bonding test equipment
By combining the frame housing and displacement unit with sensors and height actuators, precise alignment and height setting of the shearing tool are achieved, solving the problem of insufficient shearing height accuracy in existing technologies and realizing sub-micron level precise control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 赛世铁克
- Filing Date
- 2022-01-20
- Publication Date
- 2026-06-30
AI Technical Summary
Existing bonding testing equipment has limitations in setting and maintaining the accuracy of shear height, making it difficult to achieve precise control at the sub-micron level.
The system employs a combination of a frame housing, a displacement unit, a shearing tool component, and a shearing height setting unit. It utilizes sensors and height actuators to achieve precise alignment and height setting of the shearing tool, including capacitive or optical distance sensors and piezoelectric actuators, to ensure precise contact and movement of the shearing tool with the substrate.
It achieves sub-micron level precision setting of shear height, improving the accuracy and reliability of joint testing and ensuring high precision in shear testing.
Smart Images
Figure CN116847974B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a bonding test apparatus, and more particularly to a bonding test apparatus for determining the strength of a bond and / or material present on a substrate. Background Technology
[0002] Electrical connections in semiconductors and electronic components typically involve bonding, and these bondings are known to be mechanically tested as a means of measuring bonding quality. One such test is performed on a system known as a bonding test apparatus and is known as a shear test. To perform this test, a component of the bonding tester, known as a shearing tool, loads the material or bonding mounted on a substrate under a specific load or load until some type of failure occurs. During this shear or bonding test, the force in the shear direction, generally parallel to the plane defined by the substrate, is measured. After performing the shear test, the sheared surface is also visually inspected.
[0003] The positional alignment accuracy of the shearing tool relative to the joint point existing on the substrate is crucial. In known technologies, various designs exist to achieve the best possible accuracy in the positional alignment of the shearing tool with respect to the joint point. Consistent with the three dimensions of space, the shearing tool has three alignments relative to the joint point. Summary of the Invention
[0004] This disclosure relates to one of these alignments, known as "shear height." Viewed in the z-direction orthogonal to the substrate surface, "shear height" is the distance between the shearing tool (its tip) and the adjacent surface of the substrate of the joint or material being tested. The accuracy of this height alignment is paramount for performing precise joint tests and should be set and maintained as precisely as possible before and during the shear test. However, this accuracy is generally limited by the precision achievable with known joint testing techniques.
[0005] The aim is to provide an improved joint testing apparatus in which the "shear height" can be set more precisely, thereby enabling more accurate joint testing.
[0006] In a first embodiment of this disclosure, a bonding test apparatus for determining the strength of a bond and / or material present on a substrate is provided, wherein the apparatus comprises at least: a frame housing; a displacement unit for displacing the frame housing in a direction orthogonal to a plane defined by the substrate; a shearing tool component housed in the frame housing and arranged for applying a shear force to the bond and / or material in a direction parallel to the plane defined by the substrate; and a shearing height setting unit housed in the frame housing, wherein the shearing height setting unit is arranged to determine when the shearing tool component contacts the substrate, thereby obtaining a contact height, under a first operating condition in which the displacement unit displaces the frame housing in a direction toward the substrate, and to move the shearing tool component relative to the frame housing in a direction away from the substrate, under a second operating condition in which the displacement unit does not displace the frame housing, to set a shearing height of the shearing tool component based on the contact height.
[0007] Therefore, compared to existing joint test structures, the "shear height" can be set more precisely. In this embodiment, only the shearing tool component is displaced to set the shear height. Therefore, what is being displaced is a finite amount of mass, and because all these movements are performed locally, very high precision can be achieved. Due to the finite mass displacement and localized movement, the joint test apparatus according to this disclosure can be operated with very high precision and is capable of setting the shear height in the sub-micron range.
[0008] In one preferred embodiment, the shear height setting unit includes a sensor element mounted between the shear height setting unit and the frame housing, wherein the sensor element is selected from the group consisting of a capacitive distance sensor element, an optical distance sensor element, or a linear variable displacement transducer element. Therefore, the moment when the shearing tool component 'contacts' the substrate surface can be accurately determined, which is crucial for the following setting of the shear height.
