Electrocaloric refrigeration system and apparatus

Abstract

The application relates to the technical field of electronic equipment refrigeration, and discloses an electric refrigerator system, which comprises an electric refrigerator module, a first heat exchange component and a second heat exchange component. The electric refrigerator module is connected with an external power supply to generate an electric refrigerator effect. The first heat exchange component is arranged on one side of the electric refrigerator module and is in heat conduction connection with the electric refrigerator module to exchange heat with the electric refrigerator module and dissipate heat of the electric refrigerator module. The second heat exchange component is arranged on the other side of the electric refrigerator module and is in heat conduction connection with the electric refrigerator module to transfer cold energy of the electric refrigerator module. The first heat exchange component and the second heat exchange component work alternately and correspond to power-on and power-off of the electric refrigerator module, so that the heat and the cold energy generated by the electric refrigerator module in the electric refrigerator effect are separated. Through the alternate working of the first heat exchange component and the second heat exchange component, the heat and the cold energy generated by the electric refrigerator module are effectively separated, the cold energy transferred by the second heat exchange component is utilized, and the purpose of industrialized mass production application is achieved. The application further discloses an equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment refrigeration, for example, to an electric card refrigeration system and equipment. BACKGROUND

[0002] A new refrigeration technology based on the electric card effect does not need to use the compressor and refrigerant required by the common refrigeration device. When an electric field is applied or removed on the electric card material, the material will produce the phenomenon of heat absorption or heat release, that is, the electric card effect. However, at present, this refrigeration technology based on the electric card effect is only tested in the laboratory based on a single electric card material. Although the electric card material can generate heat / cold through the application / removal of the electric field, it cannot effectively realize the separation of cold and heat, so as to realize the utilization of cold, and further industrialization and mass production application. SUMMARY

[0003] The following presents a simplified summary of some aspects of the disclosed embodiments in order to provide a basic understanding of such embodiments. This summary is not an extensive overview of the embodiments described in detail in the following detailed description, and is intended neither to identify key or critical elements nor to delineate the scope of such embodiments. Rather, the primary purpose of this summary is to present some concepts of the disclosed embodiments in a simplified form to the reader.

[0004] The electric card refrigeration system and equipment provided by the embodiments of the present disclosure can effectively separate cold and heat, so as to realize the application of generated cold, and further industrialization and mass production application.

[0005] In some embodiments, the electric card refrigeration system comprises:

[0006] An electric card module to generate an electric card effect by switching on and off an external power supply;

[0007] A first heat exchange component arranged on one side of the electric card module and in thermal conductive connection with the electric card module to exchange heat with the electric card module and transfer heat of the electric card module to dissipate heat of the electric card module;

[0008] A second heat exchange component arranged on the other side of the electric card module and in thermal conductive connection with the electric card module to transfer cold of the electric card module;

[0009] The first heat exchange component and the second heat exchange component work alternately and correspond to the electric card module being powered on or powered off respectively, so that the heat and cold generated in the electric card effect of the electric card module are separated.

[0010] In some embodiments, the electric card module comprises:

[0011] An electric card component comprising an electric card element and a thin film electrode covering and adhering to opposite sides of the electric card element;

[0012] The heat conducting assembly comprises a first heat conducting element and a second heat conducting element arranged oppositely, and the first heat conducting element and the second heat conducting element are respectively connected to opposite sides of the electric heating assembly to transfer heat with the electric heating assembly.

[0013] In some embodiments, the electric heating module further comprises:

[0014] The heat insulation element is in a block or sheet structure.

[0015] The heat insulation element is configured with a hollow part to accommodate the electric heating assembly and the heat conducting assembly.

[0016] In some embodiments, the first heat exchange assembly comprises:

[0017] The first heat transfer element is used to be connected to the electric heating module in heat conduction.

[0018] The first heat exchanger is used to dissipate heat.

[0019] The first water pump assembly comprises a first water pump and a first pipeline connected between the first heat transfer element and the first heat exchanger, and the first water pump is arranged in the first pipeline and controls the opening and closing of the first pipeline.

[0020] In some embodiments, the first heat exchange assembly further comprises:

[0021] The fan is arranged at the side of the first heat exchanger to blow air flow to accelerate heat dissipation of the first heat exchanger.

