A circuit board module and a communication device

Abstract

The application relates to the technical field of communication equipment, and discloses a circuit board module and communication equipment to improve the heat dissipation performance of the circuit board module. The circuit board module comprises a substrate, an optical module assembly, an elastic piece and a heat sink. The optical module assembly comprises a shell and an optical module. The shell is arranged on one side of the substrate, and the side of the shell away from the substrate is provided with an opening. The optical module is inserted into the shell from the first end of the shell along a first direction. The first end of the elastic piece is fixedly connected with the substrate, and the second end of the elastic piece is fixedly connected with the side of the shell facing the substrate. The heat sink is arranged on the side of the shell away from the substrate, and the heat sink is fixedly connected with the substrate. The side of the heat sink facing the substrate is provided with a boss opposite the position of the opening. The boss can be inserted into the shell through the opening and is in contact with the optical module inserted into the shell.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and in particular to a circuit board module and a communication device. Background Technology

[0002] Optical modules are a crucial component of communication networks, primarily functioning to convert between optical and electrical signals. With the evolution and upgrading of communication networks, the volume and transmission rate of communication data have significantly increased, placing higher demands on the performance of optical modules. However, this performance improvement also leads to increased power consumption, resulting in greater heat generation during operation. Therefore, enhancing the heat dissipation performance of optical modules has become a pressing technical challenge. Summary of the Invention

[0003] This application provides a circuit board module and a communication device to improve the heat dissipation performance of the circuit board module.

[0004] In a first aspect, this application provides a circuit board module, which may include a substrate, an optical module assembly, an elastic member, and a heat sink. The optical module assembly may include a housing and an optical module. The housing may be disposed on one side of the substrate, and an opening may be provided on the side of the housing facing away from the substrate. The optical module may be inserted into the housing from a first end along a first direction. The first end of the elastic member may be fixedly connected to the substrate, and the second end may be fixedly connected to the side of the housing facing the substrate, thereby achieving a floating connection between the housing and the substrate. The heat sink is disposed on the side of the housing facing away from the substrate, and the heat sink is fixedly connected to the substrate. A boss may be provided on the side of the heat sink facing the substrate, opposite to the opening. This boss may extend into the housing through the opening and contact the optical module inserted into the housing, thereby allowing the heat generated by the optical module to be conducted to the heat sink through the boss, and then dissipated to the outside by the heat sink, achieving heat dissipation for the optical module.

[0005] In the above solution, the outer shell and the substrate can be floated together by an elastic element, so that the optical module can maintain contact with the heat sink protrusion after being inserted into the outer shell. In this way, the heat generated by the optical module can be quickly transferred to the heat sink through the protrusion, thereby achieving continuous heat dissipation of the optical module and improving the heat dissipation performance of the circuit board module.

[0006] For example, the outer shell can be an optical cage. When the optical module is inserted into the optical cage, the optical cage can provide a certain electromagnetic shielding function for the optical module, thereby reducing the electromagnetic interference from the outside world to the optical module.

[0007] In some possible implementations, the circuit board module may further include a connector, which can be fixed to a second end of the housing opposite to its first end and can be electrically connected to an optical module inserted into the housing. Additionally, the connector can be electrically connected to the substrate via a flexible conductive element, thereby achieving an electrical connection between the optical module and the substrate. Utilizing the flexible conductive element, when the connector floats under the influence of the housing, the flexible conductive element deforms with the position of the connector, thereby avoiding pulling on the connection ends of the flexible conductive element, the connector, and the substrate, ensuring reliable connection between both ends of the flexible conductive element and the connector and substrate.

[0008] In some possible implementations, there can be multiple optical module components. In this case, the heat sink can be equipped with protrusions corresponding to each of the multiple optical module components. Each protrusion can extend into the housing of its corresponding optical module component to facilitate heat dissipation for each optical module. Based on the elastic support of the elastic element, each optical module component in this solution can float freely. Therefore, the optical modules within each component can reliably abut against their corresponding protrusions. This allows for effective heat dissipation of multiple optical modules using a single heat sink, which helps simplify the overall structure of the circuit board module and reduce its manufacturing cost.

[0009] In some possible implementations, the circuit board module may also include a fixing plate that can be fixedly disposed on the side of the substrate away from the optical module assembly, thereby supporting the substrate and improving the structural strength of the substrate.

[0010] In some possible implementations, a through hole may be provided on the substrate, and the first end of the elastic element may pass through the through hole and be fixedly connected to the fixing plate. Since the fixing plate is fixedly connected to the substrate, the relative fixation between the first end of the elastic element and the substrate can be achieved.

