System and method for cleaning an object

Abstract

The present invention relates generally to a system and method for cleaning a surface of an object. More particularly, the present invention relates to a system and method for removing inorganic contaminants from a surface of an object and activating the surface and removing organic contaminants therefrom. The system for cleaning an object includes a first cleaner (120) comprising at least one elastomeric roller (122) rotatably mounted to the first cleaner and having a generally cylindrical outer surface configured to contact a first surface of an object so as to remove inorganic contaminants. The system further includes at least one tacky roller (424, 434) rotatably mounted to the first cleaner and having a generally cylindrical outer surface in contact with a portion of the outer surface of the at least one elastomeric roller. Additionally, the system includes at least one second cleaner (440) configured to operatively receive an object from the first cleaner and comprising an electromagnetic radiation source (342) adapted to selectively emit electromagnetic radiation having a wavelength in the range of 10 nm to 280 nm to irradiate at least a first surface of the object so as to activate at least the first surface and decontaminate organic contaminants therefrom.

Description

[0001] Related applications

[0002] This application claims the benefit of UK (GB) patent application serial number 2019613.5, entitled "SYSTEM AND METHOD FOR CLEANING AN OBJECT", filed on 11 December 2020, and UK (GB) patent application serial number 2116286.2, entitled "SYSTEM AND METHOD FOR CLEANING AN OBJECT", filed on 12 November 2021. The entire contents of UK patent application serial number 2019613.5 and UK patent application serial number 2116286.2 are expressly incorporated herein by reference. Technical Field

[0003] This invention generally relates to a system and method for cleaning the surface of an object. More particularly, this invention relates to a system and method for removing inorganic contaminants from the surface of an object and then activating the surface and removing organic matter from it. Background Technology

[0004] introduction

[0005] In manufacturing, many components require cleaning before assembly for various reasons. For example, liquid crystal display (LCD) panels used in televisions, monitors, tablets, telephones, etc., require optical polarizing films. These films must be thoroughly cleaned to prevent contaminants from degrading or impairing the image quality of the entire LCD panel. These films are typically provided as a continuous substrate or roll on rollers. Alternatively, discrete substrates or objects can be provided on a conveyor system.

[0006] Systems exist capable of cleaning one or both surfaces of a substrate by removing inorganic and other contaminants down to the micrometer scale. However, such systems cannot remove contaminants down to the nanometer scale (such as oligomers), which are not particles themselves but rather aggregates of organic chemicals. Sources of organic contamination may include oil or fingerprints.

[0007] Some known methods for cleaning or removing organic contaminants utilize solvents to dissolve the contaminants or physically remove them. Other known cleaning methods employ plasma cleaners to eliminate these organic contaminants. Here, the plasma cleaner generates plasma by ionizing air and forces it through the substrate surface, effectively causing oligomers or other organic contaminants to evaporate or detach.

[0008] At least one drawback of known solutions in the prior art is that these processes have the potential to damage the substrate because they are difficult to control. For example, solvents used to remove contaminants may degrade some substrates upon contact. Additionally, plasma treatment requires the use of relatively high-power plasma to clean organic contaminants.

[0009] Because it requires operation in a controlled environment and electrical control and guidance of the plasma, plasma systems also require expensive equipment. Therefore, this treatment can only clean a narrow area on the substrate surface as it passes through the plasma.

[0010] Moreover, substrates cleaned using plasma still require further processing steps to ensure compatibility with further manufacturing processes.

[0011] Furthermore, when cleaning substrates, especially films or films with specialized coatings, currently known methods may damage or inhibit the cleaning of the substrate surface. Substrate surfaces damaged or inhibited by aggressive cleaning will ultimately hinder any subsequent manufacturing steps and may even lead to defective products. Similarly, substrate surfaces that have undergone insufficient cleaning may suffer the same drawbacks. Therefore, cleaning certain substrates may be impractical because existing systems and technologies cannot remove organic contaminants without degradation.

[0012] Therefore, an object of the present invention is to provide a simple, low-cost cleaning system and method that does not suffer from at least some of the aforementioned drawbacks. A further object of the present invention is to provide a cleaning system and method that is easy to control, and in particular, provides a cleaning method that can be easily adjusted for the substrate being cleaned. A further object of the present invention is to provide a cleaning system and method for sensitive or fragile substrates. In this way, the systems and methods of the present invention can provide effective cleaning without inhibiting, damaging, or harming the membrane or its surface.

