A coupling method and coupling system for an integrated lens assembly

Abstract

The application provides a coupling method and a coupling system of an integrated lens assembly. The method comprises the following steps: obtaining a power flat area diagram of two outer emitting chips on an X axis, adjusting an angle of the integrated lens assembly, obtaining a first coupling angle and a corresponding first power flat area range on an XOY plane, rotating the integrated lens assembly, obtaining a first deflection angle interval range, and recording a second power flat area range of the two outer emitting chips on the XOY plane corresponding to each rotation angle, placing the integrated lens assembly at a center position of the first coupling angle and the first power flat area range, and obtaining a responsivity flat area diagram of two outer receiving chips on the X axis, a second coupling angle, a first responsivity flat area range, and a second responsivity flat area range in sequence according to a similar method, and determining a coupling position by combining the first deflection angle interval range, the second deflection angle interval range, the second power flat area range, and the second responsivity flat area range. The coupling efficiency is high.

Description

Technical Field

[0001] This invention relates to the field of optical device technology, and in particular to a coupling method and coupling system for an integrated lens assembly. Background Technology

[0002] like Figure 1 As shown, the array optical transceiver module mainly includes an optical transmitter chip array (also known as an LD chip array), an optical receiver chip array (also known as a PD chip array), a PCBA board, and an integrated lens assembly (also known as an integrated lens assembly). The optical transmitter chip array and the optical receiver chip array are mounted on the PCBA board, and the integrated lens assembly covers the optical transmitter chip array and the optical receiver chip array. Summary of the Invention

[0003] The inventors discovered that when coupling an integrated lens assembly to an array optical transceiver module, it is necessary to simultaneously consider the coupling relationship between the integrated lens assembly and the optical emitting chip array and the optical receiving chip array. Furthermore, due to the inherent mounting deviations of the optical emitting and receiving chip arrays, and the uncertainty of the magnitude of these deviations, the coupling difficulty is significantly increased. In view of the above problems, it is necessary to propose a coupling method for an integrated lens assembly to reduce coupling difficulty and improve coupling accuracy and efficiency. The coupling method for an integrated lens assembly proposed in this invention includes the following steps:

[0004] Connect the adapter port of the integrated lens assembly to a multi-channel optical power monitoring device to power the light emitting chip array mounted on the PCBA board;

[0005] The movable integrated lens assembly monitors the optical power of the two outer emission chips of the optical emission chip array, and obtains the power flatness map of the two outer emission chips on the X-axis when the initial vertical position and the initial angle are respectively.

[0006] Adjust the angle of the integrated lens assembly. When there is no deflection angle in each power flat area map, determine the angle between the integrated lens assembly and the initial angle as the first coupling angle θ0, and determine the first power flat area range of the two outer emitter chips on the XOY plane corresponding to the first coupling angle.

[0007] Place the integrated lens assembly at the center of the first coupling angle θ0 and the first power flat region range, rotate the integrated lens assembly so that the power flat region margin on the X-axis and Y-axis meets the margin requirements, take the rotation angle range that meets the power flat region margin requirements as the first deflection angle range, and record the second power flat region range of the two outer emitter chips on the XOY plane corresponding to each rotation angle.

[0008] Connect the adapter port of the integrated lens assembly to a multi-channel optical output device to output light of the wavelength corresponding to the optical receiving chip array mounted on the PCBA board, and power the receiving chips on both sides of the optical receiving chip array.

[0009] The integrated lens assembly is placed at the center of the first coupling angle θ0 and the first power flat region range. The responsivity of the two outer receiving chips is monitored, and the responsivity flat region map of the two outer receiving chips on the X-axis is obtained respectively.

[0010] Adjust the angle of the integrated lens assembly. When there is no deflection angle in each responsivity flat area map, determine the angle between the integrated lens assembly and the initial angle as the second coupling angle β0, and determine the first responsivity flat area range of the two outer receiving chips on the XOY plane corresponding to the second coupling angle.

[0011] The integrated lens assembly is placed at the center of the second coupling angle and the first responsivity range. The integrated lens assembly is rotated so that the responsivity flat area margins on the X-axis and Y-axis meet the margin requirements. The rotation angle range that meets the responsivity flat area margin requirements is taken as the second deflection angle range. The second responsivity flat area ranges of the two outer receiver chips on the XOY plane corresponding to each rotation angle are recorded.

[0012] By combining the first deflection angle range, the second deflection angle range, the second power flatness range, and the second responsivity flatness range, the optimal coupling position of the integrated lens assembly is determined.

[0013] On the other hand, the present invention also discloses a coupling system for an integrated lens assembly, including a clamping device, a control device, an optical power monitoring device, a multi-channel optical output device, and a power supply device, wherein:

[0014] The clamping device is used to clamp the integrated lens assembly;

[0015] The optical power monitoring device is used to monitor the optical power of the two outer emitter chips of the optical emitter chip array;

[0016] The multi-channel optical output device is used to provide light corresponding to the wavelength received by the optical receiving chip;

[0017] The power supply equipment is used to supply power;

[0018] The control device is used to control the movement of the integrated lens assembly of the clamping device according to the above coupling method, and to control the operation of the optical power monitoring device, the multi-channel optical output device, and the power supply device.

[0019] Based on the above technical solution, the beneficial effects of the present invention compared with the prior art are as follows:

[0020] This invention proposes a coupling method for an integrated lens assembly. First, the power flatness region diagrams of the two outer transmitting chips on the X-axis are obtained. Then, the angle of the integrated lens assembly is adjusted until there is no skew angle in any of the power flatness region diagrams, obtaining a first coupling angle and the corresponding first power flatness region range on the XOY plane. Next, the integrated lens assembly is placed at the center of the first coupling angle θ0 and the first power flatness region range. The integrated lens assembly is rotated so that the power flatness region margins on both the X and Y axes meet the margin requirements, obtaining a first skew angle range. The second power flatness region ranges of the two outer transmitting chips on the XOY plane corresponding to each rotation angle are recorded. Then, the integrated lens assembly is placed at the center of the first coupling angle θ0 and the first power flatness region range. Following a similar method, the responsivity flatness region diagrams, second coupling angles, first responsivity flatness region ranges, and second responsivity flatness region ranges of the two outer receiving chips on the X-axis are obtained sequentially. Finally, combining the first skew angle range, second skew angle range, second power flatness region range, and second responsivity flatness region range, the optimal coupling position of the integrated lens assembly is determined.