[0011] In some possible implementations, the circuit board module may further include a first support plate, which may be fixed to the side of the housing facing the substrate to support the housing. In this case, the second end of the elastic element may be fixedly connected to the side of the first support plate facing the substrate. Due to the supporting effect of the first support plate, the pressure on the housing is relatively small when the elastic force is transmitted to the housing, thus reducing the risk of damage to the housing during floating under stress.

[0012] In some other possible implementations, the circuit board module may further include a second support plate, which is arranged side-by-side with the substrate along a first direction and is movable relative to the substrate. Specifically, the housing may be fixed to the side of the second support plate opposite to the fixed plate. In this case, the first end of the elastic member may be fixedly connected to the fixed plate, and the second end may be fixedly connected to the side of the second support plate facing the fixed plate, thereby providing elastic support for the second support plate. The elastic force applied by the elastic member 70 is then transmitted from the second support plate to the optical module assembly.

[0013] In a specific configuration, the second support plate and the substrate can be independent of each other, or they can be connected by a flexible structure so that the second support plate can move relative to the substrate.

[0014] In some possible implementations, the circuit board module may further include a panel fixedly connected to a mounting plate, and the panel may be positioned facing the first end of the housing. The panel has clearance holes through which the optical module can be inserted into the housing. When ventilation is provided to the side of the substrate where the optical module assembly is located, the panel can act as a baffle to guide the airflow, thereby helping to improve the heat dissipation efficiency of the circuit board module.

[0015] In practice, the first end of the panel and the outer casing can be connected by an elastic absorbing material, thereby blocking the gap between the first end of the outer casing and the clearance hole, ensuring the electromagnetic shielding effect of the outer casing on the optical module. For example, the elastic absorbing material includes, but is not limited to, springs, absorbing sponges, etc.

[0016] In some possible implementations, the side of the boss facing the first end of the housing may have a slope, which may gradually tilt toward the housing along a first direction. When the optical module is inserted from the first end of the housing, the slope may guide the insertion of the optical module to improve the ease of operation of the insertion process.

[0017] In some possible implementations, the substrate and the heat sink can be fixedly connected by a first support post. Exemplarily, the first support post can be a stud or other rigid column structure, etc.

[0018] To ensure reliable support for the heat sink, there can be multiple first pillars, which can be evenly arranged between the heat sink and the substrate.

[0019] In some possible implementations, heat pipes can be embedded in the heat sink. The heat pipes can be used to quickly conduct the heat concentrated at the boss on the heat sink to various parts of the heat sink, thereby improving the temperature uniformity of the heat sink, which in turn can improve the heat dissipation efficiency of the heat sink and enhance the heat dissipation effect on the optical module.

[0020] In some other possible implementations, the radiator may also be a water-cooled radiator or an air-cooled radiator of other structures.

[0021] Secondly, this application also provides a communication device, which may include the circuit board module in any of the possible embodiments of the first aspect. Due to the better heat dissipation performance of the circuit board, the operational reliability of the communication device is also improved.

[0022] In some possible implementations, there can be multiple circuit board modules, which can be arranged in parallel. The communication device may also include a backplane, which can be disposed on one side of each circuit board along a first direction and at a first end away from the housing. The backplane can be electrically connected to each circuit board module, thereby enabling the circuit board modules to communicate through the backplane.

[0023] In some possible implementations, the communication device may also include a fan that can deliver air into the air duct formed between adjacent circuit board modules, thereby removing the heat generated by the circuit board modules during operation. Attached Figure Description

[0024] Figure 1 A schematic diagram of the structure of a communication device provided in an embodiment of this application;

[0025] Figure 2 for Figure 1 The diagram shows the structure of a single-board panel.

[0026] Figure 3 for Figure 2 The side view of the single panel shown;

[0027] Figure 4 A side view of a circuit board module provided in an embodiment of this application;

[0028] Figure 5 This is a schematic diagram of the structure of the elastic element provided in the embodiments of this application;

[0029] Figure 6 for Figure 4 The diagram shows the structure of the circuit board module when the optical module is not plugged in.

[0030] Figure 7 for Figure 4 The diagram shows the structure of the circuit board module during the optical module insertion process.

[0031] Figure 8 This is a schematic diagram of another circuit board module provided in an embodiment of this application;

[0032] Figure 9 This is a schematic diagram of another circuit board module provided in an embodiment of this application;

[0033] Figure 10This is a schematic diagram of another circuit board module provided in an embodiment of this application;

[0034] Figure 11 A top view of the circuit board module provided in the embodiments of this application;

[0035] Figure 12 for Figure 11 The diagram shows a cross-sectional view of the circuit board module at point AA.

