Test kits and test equipment

Abstract

The present invention discloses a test kit and test equipment. The test kit includes an adapter plate assembly and a mounting base. The base plate and upper plate of the adapter plate assembly are used to restructure the signal transmission method, and the adapter plate assembly is fixed to the mounting slot of the mounting base to change the installation method. Accordingly, by redesigning the test kit and installing it on a test machine of the test equipment, the test kit can be installed on a test machine for testing using test carriers of different specifications. The present invention can divert the available space of the test carrier, and the test carrier can be redesigned to increase the testable capacity of the object to be tested. Under the premise of a set of test kit and test equipment, the equipment setup cost and test complexity are reduced, while the efficiency of test output is improved.

Description

Technical Field

[0001] The present invention relates to a test of a semiconductor or electronic component, and in particular to a test kit and a test device. Background Art

[0002] Semiconductor components and chips or lower-level electronic circuit components and chips not only include complex manufacturing, packaging processes and testing-related steps, but packaged chips (integrated circuits) can generally refer to components including semiconductors, and undergo related testing processes after manufacturing.

[0003] The equipment or device for testing semiconductor chips has a test host specifically for testing semiconductor chips and a carrier board for mounting the DUT. The test host can be called a tester or test head, which mounts the carrier board and tests the DUT. The test host is a device that generates test signals or signal sources.

[0004] Once the carrier board and test host for the DUT are installed, they can only test the DUT based on the carrier board's specific specifications. When testing a different DUT, the carrier board and test host must be replaced with different specifications. The test host is not universal, meaning that one set of equipment cannot test DUTs with different specifications or functions. Summary of the Invention

[0005] An object of the present invention is to provide a test kit and a test device to solve at least one of the above problems.

[0006] The technical problem to be solved by the present invention is to provide a test kit to address the deficiencies of the prior art, comprising: an adapter board assembly, the adapter board assembly being provided with a base plate and an upper plate, the lower surface of the base plate being provided with a plurality of first signal connection portions and a first connector for connecting at least one relay control switch board, the upper plate being connected to the base plate via a plurality of second connectors, the upper surface of the upper plate being provided with a plurality of second signal connection portions for connecting a plurality of adapter board connectors; and a mounting base being provided with a mounting groove for fixing the adapter board assembly, the mounting base being provided with at least one first fixing member. The upper surface of the base plate being provided with a plurality of third signal connection portions, the plurality of first signal connection portions of the base plate being provided with a first circuit layout layer of the base plate so as to change the arrangement direction of the plurality of third signal connection portions on the upper surface of the base plate for connecting the plurality of second connectors. A plurality of fourth signal connection portions are provided on the lower surface of the upper board. The arrangement direction of the plurality of fourth signal connection portions on the lower surface of the upper board for connecting the plurality of second connectors is the same as the arrangement direction of the plurality of third signal connection portions. The plurality of fourth signal connection portions are respectively electrically connected to the plurality of second signal connection portions through a second circuit layout layer of the upper board.

[0007] Preferably, the arrangement direction of the plurality of first signal connection portions on the lower surface of the base plate is perpendicular to the arrangement direction of the plurality of third signal connection portions on the upper surface of the base plate.

[0008] Preferably, the first signal connection portion is composed of a plurality of first electrical contacts, the second signal connection portion is composed of a plurality of second electrical contacts, the third signal connection portion is composed of a plurality of third electrical contacts, and the fourth signal connection portion is composed of a plurality of fourth electrical contacts.

[0009] Preferably, the first fixing member is a roller, and the base plate or the mounting seat is provided with at least one supporting column for raising the base plate.

[0010] Preferably, the device further includes a test carrier, which is provided with a test carrier circuit layout layer, and a plurality of lower surface signal connection portions are provided on the lower surface of the test carrier, and the plurality of lower surface signal connection portions are electrically connected to the plurality of adapter board connectors on the upper surface of the upper board. The plurality of lower surface signal connection portions are provided with a plurality of upper surface signal connection portions on the upper surface of the test carrier through the test carrier circuit layout layer of the test carrier, the lower surface signal connection portion is composed of a plurality of fifth electrical contacts, and the upper surface signal connection portion is composed of a plurality of sixth electrical contacts.

