A monitoring device and method for decomposition products of metals inside a high-voltage switch cabinet

Abstract

The application relates to the technical field of electrical equipment testing, in particular to a monitoring device and method for metal decomposition products in a high-voltage switch cabinet. The temperature monitoring module is arranged in the switch cabinet and connected with a single-chip microcomputer; the single-chip microcomputer is connected with a temperature simulation module; a step-up transformer is connected with a power grid; first and second discharge modules are arranged in the monitoring device main body and connected with the step-up transformer and the temperature simulation module, and are used for generating partial discharge under the same working condition as the high-voltage switch cabinet according to the voltage provided by the step-up transformer, the heat provided by the temperature simulation module and the environmental humidity in the monitoring device main body; the first and second discharge modules generate nitrate after the partial discharge; the application can simulate the partial discharge under the same temperature, voltage and humidity environment as the high-voltage switch cabinet, analyze the decomposition products generated in the device, and realize the corrosion condition of metal parts in the high-voltage switch cabinet without opening the cabinet.

Description

Technical Field

[0001] This invention relates to the field of electrical equipment testing technology, and in particular to a monitoring device and method for metal decomposition products inside a high-voltage switchgear. Background Technology

[0002] High-voltage switchgear is a commonly used electrical equipment in power supply units such as substations. It plays an important role in circuit switching, circuit control and circuit protection during power generation, transmission and supply. Therefore, whether the high-voltage switchgear can operate reliably directly determines the reliable operation of the entire power system.

[0003] To ensure reliable and uninterrupted power supply, the maintenance cycle of high-voltage switchgear is usually close to 6 years or even longer. However, due to the influence of humidity, temperature and load environment during actual operation, many switchgear fail before completing their service objectives, posing a hidden danger to the reliable operation of the power system.

[0004] Existing methods for evaluating the insulation performance of high-voltage switchgear typically involve shutting down and dismantling the switchgear before conducting insulation performance tests. However, this approach can lead to power system outages, violating the principle of reliable power supply. Alternatively, methods can be used to detect the decomposition products of the air inside the high-voltage switchgear to assess its operational status. However, due to the ease of gas diffusion and the complexity of the decomposition products, the test results are often unsatisfactory, affecting the accuracy of the tests. Summary of the Invention

[0005] This invention provides a monitoring device and method for metal decomposition products inside high-voltage switchgear, which solves the problem of inaccurate testing of the insulation performance of high-voltage switchgear.

[0006] The first aspect of this invention provides a monitoring device for metal decomposition products inside a high-voltage switchgear, comprising: a temperature monitoring module, a step-up transformer, a temperature simulation module, a first discharge module, a second discharge module, a microcontroller, and a monitoring device body, wherein:

[0007] The temperature monitoring module is installed inside the high-voltage switchgear and connected to the microcontroller. It is used to monitor the temperature of the metal parts inside the high-voltage switchgear and generate temperature data to be transmitted to the microcontroller.

[0008] The microcontroller is connected to the temperature simulation module and is used to send a temperature control signal with the same temperature as the temperature data to the temperature simulation module based on the temperature data transmitted by the temperature monitoring module.

[0009] The temperature simulation module is located inside the main body of the monitoring device and is used to generate heat corresponding to the temperature control signal based on the temperature control signal transmitted by the microcontroller.

[0010] The step-up transformer is connected to the power grid and is used to raise the grid voltage to the same level as the voltage inside the high-voltage switchgear.

[0011] The monitoring device has a ventilation hole on one side of its main body to simulate the ambient humidity inside the high-voltage switchgear under a ventilation environment connected to the high-voltage switchgear.

[0012] The first discharge module and the second discharge module are spaced apart inside the main body of the monitoring device. They are both connected to the step-up transformer and the temperature simulation module. They are used to generate partial discharge under the same operating conditions as inside the high-voltage switchgear based on the voltage provided by the step-up transformer. They are also used to simulate the generation of nitrates inside the switchgear based on the heat generated by the temperature simulation module, the ambient humidity inside the high-voltage switchgear, and the compounds generated by the partial discharge.

[0013] Specifically, the first discharge module comprises multiple discharge units made of the same material as multiple metal parts in the high-voltage switchgear, and the discharge units are arranged at intervals between each other.

