Dispensing apparatus for semiconductor packaging and method of use

Abstract

The application relates to the field of semiconductor dispensing. The application discloses a dispensing device for semiconductor packaging and a use method. The application aims to solve the problem that, when dispensing the semiconductor, the dispensing device cannot control the discharging amount of the semiconductor, which influences the subsequent component packaging of the semiconductor, and the glue accumulated on the surface of the semiconductor after dispensing is prone to wire drawing, which influences the subsequent packaging work of the semiconductor components. The dispensing device can control the discharging amount of the glue by continuously contacting the semiconductor through the dispensing head according to the required glue amount of the semiconductor, the dispensing device is convenient for controlling the discharging amount of the glue and effectively scraping the glue on the outer wall of the dispensing head into the outer shell, so that the wire drawing of the glue in the dispensing process is effectively avoided, and the dispensing work of the semiconductor is effectively performed.

Description

TECHNICAL FIELD

[0001] The application relates to the field of semiconductor dispensing, in particular to a dispensing device for semiconductor packaging and a use method. BACKGROUND

[0002] Due to the controllable conductivity of semiconductors, semiconductor devices are widely used in various fields such as integrated circuits and lighting. When processing semiconductor devices, different semiconductor materials are bonded after being coated with glue on the material surface by a dispensing machine.

[0003] The existing patent (publication number: CN114042601B) discloses a dispensing machine for semiconductors, which comprises a machine body, a conveyor is installed on the top surface of the machine body, a support is fixedly connected to the top of the machine body, a dispenser is installed on one side of the support, a support sleeve is fixedly connected to the bottom surface of the dispenser, a dispensing column is slidably connected inside the support sleeve, a plurality of dispensing tubes are arranged inside the dispensing column, and the bottom surfaces of the plurality of dispensing tubes are communicated with dispensing nozzles. In the present application, the glue is moved to the dispensing nozzle through the dispensing tube by air pressure, the dispensing nozzle is moved out of the support sleeve to realize dispensing, and after the dispensing is completed, the dispensing column is driven by the reset mechanism to return to the initial position with the dispensing tube and the dispensing nozzle. At this time, the transmission mechanism drives the opening and closing mechanism to close to protect the dispensing nozzle in the support sleeve, which protects the dispensing nozzle and is also conducive to reducing the direct contact of the dispensing nozzle with the surface of the device and reducing the occurrence of glue stringing phenomenon. In the process of realizing the present application, the inventors found that the following problems in the prior art have not been solved: when dispensing the semiconductor, the dispenser cannot control the discharge amount of the semiconductor, which affects the subsequent packaging of semiconductor components, and the glue accumulated on the surface of the semiconductor after dispensing is prone to stringing and affects the subsequent packaging of semiconductor components. SUMMARY

[0004] The present application aims to provide a dispensing device for semiconductor packaging and a use method to solve the problems raised in the background art. To achieve the above-mentioned purpose, the present application provides the following technical solution: a dispensing device for semiconductor packaging, comprising a horizontally arranged machine body, a slide for conveying semiconductors is arranged on the top of the machine body, and a lead screw slide is also arranged on the top of the machine body, a dispensing equipment is arranged on the slide of the lead screw slide, and the dispensing equipment is located above the slide.

[0005] Preferably, the dispensing equipment comprises an electric slide arranged on the lead screw slide, a support seat is arranged on the slide of the electric slide, a detachable dispenser is arranged on the support seat, and the dispenser is located above the slide, a material box is fixedly connected to the support seat, and a connecting pipe in communication with the dispenser is arranged between the material box and the dispenser.

[0006] Preferably, the point glue device comprises a shell body which is detachably arranged on a support base, a rotary motor is fixedly connected to an outer wall of the support base, a screw conveying rod is drivingly connected to a main shaft of the rotary motor, the screw conveying rod is rotationally matched with the shell body, a screw sleeve is fixedly arranged on an inner top of the shell body, the screw conveying rod is located in the screw sleeve, and one end of the connecting pipe is in communication with the screw sleeve.

[0007] Preferably, a bottom of the screw sleeve is in an open shape, a fixed clamping rod is connected to an inner wall of the shell body, a circular table is fixedly arranged on the fixed clamping rod, an upper end surface of the circular table is smaller than a lower end surface of the circular table, an arc surface below the circular table gradually decreases, and a blanking flow channel is formed between the bottom of the circular table and the inner wall of the shell body.