[0011] Preferably, the device further includes a test carrier, wherein a plurality of fifth signal connection portions and at least one sixth signal connection portion are provided on the lower surface of the test carrier for connection to the plurality of adapter board connectors, and a plurality of seventh signal connection portions are provided on the upper surface of the test carrier. The sixth signal connection portions change the arrangement direction of the plurality of seventh signal connection portions on the upper surface of the test carrier for connection to a plurality of third connectors through a test carrier circuit layout layer of the test carrier, and the third connector is composed of a plurality of stacked connectors.

[0012] The present invention also discloses a testing device, which includes: a testing kit; and a testing machine, on which are provided a plurality of testing machine signal connectors for connecting the plurality of first signal connecting parts; wherein, when the plurality of first signal connecting parts of the base plate are installed and connected to the plurality of testing machine signal connectors of the testing machine, the plurality of testing signals provided by the plurality of testing machine signal connectors of the testing machine pass through the plurality of first signal connecting parts on the lower surface of the base plate, and then are transmitted out by the plurality of third signal connecting parts and the plurality of second connectors on the upper surface of the base plate.

[0013] Preferably, the second connector is a board-to-board connector, and the adapter board connector is a spring pin connector.

[0014] Preferably, the test machine is provided with a connecting rod fixing device, the connecting rod fixing device is provided with a first control axis device, the first control axis device is provided with a first pressing device and a first connecting rod, the first connecting rod is connected to a first fixed carrier moving on a first track, the first fixed carrier is provided with a first groove and the first groove is provided with a first extension track, the first extension track is provided with an inclination angle, and the first fixed carrier is provided with a first insertion hole for the first groove. When the multiple first signal connection parts of the base plate are installed and connected to the multiple test machine signal connectors of the test machine, the first fixing part is simultaneously inserted into the first groove through the first insertion hole, and then the first pressing device is operated relative to the first control axis device to drive the first fixed carrier to move on the first track via the first connecting rod. Through the movement of the first fixed carrier, the first fixing part is relatively moved in the first extension track for limitation and fixation.

[0015] Preferably, the testing machine is provided with a test carrier connecting rod fixing device, the test carrier connecting rod fixing device is provided with a second control axis device, the second control axis device is provided with a second pressing device and a second connecting rod, the second connecting rod is connected to a second fixed carrier moving on a second track, the second fixed carrier is provided with a second groove and the second groove is provided with a second extension track, the second extension track is provided with an inclination angle, the second fixed carrier is provided with a second insertion hole for the second groove, and the test carrier is provided with a fixing frame plate, the fixing frame plate is provided with two armrests and at least one second fixing member, the second fixing member is a roller, when the test carrier is connected to the multiple adapter plate connectors on the upper surface of the upper plate, the second fixing member is simultaneously inserted into the second groove through the second insertion hole, and then the second pressing device is operated relative to the second control axis device to drive the second fixed carrier to move on the second track via the second connecting rod, and the movement of the second fixed carrier causes the second fixing member to move relatively within the second extension track for limitation and fixation.

[0016] One of the benefits of the present invention is that it reshapes the signals of the adapter board assembly in the test kit, changes the signal transmission path and the installation structure and method, thereby freeing up the test space available on the test carrier to avoid affecting the components on the test carrier. Furthermore, the present invention can significantly increase the test capacity of the test carrier by redesigning the test carrier. The redesigned test carrier and the existing test carrier can be directly used for assembly and testing with the adapter board connector on the adapter board assembly, reducing equipment setup costs and accelerating test output (by multiples) with a single set of test equipment.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a three-dimensional exploded structure of a test device is presented, showing an embodiment of the present invention, in which a test kit is installed in a test machine.

[0019] Figure 2 A schematic diagram of a three-dimensional assembly structure of a test device is presented, showing an embodiment of the present invention, in which a test kit is installed in a test machine to form the test device.

[0020] Figure 3 The structure and perspective diagram of a test kit according to an embodiment of the present invention are presented.

[0021] Figure 4 The present invention presents a perspective view of the structure and upper plate of a test kit according to an embodiment of the present invention.

[0022] Figure 5 A schematic diagram showing an embodiment of the present invention showing that a test kit and a test machine are installed and then a test carrier is installed.

[0023] Figure 6 A schematic diagram illustrating an embodiment of the present invention is provided showing how to install an existing test carrier board after a test kit and a test machine are installed.

[0024] Figure 7 An embodiment of the present invention is presented, showing a redesigned structure and perspective diagram of a conventional test carrier.

