Middle frame assembly and display device

Abstract

Embodiments of the present application provide a middle frame assembly and a display device, and relate to the display field, and improve flexibility of a heat dissipation mode. The middle frame assembly comprises: a middle frame; a back cover, the back cover and the middle frame have a containing cavity therebetween; a heat equalizing structure located in the containing cavity; and a heat dissipation fin located in the containing cavity, a contact area between the heat dissipation fin and the heat equalizing structure being variable.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a mid-frame assembly and a display device. Background Technology

[0002] Display devices generate a lot of heat when they are working. If this heat cannot be dissipated in time, it can damage the electronic components in the display device and thus affect the lifespan of the display device.

[0003] Currently, heat dissipation is generally achieved by attaching a full-surface heat sink between the back cover and the mid-frame of the display device. However, this method is relatively simple and cannot meet the user's needs for heat dissipation in different usage scenarios, resulting in a poor user experience. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a mid-frame assembly and a display device, which improves the flexibility of heat dissipation methods.

[0005] On one hand, embodiments of the present invention provide a mid-frame component, including:

[0006] Mid-frame;

[0007] The rear cover has a receiving cavity between it and the middle frame;

[0008] The heat dissipation structure located in the receiving cavity;

[0009] The heat sink located in the receiving cavity has a variable contact area with the heat dissipation structure.

[0010] On the other hand, embodiments of the present invention provide a display device, including a display panel and the aforementioned mid-frame assembly;

[0011] The display panel has a first frequency and a second frequency, the second frequency being greater than the first frequency, and the contact area between the heat sink and the heat dissipation structure at the second frequency being smaller than the contact area between the heat sink and the heat dissipation structure at the first frequency.

[0012] One of the above technical solutions has the following beneficial effects:

[0013] In this embodiment of the invention, the contact area between the heat sink and the heat spreader in the mid-frame assembly is variable. That is, this embodiment of the invention can change the heat transferred from the heat spreader to the heat sink by changing the contact area between the heat sink and the heat spreader, thereby changing the heat dissipated by the heat sink through the back cover.

[0014] Based on this design, in one usage scenario, when the display device has low power consumption and generates little heat, the contact area between the heat dissipation structure and the heat sink can be controlled to be larger, allowing the entire heat sink to dissipate heat more effectively. Since the display device generates relatively little heat, the temperature at various points on the back cover will not be too high, preventing the area touched by the user from becoming excessively hot, regardless of where the user holds the device. Furthermore, this also achieves uniform heat dissipation from the heat sink. In another usage scenario, when the display device has higher power consumption and generates more heat, the contact area between the heat sink and the heat dissipation structure can be adjusted to regulate the heat sink's heat dissipation. For example, the heat dissipation at certain points on the back cover can be reduced to prevent the back cover from overheating at those locations. Based on this concept, when the user holds the display device, the temperature of the back cover at the hand-held area can be reduced accordingly, preventing it from becoming too hot and affecting the user's grip experience.

[0015] In summary, in this embodiment of the invention, the heat dissipation method of the mid-frame component is more flexible, making it easier to adjust the temperature of the back cover, which helps to improve the user's grip experience when holding the display device. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a mid-frame component provided in an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A schematic diagram showing the relative motion between the corresponding sub-heat sink and the heat dissipation structure;

[0019] Figure 3 This is a partial structural diagram of the mid-frame component provided in an embodiment of the present invention;

[0020] Figure 4 A top view of the sub-heat sink, controller, and spring provided in an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of another partial structure of the mid-frame component provided in an embodiment of the present invention;

[0022] Figure 6 This is another top view of the sub-heat sink, controller, and spring provided in an embodiment of the present invention;

[0023] Figure 7 for Figure 5A schematic diagram showing the relative motion between the corresponding sub-heat sink and the heat dissipation structure;

[0024] Figure 8 This is a partial structural diagram of the mid-frame component provided in an embodiment of the present invention;

[0025] Figure 9 This is a schematic diagram of another structure of the mid-frame component provided in an embodiment of the present invention;

[0026] Figure 10 This is a schematic diagram of another structure of the mid-frame component provided in an embodiment of the present invention;

[0027] Figure 11 This is a top view of a sub-heat sink provided in an embodiment of the present invention;

[0028] Figure 12 This is another structural schematic diagram of the mid-frame component provided in an embodiment of the present invention;

[0029] Figure 13 for Figure 12 A schematic diagram showing the relative motion between the corresponding sub-heat sink and the heat dissipation structure;

[0030] Figure 14 This is another structural schematic diagram of the mid-frame component provided in an embodiment of the present invention;

[0031] Figure 15 for Figure 14 A schematic diagram showing the relative motion between the corresponding sub-heat sink and the heat dissipation structure;

[0032] Figure 16 This is another structural schematic diagram of the mid-frame component provided in an embodiment of the present invention;

[0033] Figure 17 for Figure 16 A sectional view along the A1-A2 direction;

[0034] Figure 18 This is another structural schematic diagram of the mid-frame component provided in an embodiment of the present invention;

[0035] Figure 19 This is a schematic diagram of a display device provided in an embodiment of the present invention;

[0036] Figure 20 This is a schematic diagram of a user handheld display device provided in an embodiment of the present invention;

[0037] Figure 21 This is another schematic diagram of a user handheld display device provided in an embodiment of the present invention. Detailed Implementation

[0038] To better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0039] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0040] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0041] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0042] This invention provides a mid-frame component, such as... Figure 1 As shown, Figure 1 This is a schematic diagram of a mid-frame assembly provided in an embodiment of the present invention. The mid-frame assembly includes a back cover 1, a mid-frame 2, a heat dissipation structure 3, and a heat sink 4. A receiving cavity 5 is provided between the back cover 1 and the mid-frame 2. The heat dissipation structure 3 and the heat sink 4 are located in the receiving cavity 5. The heat dissipation structure 3 can specifically be a VC heat pipe to improve heat dissipation efficiency. The heat sink 4 can specifically be formed of a heat dissipation material such as graphene. The contact area between the heat sink 4 and the heat dissipation structure 3 is variable.

