PCB circuit fabrication methods and circuit systems
By embedding metal connection structures in PCB circuit processing and performing electroplating, the deformation problem during high-temperature welding was solved, and precise assembly of PCB boards was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENNAN CIRCUITS
- Filing Date
- 2023-08-08
- Publication Date
- 2026-06-30
Smart Images
Figure CN117042312B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of PCB technology, and in particular to a PCB circuit processing method and circuit system. Background Technology
[0002] A PCB (Printed Circuit Board) is an essential component of electronic circuits. It is a plate-shaped structure made of conductive material used to support and connect electronic components. Due to its good reliability, stability, and repeatability, PCBs have become a widely used technology in electronic products.
[0003] Traditionally, PCB circuits between different PCB boards are assembled and soldered using metal solder. However, PCB boards are prone to deformation under high-temperature metal soldering conditions, which affects the assembly accuracy of electronic components on the PCB board. Summary of the Invention
[0004] This invention provides a PCB circuit processing method and circuit system to solve the problem that existing PCB circuits can easily affect the assembly accuracy of electronic components on the PCB board when making electrical connections.
[0005] A PCB circuit fabrication method, comprising:
[0006] Process the target metal layer on the substrate;
[0007] A photosensitive layer is processed on the target metal layer;
[0008] A metal connection structure is embedded in the photosensitive layer, and a first circuit pattern is formed on the photosensitive layer. The metal connection structure is electrically connected to the target metal layer.
[0009] The target metal layer is etched according to the first circuit pattern to obtain the target PCB circuit. The target PCB circuit includes a target circuit structure that matches the first circuit pattern and a metal connection structure that partially protrudes from the target circuit structure.
[0010] Furthermore, the embedding of the metal connection structure in the photosensitive layer includes:
[0011] A first through-hole is formed on the photosensitive layer;
[0012] The first through hole is filled with metal material to form a metal connection structure.
[0013] Furthermore, the height of the metal connection structure is equal to the thickness of the photosensitive layer.
[0014] Furthermore, an electroplating process is used to form the metal connection structure within the first through hole.
[0015] Furthermore, the photosensitive layer is made of dry film or photosensitive emulsion.
[0016] Further, the step of etching the target metal layer according to the first circuit pattern to obtain the target PCB circuit includes:
[0017] A target protective layer is formed on the metal connection structure;
[0018] The target metal layer is etched according to the first circuit pattern to obtain the target circuit structure;
[0019] Remove the target protective layer on the metal connection structure to obtain the target PCB circuit.
[0020] Further, forming the target protective layer on the metal connection structure includes:
[0021] A first protective layer is applied to the target metal layer and the metal connection structure.
[0022] Remove the first protective layer on the target metal layer, and determine the first protective layer on the metal connection structure as the target protective layer.
[0023] Furthermore, the material of the target protective layer is tin.
[0024] A circuit system includes a first circuit board; the first circuit board includes the target PCB circuit obtained by the above-described PCB circuit processing method.
[0025] Furthermore, the circuit system also includes a second circuit board; the second circuit board is physically and electrically connected to the metal connection structure in the target PCB circuit.
[0026] The aforementioned PCB circuit processing method and circuit system involve processing a target metal layer on a substrate, processing a photosensitive layer on the target metal layer, embedding a metal connection structure in the photosensitive layer, forming a first circuit pattern on the photosensitive layer, electrically connecting the metal connection structure to the target metal layer, etching the target metal layer according to the first circuit pattern to obtain the target PCB circuit. The target PCB circuit includes a target circuit structure matching the first circuit pattern and a metal connection structure that partially protrudes from the target circuit structure, enabling the target PCB circuit to make physical contact and electrical connection with other PCB boards through the metal connection structure. This ensures that the PCB board will not be subjected to high-temperature deformation when electrically connecting the target PCB circuit to the PCB board, thus ensuring the assembly accuracy of electronic components on the PCB board. Attached Figure Description
[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1 This is a flowchart of a PCB circuit processing method according to an embodiment of the present invention;
[0029] Figure 2 This is another flowchart of a PCB circuit processing method according to one embodiment of the present invention;
[0030] Figure 3 This is another flowchart of a PCB circuit processing method according to one embodiment of the present invention;
[0031] Figure 4 This is another flowchart of a PCB circuit processing method according to one embodiment of the present invention;
[0032] Figure 5 This is a schematic flowchart of a PCB circuit processing method according to an embodiment of the present invention.
