Intelligent multi-section temperature control method for hot melt glue gun and hand-held hot melt glue gun

Abstract

The application discloses a kind of hot melt glue gun intelligent multi-section temperature control method and hand-held hot melt glue gun;Among them, hot melt glue gun includes total switch, contact switch, controller, heating device, power device and holding detection device;When total switch is started, the following steps are executed: if hot melt glue gun is detected in holding state, timing is zero, and controller makes heating device in non-low temperature heating mode;If hot melt glue gun is detected in non-holding state, start timing, within preset buffer time T1, controller makes heating device along previous non-low temperature heating mode;After reaching T1, controller makes heating device set to low temperature heating mode, and after reaching preset standby time T2, controller makes heating device set to stop heating mode;The application can judge the state when user uses, then control heating temperature by controller, control the melting state of glue stick, both can save power and can avoid glue overflow, scald user's situation occurs.

Description

Technical Field

[0001] This invention relates to the field of glue gun technology, and in particular to an intelligent multi-segment temperature control method for hot melt glue guns and a handheld hot melt glue gun using this method. Background Technology

[0002] A hot melt glue gun is a tool that uses a heating structure to heat a glue stick, turning it from a solid to a molten state, thereby bonding objects together. During use, especially handheld hot melt glue guns with rechargeable batteries, the battery capacity and heat power are limited, often resulting in insufficient power halfway through use, which greatly affects the user experience. In addition, traditional hot melt glue guns usually only have a few settings that need to be manually adjusted. If the setting is not returned to a lower setting after using the high temperature, not only is electricity wasted, but the molten glue will also overflow from the nozzle, which can easily burn the user.

[0003] To address this issue, prior art patent CN206882039U discloses a hot melt glue gun that uses a contact switch to detect whether the user's hand is placed on the switch. If the trigger's pressure on the trigger button disappears after a certain period, the trigger switch closes, causing the temperature of the heating hot melt device to drop, thereby reducing the fluidity of the molten glue in the melting chamber and effectively achieving energy saving and preventing overflow. Prior art patent CN213194403U discloses a glue melting device and glue gun, which has a linkage switch and a master control switch. The linkage switch works in conjunction with the trigger to detect whether the trigger has been pulled. If the trigger is not pulled for a period exceeding a preset time by the controller, the controller causes the master control switch to disconnect the circuit and shut down the glue gun, thus achieving automatic shutdown and avoiding excessive energy consumption and safety hazards. Prior art patent CN107096... 695A discloses a temperature control method for a hot melt glue gun. In this method, during the standby phase, a circuit control board performs a standby delay with a preset delay time of t2. If the trigger switch does not activate within the preset delay time t2, the standby phase ends when the preset delay time t2 is reached, and the circuit control board stops the heating and melting device, i.e., the glue gun automatically shuts down. If the trigger switch is activated within the preset delay time t2, the circuit control board enables the heating and melting device to operate in a high-temperature heating mode, allowing the glue stick in the melting chamber to melt rapidly. When the trigger switch is deactivated, the preset delay time t2 is reset and the standby phase is restarted. At this time, the heating and melting device resumes a low-temperature heating mode, which not only has a better energy-saving effect, but also allows the melting chamber to cool down rapidly, thereby reducing the fluidity of the molten glue in the melting chamber and preventing overflow.

[0004] In summary, the above technical solutions rely solely on a single contact switch for status determination. Use is initiated only when the switch is pressed, and the device enters standby mode if the switch is not pressed for an extended period. This approach is inaccurate in determining the user's usage status. In actual use, users may hold the glue gun for extended periods without triggering the switch, leaving it in standby mode. After a prolonged period without activation, the glue gun either enters a low-temperature heating mode or stops heating altogether. When needed, heating resumes only after triggering the contact switch, resulting in a slow heating response, poor user experience, and high power consumption. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a smart multi-segment temperature control method for hot melt glue gun that can effectively reduce power consumption, glue dripping and leakage, and has a fast heating response when the glue gun is held but not in use, and a handheld hot melt glue gun using the method.