[0043] The aforementioned mid-frame component is used in the display device. The heat generated when the display device is working is conducted to the heat sink 4 through the heat dissipation structure 3, and finally dissipated through the back cover 1 via the heat sink 4. It is understandable that the amount of heat dissipated by the heat sink 4 will affect the temperature of the back cover 1, and thus affect the temperature felt by the user's hand when the user holds the display device.

[0044] In this embodiment of the invention, the contact area between the heat sink 4 and the heat dissipation structure 3 in the middle frame assembly is variable. That is, in this embodiment of the invention, the heat transferred from the heat dissipation structure 3 to the heat sink 4 can be changed by changing the contact area between the heat sink 4 and the heat dissipation structure 3, thereby changing the heat dissipated by the heat sink 4 through the back cover 1.

[0045] Based on this design, in one usage scenario, when the display device has low power consumption and generates little heat, the contact area between the heat dissipation structure 3 and the heat sink 4 can be controlled to be larger, allowing the entire heat sink 4 to dissipate a larger amount of heat. Since the display device generates relatively little heat, the temperature at various points on the back cover 1 will not be too high, preventing the area touched by the user from becoming excessively hot, regardless of where the user holds the device. Furthermore, this also achieves uniform heat dissipation from the heat sink 4. In another usage scenario, when the display device has higher power consumption and generates more heat, the contact area between the heat sink 4 and the heat dissipation structure 3 can be adjusted to regulate the heat dissipation of the heat sink 4. For example, the heat dissipation of the heat sink 4 at certain locations on the back cover 1 can be reduced to prevent the back cover 1 from becoming too hot at those locations. Based on this concept, when the user holds the display device, the temperature of the back cover at the hand-held location can be reduced accordingly, preventing it from becoming too hot and affecting the user's grip experience.

[0046] In summary, in this embodiment of the invention, the heat dissipation method of the mid-frame component is more flexible, making it easier to adjust the temperature of the back cover 1, which helps to improve the user's grip experience when holding the display device.

[0047] In one feasible implementation, see again Figure 1 The receiving cavity 5 includes at least two partitions 6. The heat sink 4 includes at least two sub-heat sinks 7, one sub-heat sink 7 corresponds to one partition 6, at least a portion of the sub-heat sink 7 is located within its corresponding partition 6, and the contact area between the sub-heat sink 7 and the heat dissipation structure 3 is variable.

[0048] The heat sink 4 in the above structure includes at least two independent sub-heat sinks 7, and one sub-heat sink 7 corresponds to one partition 6. In this way, the temperature of the back cover at different partitions 6 can be individually controlled by controlling the contact area between different sub-heat sinks 7 and the heat dissipation structure 3.

[0049] Specifically, for a particular sub-heat sink 7, in one usage scenario, the contact area between the sub-heat sink 7 and the heat dissipation structure 3 can be controlled to be larger, so that the heat dissipation structure 3 can conduct more heat to the sub-heat sink 7. In this case, the sub-heat sink 7 will dissipate a large amount of heat through the back cover 1, resulting in a higher temperature of the back cover at the corresponding partition 6. In another usage scenario, the contact area between the sub-heat sink 7 and the heat dissipation structure 3 can be controlled to be smaller, so that the heat dissipation structure 3 can conduct less heat to the sub-heat sink 7. In this case, the sub-heat sink 7 will dissipate less heat only through the back cover 1, resulting in a lower temperature of the back cover at the corresponding partition 6.

[0050] Based on this heat dissipation method, the contact area between the sub-heat sinks 7 and the heat dissipation structure 3 corresponding to different partitions 6 can be adjusted according to the user's hand position, thereby reducing the temperature of the back cover at the user's hand position.

[0051] It should be noted that in the above design, although the heat dissipation of a certain sub-heat sink 7 is reduced, the heat dissipation structure 3 will transfer most of the heat to the other sub-heat sinks 7, allowing most of the heat to be dissipated through the other sub-heat sinks 7. For example, when the user holds the bottom of the display device, although the heat dissipation of the sub-heat sink 7 corresponding to the bottom of the display device is reduced, the heat dissipation structure 3 will transfer most of the heat to the sub-heat sink 7 corresponding to the top of the display device, thereby allowing most of the heat to be dissipated through this sub-heat sink 7, ensuring that the display device still has good heat dissipation performance.

[0052] Based on the above structure, one feasible implementation method is described again. Figure 1 The sub-heat sink 7 includes a first main heat dissipation part 8 and a first adjustment part 9 connected together. The area of ​​the first main heat dissipation part 8 can be larger than the area of ​​the first adjustment part 9. The first main heat dissipation part 8 is located on one side of the back cover 1, specifically attached to the surface of the back cover 1 facing the middle frame 2. The first adjustment part 9 is located on one side of the heat dissipation structure 3, and the contact area between the first adjustment part 9 and the heat dissipation structure 3 is different in different states.

[0053] This structure only requires controlling the relative movement of the first adjustment part 9 in the sub-heat sink 7 with the heat dissipation structure 3 to change the contact area between the entire sub-heat sink 7 and the heat dissipation structure 3. Firstly, the movement state of the local first adjustment part 9 is easier to control, and secondly, it can fix the position of the first main heat dissipation part 8 with a larger area in the sub-heat sink 7, and use the first main heat dissipation part 8 to ensure that the sub-heat sink 7 has stable heat dissipation performance.