[0025] Figure 8 A schematic diagram showing a state in which a test kit is fixed by a fixing member according to an embodiment of the present invention is presented.

[0026] Figure 9 The present invention shows an embodiment of the present invention showing a state in which the fixing member is inserted into the test kit for fixing and limiting the test kit. DETAILED DESCRIPTION

[0027] The following is an explanation of the implementation methods of the "test kit and test equipment" provided by the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content provided in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the content provided is not intended to limit the scope of protection of the present invention.

[0028] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0029] The present invention discloses a test kit and test equipment. The base and upper panels of the test kit can be made of commonly available insulating and flame-resistant circuit substrates, plastic boards, rubber boards, bakelite boards, fiberglass boards, or any other suitable board for circuit layout. Furthermore, a tester within the test equipment can be equipped with software and hardware for providing test signals, or a motherboard for providing test signals. The tester also includes a power socket for connecting to an external power cord, allowing the tester to connect to a power source and operate.

[0030] The tester can be equipped with a movable mechanism, such as pulleys, to allow for easy movement of the entire tester, or with a support structure to support the weight of the tester. Alternatively, the tester can be positioned in a specific location within the factory without a movable mechanism. Typically, the tester has a test table for installing and replacing test kits. Cooling fans or fins can also be installed internally, complemented by cooling holes, to aid in heat dissipation during operation.

[0031] When the test kit is installed on the test machine for testing, the test machine can be installed on a rotatable support rod so that the test machine can rotate based on an axis to change the angle of the test table, thereby facilitating the operator to install, remove and perform maintenance work.

[0032] Please continue to refer to the following description. According to one embodiment of the present invention, please refer to Figures 1 to 4 , Figure 1 A schematic diagram of a three-dimensional exploded structure of a test device is presented, showing an embodiment of the present invention, in which a test kit is installed in a test machine. Figure 2 A schematic diagram of a three-dimensional assembly structure of a test device is presented, showing an embodiment of the present invention, in which a test kit is installed in a test machine to form the test device. Figure 3 The structure and perspective diagram of a test kit according to an embodiment of the present invention are presented. Figure 4 The present invention presents a perspective view of the structure and upper plate of a test kit according to an embodiment of the present invention.

[0033] The present invention provides a test kit applicable to semiconductor test equipment. The test equipment includes a test kit 1 and a test machine 2. The test kit 1 includes but is not limited to: an adapter board assembly 11 and a mounting seat 12.

[0034] The adapter board assembly 11 comprises a bottom plate 111 and a top plate 112, the two plates being arranged in parallel. The bottom surface of the bottom plate 111 is provided with a plurality of first signal connection portions 113 and a first connector 114 for connecting to at least one relay control switch board 115. The top plate 112 is connected to the bottom plate 111 via a plurality of second connectors 116. The top surface of the top plate 112 is provided with a plurality of second signal connection portions 117A for connecting to a plurality of adapter board connectors 117.

[0035] In one embodiment, multiple first connectors 114 may be provided, each corresponding to a corresponding relay control switch board 115. The first connectors 114 are electrically connected to the plurality of first signal connection portions 113 of the portion through the circuit layout of the baseboard 111. The relay control switch board 115 functions to control the timely opening and closing of the plurality of relay switches therein, thereby changing or expanding the number of input and output pins of the tester. Specifically, by controlling the power on and off of each relay, the tester's test signals pass through the plurality of relays in the relay control switch board 115, changing the signal transmission path from open to open or open, thereby changing or expanding the number of input and output pins that the tester can test. The first connector 114 may be a backplane connector, and the adapter board connector may be a pogo pin connector having a certain height, but the present invention is not limited to the aforementioned configuration.

[0036] The test kit 1 also includes a mounting base 12, which is provided with a mounting slot 121 for securing the adapter plate assembly 11. In one embodiment, the upper plate 112 can be secured by snapping into the mounting slot 121, or both the bottom plate 111 and the upper plate 112 can be snapped into the mounting slot 121, but the present invention is not limited to this. Furthermore, the mounting base 12 is provided with a plurality of first fixing members 122, which are attached to the sides of the mounting base 12 via a plate body.

[0037] The present invention uses the adapter board assembly 11 and restructures the signals of the multiple boards that transmit signals therein, and the installation method is also adjusted accordingly. It can not only connect to a test machine of a single specification test equipment, but also be suitable for test carriers of different specifications and corresponding DUTs after signal restructuring.