[0009] In another embodiment of this disclosure, the shear height setting unit includes a height actuator unit mounted between the shear height setting unit and the frame housing. This height actuator unit is arranged to move the shear tool component relative to the frame housing in a direction away from the substrate under a second operating condition. Since the height actuator unit only needs to displace the shear tool component relative to the frame housing in a direction away from the substrate, the overall mass displacement is finite and involves a limited number of parts. The stiffness in the shear direction can be very high, thereby ensuring improved accuracy of the shear height setting, particularly in the sub-micron range.
[0010] In a preferred embodiment, the height actuator unit includes a piezoelectric actuator element and an electromagnet connection unit arranged to mechanically connect the piezoelectric actuator element to the shearing tool component under a second operating condition. Specifically, the shearing tool component includes a contact flange element made of a magnetic (or ferromagnetic) material. Under the first operating condition, the contact flange element, made of (ferro)magnetic material, just brushes past the electromagnet connection unit, during which time the electromagnet connection unit is deactivated. Under the second operating condition, the electromagnet connection unit is activated, and the contact flange element and the shearing tool component are mechanically coupled to the electromagnet connection unit and the piezoelectric actuator element. This magnetically induced mechanical interconnection allows the piezoelectric actuator element to precisely displace the shearing tool component vertically and raise it to the desired shearing height.
[0011] In yet another second embodiment of this disclosure, a bonding test apparatus for determining the strength of a bond and / or material present on a substrate is provided, wherein the apparatus comprises at least: a frame housing; a displacement unit for displacing the frame housing in a direction orthogonal to a plane defined by the substrate; a shearing tool component, housed in the frame housing and arranged to apply a shearing force to the bond and / or material in a direction parallel to the plane defined by the substrate; and a shearing height setting unit, housed in the frame housing, wherein the shearing height setting unit is arranged to determine when the shearing tool component contacts the substrate, thereby obtaining a contact height, under a first operating condition in which the displacement unit displaces the frame housing in a direction toward the substrate, and under a second operating condition in which the displacement unit does not displace the frame housing, to move the shearing tool component relative to the frame housing in a direction away from the substrate, to set a shearing height of the shearing tool component based on the contact height. According to this embodiment, a height actuator unit includes a motor, such as, but not limited to, a voice coil actuator element, to precisely displace the shearing tool component vertically and raise the shearing tool component to the desired shearing height.
[0012] In both the first and second embodiments, the shear height setting unit may further include a control unit configured to control the first and second operating conditions of the displacement unit and / or the electromagnet connection unit.
[0013] Specifically, the control unit is configured to apply a reduced alternating current to the subsequently deactivated electromagnet connection unit under the first operating condition to reduce the residual magnetism present in the electromagnet connection unit to a desired amount. Any residual magnetism will generate a small attractive force on the contact flange element made of (ferro)magnetic material, thereby creating some unwanted friction between the shearing tool component and the high-speed actuator unit. The residual magnetic force can help ensure that the flange element remains in contact with the electromagnet, but with a controlled amount of contact friction. Attached Figure Description
[0014] The invention will now be described in more detail with reference to the accompanying drawings, in which:
[0015] Figure 1 A first embodiment of a device for determining the strength of a bond and / or material present on a substrate, according to the present disclosure, is shown;
[0016] Figure 2 A second embodiment of a device for determining the strength of a bond and / or material present on a substrate, according to the present disclosure, is shown. Detailed Implementation
[0017] For a better understanding of the invention, the same parts in the accompanying drawings are indicated by the same reference numerals.
[0018] Figure 1 and Figure 2 Different embodiments of the bonding test apparatus according to this disclosure are shown, the bonding test apparatus in Figure 1 The figure is marked with 100 in the attached drawing. Figure 2 The figure is denoted by 200 in the attached figure.
[0019] This invention relates to a bonding test apparatus, and more particularly to a bonding test apparatus for determining the strength of a bond and / or material present on a substrate.
[0020] As outlined in the introduction above, electrical connections in semiconductors and electronic components typically involve bonding, and these bondings are known to require mechanical testing as a means of measuring bonding quality. One such test is known as a shear test, which can be performed using bonding testing equipment. To perform this test, a component of the bonding tester, known as a shearing tool, loads the material or bonding mounted on a substrate under a specific load or loads until some type of failure occurs. During this shear or bonding test, the force in the shear direction, generally parallel to the plane defined by the substrate, is measured. After performing the shear test, the sheared surface is also visually inspected.
