Circuit board assembly structure and method of manufacturing same, antenna structure

Abstract

The application provides a manufacturing method of a circuit board assembly structure, comprising the following steps: providing a circuit board, wherein the circuit board comprises a core plate and a side plate, the core plate is flexible, and the circuit board is provided with a setting area and a bending area; setting an opening in the bending area, and exposing part of the core plate at the bottom of the opening; bending the part of the core plate exposed at the bottom of the opening, so that the setting area is correspondingly set; setting a plurality of electronic components in the setting area, and obtaining the circuit board assembly structure. The manufacturing method provided by the application has the advantages of high fault tolerance and high efficiency. In addition, the application also provides a circuit board assembly structure and an antenna structure.

Description

Technical Field

[0001] This application relates to a circuit board assembly structure and its manufacturing method, and an antenna structure. Background Technology

[0002] In general, the circuit boards in a mobile phone antenna structure can be stacked in a sandwich configuration to make full use of available space. The circuit board assembly structure designed using this sandwich configuration mainly includes a top circuit board, a bottom circuit board, and a support frame, with the support frame connecting the top and bottom circuit boards. Electronic components on the top and / or bottom circuit boards can be housed within the support frame.

[0003] However, the aforementioned sandwich stacking method places high demands on the flatness, alignment accuracy, and dimensions of the top circuit board, bottom circuit board, and even the support frame. Even slight warping or shrinkage in certain areas can reduce the reliability of the circuit board assembly structure. Furthermore, this sandwich stacking method involves a long process and is difficult to manufacture, which is detrimental to improving production efficiency. Summary of the Invention

[0004] In view of the above, it is necessary to provide a method for manufacturing a circuit board assembly structure to solve the above problems.

[0005] In addition, it is necessary to provide a circuit board assembly structure.

[0006] In addition, it is necessary to provide an antenna structure.

[0007] A method for manufacturing a circuit board assembly structure includes the following steps: providing a circuit board substrate, the circuit board substrate including a core board and side plates disposed on the core board, the core board being flexible. The circuit board substrate is divided into a first setting area, a second setting area, a first bending area, and a second bending area, the first setting area and the second setting area being spaced apart. The first bending area is connected between the first setting area and the second setting area, and the second bending area is connected to the end of the second setting area away from the first bending area. A first opening is provided in the first bending area, exposing a portion of the core board at the bottom of the first opening, and a second opening is provided in the second bending area, exposing a portion of the core board at the bottom of the second opening. The portion of the core board exposed at the bottom of the first opening is bent such that the first setting area faces the second setting area. The portion of the core board exposed at the bottom of the second opening is bent such that the portion of the core board exposed at the bottom of the second opening is connected to the first setting area, and a plurality of first electronic components are disposed on the side of the first setting area facing the second setting area. A plurality of second electronic components are disposed on the side of the second setting area facing the first setting area, thereby obtaining the circuit board assembly structure.

[0008] Furthermore, the method includes the steps of: disposing of a plurality of third electronic components on the side of the first setting area away from the second setting area, and disposing of a plurality of fourth electronic components on the side of the second setting area away from the first setting area.

[0009] Furthermore, the method includes the step of: setting a slot in the first setting area corresponding to the second bending area, and accommodating one end of the core board exposed at the bottom of the second opening within the slot.

[0010] Furthermore, the circuit board further includes at least one third bending region, the third bending region being connected to the first setting region, and the third bending region being offset from the first bending region and the second bending region. The manufacturing method further includes: providing a third opening in the third bending region, with a portion of the core board exposed at the bottom of the third opening. The core board exposed at the bottom of the third opening is bent such that the end of the core board exposed at the bottom of the third opening, away from the first setting region, is connected to the second setting region.

[0011] Furthermore, the circuit board further includes at least one fourth bending region, the fourth bending region being connected to the second setting region, and the fourth bending region being offset from the first bending region and the second bending region. The manufacturing method further includes: providing a fourth opening in the fourth bending region, with a portion of the core board exposed at the bottom of the fourth opening. The core board exposed at the bottom of the fourth opening is bent such that the end of the core board exposed at the bottom of the fourth opening, away from the second setting region, is connected to the first setting region.