[0021] This invention determines whether there is an angular deviation in the optical power flatness region map of the two outer emitting chips on the X-axis. When there is no angular deviation in any power flatness region map, the angle of the current integrated lens assembly is considered to be optimal, obtaining the first coupling angle and the corresponding first power flatness region range on the XOY plane. The integrated lens assembly is then placed at the center of the first coupling angle θ0 and the first power flatness region range. The integrated lens assembly is rotated so that the power flatness region margins on the X and Y axes meet the margin requirements, obtaining the first angular deviation range. The second power flatness region ranges of the two outer emitting chips on the XOY plane corresponding to each rotation angle are recorded. In other words, after correcting the mounting angular deviation of the emitting chips by adjusting the angle of the integrated lens assembly, this optimal angle is directly maintained to determine the center of the flatness region range on the XOY plane to correct the mounting displacement deviation of the chips on the X and Y axes. The algorithm logic is simple and the coupling speed is fast. After coupling the optical emitting chip array, the initial horizontal coupling position of the integrated lens assembly can be found relatively quickly and accurately. Then, coupling of the optical receiving chip array begins. Compared to simultaneously coupling the optical emitting and receiving chip arrays, this reduces coupling difficulty and facilitates device implementation. Finally, considering the first offset angle range, the second offset angle range, the second power flatness range, and the second responsivity flatness range, the optimal coupling margin is expected to be obtained after the integrated lens assembly is fixed, improving product reliability. The coupling method of the integrated lens assembly of this invention has low coupling difficulty and high efficiency. It can also be implemented using automated coupling equipment, facilitating production automation, and the coupled array optical transceiver module has high quality. Attached Figure Description

[0022] Figure 1This is a schematic diagram of the structure of the array optical transceiver module;

[0023] Figure 2 This is a flowchart illustrating a coupling method for an integrated lens assembly according to Embodiment 1 of the present invention.

[0024] Figure 3 This is a flowchart illustrating step S120 in Embodiment 1 of the present invention;

[0025] Figure 4 This is a schematic diagram of the power flatness region of the two outer emitter chips on the X-axis in Embodiment 1 of the present invention;

[0026] Figure 5 This is a schematic diagram of another power flat region of the two outer emitter chips on the X-axis in Embodiment 1 of the present invention;

[0027] Figure 6 This is a flowchart illustrating step S130 in Embodiment 1 of the present invention;

[0028] Figure 7 This is a schematic diagram of the rotation of the integrated lens assembly in Embodiment 1 of the present invention;

[0029] Figure 8 This is a schematic diagram of determining the flat area range and the center O0 of the flat area of ​​LD1 and LD4 on the XOY horizontal plane according to the ellipse formula in Embodiment 1 of the present invention.

[0030] Figure 9 This is a flowchart illustrating step S140 in Embodiment 1 of the present invention;

[0031] Figure 10 This is a flowchart illustrating step S160 in Embodiment 1 of the present invention;

[0032] Figure 11 This is a flowchart illustrating step S190 in Embodiment 1 of the present invention;

[0033] Figure 12 This is a schematic diagram of the coupling system of an integrated lens assembly in Embodiment 2 of the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0035] In this invention,

[0036] Example 1

[0037] This embodiment proposes a coupling method for an integrated lens assembly, combining... Figure 2 As shown, steps S110-S190 are included:

[0038] The S110 connects the adapter port of the integrated lens assembly to a multi-channel optical power monitoring device to power the optical emitting chip array mounted on the PCBA board.

[0039] In practical applications, before step S110, the optical transmitter chip array (generally abbreviated as LD array) and the optical receiver chip array (generally abbreviated as PD array) are attached to the PCBA board and the wire bonding operation is completed.

[0040] S120, a movable integrated lens assembly, monitors the optical power of the two outer emission chips of the optical emission chip array, and obtains the power flatness map of the two outer emission chips on the X-axis when they are in the initial vertical position and at the initial angle.

[0041] Specifically, in combination Figure 3 As shown, this step includes sub-steps S121-S122:

[0042] Step S121: Place the integrated lens assembly in the initial position and initial angle.

[0043] Step S122: Move the integrated lens assembly along one direction of the X-axis and record the power values ​​generated by the two outer emitting chips respectively. If the power of the two optical paths meets the preset power value range, continue to move along the current direction. When the power of the two optical paths is less than the minimum value of the preset power value range, move the two outer emitting chips in the opposite direction until the power of the two optical paths is less than the minimum value of the preset power value range, forming a power flat area map of the two outer emitting chips on the X-axis.

[0044] The preset power value range can be from 90% of the maximum power of the transmitting chip to the maximum power. When the two outer transmitting chips move along the X-axis, if the power of both optical paths meets the preset power value range, they continue to move in the same direction until the optical power is less than 90% of the maximum power. Then, the two outer transmitting chips move in the opposite direction, ensuring that the power of the two reverse optical paths is within the preset power value range, until it is less than 90% of the maximum power, at which point they stop. During the movement of the integrated lens assembly along the X-axis, a power flattening region map is formed. The point where the X-axis turns in one direction is defined as the inflection point of the power flattening region map. Specifically, the process of the integrated lens assembly moving along the X-axis is as follows:

[0045] (1) If the power values ​​of the two optical paths are less than the minimum value of the preset power value range, the two outer transmitting cores will be moved in the opposite direction, and the power value will increase to the minimum value of the preset power value range, then increase to the maximum value of the preset power value range, then maintain the maximum value, and then gradually decrease until it is less than the minimum value of the preset power value range.