[0054] In one feasible implementation, see again Figure 1 The middle frame assembly also includes at least two first driving components 10, each first driving component 10 corresponding to a first adjusting part 9. Each first driving component 10 includes a controller 11 and a spring 12. The spring 12 is located on the side of the corresponding first adjusting part 9 away from the heat-spreading structure 3. The surface of the spring 12 near the first adjusting part 9 is connected to the first adjusting part 9; for example, the surface of the spring 12 near the first adjusting part 9 is bonded and fixed to the first adjusting part 9. The controller 11 is located on the side of the spring 12 away from the heat-spreading structure 3, and there is a gap between the controller 11 and the spring 12. The controller 11 is used to attract the spring 12 to move away from the heat-spreading structure 3 during operation.

[0055] Based on this structure, such as Figure 2 As shown, Figure 2 for Figure 1The diagram illustrates the relative motion between the sub-heat sink 7 and the heat dissipation structure 3. When the controller 11 is not in operation, it has no attraction force on the spring 12, and the spring 12 presses the first adjustment part 9 into close contact with the heat dissipation structure 3, maximizing the contact area between them. When the controller 11 is in operation, it attracts the spring 12 and moves it away from the heat dissipation structure 3. Since the spring 12 is bonded to the first adjustment part 9, it further drives at least a portion of the first adjustment part 9 to move away from the heat dissipation structure 3, thus reducing the contact area between them and consequently reducing the overall contact area between the sub-heat sink 7 and the heat dissipation structure 3.

[0056] That is, whether the controller 11 works or not can control the first adjustment part 9 to have different states, thereby controlling the first adjustment part 9 and the heat dissipation structure 3 to have different contact areas.

[0057] Furthermore, such as Figure 3 and Figure 4 As shown, Figure 3 This is a partial structural diagram of the mid-frame component provided in an embodiment of the present invention. Figure 4 This is a top view of the sub-heat sink 7, controller 11 and spring 12 provided in an embodiment of the present invention. The spring 12 includes a first end 13 and a second end 14 opposite to each other. In the direction perpendicular to the plane where the rear cover 1 is located, the first end 13 is close to the first main heat sink 8, and the controller 11 overlaps with the second end 14.

[0058] In the above structure, the controller 11 is located near the second end 14 of the spring 12, controlling the connection. Figure 2 When the controller 11 is working, it generates a strong suction force on the second end 14 of the spring 12, causing the second end 14 of the spring 12 to tilt away from the heat-spreading structure 3, thereby pulling the end of the first adjustment part 9 to tilt up. When the controller 11 is not working, the suction force generated by the controller 11 on the second end 14 of the spring 12 disappears, and the second end 14 of the spring 12 falls down, so that the first adjustment part 9 returns to a state of close contact with the heat-spreading structure 3.

[0059] The rising method reduces the contact area between the first adjustment part 9 and the heat dissipation structure 3 by controlling the end of the first adjustment part 9 to be in a tilted state. When the end of the first adjustment part 9 in the sub-heat sink 7 is tilted, the contact area between the sub-heat sink 7 and the heat dissipation structure 3 will be greatly reduced, which can significantly reduce the contact area between the sub-heat sink 7 and the heat dissipation structure 3, thereby significantly reducing the back cover temperature at the partition 6 corresponding to the sub-heat sink 7.

[0060] Or, such as Figure 5 and Figure 6 As shown, Figure 5 This is a schematic diagram of another partial structure of the mid-frame component provided in an embodiment of the present invention. Figure 6 This is another top view of the sub-heat sink 7, controller 11, and spring 12 provided in an embodiment of the present invention. The spring 12 includes a middle portion 15 and an edge portion 16. In one configuration, the edge portion 16 may be located on both sides of the middle portion 15, and the arrangement direction of the edge portion 16 and the middle portion 15 is parallel to the arrangement direction of the first main heat sink 8 and the first adjustment portion 9. In a direction perpendicular to the plane of the rear cover 1, the controller 11 overlaps with the middle portion 15.

[0061] In the above structure, such as Figure 7 As shown, Figure 7 for Figure 5 The diagram shows a relative motion between the sub-heat sink 7 and the heat dissipation structure 3. The controller 11 is located on one side of the middle part 15 of the spring 12. When the controller 11 is working, it will generate an adsorption force on the middle part 15 of the spring 12, causing the middle part 15 of the spring 12 to arch away from the heat dissipation structure 3. This will pull the middle position of the first adjustment part 9 to arch away from the heat dissipation structure 3 as well. At this time, the edges on both sides of the first adjustment part 9 will still be in contact with the heat dissipation structure 3, which can prevent the contact area between the first adjustment part 9 and the heat dissipation structure 3 from being reduced to too small. While effectively reducing the temperature of the partition 6, it can also ensure that the sub-heat sink 7 and the heat dissipation structure 3 still retain a certain contact area, so that the sub-heat sink 7 can still dissipate enough heat to optimize the overall heat dissipation effect.

[0062] In both of the above structures, see again Figure 4 and Figure 6 The width d1 of the spring piece 12 is greater than or equal to the width d2 of the first adjustment part 9, and the width d3 of the controller 11 is greater than or equal to the width d1 of the spring piece 12. The width directions of the spring piece 12, the first adjustment part 9, and the controller 11 are all parallel to the plane of the rear cover 1 and intersect with the arrangement directions of the first main heat dissipation part 8 and the first adjustment part 9.

[0063] This configuration serves two purposes: first, it ensures sufficient overlap between the controller 11 and the spring 12, so that the controller 11 can generate enough suction to pull the spring 12 up when it is working; second, it ensures sufficient overlap between the spring 12 and the first adjustment part 9, so that when the spring 12 is pulled up, it can pull up the first adjustment part 9 with a sufficient area, thereby effectively controlling the contact area between the first adjustment part 9 and the heat dissipation structure 3.

