A horizontal alignment device and method for tile RF assembly electrical interconnect structures

Abstract

The present application relates to the alignment of the electrical interconnection structure of a radio frequency assembly, and in particular to a horizontal alignment device and method for the electrical interconnection structure of a tile radio frequency assembly, comprising a base for placing the component to be aligned, the base containing the component to be aligned through a positioning cavity, and a positioning plate arranged at the positioning cavity; the base is provided with a plurality of horizontal abutting components, a plurality of horizontal adjusting components, and a plurality of pressing components for pressing the component to be aligned. The base simulates the packaging box body, ensuring that the alignment between the cover plate of the tile component to be aligned and the upper substrate is consistent with the actual assembly state, and the alignment precision is high; during the horizontal alignment process, the operation logic is clear, and it is convenient to observe, and only three degrees of freedom are needed to complete the adjustment of X, Y and the rotation angle around the Z axis, and the efficiency is high; through the adjustment of the horizontal abutting component and the pressing component, the pressure acting on the upper substrate is controlled, and damage caused by the operation process is avoided.

Description

Technical Field

[0001] This invention relates to the alignment process of electrical interconnect structures of radio frequency (RF) components, and more specifically to a horizontal alignment device and method for the electrical interconnect structure of tile-type RF components. Background Technology

[0002] With the continuous improvement of performance and installation requirements for electronic devices such as radar and communication equipment, integration and thinning have become development trends. Radio frequency (RF) components are gradually evolving from two-dimensional planar integration to three-dimensional integration. Due to their advantages in integration density and low profile, tile-type RF components are gradually replacing brick-type RF components and are widely used in electronic devices.

[0003] Tile-type RF components have the following characteristics:

[0004] (1) Its planar dimensions need to match the antenna aperture, which limits the area of ​​a single-layer circuit. In order to meet the needs of more functions and performance improvement, it is usually necessary to carry out multi-layer circuit stacking layout, and set up a vertical interconnection structure between the circuits to ensure their electrical connection;

[0005] (2) In order to improve its environmental adaptability and reliability, the radio frequency components need to be hermetically sealed to isolate the bare chip inside the component from the external environment and prevent the bare chip from being contaminated or corroded by harmful gases.

[0006] (3) In order to minimize the thickness of the RF components, while meeting the needs of power supply, control and RF transmission, and to improve the convenience of RF components being installed and removed from the equipment, elastic contact connectors such as hair buttons are usually used to realize the electrical interconnection between the RF components and the RF motherboard.

[0007] Patent CN202110239036.5 discloses an integration method for a three-dimensional tile-type TR module using snap fasteners. This TR module has two substrates inside the package housing, with the upper and lower substrates electrically interconnected using snap fasteners. The upper substrate is first welded to a cover plate, and then the entire assembly is laser-sealed to the package housing to achieve hermetic packaging of the TR module. Electrical interconnection between the TR module and an external RF motherboard also typically uses snap fasteners. Thus, the upper substrate must be precisely aligned with both the internal and external snap fasteners. The alignment of the upper substrate with the cover plate is a critical step. Current methods use the edges of the upper substrate and cover plate as a reference, aligning them visually and manually adjusting their relative positions until they are roughly aligned before welding them together. This method suffers from low production efficiency, poor alignment accuracy, inconsistent performance, and low yield. Misalignment often leads to signal failures, increasing costs and reducing product quality.

[0008] It is evident that existing horizontal alignment schemes for electrical interconnects of radio frequency components still have problems that urgently need to be addressed. Optimization is necessary to improve alignment accuracy and resolve issues such as low production efficiency, high cost, and low product quality. Therefore, a more reasonable technical solution is required to address the technical problems existing in the current technology. Summary of the Invention

[0009] To overcome at least one of the aforementioned defects, this invention proposes a horizontal alignment method and apparatus for a tile-type radio frequency component electrical interconnect structure. The apparatus uses an adjustment structure to adjust and align the horizontal position of the component to be aligned, ensuring alignment accuracy and maintaining the aligned state. The operation is simple and quick, and does not damage the component to be aligned.

[0010] To achieve the above objectives, the alignment device disclosed in this invention can adopt the following technical solution:

[0011] A horizontal alignment device for a tile-type radio frequency component electrical interconnect structure includes a base for placing a component to be aligned, the base accommodating the component to be aligned through a positioning cavity, and a positioning plate disposed at the positioning cavity; the base is provided with a plurality of horizontal clamping components along the X and Y directions for elastically clamping the component to be aligned, and a plurality of horizontal adjusting components along the X and Y directions for adjusting the component to be aligned and maintaining alignment, and a plurality of clamping components for pressing the component to be aligned.