[0022] In some embodiments, the second heat exchange assembly comprises:

[0023] The second heat transfer element is used to be connected to the electric heating module in heat conduction.

[0024] The second heat exchanger is used to refrigerate.

[0025] The second water pump assembly comprises a second water pump and a second pipeline connected between the second heat transfer element and the second heat exchanger, and the second water pump is arranged in the second pipeline and controls the opening and closing of the second pipeline.

[0026] In some embodiments, the electric heating module is fixedly connected with the first heat exchange assembly and the second heat exchange assembly; or,

[0027] The electric heating module is movably connected with the first heat exchange assembly and the second heat exchange assembly.

[0028] In some embodiments, when the electric heating module is movably connected with the first heat exchange assembly and the second heat exchange assembly, it further comprises:

[0029] A driving assembly is connected with the electric card module to drive the electric card module to move towards the first heat exchange assembly to be in heat conduction connection with the first heat exchange assembly, or to move towards the second heat exchange assembly to be in heat conduction connection with the second heat exchange assembly.

[0030] In some embodiments, in the case that the electric card module is fixedly connected with the first heat exchange assembly and the second heat exchange assembly, the first heat transfer element of the first heat exchange assembly and the second heat transfer element of the second heat exchange assembly are respectively fixedly connected to two sides of the heat insulation element of the electric card module to accelerate the heat or cold transfer.

[0031] In some embodiments, the device comprises the electric card refrigeration system provided in the foregoing embodiments.

[0032] The electric card refrigeration system and the device provided by the embodiments of the present disclosure can achieve the following technical effects:

[0033] The heat generated by the electric card module is transferred to the first heat exchange assembly for heat dissipation and cooling, and the cold generated by the electric card module is transferred to the second heat exchange assembly and then to the associated device for refrigeration; wherein the electric card module generates heat when powered on, and the first heat exchange assembly works; the electric card module generates cold when powered off, and the second heat exchange assembly works, and the first heat exchange assembly and the second heat exchange assembly work alternately to effectively separate the heat and cold generated by the electric card module, utilize the cold transferred by the second heat exchange assembly, and achieve the purpose of industrialized mass production and application.

[0034] The general description above and the following description below are exemplary and explanatory only and are not intended to be limiting of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0035] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are schematic and are not intended to be limiting of the embodiments, in which like reference numbers refer to like elements throughout the drawings and in which:

[0036] Figure 1 is a schematic diagram of a frame of the electric card refrigeration system provided by the embodiments of the present disclosure;

[0037] Figure 2 is a schematic diagram of changes of heat / cold in the electric card refrigeration system provided by the embodiments of the present disclosure in the case of power on / off;

[0038] Figure 3 is a schematic diagram of a partial structure of the electric card refrigeration system provided by the embodiments of the present disclosure;

[0039] Figure 4is another structural schematic diagram of the electric card refrigeration system provided by the embodiment of the present disclosure.

[0040] Figure 5 is a structural schematic diagram of the electric card module provided by the embodiment of the present disclosure.

[0041] Reference signs:

[0042] 10: electric card module; 101: electric card assembly; 102: first heat-conducting element; 103: second heat-conducting element; 104: heat-insulating element; 105: hollow part; 20: first heat exchange assembly; 201: first heat transfer element; 202: first heat exchanger; 203: first water pump; 204: first pipeline; 205: fan; 30: second heat exchange assembly; 301: second heat transfer element; 302: second heat exchanger; 303: second water pump; 304: second pipeline. DETAILED DESCRIPTION

[0043] In order to enable a more detailed understanding of the features and technical content of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the drawings, which are only used for reference and do not limit the embodiments of the present disclosure. In the following technical description, in order to facilitate explanation, a plurality of details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, in order to simplify the drawings, well-known structures and devices can be simplified.

[0044] The terms "first", "second", and the like in the specification and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present disclosure described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0045] In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "back", and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation. In addition, in addition to indicating the orientation or positional relationship, the above-mentioned terms can also be used to represent other meanings, for example, the term "upper" can also be used to represent a certain attachment relationship or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0046] In addition, the terms "set", "connected", and "fixed" should be interpreted broadly. For example, "connected" can be fixed connection, detachable connection, or integral configuration; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection via an intermediate medium, or internal communication between two devices, elements, or components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present disclosure according to the specific circumstances.