[0006] To solve the above technical problems, the technical solution of the present invention is: an intelligent multi-segment temperature control method for a hot melt glue gun, wherein the hot melt glue gun includes a main switch, a contact switch, a controller, a heating device, and a power supply device, and the hot melt glue gun is also provided with a grip detection device for detecting whether the handle of the hot melt glue gun is being gripped, the grip detection device being connected to the controller; when the main switch is activated, the following steps are performed:

[0007] S1. The grip detection device detects whether the hot melt glue gun is being gripped. If the hot melt glue gun is detected to be in a gripped state, the timer is reset to zero, and the controller puts the heating device into a non-low temperature heating mode, which is either a high temperature heating mode or a medium temperature heating mode. At the same time, it determines whether the contact switch is triggered. When the contact switch is triggered, the controller sets the heating device to a high temperature heating mode; when the contact switch is not triggered, the controller sets the heating device to a medium temperature heating mode.

[0008] S2. If the hot melt glue gun is detected to be in a non-held state, the timing starts and the controller enters the buffer stage. The preset buffer delay is T1. Within the preset buffer time T1, the controller makes the heating device continue to use the previous non-low temperature heating mode.

[0009] S3. After the preset buffer time T1 is reached, the controller sets the heating device to a low-temperature heating mode and presets a standby time T2. After the preset standby time T2 is reached, the controller sets the heating device to a stop heating mode.

[0010] As a preferred technical solution, in any of steps S1 to S3, once the contact switch is triggered, regardless of whether the grip detection device detects whether the hot melt glue gun is being gripped, the timer is reset to zero, and the controller sets the heating device to high-temperature heating mode.

[0011] As a preferred technical solution, in the buffer stage of step S2, if the heating device was previously in high-temperature heating mode, the heating device will remain in high-temperature heating mode within the preset buffer time T1; if the heating device was previously in medium-temperature heating mode, the heating device will remain in medium-temperature heating mode within the preset buffer time T1.

[0012] As a preferred technical solution, the grip detection device is a capacitive sensor installed at the handle of the hot melt glue gun.

[0013] As a preferred technical solution, the hot melt temperature under the high-temperature heating mode is 85℃-95℃; the hot melt temperature under the medium-temperature heating mode is 60℃-70℃; and the hot melt temperature under the low-temperature heating mode is 45℃-55℃.

[0014] As a preferred technical solution, the preset buffer time T1 is 5s-20s; the preset standby time T2 is 120s-240s.

[0015] As a preferred technical solution, the heating device includes a heating element disposed at the glue outlet of the hot melt glue gun, and the hot melt glue gun is provided with a temperature sensor for detecting and feeding back the heating temperature of the heating element.

[0016] Another preferred technical solution is a handheld hot melt glue gun, which employs the intelligent multi-segment temperature control method described above.

[0017] As a preferred technical solution, the hot melt glue gun is also equipped with a rapid cooling device for cooling down the heating device.

[0018] As a preferred technical solution, the rapid cooling device includes a cooling fan fixed inside the hot melt glue gun, the air outlet side of the cooling fan corresponds to the heating device, and the surface of the hot melt glue gun is also provided with an air inlet and an air outlet, forming a cooling air duct that flows through the heating device between the air inlet and the air outlet.

[0019] Due to the adoption of the above technical solutions, the beneficial effects of this invention are as follows: This invention provides a temperature control method that combines a contact switch, a capacitive sensor, and a temperature sensor. This design can determine the user's state during use and then control the heating temperature of the heating element through a controller, thereby controlling the melting state of the glue stick. This saves power and prevents glue overflow and burns to the user. The combination of the capacitive sensor and the timing mechanism ensures that the glue gun maintains low power consumption during most periods of non-use, while also reducing glue dripping and leakage. The combination of the contact switch and the capacitive sensor considers situations where the user holds the glue gun but does not squeeze glue. It places the heating element in a medium-temperature heating mode, which, compared to the prior art that maintains a consistently high temperature, reduces power consumption and glue dripping and leakage. Furthermore, when the contact switch is triggered again, compared to the prior art that directly heats from a low-temperature mode to a high-temperature mode, this solution heats from a medium-temperature mode to a high-temperature mode, resulting in a faster heating response. Attached Figure Description

[0020] The following figures are intended only to illustrate and explain the present invention and do not limit the scope of the invention. Wherein:

[0021] Figure 1 This is a schematic diagram of the structure of a handheld hot melt glue gun according to an embodiment of the present invention;

[0022] Figure 2 This is an operation flowchart of an embodiment of the present invention;

[0023] Figure 3 This is an operation flowchart of the contact switch after being triggered and started according to an embodiment of the present invention;

[0024] In the diagram: 1-Main switch; 2-Contact switch; 3-Controller; 4-Power supply; 5-Heating element; 6-Temperature sensor; 7-Capacitive sensor; 8-Cooling fan; 9-Air inlet; 10-Air outlet. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the following detailed description, only certain exemplary embodiments of the invention are described by way of illustration. Undoubtedly, those skilled in the art will recognize that various modifications can be made to the described embodiments without departing from the spirit and scope of the invention. Therefore, the drawings and description are illustrative in nature and not intended to limit the scope of the claims.

[0026] Example 1:

[0027] See Figure 1A handheld hot melt glue gun includes a main switch 1, a contact switch 2, a controller 3, a heating device, and a power supply 4. The main switch 1, contact switch 2, heating device, and power supply 4 are all structures found in conventional hot melt glue guns. Each of these components is connected to the controller 3. The main switch 1 serves as the master control switch for starting the hot melt glue gun. The main control switch can be located in a position that does not affect grip, such as the bottom of the handle or the top of the glue gun. When the main switch 1 is turned on, the hot melt glue gun can be used; when the main switch 1 is turned off, the hot melt glue gun cannot be used. The contact switch 2 is located on the handle of the hot melt glue gun near the trigger. The contact switch 2 is a contact sensor used to detect whether the user has pressed the trigger. When the trigger is pressed, it triggers the contact switch 2 to open, indicating that the user wants to dispense glue, requiring the heating device to be set to high-temperature heating mode. The heating device includes a heating element 5 disposed at the glue dispensing point of the hot melt glue gun, and a temperature sensor 6 is provided inside the hot melt glue gun for detecting and feeding back the heating temperature of the heating element 5. The controller is a microcontroller.

[0028] This embodiment is an improvement on the existing conventional hot melt glue gun. Specifically, the hot melt glue gun is further equipped with a grip detection device for detecting whether the handle of the hot melt glue gun is being gripped. The grip detection device is connected to the controller 3, and the grip signal detected by the grip detection device is transmitted to the controller 3, thereby controlling the heating device to switch between multiple heating modes. In this embodiment, the grip detection device is a capacitive sensor 7 located at the handle of the hot melt glue gun. The capacitive sensor 7 is fixed inside the hot melt glue gun. The capacitive sensor 7 determines whether the handle is being gripped by the user by measuring the change in pressure on the surface of the handle. To ensure the accuracy of the measurement results, multiple capacitive sensors 7 can be installed at the handle corresponding to the positions of each finger. The grip signals generated by the multiple capacitive sensors 7 are transmitted to the controller 3 respectively. The controller 3 processes and analyzes the multiple grip signals to obtain accurate detection results.

[0029] like Figure 2 As shown, the intelligent multi-segment temperature control method for hot melt glue gun performs the following steps when the main switch 1 is activated:

[0030] S1. The grip detection device detects whether the hot melt glue gun is being gripped. If the hot melt glue gun is detected to be in a gripped state, it means that the user is in a ready-to-use state. At this time, the timer is reset to zero, and the controller 3 sets the heating device to a non-low temperature heating mode, which is either a high temperature heating mode or a medium temperature heating mode. At the same time, it determines whether the contact switch 2 is triggered. When the contact switch 2 is triggered, that is, when the user presses the trigger, it means that the user is already using the hot melt glue gun, and the controller 3 immediately sets the heating device to a high temperature heating mode. When the contact switch 2 is not triggered, that is, when the user does not press the trigger, the controller 3 sets the heating device to a medium temperature heating mode.

[0031] S2. If the hot melt glue gun is detected to be in a non-held state, that is, the hot melt glue gun is in a placed state, the timing starts and the controller 3 enters the buffer stage. The preset buffer delay is T1. Within the preset buffer time T1, the controller 3 makes the heating device continue to use the previous non-low temperature heating mode. That is, if the heating device was previously in high temperature heating mode, the heating device will still be in high temperature heating mode within the preset buffer time T1. If the heating device was previously in medium temperature heating mode, the heating device will still be in medium temperature heating mode within the preset buffer time T1.