[0012] The aforementioned horizontal alignment device uses the base as the center of alignment coordination, places the part to be aligned in the positioning cavity, uses the horizontal clamping component to elastically clamp in both the X and Y directions, and adjusts in both the X and Y directions by the horizontal adjustment component to move and adjust the upper substrate to achieve alignment with the upper and lower structures.

[0013] Furthermore, the structure of the positioning cavity is the same as the packaging box structure of the component to be aligned. Placing the cover plate inside the positioning cavity has the same effect as placing it inside the packaging box. Therefore, after alignment via the positioning cavity, the component to be aligned can be precisely placed inside the packaging box. There are multiple ways to implement the positioning of the cover plate within the positioning cavity, and it is not limited to a single method. Here, we optimize and propose one feasible option: the positioning cavity is provided with a positioning structure that cooperates with the component to be aligned. The positioning structure includes at least two positioning parts. With this approach, the two positioning parts can be symmetrically arranged within the positioning cavity to facilitate better positioning of the positioning plate. In some solutions, a greater number of positioning parts can be provided. Simultaneously, the positioning structure can employ a configuration of positioning pins and positioning holes.

[0014] Furthermore, this invention uses a horizontal clamping assembly to clamp the part to be aligned, while simultaneously satisfying dynamic clamping during horizontal adjustment. The structure of the horizontal clamping assembly can be constructed in various forms and is not limited to a single one. Here, we optimize and propose one feasible option: The horizontal clamping assembly includes a connecting part that is fixedly fitted with the base. A pin is telescopically disposed within the connecting part, and a clamping elastic member is also disposed within the connecting part to apply elastic force to the pin. The clamping elastic member applies elastic force to the pin, causing the front end of the pin to extend from the front port of the connecting part, and the pin supports and clamps the part to be aligned. The rear end of the pin extends from the rear port of the connecting part and is provided with a limiting stop. With this solution, the connecting part forms a cylindrical structure to accommodate the pin. The front end of the pin can be constructed as a spherical surface to facilitate contact and apply force to the part to be aligned, reducing excessive pressure on the surface of the part to be aligned, which could damage the part. The limiting stop can be a blocking block, blocking head, or other structure, with an outer diameter larger than the inner diameter of the cylindrical structure of the connecting part, thereby preventing the pin from falling off the connecting part.

[0015] Furthermore, in this invention, a horizontal adjustment component is used to adjust the horizontal position of the part to be aligned, thereby achieving alignment of the upper substrate within the part to be aligned and ultimately ensuring the accuracy of the processing. The horizontal adjustment component can be constructed in various ways and is not limited to a single structure. Here, an optimized and feasible option is proposed: the horizontal adjustment component includes an adjustment rod, which rotatably engages with an adjustment seat and rotatably pushes the part to be aligned along the X or Y direction. The adjustment rod is also equipped with an adjustment head for holding and operating. With this design, the adjustment rod and adjustment seat can be threaded together, allowing the adjustment rod to axially approach or move away from the part to be aligned during rotation. To improve adjustment accuracy, a fine-pitch thread can be used, and an indicator scale can be provided on the adjustment rod to indicate the feed amount.

[0016] Furthermore, in this invention, the clamping assembly clamps the part to be aligned longitudinally. To improve the ease of operation while ensuring the clamping effect, various clamping assembly structures can be adopted. Here, we optimize and propose one feasible option: The clamping assembly includes a rotating shaft connected to the base. The rotating shaft drives a clamping sleeve to deflect synchronously. The clamping sleeve is provided with a pressure rod and a clamping elastic element that applies elastic force to the pressure rod. The front end of the pressure rod is clamped by the clamping elastic element and extends from the lower port of the clamping sleeve. The rear end of the pressure rod extends from the upper port of the clamping sleeve, and a limiting anti-detachment element is provided at the rear end of the pressure rod. When adopting this scheme, the limiting anti-detachment element can be an anti-detachment block, anti-detachment head, or other structures, with an outer diameter larger than the inner diameter of the clamping sleeve, thereby preventing the pressure rod from falling off the clamping sleeve.

