An ultraviolet laser drilling method and system for ceramic surface stress detection

Abstract

The application provides a kind of UV laser drilling method and system for ceramic surface stress detection, comprising: strain gauge processing path and ceramic processing path are designed in advance in control terminal;When the processing position of the ceramic surface to be measured is pasted with strain gauge, and the strain gauge is connected with strain gauge collector, laser engraving machine processes strain gauge according to strain gauge processing path, until strain gauge etches through hole;When the current strain data read by strain collector is stable, the current strain data is cleared, and the laser engraving machine drills the processing position of the ceramic surface to be measured according to the ceramic processing path, and the strain gauge collector collects the strain data during drilling.The application first etches through hole in strain gauge according to strain gauge processing path, clears strain collector, and then drills the processing position of the ceramic surface to be measured, reduces the influence of strain gauge thermal effect on measurement data, and improves the accuracy of blind hole method for testing ceramic tile surface residual stress.

Description

Technical Field

[0001] This invention relates to the field of ceramic technology, and in particular to an ultraviolet laser drilling method and system for detecting stress on ceramic surfaces. Background Technology

[0002] During the manufacturing process of ceramic materials, uneven plastic deformation often occurs due to factors such as uneven mechanical deformation, temperature changes, and phase transformations. After the external forces are removed, the residual plastic deformation exerts its effect on the material, resulting in corresponding elastic deformation within the material to maintain the equilibrium of the component and generating internal stress, known as internal stress. This internal stress exists over a large area of ​​the material and is considered uniform. The associated internal forces and moments remain in equilibrium across all cross-sections of the object; this type of internal stress is called residual stress. The presence of residual stress makes the material prone to deformation and cracking during use, affecting its service life.

[0003] The blind hole method, as an effective residual stress detection method, is well-established in the application of metallic materials. Its principle involves drilling a small hole in the material surface with a drill bit to release the stress at the measurement point. The magnitude of the released residual stress is then calculated by measuring the deformation sensed by a strain gauge. However, due to the high hardness and wear resistance of ceramic materials, ordinary drill bits cannot be used for drilling. Even using diamond drill bits results in inaccurate measurements due to excessive heat generation. Related technologies have proposed using laser engraving machines to drill holes in ceramics. This involves attaching strain gauges to the ceramic processing location and using a strain gauge acquisition device to collect strain data. However, the laser processing proceeds gradually from the strain gauge to the ceramic beneath it. When the laser etches a hole in the strain gauge, the strain gauge experiences irreversible numerical disturbances due to thermal effects, causing significant fluctuations in the strain value. These fluctuations may be irreversible, affecting the accuracy of subsequent measurement data.

[0004] Therefore, existing technologies have shortcomings and need to be improved and developed. Summary of the Invention

[0005] Therefore, it is necessary to provide an ultraviolet laser drilling method and system for ceramic surface stress detection to address the problem of inaccurate ceramic strain data measurement during ceramic surface stress detection.

[0006] The technical solution adopted by this invention to solve the technical problem is as follows:

[0007] An ultraviolet laser drilling method for detecting stress on ceramic surfaces is disclosed. This method is based on an ultraviolet laser drilling system, which includes a laser engraving machine, a strain gauge acquisition instrument, and a control terminal connected to the laser engraving machine. The method includes:

[0008] The strain gauge processing path and ceramic processing path are pre-designed in the control terminal;

[0009] When a strain gauge is attached to the processing location on the ceramic surface to be tested, and the strain gauge is connected to the strain gauge acquisition instrument, the laser engraving machine processes the strain gauge according to the processing path of the strain gauge until the strain gauge is etched with a through hole;

[0010] Once the strain data read by the strain gauge stabilizes, the current strain data is cleared to zero. The laser engraving machine then drills holes at the processing positions on the ceramic surface to be tested according to the ceramic processing path, and the strain gauge acquirer collects the strain data during drilling.

[0011] Optionally, the first aperture corresponding to the strain gauge processing path is larger than the second aperture corresponding to the ceramic processing path.

[0012] Optionally, the path design diagram corresponding to the strain gauge processing path includes: a first circle with the first aperture as its diameter, and first equally spaced filling lines corresponding to two or more angles in the first circle.