[0047] Unless otherwise specified, the term "plurality" means two or more.

[0048] In the embodiments of the present disclosure, the character " / " represents an "or" relationship between the objects before and after it. For example, A / B means A or B.

[0049] The term "and / or" is a description of the association between objects, which means that there can be three relationships. For example, A and / or B means that there are three relationships of A or B, or A and B.

[0050] It should be noted that the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0051] In combination Figures 1 to 5 As shown, the present disclosure provides an electrocaloric refrigeration system including an electrocaloric module 10, a first heat exchange component 20, and a second heat exchange component 30. The electrocaloric module 10 is used to generate an electrocaloric effect by switching on and off with an external power supply. The first heat exchange component 20 is arranged on one side of the electrocaloric module 10 and is in thermal conductive connection with the electrocaloric module 10 to exchange heat with the electrocaloric module 10 and transfer the heat of the electrocaloric module 10 to dissipate heat. The second heat exchange component 30 is arranged on the other side of the electrocaloric module 10 and is in thermal conductive connection with the electrocaloric module 10 to transfer the cold energy of the electrocaloric module 10. The first heat exchange component 20 and the second heat exchange component 30 work alternately and correspond to the power-on or power-off of the electrocaloric module 10, so that the heat and cold energy generated in the electrocaloric effect of the electrocaloric module 10 are separated.

[0052] The electrocaloric refrigeration system provided by the embodiments of the present disclosure is used. The heat generated by the electrocaloric module 10 is transferred to the first heat exchange component 20 to dissipate heat and cool down. The cold energy generated by the electrocaloric module 10 is transferred to the second heat exchange component 30 and then to the associated equipment to refrigerate. When the electrocaloric module 10 is powered on, heat is generated and the first heat exchange component 20 works. When the electrocaloric module 10 is powered off, cold energy is generated and the second heat exchange component 30 works. Through the alternate working of the first heat exchange component 20 and the second heat exchange component 30, the effective separation of the heat and cold energy generated by the electrocaloric module 10 is realized, and the cold energy transferred by the second heat exchange component 30 is utilized, achieving the purpose of industrial mass production application.

[0053] The electric card module 10 is connected with an external power supply, the external power supply is periodically powered on and powered off with the electric card module 10, the electric card module 10 thereby realizes periodic heat release and heat absorption, and the first heat exchange assembly 20 and the second heat exchange assembly 30 work alternately. In the case that the external power supply is powered on with the electric card module 10, the electric card module 10 releases heat, the heat is transferred to the first heat exchange assembly 20, and the heat is radiated and cooled by the first heat exchange assembly 20. When the external power supply is powered off with the electric card module 10 in the powered-on state, the electric card module 10 absorbs heat, the second heat exchange assembly 30 is connected with the electric card module 10, the cold energy generated when the electric card module 10 absorbs heat is transferred to the second heat exchange assembly 30, and the cold energy is transferred to the corresponding device or equipment outside through the second heat exchange assembly 30 to achieve the purpose of refrigeration. In the case that the first heat exchange assembly 20 works, the second heat exchange assembly 30 does not work. In the case that the second heat exchange assembly 30 works, the first heat exchange assembly 20 does not work. In this way, the heat and cold energy generated in the electric card effect of the electric card module 10 can be effectively separated.

[0054] Optionally, the electric card module 10 comprises: an electric card assembly 101 comprising an electric card element and a thin film electrode covering and adhering to opposite sides of the electric card element; a heat conduction assembly comprising a first heat conduction element 102 and a second heat conduction element 103 arranged oppositely, the first heat conduction element 102 and the second heat conduction element 103 are respectively connected in heat conduction with opposite sides of the electric card assembly 101 to realize heat transfer with the electric card assembly 101.