[0012] Further, the method for manufacturing the circuit board includes: providing a core board, the core board including a metal layer, an inner substrate layer, and an inner circuit layer, the inner substrate layer being disposed between the metal layer and the inner circuit layer; disposing an adhesive layer on the inner circuit layer; and disposing a side plate on the adhesive layer, the side plate including a plurality of outer substrate layers and a plurality of outer circuit layers, the outer substrate layers and the outer circuit layers being alternately stacked on the adhesive layer to obtain the circuit board.

[0013] A circuit board assembly structure includes a circuit board substrate, a plurality of first electronic components, and a plurality of second electronic components. The circuit board substrate includes a core board and side plates disposed on the core board, the core board being flexible. The circuit board substrate is divided into a first setting area, a second setting area, a first bending area, and a second bending area. The first setting area and the second setting area are spaced apart, the first bending area connects the first setting area and the second setting area, and the second bending area is disposed at the end of the second setting area away from the first bending area. The first bending area has a first opening, and the second bending area has a second opening, with a portion of the core board exposed at the bottom of the first opening and the second opening. The first setting area and the second setting area are disposed opposite each other, the portion of the core board exposed at the first opening connects the first setting area and the second setting area, and the portion of the core board exposed at the second opening connects the first setting area away from the first bending area. The first electronic components are disposed on the side of the first setting area facing the second setting area, and the second electronic components are disposed on the side of the second setting area facing the first setting area.

[0014] Furthermore, the first setting area is provided with a slot corresponding to the second bending area, and the core board portion exposed at the bottom of the second opening is accommodated in the slot.

[0015] Furthermore, the core board includes a metal layer, an inner substrate layer, and an inner circuit layer, wherein the inner substrate layer is disposed between the metal layer and the inner circuit layer.

[0016] An antenna structure comprising the circuit board assembly structure described above.

[0017] Compared to existing technologies, the method for manufacturing a circuit board assembly structure provided in this application exposes a flexible core board within a bending region (e.g., a first opening and a second opening) by creating openings in the bending region (e.g., a first bending region and a second bending region). Then, by bending the core board exposed in the openings, a "sandwich" structure of the circuit board assembly structure can be formed. The entire manufacturing process is simple and suitable for batch operations. Moreover, the method of bending the first setting area towards the second setting area does not require high flatness of the core board and side plates, which helps to improve the fault tolerance rate of the process of manufacturing the circuit board assembly structure. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the circuit board provided in one embodiment of this application.

[0019] Figure 2 for Figure 1 The diagram shows a circuit board with the first and second openings.

[0020] Figure 3 for Figure 2 The diagram shown is a schematic diagram of the circuit board after the first electronic component and the second electronic component are installed.

[0021] Figure 4 This is an overall schematic diagram of a circuit board assembly structure provided in an embodiment of this application.

[0022] Figure 5 This is a cross-sectional schematic diagram of a metal plate provided in an embodiment of this application.

[0023] Figure 6 for Figure 5 The diagram shows a cross-section of the metal plate after the first inner through hole is provided.

[0024] Figure 7 This is a cross-sectional schematic diagram of a core board intermediate provided in an embodiment of this application.

[0025] Figure 8 for Figure 7 The diagram shows a cross-section of the core board intermediate body after the second inner through hole is provided.

[0026] Figure 9 This is a cross-sectional schematic diagram of a core board provided in an embodiment of this application.

[0027] Figure 10 for Figure 1 The diagram shows a cross-sectional view of the circuit board along line II.

[0028] Figure 11 for Figure 2 The diagram shows a cross-sectional view of the circuit board along line II-II.

[0029] Figure 12 for Figure 3 The diagram shows a cross-sectional view of the circuit board along line III-III.

