Display panel, manufacturing method thereof and display device

Abstract

A display panel, a manufacturing method thereof and a display device, the display panel comprising an array substrate, a color film substrate, a liquid crystal layer and a glue frame, the array substrate and the color film substrate are oppositely arranged, the glue frame connects the array substrate and the color film substrate, and the glue frame is provided with conductive particles, the liquid crystal layer is arranged between the array substrate and the color film substrate and located in a space enclosed by the glue frame; the array substrate comprises an organic planar layer, a driving circuit layer and a spacer layer, the spacer layer is stacked between the driving circuit layer and the glue frame to isolate the driving circuit layer and the glue frame, the organic planar layer and the spacer layer are arranged in the same layer, and the surface of the organic planar layer facing the color film substrate is flush with the surface of the spacer layer facing the color film substrate. Meanwhile, the surface of the spacer layer facing the color film substrate is flush with the surface of the organic planar layer facing the color film substrate, so that the glue frame can be manufactured in a uniform thickness, and the process difficulty is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] Most of liquid crystal displays (LCD) are backlight liquid crystal displays, which include a housing, a display panel arranged in the housing, and a backlight module arranged in the housing. The liquid crystal display needs to be normally displayed by the light source provided by the backlight module. The display panel is usually formed by adhering an array substrate (Array Glass) and a color filter substrate (Color Filter Glass), and liquid crystal is filled between the two substrates. Pixel electrodes and common electrodes are arranged on the opposite inner sides of the two substrates, respectively. The rotation direction of the liquid crystal molecules is controlled by the voltage field strength to refract the light of the backlight module to generate a picture.

[0003] With the improvement of people's living standards, higher requirements are put forward for display products, so that the application of less gate driver technology (Gate Driver less, GDL) is more and more widely used. The advantage of GDL technology is that it can make the two sides of the display panel no longer need to use integrated circuit (Integrated Circuit, IC) driving, thereby greatly improving the production capacity and reducing the cost.

[0004] Since the GDL circuit and the corresponding driving circuit are arranged in the frame area of the display panel, the GDL circuit and the corresponding driving circuit will occupy a certain space, resulting in that the final display product has a too wide frame, which is difficult to meet the narrow frame design of the display product. SUMMARY

[0005] The purpose of the present application is to provide a display panel, a manufacturing method thereof and a display device, which solve the problem of too wide frame of the display product.

[0006] To achieve the purpose of the present application, the present application provides the following technical solutions:

[0007] In a first aspect, the present application provides a display panel, comprising an array substrate, a color film substrate, a liquid crystal layer and a frame, the array substrate and the color film substrate are oppositely arranged, the frame connects the array substrate and the color film substrate, and the frame is provided with conductive particles, the liquid crystal layer is arranged between the array substrate and the color film substrate and located in a space enclosed by the frame; the array substrate comprises an organic planarization layer, a drive circuit layer and a spacer layer, the spacer layer is laminated between the drive circuit layer and the frame to insulate the drive circuit layer and the frame, the organic planarization layer and the spacer layer are arranged in the same layer, and the surface of the organic planarization layer facing the color film substrate is flush with the surface of the spacer layer facing the color film substrate.

[0008] In an embodiment, the array substrate further comprises a gate insulating layer, the spacer layer is formed on the gate insulating layer and covers the drive circuit layer; the drive circuit layer comprises a first signal layer and a second signal layer, the first signal layer is arranged in the gate insulating layer and exposed to the surface of the gate insulating layer away from the spacer layer, the second signal layer is arranged on the surface of the gate insulating layer away from the first signal layer, the first signal layer is exposed to the surface of the gate insulating layer facing the spacer layer and laminated with a conductive layer, and the conductive layer extends to connect the second signal layer.

[0009] In an embodiment, the array substrate further comprises a first electrode layer, the color film substrate comprises a second electrode layer opposite to the first electrode layer, the liquid crystal layer is located between the first electrode layer and the second electrode layer, and the frame connects and conducts the first electrode layer and the second electrode layer.