[0013] Optionally, the laser engraving machine processes the strain gauge according to the strain gauge processing path until a through hole is etched into the strain gauge, including:

[0014] The laser engraving machine processes the strain gauge sequentially using the first equally spaced filling lines corresponding to each angle in the first circle as the processing path until the strain gauge is etched with through holes.

[0015] Optionally, the path design diagram corresponding to the ceramic processing path includes: a second circle with the second aperture as its diameter, and two or more equal-spaced filling lines corresponding to two angles in the second circle and offset equal-spaced filling lines based on the second equal-spaced filling lines;

[0016] The second equally spaced fill line and the offset equally spaced fill line corresponding to each angle are arranged in parallel.

[0017] Optionally, the laser engraving machine drills holes at the processing positions on the ceramic surface to be tested according to the ceramic processing path, including:

[0018] The laser engraving machine uses the second equally spaced filling lines and offset equally spaced filling lines corresponding to each angle in the second circle as the processing path to drill holes at the processing positions on the ceramic surface to be tested.

[0019] Optionally, multiple sets of offset equally spaced fill lines are provided for each angle, and each set of offset equally spaced fill lines has a different offset distance from the corresponding second equally spaced fill line;

[0020] The ultraviolet laser drilling method for detecting stress on ceramic surfaces further includes:

[0021] When processing using the second equally spaced fill line and the offset equally spaced fill line corresponding to each angle as the processing path, processing is performed according to the processing path corresponding to the second equally spaced fill line;

[0022] After the processing of the second equally spaced filling line is completed, when the preset interval time is reached, the processing is carried out according to the processing path corresponding to each group of offset equally spaced filling lines, with the preset interval time between the processing of each group of offset equally spaced filling lines.

[0023] After completing the processing of the offset equally spaced fill lines of each group, when the preset interval time is reached, the processing path corresponding to the second equally spaced fill line of the next angle is processed.

[0024] Optionally, after the strain data read by the strain gauge stabilizes, the current strain data is cleared to zero, and the laser engraving machine drills holes at the processing positions on the ceramic surface to be tested according to the ceramic processing path. The strain gauge acquirer collects the strain data during drilling. The process also includes:

[0025] The laser engraving machine performs multiple cycles of processing on the surface of the ceramic to be tested according to the described ceramic processing path until an etched hole of the preset depth is obtained.

[0026] Optionally, while the laser engraving machine drills holes at the processing positions on the ceramic surface to be tested according to the ceramic processing path, it also includes:

[0027] A gas tube or nozzle is fixed at the processing location on the ceramic surface to be tested, and high-pressure gas is introduced to continuously cool the processing location.

[0028] The present invention also discloses an ultraviolet laser drilling system, the system comprising:

[0029] Control terminal, used to design strain gauge processing paths and ceramic processing paths;

[0030] A laser engraving machine, connected to the control terminal, is used to process strain gauges according to the processing path of the strain gauges when strain gauges are attached to the processing position on the surface of the ceramic to be tested and the strain gauges are connected to the strain gauge acquisition instrument, until the strain gauges are etched with through holes; and to drill holes at the processing position on the surface of the ceramic to be tested according to the ceramic processing path.

[0031] The strain gauge acquisition instrument is used to clear the current strain data to zero after the current strain data is stabilized, and to acquire strain data during drilling.

[0032] The beneficial effects of this invention are as follows: The ultraviolet laser drilling method for detecting stress on ceramic surfaces is based on an ultraviolet laser drilling system, which includes a laser engraving machine, a strain gauge acquisition instrument, and a control terminal connected to the laser engraving machine. The method includes: pre-designing a strain gauge processing path and a ceramic processing path in the control terminal; when a strain gauge is attached to the processing position on the ceramic surface to be tested and connected to the strain gauge acquisition instrument, the laser engraving machine processes the strain gauge according to the strain gauge processing path until a through hole is etched into the strain gauge; after the current strain data read by the strain acquisition instrument stabilizes, the current strain data is cleared to zero, and the laser engraving machine drills a hole at the processing position on the ceramic surface to be tested according to the ceramic processing path, while the strain gauge acquisition instrument collects the strain data during drilling. This invention reduces the influence of the strain gauge's thermal effect on the measurement data by first etching a through hole into the strain gauge according to the strain gauge processing path, clearing the strain acquisition instrument, and then drilling a hole at the processing position on the ceramic surface to be tested, thereby improving the accuracy of the blind hole method for testing residual stress on ceramic tile surfaces. Attached Figure Description

[0033] Figure 1 This is a flowchart of a preferred embodiment of the ultraviolet laser drilling method for detecting stress on ceramic surfaces in this invention.