[0013] A further object of the present invention is to provide an integrated system capable of removing both organic and inorganic contaminants from the surface of an object and activating the surface for immediate use in further manufacturing steps. Summary of the Invention

[0014] According to a first aspect of the present invention, a system for cleaning objects is provided, the system comprising:

[0015] A first cleaner, comprising:

[0016] At least one elastic roller is rotatably mounted to the first cleaner and has a generally cylindrical outer surface configured to contact a first surface of an object in order to remove inorganic contaminants;

[0017] At least one adhesive roller, which is rotatably mounted to the first cleaner and has a generally cylindrical outer surface that contacts a portion of the outer surface of the at least one elastic roller;

[0018] At least one second cleaner is configured to operatively receive an object from the first cleaner. The at least one second cleaner includes an electromagnetic radiation source adapted to selectively emit electromagnetic radiation having a wavelength in the range of 10 nm to 280 nm to irradiate at least a first surface of the object, thereby activating at least the first surface and purifying organic contaminants from the first surface. Preferably, the electromagnetic radiation source may be adapted to selectively emit electromagnetic radiation having a wavelength in the range of 100 nm to 280 nm. Even more preferably, the electromagnetic radiation source may be adapted to selectively emit electromagnetic radiation having a wavelength in the range of 170 nm to 180 nm.

[0019] Suitable, the first cleaner may include a first support member through which an object passes between the at least one elastic roller and the first support member, such that the first support member contacts the opposite second surface of the object.

[0020] Suitable, the first support member may be at least one processing roller.

[0021] Suitablely, the at least one elastic roller may be a first elastic roller, and the first support may include a rotatable second elastic roller configured to remove inorganic contaminants from a second surface of the object.

[0022] Suitable, the system may further include a second rotatable adhesive roller that contacts and engages with the second elastic roller.

[0023] Appropriately, the at least one second cleaner may be operatively adjacent to the first cleaner.

[0024] Appropriately, the at least one second cleaner can be configured to directly receive objects from the first cleaner.

[0025] Suitable, the at least one second cleaner may further include a housing configured to shield the electromagnetic radiation source and reflect back any electromagnetic radiation emitted from the electromagnetic radiation source toward at least a first surface of the object.

[0026] Appropriately, the electromagnetic radiation source may include at least one transmitter.

[0027] Suitablely, the at least one emitter may be a UVC light-emitting diode.

[0028] Suitable, the at least one second cleaner may include a main second cleaner and at least one auxiliary second cleaner, the at least one auxiliary second cleaner being arranged operatively adjacent to the main second cleaner and configured to receive objects from the main second cleaner.

[0029] According to a second aspect of the present invention, a method is provided, the method comprising the following steps:

[0030] An object is received in a first cleaner, the first cleaner including at least one elastic roller rotatably mounted to the first cleaner and having a generally cylindrical outer surface configured to contact a first surface of the object in order to remove inorganic contaminants;

[0031] The first surface of the object is brought into contact with the at least one elastic roller in order to remove inorganic contaminants from at least the first surface of the object;

[0032] The object is transferred from the first cleaner to the second cleaner, which is configured to operatively receive the object from the first cleaner and includes an electromagnetic radiation source;

[0033] Electromagnetic radiation having wavelengths in the range of 100 nm to 280 nm is emitted from an electromagnetic radiation source onto at least a first surface of an object.

[0034] Suitable, the method may further include the step of contacting the opposite second surface of the object with a second elastic roller in order to remove inorganic contaminants from the opposite second surface.

[0035] Where appropriate, the method may further include the following steps:

[0036] Transferring an object from the main second cleaner to an auxiliary second cleaner, the auxiliary second cleaner being operatively adjacent to the main second cleaner and including another electromagnetic radiation source; and

[0037] Electromagnetic radiation having wavelengths in the range of 100 nm to 280 nm is emitted from the other electromagnetic radiation source onto the first and / or second surfaces of the object.

[0038] Suitable, the method may include the electromagnetic radiation source of the primary second cleaner or the auxiliary second cleaner being adapted to selectively emit electromagnetic radiation having wavelengths in the range of 170 nm to 180 nm.

[0039] Some embodiments offer the advantage of using the system to clean organic contaminants in a controlled manner. In this way, the EM radiation provided by the EM radiation source can be easily operated and adjusted by modifying the power or wavelength of the EM radiation source. Therefore, organic contaminants can be broken down into smaller molecules that can volatilize from the surface using only just the right amount of power to clean the surface.

[0040] Some embodiments offer the advantage that the EM radiation source can be adjusted according to one or more specific organic contaminants. Other embodiments offer the advantage that the EM radiation source can be adapted to provide specific activation to a substrate surface. Therefore, one or more wavelengths of EM radiation can be selected based on the organic contaminants on the surface. Additionally or alternatively, certain wavelengths of light can be intentionally excluded or filtered out. In this way, the organic cleaner can be adapted to avoid the sensitivity of certain materials or coatings to specific types of light.