[0033] In the figure: 10, substrate; 20, target metal layer; 30, photosensitive layer; 31, first through-hole; 40, target protective layer; 50, target PCB circuit; 51, metal connection structure; 52, target circuit structure. Detailed Implementation
[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0035] It should be understood that the invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0036] To fully understand this invention, detailed structures and steps will be presented in the following description to illustrate the technical solution proposed by this invention. Preferred embodiments of the invention are described in detail below; however, in addition to these detailed descriptions, the invention may have other embodiments.
[0037] This embodiment provides a PCB circuit processing method, such as Figure 1 and Figure 5 As shown, it includes:
[0038] S101: Process the target metal layer 20 on the substrate 10.
[0039] S102: Process the photosensitive layer 30 on the target metal layer 20.
[0040] S103: A metal connection structure 51 is embedded in the photosensitive layer 30, and a first circuit pattern is formed on the photosensitive layer 30. The metal connection structure 51 is electrically connected to the target metal layer 20.
[0041] S104: The target metal layer 20 is etched according to the first circuit pattern to obtain the target PCB circuit 50. The target PCB circuit 50 includes a target circuit structure 52 that matches the first circuit pattern and a metal connection structure 51 that protrudes from the target circuit structure 52.
[0042] The substrate 10 can be an epoxy resin substrate containing glass fiber, or an aluminum substrate or a copper substrate.
[0043] As an example, in step S101, a target metal layer 20 is processed on the substrate 10. Optionally, before processing the target metal layer 20 on the substrate 10, the substrate 10 is cleaned, that is, the substrate 10 is cleaned to remove any dirt and oxides, making the surface of the substrate 10 smooth and clean. Optionally, the target metal layer 20 can be processed on the substrate 10 by chemical plating or electroplating. Preferably, the target metal layer 20 is made of copper, and the target metal layer 20 is processed on the substrate 10 by chemical copper plating. Understandably, other metals can also be used for chemical plating, such as nickel, gold, silver, and zinc. Optionally, the chemical copper plating method can employ positive polarization and anti-polarization methods to make the target metal layer 20 on the substrate 10 more uniform and have better corrosion resistance. It should be noted that the thickness of the target metal layer 20 can be determined based on practical experience, and the thickness of the target metal layer 20 can be controlled by controlling the chemical copper plating time. In this example, the chemical copper plating method can be any method known to those skilled in the art, as long as the target metal layer 20 is processed on the substrate 10, which will not be described in detail here.
[0044] As an example, in step S102, a photosensitive layer 30 is processed on the target metal layer 20. Optionally, before step S102, i.e., before processing the photosensitive layer 30 on the target metal layer 20, the surface of the target metal layer 20 is pretreated to ensure that the photosensitive layer 30 can firmly adhere to the surface of the target metal layer 20, avoiding the problem of peeling off during subsequent processing. Optionally, the pretreatment of the surface of the target metal layer 20 may include pickling, alkaline washing, and / or sandblasting. As an example, the surface of the target metal layer 20 is immersed in an acidic solution for etching treatment to remove the oxide layer and impurities on the surface, while increasing the surface roughness and improving adhesion. As another example, the surface of the target metal layer 20 is immersed in an alkaline solution for etching treatment to remove grease, dirt, and other organic matter on the surface, increasing the surface roughness. As yet another example, high-speed flowing sand particles are sprayed onto the surface of the target metal layer 20 to remove the oxide layer and impurities on the surface of the target metal layer 20, increasing the surface roughness and improving adhesion. In this example, a photosensitive layer 30 is fabricated on the target metal layer 20 to facilitate pattern transfer in subsequent processing, i.e., transferring the desired pattern to the target metal layer 20 to form the desired circuit pattern.
[0045] As an example, in step S103, a metal connection structure 51 is embedded in the photosensitive layer 30, and a first circuit pattern is formed on the photosensitive layer 30. The metal connection structure 51 is electrically connected to the target metal layer 20. Specifically, embedding the metal connection structure 51 in the photosensitive layer 30 means embedding a metal connection structure 51 electrically connected to the target metal layer 20 in the photosensitive layer 30, so that in subsequent processes, the target PCB circuit 50 formed based on the target metal layer 20 can be electrically connected to the metal connection structure 51. It should be noted that the metal connection structure 51 is used for physical contact electrical connection between different PCB boards. Exemplarily, the way to embed the metal connection structure 51 in the photosensitive layer 30 can be to first determine the processing position of the metal connection structure 51 on the photosensitive layer 30, which can be determined based on actual experience. Then, an accommodating space penetrating the photosensitive layer 30 is formed in the photosensitive layer 30, and metal material is filled in the accommodating space, thereby realizing the embedding of the metal connection structure 51 electrically connected to the target metal layer 20 in the photosensitive layer 30. Preferably, the space is filled with a metallic material using an electroplating process. Preferably, the metallic material is copper.