[0064] Furthermore, in this embodiment of the invention, the area of ​​the spring 12 corresponding to different sub-heat sinks 7 can also be set to be different. For example, when the display device is a mobile phone, regardless of whether the mobile phone is displayed in landscape or portrait mode, the user is more likely to hold the phone at the bottom. Therefore, the area of ​​the spring 12 corresponding to the sub-heat sink 7 at the bottom of the phone can be set to be larger, so as to increase the degree of control of the contact area of ​​the spring 12 with the first adjustment part 9 in the sub-heat sink 7. When the spring 12 moves the first adjustment part 9 in the sub-heat sink 7, the contact area between the sub-heat sink 7 and the heat dissipation structure 3 can be reduced significantly, thereby effectively reducing the temperature of the back cover at the bottom of the phone.

[0065] In one feasible implementation, such as Figure 8 As shown, Figure 8 This is a partial structural diagram of the mid-frame assembly provided in an embodiment of the present invention. The spring piece 12 includes a first part 17 and a second part 18. The first part 17 is connected to the back cover 1 or the mid-frame 2. The surface of the second part 18 near the first adjustment part 9 is connected to the first adjustment part 9. For example, the first part 17 is bonded and fixed to the back cover 1 or the mid-frame 2, and the surface of the second part 18 near the first adjustment part 9 is bonded and fixed to the first adjustment part 9. Furthermore, there is a gap between the second part 18 and the controller 11.

[0066] At this time, the spring piece 12 can be L-shaped, with the first part 17 being the short end of the spring piece 12 and the second part 18 being the long end of the spring piece 12. The first part 17 of the spring piece 12 is fixed to the back cover 1 or the middle frame 2 to achieve fixation with the back cover 1 or the middle frame 2. When the controller 11 controls the second part 18 of the spring piece 12 to tilt up, the first part 17 of the spring piece 12 will press the first adjustment part 9 at its location to contact the heat dissipation structure 3, thereby ensuring that a part of the first adjustment part 9 can still contact the heat dissipation structure 3. While effectively reducing the temperature of the partition 6, it also allows the sub-heat sink 7 to still maintain a certain contact area with the heat dissipation structure 3 to optimize the overall heat dissipation effect.

[0067] In one feasible implementation, the controller 11 includes an electromagnetic device, and the spring 12 can be a metal spring 12. When the controller 11 is working, it uses magnetic force to move the spring 12.

[0068] In one feasible implementation, such as Figure 9 As shown, Figure 9 This is another structural schematic diagram of the mid-frame assembly provided in an embodiment of the present invention. The first driving assembly 10 further includes a spring 19, which is located between the controller 11 and the spring piece 12. One end of the spring 19 is connected to the controller 11, and the other end of the spring 19 is connected to the spring piece 12.

[0069] When the controller 11 is working and adsorbs the spring 12, the spring 19 is compressed. When the controller 11 is not working and the adsorption force on the spring 12 disappears, the spring 19 extends and applies a force to the spring 12 toward the heat dissipation structure 3, thereby pushing the first adjustment part 9 into close contact with the heat dissipation structure 3.

[0070] In one feasible implementation, such as Figure 10 As shown, Figure 10 This is another schematic diagram of the mid-frame assembly provided in an embodiment of the present invention. The heat dissipation structure 3 includes a first surface 20 and a second surface 21 facing each other. The first surface 20 faces the rear cover 1, and the second surface 21 faces the mid-frame 2. At least two sub-heat sinks 7 include a first sub-heat sink 22 and a second sub-heat sink 23. The first adjustment portion 9 of the first sub-heat sink 22 is located on one side of the first surface 20, and the first adjustment portion 9 of the second sub-heat sink 23 is located on one side of the second surface 21.

[0071] At this time, the first adjustment part 9 in the first sub-heat sink 22 and the second sub-heat sink 23 is located on the opposite side of the heat dissipation structure 3. When the two first adjustment parts 9 are in close contact with the heat dissipation structure 3, they can have a large contact area with the first adjustment part 9. Therefore, when the contact area between the first adjustment part 9 and the heat dissipation structure 3 is reduced, the temperature of the back cover at partition 6 can be significantly reduced.

[0072] Furthermore, see again Figure 10 The back cover 1 includes a first groove 24, and a controller 11 corresponding to the first sub-heat sink 22 is located in the first groove 24, and / or the middle frame 2 includes a second groove 25, and a controller 11 corresponding to the second sub-heat sink 23 is located in the second groove 25.

[0073] With this configuration, when the distance between the back cover 1 and the middle frame 2 is constant, sufficient gaps are left between the spring 12 corresponding to the first sub-heat sink 22 and the controller 11, as well as between the spring 12 corresponding to the second sub-heat sink 23 and the controller 11. When the controller 11 adsorbs the spring 12, it can increase the degree of the spring 12's tilting or arching, effectively controlling the contact area between the sub-heat sink 7 and the heat dissipation structure 3.

[0074] In one feasible implementation, such as Figure 11 As shown, Figure 11 This is a top view of a sub-heat sink 7 provided in an embodiment of the present invention. The sub-heat sink 7 includes at least two first adjustment parts 9.

[0075] At this point, the temperature of partition 6 can be regulated to different degrees by controlling the different states of the first adjustment parts 9 in the same sub-heat sink 7. For example, when all the first adjustment parts 9 in the sub-heat sink 7 are in close contact with the heat dissipation structure 3, the contact area between the sub-heat sink 7 and the heat dissipation structure 3 reaches its maximum. The more first adjustment parts 9 in the sub-heat sink 7 that are raised or arched, the greater the reduction in the contact area between the sub-heat sink 7 and the heat dissipation structure 3, and the smaller the contact area between the sub-heat sink 7 and the heat dissipation structure 3.