[0038] See Figure 3 、 Figure 4 Therefore, the signal reshaping of the present invention is to dispose a plurality of third signal connection portions 118 on the upper surface of the bottom board 111. The plurality of first signal connection portions 113 of the bottom board 111 change the arrangement direction of the plurality of third signal connection portions 118 on the upper surface of the bottom board 111 for connecting with the plurality of second connectors 116 through a first circuit layout layer of the bottom board 111. Furthermore, a plurality of fourth signal connection portions 112A are disposed on the lower surface of the top board 112. The arrangement direction and number of the plurality of fourth signal connection portions 112A on the lower surface of the top board 112 for connecting with the plurality of second connectors 116 are the same as or different from the arrangement direction and arrangement number of the plurality of third signal connection portions 118. The plurality of fourth signal connection portions 112A are electrically connected to the plurality of second signal connection portions 117A through a second circuit layout layer of the top board 112.

[0039] In one embodiment, the first signal connection portion 113 is composed of multiple first electrical contacts, the second signal connection portion 117A is composed of multiple second electrical contacts, the third signal connection portion 118 is composed of multiple third electrical contacts, and the fourth signal connection portion 112A is composed of multiple fourth electrical contacts, and the above are not limiting.

[0040] In one embodiment, the orientation of the plurality of first signal connections 113 on the lower surface of the base plate 111 and the orientation of the plurality of third signal connections 118 on the upper surface of the base plate 111 are perpendicular to each other, or are not limited to a specific orientation. In other words, by changing the orientation of the plurality of third signal connections 118 via the first circuit layout layer, the present invention can also change the size of the upper plate 112 and the layout of the components on the upper plate 112. Therefore, by changing the size of the upper plate 112 and the layout of the components on the upper plate 112, and installing the adapter board connector 117, the connection space of the test carrier can be reclaimed. The adapter board connector 117 can connect test carriers of different specifications and the corresponding DUTs. At this time, the space available for installing and testing the test carrier can be moved out (in conjunction with the adapter board connector 117), avoiding the limitations of traditional test carriers that are directly installed in a single test machine and space, thereby increasing the space available for installing and testing the test carrier. In addition, the height at which components can be installed on the installed test carrier can be increased to prevent interference with the components during installation and testing of the test carrier (because components are usually also installed on the lower surface of the test carrier, which can reduce or avoid interference with the components).

[0041] In one embodiment, given that the present invention increases the available space for installing and testing a test carrier while avoiding impacting components on the test carrier, the present invention can also be used to redesign the test carrier, thereby increasing the number of test sites and the number of DUTs that can be installed relative to the test carrier. For example, four test sites (4 sites) can be increased to eight test sites (8 sites) or more. This frees the test carrier from the limitation of direct installation in a tester, allowing for not only redesign of the test carrier but also changes in the number of DUTs that can be installed relative to the test carrier.

[0042] In one embodiment, the adapter plate assembly 11 is fixed to the mounting slot 121 by interlocking or other fixing means such as locking, riveting, etc., and the present invention is not limited thereto.

[0043] Please continue reading Figures 5 to 9 , and can be used in conjunction with Figures 1 to 4 , Figure 5 A schematic diagram showing an embodiment of the present invention showing that a test kit and a test machine are installed and then a test carrier is installed. Figure 6 A schematic diagram illustrating an embodiment of the present invention is provided showing how to install an existing test carrier board after a test kit and a test machine are installed. Figure 7 An embodiment of the present invention is presented, showing a redesigned structure and perspective diagram of a conventional test carrier. Figure 8 A schematic diagram showing a state in which a test kit is fixed by a fixing member according to an embodiment of the present invention is presented. Figure 9 The present invention shows an embodiment of the present invention showing a state diagram of the fixing member being inserted into the test kit for fixing and limiting when the fixing member is used to fix the test kit. Figure 8 、 9 yes Figure 2 Magnified view of region IX.

[0044] When a test board 3 or 4 of a specific specification is installed to perform a test through the test kit 1 of the present invention, the test can be performed through a redesigned or existing test board 3 or 4. In one embodiment, see Figure 5 The test carrier 3 is provided with a test carrier circuit layout layer. A plurality of lower surface signal connection portions 31 are provided on the lower surface of the test carrier 3. The plurality of lower surface signal connection portions 31 are connected to a plurality of upper surface signal connection portions 32 on the upper surface of the test carrier 3 through the test carrier circuit layout layer of the test carrier 3. The lower surface signal connection portions 31 are composed of a plurality of fifth electrical contacts, and the upper surface signal connection portions 32 are composed of a plurality of sixth electrical contacts.

