An intake mechanism for a vacuum thin film deposition apparatus

Abstract

The application discloses a kind of vacuum film deposition device air inlet mechanism, its structure includes by inside to outside sequentially connected in cavity one side of air outlet plate, busbar and pressing plate, air outlet plate is equipped with several spaced parallel arrangement of grid plate components, grid plate component includes several pieces of evenly arranged grid sheet, the busbar on both sides of each grid plate component is equipped with the hole of the opening of the convection air duct of uniformly distributed, the both ends of convection air duct are connected with the busbar on a pair of upper and lower distribution main air duct, a pair of main air ducts are gathered and end portion is equipped with air inlet opening in air outlet plate side surface.Gas enters from air inlet, and it is evenly flowed into cavity from the gap of grid sheet by main air duct, convection air duct on busbar.The advantages of the application are: structure design is reasonable, can guarantee the uniformity of reaction gas in cavity, realize airflow blowing even, and adjust control airflow is convenient, easy to operate, maintenance is convenient.

Description

Technical Field

[0001] This invention relates to an air inlet mechanism for a vacuum thin film deposition apparatus, specifically an air inlet mechanism for a photovoltaic atomic layer deposition apparatus used for vacuum thin film deposition. Background Technology

[0002] A photovoltaic atomic layer deposition (ALD) device is a device that sequentially injects different reactive gases into a reaction chamber, causing them to react on the surface of the target material (a thin film under vacuum in this invention), thereby generating layer upon layer of single-atom films.

[0003] Existing deposition devices suffer from uneven air intake within the chamber and cumbersome airflow regulation, failing to effectively meet production needs and affecting product quality stability. Summary of the Invention

[0004] The present invention proposes an air intake mechanism for a vacuum thin film deposition apparatus, which aims to overcome the above-mentioned shortcomings of the prior art, improve air intake uniformity, facilitate airflow adjustment, and simplify operation and maintenance.

[0005] The technical solution of this invention is as follows: A gas inlet mechanism for a vacuum thin film deposition apparatus, comprising an outlet plate, a manifold plate, and a pressure plate connected sequentially from the inside to the outside of one side of the cavity. The outlet plate has several parallel grid plate assemblies arranged at intervals. Each grid plate assembly includes several uniformly spaced grid plates. Each grid plate assembly has convection channels with evenly distributed holes opening towards the grid plate assembly on both sides of the manifold plate. The two ends of the convection channels are connected to a pair of vertically distributed main gas channels on the manifold plate. The pair of main gas channels converge, and their ends are provided with inlets located on the side of the outlet plate. Gas enters through the inlets and flows uniformly into the cavity through the main gas channels and convection channels on the manifold plate, exiting through the gaps between the grid plates.

[0006] Preferably, a first adjusting knob is provided at the junction of the pair of main air passages to adjust the area of ​​gas flow to one of the air passages, thereby making the airflow in the two air passages the same. A first adjusting screw is provided at the connection between the convection air passage and the main air passage. Adjusting the extension length of the adjusting screw in the air passage can adjust the gas flow rate and also achieve the purpose of adjusting the uniformity of airflow.

[0007] Preferably, the main air duct and the convection air duct have two layers. The air inlets at the ends of the pair of main air ducts in the other layer are located on the other side of the air outlet plate. A second adjustment knob is provided at the confluence of the pair of main air ducts in the other layer. A second adjustment screw is provided at the connection between the convection air duct and the main air duct in the other layer. This ensures the intake volume and facilitates the adjustment of the intake.

[0008] Preferably, the ends of the first adjusting knob, the second adjusting knob, the first adjusting screw, and the second adjusting screw all extend to the outside of the pressure plate. This facilitates adjustment.

[0009] The advantages of this invention are: reasonable structural design, which can ensure the uniformity of the reaction gas in the cavity, achieve uniform airflow, and make it easy to adjust and control the airflow, simple to operate, and convenient to maintain. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the air intake mechanism of the vacuum thin film deposition apparatus of the present invention.

[0011] Figure 2 yes Figure 1 Enlarged structural diagram of the middle section (I).

[0012] Figure 3 yes Figure 1 A bottom view.

[0013] In the diagram, A is the cavity, 1 is the manifold, 11 is the main air passage, 12 is the convection air passage, 13 is the air inlet, 2 is the first adjustment knob, 3 is the second adjustment knob, 4 is the grid assembly, 5 is the first adjustment screw, 6 is the second adjustment screw, 7 is the pressure plate, and 8 is the air outlet plate. Implementation

[0014] The present invention will be further described in detail below with reference to embodiments and specific implementation methods.