[0055] The thin film electrode covers and adheres to the side surface of the electric card element to form the electric card assembly 101, which not only makes the electric card element power on and off to generate the electric card effect, but also helps to make the surface of the electric card assembly 101 flat, thereby ensuring the effective contact area between the electric card assembly 101 and the heat conduction assembly when the electric card assembly 101 is connected in heat conduction with the heat conduction assembly, and further improving the heat transfer efficiency between the electric card assembly 101 and the heat conduction assembly. In addition, the electric card module 10 is packaged by arranging the electric card assembly 101 between the first heat conduction element 102 and the second heat conduction element 103, so as to realize the industrialized preparation and application of the electric card module 10.

[0056] The electric card element can be one or more. The number of electric card elements can be selected according to actual needs, so as to realize the purpose of controllable cold energy of the electric card module 10. In the case that the electric card assembly 101 comprises a plurality of electric card elements, the plurality of electric card elements are arranged side by side and located in the same plane.

[0057] The thin film electrodes cover and adhere to both sides of the electrocaloric element. The thin film electrodes are externally connected to a power supply through wires, which not only can fix the electrocaloric element, but also can exert an electric field on the electrocaloric element to generate an electrocaloric effect. In addition, after the thin film electrodes cover the side surface of the electrocaloric element, the uneven surface of the electrocaloric element can be filled and corrected, so that the outer surface of the electrocaloric assembly 101 remains flat, thereby solving the problem of low heat transfer efficiency of the electrocaloric element caused by the uneven surface.

[0058] The electrocaloric assembly 101 is in thermal contact with the heat conduction assembly, and in particular, the electrocaloric assembly 101 is arranged between the first heat conduction element 102 and the second heat conduction element 103. In this way, in the case of heat release of the electrocaloric assembly 101, the heat released by the electrocaloric assembly 101 is transferred to the first heat conduction element 102, and the heat is transferred to the first heat exchange assembly 20 through the first heat conduction element 102 for heat dissipation. In the case of heat absorption of the electrocaloric assembly 101, the electrocaloric assembly 101 absorbs heat to produce cooling, and the generated cooling is transferred to the second heat exchange assembly 30 through the second heat conduction element 103, and the cooling is transferred outward through the second heat exchange assembly 30 to achieve the purpose of refrigeration.

[0059] Optionally, the first heat conduction element 102 can be a heat conduction sheet. Optionally, the second heat conduction element 103 can be a heat conduction sheet.

[0060] Optionally, the electrocaloric element can be a circular structure or a square structure. The specific size of the electrocaloric element is determined as needed. The electrocaloric element can be made of ferroelectric material powder configured in proportion, ball milled, dried, ground, pressed, and sintered. However, the material of the electrocaloric element is not limited to being made of ferroelectric material.

[0061] For the convenience of description and distinction, the thin film electrodes on both sides of the electrocaloric element are defined as a first thin film electrode and a second thin film electrode. The first thin film electrode is in thermal contact with the first heat conduction element 102, and the second thin film electrode is in thermal contact with the second heat conduction element 103. The first thin film electrode and the second thin film electrode are respectively provided with pins for externally connecting a power supply.

[0062] In actual application, in order to improve the heat conduction efficiency and ensure safety, the first heat conduction element 102 and the second heat conduction element 103 are made of high-thermal-conductivity insulating materials, such as aluminum nitride, silicon carbide, gallium nitride, boron nitride, and aluminum oxide. In addition, the first heat conduction element 102 and the second heat conduction element 103 can have a certain thickness to store cold or heat.

[0063] Optionally, the opposite sides of the electrocaloric element are coated with conductive paint to make the electrocaloric element adhere to and conductively connect with the thin film electrodes.

[0064] The opposite sides of the electric card element are coated with conductive paint, which not only enables the electric card element to be attached to and conductively connected to the thin film electrode, but also fills in uneven areas on the surface of the electric card element, so that the lateral surface of the electric card assembly 101 formed by the electric card element and the thin film electrode is kept smooth. In the case where the electric card assembly 101 is conductively connected to the heat conduction sheet assembly, the lateral surface of the electric card assembly 101 is ensured to have an effective contact area with the lateral surface of the heat conduction sheet, thereby improving the heat transfer efficiency.