[0030] Explanation of main component symbols

[0031] Circuit board assembly structure 100

[0032] First Setting Area 101

[0033] Second setting area 102

[0034] First bend zone 103

[0035] Second bend zone 104

[0036] Circuit board 10

[0037] Core board 11

[0038] Metal layer 111

[0039] First inner through hole 111a

[0040] 111b copper-clad substrate

[0041] Inner substrate layer 111c

[0042] Copper foil layer 111d

[0043] Core board intermediate 111e

[0044] Second inner through hole 111f

[0045] Inner conduction body 111h

[0046] Inner circuit layer 112

[0047] Side panel 12

[0048] Outer substrate layer 121

[0049] Outer line layer 122

[0050] Adhesive layer 113

[0051] First opening 21

[0052] Second opening 22

[0053] First electronic component 31

[0054] Second electronic component 32

[0055] Third electronic component 33

[0056] Fourth electronic component 34

[0057] Thickness direction D

[0058] Extended surface S

[0059] Accommodation space R

[0060] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0061] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0062] Please see Figures 1 to 12 This application provides a method for manufacturing a circuit board assembly structure 100, which is generally sandwich-shaped. The manufacturing method includes the following steps:

[0063] S1: Please see Figure 1 and Figure 10 A circuit board 10 is provided. The circuit board 10 includes a core board 11 and two side plates 12. The two side plates 12 are respectively disposed on opposite sides of the core board 11. The core board 11 is a flexible board, and the side plates 12 are rigid boards. It can be understood that in other embodiments of this application, the number of side plates 12 may also be one.

[0064] The circuit board 10 has a thickness direction D and an extension surface S perpendicular to the thickness direction D. Within the extension surface S, the circuit board 10 is divided into a first setting area 101, a second setting area 102, a first bending area 103, and a second bending area 104. The first setting area 101 and the second setting area 102 are spaced apart. The first bending area 103 is connected between the first setting area 101 and the second setting area 102. The second bending area 104 is connected to the end of the second setting area 102 away from the first bending area 103.

[0065] In other embodiments of this application, the circuit board 10 is further divided into at least one third bending area (not shown) within the extended surface S. The third bending area is connected to the first setting area 101, and the third bending area is offset from the first bending area 103 and the second bending area 104.

[0066] In other embodiments of this application, within the extended surface S, the circuit board 10 further divides at least one fourth bending region (not shown), the fourth bending region is connected to the second setting region 102, and the fourth bending region is offset from the first bending region 103 and the second bending region 104.

[0067] In this embodiment, please refer to Figures 9 to 11 In step S1, the manufacturing method of the circuit board 10 includes the following steps:

[0068] S11: Please refer to Figure 9 A core board 11 is provided, the core board 11 including a metal layer 111 and inner circuit layers 112 disposed on opposite sides of the metal layer 111. By selecting the metal layer 111, not only is the flexibility of the core board 11 improved, but the structural strength of the circuit board assembly structure 100 is also enhanced.

[0069] In this embodiment, please refer to Figures 5 to 9 In step S11, the manufacturing method of the core board 11 includes the following steps:

[0070] S111: Please refer to Figure 5A metal layer 111 is provided. The material of the metal layer 111 includes at least one selected from iron alloy, aluminum alloy, and copper alloy.

[0071] S112: Please refer to Figure 6 A plurality of first inner through holes 111a are provided on the metal layer 111, and the first inner through holes 111a penetrate the metal layer 111.

[0072] S113: Please see Figure 7 A copper-clad substrate 111b is provided on opposite sides of the metal layer 111. The copper-clad substrate 111b includes an inner substrate layer 111c and a copper foil layer 111d. The inner substrate layer 111c is disposed between the metal layer 111 and the copper foil layer 111d. Part of the inner substrate layer 111c is filled into the first inner through hole 111a to obtain the core board intermediate 111e.

[0073] S114: Please see Figure 8 A second inner through hole 111f is provided on the core board intermediate body 111e. The second inner through hole 111f penetrates the copper clad substrate 111b and the metal layer 111. The second inner through hole 111f is provided corresponding to the first inner through hole 111a (that is, the second inner through hole 111f is provided in the first inner through hole 111a).

[0074] S115: Please refer to Figure 9 An electroplated layer (not shown) is provided on the copper foil layer 111d. The electroplated layer fills the second inner through hole 111f to form an inner conductor 111h. The inner conductor 111h is electrically connected to the two copper foil layers 111d disposed on opposite sides of the metal layer 111.