[0017] Furthermore, the options for setting the rotating shaft are not limited to a single one. Here, we propose one feasible option: the base is provided with mounting holes for installing the rotating shaft and fixing holes for receiving the pressure rod. When the clamping assembly is not engaged with the part to be aligned, the rotating shaft is rotated so that the front end of the pressure rod engages with the fixing hole. With this approach, a bearing can be installed in the mounting hole to connect the rotating shaft, enabling its rotation. To improve the clamping reliability of the clamping assembly on the part to be aligned, a damping bearing can be used to maintain the deflection angle after the rotating shaft has deflected to a set angle.

[0018] Furthermore, radio frequency components generally include a closed housing, within which a lower substrate, a snap fastener, an upper substrate, and a cover plate are arranged from bottom to top. The upper substrate and the lower substrate are connected by the snap fastener. Due to the need to meet the positioning and alignment requirements of the upper substrate, the lower substrate, and the cover plate, as well as the airtight connection requirements between the cover plate and the closed housing, the upper substrate and the cover plate are usually connected first to form an integral structure. In this invention, the cover plate and the upper substrate are separated for preliminary alignment operations and optimized to propose the following structure that facilitates positioning: The component to be aligned includes a cover plate and an upper substrate arranged from bottom to top. An annular limiting baffle is also arranged around the outside of the upper substrate. The upper substrate is provided with several positioning pads, and the positioning plate is provided with several first positioning holes corresponding to the positioning pads. Several second positioning holes corresponding to the positioning pads are provided at the bottom of the receiving cavity. When the component to be aligned is aligned in the positioning cavity, the first positioning holes and the second positioning holes are aligned with the positioning pads. When this solution is adopted, the cover plate is placed below the upper substrate, and a positioning plate is placed above the upper substrate. An inverted structure is used, which improves the convenience of positioning and alignment and subsequent processing and connection.

[0019] Furthermore, in this invention, after the alignment of the components to be aligned is completed, the base and the components to be aligned are treated as a whole. The base assists in fixing the components to be aligned and performs subsequent docking processing. After processing, the aligned components are disassembled from the base. Here, an optimization is proposed, and one feasible option is: the positioning cavity is provided with several disassembly holes, which are used to remove the aligned components from the positioning cavity after alignment. When adopting this scheme, the number of disassembly holes can be set to multiple, and they can be distributed on the base according to disassembly requirements.

[0020] The above content discloses the composition and structure of the horizontal alignment device. The present invention also provides a method for horizontal alignment, which will be described below.

[0021] A method for horizontal alignment of a tile-type radio frequency component electrical interconnect structure, employing the horizontal alignment device mentioned above, includes:

[0022] The component to be aligned is placed in the positioning cavity, wherein a welding sheet is placed between the cover plate and the upper substrate, and a limiting baffle surrounds the upper substrate.

[0023] Set a positioning plate and make the positioning plate match the positioning structure of the base;

[0024] Observe the alignment of the positioning pads of the upper substrate with the first positioning hole of the positioning plate, and adjust the position of the upper substrate by using the horizontal adjustment component to achieve alignment;

[0025] By observing the alignment of the positioning pads of the upper substrate with the second positioning hole of the base, the alignment adjustment is completed when the positioning pads are aligned with both the first and second positioning holes. If the positioning pads cannot be aligned, it indicates that there is a problem with the upper substrate structure.

[0026] The alignment method mentioned above can adjust the upper substrate in the horizontal direction to align the upper substrate with the positioning plate. At the same time, due to the position restriction of the upper substrate by the limiting baffle and the position restriction of the receiving cavity by the cover plate, the upper substrate can also be aligned with the cover plate, thus achieving overall alignment between the upper substrate and the cover plate.

[0027] Furthermore, after the upper substrate is aligned and adjusted, a clamping assembly is set to clamp the positioning plate, and the entire alignment device and the aligned component are transferred to the welding equipment for welding; after welding, the aligned component is disassembled through the disassembly hole.

[0028] Compared with the prior art, some of the beneficial effects of the technical solution disclosed in this invention include:

[0029] 1) The present invention simulates the package of the tile-type RF component by using the base of the horizontal alignment device, ensuring that the alignment between the cover plate and the upper substrate of the tile-type RF component is consistent with the actual assembly state, with high alignment accuracy and the yield rate increased from less than 50% to more than 95%.