[0065] Alternatively, the conductive paint can be conductive silver paste. The conductive silver paste not only ensures the electric conductivity between the electric card element and the thin film electrode, but also ensures the thermal conductivity therebetween. In addition, the conductive silver paste can fill in uneven areas on the surface of the electric card element, so that the surface of the electric card element is kept smooth. The thin film electrode can be attached to the electric card element by the conductive silver paste, so as to realize the attachment and assembly of the two.

[0066] Alternatively, the lateral surface of the electric card assembly 101 is provided with a heat conduction medium, so as to be conductively connected to the heat conduction assembly.

[0067] The lateral surface of the electric card assembly 101 is provided with a heat conduction medium, so that the heat or cold generated by the electric card effect of the electric card element can be quickly transferred to the heat conduction assembly through the heat conduction medium. In addition, the heat conduction medium not only enables the heat or cold to be transferred from the electric card assembly 101 to the heat conduction assembly, but also serves to fixedly connect the electric card assembly 101 and the heat conduction sheet assembly. The electric card assembly 101 is attached to the heat conduction assembly through the heat conduction medium.

[0068] The lateral surface of the electric card assembly 101, i.e. the surface of the thin film electrode. The surface of the thin film electrode can have uneven areas, which are filled in by the heat conduction medium, so as to ensure the effective contact area between the electric card assembly 101 and the heat conduction sheet, thereby ensuring the heat transfer efficiency therebetween.

[0069] Alternatively, the electric card module 10 further comprises: a heat insulation element 104, which has a block or sheet structure; wherein the heat insulation element 104 is configured with a hollow part 105 for accommodating the electric card assembly 101 and the heat conduction assembly.

[0070] The electric card assembly 101 and the heat conduction assembly are embedded in the heat insulation element 104 through the hollow part 105 of the heat insulation element 104, which is equivalent to a circumferential sealing treatment of the electric card assembly 101 and the heat conduction assembly. In this way, the electric card module 10 not only has an insulating effect, but also has a heat preservation effect, so that the heat or cold generated by the electric card module 10 can be transferred to the first heat exchange assembly 20 or the second heat exchange assembly 30, thereby reducing the loss of emission to the surrounding environment.

[0071] The heat insulation element 104 is made of a material with low thermal conductivity, so as to have a heat preservation effect.

[0072] In practical application, the heat insulation element 104 also functions to separate the first heat exchange assembly 20 and the second heat exchange assembly 30. In this way, the first heat exchange assembly 20 and the second heat exchange assembly 30 can be effectively separated by the heat insulation element 104, and the heat or cold generated by the electric heating assembly 101 can be repeatedly diffused between the two, thereby affecting the refrigeration effect.

[0073] Optionally, the pin of the electric heating assembly 101 can be connected with the external power supply through the heat insulation element 104, or the heat insulation element 104 is embedded with a connector for conducting the external power supply, and the pin of the electric heating assembly 101 is conductively connected with the connector.

[0074] Optionally, the first heat exchange assembly 20 comprises: a first heat transfer element 201 for conductive connection with the electric heating module 10; a first heat exchanger 202 for heat dissipation; and a first water pump 203 assembly comprising the first water pump 203 and a first pipeline 204 connecting the first heat transfer element 201 and the first heat exchanger 202, wherein the first water pump 203 is arranged in the first pipeline 204 and controls the opening and closing of the first pipeline 204.

[0075] The first pipeline 204 is connected in series with the first heat transfer element 201, the first water pump 203 and the first heat exchanger 202. The first pipeline 204 contains a heat-conducting liquid. The flow of the liquid is controlled by the first water pump 203. The heat-conducting liquid can be water, refrigerant or other heat-conducting medium that can be phase-changed by heat.

[0076] In the case that the electric heating module 10 is powered on and generates heat, the first heat exchange assembly 20 works, the first heat transfer element 201 is conductively connected with the electric heating module 10, and the first water pump 203 in the first water pump 203 assembly works to make the liquid in the first pipeline 204 circulate. The liquid in the first pipeline 204 exchanges heat with the electric heating module 10 when flowing through the first heat transfer element 201, receives the heat of the electric heating module 10, and then continues to flow to transfer the heat to the first heat exchanger 202, which is cooled by heat dissipation.