[0045] In one embodiment, see Figure 1 and Figure 5When conducting a test, a test machine 2 is prepared and the test kit 1 and test carrier 3 are installed. The test machine 2 is provided with multiple test machine signal connectors 21 for connecting to the multiple first signal connection portions 113 of the bottom board 111 of the test kit 1. When the multiple first signal connection portions 113 of the bottom board 111 of the test kit 1 are installed and connected to the multiple test machine signal connectors 21 of the test machine 2, the multiple lower surface signal connection portions 31 of the test carrier 3 are installed (electrically connected) to the multiple adapter board connectors 117 on the upper surface of the upper board 112 of the test kit 1. After installation, subsequent testing can be carried out.

[0046] In one embodiment, the test signals provided by the multiple tester signal connectors 21 of the tester 2 are transmitted through the multiple first signal connection portions 113 on the lower surface of the base plate 111 and then transmitted through the multiple third signal connection portions 118 and the multiple second connectors 116 on the upper surface of the base plate 111. The signal reorganization and redesign of the adapter board assembly 11 or the assembly and testing of the existing test carriers 3 and 4 not only expands the available testing space of the test carriers 3 and 4 and allows the installation and testing of the test carriers 3 and 4 without affecting the components thereon, but also allows for rapid switching to support testing of different specifications of DUTs, thereby allowing the installation of different specifications of test carriers 3 and 4. For example, within a set of test equipment, the test carrier 2 and the test kit 1 can be switched from the test carrier 3 to the test carrier 4 to install and test carriers of different specifications.

[0047] In one embodiment, in addition to the redesigned test carriers 3 and 4, existing carriers can also be used, for example, a carrier with the specification of S100-7D-BY8-2MM-Raising-diag-LB, so as to be connected to the adapter board connector 117 in the form of a Pogo pin, but the present invention is not limited to the foregoing.

[0048] Since the present invention changes and reorganizes the test signal transmission path and the installation method of the test kit 1 relative to the test machine 2 through the adapter board assembly 11 in the test kit 1, the adapter board connector 117 on the test kit 1 can be directly adapted to connect to the test carrier boards 3 and 4 designed with different specifications or the existing test carrier boards 3 and 4 with the S100-7D-V50-ITF-BD specifications, for example Figure 6 As shown, the existing test carrier boards 3 and 4 of the S100-7D-V50-ITF-BD specification can also be designed.

[0049] In one embodiment, see Figure 6 、 Figure 7The lower surface of the test carrier 4 of the S100-7D-V50-ITF-BD specification is provided with multiple fifth signal connection parts 41 for connecting to multiple adapter board connectors 117 and two sixth signal connection parts 42. The upper surface of the test carrier 4 is provided with multiple seventh signal connection parts 43. The two sixth signal connection parts 42 change the arrangement direction of some of the multiple seventh signal connection parts 43 on the upper surface of the test carrier 4 for connecting to multiple third connectors 5 through a test carrier circuit layout layer of the test carrier 4. The change in the arrangement direction is that the arrangement directions of some of the seventh signal connection parts 43 and the sixth signal connection parts 42 are perpendicular to each other or are not limited, and the third connector 5 is composed of multiple stacked connectors.

[0050] In one embodiment, the third connector 5 may be a board-to-board connector when it is a plurality of stacked connectors. The board-to-board connector may be a three-row jack with 64 pins and mounted on the test carrier 4 with a locking fixing means. Each third connector 5 is used to mount a circuit board to be tested (not shown). The present invention is not limited to the foregoing.

[0051] Therefore, the present invention reorients some of the seventh signal connectors 43 on the test carrier 4 to reorganize the signals, and further elevates the device by stacking connectors. This allows the present invention to utilize available test space on the test carrier 4 when installing an object under test (e.g., a circuit board) on an existing S100-7D-V50-ITF-BD test carrier 4, thereby preventing the test carrier 4 from interfering with previously installed components. Therefore, by reorganizing the signal path and installation method of the adapter board assembly 11, the present invention allows any specifications of designed or existing test carrier boards 3 and 4 to be easily installed on the test machine 2 through the test kit 1 to quickly switch the installation of each test carrier board 3 and 4. For example, when each adapter board connector 117 is a Pogo pin connector, a carrier board with an S100-7D-BY8-2MM-Raising-diag-LB specification or a carrier board with an S100-7D-V50-ITF-BD specification can be quickly replaced for testing, thereby quickly switching and supporting the installation of test carrier boards 3 and 4 of different specifications.