[0075] S116: Please see again Figure 9 The electroplated layer and the copper foil layer 111d are etched to form the inner circuit layer 112, thereby obtaining the core board 11.

[0076] S12: Please refer to Figure 10 An adhesive layer 113 is provided on each of the inner circuit layers 112. The adhesive layer 113 is made of ABF (Ajinomoto Build-up Film).

[0077] S13: Please see again Figure 10A side plate 12 is disposed on each of the adhesive layers 113. The side plate 12 includes a plurality of outer substrate layers 121 and a plurality of outer circuit layers 122. The outer substrate layers 121 and the outer circuit layers 122 are alternately stacked on the adhesive layers 113 to obtain the circuit board 10. The material of the outer substrate layers 121 is the same as that of the adhesive layers 113.

[0078] S2: Please see Figure 2 and Figure 11 A first opening 21 is provided in the first bending area 103, and the first opening 21 penetrates the side plate 12 (that is, each side plate 12 is provided with one first opening 21, and two first openings 21 are provided correspondingly). Part of the core plate 11 is exposed at the bottom of the first opening 21 (that is, the opposite sides of part of the core plate 11 are exposed at the bottom of the two corresponding first openings 21). A second opening 22 is provided in the second bending area 104, and the second opening 22 penetrates the side plate 12 (that is, each side plate 12 is provided with one second opening 22, and two second openings 22 are provided correspondingly). Part of the core plate 11 is exposed at the bottom of the second opening 22 (that is, the opposite sides of part of the core plate 11 are exposed at the bottom of the two corresponding second openings 22).

[0079] In this embodiment, please refer to Figure 11 Step S2 also includes:

[0080] S21: A slot 101a is provided in the first setting area 101.

[0081] In other embodiments of this application, step S2 further includes the step:

[0082] S22: A third opening (not shown) is provided in the third bending area, the third opening penetrates the side plate 12 (that is, each side plate 12 is provided with a third opening, and two third openings are provided correspondingly), and part of the core plate 11 is exposed at the bottom of the third opening.

[0083] In other embodiments of this application, step S2 further includes the step:

[0084] S23: A fourth opening (not shown) is provided in the fourth bending area. The fourth opening penetrates the side plate 12 (that is, each side plate 12 is provided with a fourth opening, and two fourth openings are provided correspondingly). Part of the core plate 11 is exposed at the bottom of the fourth opening.

[0085] S3: Please see Figure 3 and Figure 12A plurality of first electronic components 31 are disposed on one side of the first setting area 101, and a plurality of second electronic components 32 are disposed on one side of the second setting area 102. The first electronic components 31 and the second electronic components 32 are disposed on the same side of the circuit board 10.

[0086] In this embodiment, please refer to Figure 3 and Figure 12 Step S3 further includes the following steps:

[0087] S31: A plurality of third electronic components 33 are disposed on the other side of the first setting area 101, and a plurality of fourth electronic components 34 are disposed on the other side of the second setting area 102, wherein the third electronic components 33 and the fourth electronic components 34 are disposed on the other side of the circuit board 10.

[0088] S4: Please see Figure 4 The core board 11 exposed at the bottom of the first opening 21 is bent approximately 180 degrees, so that the first setting area 101 is generally oriented towards the second setting area 102; and the core board 11 exposed at the bottom of the second opening 22 is bent to connect to the first setting area 101, thus obtaining the circuit board assembly structure 100. The first setting area 101, the first bending area 103, the second setting area 102, and the second bending area 104 are sequentially arranged to form an accommodating space R (i.e., the first setting area 101, the second setting area 102, the first bending area 103, and the second bending area 104 generally form a "sandwich" structure circuit board assembly structure 100), with the first electronic component 31 and the second electronic component 32 facing towards the accommodating space R. The third electronic component 33 and the fourth electronic component 34 are oriented away from the accommodating space R. The two ends of the accommodating space R in the circuit board assembly structure 100 (i.e., the two ends of the first bending area 103 and the second bending area 104 are offset) are connected to the external environment, thereby facilitating the heat dissipation of the first electronic component 31 and the second electronic component 32 disposed in the accommodating space R.