[0046] (2) If the power values ​​of the two optical paths are greater than the minimum value of the preset power value range, they continue to move in the same direction. If the power increases further, they continue to move in the same direction until they increase to the maximum value of the preset power value range. Then they maintain the maximum value and the power decreases until the minimum value of the preset power value range is reached, at which point they return to the aforementioned situation (1).

[0047] For ease of understanding, the following is in conjunction with the appendix. Figure 1 , Figure 4 , Figure 5 Please provide some explanation. For example... Figure 1 As shown, assume the LD array and PD array are arranged along the X-axis; the direction perpendicular to the X-axis on the PCBA board plane is the Y-axis; the height direction from the PCBA board is the Z-axis; and the integrated lens assembly is abbreviated as lens. In this embodiment, the LD array integrates four LD chips. For this array chip, since the LDs on both sides are well coupled, the optical path of the LD in the middle does not need to be considered.

[0048] Specifically: Place the lens at the initial design position (x0, y0) and at the initial angle, move it along the X-axis, and read the optical power of LD1 and LD4 respectively until the power flattening region pattern of LD1 and LD4 on the X-axis is determined. The lens movement rule can be: first move it in one direction along the X-axis until the optical power of LD1 and LD4 is less than the minimum value of the preset power value range (i.e., determine the inflection point of the two optical power patterns), then move it in the opposite direction to find the position where the optical power of LD1 and LD4 is less than the minimum value of the preset power value range in the other direction, forming the power flattening region pattern of LD1 and LD4 on the X-axis at the initial y0 position. Figure 4 , Figure 5 The diagram illustrates the power flatness region of the two outer emitter chips on the X-axis for two different scenarios.

[0049] S130, adjust the angle of the integrated lens assembly. When there is no deflection angle in each power flat area map, determine the angle between the integrated lens assembly and the initial angle as the first coupling angle θ0, and determine the first power flat area range of the two outer emitter chips on the XOY plane corresponding to the first coupling angle.

[0050] The integrated lens assembly is placed at the initial design position (x0, y0) and at the initial angle. It is then rotated based on this initial angle until the integrated lens assembly and the transmitting chip are at the same angle, thus determining the first coupling angle θ0 between the integrated lens assembly and the initial angle. Specifically, as follows... Figure 6 As shown, this step includes at least sub-steps S131-S133, wherein:

[0051] Step S131: Adjust the angle of the integrated lens assembly and determine whether the X-axis coordinates of the inflection points of the power flatness maps of the two outer emission chips are consistent in the two directions.

[0052] Step S132: If the results are consistent, it is determined that the power flatness map does not contain any skew angles; otherwise, step S131 is executed again until a power flatness map without skew angles is generated.

[0053] Step S133: Determine the angle between the integrated lens assembly and the initial angle as the first coupling angle θ0, and determine the range of the first power flat region of the two outer emitter chips on the XOY plane corresponding to the first coupling angle.

[0054] For ease of understanding, please refer to the appendix below. Figure 4 Appendix Figure 5 , Figure 7 , Figure 8 Some explanations are needed. As the lens moves to different positions, different optical power values ​​will be obtained; the so-called flat area graph is actually the optical power graph corresponding to different coordinates; whether there is an angle is generally automatically identified by the preset machine, but it can also be displayed for manual viewing. First, analyze the power flat area graphs of LD1 and LD4 on the X-axis to determine if there is an angle; the judgment principle is that if the inflection points of the two light sources are misaligned in at least one direction, regardless of whether the inflection points coincide in the other direction, then an angle is considered to exist (e.g., ...). Figure 5 As shown, the inflection points at both ends of the power flatness region diagrams for LD1 and LD4 do not coincide in both directions, indicating that the chip mounting is off-angled. If the inflection points in both directions of the two beams coincide (e.g., ... Figure 4 As shown, if the inflection points at both ends of the power flatness region diagrams of LD1 and LD4 coincide, then it is considered that there is no deflection angle.

[0055] If there is no deflection angle, then the existing angle is taken as the optimal angle θ0, and subsequent steps are performed; if there is a deflection angle, then, as follows: Figure 7 As shown, select the corresponding direction to rotate the lens by a certain angle (e.g., rotation range of 0.2°), and then follow the steps to redetermine the power flatness region diagram of LD1 and LD4 of the rotated lens on the X-axis of the X0Y plane.

[0056] If the overlap of the flat regions of the two new optical paths increases (or the inflection points move closer), continue rotating the lens in the same direction and angle, and repeat the process to determine the new flat region range until the overlap of the flat regions of the two optical paths decreases. Then, reduce the rotation amplitude (e.g., 0.1°) and rotate in the opposite direction until the flat regions of the two optical paths overlap (i.e., the inflection points of the power flat region patterns of the two LDs coincide, similar to...). Figure 4 (The right figure shows the power flat region), thus determining the optimal θ0 angle.

[0057] If the overlap of the flat regions of the two new optical paths decreases, the rotation is reversed, similar to the process above, to redetermine the range of the new flat regions until the flat regions of the two optical paths overlap, thereby determining the optimal angle θ0, which is called the first coupling angle.

[0058] Combination Figure 8 As shown, determining the range of the first power flat region of the two outer emitter chips on the XOY plane corresponding to the first coupling angle θ0 includes the following steps:

[0059] First determine the center of the flat region on the X-axis (e.g.) Figure 8 As shown, assume the left and right endpoints of the power flatness region map are X. 11 and X 12 The center of the flat region on the X-axis is X0; then, based on this center of the flat region on the X-axis, move along the Y-axis to find the center of the power flat region on the Y-axis (similarly, the endpoints of the coincident flat regions on the Y-axis are set as Y). 11 and Y 12 Based on the positions of the two boundary endpoints of the flat area on the X-axis and the two boundary endpoints of the flat area on the Y-axis, the range of the flat area LD1 and LD4 on the XOY horizontal plane and the center O0 of the flat area are determined according to the ellipse formula.