[0036] Figure label:

[0037] 1-Communication equipment; 100-Housing; 200-Communication main body; 210-Single board (circuit board module); 220-Backplane; 10-Chip;

[0038] 20 - Optical module assembly; 21 - Housing; 211 - First end of housing; 212 - Second end of housing; 22 - Optical module;

[0039] 30 - Inter-board connector; 40 - Power supply; 50 - Central processing unit; 60 - Substrate; 61 - Fixing plate; 611 - Second support;

[0040] 62-Through hole; 63-Panel; 631-Allowing hole; 64-First support plate; 65-Second support plate; 70-Elastic element;

[0041] 80-Radiator; 81-Boss; 811-Bevel; 82-Fin; 83-First support; 90-Connector; 91-Flexible conductive component. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this application clearer, a further detailed description of this application will be provided below in conjunction with the accompanying drawings. The exemplary embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms expressing position and direction described in this application are illustrative based on the accompanying drawings, but changes may be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0043] It should be noted that specific details are set forth in the following description to provide a full understanding of this application. However, this application can be implemented in many ways other than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below. The following descriptions are preferred embodiments for carrying out this application; however, these descriptions are for the purpose of illustrating the general principles of this application and are not intended to limit the scope of this application. The scope of protection of this application shall be determined by the appended claims.

[0044] refer to Figure 1 As shown, Figure 1 This is a schematic diagram of a communication device provided in an embodiment of this application. In this embodiment, the communication device 1 can be a fiber optic transceiver, switch, fiber optic router, fiber optic network card, or base station, or it can be other fiber optic devices with communication functions; this application does not limit this. The communication device may include a housing 100 and a communication main body 200 and a power supply device (not shown in the figure) located within the housing 100. The power supply device may be located on the top of the communication main body 200 to supply power to the communication main body 200.

[0045] The housing 100 may have multiple slots, which may be parallel to each other. Exemplarily, the slots may be arranged side-by-side laterally or in a column-to-column arrangement; this application does not impose any limitation on this. Figure 1 The embodiment shown illustrates multiple slots arranged horizontally side-by-side. The communication unit 200 may include multiple boards 210 and a backplane 220, with each board 210 being inserted into a corresponding slot. Exemplarily, the multiple boards 210 may include service boards and control boards. The insertion direction of the boards 210 is defined as a first direction x, and the backplane may be disposed on one side of each board 210 along the first direction x.

[0046] Figure 2 for Figure 1 The diagram shows the structure of a single-board panel. Figure 3 for Figure 2 The side view of the single panel shown. See also... Figures 1 to 3As shown, a chip 10, an optical module assembly 20, and an inter-board connector 30 can be disposed on the single board 210. The optical module assembly 20 can be disposed at the end of the single board 210 away from the backplane 220, so that the single board 210 can communicate with external devices through the optical module assembly 20. The inter-board connector 30 can be disposed at the end of the single board 210 close to the backplane 220, that is, the optical module assembly 20 and the inter-board connector 30 can be disposed at opposite ends of the single board 210 along the first direction x. The single board 210 can be electrically connected to the backplane 220 through the inter-board connector 30. In a specific implementation, the male connector of the inter-board connector 30 can be disposed on the single board 210, and the female connector can be disposed on the backplane 220. When the single board 210 is inserted into the above-mentioned slot, the connection between the single board 210 and the backplane 220 can be realized by the mating of the male and female connectors. Of course, in some other embodiments, the male connector of the inter-board connector 30 can be disposed on the back plate 220, and the female connector of the inter-board connector 30 can be disposed on the single board 210 accordingly, as long as the connection between the single board 210 and the back plate 220 can be realized. The embodiments of this application do not impose specific restrictions on the arrangement of the inter-board connector 30.

[0047] In some embodiments, the single-board 210 may also be equipped with devices such as a power supply 40 and a central processing unit (CPU) 50. The power supply 40 can be used to supply power to the electrical components on the single-board 210 to ensure the normal operation of the single-board 210. The CPU 50 can be used to control the single-board 210 to perform service transmission and reception, speed adjustment, and handle emergency situations.

[0048] Additionally, the communication device 1 may also include a fan (not shown) for heat dissipation of the communication body 200. Exemplarily, air ducts may be formed between adjacent boards 210 inside the communication device 1, and fans may be disposed at one end of each air duct to deliver airflow into each air duct and remove the heat generated by the boards 210 during operation. In a specific implementation, each air duct may be arranged along a second direction y, and the second direction y may be perpendicular to the first direction x.

[0049] When the communication device 1 is working, the single board 210 can receive external optical signals through the optical module component 20, convert the optical signals into electrical signals and send them to the chip 10 for processing. The chip 10 transmits the processed signals to the backplane 220 through the board-to-board connector 30, and then the backplane 220 transmits them to other single boards 210. After being processed by the chip 10 on the other single board 210, the signals are converted into optical signals by their optical module components 20 and output to the outside, thereby enabling the communication device 1 to realize network switching or network processing functions.