[0021] exist Figure 1 and Figure 2 In the accompanying drawings, reference numeral 1 indicates this type of substrate. Multiple electrical features, such as copper conductors, copper pillars, or solder balls 2a and / or electronic packages or electronic components 2b (e.g., resistors, capacitors, semiconductor ICs, etc.), can be mounted on the contact surface 1a of the substrate 1, and their bonding can be tested as previously described. The substrate 1 can be of various types, including but not limited to FR4 or ceramic circuit boards, silicon chips, and silicon wafers.
[0022] return Figure 1 and Figure 2The respective portions of two schematic diagrams of the bonding test apparatus 100 and 200 according to this disclosure are explained. Both embodiments 100 and 200 are capable of determining the strength of such a bond or ball 2a and / or component 2b present on the substrate 1. The bonding test apparatus 100 (200) may be of the force measurement system type and is at least constituted by a frame housing 10. The shearing tool component 20 and the shearing height setting unit 30 are both housed within the frame housing 10.
[0023] The shearing tool component 20 includes a shearing tool holder 21 that holds the shearing tool 22. The shearing tool 22 may be permanently mounted in the shearing tool holder 21 or may be of a replaceable type. The shearing tool 22 has an elongated configuration terminating at a free shearing tool tip 22a. For proper operation of either embodiment 100 or 200, the shearing tool component 20 is arranged to apply a shearing force to the joint 2a and / or material component 2b in a direction parallel to the plane defined by the base 1. This direction parallel to the plane defined by the base 1 is indicated by an arrow located below the base 1 and pointing to the left.
[0024] In this specific embodiment, the shearing tool component 20 can be mounted to the frame housing 10 by means of the shearing tool sensor unit 11, wherein the shearing tool holder 21 includes a sensor for sensing or measuring a force applied by the shearing tool 22 to the joint 2a or component 2b in a shearing direction generally parallel to the plane defined by the base 1.
[0025] according to Figure 1 The disclosed content shows that the shearing height setting unit 30 includes a sensor element 31. The sensor element 31 is mounted between the shearing tool sensor unit 11 and the frame housing 10. In various configurations, the sensor element 31 is selected from the group consisting of a capacitive distance sensor element, an optical distance sensor element, or a linear variable displacement transducer element.
[0026] Figure 1 and Figure 2 The two embodiments depicted are constructed to establish the precise position of the tip 22a of the shearing tool 22 relative to the surface 1a of the substrate, and especially relative to the point of engagement 2a or component 2b present on the substrate 1. It is known that the positional alignment accuracy of the shearing tool 22 (the tip 22a) relative to the point of engagement 2a or component 2b present on the substrate 1 is very important.
[0027] Using these two implementations, the precise alignment of the tip 22a of the shearing tool 22 relative to the surface 1a can be established, also known as the "shearing height". Viewed in the z-direction orthogonal to the substrate surface, the "shearing height" is the distance between the tip 22a of the shearing tool 22 and the surface 1a of the adjacent tested joint 2a or material component 2b of the substrate 1. Figure 1 and Figure 2 In this context, "shear height" is represented by 'x'. Setting the height alignment 'x' precisely and maintaining that alignment during the shear test is important for performing accurate joint tests.
[0028] Here, under the first operating conditions of the engagement test equipment 100 (or 200), the complete unit, namely the frame housing 10 including the shearing tool component 20, the shearing tool sensor unit 11, and the shearing height setting unit 30, can be displaced in a direction orthogonal to the plane defined by the base 1 (contact surface 1a) by means of a displacement unit (not depicted). The direction orthogonal to the plane is indicated by a vertically oriented double arrow on the left side of the frame housing 10 of both embodiments 100 and 200.
[0029] Using sensor element 31, the moment when the cutting tool component 20, and especially the tip 22a of the cutting tool 22, 'touches' the substrate surface 1a can be precisely determined. Under the first operating condition of moving the cutting tool component 20 (and the frame housing 10) toward the substrate 1 in the z-direction, the tip 22a of the cutting tool 22 touches the substrate surface 1a, while simultaneously sensing the distance difference between the cutting tool sensor unit 11 and sensor element 31. Once "touching" is sensed, the displacement in the z-direction orthogonal to the substrate stops, and the "touching" of the tip 22a to the surface 1a sets a reference position. This reference position is used to set the desired shearing height 'x' under the second operating condition of the bonding test device 100, i.e., the desired height of the tip 22a relative to the substrate surface 1a for performing a shearing test on the bonding 2a or component 2b.