[0014] Specifically, the temperature simulation module includes: a heater, a fan, and a controller;

[0015] The controller is connected to the microcontroller and is used to generate temperature control commands based on the control signals from the microcontroller.

[0016] The heater is connected to the controller and is used to generate heat according to the temperature control command of the controller;

[0017] The fan is connected to the heater, the first discharge module and the second discharge module respectively through an insulated air duct, and is used to transport the heat generated by the heater to the first discharge module and the second discharge module.

[0018] Specifically, the temperature monitoring module includes multiple infrared temperature measurement units, which are used to monitor the surface temperature of different metal parts inside the high-voltage switchgear.

[0019] Specifically, the monitoring device for the metal decomposition products inside the high-voltage switchgear is placed around the high-voltage switchgear to obtain the same ventilation environment as the high-voltage switchgear.

[0020] Specifically, this also includes grounding electrodes;

[0021] The grounding electrode is connected to the step-up transformer and the second discharge module respectively, for protective grounding.

[0022] Specifically, the materials of the multiple discharge units of the first discharge module include copper, aluminum, and zinc, respectively.

[0023] The materials used in the second discharge module include copper.

[0024] Specifically, the spacing between the multiple discharge units of the first discharge module and the second discharge module corresponds one-to-one with the spacing between the different metal parts that generate discharge inside the high-voltage switchgear.

[0025] Specifically, solenoid valves are installed on the insulated air ducts;

[0026] The solenoid valve is connected to the controller and is used to adjust the opening degree of each insulating air duct according to the temperature control command generated by the controller, so as to deliver the same temperature to the first discharge module and the second discharge module as the temperature corresponding to multiple different metal parts in the high-voltage switch cabinet.

[0027] This invention also provides a method for monitoring metal decomposition products inside a high-voltage switchgear, comprising the following steps:

[0028] S1: The temperature of different metal parts in the high-voltage switchgear to be monitored is collected by the temperature acquisition device, and multiple temperature data are generated and sent to the microcontroller.

[0029] S2: A control signal is generated from multiple temperature data and sent to the controller;

[0030] S3: The controller controls the heater to generate heat according to the control signal and controls the opening and closing degree of the solenoid valve, so that the multiple discharge units of the first discharge module and the second discharge module are heated to the temperature corresponding to the temperature data.

[0031] S4: The step-up transformer raises the grid voltage to the same level as the voltage inside the high-voltage switchgear according to the preset voltage level, and transmits it to the first discharge module and the second discharge module, so that the first discharge module and the second discharge module generate partial discharge and generate nitrate.

[0032] S5: After waiting for the preset time, the staff will perform electron spectrometry analysis on the nitrates on the first and second discharge modules to determine the corrosion status of the metal parts inside the high-voltage switchgear.

[0033] The beneficial effects of this invention are as follows: An embodiment of this invention provides a monitoring device for metal decomposition products inside a high-voltage switchgear, comprising: a temperature monitoring module, a step-up transformer, a temperature simulation module, a first discharge module, a second discharge module, a microcontroller, and a monitoring device body. The temperature monitoring module is disposed inside the high-voltage switchgear and connected to the microcontroller, used to monitor the temperature of metal parts inside the high-voltage switchgear and generate temperature data to be transmitted to the microcontroller. The microcontroller is connected to the temperature simulation module and used to send a temperature control signal with the same temperature as the temperature data transmitted by the temperature monitoring module to the temperature simulation module. The temperature simulation module is disposed inside the monitoring device body and used to transmit a temperature control signal with the same temperature as the temperature data transmitted by the microcontroller. The system outputs a temperature control signal, generating heat corresponding to the temperature control signal; a step-up transformer is connected to the power grid to increase the grid voltage to the same level as the voltage inside the high-voltage switchgear; a ventilation hole is provided on one side of the main body of the monitoring device to simulate the ambient humidity inside the high-voltage switchgear under ventilation conditions connected to the high-voltage switchgear; a first discharge module and a second discharge module are spaced apart inside the main body of the monitoring device, both connected to the step-up transformer and the temperature simulation module, to generate partial discharge under the same operating conditions as inside the high-voltage switchgear based on the voltage provided by the step-up transformer, and also to simulate the generation of nitrates inside the switchgear based on the heat generated by the temperature simulation module, the ambient humidity inside the high-voltage switchgear, and the compounds generated by the partial discharge.