[0030] 2) In the horizontal alignment process, the operation logic of this invention is clear and easy to observe. Only 3 degrees of freedom are needed to adjust the X, Y and rotation angles around the Z axis. The time to complete one alignment is shortened from about 5 minutes to 1-2 minutes.

[0031] 3) The present invention can control the pressure acting on the upper substrate (generally a ceramic substrate) by adjusting the spring force of the spring assembly and the vertical clamping assembly, thereby avoiding damage caused by excessive pressure during operation. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of a tile-type radio frequency component structure;

[0034] Figure 2 This is a cross-sectional view of a tile-type radio frequency component;

[0035] Figure 3 This is a schematic diagram of the principle of the horizontal alignment device for electrical interconnection structure (including a hierarchical diagram from bottom to top);

[0036] Figure 4 This is a schematic diagram of the substrate clamping state of the horizontal alignment device for the electrical interconnect structure;

[0037] Figure 5 This is a schematic diagram of the relaxed state of the substrate of the electrical interconnect structure horizontal alignment device;

[0038] Figure 6 This is an exploded view of the stacked portion of the horizontal alignment device for the electrical interconnect structure;

[0039] Figure 7 This is a top view of the base structure.

[0040] Figure 8 This is an exploded view of the horizontally pushing component;

[0041] Figure 9 This is a cross-sectional view of the clamping assembly;

[0042] Figure 10 This is a schematic diagram of the horizontal adjustment component.

[0043] In the above attached figures, the meanings of each number are as follows:

[0044] 1. RF component; 11. Package housing; 12. Lower substrate; 13. Upper substrate; 131. Positioning pad; 14. Cover plate; 15. Hair button; 2. Base; 21. Positioning cavity; 22. Positioning pin; 23. Mounting hole; 24. Fixing hole; 25. Removal hole; 26. Second positioning hole; 3. Positioning plate; 31. First positioning hole; 32. First pin hole; 4. Horizontal adjustment assembly; 41. Adjustment seat; 42. Adjustment head; 5. Horizontal clamping assembly; 51. Connecting part; 52. Clamping elastic element; 53. Ejector pin; 54. Limiting and blocking element; 6. Pressing assembly; 61. Rotating shaft; 62. Pressure rod; 63. Pressing elastic element; 64. Limiting and anti-detachment element; 7. Limiting baffle; 71. Second pin hole. Detailed Implementation

[0045] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments.

[0046] In view of the fact that the existing technology has problems such as complicated alignment operation of radio frequency components, low operation efficiency, poor product yield, and difficulty in reducing production costs, the following embodiments are optimized to improve the defects of the existing technology.

[0047] Example 1

[0048] like Figures 3-6 As shown, this embodiment provides a horizontal alignment device for a tile-type radio frequency component electrical interconnect structure, including a base 2 for placing the component to be aligned. The base 2 accommodates the component to be aligned through a positioning cavity 21, and a positioning plate 3 is provided at the positioning cavity 21. The base 2 is provided with a plurality of horizontal clamping components 5 along the X and Y directions for elastically clamping the component to be aligned, and a plurality of horizontal adjusting components 4 along the X and Y directions for adjusting the component to be aligned and keeping it aligned. A plurality of clamping components 6 are also provided for pressing the component to be aligned.

[0049] Preferably, in this embodiment, two horizontal clamping components 5 are provided in both the X and Y directions; two horizontal adjustment components 4 are provided in the X direction and one horizontal adjustment component 4 is provided in the Y direction; at the same time, four pressing components 6 are provided on the base 2 and are evenly distributed in the four directions of the part to be aligned.

[0050] The horizontal alignment device disclosed in this embodiment uses the base 2 as the center for alignment coordination. The component to be aligned is placed in the positioning cavity 21, and the horizontal clamping component 5 provides elastic clamping in both the X and Y directions. Simultaneously, the horizontal adjustment component 4 adjusts the upper substrate 13 in both the X and Y directions to achieve alignment with the upper and lower layers. In this embodiment, the tile-type component to be aligned is 50mm in both length and width; the upper substrate 13 is an LTCC substrate with a thickness of 1.4mm; and the cover plate 14 is made of silicon-aluminum material with a thickness of 1.2mm.