[0046] As another example, in step S103, a first circuit pattern is formed on the photosensitive layer 30. This first circuit pattern at least partially overlaps with the processing position of the metal connection structure 51 in the vertical direction, so that the metal connection structure 51 can be connected to the metal connection structure 51 that partially protrudes from the target circuit structure 52 in subsequent steps. Exemplarily, the first circuit pattern is drawn based on practical experience, and a transparent film is made from the first circuit pattern. This transparent film is placed on the photosensitive layer 30, and then exposed and developed to achieve the transfer of the first circuit pattern, that is, to form the first circuit pattern on the photosensitive layer 30.
[0047] As an example, in step S104, the target PCB line 50 refers to the PCB line obtained by etching the target metal layer 20 according to the first line pattern. The target PCB line 50 includes a target line structure 52 that matches the first line pattern and a metal connection structure 51 that partially protrudes from the target line structure 52. The target line structure 52 refers to the line structure formed on the substrate 10 after etching the target metal layer 20 according to the first line pattern, where the target metal layer 20 remains. In this embodiment, since the metal connection structure 51 is embedded in the photosensitive layer 30 on the target metal layer 20 in step 102, etching the target metal layer 20 allows the metal connection structure 51 to partially protrude from the target line structure 52. In this embodiment, the target metal layer 20 is etched according to the first circuit pattern, so that the target PCB circuit 50 includes a target circuit structure 52 that matches the first circuit pattern and a metal connection structure 51 that partially protrudes from the target circuit structure 52. This allows the target PCB circuit 50 to make physical contact and electrical connection with other PCB boards through the metal connection structure 51, thereby ensuring that the PCB board will not be deformed by high temperature when the target PCB circuit 50 is electrically connected to the PCB board, and ensuring the assembly accuracy of electronic components on the PCB board.
[0048] Further, after etching the target metal layer 20 according to the first circuit pattern, the residual photosensitive layer 30 on the target circuit structure 52 is removed. Specifically, a specific solvent can be used to remove the residual photosensitive layer 30 on the target circuit structure 52. For example, the photosensitive layer 30 can be a dry film or a photosensitive adhesive, and the residual photosensitive layer 30 on the target circuit structure 52 can be removed by an alkaline solvent.
[0049] In this embodiment, a target metal layer 20 is processed on the substrate 10, a photosensitive layer 30 is processed on the target metal layer 20, a metal connection structure 51 is embedded in the photosensitive layer 30, and a first circuit pattern is formed on the photosensitive layer 30. The metal connection structure 51 is electrically connected to the target metal layer 20. The target metal layer 20 is etched according to the first circuit pattern to obtain the target PCB circuit 50. The target PCB circuit 50 includes a target circuit structure 52 that matches the first circuit pattern and a metal connection structure 51 that partially protrudes from the target circuit structure 52, so that the target PCB circuit 50 can make physical contact and electrical connection with other PCB boards through the metal connection structure 51. This ensures that the PCB board will not be deformed by high temperature when the target PCB circuit 50 is electrically connected to the PCB board, and ensures the assembly accuracy of electronic components on the PCB board.
[0050] In one embodiment, such as Figure 2 As shown, in step S103, embedding a metal connection structure 51 in the photosensitive layer 30 includes:
[0051] S201: A first through hole 31 is formed on the photosensitive layer 30.
[0052] S202: Fill the first through hole 31 with metal material to form a metal connection structure 51.
[0053] As an example, in step S201, the diameter of the first through hole 31 can be selected based on practical experience. Optionally, laser drilling or drilling with a drill bit can be used to form the first through hole 31 on the photosensitive layer 30. It should be noted that since the photosensitive layer 30 covers the target metal layer 20, during the process of forming the first through hole 31 on the photosensitive layer 30 by laser drilling or drilling with a drill bit, it is necessary to prevent the laser or drill bit from damaging the target metal layer 20, and only ensure that the first through hole 31 penetrating the photosensitive layer 30 is formed. Optionally, the first through hole 31 can be a round hole, a square hole, or a through hole of other shapes, and there is no limitation here.
