Display screen with fingerprint detection function and electronic device

Abstract

The application provides a display screen with a fingerprint detection function and an electronic device, and relates to the technical field of display. The display screen is provided with a first light reflection layer on the side wall of the imaging hole of the black matrix; and / or is provided with a first through hole on the pixel definition layer, and the side wall of the first through hole is provided with a second light reflection layer; and the orthographic projection of the imaging hole and the first through hole on the base layer respectively overlaps with the orthographic projection of the optical sensor on the base layer. In this way, the first light reflection layer and / or the second light reflection layer can reflect the light rays that enter the imaging hole and whose light paths do not reach the optical sensor, and can make most of the light rays reflected by the first light reflection layer and / or the second light reflection layer reach the optical sensor. In this way, the imaging integrity of the optical sensor on the fingerprint is improved, and the accuracy of the detection of the optical sensor on the fingerprint is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display screen and electronic device with fingerprint detection function. Background Technology

[0002] The fingerprint detection module in the display screen can detect the user's fingerprint, and then unlock the display interface when the fingerprint verification is successful. When the fingerprint detection module is located within the display area of ​​the screen, it can achieve under-display fingerprint detection. This increases the display area ratio, enabling the currently popular full-screen technology.

[0003] Currently, the principle of under-display fingerprint detection is as follows: light emitted from the pixel unit below the fingerprint detection area in the display area can illuminate the finger located in the fingerprint detection area of ​​the display area. Then, the light illuminating the finger is reflected by the finger and onto the optical sensor located below the fingerprint detection area. The optical sensor creates an image based on the reflected light from the finger to complete fingerprint detection.

[0004] However, because the display screen also has a planarization layer, a black matrix (BM) layer, a transparent electrode layer, and an insulating layer above the optical sensor, the under-display fingerprint detection process described above... Figure 1 As shown, the light shining on the finger is reflected by the finger onto the planarization layer, the black matrix (BM) layer, the transparent electrode layer, and the insulating layer. Some of the light does not reach the optical sensor. As a result, the optical sensor's image of the fingerprint is incomplete, which in turn leads to low accuracy in fingerprint detection. Summary of the Invention

[0005] This application provides a display screen and electronic device with fingerprint detection function to solve the problem in the prior art where the imaging of fingerprints by optical sensors is incomplete, resulting in low accuracy of fingerprint detection by optical sensors.

[0006] In a first aspect, this application provides a display screen with fingerprint detection function, the display screen including a fingerprint detection area, the fingerprint detection area including: basal layer; The light-emitting device layer and the optical sensor are disposed on one side of the substrate layer. The light-emitting device layer includes a pixel defining layer and multiple light-emitting devices. The pixel defining layer includes multiple pixel openings. The light-emitting devices are disposed at the pixel openings. The pixel defining layer is located on the side of the optical sensor away from the substrate layer. An encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate layer; A color filter layer is disposed on the side of the encapsulation layer away from the substrate layer. The color filter layer includes a black matrix and a color filter unit facing the light-emitting device. An imaging aperture is disposed on the black matrix facing the optical sensor. A first reflective layer is disposed on the sidewall of the imaging aperture. And / or, a pixel defining layer is disposed on a first through-hole. A second reflective layer is disposed on the sidewall of the first through-hole. The orthogonal projections of the imaging aperture and the first through-hole onto the substrate layer overlap with the orthogonal projection of the optical sensor onto the substrate layer.

[0007] In one possible implementation, a first reflective layer is provided on the sidewall of the imaging aperture, and the first reflective layer is inclined toward the side away from the imaging aperture.

[0008] In one possible implementation, the pixel defining layer is provided with a first through hole, and the sidewall of the first through hole is provided with a second reflective layer.

[0009] In one possible implementation, the orthographic projection of the first via on the substrate layer lies within the orthographic projection of the imaging hole on the substrate layer.

[0010] In one possible implementation, the encapsulation layer is provided with a second through-hole, and the sidewall of the second through-hole is provided with a third reflective layer.

[0011] In one possible implementation, the refractive index of the pixel defining layer is greater than that of the encapsulation layer.

[0012] In one possible implementation, a buffer layer is provided on the side of the color filter layer away from the substrate layer, a first reflective layer forms a light-transmitting opening, the light-transmitting opening is filled by the buffer layer, and the refractive index of the encapsulation layer is greater than the refractive index of the buffer layer.