[0030] Here, the shear height setting unit 30 includes a height actuator unit, the first embodiment of which is as follows: Figure 1 As depicted and indicated by reference numeral 32 in the accompanying drawings. Viewed in a direction orthogonal to the plane formed by the base 1, Figure 1 The height actuator unit 32 is mounted between the shear tool sensor unit 11 and the frame housing 10. Under the second operating condition of the engagement test equipment 100, the height actuator unit is arranged to move the shear tool component 20 relative to the frame housing 10 in a direction away from the base 1, and thus in a direction opposite to the z-direction of the 'grounding' movement of the shear tool component 20 under the first operating condition.
[0031] Under the second operating condition, the frame housing 10, which had previously displaced along with the shearing tool component 20 in the z-direction toward the base 1 under the first operating condition, is set in a fixed position relative to the base 1. Only the shearing tool component 20 moves relative to the frame housing 10 in a direction away from the base 1, and therefore in a direction opposite to the z-direction of the 'grounding' movement. Therefore, a limited amount of the mass of the shearing tool component 20 is displaced, and because all these movements are performed locally, very high precision can be achieved. Since only a limited amount of the mass of the shearing tool component 20 and the shearing tool tip 21 is displaced, the engagement test device 100 can be operated with very high precision and can achieve shearing height settings in the sub-micron range.
[0032] Since the height actuator unit 30 only needs to displace the shearing tool component 20 relative to the frame housing 10 in a direction away from the base 1, the overall mass displacement is finite and involves a limited number of parts. Therefore, when performing a shear test, the structure can have very high stiffness in the shear direction, thereby ensuring improved accuracy of the shear height setting, especially in the sub-micron range.
[0033] In particular, the height actuator unit 30 may include a piezoelectric actuator element 32 and an electromagnet connection (or clamping) unit 33. Under the second operating condition, the electromagnet connection (or clamping) unit 33 is used to mechanically connect or clamp the piezoelectric actuator element 32 to the shearing tool component 20, and more specifically to mechanically connect or clamp the piezoelectric actuator element 32 to the shearing tool sensor unit 11.
[0034] The piezoelectric actuator element 32 is mechanically connected or clamped to the shearing tool component 20, and in particular to the shearing tool sensor unit 11, by means of a magnetic clamping force applied between the two parts 32 and 20 / 11. In particular, the shearing tool component 20 includes a contact flange element 34 made of magnetic material. The contact flange element 34 made of magnetic material is permanently mounted to the shearing tool component 20 and is mounted together with the shearing tool sensor unit 11, in particular, by means of its contact surface element 34a.
[0035] Under the first operating condition of the engagement test equipment 100, the contact flange element 34 will just brush past the electromagnet connection unit 33, during which time the electromagnet connection unit 33 is deactivated. Under the second operating condition, the electromagnet connection unit 33 will be activated, and the contact flange element 34, the shearing tool sensor unit 11, and the shearing tool component 20 can be mechanically connected to the electromagnet connection unit 33 and the piezoelectric actuator element 32 by means of the magnetic force generated by the activated electromagnet of the electromagnet connection unit 33.
[0036] This mechanical interconnection due to magnetic force enables the piezoelectric actuator element 32 to precisely displace the shearing tool component 20 and thus the shearing tool 22 in the vertical direction orthogonal to the plane of the substrate 1, and accordingly raise the shearing tool component 20 (and the shearing tool 22) to the desired shearing height 'x'.
[0037] In short, the shearing height setting unit 30 is arranged to determine when the tip 22a of the shearing tool component 20 and the shearing tool 22 contacts the upper surface 1a of the substrate 1 under a first operating condition where the displacement unit displaces the frame housing 10 in the direction toward the substrate 1. The contact position or ground contact height or reference position is set. Under a second operating condition where the displacement unit does not displace the frame housing 10, the electromagnet connection unit 33 of the shearing height setting unit 30 is activated, thereby clamping the shearing tool component 20 with the height actuator unit 32, and the shearing tool component 20 can be displaced relative to the frame housing 10 and in a direction away from the substrate 1 to set the shearing height 'x' of the shearing tool component relative to the contact height or reference position.