[0041] Some embodiments offer the advantage that the membrane surface can be activated. In other words, the EM radiation of the cleaner both purifies organic contaminants and additionally treats or conditions the substrate. In this way, the substrate or surface can be easily modified, for example, to readily accept another coating or substrate. Furthermore, the activation of the surface can be adjusted to condition the substrate or surface during subsequent manufacturing steps to react with a specific coating or treatment.

[0042] Some embodiments offer the advantage that the cleaner can irradiate a large surface area of ​​an object with EM radiation over a certain angle of incidence. In this way, the substrate surface can be irradiated more effectively to provide activation and purification of organic contaminants.

[0043] Some embodiments offer the advantage that the substrate surface can be irradiated using one or more specific wavelengths of EM radiation. In this way, the EM radiation projected onto the surface can target different organic contaminants.

[0044] Some embodiments offer the advantage that cleaning can be provided in multiple or repeated stages at a relatively low cost. In this way, the cleaning system can include multiple cleaning or activation steps. That is, the cleaning system is no longer limited to a single processing step due to the cost and size limitations of implementing such equipment.

[0045] Some embodiments offer the advantage that inorganic and organic cleaning and purification of the surface can be performed without the risk of contamination between processing steps. Additionally, the surface is activated, allowing the substrate surface to be used directly for further manufacturing steps without additional processing or treatment.

[0046] Some embodiments limit or control the EM radiation projected from the EM radiation source. In this way, contaminants can be easily and safely removed from the surface without posing a risk of exposure to the operator. Attached Figure Description

[0047] Embodiments of the invention will now be described below by way of example with reference to the accompanying drawings, in which:

[0048] Figure 1 A schematic view of a first example cleaning system according to one aspect of the present invention is shown;

[0049] Figure 2 It shows Figure 1 A schematic view of an example, further including an auxiliary second cleaner for cleaning the surface of the first substrate;

[0050] Figure 3 It shows Figure 1 A schematic view of an example, further including a housing for a second cleaner;

[0051] Figure 4 It shows Figure 1 A schematic view of an example, which further includes a second inorganic cleaner;

[0052] Figure 5 It shows Figure 1 A schematic view of an example, which further includes an auxiliary cleaner for cleaning the surface of a second substrate;

[0053] Figure 6 A schematic view of another example cleaning system adapted for cleaning discrete objects according to one aspect of the invention is shown, and

[0054] Figure 7 An example method according to one aspect of the invention is shown.

[0055] In the accompanying drawings, similar reference numerals indicate similar parts. Detailed Implementation

[0056] Certain terms used in the following specification are for convenience only and not for limitation. Furthermore, as used herein, the terms “receiving,” “transmitting,” and “installing” are intended to include direct connections or relationships between two components without any other components in between, and indirect connections between components in which one or more other components are in between. Terms include those specifically mentioned above, their derivatives, and words with similar meanings.

[0057] Furthermore, unless otherwise stated, the use of ordinal adjectives such as “first,” “second,” “third,” “primary,” and “auxiliary” merely indicates different instances of similar objects referred to, and is not intended to imply that the objects described must be in a given order in time, space, sequence, or any other way.

[0058] Now for reference Figure 1 A cleaning system 100 for cleaning an object 110 according to a first aspect of the present invention is shown. Figure 1 In the example, object 110 is a continuous sheet substrate 110. Cleaning system 100 includes a first cleaner 120 comprising an elastic roller 122 rotatably mounted to the first cleaner and having a generally cylindrical outer surface (referred to as cleaning surface 123) configured to contact the first surface 112 of the object or sheet substrate 110 to remove inorganic contaminants. Cleaning system 100 also includes a second cleaner 140 configured to receive the sheet substrate 110 from the first cleaner 120 and including an electromagnetic radiation (EMR) source 142 adapted to selectively emit electromagnetic radiation 144 having wavelengths in the range of 10 nm (nm = nanometer) to 280 nm to irradiate the first surface 112 of the sheet substrate 110. Irradiation of the first surface 112 with electromagnetic radiation 144 activates the first surface 112 and purifies organic contaminants from the first surface.

[0059] The cleaning system 100 has an adhesive roller 124 rotatably mounted to a first cleaner 120. The adhesive roller 124 has a generally cylindrical outer surface (referred to as an adhesive surface 125) arranged such that a portion of the adhesive surface 125 of the adhesive roller 124 contacts a portion of the cleaning surface 123 of the elastic roller 122. As the elastic roller 122 and the adhesive roller 124 rotate relative to each other, the adhesive surface 125 is adapted to remove accumulated inorganic contaminants from the cleaning surface 123. In this way, the adhesive surface 125 continuously refreshes the cleaning surface 123 to achieve optimal cleaning of the sheet substrate 110.