[0010] In an embodiment, the array substrate is provided with a plurality of spacers, the plurality of spacers are used to support the color film substrate, the plurality of spacers comprise a main spacer and an auxiliary spacer arranged on the surface of the organic planarization layer facing the color film substrate, the main spacer is connected with the color film substrate, the auxiliary spacer is spaced apart from the color film substrate and has the same thickness as the spacer layer.

[0011] In a second aspect, the application further provides a manufacturing method of a display panel, the manufacturing method comprising: providing a color film substrate; manufacturing an array substrate, comprising: forming a driving circuit layer and a gate insulating layer in the same layer; forming an organic planarization layer stacked on the driving circuit layer and the gate insulating layer; forming a filling groove in a region corresponding to the driving circuit layer on the organic planarization layer, so as to expose the driving circuit layer; forming a spacer layer stacked on the driving circuit layer in the filling groove, and making a surface of the spacer layer away from the driving circuit layer and a surface of the organic planarization layer away from the gate insulating layer flush; forming a liquid crystal layer between the array substrate and the color film substrate and a frame enclosing the liquid crystal layer, so as to connect the surface of the spacer layer away from the driving circuit layer to the frame.

[0012] In an embodiment, the driving circuit layer comprises a first signal layer and a second signal layer, and after the filling groove is formed in the region corresponding to the driving circuit layer on the organic planarization layer so as to expose the driving circuit layer, the manufacturing method further comprises: forming a conductive layer stacked on the first signal layer and the second signal layer; and forming a first electrode layer stacked on the organic planarization layer.

[0013] In an embodiment, the conductive layer and the first electrode layer are formed in the same process.

[0014] In an embodiment, the spacer layer stacked on the driving circuit layer in the filling groove is formed at the same time as forming a plurality of spacers on a surface of the organic planarization layer facing the color film substrate, and the plurality of spacers comprise a main spacer connected to the color film substrate and an auxiliary spacer spaced apart from the color film substrate.

[0015] In an embodiment, the auxiliary spacer and the spacer layer have the same thickness.

[0016] In a third aspect, the application further provides a display device, comprising a backlight module and the display panel of any one of the embodiments of the first aspect, and the backlight module is arranged on one side of the display panel.

[0017] The display panel, the display device and the manufacturing method of the display panel provided by the application have the following advantages: the spacer layer is arranged on the driving circuit layer, the frame is connected to a surface of the spacer layer away from the driving circuit layer, the overall width size of the frame and the driving circuit layer is reduced, and this is conducive to the narrow frame design of the display product. Meanwhile, a surface of the spacer layer facing the color film substrate and a surface of the organic planarization layer facing the color film substrate are flush, so that the frame is manufactured in a uniform thickness, and the process difficulty is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0019] Figure 1 is a schematic view of the display panel from the top direction of the prior art;

[0020] Figure 2 is Figure 1 a schematic view of the internal structure of the display panel of the prior art;

[0021] Figure 3 is a schematic view of the left and right areas of the display panel provided by an embodiment of the present application;

[0022] Figure 4 is Figure 3 a specific schematic view of the display panel of the prior art;

[0023] Figure 5 is a schematic view of the upper and lower areas of the display panel provided by an embodiment of the present application;

[0024] Figure 6 is a schematic view of the display panel from the top direction provided by an embodiment of the present application;

[0025] Figure 7 is a schematic view of the display device provided by an embodiment of the present application;

[0026] Figure 8 is a flowchart of the manufacturing method of the display panel provided by an embodiment of the present application;

[0027] Figure 9 is a flowchart of one step of the manufacturing method of the display panel provided by an embodiment of the present application.