[0052] Furthermore, by freeing up the available test space on test carriers 3 and 4, the test capacity of test carriers 3 and 4 can be modified through design. Furthermore, given the high cost of semiconductor test equipment, the test equipment in tester 2 can be effectively reduced to just one set. Furthermore, test carriers 3 and 4 of different specifications can be quickly replaced within the same test facility or test area, thereby accelerating or multiplying test throughput.

[0053] In one embodiment, see Figure 3 、 56. When the test kit 1 is installed on the test machine 2 for signal transfer, the second connector 116 can be configured as a board-to-board connector to increase the overall installation height of the bottom plate 111 and the upper plate 112. Furthermore, multiple support columns 13 can be provided on the bottom plate 111 or the mounting base 12 to provide a cushioned height, thereby further raising the height of the test kit 1 during installation. This allows the subsequent installation of the test carrier boards 3 and 4 to further increase the available testing space without being affected by the test machine 2.

[0054] In one embodiment, a symmetrical armrest 123 may be provided on the mounting base 12 of the test kit 1, which allows the tester to quickly align and install and easily disassemble the test kit 1 through the armrest when installing or disassembling the test kit 1 relative to the test machine 2. This can avoid the problem of the base plate 111 of the test kit 1 and the electrical contacts of the test machine 2 not being easily aligned and connected, and not being able to reliably connect, and can also provide the tester with easy removal of the test kit 1.

[0055] In one embodiment, see Figure 1 、 3 , 8, 9. When installing the test kit 1 and the test carriers 3 and 4, the present invention generally requires that the multiple first signal connection portions 113 of the bottom plate 111 of the adapter board assembly 11 of the test kit 1 be electrically connected to the multiple test machine signal connectors 21 of the test machine 2. Similarly, the signal connection portions of the test carriers 3 and 4 and the adapter board connectors 117 on the upper plate 112 of the adapter board assembly 11 are also electrically connected via the spring force of the spring pin connector spring. However, during testing, the present invention can also effectively secure the test kit 1 and the test carriers 3 and 4 relative to the test machine 2, thereby avoiding signal transmission problems during testing.

[0056] Therefore, in one embodiment, the mounting base 12 of the test kit 1 is provided with one or more first fixing members 122, which can be arranged around the mounting base 12 and are rollers. The test table of the test machine 2 includes one or more connecting rod fixing devices 6, each of which is provided with a first control axis device 61. The first control axis device 61 is provided with a first pressing device 610 and a first connecting rod 611. The first connecting rod 611 is connected to a first fixing carrier 612 that moves on a first track 7. The first fixing carrier 612 is provided with a first groove 613, and the first groove 613 is provided with a first extension track 614. The first extension track 614 is provided with an inclination angle. The first fixing carrier 612 is provided with a first insertion hole 615 for the first groove 613.

[0057] When the multiple first signal connection parts 113 of the base plate 111 are installed and connected to the multiple test machine signal connectors 21 of the test machine 2, the first fixing member 122 is simultaneously inserted into the first groove 613 through the first insertion hole 615 (at this time, the mounting seat 12 can be placed next to the connecting rod fixing device 6), and then the first pressing device 610 is operated relative to the first control axis device 61 to drive the first fixing carrier 612 to move on the first track 7 through the first connecting rod 611. Through the movement of the first fixing carrier 612, the first fixing member 122, when it is a roller, moves relatively in the first extension track 614 for limitation and fixation.

[0058] In one embodiment, when there are multiple sets of connecting rod fixing devices 6, multiple sets of first fixing carriers 612 and their corresponding first grooves 613, first insertion holes 615, first tracks 7, and first extension tracks 614 can be provided, and the multiple sets of first fixing carriers 612 can be controlled and linked to each other. That is, one end of a first control axis device 61 controls the movement of the first fixing carrier 612 via the first connecting rod 611 to limit and fix the test kit 1. The other end of the same first control axis device 61 is connected via an intermediate connecting rod, and the intermediate connecting rod is further connected to another first fixing carrier 612 via another first control axis device 61. The intermediate connecting rod is arranged relative to another track. In this way, when each fixing carrier is driven to move on the track, each first fixing member, if it is a roller, moves relatively within the extension track of each fixing carrier to limit and fix it, thereby strengthening the installation of the fixed test kit 1.