[0060] Furthermore, a processing roller 126 is mounted in the cleaning system 100. The processing roller 126 has a generally cylindrical outer surface (referred to as a support surface) that is arranged such that when the sheet substrate 110 is received by the first cleaner 120, the outer surface contacts a second surface 114 of the sheet substrate. That is, when the sheet substrate 110 engages with the elastic roller 122, the processing roller 126 supports the sheet substrate.

[0061] The processing roller 126 and the elastic roller 122 are arranged opposite each other with a gap or roll gap therebetween. Thus, the processing roller 126 and the elastic roller 122 are arranged such that when the sheet substrate 110 is received by the first cleaner 120, the processing roller and the elastic roller respectively engage the opposite portions of the first surface 112 and the second surface 114 of the sheet substrate.

[0062] The second cleaning system 140 includes an EMR source 142 adapted to irradiate the sheet substrate 110 after it has been cleaned by the first cleaner 120. The emitted electromagnetic radiation 144 irradiates a portion of the first surface 112. That is, the emitted electromagnetic radiation 144 irradiates an area of ​​the first surface 112 as the sheet substrate 110 is conveyed within the second cleaner 140.

[0063] EMR source 142 is configured to emit electromagnetic radiation 144 having a wavelength in the range of 10 nm to 280 nm. That is, EMR source 142 is configured to emit UV-C light. Optionally, EMR source 142 is configured to emit electromagnetic radiation 144 having a wavelength in the range of 100 nm to 280 nm. More preferably and more preferably, EMR source 142 is configured to emit electromagnetic radiation 144 having a wavelength in the range of 170 nm to 180 nm.

[0064] The emitted electromagnetic radiation 144 thus irradiates any organic contaminants on the first surface 112, causing the organic contaminants to decompose. Once decomposed, the organic contaminants readily evaporate or volatilize from the first surface 112, thereby purifying the first surface 112.

[0065] The electromagnetic radiation 144 emitted by the EMR source 142 is also suitable for activating (and simultaneously purifying) the first surface 112 of the sheet substrate 110. As used herein, “activation” means producing one or more effects on the first surface, including, for example, (i) providing ionization of the substrate 110, (ii) providing an electrostatic surface for the substrate 110, or (iii) providing chemical modification of the components of the substrate 110. In this way, the substrate 110 is modified to prepare it for subsequent processing.

[0066] The EMR source 142 of the second cleaner 140 can be actuated and regulated (i.e., controlled) by a controller (not shown). The controller can be configured to selectively activate the EMR source 142. Here, selective activation can be in response to one or more sensors, such as those adapted to detect the presence of the sheet substrate 110 within the second cleaner 140 (e.g., at a predetermined location). However, those skilled in the art will understand that selective activation of the EMR source 142 can be in response to any other suitable sensor input (measuring predetermined parameters), as can selective deactivation of the EMR source 142.

[0067] The controller can be further configured to modulate the characteristics of the electromagnetic radiation 144 emitted by the EMR source 142. For example, the controller can be configured to selectively modulate any one of the wavelength, wavelength range, and power output of the emitted electromagnetic radiation 144. In this way, the electromagnetic radiation 144 can be “tuned” for the sheet substrate 110 undergoing the cleaning process. Therefore, the electromagnetic radiation 144 can be optimized for organic contaminants on the sheet substrate 110 (i.e., to maximize efficiency). Additionally or alternatively, the electromagnetic radiation 144 can be optimized for the composition of the sheet substrate 110 to prevent damage or degradation of sensitive substrates and films or to provide a specific type of activation to the surface.

[0068] In use, the cleaning device 100 is configured to be in the presence of... Figure 1 The sheet substrate 110 is conveyed in the direction indicated by the arrow. The sheet substrate 110 is conveyed by one or more known drive devices, such as a conveyor belt or multiple driven processing rollers (not shown) appropriately positioned before, within and / or after the cleaning device 100.

[0069] Additionally, the sheet substrate 110 can be conveyed by rotating the elastic roller 122 and the processing roller 126. The elastic roller 122 can be driven by using a direct drive system, or it can be driven by rotational engagement with a driven viscous roller.

[0070] The sheet substrate 110 is received by the first cleaner 120, such that the sheet substrate engages with the gap between the elastic roller 122 and the processing roller 126. Specifically, the first surface 112 of the sheet substrate 110 contacts the cleaning surface 123 of the elastic roller 122, and the second surface 114 contacts the support surface of the processing roller 126. Because the cleaning surface 123 tends to collect inorganic contaminants, these contaminants are removed from the first surface 112 as the sheet substrate 110 is conveyed between the rollers.

[0071] like Figure 1 As shown, the second cleaner 140 is positioned "downstream" (i.e., adjacent to) the first cleaner 120. The second cleaner 140 receives the substrate 110 directly from the first cleaner 120. In this manner, when the sheet substrate 110 is dispensed from the first cleaner 120, it is conveyed to the second cleaner 140 without intermediate exposure, which would otherwise pose a risk of contamination. Therefore, the second cleaner 140 is effectively arranged operatively adjacent to the first cleaner 120.