[0051] The structure of the positioning cavity 21 is the same as that of the packaging box 11 of the part to be aligned. Placing the cover plate 14 inside the positioning cavity 21 has the same effect as placing the cover plate 14 inside the packaging box 11. Therefore, after positioning through the positioning cavity 21, the part to be aligned can be accurately placed inside the packaging box 11. There are multiple ways to place the cover plate 14 inside the positioning cavity 21 for positioning, and it is not limited to a single method. This embodiment optimizes and adopts one feasible option: such as... Figure 7As shown, a positioning structure is provided at the positioning cavity 21 and cooperates with the part to be aligned. The positioning structure includes at least two positioning parts. When this scheme is adopted, the two positioning parts can be symmetrically arranged in the positioning cavity 21 to facilitate better positioning of the positioning plate 3. In some schemes, more positioning parts can be provided. At the same time, the positioning structure can adopt a structure in which the positioning pin 22 cooperates with the positioning hole.

[0052] Preferably, in this embodiment, the base 2 is configured as a square structure, and the receiving cavity on it is also configured as a square semi-hole structure. The positioning part includes a pin structure disposed on the edge of the receiving cavity. When the positioning plate 3 is placed on the base 2, the pin structure cooperates with the corresponding positioning groove or positioning hole on the positioning plate 3, thereby achieving precise positioning of the positioning plate 3. In this embodiment, the positioning pin 22 is integrally machined with the base 2 to ensure that the positional tolerance between the positioning pin 22 and the positioning cavity 21 is ±0.01mm, minimizing tolerance accumulation. The positioning plate 3 is provided with two first pin holes 32, which cooperate with the positioning pin 22 to ensure accurate positional relationship between the base 2 and the positioning plate 3.

[0053] In this embodiment, the horizontal clamping component 5 clamps the part to be aligned, while simultaneously satisfying dynamic clamping during horizontal adjustment. The structure of the horizontal clamping component 5 can be constructed in various forms, and its structure is not limited to a single one. This embodiment optimizes and adopts one feasible option: such as Figure 8 As shown, the horizontal clamping assembly 5 includes a connecting portion 51 that is fixedly fitted to the base 2. A pin 53 is telescopically disposed within the connecting portion 51, and a clamping elastic member 52 is also disposed within the connecting portion 51 to apply elastic force to the pin 53. The clamping elastic member 52 applies elastic force to the pin 53, causing the front end of the pin 53 to extend from the front port of the connecting portion 51, and the pin 53 supports and clamps against the part to be aligned. The rear end of the pin 53 extends from the rear port of the connecting portion 51 and is provided with a limiting stop member 54. With this design, the connecting portion 51 forms a cylindrical structure to accommodate the pin 53. The front end of the pin 53 can be constructed as a spherical surface to facilitate contact and apply force to the part to be aligned, reducing excessive pressure on the surface of the part to be aligned, which could damage the part. The limiting stop member 54 can be a blocking block, blocking head, or similar structure, with an outer diameter larger than the inner diameter of the cylindrical structure of the connecting portion 51, thereby preventing the pin 53 from falling off the connecting portion 51.

[0054] Preferably, the limiting stop 54 is a nut, which is detachably mounted at the rear end of the ejector pin 53 via a threaded connection. Furthermore, the position of the nut can be adjusted to change the elastic deformation of the clamping elastic element 52, thereby altering the clamping force; in this embodiment, the clamping elastic element 52 is a spring.

[0055] In this embodiment, the horizontal adjustment component 4 is used to adjust the horizontal position of the component to be aligned, thereby achieving alignment of the upper substrate 13 within the component to be aligned and ultimately ensuring the accuracy of the processing; such as Figure 10 As shown, the horizontal adjustment component 4 can be constructed in various ways, and is not limited to a single structure. This embodiment optimizes and adopts one feasible option: the horizontal adjustment component 4 includes an adjustment rod, which is rotatably engaged with an adjustment seat 41 and rotates to push the part to be aligned along the X or Y direction. The adjustment rod is also provided with an adjustment head 42 for holding and operating. With this scheme, the adjustment rod and the adjustment seat 41 can be threaded together, and the adjustment rod axially approaches or moves away from the part to be aligned during rotation. To improve the adjustment accuracy, a fine thread can be provided, and an indicator scale can be provided on the adjustment rod to indicate the feed amount.

[0056] Preferably, in this embodiment, since the cover plate 14 remains stationary, the relative positional relationship between the upper substrate 13 and the cover plate 14 can be adjusted arbitrarily until the first positioning hole 31 is completely aligned with the pad. This ensures an alignment accuracy better than ±0.1mm, meeting the assembly requirements of tile-type components to be aligned.