[0015] like Figure 1-3 As shown, an air intake mechanism for a vacuum thin film deposition apparatus includes an outlet plate 8, a manifold plate 1, and a pressure plate 7 connected sequentially from the inside to the outside of a cavity A. The outlet plate 8 is provided with several parallel grid plate assemblies 4, each grid plate assembly 4 including several uniformly spaced grid plates. Each grid plate assembly 4 has convection air channels 12 with evenly distributed holes facing the grid plate assembly 4 on both sides of the manifold plate 1. The two ends of the convection air channels 12 are connected to a pair of vertically distributed main air channels 11 on the manifold plate 1. The pair of main air channels 11 converge and have an air inlet 13 at their ends on the side of the outlet plate 8. A first adjustment knob 2 is provided at the convergence point of the pair of main air channels 11. A first adjustment screw 5 is provided at the connection point between the convection air channel 12 and the main air channel 11.

[0016] The main air passage 11 and the convection air passage 12 are preferably provided in two layers. The air inlet 13 at the end of the pair of main air passages 11 in the other layer is located on the other side of the air outlet plate 8. A second adjustment knob 3 is provided at the confluence of the pair of main air passages 11 in the other layer. A second adjustment screw 6 is provided at the connection between the convection air passage 12 and the main air passage 11 in the other layer.

[0017] The ends of the first adjusting knob 2, the second adjusting knob 3, the first adjusting screw 5, and the second adjusting screw 6 all extend to the outside of the pressure plate 7.

[0018] Based on the above structure, air inlets 13 are provided on both sides of the air outlet plate 8 and are connected to the air passages inside the manifold plate 1. The grid plate assembly 4 located on the air outlet plate 8 has uniformly arranged grid plates. Gas flows into the cavity A uniformly from the grid plate gaps through the air passages of the manifold plate 1.

[0019] In the ideal design of this embodiment, the gas is split into multiple 5mm wide convection channels 12 via the 10mm wide main air channel 11 of the manifold 1. The gas is then blown into cavity A through the grid. When the gas flows through the main air channel 11 of the manifold 1 and splits into upper and lower air paths, the gas flow rate can be controlled by adjusting the area of ​​one of the air paths to ensure uniform airflow. After the gas is split into the 5mm convection channels 12, the gas flow rate can be adjusted by adjusting the extension length of the adjusting screw within the air path to achieve uniform airflow.

[0020] All of the components described above are existing technologies, and those skilled in the art can use any model and existing design that can achieve their corresponding functions.

[0021] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. An air inlet mechanism for a vacuum thin film deposition apparatus, characterized in that, The cavity (A) is connected from the inside out to one side of the cavity (A) in sequence as an air outlet plate (8), a manifold plate (1) and a pressure plate (7). The air outlet plate (8) is provided with several parallel grid plate assemblies (4) arranged at intervals. The grid plate assembly (4) includes several grid plates arranged at even intervals. Each grid plate assembly (4) has a convection air passage (12) with holes opening towards the grid plate assembly (4) on both sides of the manifold plate (1). The two ends of the convection air passage (12) are connected to a pair of vertically distributed main air passages (11) on the manifold plate (1). The pair of main air passages (11) converge and the end is provided with an air inlet (13) on the side of the air outlet plate (8).

2. The air inlet mechanism of a vacuum thin film deposition apparatus as described in claim 1, characterized in that, A first adjustment knob (2) is provided at the junction of the pair of main air passages (11), and a first adjustment screw (5) is provided at the connection between the convection air passage (12) and the main air passage (11).

3. The air inlet mechanism of a vacuum thin film deposition apparatus as described in claim 2, characterized in that, The main air passage (11) and the convection air passage (12) have two layers. The air inlet (13) at the end of the pair of main air passages (11) in the other layer is located on the other side of the air outlet plate (8). A second adjustment knob (3) is provided at the confluence of the pair of main air passages (11) in the other layer. A second adjustment screw (6) is provided at the connection between the convection air passage (12) and the main air passage (11) in the other layer.

4. The air inlet mechanism of a vacuum thin film deposition apparatus as described in claim 3, characterized in that, The ends of the first adjustment knob (2), the second adjustment knob (3), the first adjustment screw (5), and the second adjustment screw (6) all extend to the outside of the pressure plate (7).

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