[0072] When the sheet substrate 110 is conveyed through the second cleaner 140, the sheet substrate is irradiated by electromagnetic radiation 144, thereby activating the first surface 112 and removing the organic detergent, as previously explained.

[0073] Now for reference Figure 2 This illustrates a second example embodiment of the cleaning system 200. While the features are the same as in the previous example, the reference numerals also remain consistent with the previous example, but begin with "2". Figure 2 In the example shown, the object is a continuous sheet-like substrate 210.

[0074] further, Figure 2 A simplified schematic diagram of a cleaning system 200 including a first cleaner 220 and a second cleaner 240 is shown. The first cleaner 220 and its features are... Figure 1 The first cleaner 120 of the example embodiment shown is substantially the same, so for the sake of brevity, the details will not be repeated here.

[0075] Figure 2 The example second cleaner 240 has a first electromagnetic source (EMR) 242, which is arranged in series with a second EMR source 252. Each of the first EMR source 242 and the second EMR source 252 is substantially connected to... Figure 1 The example shown uses the same EMR source 142. Within the scope of the variations described herein, the first EMR source 242 can be provided with a different configuration than the second EMR source 252.

[0076] In use, the first EMR source 242 and the second EMR source 252 are configured to irradiate the first surface 212 of the sheet substrate 210 with first electromagnetic radiation 244 and second electromagnetic radiation 254, respectively. In this way, the first surface 212 is activated and purified of organic contaminants twice in succession. Therefore, the two successive EMR sources 242, 252 irradiate the first surface 212 with relatively low power, but still ensure more efficient treatment than that achieved by using only a single EMR source (e.g., 142), whose total power output is equivalent to the sum of the two successive EMR sources 242, 252.

[0077] Now for reference Figure 3 This illustrates a third example embodiment of the cleaning system 300. While the features are the same as in the previous example, the reference numerals also remain the same, but begin with "3". Figure 3 In the example shown, the object is a continuous sheet-like substrate 310.

[0078] further, Figure 3A simplified schematic illustration of a cleaning system 300 including a first cleaner 320 and a second cleaner 340 is shown, wherein the second cleaner 340 includes a housing 370 configured to shield an electromagnetic radiation source 342 and adapted to reflect back electromagnetic radiation 344 emitted from the EMR source 342 toward a first surface 312 of a sheet substrate 310.

[0079] The housing 370 is provided with an inlet and an outlet (not shown in detail) so that, in use, the sheet substrate 310 can be conveyed through the second cleaner 340. The second cleaner 340 is positioned "downstream" (i.e., immediately adjacent to) the first cleaner 320, such that the sheet substrate 310 is received directly from the first cleaner 320 through the inlet. After being irradiated by electromagnetic radiation 344, the sheet substrate 310 is dispensed from the outlet.

[0080] As previously mentioned, housing 370 is adapted to reflect electromagnetic radiation 344 emitted from EMR source 342. That is, electromagnetic radiation 344 that does not directly irradiate the first surface 312, for example due to scattering from EMR source 342 or reflection from any surface such as the first surface 312, is thus reflected back to the first surface 312. In this way, during operation of the second cleaner 340, substantially all electromagnetic radiation 344 (not considering any possible leakage or absorption) remains within housing 370 (and is ultimately reflected back to the first surface 312), thereby ensuring operator safety from electromagnetic radiation and improving the efficiency of the second cleaner 340.

[0081] Now for reference Figure 4 This illustrates a fourth example embodiment of the cleaning system 400. While the features are the same as in the previous example, the reference numerals also remain the same, but begin with "4". Figure 4 In the example, the object is a continuous sheet-like substrate 410.

[0082] further, Figure 4 A simplified schematic diagram of a cleaning system 400 including a first cleaner 420 and a second cleaner 440 is shown. The first cleaner 420 includes a first elastic roller 422 and a second elastic roller 432. The first elastic roller is mounted to contact a first surface 412 of a sheet substrate 410 and remove inorganic contaminants from the first surface. The second elastic roller is mounted to contact a second surface 414 of the sheet substrate 410 and remove inorganic contaminants from the second surface.

[0083] Second cleaner 440 and its features Figure 1 The second cleaner 140 shown in the example embodiment is essentially the same, so for the sake of brevity, the details will not be repeated here.

[0084] The first cleaner 420 includes a first elastic roller 422, which is mounted to engage with... Figure 1 The elastic roller 122 of the example embodiment shown contacts the first surface 412 of the sheet substrate 410 in the same manner and removes inorganic contaminants from the first surface. Therefore, in use, the cleaning surface 423 of the first elastic roller 422 is operable to remove inorganic contaminants from the first surface 412, and the cleaning surface 423 is refreshed by removing accumulated inorganic contaminants due to engagement with the adhesive surface 425 of the first adhesive roller 424.

