A stacked immersion liquid cooling heat dissipation device

Abstract

A kind of laminated immersion liquid cooling heat dissipation device, setting framework, bottom plate, multiple partitions, cover plate in turn, the front of cover plate and each partition is provided with recess in edge, embedding sealing material, with screw is connected with each other, respectively sealed cavity is formed, printed board is installed in cavity, heating device is installed in printed board, the back of bottom plate and partition is covered with jet plate, edge and bottom plate are welded, there is gap between jet plate and bottom plate, or no gap, set inner wall jet channel, jet plate surface has multiple jet holes, is distributed along jet channel, corresponds to each heating device, framework bottom is provided with water inlet hole, top is provided with water outlet hole, partition front water inlet hole edge has recess, embedding sealing ring, jet plate outer wall and partition front clamping sealing ring, water inlet hole passes through bottom plate and partition from jet plate covered area, and gap or jet channel is communicated, and cavity is not communicated, water outlet hole passes through bottom plate from jet plate covered area outside, and gap or jet channel is not communicated, and cavity is communicated.

Description

Technical Field

[0001] This invention belongs to the field of liquid cooling technology, specifically relating to a thermodynamic structure technology. Background Technology

[0002] As the output power of radar electronic equipment continues to increase, electronic devices are constantly evolving towards higher integration and thinner designs. Conventional brick-like architectures, due to their low integration density, cannot meet these demands. Chip-based architectures, with their advanced three-dimensional integration technology, effectively solve the problems of size, weight, and losses, and represent the future direction for large-scale equipment. However, the high power consumption and high integration characteristics of chip-based architectures result in high heat flux density, posing a significant challenge to heat dissipation within a limited space.

[0003] Liquid cooling technology boasts high heat transfer coefficients, low noise, and a compact structure. However, increasing flow rate to enhance heat dissipation leads to bulky liquid cooling pipes and a surge in energy consumption, making it difficult to apply in thin and light chip architectures. Chip architectures, with their highly integrated, multi-layered heat-generating devices of varying performance within a limited space, present significant challenges to the design of liquid cooling plates and flow channels. Furthermore, liquid cooling systems carry the risk of refrigerant leakage, which can easily lead to catastrophic consequences.

[0004] Due to the limitations of conventional liquid cooling, immersion liquid cooling systems have emerged. Heat-generating electronic components are immersed in an insulating liquid, and heat is transferred to the liquid working fluid via convection, solving the heat dissipation problem caused by three-dimensional stacking. However, even with natural convection, it is still insufficient to meet the heat dissipation requirements of high heat flux densities.

[0005] Patent CN114779172A discloses an integrated immersion jet cooling RF module. This module uses a jet outlet at the bottom to focus cooling on high-power devices while immersing and cooling the lower-power devices above, achieving efficient, tiered cooling. However, this solution has a complex flow channel layout, is difficult to manufacture, and has narrow internal circuit board gaps, making disassembly and assembly difficult. After the liquid working fluid absorbs heat from the high-power devices at the bottom, its temperature rises significantly, while the lower-power devices receive limited cooling resources, leading to heat accumulation, device overheating failure, and large temperature differences. Summary of the Invention

[0006] To address the technical challenges of varying heat dissipation requirements for different devices, uneven liquid cooling immersion, heat accumulation, and limited heat dissipation resources, a technical solution was adopted that combines multiple sealed cavities, precise heat dissipation through jet holes, and overall heat dissipation through cavity immersion. This resulted in a technical effect that is easy to assemble and disassemble, compatible and expandable, and allows for rapid, tiered heat dissipation.

[0007] The device consists of a frame, a base plate, and a cover plate arranged sequentially. The base plate and the cover plate are sealed to form a cavity. A printed circuit board is installed inside the cavity, and the heating element is installed on the printed circuit board. The front of the base plate is fixed to the frame, and the back is covered by a jet plate. There is a gap between the jet plate and the base plate, and the surface has multiple jet holes. The edges are welded to the base plate. A water inlet is provided at the bottom of the frame, and a water outlet is provided at the top. The water inlet passes through the base plate from the area covered by the jet plate, does not pass through the jet plate, communicates with the gap, and is not connected to the cavity. The water outlet passes through the base plate from outside the area covered by the jet plate, is not connected with the gap, and communicates with the cavity.