[0077] Optionally, the first heat exchange assembly 20 further comprises: a fan 205 arranged at the side of the first heat exchanger 202 to blow air flow to accelerate the heat dissipation of the first heat exchanger 202.

[0078] The fan 205 is arranged at the side of the first heat exchanger 202. When the liquid at a high temperature flows through the first heat exchanger 202, the liquid in the first pipeline 204 not only exchanges heat with the first heat exchanger 202 to be cooled, but also works with the fan 205 to blow air flow to the first heat exchanger 202 to accelerate the heat dissipation of the first heat exchanger 202, thereby improving the heat dissipation efficiency of the first heat exchange assembly 20.

[0079] Optionally, the second heat exchange assembly 30 comprises: a second heat transfer element 301, configured to be in heat conduction connection with the electrocaloric module 10; a second heat exchanger 302, configured to perform refrigeration; and a second water pump 303 assembly, comprising the second water pump 303 and a second pipeline 304 connecting the second heat transfer element 301 and the second heat exchanger 302, wherein the second water pump 303 is arranged in the second pipeline 304 and controls the opening and closing of the second pipeline 304.

[0080] The second pipeline 304 is connected in series with the second heat transfer element 301, the second water pump 303 and the second heat exchanger 302, and a heat transfer liquid flows in the second pipeline 304. The flow of the liquid in the second pipeline 304 is controlled by the second water pump 303. The heat transfer liquid can be water, refrigerant or other heat transfer medium capable of phase change.

[0081] In the case that the electrocaloric module 10 is powered off to absorb heat, the second heat exchange assembly 30 works, the second heat transfer element 301 is in heat conduction connection with the electrocaloric module 10, and the second water pump 303 in the second water pump 303 assembly works to circulate the liquid in the second pipeline 304. The liquid in the second pipeline 304 exchanges heat with the electrocaloric module 10 when flowing through the second heat transfer element 301, the cold energy generated by the electrocaloric module 10 is transferred to the second heat transfer element 301, and then continues to flow to transfer the cold energy to the second heat exchanger 302, so as to achieve the purpose of refrigeration.

[0082] The intermittent fluid heat transfer mode adopted in the embodiment of the present disclosure can efficiently transfer the heat and cold energy generated by the electrocaloric module 10 in the electrocaloric effect, and effectively separate the heat and cold energy.

[0083] Optionally, the first heat transfer element can be a water cooling head. However, the first heat transfer element is not limited to the water cooling head, for example, other element structures having heat transfer and liquid flow function inside can also be used.

[0084] Optionally, the second heat transfer element can be a water cooling head. However, the second heat transfer element is not limited to the water cooling head, for example, other element structures having heat transfer and liquid flow function inside can also be used.

[0085] Optionally, the electrocaloric module 10 is fixedly connected with the first heat exchange assembly 20 and the second heat exchange assembly 30, or the electrocaloric module 10 is movably connected with the first heat exchange assembly 20 and the second heat exchange assembly 30.

[0086] In the case that the electrocaloric module 10 is fixedly connected with the first heat exchange assembly 20 and the second heat exchange assembly 30, it can be understood that the electrocaloric module 10, the first heat exchange assembly 20 and the second heat exchange assembly 30 are relatively fixed, and the first heat exchange assembly 20 and the second heat exchange assembly 30 are arranged on the two sides of the electrocaloric module 10. The first heat exchange assembly 20 and the second heat exchange assembly 30 are separated by the heat insulation element 104 to avoid relative diffusion of heat or cold energy between them.

[0087] In the case that the electrocaloric module 10 is movably connected to the first heat exchange assembly 20 and the second heat exchange assembly 30, the electrocaloric module 10 is powered on, and then the electrocaloric module 10 is in direct contact with the first heat exchange assembly 20 to transfer heat. The electrocaloric module 10 is powered off, and then the electrocaloric module 10 is moved from the first heat exchange assembly 20 to the second heat exchange assembly 30 and is in direct contact with the second heat exchange assembly 30 to transfer cold, thereby realizing effective separation of the heat and cold generated by the electrocaloric module 10 in the electrocaloric effect.