[0038] Operation under both the first and second operating conditions is controlled by a control unit 35, which can be housed within the frame housing 10 or mounted externally outside the housing 10. The control unit 35 operates a displacement unit to displace the frame housing 10 toward and away from the base 1, receives signals generated by sensor element 31 to determine and establish a "grounding" reference position, generates signals to activate and deactivate the electromagnet clamping unit 33, and controls a height actuator unit 32 to raise the shearing tool component 20 and the shearing tool 22 to the desired shearing height 'x'.
[0039] Therefore, compared to existing joint test structures, the shear height 'x' can be set in a much more precise manner. Figure 1 In the illustrated embodiment, only the shearing tool component 20 is displaced relative to the frame housing 10 and the base 1 to set the shearing height 'x'. Therefore, the displacement is a finite amount of mass, and because all these movements are performed locally, very high precision can be achieved. Due to the finite mass displacement and localized movement, according to Figure 1 The bonding test apparatus of the embodiment can be operated with great precision and is capable of setting the shear height in the submicron range.
[0040] exist Figure 2 Another second embodiment of the bonding test apparatus 200 is described herein. This is based on the functionality and operation of the first and second operating conditions. Figure 1 The first embodiment described therein is very similar.
[0041] Similarly, under the first operating conditions of the engagement test equipment 200, the complete unit, namely the frame housing 10 including the shearing tool component 20, the shearing tool sensor unit 11, and the shearing height setting unit 30, can be displaced in a direction orthogonal to the plane defined by the base 1 (contact surface 1a) by means of a displacement unit (not depicted). The direction orthogonal to this plane is indicated by a vertically oriented double arrow on the left side of the frame housing 10.
[0042] The sensor element 31 is capable of accurately determining the moment when the cutting tool component 20, and especially the tip 22a of the cutting tool 22, touches the substrate surface 1a. Under the first operating condition of moving the cutting tool component 20 (and the frame housing 10) toward the substrate 1, the tip 22a of the cutting tool 22 touches the substrate surface 1a, and at the same time, the distance difference between the cutting tool sensor unit 11 and the sensor element 31 is sensed.
[0043] Once "ground contact" is sensed, the displacement in the z-direction orthogonal to the substrate stops and the "ground contact" setting of the front end 22a to the surface 1a sets a reference position. This reference position is used to set the desired shear height 'x' under the second operating conditions of the bonding test equipment 200, that is, the desired height of the front end 22a relative to the substrate surface 1a for performing a shear test on the bonding 2a or component 2b.
[0044] In this second embodiment, the shearing height setting unit 30 includes a height actuator unit indicated by reference numeral 44. In a direction orthogonal to the plane formed by the substrate 1, the second embodiment of the height actuator unit 44 is mounted between the shearing tool sensor unit 11 and the frame housing 10. Under the second operating conditions of the engagement test device 200, the height actuator unit 44 is arranged to move the shearing tool component 20 relative to the frame housing 10 in a direction away from the substrate 1, and therefore in a direction opposite to the direction of "grounding" movement of the shearing tool component 20 under the first operating conditions.
[0045] According to the second embodiment, the height actuator unit 44 includes a motor, preferably but not limited to a voice coil actuator element 44. This embodiment of the height actuator unit 44 is capable of operating in conjunction with... Figure 1 The first embodiment precisely moves the shearing tool component 20 up and down in a similar manner to raise it to the desired shearing height 'x'.
[0046] In both the first and second embodiments, the control unit 35 is housed in the frame housing 10 and is used to operate a displacement unit for displacing the frame housing 10 toward and away from the base 1, receive signals generated by the sensor element 31 to determine and establish a "grounding" reference position, generate signals for activating and deactivating the electromagnet clamping unit 33, and control height actuator units 32 / 44 for raising the shearing tool component 20 and the shearing tool 22 to the desired shearing height 'x'.
[0047] In both embodiments 100 and 200, under the second operating condition, the frame housing 10, which had previously been displaced toward the base 1 in the z-direction along with the shearing tool component 20 under the first operating condition, is set in a fixed position relative to the base 1. Using the height actuator unit 32 or 44 of the first or second embodiment, the shearing tool component 20 moves relative to the frame housing 10 in a direction away from the base 1, and therefore in a direction opposite to the z-direction of the 'grounding' movement.