[0032] S3. After the preset buffer time T1 is reached, the controller 3 sets the heating device to low temperature heating mode and presets the standby time to T2. After the preset standby time T2 is reached, the controller 3 sets the heating device to stop heating mode, while each sensor remains in working state, ready for use.

[0033] See Figure 3 In any of steps S1 to S3, once the contact switch 2 is triggered, regardless of whether the grip detection device detects whether the hot melt glue gun is being gripped, the timer is reset to zero, and the controller 3 sets the heating device to high-temperature heating mode. In this way, the contact switch 2 is given the highest priority. Whenever the contact switch 2 is pressed, it indicates that the user is already using the hot melt glue gun, and the timer is immediately reset to zero. At this time, the capacitive sensor 7 should detect that the handle is being gripped by the user. If the capacitive sensor 7 does not detect the handle being gripped due to its placement or other reasons, it will automatically be set to a gripped state as soon as the contact switch 2 is triggered, and the controller 3 will simultaneously set the heating device to high-temperature heating mode. Furthermore... Figure 2 The positions marked ①, ②, and ③ indicate that, regardless of the current mode of the heating element 5, once the contact switch 2 is turned on, the heating element 5 will switch to the high-temperature heating mode.

[0034] In this embodiment, regardless of the state or temperature mode of the heating device, as long as the handle is detected to be gripped or the contact switch 2 is triggered, the usage state will change. Therefore, this control method needs to follow... Figure 2 , Figure 3 The process is re-evaluated and processed, that is, the steps are executed cyclically.

[0035] The preset buffer time T1 is 5s-20s, and the preset standby time T2 is 120s-240s. In this embodiment, the preset buffer time T1 is 10s, and the preset standby time T2 is 180s. The time settings are reasonable, ensuring power saving while effectively preventing glue overflow. In step S2, if the hot melt glue gun is detected to be in a non-held state, i.e., the hot melt glue gun is in a placed state, the timing state is entered. When T < 10s, the buffer stage is entered. If the heating element 5 was previously in high-temperature heating mode, it will remain in high-temperature heating mode for 10s. If the heating element 5 was previously in medium-temperature heating mode, it will remain in medium-temperature heating mode for 10s. In step 3, when 10s < T < 180s, the heating element 5 enters low-temperature heating mode. When T > 180s, the heating element 5 completely stops working and is set to stop heating mode.

[0036] The hot melt temperature in the high-temperature heating mode is 85℃-95℃, at which point the glue stick completely softens into a fluid. In the medium-temperature heating mode, the hot melt temperature is 60℃-70℃, at which point the glue stick softens but remains essentially non-flowing. In the low-temperature heating mode, the hot melt temperature is 45℃-55℃, at which point the glue stick does not soften at all. In this embodiment, the optimal hot melt temperature is 90℃ in the high-temperature heating mode, 65℃ in the medium-temperature heating mode, and 50℃ in the low-temperature heating mode, meeting the melting point requirements of the glue stick. This also results in shorter heating times during temperature switching, saving energy consumption.

[0037] This invention provides a temperature control method that combines a contact switch 2, a capacitive sensor, and a temperature sensor 6. This design can determine the user's state during use, and then control the heating temperature of the heating element via a controller 3 to control the melting state of the glue stick. This saves power and prevents glue overflow and burns. The combination of the capacitive sensor 7 and the timing mechanism ensures that the glue gun maintains low power consumption during most periods of non-use, while also reducing glue dripping and leakage. The combination of the contact switch 2 and the capacitive sensor 7 considers situations where the user is holding the glue gun but not dispensing glue, placing the heating element 5 in a medium-temperature heating mode. Compared to existing technologies that maintain a constantly high temperature, this medium-temperature heating also reduces power consumption and glue dripping and leakage. Furthermore, when the contact switch is triggered again, unlike existing technologies that directly heat from a low-temperature mode to a high-temperature mode, this solution heats from a medium-temperature mode to a high-temperature mode, resulting in a faster heating response.