[0034] Figure 2 These are two sets of equidistant filling lines with included angles of 45° and 135° within the horizontal lines in the strain gauge processing path of this invention.

[0035] Figure 3 This is a schematic diagram of the processing path from step one to step four in a specific embodiment of the ultraviolet laser drilling method for detecting stress on ceramic surfaces in this invention.

[0036] Figure 4 This is a schematic diagram of the processing path after the processing paths of the first to sixteenth steps are superimposed together in a specific embodiment of the ultraviolet laser drilling method for detecting ceramic surface stress in this invention. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0038] The method of using a laser engraving machine to drill holes in ceramics has the following problems: 1. In the established processing method, the laser processing proceeds from the strain gauge to the ceramic underneath. However, when the laser etches a hole in the strain gauge, the strain gauge will experience irreversible numerical disturbances due to thermal effects, causing significant fluctuations in the strain value. These fluctuations may be irreversible, affecting the accuracy of subsequent measurement data. 2. Because the maximum outer diameter of the circular ring processed by the laser remains unchanged for each layer, when processing to the ceramic base layer, the laser will still sweep across the edge of the etched strain gauge, causing significant thermal effects on the strain gauge and resulting in large fluctuations in the strain value. 1. It is irreversible and affects the accuracy of subsequent measurement data; 2. In order to obtain a better drilling effect, the spacing of the filling lines inside the processing trajectory is set to 0.01mm. The filling lines are relatively tight, but a large number of single processing trajectories can easily lead to excessive heat effect in each processing, which will also cause large fluctuations in strain value. The fluctuations may be irreversible and affect the accuracy of subsequent measurement data; 3. The method of using the ceramic material to be tested to reduce the heat effect during laser processing by placing it above the ice box is not very effective, because the ice box can only reduce the temperature of the back of the ceramic material, but the laser processing is processing the upper part of the ceramic material to be tested. It is characterized by short heating time, narrow heating area, and rapid attenuation in the depth direction, so the temperature rise on the back of the tile is not large.

[0039] To address the aforementioned deficiencies in existing technologies, this invention provides an ultraviolet laser drilling method for detecting stress on ceramic surfaces. This method reduces the thermal effects during laser drilling and improves the reliability of test values ​​for residual stress on ceramic brick surfaces using the blind hole method.

[0040] Please see Figure 1 The ultraviolet laser drilling method for detecting stress on ceramic surfaces according to embodiments of the present invention includes the following steps:

[0041] Step S100: Design the strain gauge processing path and ceramic processing path in advance in the control terminal.

[0042] Specifically, the ultraviolet laser drilling method for detecting stress on ceramic surfaces in this application embodiment is implemented based on an ultraviolet laser drilling system, which includes a laser engraving machine, a strain gauge acquisition instrument, and a control terminal connected to the laser engraving machine. The strain gauge processing path and the ceramic processing path are edited and drawn in the control terminal. Both the strain gauge processing path and the ceramic processing path consist of circles and equidistant filled lines within those circles.

[0043] In one embodiment, the first aperture corresponding to the strain gauge processing path is larger than the second aperture corresponding to the ceramic processing path.

[0044] Specifically, the diameter of the circle in the strain gauge processing path is larger than the diameter of the circle in the tile processing path, with a difference of 0.2 mm or more. Furthermore, the diameter of the circle in the strain gauge processing path does not exceed the allowable drilling range of the strain gauge. Assuming that the diameter of the circle when drilling the tile during stress testing is set to 2 mm and the maximum allowable drilling range of the strain gauge is 3 mm, the diameter of the circle when drilling the strain gauge can be set between 2.2 and 3 mm.

[0045] In this way, the embodiments of this application avoid the overlap of the circle of the strain gauge processing path and the circle of the tile processing path, so that when processing to the ceramic substrate in the later stage, the laser will not sweep across the edge of the strain gauge being etched, which has a smaller impact on the thermal effect generated by the strain gauge and improves the accuracy of subsequent measurement data.