[0050] With the upgrading and evolution of communication networks, the volume and transmission rate of communication data have significantly increased. To ensure the communication needs of communication equipment, the performance of the optical module component 20 can be optimized, and the deployment density of the optical module component 20 on the single board 210 can also be increased, for example... Figure 2 The illustration shows a configuration with five optical module assemblies 20 on board 210. In a specific implementation, these optical module assemblies 20 can be arranged side-by-side along the second direction y on the board. Board 210 can communicate with external devices through each optical module assembly 20, thereby increasing the overall data transmission capacity of the communication device. It should be noted that... Figure 2 The number of optical module components 20 shown in the following figures is for illustrative purposes only and does not constitute a limitation on the actual number of optical module components 20 on board 210.

[0051] Understandably, as the performance of the optical module component 20 improves, its power consumption also increases, leading to increased heat generation during operation. Therefore, heat dissipation for the optical module component 20 is particularly important. Furthermore, in scenarios with high-density deployment of the optical module components 20, the temperatures of each component can cascade. Specifically, the temperature of the optical module component 20 located downstream of the airflow path will be significantly higher than that of the component located upstream, which is extremely detrimental to the overall heat dissipation of the single board 210.

[0052] To address the above issues, this application provides a circuit board module that can be used as a single board 210 in the aforementioned communication device. This circuit board module, by floating the entire optical module assembly, not only ensures effective heat dissipation for the optical module assembly but also solves the problem of temperature cascading of the optical module assembly in high-density deployment scenarios, thereby improving the overall heat dissipation performance of the circuit board module. The circuit board module provided in this application embodiment will be described in detail below with reference to the accompanying drawings. It is worth noting that the reference numerals for the circuit board module are the same as those for the single board 210 in the following text.

[0053] refer to Figure 4 As shown, Figure 4 This is a side view of a circuit board module provided in an embodiment of this application. In this embodiment, the circuit board module 210 may include a substrate 60, an optical module assembly 20, an elastic member 70, and a heat sink 80. The height direction of the circuit board module 210 is defined as the third direction z. The substrate 60, the optical module assembly 20, and the heat sink 80 can be arranged sequentially along the third direction z. The elastic member 70 can elastically connect the substrate 60 and the optical module assembly 20, thereby allowing the optical module assembly 20 to float up and down relative to the substrate 60 along the third direction z. The heat sink 80 can be fixedly connected to the substrate 60 for heat dissipation of the optical module assembly 20. It should be noted that... Figure 4The accompanying drawings below only schematically show some components of the circuit board module 210. The actual shape, size, location, and construction of these components are not subject to change. Figure 4 As well as the limitations of the accompanying figures below.

[0054] In practice, the substrate 60 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. When the substrate 60 is a flexible circuit board or a rigid-flex circuit board, a reinforcing plate can be provided on one side of the substrate 60 to ensure the structural strength of the substrate 60. The substrate 60 can be an FR-4 dielectric substrate, a Rogers dielectric substrate, or a hybrid dielectric substrate of FR-4 and Rogers, etc.

[0055] The optical module assembly 20 may include a housing 21 and an optical module 22. The housing 21 is located on one side of the substrate 60. Along the first direction z, the housing 21 includes a first end 211 and a second end 212. The optical module 22 can be inserted into the housing 21 through the first end 211. For example, the housing 21 may specifically be an optical cage. When the optical module 22 is inserted into the optical cage, the optical cage can provide a certain electromagnetic shielding function for the optical module, thereby reducing the electromagnetic interference of the optical module 22 from the outside.

[0056] When the optical module 22 is electrically connected to the circuit board module 210, the circuit board module 210 may also include a connector 90. The connector 90 can be fixed to the second end 212 of the housing 21, and the connector 90 is electrically connected to the substrate 60, thereby electrically connecting to the chip disposed on the substrate 60. The end of the optical module 22 facing the connector 90 may be provided with gold fingers, and the connector 90 may be provided with pins. During the process of inserting the optical module 22 into the housing 21, the gold fingers of the optical module 22 can be aligned and connected one-to-one with the pins of the connector 90, thereby realizing signal transmission between the optical module 22 and the connector 90. It is understandable that because the housing 21 and the substrate 60 are floatingly connected, the connector 90 will float relative to the substrate 60 along with the housing 21. To ensure the stability of the electrical connection between the connector 90 and the substrate 60, a flexible conductive element 91 can be used to electrically connect the two. When the housing 21 causes the connector 90 to float, the flexible conductive element 91 can deform along with the position change of the connector 90, thereby avoiding pulling on the connection ends of the flexible conductive element 91 with the connector 90 and the substrate 60, and ensuring that both ends of the flexible conductive element 91 can be reliably connected with the connector 90 and the substrate 60. For example, the flexible conductive element 91 can be a flexible cable, a flexible circuit board, etc.

