposed on the first PCB board 57.

[0057] In one embodiment, a third connector 54 is also provided on the first PCB board 57, and the third connector 54 is located near the first clearance notch 55. Figure 6 The third connector 54 shown is disposed on the third region R3. In some embodiments, the third connector 54 is a non-micro connector, and the pad spacing of the third connector 54 is greater than 1 mm and less than 2 mm. The third connector 54 can be a male or female connector.

[0058] In one embodiment, the second PCB board 64 covers at least a portion of the first region R1 or a portion of the second region R2. Figure 8 The second PCB board 64 shown is mounted above and partially covers the first region R1. However, it is not limited to this; the second PCB board 64 can also be mounted above the second region R2 to partially cover the second region R2. In some embodiments, the second PCB board 64 can also extend from the first region R1 or the second region R2 to the third region R3, that is, the second PCB board 64 can also partially cover the third region R3.

[0059] In one embodiment, the first connector 53 is disposed at the end of the first region R1 or the second region R2 away from the third region R3. Figure 6 The first connector 53 shown is located at the end of the first region R1 away from the third region R3. However, it is not limited to this; the first connector 53 may also be located at the end of the second region R2 away from the third region R3.

[0060] like Figure 7 As shown, in one embodiment, the second connector 61 is located at one end of the second PCB board 64. Figure 8 As shown, in one specific embodiment, when the daughter board PCB assembly 6 is assembled onto the mother board PCB assembly 5, the second connector 61 is located at the end of the second PCB 64 away from the third region R3.

[0061] In one embodiment, the first connector 53 and the second connector 61 are pluggable connectors. In a specific embodiment, the first connector 53 is a male terminal, the second connector 61 is a female terminal, and the first PCB board 57 and the second PCB board 64 are connected using a surface mount method.

[0062] In one embodiment, the sub-board PCB assembly 6 further includes a sub-board optoelectronic device 62 disposed on the second PCB board 64. For example... Figure 8 As shown, in one specific embodiment, the sub-board optoelectronic device 62 is disposed near the third region R3. One end of the sub-board optoelectronic device 62 can be connected to an optical fiber, and the end of the sub-board optoelectronic device 62 connected to the optical fiber is disposed towards the third region R3 to facilitate the coiling of the optical fiber.

[0063] In one embodiment, at least one sub-board fixing hole 63 is provided at the edge of the second PCB board 64, and the sub-board fixing hole 63 penetrates the second PCB board 64. In some embodiments, the base 2 is further provided with a sub-board support boss 21, which has a screw hole with threads machined on its inner wall. The screw hole of the sub-board support boss 21 is arranged opposite to the sub-board fixing hole 63, and the sub-board PCB assembly 6 is fixed to the sub-board support boss 21 by screws passing through the sub-board fixing hole 63 from top to bottom. In some embodiments, the orthographic projections of the sub-board fixing hole 63 and the first PCB board 57 on the base 2 do not overlap, so that the screws passing through the sub-board fixing hole 63 avoid the first PCB board 57.

[0064] The PCB assembly 20 provided in this embodiment includes a motherboard PCB assembly 5 and a daughterboard PCB assembly 6 mounted on the motherboard PCB assembly 5. This embodiment of the PCB assembly 20 is split into the motherboard PCB assembly 5 and the daughterboard PCB assembly 6, which allows the motherboard PCB assembly 5 and the daughterboard PCB assembly 6 to be manufactured, reworked and repaired separately, thereby dispersing the failure risk of the PCB assembly 20 in manufacturing, rework and repair. At the same time, vulnerable components (such as optical attenuators, pump lasers, etc.) can be integrated on the daughterboard PCB assembly 6. When these vulnerable components are damaged, only the daughterboard PCB assembly 6 can be repaired or replaced, reducing maintenance costs.