[0060] Since the light spot is an irregular circle, the coupling center position is represented by the elliptical formula (xh) to simplify the calculation. 2 / a 2 +(yk) 2 / b 2 =1, confirming that X is about to be determined. 11 X 12 Y 11 Y 12 Substituting the coordinates into the above ellipse formula, we determine the values ​​of h, k, a, and b. That is, the coordinate positions (h, k) are the coupling center position O0, and the region inside the ellipse boundary line is the range of the first power flat region.

[0061] S140, place the integrated lens assembly at the center of the first coupling angle θ0 and the first power flat region range, rotate the integrated lens assembly so that the power flat region margin on the X-axis and Y-axis meets the margin requirements, take the rotation angle range that meets the power flat region margin requirements as the first deflection angle range, and record the second power flat region range of the two outer emitter chips on the XOY plane corresponding to each rotation angle.

[0062] like Figure 9 As shown, this step includes at least sub-steps S141-S146. Specifically:

[0063] Step S141: Place the integrated lens assembly at the center of the first coupling angle θ0 and the first power flat region.

[0064] Step S142: Rotate the integrated lens assembly to redetermine the power flatness region range and center of the power flatness region of the two outer emission chips on the X-axis of the X0Y plane after rotation.

[0065] The integrated lens assembly can be rotated 0.1° in a certain direction, and the resulting angle is denoted as θ. i Then, the two beams are redefined at θ. i When the angle is defined, the corresponding flat area on the X-axis of the X0Y plane and the center of the flat area on the X-axis.

[0066] Step S143: At the center position of the power flat region on the X-axis, determine the range and center of the power flat region on the Y-axis.

[0067] Step S144: Determine the center of the power flat region and the coordinate range of the power flat region on the rotated X0Y plane according to the ellipse formula.

[0068] Step S145: Determine whether the power flatness margins on the X-axis and Y-axis meet the requirements when the integrated lens assembly is located at the center of the power flatness region on the rotated XOY plane. If they do, continue rotating in the original direction until the power flatness margins on the X-axis and Y-axis do not meet the requirements. Record the first boundary angle that meets the requirements for this rotation and the range of the second power flatness region of the two outer emitter chips on the XOY plane corresponding to each rotation angle.

[0069] For ease of understanding, please refer to Figure 8 As shown, the concepts related to margin requirements include: assuming the lens component is located at point 0, then on the Y-axis, Y... 11 and Y 12 The optical power within the specified range meets the requirements. This means that even if the lens component deviates from 0° during subsequent processes or use, as long as the displacement remains within this range, the optical power will still meet the requirements. In other words, when the lens coupling is fixed at the optimal point 0°, the Y-axis flat region margin is [missing information]. 11 and Y 12 The distance between them. Additionally, there is a minimum flat region requirement for structural design stability; therefore, in actual coupling, the flat region margin only needs to be greater than this minimum requirement.

[0070] This step may include the following steps when executed:

[0071] Determine whether to place the lens component at the θ determined in step S144. iWhen the angle is the center of the flat area on the XOY plane, check whether the flat area margins on the X and Y axes meet the requirements. If they do, continue to rotate 0.1° in the original direction and repeat the above operation to determine the coordinate range of the flat area on the XOY plane for the corresponding angle, until the power flat area margins on the X and Y axes do not meet the requirements. Record the first boundary angle that meets the requirements for this rotation and the second power flat area range of the two outer emitter chips on the XOY plane corresponding to each rotation angle.

[0072] Step S146: Rotate the integrated lens assembly in the opposite direction until the power flatness margin on the X-axis and Y-axis does not meet the requirements. Record the second boundary angle that meets the requirements for this reverse rotation and the range of the second power flatness region of the two outer emitter chips on the XOY plane corresponding to each rotation angle.

[0073] Steps S110-S140 involve scanning only the optical power graphs of LD1 and LD4 on the X-axis. Based on the inflection points of both, it is possible to directly determine whether an angular misalignment exists. Furthermore, the proximity of the inflection points on the X-axis determines whether the angle has been adjusted to the optimal level. By simultaneously observing two optical paths and adjusting only the lens angle, the angle range that can correct the chip's mounting misalignment can be obtained. It eliminates the need to consider unpredictable changes in optical power or responsivity caused by mounting displacement deviations of the LD chip on the X and Y axes. This approach reduces the difficulty of identification, simplifies the coupling algorithm logic, and lowers the coupling difficulty while increasing coupling speed.

[0074] After correcting the mounting offset angle of the LD or PD chip by adjusting the lens angle, the center of the flat area on the XOY plane is determined by maintaining this optimal angle. This corrects the mounting displacement deviation of the chip on the X and Y axes. The algorithm logic is simple and the coupling speed is fast.

[0075] Step S140 uses the center of the flat area range where the chip's mounting displacement deviation on the X and Y axes has been corrected as the base point to determine the angle range that meets the conditions. This means that the angles and corresponding flat areas determined later have already corrected the chip's mounting displacement deviation on the X and Y axes. Therefore, the only variable that is actually adjusted later is the angle. The coupling logic is simple and easy to implement. Moreover, using the center of the flat area range as the base point can also determine the flat area range of each angle more quickly and accurately.

[0076] Since the light-emitting surface (8-10μm) of an LD chip is generally smaller than the photosensitive surface (35-60μm) of a PD chip, the LD requires higher positional accuracy. This embodiment of the invention first couples the LD, enabling a relatively quick and accurate initial horizontal coupling position to be found, before coupling the PD chip. Compared to simultaneously coupling the PD and LD chips, this reduces coupling difficulty and facilitates device implementation. The following steps will describe the coupling process of the PD chip.

[0077] The S150 connects the adapter port of the integrated lens assembly to a multi-channel optical output device to output light of the wavelength corresponding to the optical receiver chip array mounted on the PCBA board, and to power the receiver chips on both sides of the optical receiver chip array.

[0078] S160, the integrated lens assembly is placed at the center of the first coupling angle θ0 and the first power flat region range, and the responsivity of the two outer receiving chips is monitored to obtain the responsivity flat region map of the two outer receiving chips on the X-axis.