[0013] In one possible implementation, the first reflective layer is tilted toward the side closer to the imaging aperture and / or the second reflective layer is tilted toward the side closer to the first through-hole.

[0014] In one possible implementation, the orthogonal projections of the imaging aperture and / or the first through-hole onto the substrate layer are located within the orthogonal projection of the optical sensor onto the substrate layer.

[0015] In one possible implementation, the fingerprint detection area includes a plurality of pixel units, each pixel unit including a light-emitting device, a first reflective layer and / or a second reflective layer located between two adjacent pixel units, and the first reflective layer and the second reflective layer are equidistant from the two adjacent pixel units respectively.

[0016] Secondly, this application also provides a method for manufacturing a display screen, comprising: A light-emitting device layer and an optical sensor are formed on one side of the substrate layer. The light-emitting device layer includes a pixel defining layer and multiple light-emitting devices. The pixel defining layer includes multiple pixel openings. The light-emitting devices are disposed at the pixel openings. The pixel defining layer is located on the side of the optical sensor away from the substrate layer. An encapsulation layer is formed on the side of the light-emitting device layer away from the substrate layer; A color filter layer is formed on the side of the encapsulation layer away from the substrate layer, wherein the color filter layer includes a black matrix and a color filter unit facing the light-emitting device; An imaging aperture is created in the black matrix directly opposite the optical sensor; A first reflective layer is formed on the sidewall of the imaging aperture; and / or when forming the pixel defining layer, a first through-hole is opened in the pixel defining layer, and a second reflective layer is formed on the sidewall of the first through-hole; and the orthogonal projections of the imaging aperture and the first through-hole on the substrate layer overlap with the orthogonal projection of the optical sensor on the substrate layer.

[0017] Thirdly, this application also provides an electronic device, including the display screen provided in the first aspect of this application.

[0018] Compared to existing technologies, this application offers the following advantages: Since the pixel defining layer and encapsulation layer are located on the side of the optical sensor away from the substrate, and the black matrix is ​​located on the side of the encapsulation layer away from the substrate, and the black matrix has an imaging aperture, when a user's finger is placed on the fingerprint detection area of ​​the display screen, the light emitted from the pixel units in the fingerprint detection area can illuminate the finger located in the fingerprint detection area. Furthermore, the light illuminating the finger must pass sequentially through the imaging aperture of the black matrix, the encapsulation layer, and the pixel defining layer before reaching the optical sensor. This allows for the placement of a first reflective layer in the imaging aperture and / or a second reflective layer in the pixel defining layer. Furthermore, the first and / or second reflective layers can reflect light that enters the imaging aperture but whose light path does not reach the optical sensor. Since the orthographic projections of the imaging aperture and the first through-hole on the substrate overlap with the orthographic projection of the optical sensor on the substrate, most of the light reflected by the first and / or second reflective layers can reach the optical sensor. This improves the imaging integrity of the fingerprint by the optical sensor, thereby improving the accuracy of fingerprint detection by the optical sensor. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the appearance of the display screen provided in an embodiment of this application; Figure 2 One of the cross-sectional views of the display screen provided in the embodiments of this application; Figure 3 A second cross-sectional view of the display screen provided in an embodiment of this application; Figure 4 A third cross-sectional view of the display screen provided in an embodiment of this application; Figure 5 Fourth cross-sectional view of the display screen provided in the embodiments of this application; Figure 6 Fifth cross-sectional view of the display screen provided in the embodiments of this application; Figure 7 Sixth cross-sectional view of the display screen provided in the embodiments of this application; Figure 8 Seventh cross-sectional view of the display screen provided in the embodiments of this application; Figure 9 The optical path diagram of the display screen provided in the embodiments of this application; Figure 10 Eighth cross-sectional view of the display screen provided in the embodiments of this application; Figure 11 A top view of the display screen provided in an embodiment of this application; Figure 12 This is one of the flowcharts for a method of manufacturing a display device provided in the embodiments of this application; Figure 13 This is a second flowchart illustrating the manufacturing method of the display device provided in this application embodiment. Detailed Implementation

[0021] Embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0022] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0023] In the context of this disclosure, when a layer / element is referred to as being "above" another layer / element, the layer / element may be directly above the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "above" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0024] The principle of under-display fingerprint detection is as follows: light emitted from the pixel unit below the fingerprint detection area in the display area can illuminate the finger located in the fingerprint detection area of ​​the display area. Then, the light illuminating the finger is reflected by the finger and onto the optical sensor located below the fingerprint detection area. The optical sensor creates an image based on the reflected light from the finger to complete fingerprint detection.