[0054] As an example, the first through-hole 31 is filled with metal material to form a metal connection structure 51 that is electrically connected to the target metal layer 20. Optionally, electroplating or chemical plating can be used to fill the first through-hole 31 with metal material, ensuring that the metal connection structure 51 formed in the first through-hole 31 is electrically connected to the target metal layer 20.
[0055] In this embodiment, a first through-hole 31 is formed on the photosensitive layer 30, and a metal material is filled into the first through-hole 31 to form a metal connection structure 51 that is electrically connected to the target metal layer 20. This allows the target PCB circuit 50 to include a target circuit structure 52 that matches the first circuit pattern and a metal connection structure 51 that partially protrudes from the target circuit structure 52. This enables the target PCB circuit 50 to make physical contact and electrical connection with other PCB boards through the metal connection structure 51, thereby ensuring that the PCB board will not be deformed by high temperature when the target PCB circuit 50 is electrically connected to the PCB board, and ensuring the assembly accuracy of electronic components on the PCB board.
[0056] In one embodiment, the height of the metal connection structure 51 is equal to the thickness of the photosensitive layer 30. In this embodiment, ensuring that the height of the metal connection structure 51 is equal to the thickness of the photosensitive layer 30 ensures that the metal connection structure 51 has sufficient height to make physical contact and electrical connection with other PCB boards. This ensures that the PCB board will not be deformed by high temperature when making electrical connections to the target PCB line 50, and ensures the assembly accuracy of electronic components on the PCB board.
[0057] In one embodiment, an electroplating process is used to form a metal connection structure 51 within the first through-hole 31. In this embodiment, an electroplating process is used to fill the first through-hole 31 with metal material to form the metal connection structure 51. Optionally, the metal material can be copper, nickel, gold, silver, zinc, etc. In this embodiment, the height of the metal connection structure 51 in the first through-hole 31 can be controlled by controlling the electroplating time.
[0058] In one embodiment, the photosensitive layer 30 is a dry film or a photosensitive emulsion. In this embodiment, the photosensitive layer 30 can be either a dry film or a photosensitive emulsion, as long as the first circuit pattern can be formed on the photosensitive layer 30.
[0059] In one embodiment, such as Figure 3 As shown, in step S104, the target metal layer 20 is etched according to the first circuit pattern to obtain the target PCB circuit 50, including:
[0060] S301: Form a target protective layer 40 on the metal connection structure 51.
[0061] S302: Etch the target metal layer 20 according to the first circuit pattern to obtain the target circuit structure 52.
[0062] S303: Remove the target protective layer 40 on the metal connection structure 51 to obtain the target PCB circuit 50.
[0063] As an example, in step S301, a target protective layer 40 is formed on the metal connection structure 51 to prevent damage to the metal connection structure 51 when the target metal layer 20 is etched, thereby ensuring the safety of the metal connection structure 51 when the target metal layer 20 is etched.
[0064] As an example, in step S302, the target metal layer 20 is etched according to the first circuit pattern to obtain the target circuit structure 52. Optionally, the target metal layer 20 can be etched according to the first circuit pattern using chemical etching, mechanical etching, or ion beam etching to obtain the target circuit structure 52. It is understood that the specific etching methods of the above-mentioned chemical etching, mechanical etching, or ion beam etching can be etching methods known to those skilled in the art, and will not be described in detail here.
[0065] As an example, in step S303, the target protective layer 40 on the metal connection structure 51 is removed to obtain the target PCB circuit 50. In this embodiment, after etching the target metal layer 20 according to the first circuit pattern to obtain the target circuit structure 52, the target protective layer 40 on the metal connection structure 51 is removed to obtain the target PCB circuit 50. Thus, the metal connection structure 51 is protected by the target protective layer 40, thereby ensuring the safety of the metal connection structure 51 during the etching of the target metal layer 20.
[0066] In this embodiment, a target protective layer 40 is formed on the metal connection structure 51, the target metal layer 20 is etched according to the first circuit pattern to obtain the target circuit structure 52, the target protective layer 40 on the metal connection structure 51 is removed to obtain the target PCB circuit 50, thereby protecting the metal connection structure 51 through the target protective layer 40, thus ensuring the safety of the metal connection structure 51 when the target metal layer 20 is etched.
[0067] In one embodiment, such as Figure 4 and Figure 5 As shown, in step S301, a target protective layer 40 is formed on the metal connection structure 51, including:
[0068] S401: Cover the target metal layer 20 and the metal connection structure 51 with a first protective layer.