[0034] The monitoring device for metal decomposition products inside high-voltage switchgear provided by this invention can obtain the temperature of metal parts inside the high-voltage switchgear through a temperature monitoring module, and re-simulate the temperature corresponding to each different metal part using a microcontroller and a temperature simulation module, thereby heating the corresponding first and second discharge modules; it can also obtain the same ventilation environment as the high-voltage switchgear through the ventilation holes of the monitoring device body, thereby obtaining the same humidity; and it can provide the same voltage level as the high-voltage switchgear through a step-up transformer; under the same temperature, humidity and voltage level environment, by analyzing the nitrates generated by the partial discharge of the first and second discharge modules, the corrosion status of the metal parts inside the high-voltage switchgear corresponding to this device can be obtained without opening the cabinet. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1A schematic diagram of the monitoring device for metal decomposition products inside a high-voltage switchgear.

[0037] Figure 2 This is a flowchart of a method for monitoring metal decomposition products inside a high-voltage switchgear. Detailed Implementation

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] Based on past experience, the main cause of switchgear failure is that the edges of metal parts inside the switchgear are generally sharp and have a large radius of curvature, which can easily cause partial discharge and produce compounds such as ozone and nitrogen oxides. These compounds can easily form corrosive substances such as nitric acid in a humid environment, causing the metal parts to be corroded and generating nitrates, which then diffuse to the surface of the insulating parts supporting the metal parts, leading to insulation failure.

[0040] Therefore, the present invention provides a monitoring device and method for metal decomposition products inside a high-voltage switchgear, which is used to simulate the internal environment of the high-voltage switchgear. By analyzing the decomposition products generated in the device, the corrosion status of metal parts inside the high-voltage switchgear can be obtained without opening the cabinet.

[0041] The first aspect of this invention provides an embodiment of a monitoring device for metal decomposition products inside a high-voltage switchgear; please refer to [link to embodiment]. Figure 1 , Figure 1 A schematic diagram of the structure of a monitoring device for metal decomposition products inside a high-voltage switchgear.

[0042] In this embodiment, the monitoring device for metal decomposition products inside the high-voltage switchgear includes: a temperature monitoring module, a step-up transformer, a temperature simulation module, a first discharge module, a second discharge module, a microcontroller, and the main body of the monitoring device, wherein:

[0043] The temperature monitoring module is installed inside the high-voltage switchgear and connected to the microcontroller. It is used to monitor the temperature of the metal parts inside the high-voltage switchgear and generate temperature data to be transmitted to the microcontroller.

[0044] The microcontroller is connected to the temperature simulation module and is used to send a temperature control signal with the same temperature as the temperature data transmitted by the temperature monitoring module to the temperature simulation module.

[0045] The temperature simulation module is located inside the main body of the monitoring device and is used to generate heat corresponding to the temperature control signal based on the temperature control signal transmitted by the microcontroller.

[0046] The step-up transformer is connected to the power grid and is used to raise the grid voltage to the same level as the voltage inside the high-voltage switchgear.

[0047] A ventilation hole is provided on one side of the main body of the monitoring device to simulate the ambient humidity inside the high-voltage switchgear in a ventilated environment connected to the high-voltage switchgear.

[0048] The first and second discharge modules are spaced apart inside the main body of the monitoring device. Both are connected to the step-up transformer and the temperature simulation module. They are used to generate partial discharge under the same operating conditions as inside the high-voltage switchgear based on the voltage provided by the step-up transformer. They are also used to simulate the generation of nitrates inside the switchgear based on the heat generated by the temperature simulation module, the ambient humidity inside the high-voltage switchgear, and the compounds generated by the partial discharge.

[0049] In another specific embodiment of the present invention, the first discharge module is composed of multiple discharge units made of the same material as multiple different metal parts in the high-voltage switch cabinet, and the discharge units are arranged at intervals.

[0050] In another more specific embodiment of the present invention, the spacing between the plurality of discharge units of the first discharge module and the second discharge module corresponds one-to-one with the spacing between the different metal parts that generate discharge in the high-voltage switch cabinet.

[0051] In another, more specific embodiment of the present invention, the temperature simulation module includes: a heater, a fan, and a controller;

[0052] The controller is connected to the microcontroller and is used to generate temperature control commands based on the control signals from the microcontroller.