[0025] However, current optical sensors do not produce complete images of fingerprints, which leads to low accuracy in fingerprint detection.

[0026] Based on the aforementioned technical problems, the inventive concept of this application is as follows: a first reflective layer is disposed on the sidewall of the imaging aperture of the black matrix; and / or, a first through-hole is disposed on the pixel defining layer, and a second reflective layer is disposed on the sidewall of the first through-hole; and the orthogonal projections of the imaging aperture and the first through-hole onto the substrate layer overlap with the orthogonal projection of the optical sensor onto the substrate layer. Thus, the first reflective layer and / or the second reflective layer can reflect light that enters the imaging aperture but whose light path does not reach the optical sensor, allowing most of the light reflected by the first reflective layer and / or the second reflective layer to reach the optical sensor. This improves the imaging integrity of the fingerprint by the optical sensor, thereby improving the accuracy of fingerprint detection by the optical sensor.

[0027] The technical solutions of this application and how they solve the aforementioned technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0028] This application provides a display screen with fingerprint detection function, such as... Figure 1 As shown, the display screen 101 includes a fingerprint detection area 102. The fingerprint detection area 102 is used to identify the fingerprint image of a finger placed in the fingerprint detection area. Figure 2 As shown, the fingerprint detection area 102 includes: The substrate 103 may be, but is not limited to, a flexible substrate. The flexible substrate may include a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, or a colorless polyimide (CPI) substrate, etc. Understandably, the substrate 103 serves to support and protect the entire display substrate.

[0029] It should be noted that the substrate layer 103 can be a single layer or a multi-layer structure. For example, the substrate layer 103 may include a glass substrate, or the substrate layer 103 may include at least one flexible substrate and at least one buffer layer, with the flexible substrate and buffer layer alternately stacked. This embodiment does not limit this.

[0030] The driving device layer 104 is disposed on one side of the base layer 103.

[0031] Among them, still as Figure 2As shown, the driving device layer 104 includes a first semiconductor layer 205 and a second semiconductor layer 206 spaced apart, a first gate isolation layer 201 covering the first semiconductor layer 205 and the second semiconductor layer 206; a first gate Gate1 and a second gate Gate2 spaced apart on the side of the first gate isolation layer 201 away from the substrate layer 103; a second gate isolation layer 202 covering the side of the first gate Gate1 and the second gate Gate2 away from the substrate layer 103; an interlayer dielectric layer 203 covering the side of the second gate isolation layer 202 away from the substrate layer 103; and a first source drain SD1 and a second source drain SD2 spaced apart on the side of the interlayer dielectric layer 203 away from the substrate layer 103. A source drain isolation layer 204 is disposed on the side of the first source drain SD1 and the second source drain SD2 away from the substrate layer 103 and covers the first source drain SD1 and the second source drain SD2. The source drain isolation layer 204 may be an inorganic layer (such as a PVX layer). Specifically, metal vias are formed in the first gate isolation layer 201, the interlayer dielectric layer 203, and the second gate isolation layer 202. The metal traces of the first source / drain SD1 can be connected to the first semiconductor layer 205 through the metal vias formed in the first gate isolation layer 201, the second gate isolation layer 202, and the interlayer dielectric layer 203. The metal traces of the second source / drain SD2 can be connected to the second semiconductor layer 206 through the metal vias formed in the first gate isolation layer 201, the second gate isolation layer 202, and the interlayer dielectric layer 203. Understandably, the first semiconductor layer 205, the first gate (Gate1), and the first source / drain SD1 constitute the first driving device, and the second semiconductor layer 206, the second gate (Gate2), and the second source / drain SD2 constitute the second driving device.

[0032] Exemplarily, the first driving device and the second driving device can be, but are not limited to, thin film transistors (TFTs). Exemplarily, the embodiments of this application do not impose excessive restrictions on the type of thin film transistor. For example, thin film transistors may include oxide thin film transistors (Oxide TFTs) and / or polycrystalline silicon thin film transistors, etc.

[0033] The light-emitting device layer and the optical sensor 105 are disposed on the side of the driving device layer 104 away from the substrate layer 103.