[0008] Preferably, a bottom of the circular table is fixedly connected with a point glue part, the point glue part comprises a fixed sleeve which is fixedly arranged on the bottom of the circular table, a point glue rod is slidingly arranged on the bottom of the fixed sleeve, one of end surfaces of the point glue rod is provided with a point glue head which extends outwardly to the shell body, a return spring is sleeved on an outer wall of the point glue rod, the return spring is located in the fixed sleeve and two ends of the return spring are respectively connected with the fixed sleeve and the point glue rod.

[0009] Preferably, the other end of the point glue rod is fixedly provided with a clamping rod, oppositely arranged clamping columns are arranged in the fixed sleeve, grooves are arranged on opposite surfaces of the two clamping columns, the grooves between the two groups of clamping columns form a spiral groove, and the clamping rod is slidingly matched with the spiral groove.

[0010] Preferably, a bottom of the shell body is fixedly connected with an annular clamping plate, three groups of opening and closing parts are arranged on an inner wall of the annular clamping plate around a center of the annular clamping plate, the three groups of opening and closing parts each comprise a hinged arc-shaped plate which is hingedly matched with the inner wall of the annular clamping plate, a pressure spring is connected between the hinged arc-shaped plate and the annular clamping plate, and the hinged arc-shaped plates on the three groups of opening and closing parts are tightly attached to an outer wall of the point glue head.

[0011] Preferably, the use method of the point glue device for semiconductor packaging comprises the following steps:

[0012] S1: a slide conveying the semiconductor device to the lower part of the point glue equipment, the screw rod slide table adjusts the position of the point glue equipment to correspond to the point glue part of the semiconductor, then the point glue device is driven by the electric slide table to move to the position of the semiconductor, so that the point glue device is in contact with the surface of the semiconductor, and the point glue work of the semiconductor device is completed;

[0013] S2: The glue tank located beside the glue dispenser continuously delivers glue into the spiral sleeve through the connecting pipe, providing continuous glue supply during the glue dispensing process of the glue dispenser, and the rotation motor drives the spiral conveying rod to further deliver the glue in the spiral sleeve to the position of the glue dispensing part, improving the glue delivery speed to avoid the glue dispensing part from affecting the glue dispensing work of the semiconductor due to glue breakage during the glue dispensing process of the semiconductor;

[0014] S3: When the glue is delivered downward from the spiral sleeve, the glue contacts the outer wall of the circular table, and the glue flows through the discharge flow channel to the bottom of the outer shell, so that a part of the glue is stored at the bottom of the outer shell, thereby ensuring sufficient glue for bonding the elements when the glue dispensing part dispenses glue to the semiconductor;

[0015] S4: When the electric sliding table drives the glue dispensing device to move towards the position of the semiconductor, the glue dispensing head on the glue dispensing part contacts the surface of the semiconductor device, the glue dispensing head is pressed to move the glue dispensing rod into the outer shell, and when the spherical glue dispensing head is lifted upward, the diameter of the glue dispensing head will contact the three sets of annular clamping plates, causing the three sets of annular clamping plates to expand outward and form a gap, so that the glue in the outer shell slides through the surface of the glue dispensing head and falls onto the surface of the semiconductor to realize the glue dispensing work on the semiconductor, and when the glue dispensing head moves upward, the glue dispensing rod will press the reset spring, thereby avoiding the surface of the semiconductor from contacting the ports of the three sets of annular clamping plates, affecting the discharge of the glue, and the glue dispensing head can control the amount of glue discharged by continuously contacting the semiconductor according to the amount of glue required by the semiconductor, facilitating the control of the amount of glue discharged.

[0016] S5: After the glue dispensing head finishes dispensing glue to the semiconductor device, the electric sliding table drives the glue dispensing device to move upward, the reset spring resets the glue dispensing rod, and when the glue dispensing rod is reset, the clamping rod on the glue dispensing rod contacts the spiral groove on the two clamping columns, thereby causing the glue dispensing rod to deflect when it is reset, the glue dispensing rod deflects to drive the glue dispensing head at the bottom to rotate, and when the glue dispensing head rotates, it rotates the glue on the surface of the semiconductor to the surface of the semiconductor, spreading the accumulated glue outward, which can spread the area of contact between the glue and the semiconductor, thereby facilitating the packaging of subsequent electronic elements and the semiconductor, and when the glue dispensing head is reset, the three sets of hinged arc-shaped plates contact the outer wall of the glue dispensing head, and the three sets of hinged arc-shaped plates can effectively scrape the glue on the outer wall of the glue dispensing head into the outer shell, thereby effectively avoiding the occurrence of glue stringing during the glue dispensing process and effectively dispensing glue to the semiconductor.