[0079] like Figure 10 As shown, this step includes the following sub-steps:

[0080] S161, the integrated lens assembly is placed at the center of the first coupling angle θ0 and the first power flat region.

[0081] S162, the integrated lens assembly is moved along one direction of the X-axis. If the responsivity of the two outer receiving chips meets the preset responsivity range, it continues to move along the current direction. When the responsivity of the two channels is less than the minimum value of the preset responsivity range, the two outer receiving chips are moved in the opposite direction until the responsivity of the two channels is less than the minimum value of the preset responsivity range, thus forming a responsivity flat area map of the two outer receiving chips on the X-axis.

[0082] When coupling a PD chip, the lens is placed at the center of the first coupling angle θ0 and the first power flat region. Generally, the flat region of a PD chip is larger than that of an LD. When coupling a PD, coupling is done directly at the center of the flat region of the LD. Compared with direct, aimless coupling, this method is more efficient and saves more time.

[0083] S170, adjust the angle of the integrated lens assembly. When there is no deflection angle in each responsivity flat area map, determine the angle between the integrated lens assembly and the initial angle as the second coupling angle β0, and determine the range of the first responsivity flat area of ​​the two outer receiving chips on the XOY plane corresponding to the second coupling angle.

[0084] Specifically, adjust the angle of the integrated lens assembly until the X-axis coordinates of the inflection points of the power flatness region map in both directions are consistent, then it is determined that there is no skew in the power flatness region map.

[0085] Otherwise, rotate the integrated lens assembly by a preset angle until a response flat area map without deflection is generated;

[0086] The angle between the integrated lens assembly and the initial angle is determined as the second coupling angle β0, and the range of the first responsivity flat region of the two outer receiving chips on the XOY plane corresponding to the second coupling angle is determined.

[0087] The method for determining the range of the first responsivity flat region of the two outer receiving chips on the XOY plane corresponding to the second coupling angle can refer to step S13, including: determining the center of the flat region on the X-axis of the responsivity flat region map, and finding the center of the flat region on the Y-axis based on the center of the flat region on the X-axis; determining the range of the first receiving flat region of the two outer receiving chips on the XOY horizontal plane according to the ellipse formula based on the positions of the two boundary endpoints of the flat region on the X-axis and the two boundary endpoints of the flat region on the Y-axis, a total of four points.

[0088] S180, place the integrated lens assembly at the center of the second coupling angle and the first responsivity range, rotate the integrated lens assembly so that the responsivity flat area margin on the X-axis and Y-axis meets the margin requirement, take the rotation angle range that meets the responsivity flat area margin requirement as the second deflection angle range, and record the second responsivity flat area range of the two outer receiving chips on the XOY plane corresponding to each rotation angle.

[0089] Specifically, the integrated lens assembly can be placed at the center of the second coupling angle and the first responsivity range. Then, the integrated lens assembly is rotated to redetermine the responsivity flatness range and center of the two outer receiving chips on the X-axis of the XOY plane after rotation. Next, at the center of the responsivity flatness range on the X-axis, the responsivity flatness range and center of the Y-axis are determined. Then, the center of the responsivity flatness range and the coordinate range of the responsivity flatness range on the XOY plane after rotation are determined according to the ellipse formula. Then, it is determined whether the responsivity flatness range margins on both the X-axis and Y-axis meet the requirements when the integrated lens assembly is located at the center of the responsivity flatness range on the XOY plane after rotation. If they do, rotation continues in the original direction until the responsivity flatness range margins on the X-axis and Y-axis no longer meet the requirements. The third boundary angle at which this rotation meets the requirements and the second responsivity flatness range of the two outer receiving chips on the XOY plane corresponding to each rotation angle are recorded. Next, rotate the integrated lens assembly in the opposite direction until the responsivity flatness margin on the X and Y axes no longer meets the requirements. Record the fourth boundary angle at which this reverse rotation meets the requirements, and the range of the second responsivity flatness region of the two outer emitter chips on the XOY plane corresponding to each rotation angle. To improve coupling efficiency, if the rotation angle exceeds the first deflection angle region when continuing to rotate the integrated lens assembly in the original direction, it indicates that the requirements of the emitter are no longer met, and there is no need to continue rotating the integrated lens assembly.

[0090] The coupling method of the PD chip in steps S150-S180 is basically the same as the coupling method of the LD chip in steps S110-140. Therefore, the specific coupling steps can be referred to the previous text and will not be repeated here.

[0091] S190, combining the first deflection angle range, the second deflection angle range, the second power flat range, and the second responsivity flat range, determines the optimal coupling position of the integrated lens assembly.

[0092] like Figure 11 As shown, this step includes sub-steps S191-S193. Specifically:

[0093] Step S191: Determine all overlapping angles within the first and second deflection angle intervals.

[0094] Step S192: Based on the second power flat region range and the second responsivity flat region range, determine the common flat region range of the two outer transmitting chips and the two outer receiving chips on the XOY horizontal plane at each overlap angle.

[0095] Step S193: Select the final angle that meets the margin requirement, and take the center of the common flat area range corresponding to the final angle as the optimal coupling position of the integrated lens assembly.

[0096] Assume that all overlapping angles within the first and second deflection angle intervals are γ. i , where i is 1, 2, 3..., used to mark the sequence number of the overlap angle. Compare the recorded ranges of the second power flat region and the second responsivity flat region on the XOY plane for each γi angle, and determine the overlapping region within these two flat regions, which is γi. i The angle represents the common flat area range of LD1, LD4, PD1, PD4 on the XOY horizontal plane. Based on the required margin, the angle with the largest margin in the overlapping or flat area can be selected as the final angle γ0 of the lens. The center of the common flat area range of LD1, LD4, PD1, PD4 on the XOY horizontal plane (i.e., the center of the overlapping area) is the optimal coupling position of the lens on the XOY horizontal plane.

[0097] This embodiment takes into account the flat area range of the LD and the flat area range of the PD recorded from various angles, and directly determines the center position as the optimal coupling position of the lens within the flat area range where the LD and PD overlap. This can ensure that the lens component can obtain the best coupling margin after it is fixed, thereby improving product reliability.