[0034] The light-emitting device layer includes a pixel defining layer 108 and multiple light-emitting devices. The pixel defining layer 108 includes multiple pixel openings, and the light-emitting devices are disposed at the pixel openings. The pixel defining layer 108 is located on the side of the optical sensor 105 away from the substrate layer 103. The light-emitting device layer is electrically connected to a first driving device, and the optical sensor 105 is electrically connected to a second driving device. The light-emitting device layer emits light when driven by the first driving device, and the optical sensor 105 detects the light L emitted by the light-emitting device layer that is reflected by the finger 116 and reaches the optical sensor 105.

[0035] Still Figure 2 As shown, a planarization layer 106 is provided on the side of the optical sensor 105 away from the substrate layer 103, and a light-emitting device layer is provided on the side of the planarization layer 106 away from the substrate layer 103.

[0036] Specifically, such as Figure 2 As shown, the light-emitting device includes an anode, a light-emitting functional layer 107, and a cathode 109, wherein the anode is a reflective electrode and the cathode 109 is a transparent electrode. The anode has a planarization layer 106 disposed on the side away from the substrate layer 103 and directly opposite the pixel opening. The light-emitting functional layer 107 is located on the side of the anode away from the substrate layer 103 and within the pixel opening. The cathode 109 covers the pixel defining layer 108 and the side of the light-emitting functional layer 107 away from the substrate layer 103. The optical sensor 105 is offset from both the anode and the light-emitting functional layer 107.

[0037] In some examples, the light-emitting device can be a Micro LED light-emitting device. The light-emitting functional layer 107 may include: an organic light-emitting material layer, and at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the cathode 109 and the organic light-emitting material layer, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the anode and the organic light-emitting material layer. The specific configuration depends on actual needs, and this embodiment does not limit this. Of course, in other examples, the light-emitting device may also be an LED light-emitting device such as a Mini LED or an OLED light-emitting device, and this embodiment does not limit this.

[0038] For example, the cathode 109 can be made of a transparent conductive oxide thin film; the anode can be made of a metal film layer, or a composite structure composed of transparent conductive oxide thin films / metal films / transparent conductive oxide thin films stacked sequentially. The material of the aforementioned transparent conductive oxide thin film is, for example, any one of indium tin oxide (ITO) and indium zinc oxide (IZO); the material of the aforementioned metal thin film is, for example, any one of gold (Au), silver (Ag), nickel (Ni), and platinum (Pt).

[0039] An encapsulation layer 110 is disposed on the side of the light-emitting device layer away from the substrate layer 103. The encapsulation layer 110 can be used to prevent air and moisture from entering the fingerprint detection module, thus preventing corrosion of the components inside the display screen 101. For example, as... Figure 2 As shown, the encapsulation layer 110 is located on the side of the cathode 109 away from the substrate layer 103.

[0040] A color filter layer 111 is disposed on the side of the encapsulation layer 110 away from the substrate layer 103. The color filter layer 111 includes a black matrix and color filter units facing the light-emitting device. The black matrix is ​​used to separate the color filter units to improve color contrast, and the transmittance of the black matrix is ​​less than 5%. To ensure that light L can reach the optical sensor 105 smoothly, an imaging aperture 112 is provided on the black matrix facing the optical sensor 105.

[0041] A first reflective layer 113 is disposed on the sidewall of the imaging aperture 112. Understandably, a light-transmitting opening is formed within the first reflective layer 113; and / or, a first through-hole 117 is disposed on the pixel defining layer 108, and a second reflective layer 118 is disposed on the sidewall of the first through-hole 117; and the orthographic projections of the imaging aperture 112 and the first through-hole 117 onto the substrate layer 103 overlap with the orthographic projection of the optical sensor 105 onto the substrate layer 103. Understandably, since both the first reflective layer 113 and the second reflective layer 118 are annular, both the first reflective layer 113 and the second reflective layer 118 form light-transmitting openings. Understandably, the light-transmitting opening formed by the second reflective layer 118 is filled by the pixel defining layer 108.

[0042] For example, the first reflective layer 113 and the second reflective layer 118 can be metal layers, such as copper, iron, or tin, etc., and are not limited thereto. For example, the first reflective layer 113 and the second reflective layer 118 can also be a reflector.

[0043] Furthermore, the display screen 101 provided in this application embodiment also includes: a buffer layer 114 disposed on the side of the black matrix away from the base layer 103, and the light-transmitting opening formed by the first reflective layer 113 is filled by the buffer layer 114.