[0046] like Figure 1 As shown, the ultraviolet laser drilling method for detecting stress on ceramic surfaces further includes the following steps:

[0047] Step S200: When a strain gauge is attached to the processing position on the ceramic surface to be tested, and the strain gauge is connected to the strain gauge acquisition instrument, the laser engraving machine processes the strain gauge according to the strain gauge processing path until the strain gauge is etched with a through hole.

[0048] In one embodiment, the path design diagram corresponding to the strain gauge processing path includes: a first circle with the first aperture as its diameter, and first equally spaced filling lines corresponding to two or more angles in the first circle.

[0049] For example, the spacing between the equidistant fill lines within the circle in the strain gauge machining path is set to 0.1 mm, and two or more sets of equidistant fill lines at a certain angle are set, such as two sets of equidistant fill lines with angles of 45° and 135° to the horizontal line; the horizontal line is the baseline, such as... Figure 2 As shown in the prior art, the spacing between the fill lines inside the machining trajectory is set to 0.01mm, resulting in relatively dense fill lines. However, a large number of machining trajectories per cycle can lead to excessive thermal effects in each machining operation, causing significant fluctuations in strain values. These fluctuations may be irreversible, affecting the accuracy of subsequent measurement data. This embodiment of the application sets the distance between the fill lines to be sparser, resulting in fewer machining trajectories per cycle. To achieve better drilling results, two or more sets of equidistant fill lines at a certain angle are set, which reduces the thermal effects generated in a single machining operation while ensuring the drilling effect.

[0050] In one embodiment, the laser engraving machine processes the strain gauge according to the strain gauge processing path until the strain gauge is etched with a through hole. Specifically, the laser engraving machine processes the strain gauge sequentially using the first equally spaced filling lines corresponding to each angle in the first circle as the processing path until the strain gauge is etched with a through hole.

[0051] Specifically, when drilling the strain gauge, the strain gauge is processed multiple times according to the strain gauge processing path, with a fixed interval time set, for example, processing once according to the strain gauge processing path every 1 second; until a through hole is etched into the strain gauge. In this embodiment, the processing path is sequentially based on the first equally spaced filling lines corresponding to each angle in the first circle, which reduces the thermal effect generated by a single processing and improves the accuracy of subsequent ceramic stress testing.

[0052] like Figure 1 As shown, the ultraviolet laser drilling method for detecting stress on ceramic surfaces further includes the following steps:

[0053] Step S300: After the current strain data read by the strain acquisition instrument stabilizes, the current strain data is cleared to zero. The laser engraving machine drills holes at the processing positions on the ceramic surface to be tested according to the ceramic processing path, and the strain gauge acquisition instrument collects the strain data during drilling.

[0054] Specifically, after the strain gauge etches a through-hole, a waiting period is required for the thermal effect of the strain gauge to dissipate. Once the strain data read by the strain gauge acquisition instrument stabilizes, it is zeroed before drilling proceeds to the processing location on the ceramic surface to be tested. In one embodiment, the strain gauge acquisition instrument can perform operations such as starting, zeroing, and calculation via host computer software. Because in existing technologies, laser processing progresses from the strain gauge to the ceramic beneath it, but when the laser etches a hole in the strain gauge, the strain gauge experiences irreversible numerical disturbances due to thermal effects, causing significant fluctuations in the strain value. These fluctuations may be irreversible, affecting the accuracy of subsequent measurement data. Therefore, this embodiment of the application zeroes the strain data generated when the strain gauge etches a hole, ensuring that the strain gauge test data does not affect subsequent testing of the ceramic surface to be tested, thus improving the accuracy of the measurement data.

[0055] In one embodiment, the path design diagram corresponding to the ceramic processing path includes: a second circle with the second aperture as its diameter, and second equally spaced filling lines corresponding to two or more angles in the second circle and offset equally spaced filling lines based on the second equally spaced filling lines, wherein the second equally spaced filling lines and the offset equally spaced filling lines corresponding to each angle are arranged in parallel.

[0056] Specifically, in the tile processing path, the circles and the equidistant fill lines within the circles are set into multiple groups, with each group of circles having the same diameter, and the equidistant fill lines within each group of circles are superimposed in sequence.