[0053] The heater is connected to the controller and is used to generate heat according to the temperature control instructions of the controller;

[0054] The fan is connected to the heater, the first discharge module, and the second discharge module via insulated ducts, and is used to transfer the heat generated by the heater to the first discharge module and the second discharge module.

[0055] In one specific embodiment of the present invention, the temperature monitoring module includes multiple infrared temperature measurement units;

[0056] Multiple infrared temperature measurement units monitor the surface temperature of different metal parts inside the switch cabinet.

[0057] In another more specific embodiment of the present invention, an electromagnetic valve is provided on the insulated air duct;

[0058] The solenoid valve is connected to the controller and is used to adjust the opening and closing degree of each insulating air duct according to the temperature control command generated by the controller, so as to deliver the same temperature as multiple different metal parts in the high-voltage switch cabinet to the first discharge module and the second discharge module.

[0059] In another specific embodiment of the present invention, a monitoring device for the metal decomposition products inside the high-voltage switchgear is placed around the high-voltage switchgear to maintain the same ventilation environment as the high-voltage switchgear.

[0060] In another more specific embodiment of the present invention, the materials of the plurality of discharge units of the first discharge module respectively include: copper, aluminum, and zinc;

[0061] The materials used in the second discharge module include copper.

[0062] In another more specific embodiment of the present invention, the monitoring device for metal decomposition products inside the high-voltage switchgear further includes: a grounding electrode;

[0063] The grounding electrode is connected to the step-up transformer and the second discharge module respectively for protective grounding.

[0064] In another specific embodiment of the present invention, the monitoring device for metal decomposition products inside the high-voltage switchgear further includes a second temperature monitoring module.

[0065] The second temperature monitoring module is located inside the main body of the monitoring device and is connected to the microcontroller. It is used to monitor the temperature of the first discharge module and the second discharge module in real time and send the data to the microcontroller. This provides the microcontroller with a basis for determining whether the temperature of the first discharge module and the second discharge module has reached the temperature of the corresponding metal parts in the high-voltage switch cabinet, making the microcontroller's temperature control of the temperature simulation module more accurate.

[0066] This invention also provides an embodiment of a method for monitoring metal decomposition products inside a high-voltage switchgear, such as... Figure 2 As shown, the specific steps include the following:

[0067] S1: The temperature of different metal parts in the high-voltage switchgear to be monitored is collected by the temperature acquisition device, and multiple temperature data are generated and sent to the microcontroller.

[0068] S2: A control signal is generated from multiple temperature data and sent to the controller;

[0069] S3: The controller controls the heater to generate heat according to the control signal and controls the opening and closing degree of the solenoid valve, so that the multiple discharge units of the first discharge module and the second discharge module are heated to the temperature corresponding to the temperature data.

[0070] S4: The step-up transformer raises the grid voltage to the same level as the internal voltage of the high-voltage switchgear according to the preset voltage level, and transmits it to the first discharge module and the second discharge module; after partial discharge occurs in the first discharge module and the second discharge module, nitrate is generated.

[0071] S5: After waiting for the preset time, the staff will perform electron spectrometry analysis on the nitrates on the first and second discharge modules to determine the corrosion status of the metal parts inside the high-voltage switchgear.

[0072] In another more specific embodiment of the present invention, in step S5, the preset time is one year.

[0073] In another more specific embodiment of the present invention, in step S5, the sampled nitrate is washed with a quantitative amount of deionized water, and the conductivity of the washed liquid is analyzed.

[0074] In the specific real-time process, 100ml of deionized water was used to clean the surface of the first discharge module with nitrate adhering to it. When the conductivity of the solution was greater than 100μS / cm and the voltage was 6KV, surface discharge began to occur on the surface of the insulating components inside the cabinet.

[0075] In another more specific embodiment of the present invention, in step S5, the metal corrosion products on the surface of the first discharge module are scraped off for electron energy spectrum analysis, thereby achieving qualitative analysis of the decomposition products.