[0044] The glass cover 115 is disposed on the side of the buffer layer 114 away from the layer. The glass cover 115 can be used to isolate air and moisture from entering the fingerprint detection module, thereby preventing the components inside the fingerprint detection module from being corroded.

[0045] It should be noted that the light transmittance of the buffer layer 114, the encapsulation layer 110, and the pixel delimitation layer 108 in this embodiment is greater than 90%.

[0046] In summary, the fingerprint detection display 101 provided in this application embodiment has a pixel defining layer 108 and an encapsulation layer 110 disposed on the side of the optical sensor 105 away from the substrate layer 103, and a black matrix disposed on the side of the encapsulation layer 110 away from the substrate layer 103, with an imaging aperture 112. Thus, when a user's finger 116 is placed on the fingerprint detection area 102 of the display 101, the light emitted from the pixel units of the fingerprint detection area 102 can illuminate the finger 116 located in the fingerprint detection area 102. Furthermore, the light illuminating the finger 116 must pass sequentially through the imaging aperture 112 of the black matrix, the encapsulation layer 110, and the pixel defining layer 108 before reaching the optical sensor 105. This allows for the provision of a first reflective layer 113 in the imaging aperture 112 and / or a second reflective layer 118 in the pixel defining layer 108. Furthermore, the first reflective layer 113 and / or the second reflective layer 118 can reflect light that enters the imaging aperture 112 but does not reach the optical sensor 105. Since the orthographic projections of the imaging aperture 112 and the first through-hole 117 on the substrate 103 overlap with the orthographic projection of the optical sensor 105 on the substrate 103, most of the light reflected by the first reflective layer 113 and / or the second reflective layer 118 can reach the optical sensor 105. This improves the imaging integrity of the fingerprint by the optical sensor 105, thus improving the accuracy of fingerprint detection by the optical sensor 105.

[0047] It should be noted that the first reflective layer 113 and / or the second reflective layer 118 can be configured in the following ways: The first option: as before Figure 2 As shown, a first reflective layer 113 is provided on the sidewall of the imaging aperture 112, and the first reflective layer 113 is inclined toward the side away from the imaging aperture 112. Figure 2 As can be seen, when the light L reflected by the finger 116 reaches the first reflective layer 113, part of the light L is reflected by the first reflective layer 113 and can reach the optical sensor 105. In this way, the imaging integrity of the fingerprint by the optical sensor 105 is improved, and the accuracy of the fingerprint detection by the optical sensor 105 is also improved.

[0048] Furthermore, such as Figure 3As shown, the refractive index of the encapsulation layer 110 can be greater than that of the buffer layer 114. When the refractive index of the encapsulation layer 110 is greater than that of the buffer layer 114, according to the law of refraction, the angle of refraction of the light ray L incident on the interface between the buffer layer 114 and the encapsulation layer 110 is smaller than the angle of incidence. This allows more reflected light ray L to reach the optical sensor 105. This further improves the imaging integrity of the fingerprint by the optical sensor 105 and further improves the accuracy of fingerprint detection by the optical sensor 105.

[0049] Or, such as Figure 4 As shown, the refractive index of the pixel defining layer 108 can also be greater than that of the encapsulation layer 110. When the refractive index of the pixel defining layer 108 is greater than that of the encapsulation layer 110, according to the law of refraction, the angle of refraction of light L incident on the interface between the pixel defining layer 108 and the encapsulation layer 110 is smaller than the angle of incidence. This allows more reflected light L to reach the optical sensor 105. This further improves the imaging integrity of the fingerprint by the optical sensor 105 and further improves the accuracy of fingerprint detection by the optical sensor 105.

[0050] Furthermore, such as Figures 2-4 As shown, the orthographic projections of the imaging aperture 112 and the first through-hole 117 onto the substrate 103 are located within the orthographic projection of the optical sensor 105 onto the substrate 103. This allows more reflected light L to reach the optical sensor 105. Consequently, the imaging integrity of the fingerprint by the optical sensor 105 is further improved, as is the accuracy of fingerprint detection by the optical sensor 105.