[0028] Explanation of reference signs:

[0029] 100 - display panel; 200 - backlight module; 1000 - display device;

[0030] 10 - array substrate; 11 - drive circuit layer; 111 - first signal layer; 112 - second signal layer; 113 - conductive layer; 12 - spacer layer; 13 - GDL circuit layer; 14 - organic flat layer; 15 - spacer; 151 - main spacer; 152 - auxiliary spacer; 16 - filter layer; 17 - gate insulating layer; 171 - signal access layer; 19 - first electrode layer;

[0031] 20 - color film substrate; 21 - transparent substrate; 22 - black matrix; 29 - second electrode layer;

[0032] 30 - liquid crystal layer; 40 - glue frame; 70 - IC device; 101 - pixel area; 102 - non-pixel area; 1021 - upper and lower area; 1022 - left and right area; 104 - peripheral area. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0034] It should be noted that when a component is referred to as being "fixed" to another component, it can be directly on the other component or there can be an intervening component. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or there can be an intervening component.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The use of the terms "and / or" includes a combination of one or more of the associated listed items.

[0036] Some embodiments of the present application will be described in detail with reference to the accompanying drawings. The following examples and features in the examples can be combined with each other without conflict.

[0037] Please refer to Figure 1 and Figure 2 In a high-pixel display product (for example, a product applying double-layer ITO), the number of thin film transistors (TFT) in the display panel 100 is large, which means that the number of clock signal lines of the required gate driving circuit will be more, so that the arrangement of the corresponding GDL line layer 13 and the driving line layer 11 will be more complex and the occupied space will be more. The display panel 100 includes a pixel area 101 and a non-pixel area 102 arranged around the pixel area 101. Since the GDL line layer 13 and the driving line layer 11 are generally arranged in the non-pixel area 102 (i.e., the frame) of the display panel 100, if the size of the GDL line layer 13 and the driving line layer 11 is too large, the frame of the final display product will be too wide.

[0038] Furthermore, the frame 40 is also a significant factor affecting the bezel width of the display product. In the non-pixel area 102 of the display panel 100, the frame 40 is typically used to connect the color filter substrate 20 and the array substrate 10. The frame 40 is located in the peripheral area 104 on the side of the non-pixel area 102 opposite to the pixel area 101, serving both to connect the color filter substrate 20 and the array substrate 10 and to provide a seal. Due to the presence of the frame 40, the GDL circuit layer 13, and the drive circuit layer 11, they occupy excessive space, making it difficult to achieve a narrow bezel design in the display product.

[0039] To resolve the above technical issues, please refer to Figure 3 and Figure 4 This invention provides a display panel 100, which can be selected as an LCD panel, Micro LED panel, or other types of panel. The display panel 100 includes an array substrate 10, a color filter substrate 20, a liquid crystal layer 30, and a frame 40. The array substrate 10 and the color filter substrate 20 are disposed opposite to each other, and the frame 40 connects the array substrate 10 and the color filter substrate 20, and conductive particles are provided in the frame 40. The liquid crystal layer 30 is disposed between the array substrate 10 and the color filter substrate 20 and is located within the space enclosed by the frame 40. The array substrate 10 includes a driving circuit layer 11 and a spacer layer 12. The spacer layer 12 is stacked between the driving circuit layer 11 and the frame 40 to isolate the driving circuit layer 11 and the frame 40; that is, the surface of the spacer layer 12 facing away from the driving circuit layer 11 is connected to the frame 40.

[0040] Specifically, the array substrate 10 further includes a first electrode layer 19, and the color filter substrate 20 has a second electrode layer 29 stacked on top of the first electrode layer 19. Both the first electrode layer 19 and the second electrode layer 29 are transparent electrodes, preferably made of indium tin oxide (ITO). The liquid crystal layer 30 is located between the first electrode layer 19 and the second electrode layer 29. The rotation direction of the liquid crystal molecules in the liquid crystal layer 30 is controlled by the voltage field strength between the first electrode layer 19 and the second electrode layer 29, so as to refract the light from the backlight module to generate an image. The conductive particles of the frame 40 are preferably gold spheres. The frame 40 is formed using a sealant-embedded gold (Au in sealant) process, that is, Au particles are uniformly mixed with sealant in advance, and then the frame is formed by a coating process, thus connecting the first electrode layer 19 and the second electrode layer 29.