[0065] In this embodiment, the first connector 53 is located at the end of the first region R1 or the second region R2 away from the third region R3, and the second connector 61 is located at the end of the second PCB board 64 away from the third region R3. In this way, the second PCB board 64 can cover the first region R1 or the second region R2 to the maximum extent, and the second PCB assembly 6 can fully occupy the first region R1 or the second region R2, thereby improving the space utilization of the optical module and avoiding space waste. At the same time, the sub-board optoelectronic device 62 is located adjacent to the third region R3, and the end of the sub-board optoelectronic device 62 connected to the optical fiber is set towards the third region R3. This design allows the optical fiber connected to the sub-board optoelectronic device 62 to not need to pass through the second connector 61 when coiling, which facilitates the coiling of the optical fiber.

[0066] It should be noted that, Figure 8 The diagram shows a motherboard PCB assembly 5 with a daughterboard PCB assembly 6. However, this is not a limitation; multiple daughterboard PCB assemblies 6 can be mounted on a motherboard PCB assembly 5, such as 2, 3, 4, or 5. Any two of the multiple daughterboard PCB assemblies 6 can be positioned on either side of the first clearance notch 55 to respectively cover a portion of the first region R1 and a portion of the second region R2. The daughterboard PCB assembly 6 can also be positioned in other areas of the first PCB board 57.

[0067] like Figure 14 As shown, in one embodiment, the optical module further includes an optical port adapter 10, which is disposed within the first clearance notch 55.

[0068] Figure 9 This is a schematic diagram of the optical port adapter, as shown below. Figure 9 As shown, one end of the optical port adapter 10 is connected to a pigtail 102. (As indicated...) Figure 14 As shown, one end of the optical port adapter 10 connected to the pigtail 102 faces the third region R3. In some embodiments, the motherboard optoelectronic device 30 (e.g., the light-emitting and receiving component 52) ​​and the daughterboard optoelectronic device 62 are connected to the pigtail 102 of the optical port adapter 10 via optical fiber.

[0069] In one embodiment, the optical port adapter 10 is fitted into the optical port anti-rotation slot 26 exposed by the first clearance notch 55. In a specific embodiment, the optical module includes two optical port adapters 10, and the base 2 is provided with two optical port anti-rotation slots 26, with the two optical port adapters 10 fitted into the two optical port anti-rotation slots 26 respectively.

[0070] In one embodiment, the sidewall of the optical port adapter 10 is provided with an arc surface 103 and a flat surface 101. The design of the flat surface 101 can prevent the optical port adapter 10 from rotating within the optical port anti-rotation groove 26, thereby avoiding damage to the pigtail 102.

[0071] In one embodiment, the optical module further includes an optical port pressure block 8 mounted on top of the optical port adapter 10.

[0072] Figure 10 This is a schematic diagram of the structure of the optical port clamping block 8. (See diagram below.) Figure 10 As shown, in one embodiment, the optical port pressure block 8 has a pressure hole 82 on the side facing the optical port adapter 10. The pressure hole 82 cooperates with the optical port anti-rotation groove 26 to completely limit the optical port adapter 10. In a specific embodiment, the inner wall contour of the pressure hole 82 after it is closed with the optical port anti-rotation groove 26 is the same as the contour of the optical port adapter 10, that is, it has a straight inner wall that fits with the plane 101 and an arc-shaped inner wall that fits with the arc surface 103, so as to completely limit the optical port adapter 10 and prevent the optical port adapter 10 from rotating within the optical port anti-rotation groove 26.

[0073] In one embodiment, the optical port pressure block 8 is provided with an optical port pressure block fixing hole 83, and the optical port pressure block 8 is fixed to the base 2 by screws passing through the optical port pressure block fixing hole 83 from top to bottom.

[0074] like Figure 14 As shown, in one embodiment, the optical module further includes a fiber optic cable tray 9, which is mounted between the first PCB board 57 and the optical port adapter 10 and disposed within the first clearance notch 55.

[0075] Figure 11 This is a schematic diagram of the fiber optic cable carrier 9. Figure 11 As shown, the fiber optic cable tray 9 is provided with a fiber optic cable slot 91. In one embodiment, there are one or more fiber optic cable slots 91 and one or more optical port adapters 10, with one or more fiber optic cable slots 91 corresponding to one or more optical port adapters 10. The fiber optic cable slot 91 is used to constrain and protect the optical fiber connected to the optical port adapter 10, preventing damage to the optical fiber.