[0059] In addition, the test carriers 3 and 4 can also be more firmly fixed relative to the test machine 2, wherein the test machine 2 is provided with one or more test carrier connecting rod fixing devices 8, which have the same or similar structure and operation principle as the aforementioned connecting rod fixing device 6. The test carrier connecting rod fixing device 8 is provided with a second control axis device 81, and the second control axis device 81 is provided with a second pressing device 811 and a second connecting rod 812. The second connecting rod 812 is connected to a second fixed carrier 813 that moves on a second track 9. The second fixed carrier 813 is provided with a second groove 814 and the second groove 814 is provided with a second extension track 815. The second extension track 815 has an inclination angle, and the second fixed carrier 813 is provided with a second insertion hole 816 of the second groove 814. And then in conjunction with Figure 7 The test carriers 3 and 4 may be provided with a fixed frame 100 , and the fixed frame 100 is provided with two armrests 200 and a plurality of second fixing members 300 , and the second fixing members 300 are rollers.

[0060] When the test carriers 3 and 4 are connected to the multiple adapter board connectors 117 on the upper surface of the upper plate 112, the second fixing member 300 is simultaneously inserted into the second groove 814 through the second insertion hole 816. The second pressing device 811 is then operated relative to the second control shaft device 81, causing the second fixing carrier 813 to move along the second track 9 via the second connecting rod 812. The movement of the second fixing carrier 813 causes the second fixing member 300, which is a roller, to move relative to the second extension track 815 for positioning and fixation. Therefore, the test carriers 3 and 4 can be effectively fixed like the test kit 1, and the operation of the tester is facilitated during testing.

[0061] In one embodiment, the aforementioned electrical contacts can be electrical contacts of gold fingers, electroplated electrical contacts, electrical contacts with solder, printed electrical contacts, or electrical contacts produced by any circuit board (PCB) process, etc., and the present invention is not limited to the aforementioned.

[0062] [Beneficial effects of the embodiment]:

[0063] One of the beneficial effects of the present invention is that the adapter board assembly in the test kit undergoes signal reorganization, changing the signal transmission path and the installation structure and method, thereby freeing up the test space available on the test carrier to avoid affecting the components on the test carrier. Furthermore, the present invention can significantly increase the test capacity of the test carrier by redesigning the test carrier. The redesigned test carrier and the existing test carrier can be directly adapted for assembly and testing with the adapter board connector on the adapter board assembly, thereby reducing (factory) equipment setup costs and accelerating test output (by multiples) with a single set of test equipment.

[0064] The above contents are only preferred feasible embodiments of the present invention and are not intended to limit the claims of the present invention. Therefore, any equivalent technical changes made using the contents of the present invention description and drawings are included in the claims of the present invention.

Claims

1. A test kit, characterized in that: include: an adapter board assembly comprising a bottom plate and an upper plate, wherein a plurality of first signal connection portions and a first connector for connecting at least one relay control switch board are provided on a lower surface of the bottom plate, the upper plate is connected to the bottom plate via a plurality of second connectors, and a plurality of second signal connection portions for connecting to a plurality of adapter board connectors are provided on an upper surface of the upper plate; and a mounting base, the mounting base being provided with a mounting groove for fixing the adapter plate assembly, and the mounting base being provided with at least a first fixing member; The upper surface of the base plate is provided with a plurality of third signal connection portions, and the plurality of first signal connection portions of the base plate are arranged in a direction of the plurality of third signal connection portions on the upper surface of the base plate for connecting the plurality of second connectors through a first circuit layout layer of the base plate; A plurality of fourth signal connection portions are provided on the lower surface of the upper board. The arrangement direction of the plurality of fourth signal connection portions on the lower surface of the upper board for connecting the plurality of second connectors is the same as the arrangement direction of the plurality of third signal connection portions. The plurality of fourth signal connection portions are respectively electrically connected to the plurality of second signal connection portions through a second circuit layout layer of the upper board.