[0051] The second type: such as Figure 5 As shown, a first reflective layer 113 is disposed on the sidewall of the imaging aperture 112. The first reflective layer 113 is inclined towards the side away from the imaging aperture 112, and a first through-hole 117 is disposed on the pixel defining layer 108. A second reflective layer 118 is disposed on the sidewall of the first through-hole 117. Understandably, since the second reflective layer 118 is annular, it also includes a light-transmitting opening. Figure 5 As can be seen, when the light L reflected by the finger 116 reaches the first reflective layer 113, part of the light L is reflected by the first reflective layer 113 and reaches the optical sensor 105; the other part of the light L reaches the second reflective layer 118 located in the pixel defining layer 108. The second reflective layer 118 can also reflect the received light L back to the optical sensor 105. In this way, the imaging integrity of the fingerprint by the optical sensor 105 is further improved, which also improves the accuracy of fingerprint detection by the optical sensor 105.

[0052] Optionally, such as Figure 5 As shown, the orthographic projection of the first through-hole 117 onto the substrate 103 lies within the orthographic projection of the imaging hole 112 onto the substrate 103. In this way, the light L reflected by the finger 116 first reaches the imaging hole 112 and is reflected by the first reflective layer 113; then it reaches the first through-hole 117 and is reflected by the second reflective layer 120. This makes it easier for light to be focused onto the optical sensor, further improving the imaging integrity of the fingerprint by the optical sensor 105.

[0053] The third type: such as Figure 6 As shown, a first reflective layer 113 is provided on the sidewall of the imaging aperture 112, and the first reflective layer 113 is inclined towards the side away from the imaging aperture 112; and the encapsulation layer 110 is provided with a second through hole 119, and a third reflective layer 120 is provided on the sidewall of the second through hole 119. Understandably, since the third reflective layer 120 is annular, it also includes a light-transmitting opening. Thus, when the light L reflected by the finger 116 reaches the reflective layer located in the imaging aperture 112, part of the light L is reflected by the first reflective layer 113 in the imaging aperture 112 and reaches the optical sensor 105; another part of the light L reaches the third reflective layer 120 in the encapsulation layer 110. The third reflective layer 120 can also reflect the received light L back to the optical sensor 105. This further improves the imaging integrity of the fingerprint by the optical sensor 105, thus improving the accuracy of fingerprint detection by the optical sensor 105.

[0054] The fourth type: such as Figure 7 As shown, the pixel defining layer 108 is provided with a first through-hole 117, and a second reflective layer 118 is provided on the sidewall of the first through-hole 117; and the second reflective layer 118 is inclined toward the side away from the first through-hole 117. Figure 7 As can be seen, when the light L reflected by the finger 116 reaches the second reflective layer 118, part of the light L is reflected by the second reflective layer 118 and can reach the optical sensor 105. In this way, the imaging integrity of the fingerprint by the optical sensor 105 is improved, and the accuracy of the fingerprint detection by the optical sensor 105 is also improved.

[0055] In addition, Figure 7Based on the corresponding embodiments, the refractive index of the encapsulation layer 110 can be greater than that of the buffer layer 114; the refractive index of the pixel defining layer 108 can also be greater than that of the encapsulation layer 110; and / or the encapsulation layer 110 is provided with a second through-hole 119, and a third reflective layer 120 is provided on the sidewall of the second through-hole 119, which is not limited here. Thus, similar to the principle of the embodiments described above, the imaging integrity of the fingerprint by the optical sensor 105 can be further improved, thereby improving the accuracy of fingerprint detection by the optical sensor 105.

[0056] The fifth type: such as Figure 8 As shown, a first reflective layer 113 is provided on the sidewall of the imaging aperture 112, and the first reflective layer 113 is inclined toward the side closer to the imaging aperture 112.

[0057] like Figure 9 As shown in (a), when the first reflective layer 113 is tilted away from the imaging aperture 112, the incident angle of the light L reflected by the finger 116 on the reflective layer is... 1. The reflection angle of the light ray L reflected by the reflective layer 108 is also . 1. At this point, a second reflective layer 118 needs to be set in the pixel defining layer 108 to allow more light to reach the optical sensor 105. For example... Figure 9 As shown in (b), when the first reflective layer 113 is tilted towards the side closer to the imaging aperture 112, the angle of incidence between the light L reflected by the finger 116 and the first reflective layer 113 is... The reflection angle of the light ray L reflected by the first reflective layer 113 is also... ,and Greater than 1. In other words, the reflection angle of the light L reflected by the first reflective layer 113 is increased. This allows more light L to reach the optical sensor 105 after being reflected by the first reflective layer 113 (eliminating the need for a second reflective layer 118 in the pixel defining layer 108). This further improves the imaging integrity of the fingerprint by the optical sensor 105, thus improving the accuracy of fingerprint detection by the optical sensor 105.