[0098] This invention determines whether there is an angular deviation in the optical power flatness region map of the two outer emitting chips on the X-axis. When there is no angular deviation in any power flatness region map, the angle of the current integrated lens assembly is considered to be optimal, obtaining the first coupling angle and the corresponding first power flatness region range on the XOY plane. The integrated lens assembly is then placed at the center of the first coupling angle θ0 and the first power flatness region range. The integrated lens assembly is rotated so that the power flatness region margins on the X and Y axes meet the margin requirements, obtaining the first angular deviation range. The second power flatness region ranges of the two outer emitting chips on the XOY plane corresponding to each rotation angle are recorded. In other words, after correcting the mounting angular deviation of the emitting chips by adjusting the angle of the integrated lens assembly, this optimal angle is directly maintained to determine the center of the flatness region range on the XOY plane to correct the mounting displacement deviation of the chips on the X and Y axes. The algorithm logic is simple and the coupling speed is fast. After coupling the optical emitting chip array, the initial horizontal coupling position of the integrated lens assembly can be found relatively quickly and accurately. Then, coupling of the optical receiving chip array begins. Compared to simultaneously coupling the optical emitting and receiving chip arrays, this reduces coupling difficulty and facilitates device implementation. Finally, considering the first offset angle range, the second offset angle range, the second power flatness range, and the second responsivity flatness range, the optimal coupling margin is expected to be obtained after the integrated lens assembly is fixed, improving product reliability. The coupling method of the integrated lens assembly of this invention has low coupling difficulty and high efficiency. It can also be implemented using automated coupling equipment, facilitating production automation, and the coupled array optical transceiver module has high quality.

[0099] Example 2

[0100] This embodiment also discloses a coupling system for implementing the coupling method of Embodiment 1, combined with... Figure 12 As shown, it includes a clamping device 10, a control device 20, an optical power monitoring device 30, a multi-channel optical output device 40, and a power supply device 50, wherein:

[0101] The clamping device 10 is used to clamp the integrated lens assembly; the optical power monitoring device 30 is used to monitor the optical power of the two outer emitting chips of the optical emitting chip array (which can be a multi-channel optical power meter); the multi-channel optical output device 40 is used to provide light corresponding to the wavelength received by the optical receiving chip; the power supply device 50 is used to provide power; and the control device 20 is used to control the clamping device 10 to move the integrated lens assembly and control the operation of the optical power monitoring device 30, the multi-channel optical output device 40, and the power supply device 50 according to the following method:

[0102] S201 connects the adapter optical port of the integrated lens assembly to the multi-channel optical power monitoring device 30, and controls the power supply device 50 to supply power to the optical emitting chip array.

[0103] S202, a movable integrated lens assembly, monitors the optical power of the two outer emission chips of the optical emission chip array, and obtains the power flatness map of the two outer emission chips on the X-axis when they are in the initial vertical position and at the initial angle.

[0104] S203, adjust the angle of the integrated lens assembly. When there is no deflection angle in each power flat area map, determine the angle between the integrated lens assembly and the initial angle as the first coupling angle, and determine the first power flat area range of the two outer emitter chips on the XOY plane corresponding to the first coupling angle.

[0105] S204, place the integrated lens assembly at the center of the first coupling angle and the first power flat area range, rotate the integrated lens assembly so that the power flat area margin on the X-axis and Y-axis meets the margin requirements, take the rotation angle range that meets the power flat area margin requirements as the first deflection angle range, and record the second power flat area range of the two outer emitter chips on the XOY plane corresponding to each rotation angle.

[0106] S205 connects the adapter optical port of the integrated lens assembly to the multi-channel optical output device 40, and the power supply device 50 supplies power to the optical receiver chip array.

[0107] S206, the integrated lens assembly is placed at the center of the first coupling angle and the first power flat region range, and the responsivity of the two outer receiving chips (i.e. the actual optical power received by the receiving chips) is monitored to obtain the responsivity flat region map of the two outer receiving chips on the X-axis.

[0108] S207, adjust the angle of the integrated lens assembly. When there is no deflection angle in each responsivity flat area map, determine the angle between the integrated lens assembly and the initial angle as the second coupling angle, and determine the first responsivity flat area range of the two outer receiving chips on the XOY plane corresponding to the second coupling angle.

[0109] S208, place the integrated lens assembly at the center of the second coupling angle and the first responsivity range, rotate the integrated lens assembly so that the responsivity flat area margin on the X-axis and Y-axis meets the margin requirement, take the rotation angle range that meets the responsivity flat area margin requirement as the second deflection angle range, and record the second responsivity flat area range of the two outer receiving chips on the XOY plane corresponding to each rotation angle.

[0110] S209, combining the first deflection angle range, the second deflection angle range, the second power flat range, and the second response flat range, determine the optimal coupling position of the integrated lens assembly.

[0111] The specific working steps of this system can be referred to in Implementation Example 1, and will not be repeated here.

[0112] In the detailed description above, various features are combined together in a single embodiment to simplify this disclosure. This approach to disclosure should not be construed as reflecting an intention that embodiments of the claimed subject matter require more features than are explicitly stated in each claim. Rather, as reflected in the appended claims, the invention is presented with fewer features than all of the features in a single disclosed embodiment. Therefore, the appended claims are hereby explicitly incorporated into the detailed description, with each claim representing a separate preferred embodiment of the invention.

[0113] The foregoing description includes examples of one or more embodiments. It is certainly impossible to describe all possible combinations of components or methods in order to describe the above embodiments, but those skilled in the art will recognize that further combinations and arrangements of the various embodiments are possible. Therefore, the embodiments described herein are intended to cover all such changes, modifications, and variations that fall within the scope of the appended claims. Furthermore, the term “comprising” as used in the specification or claims is interpreted in a manner similar to the term “including,” just as “including,” is interpreted as a conjunction in the claims. Additionally, the use of any term “or” in the specification of the claims is intended to mean “non-exclusive or.”