[0076] This method allows for more precise and flexible control of the temperature of partition 6. For example, when the display device is displaying at ultra-high frequency, it generates a lot of heat. To prevent the handheld area from getting too hot, all the first adjustment parts 9 in the corresponding sub-heat sink 7 at the bottom of the display device can be raised or arched. When the display device is displaying at high frequency, it generates less heat, so some of the first adjustment parts 9 in the corresponding sub-heat sink 7 at the bottom of the phone can be raised or arched.

[0077] In one feasible implementation, such as Figures 12-14 As shown, Figure 12 This is a schematic diagram of another structure of the mid-frame component provided in an embodiment of the present invention. Figure 13 for Figure 12 A schematic diagram showing the relative motion between the corresponding sub-heat sink 7 and the heat dissipation structure 3. Figure 14 This is a schematic diagram of another structure of the mid-frame component provided in an embodiment of the present invention. Figure 15 for Figure 14 A schematic diagram of the relative motion between the corresponding sub-heat sink 7 and the heat dissipation structure 3, wherein at least two sub-heat sinks 7 include a first sub-heat sink 22 and a second sub-heat sink 23, and the positions of the first sub-heat sink 22 and the second sub-heat sink 23 are fixed.

[0078] The mid-frame assembly also includes a second driving component 26, which is connected to the heat dissipation structure 3 and is used to pull the heat dissipation structure 3 relative to the first sub-heat sink 22 and the second sub-heat sink 23 so that the contact area between the first sub-heat sink 22 and the second sub-heat sink 23 and the heat dissipation structure 3 is variable. When the heat dissipation structure 3 moves relative to the first sub-heat sink 22 and the second sub-heat sink 23, the contact area between the first sub-heat sink 22 and the second sub-heat sink 23 and the heat dissipation structure 3 increases and decreases, respectively.

[0079] In this configuration, the positions of the first sub-heat sink 22 and the second sub-heat sink 23 are fixed. The contact area between the heat dissipation structure 3 and the sub-heat sink 7 is changed by controlling the movement of the heat dissipation structure 3. For example, the heat dissipation structure 3 can be moved towards the top of the display device to increase the contact area between the heat dissipation structure 3 and the sub-heat sink 7 corresponding to the top of the display device, while decreasing the contact area with the sub-heat sink 7 corresponding to the bottom of the display device. At this time, the heat dissipation of the sub-heat sink 7 corresponding to the bottom of the display device is reduced, the temperature of the back cover at the bottom of the display device is lowered, and more heat will be dissipated through the back cover 1 at the top of the display device.

[0080] Furthermore, see again Figure 12 and Figure 13 The first sub-heat sink 22 and the second sub-heat sink 23 are both located on one side of the back cover 1. The second driving component 26 is used to pull the heat dissipation structure 3 to move in the arrangement direction of the first sub-heat sink 22 and the second sub-heat sink 23. At this time, the first sub-heat sink 22 and the second sub-heat sink 23 can be fully attached to the back cover 1. The structure is simple and the design is easy.

[0081] Furthermore, see again Figures 12-15 The second driving component 26 includes a telescopic rod 27, which extends or retracts to pull the heat dissipation structure 3 relative to the first sub-heat sink 22 and the second sub-heat sink 23, causing relative movement. Specifically, one end of the telescopic rod 27 can be connected to the heat insulation cover 36, and the other end can be connected to the heat dissipation structure 3, so that one end of the telescopic rod 27 is fixed and drives the heat dissipation structure 3 to move by its own retraction or extension.

[0082] In one feasible implementation, such as Figure 16 and Figure 17 As shown, Figure 16 This is a schematic diagram of another structure of the mid-frame component provided in an embodiment of the present invention. Figure 17 for Figure 16 A cross-sectional view along the A1-A2 direction, wherein the length of the middle frame component in the first direction x is greater than the length in the second direction y, and the first direction x intersects the second direction y.

[0083] The receiving cavity 5 includes a first edge 28 and a second edge 29 opposite each other in the first direction x, and at least two partitions 6 include a first partition 30 and a second partition 31 arranged along the first direction x, with one edge of the first partition 30 being the first edge 28 and one edge of the second partition 31 being the second edge 29.

[0084] When the length of the middle frame assembly in the first direction x is greater than its length in the second direction y, the middle frame assembly has a long strip structure, and the display device it is in also has a long strip structure. This type of display device is mostly used in electronic products such as mobile phones. In this structure, since the first partition 30 and the second partition 31 in the receiving cavity 5 are located on both sides of the receiving cavity 5, the first partition 30 and the second partition 31 can correspond to the top and bottom positions of the display device, respectively. In this way, the areas where the first partition 30 and the second partition 31 are located can correspond to the hand position commonly used by the user when holding the display device. Therefore, by adjusting the temperature of the back cover at the first partition 30 and / or the second partition 31, the temperature at the user's hand touch position can be changed.

[0085] In this embodiment of the invention, when the display device is driven at a higher frequency, it generates more heat. In this case, the contact area between the sub-heat sink 7 corresponding to the first partition 30 and the heat dissipation structure 3 can be reduced to be smaller than the contact area between the sub-heat sink 7 corresponding to the first partition 30 and the heat dissipation structure 3 during low-frequency driving. And / or, the contact area between the sub-heat sink 7 corresponding to the second partition 31 and the heat dissipation structure 3 can be reduced to be smaller than the contact area between the sub-heat sink 7 corresponding to the second partition 31 and the heat dissipation structure 3 during low-frequency driving. This reduces the temperature of the back cover at the first partition 30 and / or the second partition 31 when the display device is driven at high frequencies, preventing the area touched by the user's hand from becoming too hot. This specific process will be described in detail in the following embodiments corresponding to the display device.