[0008] N partitions are set up. The bottom plate and the front of the first partition, the back of the first partition and the front of the second partition, the back of the Nth partition and the cover plate are sealed to form cavities. A printed circuit board is installed in each cavity. The back of the partition and the back of the bottom plate have the same structure, with jet plates and gaps. The water outlet passes through the N partitions, and all cavities are connected by the water outlet. The water inlet passes through the first partition to the (N-1)th partition and its jet plate, but does not penetrate the jet plate of the Nth partition. The water inlet on the front of the partition has a sealing structure to isolate the water inlet from the cavity. This process is repeated. All gaps are connected by the water inlet, and all cavities are not connected to the water inlet.

[0009] Furthermore, the jet holes correspond to each heating element, there are no gaps between the base plate, partition plate and jet plate, the inner walls of the base plate and partition plate are provided with jet channels, which are connected to the water inlet holes, and the jet channels are distributed along the jet holes.

[0010] Furthermore, the sealing structure is designed with grooves on the edge of the water inlet hole to embed the sealing ring, and the outer wall of the jet plate clamps the sealing ring with the front of the partition plate.

[0011] Preferably, the frame is provided with an inlet channel and an outlet channel, the inlet channel and the inlet hole are connected, the outlet channel and the outlet hole are connected, and the inlet hole and the outlet hole are diagonally distributed.

[0012] Preferably, the front of the cover plate and each partition plate has a groove on the edge to embed sealing material. The outer wall of the jet plate is clamped with the cover plate and the front of the partition plate to form a sealing cavity. The sealing material is then clamped between each layer and the cover plate and the front of the partition plate. After each layer is stacked, they are connected to each other with screws to form a sealed cavity with a depth greater than the total thickness of the printed circuit board and the heating device.

[0013] Preferably, the frame is a hollow frame, and the front of the base plate is provided with protruding ribs. The ribs are embedded in the frame, and the base plate is fixed to the frame with screws. Attached Figure Description

[0014] Figure 1 This is a frontal exploded view. Figure 2 It's an exploded view of the back. Figure 3 It is a side view. Figure 4 This is a diagram of the jet plate structure. Implementation

[0015] The technical solution of the present invention will be specifically described below with reference to the accompanying drawings, taking two partitions as an example.

[0016] The frame 1, base plate 2, two partitions 3, and cover plate 4 are stacked in sequence, as follows: Figure 1 As shown, both the cover plate 4 and the partition plate 3 have grooves 5 on their front edges to embed sealing material, which are then connected to each other with screws 6, forming three cavities 21 respectively. Figure 3 As shown.

[0017] A printed circuit board 9 is installed inside each cavity 21, and a heating element 10 is mounted on the printed circuit board 9, such as... Figure 1 and Figure 3 As shown, the depth of cavity 21 is greater than the total thickness of printed circuit board 9 and heating device 10.

[0018] The frame 1 is a hollow frame, and the front of the base plate 2 has raised ribs 7, which are embedded in the frame 8 in the middle of the frame 1, such as... Figure 2 As shown, the base plate 2 is fixed to the frame 1 using screws 6, as follows. Figure 1 and Figure 3 As shown.

[0019] The back of both the base plate 2 and the partition plate 3 are covered with jet plates 14, which are welded to the corresponding base plate 2 or partition plate 3 along the edges. The surface of the jet plate 14 has multiple jet holes 15, such as... Figure 2 and Figure 3 As shown, the jet holes 15 correspond to each heating element 10, and there are gaps between the base plate 2 and the partition plate 3 and their corresponding jet plates 14.

[0020] The frame 1 has a water inlet hole 12 at the bottom and a water outlet hole 11 at the top. Inside, there are water inlet channels 17 and 18. The water inlet channel 17 is connected to the water inlet hole 12, and the water outlet channel 18 is connected to the water outlet hole 11. The water inlet hole 12 and the water outlet hole 11 are diagonally distributed. Figure 1 As shown.

[0021] The water inlet 12 passes through the base plate 2 and the two partitions 3 from the area covered by the jet plate 14, but does not penetrate the jet plate 1 of the second partition 3, as shown. Figure 1 and Figure 2 As shown, the water outlet 11 extends from outside the area covered by the jet plate 14, passing through the bottom plate 2 and the two partition plates 3, as... Figure 3 and Figure 4 As shown, the water outlet 11 is not connected to the gap, but is connected to the cavity 21.

[0022] There can also be no gap between the jet plate 14, the base plate 2, and the partition plate 3. A jet channel 16 is provided on the inner wall, which communicates with the water inlet 12. Figure 4 As shown, the jet channel 16 is distributed along the jet hole 15.