[0057] For example, the processing graphics for each step in the tile processing path are as follows:

[0058] The first step is to draw a circle with a diameter of 2mm, and draw equally spaced fill lines with a line spacing of 0.2mm inside the circle, with an angle of 0 degrees to the horizontal line, dividing the circle into equal parts;

[0059] The second step is to draw a circle with a diameter of 2mm, and draw equally spaced fill lines with a line spacing of 0.2mm inside the circle, with an angle of 0 degrees to the horizontal line, offset by 0.05mm from the first step.

[0060] The third step is to draw a circle with a diameter of 2mm, and draw equally spaced fill lines with a line spacing of 0.2mm inside the circle, with an angle of 0 degrees to the horizontal line, offset by 0.1mm from the first step.

[0061] Step 4: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 0 degrees to the horizontal line, offset by 0.15mm from the first step.

[0062] Step 5: Draw a circle with a diameter of 2mm, and fill it with equally spaced lines with a spacing of 0.2mm, at an angle of 45 degrees to the horizontal line, dividing the circle into equal parts;

[0063] Step 6: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 45 degrees to the horizontal line, offset by 0.05mm from the level in step 5.

[0064] Step 7: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 45 degrees to the horizontal line, offset by 0.1mm from the level in step 5.

[0065] Step 8: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 45 degrees to the horizontal line, offset by 0.15mm from the level in step 5.

[0066] Step 9: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at a 90-degree angle to the horizontal line, dividing the circle into equal parts.

[0067] Step 10: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at a 90-degree angle to the horizontal line, offset by 0.05mm from the level in step 9.

[0068] Step 11: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 90 degrees to the horizontal line, offset by 0.1mm from the level of step 9.

[0069] Step 12: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 90 degrees to the horizontal line, offset by 0.15mm from the level in step 9.

[0070] Step 13: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 135 degrees to the horizontal line, and divide the circle into equal parts.

[0071] Step 14: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 135 degrees to the horizontal line, offset by 0.05mm from the step 13.

[0072] Step 15: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 135 degrees to the horizontal line, offset by 0.1mm from the step 13.

[0073] Step 16: Draw a circle with a diameter of 2mm. Inside the circle, draw equally spaced fill lines with a line spacing of 0.2mm, at an angle of 135 degrees to the horizontal line, offset by 0.15mm from the step 13.

[0074] like Figure 3 and Figure 4 As shown, Figure 3 This is a schematic diagram of the processing path from step one to step four. Figure 4 This is a schematic diagram of the processing path after the processing paths from step one to step sixteen are superimposed.

[0075] In one embodiment, the laser engraving machine drills holes at the processing positions on the ceramic surface to be tested according to the ceramic processing path, including: the laser engraving machine sequentially uses the second equally spaced filling lines and offset equally spaced filling lines corresponding to each angle in the second circle as the processing path to drill holes at the processing positions on the ceramic surface to be tested.

[0076] In this embodiment of the application, when drilling holes at the processing positions on the ceramic surface to be tested, the processing is carried out according to the ceramic processing path. The processing path is sequentially based on the second equally spaced filling lines and offset equally spaced filling lines corresponding to each angle in the second circle. This reduces the thermal effect generated by a single processing and improves the accuracy of subsequent ceramic stress testing.

[0077] In one embodiment, multiple sets of offset equally spaced fill lines are provided for each angle, and each set of offset equally spaced fill lines has a different offset distance from the corresponding second equally spaced fill line. The ultraviolet laser drilling method for detecting stress on ceramic surfaces further includes:

[0078] When processing using the second equally spaced fill line and the offset equally spaced fill line corresponding to each angle as the processing path, processing is performed according to the processing path corresponding to the second equally spaced fill line;

[0079] After the processing of the second equally spaced filling line is completed, when the preset interval time is reached, the processing is carried out according to the processing path corresponding to each group of offset equally spaced filling lines, with the preset interval time between the processing of each group of offset equally spaced filling lines.

[0080] After completing the processing of the offset equally spaced fill lines of each group, when the preset interval time is reached, the processing path corresponding to the second equally spaced fill line of the next angle is processed.

[0081] Specifically, a timer is inserted at the interval of each processing step, that is, after completing one processing step, a certain period of time is waited before processing the next step.