[0086] Furthermore, see again Figure 16 and Figure 17 The mid-frame assembly also includes a battery 32, which is located in the receiving cavity 5 and at least partially in the second partition 31. At least two sub-heat sinks 7 include a first sub-heat sink 22 corresponding to the first partition 30 and a second sub-heat sink 23 corresponding to the second partition 31, wherein the distance between the second sub-heat sink 23 and the second edge 29 is greater than the distance between the first sub-heat sink 22 and the first edge 28. In one configuration, the distance between the first sub-heat sink 22 and the first edge 28 can be 0, that is, one edge of the first sub-heat sink 22 coincides with the first edge 28.

[0087] The battery 32 is typically located at the bottom of the display device; therefore, the aforementioned second partition 31 can be considered as the area corresponding to the bottom of the display device. Due to the elongated design of the mid-frame assembly (display device), users tend to hold the bottom of the display device more often, whether viewing the screen horizontally or vertically. To address this, this embodiment of the invention designs the second sub-heat sink 23 to not extend to the edge of the second partition 31. This allows for the absence of the second sub-heat sink 23 in certain areas of the second partition 31, thereby reducing the area of ​​the second sub-heat sink 23 within the second partition 31, decreasing the heat dissipation within the second partition 31, and further reducing the temperature of the back cover at the second partition 31, thus improving the user's grip experience.

[0088] In one feasible implementation, such as Figure 18 As shown, Figure 18 This is another structural schematic diagram of the mid-frame assembly provided in an embodiment of the present invention. In a direction perpendicular to the plane where the mid-frame assembly is located, the heat sink 4 covers the portion of the rear cover 1 located in the receiving cavity 5.

[0089] The heat sink 4 includes a second main heat dissipation section 33 and a second adjustment section 34 connected together. The second main heat dissipation section 33 is located on one side of the rear cover 1, and there is a gap between the second adjustment section 34 and the rear cover 1. The contact area between the second adjustment section 34 and the heat dissipation structure 3 varies in different states. Specifically, the contact area between the second adjustment section 34 and the heat dissipation structure 3 can be adjusted by the controller 11 and the spring 12. The adjustment method is similar to that in the previous embodiment and will not be described again here.

[0090] In this configuration, the heat sink 4 is a full-surface structure. By changing the contact area between the second adjustment part 34 and the heat dissipation structure 3, the temperature of the entire back cover 1 can be changed, which in turn changes the temperature of the handheld position.

[0091] In one feasible implementation, see again Figure 1 The mid-frame assembly also includes a heat source 35 and a heat shield 36. The heat source 35, located in the housing cavity 5, is the core heat-generating component and may include a driver chip, etc. The heat source 35 is in contact with the heat spreader 3 to conduct heat through the heat spreader 3 to the heat sink 4. The heat shield 36 is located in the housing cavity 5 and covers the heat source 35, preventing heat from accumulating at the location of the rear cover 1 near the heat source 35. Instead, the heat is conducted through the heat spreader 3 to the sub-heat sink 7 and dissipated at multiple locations, preventing localized overheating.

[0092] In addition, see again Figure 1 The middle frame 2 and the back cover 1 can be bonded together with sealant 37 to form a receiving cavity 5.

[0093] Based on the same inventive concept, embodiments of the present invention also provide a display device, such as... Figure 19 As shown, Figure 19 This is a schematic diagram of a display device provided in an embodiment of the present invention. The display device includes a display panel 100 and the aforementioned mid-frame assembly 200.

[0094] The display panel 100 has a first frequency and a second frequency, the second frequency being greater than the first frequency, and the contact area between the heat sink 4 and the heat dissipation structure 3 at the second frequency being smaller than the contact area between the heat sink 4 and the heat dissipation structure 3 at the first frequency.

[0095] Based on the preceding analysis of the mid-frame assembly 200, in this embodiment of the invention, the contact area between the heat sink 4 and the heat dissipation structure 3 in the mid-frame assembly 200 is variable. Therefore, in the display device including this mid-frame assembly 200, when the display panel 100 is driven at a lower frequency (a first frequency), power consumption is low and less heat is generated. At this time, a larger contact area can be controlled between the heat dissipation structure 3 and the heat sink 4, allowing for uniform heat dissipation of the back cover 1. Since the heat generated by the display device is already relatively small, the temperature at various locations on the back cover 1 will not be too high, preventing the touch area from becoming excessively hot regardless of where the user holds the device. However, when the display panel 100 is driven at a higher frequency (a second frequency), power consumption is high, and more heat is generated. In this case, the contact area between the heat sink 4 and the heat dissipation structure 3 can be reduced. For example, the heat dissipation of the heat sink 4 at certain locations on the back cover 1 can be reduced to prevent the temperature of the back cover 1 from becoming too high at those locations. Based on this concept, when the user holds the display device, the temperature of the back cover at the hand-held location can be reduced accordingly, preventing it from becoming too hot and affecting the user's grip experience.

[0096] In one feasible implementation, combined with Figure 1 The receiving cavity 5 includes at least two partitions 6. The heat sink 4 includes at least two sub-heat sinks 7, one sub-heat sink 7 corresponds to one partition 6, at least a portion of the sub-heat sink 7 is located within its corresponding partition 6, and the contact area between the sub-heat sink 7 and the heat dissipation structure 3 is variable.

[0097] At the first frequency, there is a first contact area between the sub-heat sink 7 and the heat dissipation structure 3. This first contact area can be the maximum contact area that the sub-heat sink 7 and the heat dissipation structure 3 can have. At the second frequency, the contact area between at least some of the sub-heat sink 7 and the heat dissipation structure 3 is smaller than the first contact area, so as to reduce the temperature of the back cover at at least some partitions 6 when driven at high frequency and avoid the area touched by the user's hand from getting too hot.