[0076] In one embodiment, the fiber optic cable box 9 further includes a fourth fiber inlet 95 for entering and exiting the fiber optic cable tray 91. The fourth fiber inlet 95 is located at the end of the fiber optic cable tray 91 away from the optical port adapter 10, and multiple fiber optic cable trays 91 share one fourth fiber inlet 95.

[0077] In one embodiment, the fiber optic cable box 9 further includes a first fiber stop cover 93 disposed above the fiber optic cable groove 91. The first fiber stop cover 93 is used to prevent the optical fiber located in the fiber optic cable groove 91 from jumping out, thereby avoiding the optical fiber from being crushed or damaged during assembly.

[0078] In one embodiment, the fiber optic cable cassette 9 is provided with a fiber optic cable cassette fixing hole 94 that passes through the fiber optic cable cassette 9; the base 2 is provided with a fiber optic cable cassette support boss 24 at a position opposite to the fiber optic cable cassette fixing hole 94, the fiber optic cable cassette support boss 24 is provided with a screw hole with threads machined on the inner wall, and the fiber optic cable cassette 9 is fixed to the fiber optic cable cassette support boss 24 by screws that pass through the fiber optic cable cassette fixing hole 94 from top to bottom.

[0079] In this embodiment, a first clearance notch 55 is provided on the first PCB board 57, the fiber optic box 9 and the optical port adapter 10 are assembled in the first clearance notch 55, and the sub-board PCB assembly 6 is assembled on one or both sides of the first clearance notch 55. In this way, the space on one or both sides of the fiber optic box 9 and the optical port adapter 10 can be fully utilized, thereby improving the space utilization rate of the optical module.

[0080] In one embodiment, the optical module further includes a fiber optic tray 40, which is disposed on the first PCB board 57. The fiber optic tray 40 has a fiber optic winding path for winding optical fibers. The optical fiber connected to the optical port adapter 10 passes through the fiber routing slot 91 and enters the fiber optic winding path of the fiber optic tray 40. The following describes the process in conjunction with... Figure 3 , Figures 12 to 17 The fiber tray 40 is described in detail.

[0081] In one embodiment, the fiber tray 40 includes a main fiber tray 4 and a tail fiber tray 3, which are mounted on the first PCB board 57.

[0082] Specifically, as shown in the figure, the end of the cavity 200 where the optical port adapter 10 is located is defined as the first end region D1, and the other end opposite to the first end region D1 is defined as the second end region D2. The main fiber tray 4 and the tail fiber tray 3 are arranged sequentially along the direction from the first end region D1 to the second end region D2.

[0083] In one embodiment, the orthographic projection of the main fiber carrier 4 on the first PCB board 57 falls within the third region R3, and the tail fiber carrier 3 is located on the side of the main fiber carrier 4 away from the first clearance notch 55, and the orthographic projection of the tail fiber carrier 3 on the first PCB board 57 at least partially falls within the third region R3.

[0084] In one embodiment, the tailstock fiber carrier 3 includes a main body 36 and a connecting part 37. The connecting part 37 is located between the main fiber carrier 4 and the main body 36. The tailstock fiber carrier 3 is connected to the end of the main fiber carrier 4 through the connecting part 37.

[0085] In one embodiment, the connecting portion 37 is provided with a fiber optic coil fixing boss 32, and the fiber optic coil fixing boss 32 is provided with a screw hole with threads machined on the inner wall; the main fiber optic coil 4 is provided with a first fiber optic coil fixing hole 411 at one end near the tail fiber optic coil 3, the first fiber optic coil fixing hole 411 overlaps with the fiber optic coil fixing boss 32, and the main fiber optic coil 4 is fixedly installed on the fiber optic coil fixing boss 32 by screws passing through the first fiber optic coil fixing hole 411 from top to bottom. In this embodiment, the tail fiber optic coil 3 can serve to fix the main fiber optic coil 4.