[0041] By providing a spacer layer 12 on the drive circuit layer 11, the frame 40 is connected to the surface of the spacer layer 12 facing away from the drive circuit layer 11. The frame 40 and the drive circuit layer 11 are stacked together through the spacer layer 12, thereby reducing the overall width of the frame 40 and the drive circuit layer 11, so as to realize the narrow bezel design of the display product.

[0042] It can be understood that, since the glue frame 40 is laminated on the drive circuit layer 11 through the spacer layer 12, the peripheral area is cancelled or the size of the peripheral area is reduced, so that the frame size of the display panel 100 is effectively reduced. The drive circuit layer 11 has exposed metal, and if the glue frame 40 is directly arranged on the drive circuit layer 11, since the glue frame 40 is conductive, it will cause the drive circuit layer 11 and the second electrode layer 29 to be short-circuited. Therefore, by arranging the spacer layer 12 between the drive circuit layer 11 and the glue frame 40, the spacer layer 12 can play an insulating role to avoid the drive circuit layer 11 and the first electrode layer 19 from being short-circuited. The spacer layer 12 is preferably a photoresist material.

[0043] In the embodiment, referring to Figure 4 , the array substrate 10 further laminates a GDL circuit layer 13, the GDL circuit layer 13 is adjacent to and conductive with the drive circuit layer 11, and is located between the drive circuit layer 11 and the liquid crystal layer 30. The drive circuit layer 11 is provided with a plurality of clock signal lines, the liquid crystal layer 30 is provided with a plurality of TFTs, and the plurality of clock signal lines are conductive with the corresponding TFTs to realize signal transmission. Further, referring to Figure 5 and Figure 6 , the display panel 100 includes a pixel area 101 and a non-pixel area 102 surrounding the pixel area 101, wherein the non-pixel area 102 includes upper and lower areas 1021 and left and right areas 1022, the drive circuit layer 11 and the GDL circuit layer 13 are arranged in the left and right areas 1022, that is, the glue frame 40 in the left and right areas 1022 is laminated on the drive circuit layer 11 through the spacer layer 12. The glue frame 40 in the upper and lower areas 1021 is directly arranged between the first electrode layer 19 and the second electrode layer 29, and connects and conducts the first electrode layer 19 and the second electrode layer 29. At the same time, the IC device 70 is also arranged in the upper and lower areas 1021, and the IC device 70 is conductive with the drive circuit layer 11. In other embodiments, the drive circuit layer 11 and the GDL circuit layer 13 can also be arranged in the upper and lower areas 1021, and the glue frame 40 is laminated on the drive circuit layer 11 through the spacer 15. And the IC device 70 is arranged in the left and right areas 1022, and the glue frame 40 in the left and right areas 1022 is configured to connect and conduct the first electrode layer 19 and the second electrode layer 29.

[0044] Further, referring to Figure 4The array substrate 10 further comprises an organic planar layer 14 (Polymer Film on Array, PFA) arranged in the same layer as the spacer layer 12. The surface of the organic planar layer 14 is flush with the surface of the spacer layer 12 facing the color film substrate 20. Specifically, the organic planar layer 14 is provided with a filter layer 16 for forming red, green and blue light in cooperation with the backlight module. The filter layer 16 can be formed of a material having a filtering function for specific wavelengths, and can filter light of different wavebands in different regions to emit red, green and blue light in different regions. In other embodiments, the filter layer 16 can also be arranged on the side of the color film substrate 20 facing the organic planar layer 14, and the present application does not limit the specific arrangement of the filter layer 16. By arranging the organic planar layer 14 and the spacer layer 12 to be flush, the frame 40 can be made to have a uniform thickness, reducing the process difficulty. In addition, the frame 40 with a uniform thickness can better seal the display panel 100, and the reliability is also better. It can be understood that the GDL circuit layer 13 and the driving circuit layer 11 are generally arranged on only one side of the display panel 100, for example, the left and right sides in the present embodiment, i.e., the left and right regions 1022, and the frame 40 is connected to the spacer layer 12 in the left and right regions 1022. In the upper and lower sides, i.e., the upper and lower regions 1021, the frame 40 is connected to the first electrode layer 19 of the organic planar layer 14. Since the first electrode layer 19 has a small thickness, and the organic planar layer 14 and the spacer layer 12 are arranged to be flush as described above, the frame 40 can be made to have a uniform thickness to reduce the process difficulty and improve the sealing performance and reliability.