[0089] In this embodiment, please refer to Figure 4 and Figure 12 Step S4 further includes the following steps:

[0090] S41: The portion of the core plate 11 exposed at the bottom of the second opening 22, away from the second setting area 102, is placed in the slot 101a, thereby increasing the stability of the connection between the core plate 11 and the second setting area 102 and improving the structural stability of the accommodating space R.

[0091] In other embodiments of this application, step S4 further includes the step:

[0092] S42: The core plate 11 exposed at the bottom of the third opening is bent (i.e., the core plate 11 exposed at the bottom of the third opening is bent at approximately 90 degrees) such that the core plate 11 exposed at the bottom of the third opening is connected to the second setting area 102.

[0093] In other embodiments of this application, step S4 further includes the step:

[0094] S43: The core plate 11 exposed at the bottom of the fourth opening is bent (i.e., the core plate 11 exposed at approximately 90 degrees from the fourth opening) such that the core plate 11 exposed at the bottom of the fourth opening is connected to the first setting area 101.

[0095] Compared to existing technologies, the manufacturing method of the circuit board assembly structure 100 provided in this application exposes the flexible core board 11 within the bending area (e.g., the first bending area 103 and the second bending area 104) by providing openings (e.g., the first opening 21 and the second opening 22). Then, by bending the core board 11 exposed in the openings, the circuit board assembly structure 100 with a "sandwich" structure can be formed. The entire manufacturing process is simple and suitable for batch operations. Moreover, the method of setting the first setting area 101 towards the second setting area 102 by bending does not have high requirements for the flatness of the core board 11 and the side plate 12, which helps to improve the fault tolerance rate of the manufacturing process of the circuit board assembly structure 100.

[0096] Please see Figure 12 and Figure 4This application also provides a circuit board assembly structure 100, which includes a circuit board substrate 10, a first electronic component 31, and a second electronic component 32. The circuit board substrate 10 includes a core board 11 and a side plate 12 disposed on the core board 11, and the core board 11 is flexible. The circuit board substrate 10 is divided into a first setting area 101, a second setting area 102, a first bending area 103, and a second bending area 104. The first setting area 101 is spaced apart from the second setting area 102, the first bending area 103 is connected between the first setting area 101 and the second setting area 102, and the second bending area 104 is disposed at the end of the second setting area 102 away from the first setting area 101. The first bending area 103 has a first opening 21, and the second bending area 104 has a second opening 22, with a portion of the core board 11 exposed at the bottom of the first opening 21 and the second opening 22. The first setting area 101 and the second setting area 102 are correspondingly arranged. The core board 11 exposed at the first opening 21 is connected between the first setting area 101 and the second setting area 102. The end of the core board 11 exposed at the second opening 22, away from the second setting area 102, is connected to the end of the first setting area 101 away from the first bending area 103. The first electronic component 31 is disposed on the side of the first setting area 101 facing the second setting area 102, and the second electronic component 32 is disposed on the side of the second setting area 102 facing the first setting area 101.

[0097] This application embodiment also provides an antenna structure (not shown), the antenna structure including a circuit board body and a circuit board assembly structure 100 connected to the circuit board body. The circuit board assembly structure 100 includes a circuit board substrate 10, a first electronic component 31 and a second electronic component 32. The circuit board substrate 10 includes a core board 11 and a side plate 12 disposed on the core board 11. The core board 11 includes a metal layer 111. The first electronic component 31 and the second electronic component 32 include at least one of a chip, an inductor, a resistor, and a capacitor.

[0098] In addition, those skilled in the art may make other changes within the spirit of this application. Of course, all such changes made in accordance with the spirit of this application should be included within the scope of protection claimed in this application.