[0088] Optionally, in the case that the electrocaloric module 10 is movably connected to the first heat exchange assembly 20 and the second heat exchange assembly 30, further comprising: a driving assembly connected to the electrocaloric module 10 to drive the electrocaloric module 10 to move towards the first heat exchange assembly 20 to be in heat-conducting connection with the first heat exchange assembly 20, or to drive the electrocaloric module 10 to move towards the second heat exchange assembly 30 to be in heat-conducting connection with the second heat exchange assembly 30.

[0089] By driving the electrocaloric module 10 to reciprocally move between the first heat exchange assembly 20 and the second heat exchange assembly 30 through the driving assembly, the periodic power-on and power-off of the electrocaloric module 10 and the periodic heat release and heat absorption are adapted, thereby realizing effective separation of the heat and cold generated by the electrocaloric module 10 in the electrocaloric effect.

[0090] When the electrocaloric module 10 is powered on, the driving assembly drives the electrocaloric module 10 to move to the first heat exchange assembly 20, so that the electrocaloric module 10 is in heat-conducting connection with the first heat exchange assembly 20 to transfer heat. When the electrocaloric module 10 is powered off, the driving assembly drives the electrocaloric module 10 to move to the second heat exchange assembly 30, so that the electrocaloric module 10 is in heat-conducting connection with the second heat exchange assembly 30 to transfer cold.

[0091] Optionally, in the case that the electrocaloric module 10 is fixedly connected to the first heat exchange assembly 20 and the second heat exchange assembly 30, the first heat transfer element 201 of the first heat exchange assembly 20 and the second heat transfer element 301 of the second heat exchange assembly 30 are respectively fixedly connected to the two sides of the heat insulation element 104 of the electrocaloric module 10 to accelerate heat or cold transfer.

[0092] The first heat transfer element 201 of the first heat exchange assembly 20 and the second heat transfer element 301 of the second heat exchange assembly 30 are respectively fixedly connected to the two sides of the heat insulation element 104 of the electrocaloric module 10, which not only can avoid relative diffusion of heat or cold between the first heat transfer element 201 and the second heat transfer element 301, but also can realize effective separation of the hot end and the cold end, i.e., effective spacing of the first heat transfer element 201 and the second heat transfer element 301.

[0093] In practical applications, the electric Peltier module 10 is fixedly connected with the first heat exchange assembly 20 and the second heat exchange assembly 30, which is helpful for structural stability and reliability, reduces the loss of corresponding components, and ensures the effective contact area between the electric Peltier module 10 and the first heat exchange assembly 20 and the second heat exchange assembly 30, thereby ensuring the heat transfer efficiency between the electric Peltier module 10 and the first heat exchange assembly 20 and the second heat exchange assembly 30.

[0094] Optionally, the side area of the heat insulation element 104 is greater than the heat transfer area of the first heat transfer element 201. Optionally, the side area of the heat insulation element 104 is greater than the heat transfer area of the second heat transfer element 301. In this way, the first heat transfer element 201 and the second heat transfer element 301 can be better isolated.

[0095] Optionally, the first heat transfer element 201 and the second heat transfer element 301 are respectively detachably connected to the heat insulation element 104. Optionally, the first heat transfer element 201 and the second heat transfer element 301 are connected by a fastener, wherein the fastener penetrates the heat insulation element 104. In this way, the effective fixed connection between the first heat transfer element 201, the heat insulation element 104 and the second heat transfer element 301 can be ensured. It should be noted that the fastener used here is preferably heat insulation plastic to reduce heat transfer.

[0096] In combination with Figures 1 to 5 As shown in the drawings, the embodiment of the present disclosure provides a device comprising the electric Peltier refrigeration system provided in the above embodiments. The electric Peltier refrigeration system comprises an electric Peltier module 10, a first heat exchange assembly 20 and a second heat exchange assembly 30. The electric Peltier module 10 is used to generate an electric Peltier effect by switching with an external power supply. The first heat exchange assembly 20 is arranged on one side of the electric Peltier module 10 and is in thermal conductive connection with the electric Peltier module 10 to exchange heat with the electric Peltier module 10 and transfer the heat of the electric Peltier module 10 to dissipate heat. The second heat exchange assembly 30 is arranged on the other side of the electric Peltier module 10 and is in thermal conductive connection with the electric Peltier module 10 to transfer the cold of the electric Peltier module 10. The first heat exchange assembly 20 and the second heat exchange assembly 30 work alternately and correspond to the power-on or power-off of the electric Peltier module 10, so as to separate the heat and cold generated in the electric Peltier effect of the electric Peltier module 10.