[0085] The first cleaner 420 also includes a second elastic roller 432 mounted to contact and remove inorganic contaminants from a second surface 414 of the sheet substrate 410. A second adhesive roller 434 is rotatably mounted near the second elastic roller 432. The second adhesive roller 434 includes an outer adhesive surface configured and arranged to operate in substantially the same manner as the corresponding adhesive surface 425 of the first adhesive roller 424. Thus, by engaging with the adhesive surface of the second adhesive roller 434, the cleaning surface of the second elastic roller 432 is refreshed by removing accumulated inorganic contaminants.

[0086] The first elastic roller 422 and the second elastic roller 432 are arranged opposite each other with a gap or roll gap therebetween. That is, the first elastic roller 422 and the second elastic roller 432 are arranged such that when the sheet substrate 410 is received by the first cleaner 420, the first elastic roller and the second elastic roller respectively engage the opposite portions of the first surface 412 and the second surface 414 of the sheet substrate.

[0087] In use, the cleaning system 400 is suitable for use with... Figure 1 The sheet substrate 410 is processed in the same direction and manner as described in the example embodiment shown. The first surface 412 and the second surface 414 are cleaned of inorganic contaminants by the first elastic roller 422 and the second elastic roller 432 of the first cleaner 420. The sheet substrate 410 is then conveyed to and directly received by the second cleaner 440. The EMR source 442 of the second cleaner 440 irradiates the first surface 412 to activate it and purify organic contaminants from it.

[0088] Now for reference Figure 5 The diagram illustrates a cleaning system 500 according to a fifth exemplary embodiment of the present invention. While the features are the same as in the previous example, the reference numerals also remain the same, but begin with "5". Figure 5 In the example, the object is a continuous sheet-like substrate 510.

[0089] further, Figure 5A simplified schematic diagram of a cleaning system 500 is shown, comprising a primary first cleaner 520 and a primary second cleaner 540, and an auxiliary second cleaner 550. The auxiliary second cleaner 550 includes another EMR source 552 adapted to irradiate a second surface 514 of a sheet substrate 510 to activate the second surface 514 and purify organic contaminants from it.

[0090] The first main cleaner 520 and the second main cleaner 540 and their respective features are arranged and configured to work with Figure 1 The first cleaner 120 and the second cleaner 140 shown in the example embodiments are substantially the same, so details will not be repeated here.

[0091] In addition to the EMR source 552 irradiating the second surface 514 of the sheet substrate 510, the auxiliary second cleaner 550 and its features are arranged and configured to be substantially the same as the main second cleaner 540.

[0092] In use, the first surface 512 is cleaned of inorganic contaminants by the main first elastic roller 522 of the first cleaner 520. Then, the sheet substrate 510 is conveyed to the main second cleaner 540 and directly received by it. The EMR source 542 of the main second cleaner 540 irradiates the first surface 512 to activate the first surface and purify organic contaminants from it.

[0093] Subsequently, the sheet substrate 510 is conveyed to and directly received by the auxiliary second cleaner 550. The EMR source 552 of the auxiliary second cleaner 550 irradiates the second surface 514 to activate the second surface and purify organic contaminants from it.

[0094] Optionally, the cleaning system 500 may include an auxiliary first cleaner 530 to remove inorganic contaminants from the second surface 514. The cleaning system 500 can therefore be arranged in a variety of suitable configurations. For example, the auxiliary first cleaner 530 may be positioned "downstream" of both the first main cleaner 520 and the second main cleaner 540. In this way, the second surface 514 is operably cleaned after the first surface 512.

[0095] Alternatively, the auxiliary first cleaner 530' can be described above regarding... Figure 4 The example described is arranged opposite to the main first cleaner 520. In such a way that inorganic contaminants are removed from both the first surface 512 and the second surface 514 before irradiation of the first surface 512 and the second surface 514. That is, all inorganic contaminants are removed from the sheet substrate 510 before activating the surfaces 512 and 514 of the sheet substrate 510 and purifying the organic contaminants thereon.

[0096] The auxiliary second cleaner 550 can be arranged opposite the main second cleaner 540. In this way, during use, the first surface 512 and the second surface 514 are operably irradiated simultaneously. Alternatively, the auxiliary second cleaner 550 can be arranged "downstream" of the main second cleaner 540. In this way, during use, the first surface 512 is operably irradiated before the second surface 514. Each of the main EMR source 542 and the auxiliary EMR source 552 is associated with... Figure 1 The example embodiments shown are essentially the same. Within the scope of the variations described herein, the first source 542 can be provided with a different configuration than the second source 552.