[0069] S402: Remove the first protective layer on the target metal layer 20 and identify the first protective layer on the metal connection structure 51 as the target protective layer 40.
[0070] The first protective layer is made of tin.
[0071] As an example, in step S401, a first protective layer is applied to the target metal layer 20 and the metal connection structure 51 by electroplating.
[0072] As an example, in step S402, the first protective layer on the target metal layer 20 is removed, and the first protective layer on the metal connection structure 51 is identified as the target protective layer 40. In this example, by removing the first protective layer on the target metal layer 20, the target protective layer 40 is formed only on the surface of the metal connection structure 51, thereby protecting the metal connection structure 51 while etching the target metal layer 20.
[0073] In this embodiment, a first protective layer is covered on the target metal layer 20 and the metal connection structure 51. The first protective layer on the target metal layer 20 is removed, and the first protective layer on the metal connection structure 51 is determined as the target protective layer 40. The metal connection structure 51 is protected by the target protective layer 40, thereby ensuring the safety of the metal connection structure 51 when the target metal layer 20 is etched.
[0074] In one embodiment, the target protective layer 40 is made of tin.
[0075] This embodiment provides a circuit system, including a first circuit board; the first circuit board includes the target PCB line 50 obtained by the above-described PCB line processing method.
[0076] In one embodiment, the circuit system further includes a second circuit board; the second circuit board is physically and electrically connected to the metal connection structure 51 in the target PCB line 50.
[0077] Exemplarily, the second circuit board can be directly physically connected to the metal connection structure 51 in the target PCB line 50, or indirectly connected via a connector that matches the metal connection structure 51. As an example, the second circuit board has a connection hole that matches the metal connection structure 51, and the metal connection structure 51 is inserted into the connection hole on the second circuit board. As another example, the connector has a connection hole that matches the metal connection structure 51, and the connector can be soldered to the second circuit board or physically connected. The metal connection structure 51 is inserted into the connection hole on the connector.
[0078] In this embodiment, the second circuit board is physically and electrically connected to the metal connection structure 51 in the target PCB line 50, thereby achieving zero-metal solder welding. This allows the target PCB line 50 in the first circuit board to be physically and electrically connected to the second circuit board through the metal connection structure 51, ensuring that the first and second circuit boards will not be deformed by high temperature when the target PCB lines 50 of the first and second circuit boards are electrically connected, thus ensuring the assembly accuracy of electronic components on the first and second circuit boards.
[0079] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.
Claims
1. A method of processing a PCB circuit, characterized by, include: Process the target metal layer on the substrate; A photosensitive layer is processed on the target metal layer; A metal connection structure is embedded in the photosensitive layer, and a first circuit pattern is formed on the photosensitive layer. The metal connection structure is electrically connected to the target metal layer. A target protective layer is formed on the metal connection structure; The target metal layer is etched according to the first circuit pattern to obtain the target circuit structure; Remove the target protective layer on the metal connection structure to obtain the target PCB circuit, which includes a target circuit structure that matches the first circuit pattern and a metal connection structure that partially protrudes from the target circuit structure.
2. The PCB circuit processing method as described in claim 1, characterized in that, The method of embedding a metal connection structure in the photosensitive layer includes: A first through-hole is formed on the photosensitive layer; The first through hole is filled with metal material to form a metal connection structure.
3. The PCB circuit processing method as described in claim 2, characterized in that, The height of the metal connection structure is equal to the thickness of the photosensitive layer.
4. The PCB circuit processing method as described in claim 2, characterized in that, The metal connection structure is formed in the first through hole using an electroplating process.
5. The PCB circuit processing method according to any one of claims 1-3, characterized in that, The photosensitive layer is made of dry film or photosensitive emulsion.
6. The PCB circuit processing method as described in claim 1, characterized in that, The formation of the target protective layer on the metal connection structure includes: A first protective layer is applied to the target metal layer and the metal connection structure. Remove the first protective layer on the target metal layer, and determine the first protective layer on the metal connection structure as the target protective layer.
7. The PCB circuit processing method as described in claim 6, characterized in that, The target protective layer is made of tin.
8. A circuit system, characterized in that, It includes a first circuit board; the first circuit board includes the target PCB circuit obtained by the PCB circuit processing method as described in any one of claims 1-7.
9. The circuit system as described in claim 8, characterized in that, The circuit system further includes a second circuit board; the second circuit board is physically and electrically connected to the metal connection structure in the target PCB circuit.