[0045] Specifically, the spacer layer 12 is preferably formed by etching the organic planar layer 14 in the region corresponding to the driving circuit layer 11 after forming a complete organic planar layer 14, hollowing out the organic planar layer 14 in the region, and forming the spacer layer 12 in the region through a mask, so that the spacer layer 12 and the organic planar layer 14 are flush. The frame 40 is formed on the organic planar layer 14 and the spacer layer 12. Since the surfaces of the organic planar layer 14 and the spacer layer 12 are flush, the frame 40 can be better formed and is not prone to gaps and defects.

[0046] In the present embodiment, please refer to Figure 4 The array substrate 10 comprises a gate insulating layer 17 (Gate SiNx αSi, GI), and the spacer layer 12 is formed on the gate insulating layer 17 and covers the driving circuit layer 11. By stacking the spacer layer 12 on the gate insulating layer 17 and covering the driving circuit layer 11, the spacer layer 12 can better insulate the driving circuit layer 11 and the frame 40, thereby improving the reliability.

[0047] Specifically, the signal access layer 171 is provided in the gate insulating layer 17, and the signal access layer 171 is in conduction with the first electrode layer 19 and is exposed on the surface of the gate insulating layer 17 facing away from the organic planarization layer 14 to access signals. Since the glue frame 40 is in conduction with the first electrode layer 19 and the second electrode layer 29, the signal access layer 171 can be in conduction with the second electrode layer 29 through the first electrode layer 19 and the glue frame 40 to realize signal transmission.

[0048] In this embodiment, referring to Figure 4 , the driving circuit layer 11 includes the first signal layer 111 and the second signal layer 112 in conduction. The first signal layer 111 is provided in the gate insulating layer 17 and is exposed on the surface of the gate insulating layer 17 facing away from the spacer layer 12, and the second signal layer 112 is provided on the surface of the gate insulating layer 17 facing away from the first signal layer 111. It can be understood that the first signal layer 111 and the second signal layer 112 are used to communicate with different areas of the GDL circuit. Through the above arrangement, the first signal layer 111 and the second signal layer 112 are layered with each other, which can reduce the overall width size of the driving circuit layer 11 and is beneficial to the narrow frame design of the display product.

[0049] In this embodiment, referring to Figure 4 , the first signal layer 111 is exposed on the surface of the gate insulating layer 17 facing the spacer layer 12 and is provided with a conductive layer 113 in a stacked manner, and the conductive layer 113 extends to be connected with the second signal layer 112. Specifically, the material of the conductive layer 113 is preferably indium tin oxide (ITO). One end of the conductive layer 113 is stacked on the surface of the first signal layer 111 facing away from the gate insulating layer 17, and the other end extends along the surface of the first signal layer 111 through the gate insulating layer 17 to the surface of the second signal layer 112, thereby connecting the first signal layer 111 and the second signal layer 112 in conduction to facilitate the communication and interaction of the first signal layer 111 and the second signal layer 112.

[0050] In one embodiment of the present embodiment, referring to the figure, the color film substrate 20 includes a transparent substrate 21 and a black matrix 22 (BM) stacked on the transparent substrate 21. The second electrode layer 29 is provided on the transparent substrate 21 and covers the black matrix 22. It can be understood that the black matrix 22 is mainly used for light shielding to avoid light mixing. The transparent substrate 21 is preferably glass (silicon dioxide).