[0097] Now for reference Figure 6 This illustrates a sixth example embodiment of the cleaning system 600. While the features are the same as in the previous example, the reference numerals also remain the same, but begin with "6". Figure 6 In the example, the object is a discrete object.

[0098] further, Figure 6 A simplified schematic diagram of a cleaning system 600 is shown, comprising a first cleaner 620 and a second cleaner 640, each cleaner being adapted to clean discrete objects.

[0099] The first cleaner 620 and the second cleaner 640, and their corresponding features Figure 1 The first cleaner 120 and the second cleaner 140 shown in the example embodiments are substantially the same, so for the sake of brevity, the details will not be repeated here.

[0100] The cleaning system 600 includes a conveyor system adapted to convey objects 615, 615' through the cleaning system 600. The conveyor system includes a belt 660 as a support for the objects 615, 615' within the cleaning system 600. In such a manner, the objects 615, 615' are positioned such that their respective first surfaces 612, 612' face away from the belt 660.

[0101] It is evident that, in use, the conveyor system can support multiple objects within the cleaning system 600, depending on the size of the objects 615, 615' and the spatial capacity of the conveyor system. Multiple objects 615, 615' can be positioned at any given time along the machine direction of belt 660 (see arrow). One or more objects 615, 615' can also be positioned laterally across belt 660 (e.g., parallel to it). Figure 6 The example embodiments shown only illustrate representative first object 615 and second object 615'.

[0102] In use, objects 615, 615' are sequentially conveyed through the cleaning system 600. Within the first cleaner 620, an elastic roller 622 contacts and engages the object (in this case, the first object 615) and removes inorganic contaminants from the first surface 612 of the object in substantially the same manner as described with reference to any of the foregoing example embodiments.

[0103] Subsequently, object 615' is conveyed to a second cleaner 640, where an EMR source 642 irradiates the first surface 612' with electromagnetic radiation 644 in order to activate the first surface and purify organic pollutants from it.

[0104] As previously mentioned, the EMR source 642 of the second cleaner 640 can be actuated and regulated by a controller (not shown). Therefore, in Figure 6 In the example embodiment shown, the controller can be configured to selectively activate the EMR source 642 in response to at least one sensor detecting, for example, the presence of each object 615, 615' as it approaches the second cleaner 640. Once the objects 615, 615' have moved past the second cleaner 640, the EMR source 642 can be selectively deactivated in response to the sensor detecting, for example, the absence of objects 615, 615'. The selective (automatic) activation and deactivation of the EMR source 642 minimizes energy usage, thereby optimizing its efficiency.

[0105] Figure 7 A flowchart illustrating a method 700 for cleaning an object according to a second aspect of the present invention is shown. Method 700 begins by receiving an object 710 in a first cleaner, the first cleaner including at least one elastic roller, which is installed and arranged in substantially the same manner as the exemplary embodiments described herein.

[0106] In the next step 720, the first surface of the object is contact-engaged with at least one elastic roller to remove inorganic contaminants from at least the first surface of the object. In step 730, the object is transferred from the first cleaner to a second cleaner configured to receive the object from the first cleaner and having an EMR source. In the final step 740, the second cleaner emits electromagnetic radiation having wavelengths in the range of 100 nm to 280 nm from the EMR source onto at least the first surface of the object to purify and activate at least the first surface of the object.

[0107] Those skilled in the art will understand that the detailed examples described above are by way of example only and are not intended to be limiting, and various changes and modifications are possible without departing from the scope of the invention as defined by the appended claims. Various modifications to the detailed examples described above are possible; for example, the number, shape, size, arrangement, components, etc., of the elastomeric rollers, cleaning surfaces, adhesive rollers, or adhesive surfaces may vary.

[0108] In relation to Figures 1 to 6 In the described example, the area of ​​the sheet substrate surface irradiated by the radiation source encompasses the entire width of the sheet substrate and its length in the machine direction. Suitably, the EMR source can be adapted to irradiate any suitable area on the first surface. For example, the area can be formed as a line or narrow band on the first surface, or alternatively, it can extend a considerable length in the machine direction. Alternatively, the irradiated area can extend only across a portion of the width of the sheet substrate. In this way, as the sheet substrate is conveyed through the second cleaner, the electromagnetic radiation source can be adapted to activate and purify specific portions of the sheet substrate.

[0109] Furthermore, the EMR source can be configured to emit radiation with a spectrum having wavelengths in the range of 10 nm to 280 nm, as well as radiation of a specific wavelength. Additionally or alternatively, the EMR source may include a filter (optical) configured to selectively transmit electromagnetic radiation of a predetermined wavelength or wavelength(s) range emitted from the EMR source.