[0017] Compared with the prior art, the beneficial effects of the present application are:

[0018] In the application, the glue tank beside the glue dispenser continuously supplies glue into the spiral sleeve through the connecting pipe, providing continuous supply during the glue dispensing process, and the spiral conveying rod driven by the rotating motor can further transport the glue in the spiral sleeve to the position of the glue dispensing part, improving the glue conveying speed to avoid the glue dispensing part affecting the semiconductor dispensing process due to material breakage.

[0019] In the application, when the glue is transported downward from the spiral sleeve, the glue contacts the outer wall of the circular table, and the glue flows through the discharge flow channel to the bottom of the outer shell, so that a part of the glue is stored at the bottom of the outer shell, thereby ensuring sufficient glue for bonding elements when the glue dispensing part dispenses glue to the semiconductor.

[0020] In the application, when the electric sliding table moves the glue dispensing equipment towards the position of the semiconductor, the glue head on the glue dispensing part contacts the surface of the semiconductor device, the glue head is pressed to move the glue dispensing rod into the outer shell, and when the spherical glue head is lifted upward, the diameter of the glue head contacts the three sets of annular clamping plates, causing the three sets of annular clamping plates to expand outward and form a gap, allowing the glue in the outer shell to slide through the surface of the glue head and fall onto the surface of the semiconductor to achieve glue dispensing to the semiconductor, and when the glue head moves upward with the glue dispensing rod, the reset spring is pressed to avoid the surface of the semiconductor contacting the ports of the three sets of annular clamping plates, affecting the discharge of the glue. This setting can control the amount of glue discharged by continuously contacting the semiconductor with the glue head according to the amount of glue required by the semiconductor, facilitating control of the amount of glue discharged.

[0021] In the application, after the glue head dispenses glue to the semiconductor device, the electric sliding table moves the glue dispensing equipment upward, the reset spring resets the glue dispensing rod, and when the glue dispensing rod is reset, the clamping rod on the glue dispensing rod contacts the spiral groove on the two clamping columns, causing the glue dispensing rod to deflect while resetting, the glue dispensing rod deflects to rotate the glue head at the bottom, and when the glue head rotates, it rotates the glue on the surface of the semiconductor to the surface of the semiconductor, spreading the accumulated glue outward. This way can spread the area of contact between the glue and the semiconductor, facilitating subsequent packaging of electronic components and semiconductors, and when the glue head is reset, the three sets of hinged arc-shaped plates contact the outer wall of the glue head, cooperating with the rotation of the glue head to effectively scrape the glue on the outer wall of the glue head into the outer shell, thereby effectively avoiding the occurrence of glue stringing during the glue dispensing process and effectively dispensing glue to the semiconductor. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The figure is a schematic diagram of the three-dimensional structure of the application;

[0023] Figure 2The schematic perspective view of the dispensing device of the present application Figure One ;

[0024] Figure 3 The partial perspective view of the dispenser of the present application Figure One ;

[0025] Figure 4 The partial perspective view of the dispenser of the present application Figure Two ;

[0026] Figure 5 The partial perspective view of the dispenser of the present application Figure Three ;

[0027] Figure 6 The partial perspective view of the dispenser of the present application Figure Four ;

[0028] Figure 7 The schematic perspective view of the dispensing device of the present application Figure Two .

[0029] In the figure: 1, the machine body; 11, the slide; 12, the screw slide; 2, the dispensing device; 21, the electric slide; 22, the support seat; 23, the material box; 24, the connecting pipe; 3, the dispenser; 31, the outer shell; 32, the rotary motor; 33, the spiral conveying rod; 34, the spiral sleeve; 4, the fixed clamping rod; 41, the circular table; 42, the discharging flow channel; 5, the dispensing part; 51, the fixed sleeve; 52, the dispensing rod; 53, the dispensing head; 54, the reset spring; 6, the clamping rod; 61, the clamping column; 62, the spiral groove; 7, the annular clamping plate; 71, the opening and closing part; 711, the hinged arc-shaped plate; 712, the pressure spring. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0031] Please refer to Figures 1 to 7 , the present application provides a technical solution: a dispensing device for semiconductor packaging, comprising a horizontally arranged machine body 1, the top of the machine body 1 is provided with a slide 11 for conveying semiconductors, and the top of the machine body 1 is also provided with a screw slide 12, and the slide of the screw slide 12 is provided with a dispensing device 2, and the dispensing device 2 is located above the slide 11.