Claims

1. A coupling method for an integrated lens assembly, characterized in that, Includes the following steps: Connect the adapter port of the integrated lens assembly to a multi-channel optical power monitoring device to power the optical emitting chip array; The movable integrated lens assembly monitors the optical power of the two outer emission chips of the optical emission chip array, and obtains the power flatness map of the two outer emission chips on the X-axis when the initial vertical position and the initial angle are respectively. Adjust the angle of the integrated lens assembly. When there is no deflection angle in each power flat area map, determine the angle between the integrated lens assembly and the initial angle as the first coupling angle, and determine the first power flat area range of the two outer emitter chips on the XOY plane corresponding to the first coupling angle. Place the integrated lens assembly at the center of the first coupling angle and the first power flat region range, rotate the integrated lens assembly so that the power flat region margin on the X-axis and Y-axis meets the margin requirements, take the rotation angle range that meets the power flat region margin requirements as the first deflection angle range, and record the second power flat region range of the two outer emitter chips on the XOY plane corresponding to each rotation angle. Connect the adapter port of the integrated lens assembly to the multi-channel optical output device to power the optical receiver chip array; The integrated lens assembly is placed at the center of the first coupling angle and the first power flat region range. The responsivity of the two outer receiving chips is monitored, and the responsivity flat region map of the two outer receiving chips on the X-axis is obtained respectively. Adjust the angle of the integrated lens assembly. When there is no deflection angle in each responsivity flat area map, determine the angle between the integrated lens assembly and the initial angle as the second coupling angle, and determine the first responsivity flat area range of the two outer receiving chips on the XOY plane corresponding to the second coupling angle. The integrated lens assembly is placed at the center of the second coupling angle and the first responsivity flat region range. The integrated lens assembly is rotated so that the responsivity flat region margins on the X-axis and Y-axis meet the margin requirements. The rotation angle range that meets the responsivity flat region margin requirements is taken as the second deflection angle range. The second responsivity flat region ranges of the two outer receiver chips on the XOY plane corresponding to each rotation angle are recorded. Determine all overlapping angles within the first and second deflection angle intervals; Based on the range of the second power flat region and the range of the second responsivity flat region, the common flat region range of the two outer transmitting chips and the two outer receiving chips on the XOY horizontal plane is determined at each overlap angle. Select the final angle that meets the margin requirements, and take the center of the common flat area range corresponding to the final angle as the optimal coupling position of the integrated lens assembly.

2. The method as described in claim 1, characterized in that, The movable integrated lens assembly monitors the optical power of the two outer emitting chips of the optical emitting chip array, and obtains power flatness maps of the two outer emitting chips on the X-axis at the initial vertical position and initial angle, including: Position the integrated lens assembly at the initial position and initial angle; If the optical power of the two outer emitter chips meets the preset power value range, they continue to move in the current direction. When the optical power of the two emitter chips is less than the minimum value of the preset power value range, they move in the opposite direction until the optical power of the two emitter chips is less than the minimum value of the preset power value range, thus forming a power flat area map of the two outer emitter chips on the X-axis.

3. The method as described in claim 1, characterized in that, The angle of the integrated lens assembly is adjusted so that, when there is no skew angle in each power flatness region map, the angle between the integrated lens assembly and the initial angle is determined as the first coupling angle, and the first power flatness region range of the two outer emitter chips on the XOY plane corresponding to the first coupling angle is determined, including: Adjust the angle of the integrated lens assembly and determine whether the X-axis coordinates of the inflection points of the power flatness diagrams of the two outer emitter chips are consistent in both directions; If they match, it is determined that the power flatness map does not have any skew angles; otherwise, the angle of the integrated lens assembly is adjusted again to determine whether the X-axis coordinates of the inflection points of the power flatness maps of the two outer emitter chips in both directions are consistent, until a power flatness map without skew angles is generated. The angle between the integrated lens assembly and the initial angle is determined as the first coupling angle θ0, and the range of the first power flat region of the two outer emitter chips on the XOY plane corresponding to the first coupling angle is determined.

4. The method as described in claim 3, characterized in that, The determination of the first power flat region range of the two outer emitter chips on the XOY plane corresponding to the first coupling angle includes: Determine the center of the flat region on the X-axis of the power flat region map; Based on the center of the flat region on the X-axis, find the center of the flat region on the Y-axis; Based on the two boundary endpoints of the flat region on the X-axis and the two boundary endpoints of the flat region on the Y-axis, the range of the first power flat region of the two outer emitter chips on the XOY horizontal plane is determined according to the ellipse formula.

5. The method as described in claim 1, characterized in that, The integrated lens assembly is placed at the center of the first coupling angle and the first power flat region range. The integrated lens assembly is rotated so that its power flat region margins on both the X and Y axes meet the margin requirements. The rotation angle range that meets the power flat region margin requirements is taken as the first deflection angle range. The second power flat region ranges of the two outer emitter chips on the XOY plane corresponding to each rotation angle are recorded, including: The integrated lens assembly is placed at the center of the first coupling angle and the first power flat region. The rotating integrated lens assembly redefines the power flatness region range and center of the power flatness region of the two outer emitter chips on the X0Y plane X-axis after rotation; At the center position of the power flat region on the X-axis, determine the range and center of the power flat region on the Y-axis; Determine the center of the power flat region and the coordinate range of the power flat region on the rotated X0Y plane according to the ellipse formula; When the integrated lens assembly is located at the center of the power flat area on the rotated XOY plane, determine whether the power flat area margins on the X and Y axes meet the requirements. If they do, continue rotating in the original direction until the power flat area margins on the X and Y axes no longer meet the requirements. Record the first boundary angle that meets the requirements for this rotation and the range of the second power flat area of ​​the two outer emitter chips on the XOY plane corresponding to each rotation angle. Then rotate the integrated lens assembly in the opposite direction until the power flatness margin on the X and Y axes does not meet the requirements. Record the second boundary angle that meets the requirements after this reverse rotation and the range of the second power flatness region of the two outer emitter chips on the XOY plane corresponding to each rotation angle.