[0057] In this embodiment, the clamping assembly 6 clamps the part to be aligned longitudinally. To improve the ease of operation while ensuring the clamping effect, various clamping assembly 6 structures can be used. This embodiment optimizes and adopts one feasible option: such as... Figure 9 As shown, the clamping assembly 6 includes a rotating shaft 61 connected to the base 2. The rotating shaft 61 drives a clamping sleeve to rotate synchronously. The clamping sleeve contains a pressure rod 62 and a clamping elastic element 63 that applies elastic force to the pressure rod 62. The front end of the pressure rod 62 is clamped by the clamping elastic element 63 and extends out from the lower port of the clamping sleeve. The rear end of the pressure rod 62 extends out from the upper port of the clamping sleeve, and a limiting anti-detachment element 64 is provided at the rear end of the pressure rod 62. When adopting this scheme, the limiting anti-detachment element 64 can be an anti-detachment block, anti-detachment head, or other structures, with an outer diameter larger than the inner diameter of the clamping sleeve, thereby preventing the pressure rod 62 from falling off the clamping sleeve.

[0058] The design of the rotating shaft 61 is not limited to a single approach. This embodiment optimizes the design and adopts one feasible option: the base 2 is provided with a mounting hole 23 for mounting the rotating shaft 61 and a fixing hole 24 for receiving the pressure rod 62. When the clamping assembly 6 is not engaged with the part to be aligned, the rotating shaft 61 is rotated so that the front end of the pressure rod 62 engages with the fixing hole 24. With this design, a bearing can be installed in the mounting hole 23 to connect the rotating shaft 61 and enable its rotation. To improve the clamping reliability of the clamping assembly 6 on the part to be aligned, a damping bearing can be used to ensure that the rotating shaft 61 maintains its deflection angle after deflecting to a set angle.

[0059] like Figure 1 , Figure 2 As shown, the radio frequency component 1 generally includes a closed housing. Inside the closed housing, from bottom to top, a lower substrate 12, a snap fastener, an upper substrate 13, and a cover plate 14 are arranged, wherein the upper substrate 13 and the lower substrate 12 are connected by snap fasteners 15. Due to the need to meet the alignment requirements of the upper substrate, lower substrate, and cover plate, as well as the airtight connection requirement between the cover plate and the closed housing, the upper substrate 13 and the cover plate 14 are usually connected first to form an integral structure. In this invention, the cover plate 14 and the upper substrate 13 are separately removed for preliminary alignment operations, and optimized to propose the following... The structure facilitates positioning: The component to be aligned includes a cover plate 14 and an upper substrate 13 arranged from bottom to top. An annular limiting baffle is also arranged around the outer side of the upper substrate 13. The upper substrate 13 is provided with several positioning pads 131. The positioning plate 3 is provided with several first positioning holes 31 corresponding to the positioning pads 131. Several second positioning holes 26 corresponding to the positioning pads 131 are provided at the bottom of the receiving cavity. When the component to be aligned is aligned in the positioning cavity 21, the first positioning holes 31 and the second positioning holes 26 are aligned with the positioning pads 131. With this arrangement, the cover plate 14 is positioned below the upper substrate 13, and the positioning plate 3 is positioned above the upper substrate 13, employing an inverted structure. This arrangement improves the convenience of positioning alignment and subsequent processing and connection.

[0060] Preferably, the limiting baffle 7 is provided with two second pin holes 71, which cooperate with the positioning pin 22 to achieve coarse positioning of the base 2 and the limiting baffle 7. For ease of installation, the positioning pin 22 and the second pin holes 71 are designed to have a clearance fit, with a single-sided clearance of 0.05mm. In this embodiment, the single-sided clearance between the inner contour of the limiting baffle 7 and the outer contour of the upper substrate 13 is 0.25mm, which ensures sufficient adjustment margin while controlling the adjustment range and saving adjustment time.

[0061] Preferably, in this embodiment, the positioning plate 3 is provided with four sets of first positioning holes 31. The first positioning holes 31 are used to simulate the position of the button 15 inside the tile-type radio frequency component 1. The positional tolerance between the first positioning holes 31 and the first pin holes 32 on the positioning plate 3 is ±0.01mm to minimize tolerance accumulation. In this embodiment, the positioning plate 3 is made of hard aluminum LY12, and the first positioning holes 31 with a diameter of Φ0.8mm are precision-machined by laser. For easy observation, the upper edge of the first positioning holes 31 is chamfered at C0.3 to avoid visual discrepancies caused by excessive hole depth.