[0051] In one embodiment of the present embodiment, referring to Figure 4The array substrate 10 is provided with a plurality of spacers 15. The plurality of spacers 15 are used to support the color film substrate 20. Specifically, the plurality of spacers 15 include main spacers 151 and auxiliary spacers 152, and the main spacers 151 and the auxiliary spacers 152 are formed on the side of the organic planarization layer 14 away from the gate insulating layer 17. The main spacers 151 are connected to the first electrode layer 19 at the end away from the organic planarization layer 14, and the auxiliary spacers 152 are spaced from the first electrode layer 19 at the end away from the organic planarization layer 14. The main spacers 151 and the auxiliary spacers 152 are arranged corresponding to different regions of the filter layer 16, for example, the plurality of spacers 15 are divided into a plurality of groups, each group includes one main spacer 151 and two auxiliary spacers 152, the main spacer 151 is arranged corresponding to the blue light region of the filter layer 16, and the two auxiliary spacers 152 are arranged corresponding to the green light region and the red light region of the filter layer 16 respectively. By arranging the plurality of spacers 15, the plurality of spacers 15 support the color film substrate 20, which is conducive to improving the reliability of the display panel 100.

[0052] In an embodiment, referring to Figure 4 The plurality of spacers 15 and the spacer layer 12 are made of the same material. Specifically, the plurality of spacers 15 and the spacer layer 12 are made of photoresist material. By making the plurality of spacers 15 and the spacer layer 12 of the same material, the plurality of spacers 15 and the spacer layer 12 can be manufactured by the same process. Preferably, the plurality of spacers 15 and the spacer layer 12 are formed by the same mask, for example, a half tone mask (HTM). Different regions of the mask are provided with different transmittances, for example, the transmittance of the region corresponding to the spacer layer 12 is 30%, the transmittance of the region corresponding to the auxiliary spacer 152 is 40%, and the transmittance of the region corresponding to the main spacer 151 is 100%. By using the principle that the thicker the thickness of the photoresist material left by the stronger the light, the main spacer 151 (26000A), the auxiliary spacer 152 (21000A) and the spacer layer 12 (12000A) are formed in turn from large to small. In this way, the thickness of the organic planarization layer 14 can be designed according to the thickness of the spacer layer 12 (so that the thickness of the spacer layer 12 is the same as the thickness of the organic planarization layer 14) to meet the cost requirements.

[0053] In other embodiments, the thickness of the spacer layer 12 can be the same as the thickness of the auxiliary spacer 152 and smaller than the thickness of the main spacer 151, for example, the thickness of the spacer layer 12 and the thickness of the auxiliary spacer 152 are both 21000A, and the thickness of the main spacer 151 is 26000A. In this way, the transmittance of the mask corresponding to the spacer layer 12 is the same as the transmittance of the mask corresponding to the auxiliary spacer 152, so that the design difficulty of the mask can be reduced.

[0054] Referring to Figure 7The display device 1000 can be a smart phone, a tablet computer, a display, or the like. The display device 1000 comprises the backlight module 200 and the display panel 100. The backlight module 200 is arranged on one side of the display panel 100. The backlight module 200 can be arranged on the side of the array substrate 10 away from the color film substrate 20, and is configured to provide light to the display panel 100. It can be understood that the backlight module 200 is a light source for providing light to the display panel 100. The backlight module 200 can be composed of a light source, a light guide plate, an optical film, a plastic frame, or the like. The backlight module 200 can be of three backlight source types, i.e., EL, CCFL, and LED. The backlight module 200 can be of side light type or direct type (bottom backlight type) according to the distribution position of the light source. By adding the display panel 100 provided in the application to the display device, the display device can have a narrower frame, so as to meet the design requirement of narrow frame.

[0055] Please refer to Figure 4 、 Figure 8 and Figure 9 The application further provides a manufacturing method of the display panel 100. The manufacturing method comprises the following steps.

[0056] S101: providing the color film substrate 20.

[0057] S102: manufacturing the array substrate 10, comprising the following steps.

[0058] S1021: forming the driving circuit layer 11 and the gate insulating layer 17 in the same layer.

[0059] S1022: forming the organic planarization layer 14 on the driving circuit layer 11 and the gate insulating layer 17.