[0038] Example 2:

[0039] This embodiment adds a new structure to the first embodiment. In this embodiment, the hot melt glue gun is further equipped with a rapid cooling device for cooling the heating element. The rapid cooling device includes a cooling fan 8 fixed inside the hot melt glue gun. The air outlet side of the cooling fan 8 corresponds to the heating element. The surface of the hot melt glue gun is also provided with an air inlet 9 and an air outlet 10, forming a cooling air duct that flows through the heating element. The cooling fan 8 is connected to the controller 3, and the control logic makes temperature control more efficient. When it is necessary to lower the temperature range, the cooling fan 8 is activated. The cold air entering through the air inlet 9 passes over the surface of the heating element, carrying away the heat from the surface of the heating element, and then is discharged through the air outlet, achieving the purpose of rapid cooling.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for intelligent multi-segment temperature control of a hot melt glue gun, wherein the hot melt glue gun includes a main switch, a contact switch, a controller, a heating device, and a power supply device, characterized in that: The hot melt glue gun is also equipped with a grip detection device for detecting whether the handle of the hot melt glue gun is being gripped, and the grip detection device is connected to the controller; when the main switch is turned on, the following steps are performed: S1. The grip detection device detects whether the hot melt glue gun is being gripped. If the hot melt glue gun is detected to be in a gripped state, the timer is reset to zero, and the controller puts the heating device into a non-low temperature heating mode, which is either a high temperature heating mode or a medium temperature heating mode. At the same time, it determines whether the contact switch is triggered. When the contact switch is triggered, the controller sets the heating device to a high temperature heating mode; when the contact switch is not triggered, the controller sets the heating device to a medium temperature heating mode. S2. If the hot melt glue gun is detected to be in a non-held state, timing begins, and the controller enters a buffer phase with a preset buffer delay of T1. During the preset buffer time T1, the controller causes the heating device to continue using the previous non-low temperature heating mode. During the buffer phase of step S2, if the heating device was previously in a high temperature heating mode, it will remain in a high temperature heating mode during the preset buffer time T1. If the heating device was previously in a medium temperature heating mode, it will remain in a medium temperature heating mode during the preset buffer time T1. S3. After the preset buffer time T1 is reached, the controller sets the heating device to a low-temperature heating mode and presets a standby time T2. After the preset standby time T2 is reached, the controller sets the heating device to a stop heating mode. In any of steps S1 to S3, once the contact switch is triggered, regardless of whether the grip detection device detects whether the hot melt glue gun is being gripped, the timer is reset, and the controller sets the heating device to high-temperature heating mode. The hot melt temperature under the medium-temperature heating mode softens the glue stick but prevents it from flowing.

2. The intelligent multi-segment temperature control method for hot melt glue gun as described in claim 1, characterized in that: The grip detection device is a capacitive sensor installed on the handle of the hot melt glue gun.

3. The intelligent multi-segment temperature control method for hot melt glue gun as described in claim 1, characterized in that: The hot melt temperature under the high-temperature heating mode is 85℃-95℃; the hot melt temperature under the medium-temperature heating mode is 60℃-70℃; and the hot melt temperature under the low-temperature heating mode is 45℃-55℃.

4. The intelligent multi-segment temperature control method for hot melt glue gun as described in claim 1, characterized in that: The preset buffer time T1 is 5s-20s; the preset standby time T2 is 120s-240s.

5. The intelligent multi-segment temperature control method for hot melt glue gun as described in claim 1, characterized in that: The heating device includes a heating element disposed at the glue outlet of the hot melt glue gun, and the hot melt glue gun is provided with a temperature sensor for detecting and feeding back the heating temperature of the heating element.

6. A handheld hot melt glue gun, characterized in that: The intelligent multi-segment temperature control method described in any one of claims 1 to 5 is adopted.

7. The handheld hot melt glue gun as described in claim 6, characterized in that: The hot melt glue gun is also equipped with a rapid cooling device for cooling down the heating device.

8. The handheld hot melt glue gun as described in claim 7, characterized in that: The rapid cooling device includes a cooling fan fixed inside the hot melt glue gun. The air outlet side of the cooling fan corresponds to the heating device. The surface of the hot melt glue gun is also provided with an air inlet and an air outlet. A cooling air duct is formed between the air inlet and the air outlet, which flows through the heating device.

Images