[0082] In this embodiment, the spacing between the fill lines is made sparser, resulting in fewer processing trajectories per pass. To achieve better drilling results, two or more sets of equidistant fill lines at a certain angle and offset equidistant fill lines are set, which reduces the thermal effect generated in a single pass while ensuring the drilling effect.

[0083] In one embodiment, step S300 further includes: the laser engraving machine performs multiple cyclic processing on the processing position of the ceramic surface to be tested according to the ceramic processing path until an etched hole of a preset depth is obtained.

[0084] For example, by repeating steps one through sixteen multiple times, the drilling process continues until the desired hole depth is reached. A preferred number of cycles is 40, resulting in a hole depth of approximately 0.5 mm. This embodiment of the application reduces the heat generated during a single drilling operation while ensuring optimal drilling results.

[0085] In one embodiment, while the laser engraving machine drills holes at the processing position on the ceramic surface to be tested according to the ceramic processing path, it also includes fixing an air pipe or air nozzle at the processing position on the ceramic surface to be tested, introducing high-pressure gas, and continuously cooling the processing position with air.

[0086] In this embodiment, air cooling is used during processing. Specifically, an air pipe or nozzle is fixed at the drilling location, and high-pressure gas is introduced to continuously cool the drilling location. In the prior art, the ceramic material to be tested is placed above an ice box to reduce the thermal effect during laser processing, but this is less effective. This embodiment uses air cooling, which improves the cooling effect and reduces the impact of thermal effects.

[0087] This invention reduces the thermal effects during laser drilling and improves the reliability of test values ​​for residual stress on ceramic tile surfaces using the blind hole method.

[0088] In one embodiment, based on the above-described ultraviolet laser drilling method for detecting ceramic surface stress, the present invention also provides an ultraviolet laser drilling system, comprising:

[0089] The control terminal is used to design strain gauge processing paths and ceramic processing paths, as described above.

[0090] A laser engraving machine, connected to the control terminal, is used to process strain gauges according to the processing path of the strain gauges when strain gauges are attached to the processing position on the ceramic surface to be tested and the strain gauges are connected to the strain gauge acquisition instrument, until the strain gauges are etched with through holes; and to drill holes at the processing position on the ceramic surface to be tested according to the ceramic processing path, as described above.

[0091] The strain gauge acquisition instrument is used to clear the current strain data to zero after the current strain data is stabilized, and to acquire strain data during drilling, as described above.

[0092] In summary, this invention discloses an ultraviolet laser drilling method and system for detecting stress on ceramic surfaces. The ultraviolet laser drilling method for detecting stress on ceramic surfaces is based on an ultraviolet laser drilling system, which includes a laser engraving machine, a strain gauge acquisition instrument, and a control terminal connected to the laser engraving machine. The method includes: pre-designing a strain gauge processing path and a ceramic processing path in the control terminal; when a strain gauge is attached to the processing position on the ceramic surface to be tested and the strain gauge is connected to the strain gauge acquisition instrument, the laser engraving machine processes the strain gauge according to the strain gauge processing path until a through hole is etched into the strain gauge; when the current strain data read by the strain acquisition instrument stabilizes, the current strain data is cleared to zero, and the laser engraving machine drills the hole at the processing position on the ceramic surface to be tested according to the ceramic processing path, while the strain gauge acquisition instrument collects the strain data during drilling. This invention reduces the impact of strain gauge thermal effects on measurement data and improves the accuracy of the blind hole method for testing residual stress on ceramic brick surfaces by first etching through holes in the strain gauge according to the strain gauge processing path, zeroing the strain acquisition instrument, and then drilling holes at the processing positions on the ceramic surface to be tested.