[0060] S1023: forming a filling groove in the region corresponding to the driving circuit layer 11 of the organic planarization layer 14, so as to expose the driving circuit layer 11.

[0061] S1024: forming the spacer layer 12 on the driving circuit layer 11 in the filling groove, and making the surface of the spacer layer 12 away from the driving circuit layer 11 and the surface of the organic planarization layer 14 away from the gate insulating layer 17 flush.

[0062] S103: forming the liquid crystal layer 30 between the array substrate 10 and the color film substrate 20, and forming the glue frame 40 surrounding the liquid crystal layer 30, so as to connect the surface of the spacer layer 12 away from the driving circuit layer 11 and the glue frame 40.

[0063] By arranging the spacer layer 12 on the driving circuit layer 11, the glue frame 40 is connected to the surface of the spacer layer 12 away from the driving circuit layer 11, and the glue frame 40 and the driving circuit layer 11 are stacked together through the spacer layer 12, so as to reduce the overall width size of the glue frame 40 and the driving circuit layer 11, so as to facilitate the narrow frame design of the display product. At the same time, the surface of the organic flat layer 14 facing the color film substrate 20 and the surface of the spacer layer 12 facing the color film substrate 20 are flush, so as to facilitate the glue frame 40 to be made into a uniform thickness form, thereby reducing the process difficulty.

[0064] In an embodiment, the driving circuit layer 11 includes a first signal layer 111 and a second signal layer 112, and S1023: a filling groove is formed in the area corresponding to the organic flat layer 14 and the driving circuit layer 11, so that after the driving circuit layer 11 is exposed, it includes:

[0065] S10231: a conductive layer 113 is formed which is stacked on the first signal layer 111 and the second signal layer 112;

[0066] S10232: a first electrode layer 19 is stacked on the organic flat layer 14.

[0067] In an embodiment, the conductive layer and the first electrode layer are formed in the same process. Specifically, the above-mentioned step S10231 and step S10232 are performed simultaneously by one process. Preferably, the materials of the conductive layer 113 and the first electrode layer 19 are both ITO, so as to be formed simultaneously. In this way, the change of the overall process is reduced as much as possible, so as to improve the efficiency.

[0068] In an embodiment, S1024: while forming the spacer layer 12 stacked on the driving circuit layer 11 in the filling groove, it includes:

[0069] S10240: a plurality of spacers 15 are formed on the surface of the organic flat layer 14 facing the color film substrate 20; wherein the plurality of spacers 15 include a main spacer 151 and an auxiliary spacer 152, the main spacer 151 is connected to the color film substrate 20, and the auxiliary spacer 152 is spaced from the color film substrate 20.

[0070] It can be understood that the plurality of spacers 15 and the spacer layer 12 are formed in the same process. Specifically, the main spacers 151, the auxiliary spacers 152 and the spacer layer 12 are made of the same material, and are made of photoresist material. The main spacers 151, the auxiliary spacers 152 and the spacer layer 12 are made by the same mask exposure and development, preferably, the thickness of the main spacers 151 is greater than the thickness of the auxiliary spacers 152, and the thickness of the auxiliary spacers 152 is greater than the thickness of the spacer layer 12, so as to reduce the thickness of the organic planar layer 14 in order to be flush with the spacer layer 12, thereby reducing the cost. The specific operation can be that different regions are designed on the mask, and the different regions correspond to the main spacers 151, the auxiliary spacers 152 and the spacer layer 12 respectively, and the light transmittance of the different regions is different, so as to utilize the principle that the thicker the photoresist material is exposed to light, the thicker the thickness is, to form the main spacers 151, the auxiliary spacers 152 and the spacer layer 12 with the thickness gradually decreasing from large to small.

[0071] Of course, please refer to Figure 4 and Figure 8 In order to reduce the process difficulty, the thickness of the auxiliary spacers 152 and the spacer layer 12 can also be set to be the same. The thickness of the auxiliary spacers 152 and the spacer layer 12 is the same. In this way, the light transmittance of the mask region corresponding to the auxiliary spacers 152 and the spacer layer 12 can be set to be the same.