[0057] In some embodiments, along the third direction z, a first end of the elastic member 70 may be fixedly connected to the substrate 60, and the other end may be fixedly connected to the side of the housing 21 facing the substrate 60, thereby achieving a floating connection between the housing 21 and the substrate 60 in the third direction z. The specific type of the elastic member 70 is not limited; exemplarily, such as... Figure 5 As shown, the elastic element 70 can be Figure 5 The spring or precision spring shown in (a) or Figure 5 The spring shown in (b) could also be corrugated steel, or other structural components made of flexible metal or non-metal materials, etc., which will not be listed here.

[0058] Please refer to this again. Figure 4 An opening may be provided on the side of the outer casing 21 facing the heat sink 80, that is, on the top of the outer casing 21, which allows the interior of the outer casing 21 to communicate with the outside. A boss 81 may be provided on the side of the heat sink 80 facing the outer casing 21, which is opposite to the opening. The boss 81 can extend into the interior of the outer casing 21 through the opening and contact the optical module 22 inserted into the outer casing 21, so that the heat generated by the optical module 22 can be conducted to the heat sink 80 through the boss 81, and then dissipated to the outside by the heat sink 80, thereby achieving heat dissipation for the optical module 22.

[0059] In practical implementation, the heat sink 80 can be made of metal materials with good thermal conductivity, such as copper and aluminum, to improve its heat dissipation effect. Additionally, fins 82 can be provided on the side of the heat sink 80 facing away from the optical module assembly 20, which can effectively increase the outer surface area of ​​the heat sink 80, thereby improving the heat exchange efficiency between the heat sink 80 and the outside air, further enhancing its heat dissipation effect. When fixing the heat sink 80 to the substrate 60, the circuit board module 210 can also include a first support pillar 83. Connecting both ends of the first support pillar 83 to the heat sink 80 and the substrate 60 respectively achieves relative fixation between them. It is understood that to achieve reliable support for the heat sink 80, there can be multiple first support pillars 83, which can be evenly arranged between the heat sink 80 and the substrate 60. For example, the first support pillar 83 can be a stud or other rigid column structure.

[0060] In some embodiments, a high thermal conductivity structure may be embedded within the heat sink 80. This high thermal conductivity structure can rapidly conduct heat concentrated at the protrusion 81 on the heat sink 80 to all other parts of the heat sink 80, thereby improving the temperature uniformity of the heat sink 80 and thus enhancing its heat dissipation efficiency and the heat dissipation effect on the optical module 22. For example, the high thermal conductivity structure may be a heat pipe or graphite, etc.

[0061] Of course, in some other embodiments, the heat sink 80 can also be a water-cooled heat sink or an air-cooled heat sink of other structures. This application does not limit this, and the specific choice can be made according to the heat dissipation requirements of the optical module 22. This will not be elaborated further here.

[0062] refer to Figure 6 and Figure 7 As shown, Figure 6 for Figure 4 The diagram shows the structure of the circuit board module when the optical module is not plugged in. Figure 7 for Figure 4 The diagram shows the structure of the circuit board module during the optical module insertion process. Before the optical module 22 is inserted, the elastic element 70 is in a released state, and the boss 81 can extend into the housing 21 through the opening at the top of the housing 21. At this time, the distance between the end face of the boss 81 and the bottom of the housing 21 is less than the height of the optical module 22. When the optical module 22 is inserted into the housing 21, the boss 81 applies a downward force to the optical module 22, thereby pushing the optical module assembly 20 and connector 90 downward as a whole. The elastic element 70 is also compressed, changing from a released state to an energy-storing state. At this time, the elastic element 70 can apply an upward force to the optical module assembly 20. Under this force, the top of the optical module 22 can maintain a contact state with the end face of the boss 81, thereby achieving reliable contact between the optical module 22 and the boss 81. After the optical module 22 is inserted into place, it is aligned and connected with the connector 90, and the optical module 22 is powered on and begins to work. At this time, the heat generated by the optical module 22 can be transferred to the heat sink 80 through the boss 81, so that the heat sink 80 can dissipate heat from the optical module 22.