[0097] The device provided by the embodiment of the present disclosure is used, the heat generated by the electric card module 10 is transferred to the first heat exchange assembly 20 to dissipate heat and cool down, the cold energy generated by the electric card module 10 is transferred to the second heat exchange assembly 30, and is transferred to the associated device through the second heat exchange assembly 30 to refrigerate; wherein the electric card module 10 generates heat when powered on, and the first heat exchange assembly 20 works; the electric card module 10 generates cold energy when powered off, and the second heat exchange assembly 30 works, the first heat exchange assembly 20 and the second heat exchange assembly 30 work alternately to realize the effective separation of the heat and the cold energy generated by the electric card module 10, and the cold energy transferred by the second heat exchange assembly 30 is utilized, which not only realizes the refrigeration purpose, but also can realize the industrialized mass production application purpose.

[0098] The above description and drawings sufficiently illustrate the embodiments of the present disclosure to enable one skilled in the art to practice them. Other embodiments can include structural and other changes. The embodiments are merely representative of the possible variations. Individual components and functions are optional unless explicitly required, and the order of operations can be varied. Parts and features of some embodiments can be included or substituted for parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures already described and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electrocaloric refrigeration system, characterized by, The electric card module is connected with an external power supply to generate an electric card effect. The first heat exchange assembly is arranged on one side of the electric card module and is in thermal contact with the electric card module to exchange heat with the electric card module and dissipate heat of the electric card module. The second heat exchange assembly is arranged on the other side of the electric card module and is in thermal contact with the electric card module to exchange cold energy of the electric card module. The electric card module comprises: The electric card assembly comprises an electric card element and a thin film electrode covering and adhering to opposite sides of the electric card element. The heat conduction assembly is in thermal contact with the electric card assembly. The heat insulation element has a hollow structure to accommodate the electric card assembly and the heat conduction assembly. The first heat exchange assembly and the second heat exchange assembly are alternately operated and correspond to power-on and power-off of the electric card module to separate heat and cold energy generated by the electric card effect.

2. The electric card refrigeration system of claim 1, wherein the heat conduction assembly comprises first and second heat conduction elements arranged opposite to each other and in thermal contact with opposite sides of the electric card assembly. The first heat exchange assembly comprises: The first heat exchange assembly further comprises:

3. The electrically powered refrigeration system of claim 1, wherein, The fan is arranged on a side of the first heat exchange assembly to blow air to accelerate heat dissipation of the first heat exchange assembly. The second heat exchange assembly comprises: The second heat exchange assembly further comprises: The electric card module is fixedly connected with the first and second heat exchange assemblies, or the electric card module is movably connected with the first and second heat exchange assemblies.

4. The electric card refrigeration system of claim 3, wherein, In the case that the electric card module is movably connected with the first and second heat exchange assemblies, the system further comprises: The driving assembly is connected with the electric card module to drive the electric card module to move to the first heat exchange assembly to be in thermal contact with the first heat exchange assembly or to move to the second heat exchange assembly to be in thermal contact with the second heat exchange assembly.

5. The electrically powered refrigeration system of claim 1, wherein, 8. The electric card refrigeration system of claim 6, wherein in the case that the electric card module is fixedly connected with the first and second heat exchange assemblies, the first heat conduction element of the first heat exchange assembly and the second heat conduction element of the second heat exchange assembly are fixedly connected with opposite sides of the heat insulation element of the electric card module to accelerate heat or cold energy exchange. ​ ​ ​ 6. The electrically powered caloric refrigeration system of any one of claims 1 to 5, wherein, ​ ​ 7. The electrically powered refrigeration system of claim 6, wherein, ​ ​ ​ ​ 9. An apparatus, comprising: An electrically powered chiller system comprising the electrically powered chiller of any one of claims 1 to 8.

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