[0023] The baffle 3 has a groove at the edge of the water inlet hole, into which the sealing ring 13 is embedded, such as Figure 1 As shown, the outer wall of the jet plate 14 clamps the sealing ring 13 with the front of the partition plate 3, isolating the water inlet 12 and the cavity 21 and connecting it with the jet channel 16, as shown. Figure 4 As shown.

[0024] Insulating coolant flows into the frame 1 from the water inlet channel 17, and flows sequentially through the bottom plate 2 and the two partition plates 3 along the water inlet hole 12 at the bottom. Figure 2 As shown, because the inlet hole 12 has a groove and a sealing ring 13 on its edge, and is clamped by the jet plate 14 and the partition plate 3, the insulating coolant cannot flow into the cavity 21, but can only flow into the jet channel 16 on the inner wall of the bottom plate 2 and the partition plate 3, as shown. Figure 4 As shown, because the jet channel 16 is narrow, the jet orifice 15 is small, and the hydraulic pressure is large, the coolant quickly fills the jet channel 16 and is simultaneously ejected from multiple jet orifices 15, precisely cooling each heat-generating component 10. Figure 3 As shown.

[0025] As coolant accumulates within cavity 21, it submerges other components that are not subject to jet cooling and have lower heat dissipation requirements. The coolant overflows to the top, enters the outlet hole 11, and flows back to the outlet channel 18 of the frame 1. Figure 2 and Figure 3 As shown, the arrows indicate the direction of coolant flow.

[0026] The above are embodiments of the present invention and do not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention are included within the protection scope of the present invention.

Claims

1. A stacked immersion liquid cooling heat dissipation device, characterized in that, include: The system consists of a frame, a base plate, and a cover plate arranged sequentially. The base plate and cover plate are sealed to form a cavity, and a printed circuit board (PCB) is installed inside the cavity. The heating element is mounted on the PCB. The front of the base plate is fixed to the frame, and the back is covered by a jet plate. There is a gap between the jet plate and the base plate, and the surface has multiple jet holes. The edges are welded to the base plate. The frame is a hollow frame, and the front of the base plate has raised ribs that are embedded in the frame. The bottom of the frame has a water inlet hole, and the top has a water outlet hole. The water inlet hole passes through the base plate from the area covered by the jet plate, does not pass through the jet plate, communicates with the gap, but does not communicate with the cavity. The water inlet hole and the water outlet hole are diagonally distributed. The water outlet hole passes through the base plate from outside the area covered by the jet plate, does not communicate with the gap, but communicates with the cavity. The interior of the frame has a water inlet channel and a water outlet channel. The water inlet channel communicates with the water inlet hole, and the water outlet... The flow channel and the outlet are connected; N baffles are set, and the bottom plate and the front of the first baffle, the back of the first baffle and the front of the second baffle, the back of the Nth baffle and the cover plate are sealed to form cavities. A printed circuit board is installed in each cavity; the back of the baffle and the back of the bottom plate have the same structure, with jet plates and gaps. The outlet passes through the N baffles, and all cavities are connected by the outlet; the inlet passes through the first baffle to the (N-1)th baffle and its jet plate, and does not penetrate the jet plate of the Nth baffle. The inlet on the front of the baffle has a sealing structure to isolate the inlet from the cavity. Similarly, all gaps are connected by the inlet, and all cavities are not connected to the inlet; there are no gaps between the bottom plate, the baffles and the jet plates. The inner walls of the bottom plate and the baffles are provided with jet channels, which are connected to the inlet. The jet channels are distributed along the jet holes. After the cover plate, partition plate, and cover plate are stacked, a sealed cavity is formed.

2. The stacked immersion liquid cooling heat dissipation device according to claim 1, characterized in that, Also includes: Secure the base plate to the frame with screws.

3. The stacked immersion liquid cooling heat dissipation device according to claim 1, characterized in that, The jet holes correspond to each heating element.

4. The stacked immersion liquid cooling heat dissipation device according to claim 1, characterized in that, The sealing structure is designed with a groove on the edge of the water inlet hole to embed a sealing ring, and the outer wall of the jet plate clamps the sealing ring with the front of the partition plate.

5. The stacked immersion liquid cooling heat dissipation device according to claim 1, characterized in that, The cover plate, partition plate, and cover plate are connected to each other with screws, and the depth is greater than the total thickness of the printed circuit board and the heating device.

6. The stacked immersion liquid cooling heat dissipation device according to claim 1, characterized in that, The front of the cover plate and each partition plate has a groove on the edge to embed sealing material, and the outer wall of the jet plate is clamped with the sealing material to the cover plate and the front of the partition plate.

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