[0048] A finite amount of displacement occurs in the mass of the shearing tool component 20, and because all these movements are performed locally, very high precision can be achieved. Since only a finite amount of displacement occurs in the mass of the shearing tool component 20 and the shearing tool tip 22a, the engagement test devices 100 and 200 can be operated with great precision and can achieve shearing height settings in the sub-micron range.
[0049] Therefore, compared to existing joint test structures, the shear height 'x' can be set more precisely. Figure 1 and Figure 2 In the depicted embodiment, only the shearing tool component 20 is displaced relative to the frame housing 10 and the base 1 to set the shearing height 'x'. Therefore, the displacement is a finite amount of mass, and because all these movements are performed locally, very high precision can be achieved. Due to the finite mass displacement and localized movement, the bonding test apparatus according to this embodiment can be operated with great precision and is capable of setting the shearing height in the sub-micron range.
[0050] In particular, the control unit 35 of the device 100 is arranged to apply a reduced alternating current to the subsequently deactivated electromagnet connection unit 33 under the first operating condition to reduce the residual magnetism present in the electromagnet connection unit 33 to a desired amount. Any residual magnetism will generate a small attractive force on the contact flange element 34 made of (ferro)magnetic material, thereby creating some unwanted friction between the shearing tool component 20 (shearing tool sensor unit 11) and the height actuator unit 30. The residual magnetic force can help ensure that the contact flange element 34 remains in contact with the electromagnet connection unit 33, but with a controlled amount of contact friction.
[0051] List of reference numerals
[0052] 1. Base
[0053] 1a Contact surface of the substrate
[0054] 2a Electrical joint or solder ball
[0055] 2b Electronic components
[0056] x Shear height
[0057] First embodiment of 100 bonding test equipment
[0058] Second embodiment of the 200 bonding test equipment
[0059] 10. Frame shell
[0060] 11. Shearing tool sensor unit
[0061] 12 Shearing tool sensor
[0062] 20 Cutting tool components
[0063] 21 Cutting Tool Holder
[0064] 22. Cutting Tool
[0065] 22a Cutting tool tip
[0066] 30 Shearing height setting unit
[0067] 31 Sensor Components
[0068] 32. First embodiment of the height actuator unit
[0069] 33 Electromagnetic clamping unit
[0070] 34 Contact elements
[0071] 34a Contact surface element
[0072] 35 Control Unit
[0073] 44. A second embodiment of the height actuator unit.
Claims
1. An apparatus for determining the strength of a bond and / or material present on a substrate, said apparatus comprising at least: Frame shell; A displacement unit for displacing the frame shell in a direction orthogonal to the plane defined by the base; A shearing tool component is housed within the frame housing and arranged to apply a shearing force to the joint and / or the material in a direction parallel to the plane defined by the base; and The shear height setting unit is housed within the frame housing. The shear height setting unit is arranged as follows: - Under the first operating condition that the displacement unit displaces the frame housing in the direction toward the substrate, it is determined when the shearing tool component contacts the substrate, thereby obtaining the contact height, and - Under the second operating condition that the displacement unit does not cause displacement of the frame housing, the shearing tool component is moved relative to the frame housing in a direction away from the base to set the shearing height of the shearing tool component based on the contact height.
2. The device of claim 1, wherein the device further comprises a shearing tool sensor unit, and wherein the shearing height setting unit comprises a sensor element mounted between the shearing tool sensor unit and the frame housing.
3. The device of claim 2, wherein the sensor element is selected from the group consisting of a capacitive distance sensor element, an optical distance sensor element, or a linear variable displacement transducer element.
4. The device according to any one of the preceding claims, wherein the shearing height setting unit further comprises a height actuator unit mounted between the shearing height setting unit and the frame housing, the height actuator unit being arranged to move the shearing tool component relative to the frame housing in a direction away from the substrate under the second operating condition.
5. The device of claim 4, wherein the height actuator unit comprises a piezoelectric actuator element and an electromagnet connection unit, the electromagnet connection unit being arranged for mechanically connecting the piezoelectric actuator element to the shearing tool component under the second operating condition.
6. The device of claim 5, wherein the shearing tool component comprises a contact flange element made of a magnetic material.
7. The device of claim 4, wherein the height actuator unit comprises a voice coil actuator element.
8. The device according to any one of claims 1 to 3, wherein the shear height setting unit further comprises a control unit configured to control the first operating condition and the second operating condition of the displacement unit.