6. The method as described in claim 1, characterized in that, The integrated lens assembly is placed at the center of the first coupling angle and the first power flat region. The responsivity of the two outer receiving chips is monitored, and the responsivity flat region maps of the two outer receiving chips on the X-axis are obtained, including: The integrated lens assembly is placed at the center of the first coupling angle and the first power flat region. If the responsivity of the two outer receiving chips meets the preset responsivity range, they continue to move in the current direction. When the responsivity of the two channels is less than the minimum value of the preset responsivity range, the two outer receiving chips move in the opposite direction until the responsivity of the two channels is less than the minimum value of the preset responsivity range, forming a flat responsivity region map of the two outer receiving chips on the X-axis.

7. The method as described in claim 1, characterized in that, The angle of the integrated lens assembly is adjusted so that there is no skew angle in each responsivity flatness region map. The angle between the integrated lens assembly and the initial angle is then determined as the second coupling angle. The first responsivity flatness region range of the two outer receiver chips on the XOY plane corresponding to the second coupling angle is also determined, including: Adjust the angle of the integrated lens assembly until the X-axis coordinates of the inflection points of the power flatness region map in both directions are consistent. Then it is determined that there is no skew in the power flatness region map. Otherwise, rotate the integrated lens assembly by a preset angle until a response flat area map without deflection is generated; The angle between the integrated lens assembly and the initial angle is determined as the second coupling angle β0, and the range of the first responsivity flat region of the two outer receiving chips on the XOY plane corresponding to the second coupling angle is determined.

8. The method as described in claim 1, characterized in that, The integrated lens assembly is placed at the center of the second coupling angle and the first responsivity flat region range. The integrated lens assembly is rotated so that the responsivity flat region margins on both the X and Y axes meet the margin requirements. The rotation angle range that meets the responsivity flat region margin requirements is taken as the second deflection angle range. The second responsivity flat region ranges of the two outer receiver chips on the XOY plane corresponding to each rotation angle are recorded, including: The integrated lens assembly is placed at the center of the second coupling angle and the first responsivity flat region. The rotating integrated lens assembly redetermines the range and center of the responsivity flat zone of the two outer receiving chips on the X0Y plane X-axis after rotation. At the center of the response flat region on the X-axis, determine the range and center of the response flat region on the Y-axis; Determine the center of the response flat region and the coordinate range of the response flat region on the rotated X0Y plane according to the ellipse formula; When the integrated lens assembly is located at the center of the responsivity flat area on the rotated XOY plane, determine whether the responsivity flat area margins on the X and Y axes meet the requirements. If they do, continue rotating in the original direction until the responsivity flat area margins on the X and Y axes no longer meet the requirements. Record the third boundary angle where the rotation in this direction meets the requirements and the range of the second responsivity flat area of ​​the two outer receiver chips on the XOY plane corresponding to each rotation angle. Then rotate the integrated lens assembly in the opposite direction until the responsivity flat area margin on the X and Y axes does not meet the requirements. Record the fourth boundary angle that meets the requirements after this reverse rotation and the range of the second responsivity flat area of ​​the two outer emitter chips on the XOY plane corresponding to each rotation angle.

9. A coupling system for an integrated lens assembly, characterized in that, Includes clamping device, control device, optical power monitoring equipment, multi-channel optical output device, and power supply equipment, among which: The clamping device is used to clamp the integrated lens assembly; The optical power monitoring device is used to monitor the optical power of the two outer emitter chips of the optical emitter chip array; The multi-channel optical output device is used to provide light corresponding to the wavelength received by the optical receiving chip; The power supply equipment is used to supply power; The control device is used to control the movement of the integrated lens assembly of the clamping device and to control the operation of the optical power monitoring device, the multi-channel optical output device, and the power supply device in the following ways: Connect the adapter port of the integrated lens assembly to the multi-channel optical power monitoring device to control the power supply device to power the optical emitting chip array; The movable integrated lens assembly monitors the optical power of the two outer emission chips of the optical emission chip array, and obtains the power flatness map of the two outer emission chips on the X-axis when the initial vertical position and the initial angle are respectively. Adjust the angle of the integrated lens assembly. When there is no deflection angle in each power flat area map, determine the angle between the integrated lens assembly and the initial angle as the first coupling angle, and determine the first power flat area range of the two outer emitter chips on the XOY plane corresponding to the first coupling angle. Place the integrated lens assembly at the center of the first coupling angle and the first power flat region range, rotate the integrated lens assembly so that the power flat region margin on the X-axis and Y-axis meets the margin requirements, take the rotation angle range that meets the power flat region margin requirements as the first deflection angle range, and record the second power flat region range of the two outer emitter chips on the XOY plane corresponding to each rotation angle. Connect the adapter port of the integrated lens assembly to the multi-channel optical output device to power the optical receiver chip array; The integrated lens assembly is placed at the center of the first coupling angle and the first power flat region range. The responsivity of the two outer receiving chips is monitored, and the responsivity flat region map of the two outer receiving chips on the X-axis is obtained respectively. Adjust the angle of the integrated lens assembly. When there is no deflection angle in each responsivity flat area map, determine the angle between the integrated lens assembly and the initial angle as the second coupling angle, and determine the first responsivity flat area range of the two outer receiving chips on the XOY plane corresponding to the second coupling angle. The integrated lens assembly is placed at the center of the second coupling angle and the first responsivity flat region range. The integrated lens assembly is rotated so that the responsivity flat region margins on the X-axis and Y-axis meet the margin requirements. The rotation angle range that meets the responsivity flat region margin requirements is taken as the second deflection angle range. The second responsivity flat region ranges of the two outer receiver chips on the XOY plane corresponding to each rotation angle are recorded. Determine all overlapping angles within the first and second deflection angle intervals; Based on the range of the second power flat region and the range of the second responsivity flat region, the common flat region range of the two outer transmitting chips and the two outer receiving chips on the XOY horizontal plane is determined at each overlap angle. Select the final angle that meets the margin requirements, and take the center of the common flat area range corresponding to the final angle as the optimal coupling position of the integrated lens assembly.

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