[0063] In some embodiments, the boss 81 may have a slope 811 on the side facing the first end 211 of the housing 21. Along the first direction x, the slope 811 may gradually slope towards the housing 21 and connect with the end face of the boss 81 facing the housing 21. In this case, the cross-section of the boss 81 in the xz plane is approximately trapezoidal. When the optical module 22 is inserted from the first end 211 of the housing 21, the slope 811 can guide the insertion of the optical module 22 to improve the ease of operation during the insertion process.

[0064] In addition, a friction-resistant material can be provided on the end face of the boss 81 facing the outer casing to reduce wear caused by repeated insertion and removal of the optical module 22, ensuring that the optical module 22 remains in contact with the end face of the boss 81 when plugged in. It should be noted that since the heat generated by the optical module 22 needs to be transferred to the heat sink 80 through the boss 81, the friction-resistant material on the end face of the boss 81, while ensuring friction resistance, also possesses good thermal conductivity to improve the heat transfer efficiency between the optical module 22 and the heat sink 80. For example, graphite can be used as the friction-resistant material.

[0065] refer to Figure 8 As shown, Figure 8 This is a schematic diagram of another circuit board module provided in an embodiment of this application. In this embodiment, the circuit board module 210 may further include a fixing plate 61, which may be disposed on the side of the substrate 60 away from the optical module assembly 20 and support the substrate 60. In some embodiments, there may be a certain gap between the fixing plate 61 and the substrate 60. In this case, the two can be fixed relative to each other by providing a second pillar 611 within the gap. Exemplarily, the second pillar 611 may be a stud or other rigid column structure. In order to achieve reliable support for the substrate 60, there may be multiple second pillars 611, which may be evenly arranged between the fixing plate 61 and the substrate 60 to improve the uniformity of force on the substrate 60. In this case, the substrate 60 may be provided with a through hole 62, and the first end of the elastic member 70 may pass through the through hole 62 and be fixedly connected to the fixing plate 61, thereby achieving relative fixation with the substrate 60. The second end of the elastic member 70 is fixedly connected to the outer shell 21, thereby achieving elastic support for the outer shell 21.

[0066] Of course, in some other embodiments, the fixing plate 61 and the substrate 60 can also be attached together, that is, the substrate 60 can be directly fixed on the fixing plate 61. In this case, a through hole 62 can also be provided on the substrate 60 so that the first end of the elastic member 70 can be fixedly connected to the fixing plate 61.

[0067] Continue to refer to Figure 8 The circuit board module 210 may further include a panel 63, which is disposed facing the first end 211 of the housing 21 and is fixedly connected to the fixing plate 61. The panel 63 is provided with a clearance hole 631, through which the optical module 22 can be inserted into the housing 21. It is understood that when the circuit board module 210 is inserted into the slot of the communication device, the panel 63 and the back plate are disposed opposite each other along the first direction x. Thus, inside the communication device, the two adjacent circuit board modules 210, as well as the panel 63 and the back plate, can form an air duct, which is understood to be disposed along the second direction. When dissipating heat from the optical module 22, air can flow along the second direction from one end of the air duct to the other, thereby carrying away the heat accumulated on the heat sink 80 and achieving continuous heat dissipation from the optical module 22.

[0068] Furthermore, since the optical module 22 will move along with the housing 21 in the third z-direction after being inserted into the housing 21, in a specific implementation, the height of the clearance hole 631 can be designed to be greater than the height of the optical module 22, thereby avoiding interference between the optical module 22 and the panel 63. In this case, the side of the panel 63 facing the housing 21 can be connected to the first end 211 of the housing 21 through an elastic absorbing material. The elastic absorbing material can deform as the housing 21 moves, thereby blocking the gap between the first end 211 of the housing 21 and the clearance hole 631 in the third z-direction, ensuring the electromagnetic shielding effect of the housing 21 on the optical module 22. In a specific implementation, the elastic absorbing material includes, but is not limited to, a spring, absorbing sponge, etc.

[0069] refer to Figure 9 As shown, Figure 9 This is a schematic diagram of another circuit board module provided in an embodiment of this application. In this embodiment, the circuit board module 210 may further include a first support plate 64, which can be fixed to the side of the housing 21 facing the substrate 60 to support the housing 21. It can be understood that along the first direction x, the first support plate 64 may also extend to the bottom of the connector 90, thereby supporting the connector 90 as well. In this case, the elastic member 70 may be specifically disposed between the fixing plate 61 and the first support plate 64, and the first end of the elastic member 70 passes through the through hole on the substrate 60 and is fixedly connected to the fixing plate 61, and the second end is fixedly connected to the side of the first support plate 64 facing the substrate 60, thereby realizing elastic support for the first support plate 64, and then the elastic force applied by the elastic member 70 is transmitted by the first support plate 64 to the optical module assembly 20 and the connector 90, so that the first support plate 64, the optical module assembly 20 and the connector 90 can float up and down relative to the substrate 60 as a whole. With the support of the first support plate 64, the pressure on the outer shell 21 will be relatively small when the elastic force is transmitted to the outer shell 21. Therefore, the risk of damage to the outer shell 21 during the floating process under force can be reduced, thereby improving the overall structural strength of the circuit board module 210.