[0076] The terms “first,” “second,” “third,” “fourth,” etc. (if present) used in this application's specification are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0077] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0078] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0079] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0080] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

Claims

1. A monitoring device for metal decomposition products inside a high-voltage switchgear, characterized in that, include: The system comprises a temperature monitoring module, a step-up transformer, a temperature simulation module, a first discharge module, a second discharge module, a microcontroller, and the main body of the monitoring device, wherein: The temperature monitoring module is located inside the high-voltage switchgear and is connected to the microcontroller. It is used to monitor the temperature of the metal parts inside the high-voltage switchgear and generate temperature data to be transmitted to the microcontroller. The microcontroller is connected to the temperature simulation module and is used to send a temperature control signal with the same temperature as the temperature data to the temperature simulation module based on the temperature data transmitted by the temperature monitoring module. The temperature simulation module is located inside the main body of the monitoring device and is used to generate heat corresponding to the temperature control signal based on the temperature control signal transmitted by the microcontroller. The step-up transformer is connected to the power grid and is used to raise the grid voltage to the same level as the voltage inside the high-voltage switchgear. The monitoring device has a ventilation hole on one side of its main body to simulate the ambient humidity inside the high-voltage switchgear under a ventilation environment connected to the high-voltage switchgear. The first discharge module and the second discharge module are spaced apart inside the main body of the monitoring device and are both connected to the step-up transformer and the temperature simulation module. They are used to generate partial discharge under the same operating conditions as inside the high-voltage switchgear based on the voltage provided by the step-up transformer. They are also used to simulate the generation of nitrates inside the switchgear based on the heat generated by the temperature simulation module, the ambient humidity inside the high-voltage switchgear, and the compounds generated by the partial discharge. The first discharge module comprises multiple discharge units made of the same material as multiple metal parts in the high-voltage switchgear, and the discharge units are arranged at intervals between each other. The temperature simulation module includes: a heater, a fan, and a controller; The controller is connected to the microcontroller and is used to generate temperature control commands based on the control signals from the microcontroller. The heater is connected to the controller and is used to generate heat according to the temperature control command of the controller; The fan is connected to the heater, the first discharge module and the second discharge module respectively through an insulated air duct, and is used to transport the heat generated by the heater to the first discharge module and the second discharge module; The spacing between the multiple discharge units of the first discharge module and the second discharge module corresponds one-to-one with the spacing between the different metal parts that generate discharge in the high-voltage switchgear. Solenoid valves are installed on the insulated air ducts; The solenoid valve is connected to the controller and is used to adjust the opening degree of each insulating air duct according to the temperature control command generated by the controller, so as to deliver the same temperature to the first discharge module and the second discharge module as the temperature corresponding to multiple different metal parts in the high-voltage switch cabinet.

2. The monitoring device for metal decomposition products inside a high-voltage switchgear according to claim 1, characterized in that, The temperature monitoring module includes multiple infrared temperature measurement units, which are used to monitor the surface temperature of different metal parts inside the high-voltage switchgear.

3. The monitoring device for metal decomposition products inside a high-voltage switchgear according to claim 1, characterized in that, The monitoring device for the metal decomposition products inside the high-voltage switchgear is placed around the high-voltage switchgear to maintain the same ventilation environment as the high-voltage switchgear.

4. The monitoring device for metal decomposition products inside a high-voltage switchgear according to claim 1, characterized in that, It also includes the grounding electrode; The grounding electrode is connected to the step-up transformer and the second discharge module respectively, for protective grounding.

5. The monitoring device for metal decomposition products inside a high-voltage switchgear according to claim 1, characterized in that, The materials of the multiple discharge units of the first discharge module include copper, aluminum, and zinc, respectively. The materials used in the second discharge module include copper.

6. A method for monitoring metal decomposition products inside a high-voltage switchgear, characterized in that, The method applied to the monitoring device as described in any one of claims 1-5 includes the following steps: S1: The temperature of different metal parts in the high-voltage switchgear to be monitored is collected by the temperature acquisition device, and multiple temperature data are generated and sent to the microcontroller. S2: A control signal is generated from multiple temperature data and sent to the controller; S3: The controller controls the heater to generate heat according to the control signal and controls the opening and closing degree of the solenoid valve, so that the multiple discharge units of the first discharge module and the second discharge module are heated to the temperature corresponding to the temperature data. S4: The step-up transformer raises the grid voltage to the same level as the voltage inside the high-voltage switchgear according to the preset voltage level, and transmits it to the first discharge module and the second discharge module, so that the first discharge module and the second discharge module generate nitrate after partial discharge. S5: After waiting for the preset time, the staff will perform electron spectrometry analysis on the nitrates on the first and second discharge modules to determine the corrosion status of the metal parts inside the high-voltage switchgear.

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