[0098] Furthermore, combined Figure 16 and Figure 17The length of the middle frame assembly 200 in the first direction x is greater than its length in the second direction y, and the first direction x intersects the second direction y. The receiving cavity 5 includes a first edge 28 and a second edge 29 opposite each other in the first direction x, and at least two partitions 6 include a first partition 30 and a second partition 31 arranged along the first direction x, with one edge of the first partition 30 being the first edge 28 and one edge of the second partition 31 being the second edge 29.

[0099] At the second frequency, the contact area between the sub-heat sink 7 corresponding to the first partition 30 and the heat dissipation structure 3 is smaller than the first contact area, and / or, the contact area between the sub-heat sink 7 corresponding to the second partition 31 and the heat dissipation structure 3 is smaller than the first contact area.

[0100] Based on the foregoing analysis, the second partition 31 corresponds to the bottom of the display device, and correspondingly, the first partition 30 corresponds to the top of the display device. The following will provide a detailed explanation using three usage scenarios as examples.

[0101] First use case:

[0102] At the second frequency, when the display device displays a high-frequency vertical screen, such as Figure 20 As shown, Figure 20 This is a schematic diagram of a user-held display device provided in an embodiment of the present invention. In this usage scenario, the user usually holds the display device at the bottom and middle positions. At this time, the contact area between the sub-heat sink 7 corresponding to the second partition 31 and the heat dissipation structure 3 can be set to be smaller than the first contact area. For example, the controller 11 can be used to control the spring 12 to move, thereby causing the first adjustment part 9 in the sub-heat sink 7 corresponding to the second partition 31 to tilt up, thereby reducing the contact area between the sub-heat sink 7 and the heat dissipation structure 3, so as to reduce the heat dissipation of the sub-heat sink 7 corresponding to the bottom position of the display device, thereby reducing the temperature of the back cover at the bottom position of the display device and avoiding excessively high temperature felt by the user's hand.

[0103] It should be noted that in this usage scenario, the heat dissipation structure 3 can conduct most of the heat to the sub-heat sink 7 corresponding to the first partition 30, so that most of the heat can be dissipated through the sub-heat sink 7 corresponding to the first partition 30, thus ensuring the overall heat dissipation effect.

[0104] Second use case:

[0105] Combination Figure 16 and Figure 17 It is understood that in one embodiment of the present invention, the sub-heat sink 7 (second sub-heat sink 23) corresponding to the second partition 31 may not extend to the second edge 29 of the receiving cavity 5.

[0106] Based on this, at the second frequency, when the display device displays in landscape mode at high frequency, such as Figure 21 As shown, Figure 21 This is another schematic diagram of a user-held display device provided in an embodiment of the present invention. Users typically hold the display device at the bottom and top. However, since there is no sub-heat sink 7 in a certain area of ​​the second partition 31, heat is hardly dissipated from this area. Therefore, the temperature of the back cover at the second partition 31 will not be too high. At this time, the contact area between the sub-heat sink 7 corresponding to the first partition 30 and the heat dissipation structure 3 can be set to be smaller than the first contact area to reduce the heat dissipation of the sub-heat sink 7 at the top of the display device, thereby reducing the temperature of the back cover at the top of the display device.

[0107] The third use case:

[0108] At the second frequency, when the display device is in landscape mode, please refer again. Figure 21 Alternatively, the contact area between the sub-heat sinks 7 corresponding to the first partition 30 and the second partition 31 and the heat dissipation structure 3 can be set to be smaller than the first contact area, so as to reduce the heat dissipation of the sub-heat sinks 7 corresponding to the first partition 30 and the second partition 31 at the same time.

[0109] In one feasible implementation, when the display panel 100 is driven at a frequency greater than or equal to 120Hz, the display device generates more heat. Therefore, in this embodiment of the invention, the second frequency can be set to greater than or equal to 120Hz so that the contact area between at least a portion of the heat sink 7 and the heat dissipation structure 3 is adjusted at 120Hz or above to avoid excessively high temperatures at at least a portion of the back cover 1.

[0110] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A middle frame assembly, characterized in that, The application relates to a middle frame assembly, comprising: a middle frame; a back cover, the middle frame and the back cover having a containing cavity therebetween; a heat equalizing structure located in the containing cavity; a heat dissipation fin located in the containing cavity, the contact area between the heat dissipation fin and the heat equalizing structure being variable; the containing cavity comprising at least two sub-zones, the heat dissipation fin comprising at least two sub-heat dissipation fins, one of the sub-heat dissipation fins corresponding to one of the sub-zones, at least part of the sub-heat dissipation fins being located in the sub-zone corresponding thereto, and the contact area between the sub-heat dissipation fins and the heat equalizing structure being variable; the sub-heat dissipation fins comprising a first main heat dissipation part and a first adjusting part in communication, wherein the first main heat dissipation part is located on one side of the back cover, the first adjusting part is located on one side of the heat equalizing structure, and the contact area between the first adjusting part and the heat equalizing structure is different in different states; the middle frame assembly further comprising at least two first driving assemblies, one of the first driving assemblies corresponding to one of the first adjusting parts; the first driving assembly comprising a controller and an elastic sheet, the elastic sheet being located on the side of the first adjusting part corresponding thereto away from the heat equalizing structure, the surface of the elastic sheet close to the first adjusting part being connected with the first adjusting part, the controller being located on the side of the elastic sheet away from the heat equalizing structure, and a gap being formed between the controller and the elastic sheet, the controller being used for driving the elastic sheet to move away from the heat equalizing structure when working.

2. The middle frame assembly according to claim 1, wherein the elastic sheet comprises opposite first and second end parts, the first end part being close to the first main heat dissipation part in the direction perpendicular to the plane where the back cover is located, and the controller overlapping the second end part.