[0086] In one embodiment, mounting feet 31 are provided on both sides of the connecting portion 37. The lower surface of the mounting feet 31 contacts the upper surface of the first PCB board 57, and a third fiber optic cable mounting hole 311 is provided on the mounting feet 31. In some embodiments, a third clearance notch 59 is provided on the first PCB board 57 below the third fiber optic cable mounting hole 311. A third motherboard support boss 233 is provided on the side of the base 2 facing the cover plate 1 opposite to the third clearance notch 59. The fiber optic cable 40 and the first PCB board 57 are fixed to the third motherboard support boss 233 by screws that pass through the third fiber optic cable mounting hole 311 and the third clearance notch 59 from top to bottom.

[0087] In one embodiment, a fourth clearance notch 33 is provided on both sides of the connecting portion 37. The fourth clearance notch 33 is used to avoid screws that pass through the second cover plate mounting boss 13 to fix the cover plate 1 on the second base mounting boss 27.

[0088] like Figure 3 and Figure 15 As shown, in one embodiment, the main body 36 is mounted on the upper part of the second end region D2. In a specific embodiment, the lower surface of the main body 36 is higher than the upper surface of the first PCB board 57, and a gap is left between the main body 36 and the first PCB board 57 so that the main body 36 can be mounted on the upper part of the second end region D2 of the cavity 200, and the gap between the main body 36 and the first PCB board 57 facilitates the connection of the first PCB board with other devices.

[0089] The fiber optic tray 40 provided in this embodiment includes a main fiber optic tray 4 and a tail fiber optic tray 3. The main body 36 of the tail fiber optic tray 3 is mounted on the upper part of the second end region D2 of the cavity 200. The MSA protocol does not restrict the upper space of the second end region D2 of the cavity 200. Therefore, the tail fiber optic tray 3 and the cover plate 1 can jointly form the shape of the optical module without violating the MSA protocol. In this way, the internal space of the optical module can be fully utilized, and the fiber optic tray space of the optical module can be expanded. According to the MSA protocol, the height of the usable space in the upper part of the second end region D2 of the cavity 200 is 3.4 mm. Therefore, the thickness H of the main body 36 can be set to be less than or equal to 3.4 mm.

[0090] The main fiber tray 4 and the tail fiber tray 3 can be formed from different materials. In one embodiment, the main fiber tray 4 is made of plastic, and the tail fiber tray 3 is made of metal. The main fiber tray 4 often has a complex structure and is thinner in some areas. In this embodiment, plastic is used as the material for forming the main fiber tray 4, which can reduce the overall weight of the optical module and facilitate processing. In addition, the mounting feet 31 of the tail fiber tray 3 are in contact with the upper surface of the first PCB board 57. In this embodiment, metal is used as the material for the tail fiber tray 3, which can provide good heat dissipation for the first PCB board 57.

[0091] In one embodiment, the main fiber tray 4 is provided with a second fiber tray fixing hole 412 that penetrates through the main fiber tray 4. In some embodiments, the first PCB board 57 is provided with a second motherboard fixing hole 562 located below the second fiber tray fixing hole 412, and the base 2 is provided with a second motherboard support boss 232 on the side facing the cover plate 1 opposite to the second motherboard fixing hole 562. The fiber tray 40 and the first PCB board 57 are fixed to the second motherboard support boss 232 by screws that pass through the second fiber tray fixing hole 412 and the second motherboard fixing hole 562 from top to bottom.

[0092] In one embodiment, the main body 36 is provided with at least one fiber coiling boss 34, which restricts at least one first path 35 on the tail fiber coiler 3. In some embodiments, the main fiber coiler 4 is provided with at least one fiber baffle 47, which restricts at least one second path 41 on the main fiber coiler 4. The at least one second path 41 is interconnected with the at least one first path 35 to form at least one fiber coiling path for coiling optical fibers.

[0093] In one embodiment, at least one fiber coil boss 34 is arranged on the tail coil frame 3 in the direction from the main coil frame 4 to the tail coil frame 3, and the fiber coil boss 34 has a sidewall that bends in the direction from the main coil frame 4 to the tail coil frame 3. The fiber coil boss 34 restricts an arc-shaped first path 35 on the tail coil frame 3 to control the optical fiber to have a suitable bending radius and avoid damage to the optical fiber.