[0070] In practice, the first support plate 64 can be made of a material with a certain strength to ensure reliable support for the optical module assembly 20 and the connector 90. For example, the first support plate 64 can be a metal plate or a plastic plate, etc.

[0071] refer to Figure 10 As shown, Figure 10This is a schematic diagram of another circuit board module provided in an embodiment of this application. In this embodiment, the circuit board module 210 may include a second support plate 65, which is arranged side by side with the substrate 60 along a first direction x, and the second support plate 65 is located on the side of the substrate 60 closer to the panel 63. The housing 21 and the connector 90 may be fixed to the second support plate 65. The second support plate 65 and the substrate 60 are movable relative to each other. In specific implementation, the second support plate 65 and the substrate 60 may be independent of each other, that is, there may be no connection between them. Alternatively, the second support plate 65 and the substrate 60 may be connected by a flexible structure, such as by a spring or rubber. In addition, the second support plate 65 and the substrate 60 may be the same type of dielectric substrate, for example, they may be cut from the same dielectric substrate. Alternatively, the second support plate 65 may also be a metal plate or a plastic plate, etc., and this application does not impose specific limitations on this.

[0072] An elastic element 70 can be disposed between the fixed plate 61 and the second support plate 65. The first end of the elastic element 70 is fixedly connected to the fixed plate 61, and the second end is fixedly connected to the side of the second support plate 65 facing the fixed plate 61, thereby providing elastic support to the second support plate 65. The second support plate 65 then transmits the elastic force applied by the elastic element 70 to the optical module assembly 20 and the connector 90, allowing the second support plate 65, the optical module assembly 20, and the connector 90 to float vertically relative to the substrate 60 as a whole. Similar to the function of the first support plate, in this embodiment, with the support of the second support plate 65, the pressure on the outer shell 21 is relatively small when the elastic force is transmitted to the outer shell 21. Therefore, the risk of damage to the outer shell 21 during the floating process can be reduced, thereby improving the overall structural strength of the circuit board module 210.

[0073] refer to Figure 11 As shown, Figure 11 This is a top view of the circuit board module provided in the embodiment of this application. Figure 12 for Figure 11 The diagram shows a cross-sectional view of the circuit board module at point AA. As mentioned earlier, to increase the volume of communication data in the communication device, multiple optical module components 20 can be installed on the circuit board module 210 for data transmission. Figure 11 The illustrated embodiment uses five optical module components 20 as an example for explanation. In specific implementation, the five optical module components 20 can be arranged side by side along the second direction y. In this case, the heat sink 80 can be provided with multiple protrusions 81 corresponding to the multiple optical module components one by one. Each protrusion 81 can extend into the housing 21 of the corresponding optical module component 20 through the opening of its housing 21, so as to facilitate heat dissipation for each optical module 22.

[0074] Based on the elastic support of the elastic element 70, each optical module assembly 20 can move freely in the third direction z. Even if there are certain manufacturing tolerances in the third direction z of each optical module assembly 20, these tolerances can be absorbed by the elastic element 70 below. This allows the optical modules 22 within each optical module assembly 20 to reliably abut against their corresponding bosses 81, thereby achieving effective heat dissipation of each optical module 22 by the heat sink 80. In other words, for high-density optical module 22 deployment scenarios, the floating design scheme of the optical module assembly 20 provided in this application embodiment can effectively dissipate heat from multiple optical modules 22 using a single heat sink 80, thereby helping to simplify the overall structure of the circuit board module 210 and reduce the manufacturing cost of the circuit board module 210.

[0075] It is worth mentioning that, in some embodiments, each optical module component 20 can be elastically supported on the substrate 60 by one or more elastic members 70. This can decouple the movement of each optical module component 20 in the third direction z, thereby reducing the mutual influence between adjacent optical module components 20 and further improving the contact reliability between each optical module 22 and the corresponding boss 81.

[0076] Please continue to refer to this. Figure 11 For communication devices using the circuit board module 210, the fan of the communication device can be located on any side of the circuit board module 210 along the second direction y, and this application does not impose any restrictions on this. For example, when the fan is located at the bottom of the circuit board module 210 and the airflow direction is from bottom to top, the end near the bottom of the circuit board module 210 can be understood as the upstream of the airflow path, and the end near the top of the circuit board module 210 can be understood as the upstream of the airflow path. Taking an optical module 22 with a power consumption of 40W, an internal slot height of 1.3 inches, and a fan speed of 3m / s as an example, the temperatures of the service chips of each optical module in the floating optical module heat dissipation scheme adopted in this application embodiment and the traditional single-unit heat sink scheme are detected, and the heat dissipation effects of the two are analyzed. The results are shown in Table 1.