[0062] In this embodiment, after the alignment of the components to be aligned is completed, the base 2 and the aligned components are treated as a whole. The base 2 assists in fixing the aligned components and performing subsequent docking processing. After processing is completed, the processed components are disassembled from the base 2. This embodiment optimizes and adopts one feasible option: the positioning cavity 21 is provided with a plurality of disassembly holes 25. The disassembly holes 25 are used to remove the processed components from the positioning cavity 21 after alignment is completed. When adopting such a scheme, the number of disassembly holes 25 can be set to multiple and distributed on the base 2 according to disassembly requirements.

[0063] This embodiment achieves a horizontal alignment accuracy of better than ±0.1mm for the electrical interconnection structure of the tile-type RF component 1, ensuring good electrical interconnection between the upper and lower substrates inside the tile-type RF component 1, as well as between the tile-type RF component 1 and the external RF motherboard, with a yield rate of over 95%.

[0064] Example 2

[0065] The above embodiment 1 discloses the composition structure of the horizontal alignment device. This embodiment also provides a method for horizontal alignment, which will be described below.

[0066] A horizontal alignment method for a tile-type radio frequency component electrical interconnect structure, employing the horizontal alignment device mentioned in Example 1, includes:

[0067] S01: The part to be aligned is placed in the positioning cavity, wherein a welding piece is placed between the cover plate and the upper substrate, and a limiting baffle surrounds the upper substrate.

[0068] S02: Set the positioning plate and make the positioning plate match the positioning structure of the base.

[0069] S03: Observe the alignment of the positioning pads of the upper substrate with the first positioning hole of the positioning plate, and adjust the position of the upper substrate through the horizontal adjustment component to achieve alignment.

[0070] At least two positioning pads should be selected to determine the alignment. Two positioning pads can be symmetrically set at the upper left and lower right corners.

[0071] If there is a deviation along the X direction, adjust one of the horizontal adjustment components located on the Y side; if there is a deviation along the Y direction, adjust both horizontal adjustment components located on the X side simultaneously.

[0072] S05: By observing the alignment of the positioning pads of the upper substrate with the second positioning hole of the base, when the positioning pads are aligned with both the first and second positioning holes, the alignment adjustment is complete. If the positioning pads cannot be aligned, it indicates that the upper substrate structure is faulty.

[0073] The alignment method mentioned in this embodiment can adjust the upper substrate in the horizontal direction to align the upper substrate with the positioning plate. At the same time, due to the position restriction of the upper substrate by the limiting baffle and the position restriction of the receiving cavity by the cover plate, the upper substrate can also be aligned with the cover plate, thus achieving overall alignment between the upper substrate and the cover plate.

[0074] After the upper substrate is aligned and adjusted, a clamping assembly is set to clamp the positioning plate, and the entire alignment device and the aligned component are transferred to the welding equipment for welding. After welding, the aligned component is disassembled through the disassembly hole.

[0075] In some embodiments, automation is also supported, which can further improve efficiency by using a motor to drive the horizontal adjustment component and machine vision to align the pads and positioning holes, resulting in significant advantages during mass production.

[0076] The above are the embodiments listed in this example. However, this example is not limited to the optional embodiments described above. Those skilled in the art can arbitrarily combine the above methods to obtain other various embodiments. Anyone can derive other various forms of embodiments under the guidance of this example. The above specific embodiments should not be construed as limiting the scope of protection of this example. The scope of protection of this example should be defined in the claims.

Claims

1. A horizontal alignment device for a tile-type radio frequency component electrical interconnect structure, characterized in that: It includes a base (2) for placing the part to be aligned, the base (2) accommodating the part to be aligned through a positioning cavity (21), and a positioning plate (3) provided at the positioning cavity (21); the base (2) is provided with a plurality of horizontal clamping components (5) for elastically clamping the part to be aligned along the X and Y directions, and a plurality of horizontal adjusting components (4) for adjusting the part to be aligned and keeping it aligned in the X and Y directions, and a plurality of clamping components (6) for pressing the part to be aligned.

2. The horizontal alignment device for the tile-type radio frequency component electrical interconnect structure according to claim 1, characterized in that: The positioning cavity (21) is provided with a positioning structure that cooperates with the part to be aligned. The positioning structure includes at least two positioning parts.