3. The middle frame assembly according to claim 1, wherein the elastic sheet comprises a middle part and an edge part, the controller overlapping the middle part in the direction perpendicular to the plane where the back cover is located.

4. The middle frame assembly according to claim 2 or 3, wherein the width of the elastic sheet is greater than or equal to the width of the first adjusting part, and the width of the controller is greater than or equal to the width of the elastic sheet; wherein the width direction of the elastic sheet, the width direction of the first adjusting part and the width direction of the controller are all parallel to the plane where the back cover is located and intersect with the arrangement direction of the first main heat dissipation part and the first adjusting part.

5. The middle frame assembly according to claim 1, wherein the elastic sheet comprises a first part and a second part, the first part being connected with the back cover or the middle frame, the surface of the second part close to the first adjusting part being connected with the first adjusting part, and a gap being formed between the second part and the controller.

6. The middle frame assembly according to claim 1, wherein the controller comprises an electromagnetic device.

7. The middle frame assembly according to claim 1, wherein the first driving assembly further comprises a spring, the spring being located between the controller and the elastic sheet, one end of the spring being connected with the controller, and the other end of the spring being connected with the elastic sheet. ​ 8. The middle frame assembly of claim 1, wherein the heat equalizing structure comprises opposite first and second surfaces, the first surface facing the back cover, and the second surface facing the middle frame. The at least two sub-radiating fins comprise a first sub-radiating fin and a second sub-radiating fin, the first adjusting portion of the first sub-radiating fin is located on one side of the first surface, and the first adjusting portion of the second sub-radiating fin is located on one side of the second surface.

9. The middle frame assembly of claim 8, wherein the back cover comprises a first recess, and the controller corresponding to the first sub-radiating fin is located in the first recess, and / or the middle frame comprises a second recess, and the controller corresponding to the second sub-radiating fin is located in the second recess.

10. The middle frame assembly of claim 1, wherein the sub-radiating fin comprises at least two first adjusting portions.

11. The middle frame assembly of claim 1, wherein the at least two sub-radiating fins comprise a first sub-radiating fin and a second sub-radiating fin, the first sub-radiating fin and the second sub-radiating fin are fixed in position. The middle frame assembly further comprises a second driving component connected to the heat equalizing structure, for pulling the heat equalizing structure to move relative to the first sub-radiating fin and the second sub-radiating fin, so that the contact area between the first sub-radiating fin and the second sub-radiating fin and the heat equalizing structure is variable, wherein when the heat equalizing structure moves relative to the first sub-radiating fin and the second sub-radiating fin, the contact area between the first sub-radiating fin and the second sub-radiating fin and the heat equalizing structure increases for one and decreases for the other.

12. The middle frame assembly of claim 11, wherein the first sub-radiating fin and the second sub-radiating fin are both located on one side of the back cover, and the second driving component is used to pull the heat equalizing structure to move in the arrangement direction of the first sub-radiating fin and the second sub-radiating fin.

13. The middle frame assembly of claim 11, wherein the second driving component comprises a telescopic rod.

14. The middle frame assembly of claim 1, wherein a length of the middle frame assembly in a first direction is greater than a length of the middle frame assembly in a second direction, the first direction intersects the second direction. The receiving cavity comprises opposite first and second edges in the first direction, and the at least two partitions comprise a first partition and a second partition arranged along the first direction, one edge of the first partition is the first edge, and one edge of the second partition is the second edge.

15. The middle frame assembly of claim 14, wherein the middle frame assembly further comprises a battery, the battery is located in the receiving cavity and at least partially located in the second partition. The at least two sub-radiating fins comprise a first sub-radiating fin corresponding to the first partition and a second sub-radiating fin corresponding to the second partition, wherein a distance between the second sub-radiating fin and the second edge is greater than a distance between the first sub-radiating fin and the first edge. ​ ​ ​ ​ ​ ​ ​ ​ 16. The middle frame assembly of claim 1, wherein the fins cover a portion of the back cover in the receiving cavity in a direction perpendicular to a plane in which the middle frame assembly lies. The fins include a second main heat dissipation portion and a second adjustment portion in communication, wherein the second main heat dissipation portion is located on one side of the back cover, and the second adjustment portion has a gap with the back cover, and the second adjustment portion has different contact areas with the heat equalization structure in different states. The middle frame assembly further comprises:

17. The middle frame assembly of claim 1, wherein, a heat source located in the receiving cavity, and the heat equalization structure is in contact with the heat source; a heat insulation cover located in the receiving cavity and covering the heat source. A display device comprising a display panel and the middle frame assembly of any one of claims 1-17.

18. A display device comprising: The display panel has a first frequency and a second frequency, and the second frequency is greater than the first frequency. The receiving cavity includes at least two sub-zones. The fins include at least two sub-fins, one of the sub-fins corresponding to one of the sub-zones, at least part of the sub-fins being located in the corresponding sub-zone, and the contact area between the sub-fins and the heat equalization structure being variable. At the first frequency, the sub-fins and the heat equalization structure have a first contact area, and at the second frequency, the contact area between part of the sub-fins and the heat equalization structure is less than the first contact area.

19. The display device of claim 18, wherein: The length of the middle frame assembly in a first direction is greater than the length in a second direction, and the first direction intersects the second direction. The receiving cavity includes a first edge and a second edge opposite in the first direction, and the at least two sub-zones include a first sub-zone and a second sub-zone arranged along the first direction, one edge of the first sub-zone being the first edge, and one edge of the second sub-zone being the second edge. At the second frequency, the contact area between the sub-fins corresponding to the first sub-zone and the heat equalization structure is less than the first contact area, and / or the contact area between the sub-fins corresponding to the second sub-zone and the heat equalization structure is less than the first contact area.

20. The display device of claim 18, wherein: The second frequency is greater than or equal to 120 Hz. ​

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