[0072] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the drawings described, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0073] The above disclosure is only a preferred embodiment of the present application, and of course cannot limit the scope of the present application. Those skilled in the art can understand that the above-mentioned all or part of the processes can be implemented, and equivalent changes made according to the claims of the present application still belong to the scope covered by the present application.

Claims

1. A display panel, comprising an array substrate, a color film substrate, a liquid crystal layer and a frame, the array substrate and the color film substrate are oppositely arranged, the frame connects the array substrate and the color film substrate, and conductive particles are arranged in the frame, the liquid crystal layer is arranged between the array substrate and the color film substrate and in a space enclosed by the frame; characterized in that, the array substrate comprises a gate insulating layer, an organic planarization layer, a drive circuit layer and a spacer layer, the organic planarization layer is laminated on the gate insulating layer and the drive circuit layer, a filling groove is formed in a region corresponding to the drive circuit layer on the organic planarization layer to expose the drive circuit layer, the spacer layer is laminated on the drive circuit layer in the filling groove, a surface of the spacer layer away from the drive circuit layer is flush with a surface of the organic planarization layer away from the gate insulating layer, and the surface of the spacer layer away from the drive circuit layer is connected with the frame; the array substrate is provided with a plurality of spacers for supporting the color film substrate, the plurality of spacers comprise auxiliary spacers on a surface of the organic planarization layer facing the color film substrate, the auxiliary spacers are spaced apart from the color film substrate and have a same thickness as the spacer layer. The spacer layer is formed on the gate insulating layer and covers the drive circuit layer. The drive circuit layer comprises a first signal layer and a second signal layer, the first signal layer is arranged in the gate insulating layer and exposed on a surface of the gate insulating layer away from the spacer layer, the second signal layer is arranged on a surface of the gate insulating layer away from the first signal layer, the first signal layer is exposed on a surface of the gate insulating layer facing the spacer layer and laminated with a conductive layer, and the conductive layer extends to connect with the second signal layer.

2. The display panel of claim 1, wherein, The plurality of spacers further comprise main spacers on the surface of the organic planarization layer facing the color film substrate, and the main spacers are connected with the color film substrate. The method comprises:

3. The display panel of claim 1, wherein, providing a color film substrate; 4. A manufacturing method of a display panel, comprising: manufacturing an array substrate, comprising: forming a drive circuit layer and a gate insulating layer in the same layer; forming an organic planarization layer laminated on the drive circuit layer and the gate insulating layer; forming a filling groove in a region corresponding to the drive circuit layer on the organic planarization layer to expose the drive circuit layer; forming a spacer layer laminated on the drive circuit layer in the filling groove and making a surface of the spacer layer away from the drive circuit layer flush with a surface of the organic planarization layer away from the gate insulating layer; forming a liquid crystal layer between the array substrate and the color film substrate and a frame enclosing the liquid crystal layer, and connecting a surface of the spacer layer away from the drive circuit layer with the frame; the forming of the spacer layer laminated on the drive circuit layer in the filling groove comprises: forming a plurality of spacers on a surface of the organic planarization layer facing the color film substrate, and the plurality of spacers comprise auxiliary spacers spaced apart from the color film substrate; the auxiliary spacers have a same thickness as the spacer layer. ​ ​ 5. The method of manufacturing according to claim 4, wherein, The driving circuit layer comprises a first signal layer and a second signal layer, and a filling groove is formed in a region corresponding to the driving circuit layer on the organic flat layer so that the driving circuit layer is exposed, and the exposed driving circuit layer comprises: a conductive layer laminated on the first signal layer and the second signal layer; a first electrode layer laminated on the organic flat layer.

6. The method of manufacturing according to claim 5, wherein, The conductive layer and the first electrode layer are formed in the same process.

7. The method of making of claim 4, wherein, The plurality of spacers further comprises a main spacer connected to the color film substrate.

8. A display device, characterized by comprising: The display panel according to any one of claims 1 to 3, and a backlight module disposed on one side of the display panel.

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