[0058] The sixth type: such as Figure 10 As shown, the pixel defining layer 108 is provided with a first through hole 117, and a second reflective layer 118 is provided on the sidewall of the first through hole 117, and the second reflective layer 118 is inclined toward the side closer to the first through hole 117.

[0059] and Figure 9 The corresponding implementation is similar, in Figure 10In a corresponding embodiment, when the second reflective layer 118 is tilted towards the side closer to the first through-hole 117, more light L can be reflected by the first reflective layer 113 and reach the optical sensor 105. This further improves the imaging integrity of the fingerprint by the optical sensor 105, thereby improving the accuracy of fingerprint detection by the optical sensor 105.

[0060] Additionally, in the embodiments of this application, such as Figure 11 As shown, the fingerprint detection area 102 includes multiple pixel units, each pixel unit including a light-emitting device. A first reflective layer 113 and / or a second reflective layer 118 are disposed between every two adjacent pixel units, and the distances from the first reflective layer 113 and the second reflective layer 118 to the two adjacent pixel units are equal. It should be noted that each group of overlapping imaging holes 112, first reflective layers 113 and / or second reflective layers 118, and optical sensors 105 projected onto the substrate layer 103 can constitute a fingerprint detection unit.

[0061] For example, still as Figure 11 As shown, multiple pixel units are contained within multiple pixel modules, and each pixel module includes three pixel units: an R pixel unit, a G pixel unit, and a B pixel unit. Each optical sensor 105 is surrounded by the R pixel units, G pixel units, and B pixel units of the same pixel module.

[0062] Still Figure 11 As shown, the fingerprint detection unit is disposed between the B pixel unit and the R pixel unit of pixel module X; the fingerprint detection unit is also disposed between the B pixel unit and the R pixel unit of pixel module Y; the fingerprint detection unit is also disposed between the G pixel unit of pixel module X and the G pixel unit of pixel module Y.

[0063] Furthermore, each fingerprint detection unit is equidistant from its two adjacent pixel units. This ensures that the amount of light L emitted by the pixel units adjacent to the fingerprint detection unit reaches the optical sensor 105 of the fingerprint detection unit in the same amount, improving the uniformity of the light L reaching the optical sensor 105 reflecting different positions of the finger 116. This further improves the imaging integrity of the fingerprint by the optical sensor 105, thereby increasing the accuracy of fingerprint detection by the optical sensor 105.

[0064] Please see Figure 12 This application also provides a method for manufacturing a display device. It should be noted that the display device provided in this application has the same basic principle and technical effects as any of the above embodiments. For the sake of brevity, any parts not mentioned in this application's embodiments can be referred to the corresponding content in the above embodiments. Specifically, as... Figure 12 As shown, the method for manufacturing the display device provided in this application includes: S1201: A light-emitting device layer and an optical sensor 105 are formed on one side of the substrate layer 103. The light-emitting device layer includes a pixel defining layer 108 and a plurality of light-emitting devices. The pixel defining layer 108 includes a plurality of pixel openings. The light-emitting devices are disposed at the pixel openings. The pixel defining layer 108 is located on the side of the optical sensor 105 away from the substrate layer 103.

[0065] S1202: An encapsulation layer 110 is formed on the side of the light-emitting device layer away from the substrate layer 103.

[0066] S1203: A color filter layer 111 is formed on the side of the encapsulation layer 110 away from the substrate layer 103, wherein the color filter layer 111 includes a black matrix and a color filter unit facing the light-emitting device.

[0067] S1204: An imaging aperture 112 is opened in the black matrix opposite to the optical sensor 105.

[0068] S1205: A first reflective layer 113 is formed on the sidewall of the imaging aperture 112; and / or when forming the pixel defining layer 108, a first through hole 117 is opened in the pixel defining layer 108, and a second reflective layer 118 is formed on the sidewall of the first through hole 117; and the orthographic projections of the imaging aperture 112 and the first through hole 117 on the substrate layer 103 overlap with the orthographic projection of the optical sensor 105 on the substrate layer 103.

[0069] Specifically, the manufacturing process of the display device provided in the embodiments of this application can also be as follows: Figure 13 As shown.