[0077] Table 1

[0078]

[0079] As can be seen from the table above, by adopting the floating design heat dissipation scheme of the optical module component 20 provided in the embodiments of this application, the problem of temperature cascading of the optical module 22 is significantly improved. Furthermore, due to the design of the overall heat sink 80 scheme, the heat dissipation area can be effectively increased, and the temperature difference between each optical module 22 is also greatly reduced. The temperature of the outer shell 21 of the optical module component 20 located at the downstream end of the air duct can be reduced by 8.1°C compared with the traditional heat dissipation scheme, and the heat dissipation effect is improved by 20%.

[0080] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board module, characterized in that, Includes substrate, optical module assembly, elastic components, and heat sink, among which: The optical module assembly includes a housing and an optical module. The housing is disposed on one side of the substrate, and an opening is provided on the side of the housing facing away from the substrate. The optical module is inserted into the housing from the first end of the housing along a first direction. The first end of the elastic element is fixedly connected to the substrate, and the second end of the elastic element is fixedly connected to the side of the outer shell facing the substrate. The heat sink is disposed on the side of the housing away from the substrate, and the heat sink is fixedly connected to the substrate. The side of the heat sink facing the substrate is provided with a boss opposite to the opening position. The boss can extend into the housing through the opening and contact the optical module inserted into the housing. The number of optical module components is multiple; The heat sink is provided with a plurality of protrusions corresponding one-to-one with the plurality of optical module components, and each protrusion can extend into the housing of the corresponding optical module component.

2. The circuit board module as described in claim 1, characterized in that, It also includes a connector, which is fixed to the second end of the housing, and is electrically connected to the substrate via a flexible conductive element, and is also electrically connected to the optical module inserted into the housing; The second end of the outer casing is disposed opposite to the first end of the outer casing along the first direction.

3. The circuit board module as described in claim 1 or 2, characterized in that, It also includes a fixing plate, which is fixedly supported on the side of the substrate away from the optical module assembly.

4. The circuit board module as described in claim 3, characterized in that, The substrate is provided with a through hole, and the first end of the elastic member passes through the through hole and is fixedly connected to the fixing plate.

5. The circuit board module as described in claim 3 or 4, characterized in that, It also includes a first support plate, which is fixedly supported on the side of the outer shell facing the substrate; The second end of the elastic element is fixedly connected to the first support plate.

6. The circuit board module as described in claim 3, characterized in that, It also includes a second support plate, which is arranged side by side with the substrate along the first direction, and the second support plate is movable relative to the substrate. The outer shell is fixed to the side of the second support plate away from the fixed plate. The first end of the elastic element is fixedly connected to the fixed plate, and the second end of the elastic element is fixedly connected to the side of the second support plate facing the fixed plate.

7. The circuit board module as described in claim 6, characterized in that, The second support plate is independently disposed from the fixed plate; or, the second support plate and the fixed plate are connected by a flexible structure.

8. The circuit board module as described in any one of claims 3 to 7, characterized in that, It also includes a panel, which is fixedly connected to the fixing plate and is positioned facing the first end of the housing. The panel is provided with a clearance hole, through which the optical module is inserted into the housing.

9. The circuit board module as described in claim 8, characterized in that, The panel is connected to the first end of the outer casing by an elastic absorbing material.

10. The circuit board module as described in any one of claims 1 to 9, characterized in that, The boss has a slope on the side facing the first end of the housing, and the slope gradually slopes towards the housing along the first direction.

11. The circuit board module as described in any one of claims 1 to 10, characterized in that, It also includes a first support column, the two ends of which are fixedly connected to the substrate and the heat sink, respectively.

12. The circuit board module as described in any one of claims 1 to 11, characterized in that, The radiator is equipped with heat pipes.

13. A communication device, characterized in that, Includes the circuit board module as described in any one of claims 1 to 12.

14. The communication device as described in claim 13, characterized in that, The number of circuit board modules is multiple, and the multiple circuit board modules are arranged side by side; The communication device further includes a backplane, which is located on one side of each of the circuit boards along the first direction and is disposed at a first end away from the housing. The backplane is electrically connected to each of the circuit board modules.

15. The communication device as described in claim 14, characterized in that, An air duct is formed between adjacent circuit board modules; The communication device also includes a fan, which is configured to deliver air into each of the air ducts.

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