[0094] Figure 12 The tail coil fiber rack 3 shown in the figure has two fiber coiling bosses 34, which limit two first paths 35 on the tail coil fiber rack 3, that is, one fiber coiling boss 34 limits one first path 35. However, it is not limited to this, any first path 35 can also be limited by multiple discrete fiber coiling bosses 34 arranged along the fiber coiling direction.

[0095] In one embodiment, the second path 41 at the end of the main fiber tray 4 near the first clearance notch 55 is arc-shaped, and the second paths 41 on both sides of the main fiber tray 4 are straight. Figure 13The main fiber rack 4 shown in the figure has an arc-shaped outer ring path 45 and an inner ring path 44 at one end near the first clearance notch 55. The outer ring path 45 is located on the periphery of the main fiber rack 4, and the inner ring path 44 is located on the inner side of the outer ring path 45.

[0096] However, this is not the only possibility. More fiber coiling protrusions 34 can be provided on the tail coil fiber rack 3 to restrict more first paths 35, and more fiber baffles 47 can be provided on the main fiber coil rack 4 to restrict more second paths 41, thereby forming more fiber coiling paths, such as 3, 4, or 5. In this embodiment, the design of multiple fiber coiling paths increases the selectivity of the fiber coiling path, making fiber coiling more convenient and clearer.

[0097] In one embodiment, a second fiber stop cover 415 is also provided on the main fiber tray 4. The second fiber stop cover 415 is located above the second path 41 and connected to the top of the fiber optic baffle 47. The design of the second fiber stop cover 415 can prevent the fiber from jumping out of the second path 41, thereby avoiding the fiber from being crushed or damaged during assembly.

[0098] In one embodiment, a device baffle 46 is also provided on the main fiber tray 4 to isolate the passive optical devices disposed on the main fiber tray 4, and to separate the passive optical devices from the optical fiber, so as to avoid some high-temperature passive optical devices from damaging the optical fiber.

[0099] In one embodiment, the main fiber tray 4 has an opening 414 in the middle region, and the main board optoelectronic devices 30 (such as light-emitting and receiving components 52 and digital signal processors 51) are fitted into the opening 414, and the fiber tray path is arranged around the opening 414.

[0100] like Figure 13 and Figure 14As shown, in one embodiment, the main fiber tray 4 is provided with a fiber winding turntable 43 and a first fiber inlet 48 leading to the fiber winding turntable 43 from an opening 414. The fiber winding turntable 43 is formed by at least one fiber baffle 47. The optical fiber connected to the light receiving and transmitting component 52 reaches the outer wall of the fiber winding turntable 43 from the first fiber inlet 48 and winds along a portion of the outer wall of the fiber winding turntable 43 to change the winding direction of the optical fiber. In some embodiments, the fiber winding turntable 43 is located at the intersection of the arc-shaped second path 41 and the straight second path 41, and is located between the outer ring path 45 and the inner ring path 44. The outer ring path 45 partially surrounds the fiber winding turntable 43, and the first fiber inlet 48 extends through the inner ring path 44 to the portion of the outer ring path 45 surrounding the fiber winding turntable 43. The arrangement of the fiber winding turntable 43 facilitates the reversal of the optical fiber connected to the light receiving and transmitting component 52, and avoids excessive bending angle during optical fiber reversal, which could damage the optical fiber. In one specific embodiment, the fiber winding turntable 43 is formed by an annular optical fiber baffle 47. However, it is not limited to this, the fiber winding turntable 43 may also be formed by multiple arc-shaped and separately arranged optical fiber baffles 47.

[0101] like Figure 14 and Figure 16 As shown, in one embodiment, the mainboard fiber tray 4 further includes a second fiber inlet 49 near the daughterboard PCB assembly 6, through which the optical fiber connected to the daughterboard optoelectronic device 62 enters the mainboard fiber tray 4.

[0102] like Figure 14 , Figure 16 and Figure 17 As shown, in one embodiment, the mainboard fiber tray 4 further includes a third fiber inlet 410 near the fiber optic box 9. The optical fiber connected to the optical port adapter 10 passes through the fiber optic channel 91 and begins to climb from the fourth fiber inlet 95 to above the first PCB board 57, and then enters the mainboard fiber tray 4 through the third fiber inlet 410. In some embodiments, the optical fiber located in the fiber optic box 9 remains horizontal before it begins to climb, and its center position is lower than or flush with the upper surface of the first PCB board 57.