3. The horizontal alignment device for the tile-type radio frequency component electrical interconnect structure according to claim 1, characterized in that: The horizontal clamping assembly (5) includes a connecting part (51) that is fixedly engaged with the base (2). A pin (53) is telescopically provided in the connecting part (51), and a clamping elastic member (52) is also provided in the connecting part (51) to apply elastic force to the pin (53). The clamping elastic member (52) applies elastic force to the pin (53) and causes the front end of the pin (53) to extend from the front port of the connecting part (51). The pin (53) supports and clamps the part to be aligned. The rear end of the pin (53) extends from the rear port of the connecting part (51) and is provided with a limiting stop member (54).

4. The horizontal alignment device for the tile-type radio frequency component electrical interconnection structure according to claim 1, characterized in that: The horizontal adjustment assembly (4) includes an adjustment rod, which is rotatably engaged with an adjustment seat (41) and rotates to push the part to be aligned to move along the X or Y direction. The adjustment rod is also provided with an adjustment head (42) for holding and operating.

5. The horizontal alignment device for the tile-type radio frequency component electrical interconnect structure according to claim 1, characterized in that: The clamping assembly (6) includes a rotating shaft (61) connected to the base (2). The rotating shaft (61) drives a clamping sleeve to rotate synchronously. The clamping sleeve is provided with a pressure rod (62) and a clamping elastic element (63) that applies elastic force to the pressure rod (62). The front end of the pressure rod (62) is clamped by the clamping elastic element (63) and extends out from the lower port of the clamping sleeve. The rear end of the pressure rod (62) extends out from the upper port of the clamping sleeve and the rear end of the pressure rod (62) is provided with a limiting anti-detachment element (64).

6. The horizontal alignment device for the tile-type radio frequency component electrical interconnect structure according to claim 5, characterized in that: The base (2) is provided with a mounting hole (23) for mounting the rotating shaft (61) and a fixing hole (24) for receiving the pressure rod (62). When the clamping assembly (6) is not in sync with the part to be aligned, the rotating shaft (61) is rotated and the front end of the pressure rod (62) is in sync with the fixing hole (24).

7. The horizontal alignment device for the tile-type radio frequency component electrical interconnect structure according to claim 1, characterized in that: The component to be aligned includes a cover plate (14) and an upper substrate (13) arranged from bottom to top. An annular limiting baffle is also arranged around the outer side of the upper substrate (13). The upper substrate (13) is provided with a number of positioning pads (131). The positioning plate (3) is provided with a number of first positioning holes (31) corresponding to the positioning pads (131). The bottom of the receiving cavity is provided with a number of second positioning holes (26) corresponding to the positioning pads (131). When the component to be aligned is aligned in the positioning cavity (21), the first positioning holes (31) and the second positioning holes (26) are aligned with the positioning pads (131).

8. The horizontal alignment device for the tile-type radio frequency component electrical interconnect structure according to claim 1, characterized in that: The positioning cavity (21) is provided with a number of disassembly holes (25), which are used to remove the part to be aligned from the positioning cavity (21) after alignment is completed.

9. A method for horizontal alignment of a tile-type radio frequency component electrical interconnect structure, employing the horizontal alignment device according to any one of claims 1 to 8, characterized in that, include: The part to be aligned is placed in the positioning cavity (21), wherein a solder pad is placed between the cover plate (14) and the upper substrate (13), and a limiting baffle (7) surrounds the upper substrate (13); Set a positioning plate (3) and make the positioning plate (3) match the positioning structure of the base (2); Observe the alignment of the positioning pad (131) of the upper substrate (13) with the first positioning hole (31) of the positioning plate (3), and adjust the position of the upper substrate (13) by the horizontal adjustment component (4) to achieve alignment; By observing the alignment of the positioning pads (131) of the upper substrate (13) with the second positioning hole (26) of the base (2), the alignment adjustment is completed when the positioning pads (131) are aligned with both the first positioning hole (31) and the second positioning hole (26). If the positioning pads (131) cannot be aligned, it indicates that the structure of the upper substrate (13) is faulty.

10. The horizontal alignment method for the tile-type radio frequency component electrical interconnect structure according to claim 9, characterized in that: After the upper substrate (13) is aligned and adjusted, the clamping assembly (6) is set to clamp the positioning plate (3), and the entire alignment device and the part to be aligned are transferred to the welding equipment for welding. After welding, the part to be aligned is disassembled through the disassembly hole (25).

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