[0070] In addition, this application also provides an electronic device, including the display screen provided in the above embodiments. The electronic device can be a mobile phone, tablet computer, etc., and is not limited thereto.

[0071] The above description does not provide detailed technical specifications regarding the structure of each layer. However, those skilled in the art should understand that layers and regions of desired shapes can be formed using various technical means. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be advantageously combined.

[0072] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0073] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A display screen with fingerprint detection function, characterized in that, The display screen includes a fingerprint detection area, which includes: basal layer; The light-emitting device layer and the optical sensor are disposed on one side of the substrate layer. The light-emitting device layer includes a pixel defining layer and a plurality of light-emitting devices. The pixel defining layer includes a plurality of pixel openings. The light-emitting devices are disposed at the pixel openings. The pixel defining layer is located on the side of the optical sensor away from the substrate layer. An encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate layer, wherein the encapsulation layer is provided with a second through hole, and a third reflective layer is provided on the sidewall of the second through hole; A color filter layer is disposed on the side of the encapsulation layer away from the substrate layer. The color filter layer includes a black matrix and a color filter unit facing the light-emitting device. An imaging aperture is disposed on the black matrix facing the optical sensor. A first reflective layer is disposed on the sidewall of the imaging aperture. The orthographic projection of the imaging aperture on the substrate layer overlaps with the orthographic projection of the optical sensor on the substrate layer. And / or, the pixel defining layer is disposed with a first through-hole. A second reflective layer is disposed on the sidewall of the first through-hole. The orthographic projection of the first through-hole on the substrate layer overlaps with the orthographic projection of the optical sensor on the substrate layer.

2. The display screen according to claim 1, characterized in that, The sidewall of the imaging aperture is provided with a first reflective layer, and the first reflective layer is inclined toward the side away from the imaging aperture.

3. The display screen according to claim 1, characterized in that, The orthographic projection of the first through-hole onto the substrate layer lies within the orthographic projection of the imaging hole onto the substrate layer.

4. The display screen according to claim 2, characterized in that, The refractive index of the pixel defining layer is greater than that of the encapsulation layer.

5. The display screen according to claim 2, characterized in that, A buffer layer is provided on the side of the color filter layer away from the substrate layer. The first reflective layer forms a light-transmitting opening, which is filled by the buffer layer. The refractive index of the encapsulation layer is greater than that of the buffer layer.

6. The display screen according to claim 1, characterized in that, The first reflective layer is tilted toward the side closer to the imaging aperture and / or the second reflective layer is tilted toward the side closer to the first through-hole.

7. The display screen according to any one of claims 1-6, characterized in that, The orthographic projections of the imaging aperture and / or the first through-hole on the substrate layer are located within the orthographic projection of the optical sensor on the substrate layer.

8. The display screen according to any one of claims 1-6, characterized in that, The fingerprint detection area includes multiple pixel units, each pixel unit includes a light-emitting device, the first reflective layer and / or the second reflective layer are located between two adjacent pixel units, and the distances of the first reflective layer and the second reflective layer to the two adjacent pixel units are equal.

9. A method for manufacturing a display screen, characterized in that, The method includes: A light-emitting device layer and an optical sensor are formed on one side of a substrate layer. The light-emitting device layer includes a pixel defining layer and a plurality of light-emitting devices. The pixel defining layer includes a plurality of pixel openings. The light-emitting devices are disposed at the pixel openings. The pixel defining layer is located on the side of the optical sensor away from the substrate layer. An encapsulation layer is formed on the side of the light-emitting device layer away from the substrate layer, wherein the encapsulation layer is provided with a second through hole, and a third reflective layer is provided on the sidewall of the second through hole; A color filter layer is formed on the side of the encapsulation layer away from the substrate layer, wherein the color filter layer includes a black matrix and a color filter unit facing the light-emitting device; An imaging aperture is opened in the black matrix directly opposite the optical sensor; A first reflective layer is formed on the sidewall of the imaging aperture; and / or when forming the pixel defining layer, a first through hole is opened in the pixel defining layer, and a second reflective layer is formed on the sidewall of the first through hole; and the orthogonal projections of the imaging aperture and the first through hole on the substrate layer overlap with the orthogonal projection of the optical sensor on the substrate layer.

10. An electronic device, characterized in that, Includes the display screen as described in any one of claims 1-8.

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