[0103] In one embodiment, the main fiber optic cable 4 is further provided with a heat dissipation through-hole 42, which penetrates the main fiber optic cable 4 and exposes the upper surface of the first PCB board 57 below. A first heat dissipation protrusion 11 is provided on the side of the cover plate 1 facing the upper surface of the first PCB board 57. The first heat dissipation protrusion 11 passes through the heat dissipation through-hole 42 and is positioned opposite to the upper surface of the first PCB board 57 for heat dissipation of the motherboard PCB assembly 5. The lower surface of the first heat dissipation protrusion 11 can contact the upper surface of the first PCB board 57 to improve the heat dissipation effect of the first heat dissipation protrusion 11.

[0104] The figure shows one heat dissipation hole 42, but it is not limited to this. The number of heat dissipation holes 42 can also be multiple, such as 2, 3 or 4, to improve the heat dissipation effect on the first PCB board 57.

[0105] In one embodiment, the heat dissipation through hole 42 is provided in the area of ​​the main fiber rack 4 where the second path 41 is not provided, and the heat dissipation through hole 42 and the second path 41 are separated by an optical fiber baffle 47 to avoid the first heat dissipation protrusion 11 from interfering with and damaging the optical fiber.

[0106] In one embodiment, a second heat dissipation protrusion 16 is provided on the side of the cover plate 1 facing the first PCB board 57, and the lower surface of the second heat dissipation protrusion 16 is disposed opposite to the upper surface of the motherboard optoelectronic device 30. The lower surface of the second heat dissipation protrusion 16 can contact the motherboard optoelectronic device 30 to improve the heat dissipation effect of the second heat dissipation protrusion 16. In a specific embodiment, two second heat dissipation protrusions 16 are provided on the side of the cover plate 1 facing the first PCB board 57, and the two second heat dissipation protrusions 16 are respectively disposed opposite to the upper surfaces of the light-emitting component 52 and the digital signal processor 51.

[0107] In one embodiment, the inner side of the fiber optic baffle 47 surrounding the fiber winding turntable 43 is provided with a through hole 413 penetrating the main fiber carrier 4, exposing the upper surface of the first PCB board 57. In some embodiments, a third heat dissipation protrusion (not shown) is provided on the side of the cover plate 1 facing the first PCB board 57, and the third heat dissipation protrusion (not shown) passes through the through hole 413 and is disposed opposite to the upper surface of the first PCB board 57. The lower surface of the third heat dissipation protrusion (not shown) can contact the upper surface of the first PCB board 57 to improve the heat dissipation effect of the third heat dissipation protrusion (not shown).

[0108] Optical modules typically have complex internal optical paths, high power consumption, and stringent heat dissipation requirements. This disclosure improves the heat dissipation efficiency of the optical module by providing a first heat dissipation protrusion 11, a second heat dissipation protrusion 16, and a third heat dissipation protrusion (not shown), thereby enhancing the module's performance. In one embodiment, the first heat dissipation protrusion 11, the second heat dissipation protrusion 16, and the third heat dissipation protrusion (not shown) are made of metal, which has good thermal conductivity to further improve their heat dissipation effect.

[0109] In one embodiment, the optical module further includes a laser 7, which is mounted above the fiber optic cable tray 9 and electrically connected to the first PCB board 57 via a third connector 54. In some embodiments, limiting walls 92 are provided on both sides of the fiber optic cable tray 9, and the laser 7 is mounted between the limiting walls 92, which are used to position and limit the assembly of the laser 7. Here, the laser 7 may be a tunable laser.

[0110] In this embodiment of the present disclosure, a first clearance notch 55 is provided on the first PCB board 57, and the fiber optic cable box 9 is placed in the first clearance notch 55. This can reduce the assembly height of the fiber optic cable box 9, thereby leaving a sufficient gap between the fiber optic cable box 9 and the laser 7, and preventing the laser 7 from crushing or damaging the optical fiber located in the fiber optic cable box 9.