Claims

1. A method for manufacturing a circuit board assembly structure, characterized in that, Including steps: A circuit board is provided, the circuit board including a core board and a side plate disposed on the core board, the core board being flexible, the circuit board being divided into a first setting area, a second setting area, a first bending area, a second bending area, at least one third bending area and at least one fourth bending area, the first setting area and the second setting area being spaced apart, the first bending area being connected between the first setting area and the second setting area, the second bending area being connected to the end of the second setting area away from the first bending area, the third bending area being connected to the first setting area and being offset from the first bending area and the second bending area, and the fourth bending area being connected to the second setting area and being offset from the first bending area and the second bending area. A first opening is provided in the first bending area, and a portion of the core board is exposed at the bottom of the first opening; a second opening is provided in the second bending area, and a portion of the core board is exposed at the bottom of the second opening; a third opening is provided in the third bending area, and a portion of the core board is exposed at the bottom of the third opening; and a fourth opening is provided in the fourth bending area, and a portion of the core board is exposed at the bottom of the fourth opening. A slot is provided in the first setting area corresponding to the second bending area; A plurality of first electronic components are disposed on one side of the first setting area, and a plurality of second electronic components are disposed on one side of the second setting area; The core board is bent at the bottom exposed portion of the first opening, such that the first setting area faces the second setting area; the core board is bent at the bottom exposed portion of the second opening, such that the core board at the bottom exposed portion of the second opening is connected to the first setting area, and one end of the core board at the bottom exposed portion of the second opening is accommodated in the slot; the core board is bent at the bottom exposed portion of the third opening, such that the end of the core board at the bottom exposed portion of the third opening away from the first setting area is connected to the second setting area; and the core board is bent at the bottom exposed portion of the fourth opening, such that the end of the core board at the bottom exposed portion of the fourth opening away from the second setting area is connected to the first setting area, thereby obtaining the circuit board assembly structure.

2. The manufacturing method as described in claim 1, characterized in that, It also includes the following steps: A plurality of third electronic components are disposed on the side of the first setting area opposite to the second setting area, and a plurality of fourth electronic components are disposed on the side of the second setting area opposite to the first setting area.

3. The manufacturing method as described in claim 1, characterized in that, The method for manufacturing the circuit board includes: A core board is provided, the core board including a metal layer, an inner substrate layer and an inner circuit layer, the inner substrate layer being disposed between the metal layer and the inner circuit layer; An adhesive layer is provided on the inner circuit layer; A side plate is disposed on the adhesive layer. The side plate includes multiple outer substrate layers and multiple outer circuit layers. The outer substrate layers and the outer circuit layers are alternately stacked on the adhesive layer to obtain the circuit substrate.

4. A circuit board assembly structure, characterized in that, Includes a circuit board, multiple first electronic components, and multiple second electronic components. The circuit board includes a core board and side plates disposed on the core board. The core board is flexible. The circuit board is divided into a first setting area, a second setting area, a first bending area, a second bending area, at least one third bending area, and at least one fourth bending area. The first setting area and the second setting area are spaced apart. The first bending area is connected between the first setting area and the second setting area. The second bending area is disposed at the end of the second setting area away from the first bending area. The third bending area is connected to the first setting area and is offset from the first bending area and the second bending area. The fourth bending area is connected to the second setting area and is offset from the first bending area and the second bending area. The first bending area has a first opening, the second bending area has a second opening, the third bending area has a third opening, and the fourth bending area has a fourth opening. Part of the core board is exposed at the bottom of the first opening, the second opening, the third opening, and the fourth opening. The first setting area and the second setting area are arranged opposite to each other. The core board exposed at the first opening is connected between the first setting area and the second setting area. The core board exposed at the second opening is connected to the first setting area away from the first bending area. The end of the core board exposed at the third opening away from the first setting area is connected to the second setting area. The end of the core board exposed at the fourth opening away from the second setting area is connected to the first setting area. The first setting area is provided with a slot corresponding to the second bending area, and the core board portion exposed at the bottom of the second opening is accommodated in the slot; The first electronic component is disposed on the side of the first setting area facing the second setting area, and the second electronic component is disposed on the side of the second setting area facing the first setting area.

5. The circuit board assembly structure as described in claim 4, characterized in that, The core board includes a metal layer, an inner substrate layer, and an inner circuit layer, wherein the inner substrate layer is disposed between the metal layer and the inner circuit layer.

6. An antenna structure, characterized in that, Includes the circuit board assembly structure as described in any one of claims 4 to 5.

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