[0093] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An ultraviolet laser drilling method for ceramic surface stress detection, the ultraviolet laser drilling method for ceramic surface stress detection being realized based on an ultraviolet laser drilling system, characterized by, The ultraviolet laser drilling system comprises a laser engraving machine, a strain gauge collector, and a control terminal connected with the laser engraving machine. The method comprises the following steps: Designing a strain gauge processing path and a ceramic processing path in the control terminal in advance; When a strain gauge is pasted on a processing position of a ceramic surface to be measured and the strain gauge is connected with the strain gauge collector, the laser engraving machine processes the strain gauge according to the strain gauge processing path until the strain gauge etches a through hole; When the current strain data read by the strain gauge collector is stable, the current strain data is cleared, the laser engraving machine drills the processing position of the ceramic surface to be measured according to the ceramic processing path, and the strain gauge collector collects the strain data during drilling; 2. The UV laser drilling method for ceramic surface stress detection according to claim 1, characterized by, The first aperture corresponding to the strain gauge processing path is larger than the second aperture corresponding to the ceramic processing path.

3. The UV laser drilling method for ceramic surface stress detection according to claim 2, characterized by, The path design diagram corresponding to the strain gauge processing path comprises a first circle with the first aperture as the diameter and first equidistant filling lines corresponding to two or more angles in the first circle. The laser engraving machine processes the strain gauge according to the strain gauge processing path until the strain gauge etches a through hole, which comprises the following steps:

4. The UV laser drilling method for ceramic surface stress detection according to claim 1, characterized by, The laser engraving machine processes the strain gauge according to the first equidistant filling lines corresponding to each angle in the first circle as the processing path until the strain gauge etches a through hole. The path design diagram corresponding to the ceramic processing path comprises a second circle with the second aperture as the diameter, second equidistant filling lines corresponding to two or more angles in the second circle, and offset equidistant filling lines based on the second equidistant filling lines; 5. The UV-laser drilling method for ceramic surface stress detection according to claim 4, characterized in that, The second equidistant filling lines and the offset equidistant filling lines corresponding to each angle are arranged in parallel. The laser engraving machine drills the processing position of the ceramic surface to be measured according to the ceramic processing path, which comprises the following steps:

6. The UV laser drilling method for ceramic surface stress detection according to claim 5, characterized by, The laser engraving machine drills the processing position of the ceramic surface to be measured according to the second equidistant filling lines and the offset equidistant filling lines corresponding to each angle in the second circle as the processing path. Each offset equidistant filling line corresponding to an angle is provided in multiple groups, and each group of offset equidistant filling lines has a different offset distance from the corresponding second equidistant filling line. The ultraviolet laser drilling method for ceramic surface stress detection further comprises the following steps: When processing according to the second equidistant filling lines and the offset equidistant filling lines corresponding to each angle as the processing path, processing according to the processing path corresponding to the second equidistant filling line; When the processing of the second equidistant filling line is completed, when a preset interval time is reached, processing according to the processing path corresponding to each group of offset equidistant filling lines, and the processing processes of each group of offset equidistant filling lines are separated by the preset interval time; When the processing of each group of offset equidistant filling lines is completed, when a preset interval time is reached, processing according to the processing path corresponding to the second equidistant filling line of the next angle.

7. The UV laser drilling method for ceramic surface stress detection according to claim 1, wherein, When the current strain data read by the strain gauge collector is stable, the current strain data is cleared, the laser engraving machine drills the processing position on the surface of the ceramic to be tested according to the ceramic processing path, the strain gauge collector collects the strain data during drilling, and the method further comprises the steps of: The laser engraving machine repeatedly processes the processing position on the surface of the ceramic to be tested according to the ceramic processing path until an etching hole with a preset hole depth is obtained.

8. The UV laser drilling method for ceramic surface stress detection according to claim 1, wherein, When the laser engraving machine drills the processing position on the surface of the ceramic to be tested according to the ceramic processing path, the method further comprises the steps of: A gas pipe or a gas nozzle is fixed at the processing position on the surface of the ceramic to be tested, and high-pressure gas is introduced to continuously cool the processing position.

9. An ultraviolet laser drilling system, characterized by, The system adopts the method according to any one of claims 1-8 to drill holes, and the system comprises: A control terminal is used to design a strain gauge processing path and a ceramic processing path; A laser engraving machine is connected to the control terminal, and is used to process the strain gauge according to the strain gauge processing path when the strain gauge is pasted at the processing position on the surface of the ceramic to be tested and the strain gauge is connected to the strain gauge collector, until a through hole is etched on the strain gauge; and drill the processing position on the surface of the ceramic to be tested according to the ceramic processing path; The strain gauge collector is used to clear the current strain data when the current strain data read is stable, and collect the strain data during drilling.

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