[0111] In one embodiment, the laser 7 is connected to the third connector 54 via a flexible strip 71. In some embodiments, the cover plate 1 is further provided with a flexible strip pressure boss 18 on the side facing the first PCB board 57. The lower surface of the flexible strip pressure boss 18 can be bonded with elastic elements such as antistatic foam to apply pressure to the flexible strip 71 and prevent the flexible strip 71 from falling off.

[0112] In one embodiment, a groove 19 is provided on the side of the cover plate 1 facing the first PCB board 57. The laser 7 is mounted below the groove 19. The groove 19 is filled with thermal grease, which contacts the upper surface of the laser 7 for heat dissipation.

[0113] In one embodiment, a laser mounting boss 15 is further provided within the groove 19. The laser mounting boss 15 contacts the upper surface of the laser 7, and a through hole is provided on the laser mounting boss 15. The laser 7 and the cover plate 1 are fixed together by screws passing through the laser mounting boss 15. The laser mounting boss 15 can also be used for heat dissipation of the laser 7. In some embodiments, the height of the laser mounting boss 15 is less than the depth of the groove 19, so that the laser 7 is partially embedded in the groove 19, thereby allowing the thermal grease located in the groove 19 to form good contact with the laser 7.

[0114] like Figure 3 and Figure 10 As shown, in one embodiment, the optical port clamping block 8 further includes a cover 81. The cover 81 is disposed on the upper surface of the optical port clamping block 8 and protrudes from the side wall of the optical port clamping block 8. The cover 81 overlaps the upper surface of the laser 7 to prevent the laser 7 from being pulled out due to adhesion to the thermal grease during the disassembly and repair of the optical module, thereby damaging the third connector 53. In some embodiments, a clearance pit 14 is provided in the groove 19 to avoid the cover 81.

[0115] It should be noted that this disclosure does not impose strict restrictions on the processing scheme of the optical module; it can be made by die casting of zinc alloy or by milling of aluminum alloy. The former can greatly reduce the processing cost of the optical module structural components, while also effectively addressing the stringent requirements of coherent optical modules for assembly strength, reliability, heat dissipation, and other performance aspects, making the product more competitive in the market.

[0116] It should be noted that the above description is only a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An optical module characterized by comprising: The application relates to an optical module. The optical module comprises a shell assembly and a PCB assembly arranged in the shell assembly, wherein the PCB assembly comprises a mainboard PCB assembly and a daughterboard PCB assembly. The mainboard PCB assembly comprises a first PCB board and a first connector arranged on the first PCB board, and the daughterboard PCB assembly comprises a second PCB board and a second connector arranged on the second PCB board. The first PCB board is provided with a first avoiding gap at one end, and the first PCB board comprises a first region and a second region arranged oppositely on both sides of the first avoiding gap, and a third region other than the first region and the second region. The optical module further comprises an optical port adapter arranged in the first avoiding gap. The optical module further comprises a fiber winding rack arranged on the first PCB board, wherein the fiber winding rack at least partially covers the third region, and the fiber winding rack is provided with a fiber winding path for winding optical fibers. The optical module further comprises a fiber running box arranged between the fiber winding rack and the optical port adapter and arranged in the first avoiding gap, wherein the fiber running box is provided with a fiber running groove, and optical fibers connected with the optical port adapter pass through the fiber running groove and enter the fiber winding path of the fiber winding rack. The first PCB board is further provided with a third connector arranged close to the first avoiding gap.

2. The optical module according to claim 1, characterized by The first connector is a male connector, and the second connector is a female connector.

3. The optical module according to claim 1, characterized by The first connector is arranged at an end of the first region or the second region away from the third region.

4. The optical module according to claim 1, characterized by The second connector is arranged at one end of the second PCB board, and when the daughterboard PCB assembly is assembled on the mainboard PCB assembly, the second connector is arranged at an end of the second PCB board away from the third region.

5. The optical module of claim 1, wherein, The shell assembly comprises a base and a cover arranged above the base, wherein the cover is arranged above the PCB assembly, the base is arranged below the PCB assembly, and the PCB assembly is arranged in a cavity enclosed by the cover and the base.

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