2. The test kit according to claim 1, wherein: The arrangement direction of the plurality of first signal connection portions on the lower surface of the base plate is perpendicular to the arrangement direction of the plurality of third signal connection portions on the upper surface of the base plate.

3. The test kit according to claim 1, wherein: The first signal connection portion is composed of a plurality of first electrical contacts, the second signal connection portion is composed of a plurality of second electrical contacts, the third signal connection portion is composed of a plurality of third electrical contacts, and the fourth signal connection portion is composed of a plurality of fourth electrical contacts.

4. The test kit according to claim 1, wherein: The first fixing member is a roller, and at least one supporting column is provided on the bottom plate or the mounting seat for raising the base.

5. The test kit according to claim 1, wherein: The present invention further includes a test carrier, which is provided with a test carrier circuit layout layer. A plurality of lower surface signal connection portions are provided on the lower surface of the test carrier, and the plurality of lower surface signal connection portions are electrically connected to the plurality of adapter board connectors on the upper surface of the upper board. The plurality of lower surface signal connection portions are provided with a plurality of upper surface signal connection portions on the upper surface of the test carrier through the test carrier circuit layout layer of the test carrier, the lower surface signal connection portion is composed of a plurality of fifth electrical contacts, and the upper surface signal connection portion is composed of a plurality of sixth electrical contacts.

6. The test kit according to claim 1, wherein: The present invention further includes a test carrier, wherein a plurality of fifth signal connection portions and at least one sixth signal connection portion are provided on the lower surface of the test carrier for connection to the plurality of adapter board connectors, and a plurality of seventh signal connection portions are provided on the upper surface of the test carrier. The sixth signal connection portions change the arrangement direction of a portion of the plurality of seventh signal connection portions on the upper surface of the test carrier for connection to a plurality of third connectors via a test carrier circuit layout layer of the test carrier, wherein the third connector is composed of a plurality of stacked connectors.

7. A testing device, characterized in that: include: A test kit according to any one of claims 5 to 6; as well as a test machine, the test machine being provided with a plurality of test machine signal connectors for connecting the plurality of first signal connection parts; Among them, when the multiple first signal connection parts of the base plate are installed and connected to the multiple test machine signal connectors of the test machine, the multiple test signals provided by the multiple test machine signal connectors of the test machine pass through the multiple first signal connection parts on the lower surface of the base plate, and then are transmitted out by the multiple third signal connection parts and the multiple second connectors on the upper surface of the base plate.

8. The testing device according to claim 7, wherein: The second connector is a board-to-board connector, and the adapter board connector is a spring pin connector.

9. The testing device according to claim 7, wherein: The testing machine is provided with a connecting rod fixing device, the connecting rod fixing device is provided with a first control axis device, the first control axis device is provided with a first pressing device and a first connecting rod, the first connecting rod is connected to a first fixed carrier moving on a first track, the first fixed carrier is provided with a first groove and the first groove is provided with a first extension track, the first extension track is provided with an inclination angle, and the first fixed carrier is provided with a first insertion hole for the first groove. When the multiple first signal connection parts of the base plate are installed and connected to the multiple test machine signal connectors of the testing machine, the first fixing part is simultaneously inserted into the first groove through the first insertion hole, and then the first pressing device is operated relative to the first control axis device to drive the first fixed carrier to move on the first track via the first connecting rod. Through the movement of the first fixed carrier, the first fixing part is relatively moved in the first extension track for limitation and fixation.

10. The testing device according to claim 9, wherein The testing machine is provided with a test carrier connecting rod fixing device, which is provided with a second control axis device, the second control axis device is provided with a second pressing device and a second connecting rod, the second connecting rod is connected to a second fixed carrier moving on a second track, the second fixed carrier is provided with a second groove, and the second groove is provided with a second extension track, the second extension track is provided with an inclination angle, the second fixed carrier is provided with a second insertion hole for the second groove, and the test carrier is provided with a fixing frame plate, the fixing frame plate is provided with two handrails and at least one second fixing member, the second fixing member is a roller, when the test carrier is connected to the multiple adapter plate connectors on the upper surface of the upper plate, the second fixing member is simultaneously inserted into the second groove through the second insertion hole, and then the second pressing device is operated relative to the second control axis device to drive the second fixed carrier to move on the second track via the second connecting rod. The movement of the second fixed carrier causes the second fixing member to move relatively within the second extension track for limitation and fixation.

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