[0110] The wavelength or wavelength range of the emitted electromagnetic radiation can be "tuned" for specific contaminants and / or for specific target chemical functional groups that activate the film itself (substrate surface).

Claims

1. A system for cleaning objects, the system comprising: A first cleaner, comprising: At least one elastic roller, rotatably mounted to the first cleaner and having a generally cylindrical outer surface configured to contact a first surface of the object to remove inorganic contaminants; At least one adhesive roller, the at least one adhesive roller being rotatably mounted to the first cleaner and having a generally cylindrical outer surface that contacts a portion of the outer surface of the at least one elastic roller; At least one second cleaner, configured to operably receive the object from the first cleaner, and including an electromagnetic radiation source adapted to selectively emit electromagnetic radiation having a wavelength in the range of 10 nm to 280 nm to irradiate at least a first surface of the object, so as to activate at least the first surface and purify organic contaminants from the first surface, and additionally treat or conditionally treat at least the first surface, and The electromagnetic radiation source is configured such that the wavelength of the electromagnetic radiation can be selected based on organic contaminants on at least the first surface, and the activation of at least the first surface is adjusted to conditionally treat at least the first surface so as to react with a specific coating or treatment during subsequent manufacturing steps.

2. The system for cleaning objects according to claim 1, wherein, The electromagnetic radiation source is adapted to selectively emit electromagnetic radiation with wavelengths in the range of 100 nm to 280 nm.

3. The system for cleaning objects according to claim 2, wherein, The electromagnetic radiation source is adapted to selectively emit electromagnetic radiation with wavelengths in the range of 170 nm to 180 nm.

4. The system for cleaning an object according to any one of the preceding claims, wherein, The first cleaner includes a first support member, through which the object passes between the at least one elastic roller and the first support member, such that the first support member contacts a second surface opposite to the object.

5. The system for cleaning objects according to claim 4, wherein, The first support is at least one processing roller.

6. The system for cleaning objects according to claim 4, wherein, The at least one elastic roller is a first elastic roller, and the first support includes a rotatable second elastic roller configured to remove inorganic contaminants from the second surface of the object.

7. The system for cleaning objects according to claim 6, further comprising a second rotatable adhesive roller that contacts and engages with the second resilient roller.

8. The system for cleaning objects according to claim 1, wherein, The at least one second cleaner is operatively adjacent to the first cleaner.

9. The system for cleaning objects according to claim 8, wherein, The at least one second cleaner is configured to receive the object directly from the first cleaner.

10. The system for cleaning objects according to claim 1, wherein, The at least one second cleaner further includes a housing configured to shield the electromagnetic radiation source and reflect any electromagnetic radiation emitted from the electromagnetic radiation source toward at least a first surface of the object.

11. The system for cleaning objects according to claim 1, wherein, The electromagnetic radiation source includes at least one transmitter.

12. The system for cleaning objects according to claim 11, wherein, The at least one emitter is a UVC light-emitting diode.

13. The system for cleaning objects according to claim 1, wherein, The at least one second cleaner includes a main second cleaner and at least one auxiliary second organic cleaner, the at least one auxiliary second organic cleaner being arranged operatively adjacent to the main second cleaner and configured to receive the object from the main second cleaner.

14. A method for cleaning an object, the method comprising: The object is received in the first cleaner according to claim 1; The first surface of the object is brought into contact with the at least one elastic roller in order to remove inorganic contaminants from at least the first surface of the object; Transferring the object from the first cleaner to the second cleaner according to claim 1, and Electromagnetic radiation having a wavelength in the range of 100 nm to 280 nm is emitted from the electromagnetic radiation source onto at least the first surface of the object to irradiate at least the first surface of the object in order to activate at least the first surface and purify organic pollutants from the first surface, and additionally treat or conditionally treat at least the first surface, and The wavelength of the electromagnetic radiation is selected based on at least the organic contaminants on the first surface, such that the activation of the surface is adjusted to condition the surface so as to react with a specific coating or treatment during subsequent manufacturing steps.

15. The method of claim 14, further comprising the following steps: The opposite second surface of the object is brought into contact with the second elastic roller in order to remove inorganic contaminants from the opposite second surface.

16. The method for cleaning an object according to any one of claims 14 and 15, the method further comprising the following steps: The object is transferred from the main second cleaner to the auxiliary second cleaner, which is operatively adjacent to the main second cleaner and includes another electromagnetic radiation source; as well as Electromagnetic radiation having wavelengths in the range of 100 nm to 280 nm is emitted from the other electromagnetic radiation source onto the first and / or second surfaces of the object.

17. The method for cleaning an object according to claim 16, wherein, The electromagnetic radiation source of the main second cleaner or the auxiliary second cleaner is adapted to selectively emit electromagnetic radiation with wavelengths in the range of 170 nm to 180 nm.

Images