[0032] In the embodiment, as Figure 1 and Figure 2As shown, the glue dispensing device 2 comprises a motorized sliding table 21 arranged on the screw sliding table 12, a supporting seat 22 is arranged on the sliding table of the motorized sliding table 21, a glue dispenser 3 is detachably arranged on the supporting seat 22, and the glue dispenser 3 is located above the sliding channel 11. A glue tank 23 is fixedly connected to the supporting seat 22, and a connecting pipe 24 is arranged between the glue tank 23 and the glue dispenser 3.

[0033] The sliding channel 11 for conveying semiconductor devices conveys the semiconductor devices to the lower side of the glue dispensing device 2. The screw sliding table 12 adjusts the position of the glue dispensing device 2 to correspond to the glue dispensing position of the semiconductor devices. Then, the motorized sliding table 21 drives the glue dispenser 3 to move to the position of the semiconductor devices, so that the glue dispenser 3 contacts the surface of the semiconductor devices, and the glue dispensing work on the semiconductor devices is completed.

[0034] In this embodiment, as shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 , the glue dispenser 3 comprises a shell 31 detachably arranged on the supporting seat 22. A rotary motor 32 is fixedly connected to the outer wall of the supporting seat 22. A spiral conveying rod 33 is drivingly connected to the main shaft of the rotary motor 32. The spiral conveying rod 33 is rotationally matched with the shell 31. A spiral sleeve 34 is fixedly arranged at the inner top of the shell 31. The spiral conveying rod 33 is located in the spiral sleeve 34. One end of the connecting pipe 24 is in communication with the spiral sleeve 34.

[0035] The glue tank 23 located beside the glue dispenser 3 continuously conveys glue into the spiral sleeve 34 through the connecting pipe 24, thereby providing continuous glue supply during the glue dispensing process of the glue dispenser 3. The rotary motor 32 drivingly drives the spiral conveying rod 33 to further convey the glue in the spiral sleeve 34 to the position of the glue dispensing member 5, thereby improving the conveying flow rate of the glue and avoiding the interruption of the glue supply to the glue dispensing member 5 during the glue dispensing process of the semiconductor devices, which affects the glue dispensing work of the semiconductor devices.

[0036] In this embodiment, as shown in Figure 1 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , the bottom of the spiral sleeve 34 is in an open shape. A fixed clamping rod 4 is connected to the inner wall of the shell 31. A circular table 41 is fixedly arranged on the fixed clamping rod 4. The upper end surface of the circular table 41 is smaller than the lower end surface of the circular table 41. The shell 31 is located below the circular table 41, and the arc surface gradually decreases. A glue discharging flow channel 42 is formed between the bottom of the circular table 41 and the inner wall of the shell 31.

[0037] When the glue is transported downward by the screw sleeve 34, the glue is in contact with the outer wall of the circular table 41, and the glue flows to the bottom of the outer shell 31 through the discharge flow channel 42, so that a part of the glue is stored at the bottom of the outer shell 31, and then when the glue dispensing part 5 dispenses the glue to the semiconductor, sufficient glue can be ensured to bond the elements.

[0038] In this embodiment, as shown in Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 , the bottom of the circular table 41 is fixedly connected with the glue dispensing part 5, the glue dispensing part 5 includes a fixed sleeve 51 fixedly arranged at the bottom of the circular table 41, a glue dispensing rod 52 is slidingly arranged at the bottom of the fixed sleeve 51, one end face of the glue dispensing rod 52 is provided with a glue dispensing head 53, the glue dispensing head 53 extends outward from the shell of the outer shell 31, a return spring 54 is sleeved on the outer wall of the glue dispensing rod 52, and the return spring 54 is located in the fixed sleeve 51 and the two ends of the return spring 54 are connected with the fixed sleeve 51 and the glue dispensing rod 52 respectively.

[0039] When the electric sliding table 21 drives the glue dispensing device 2 to move towards the position of the semiconductor, the glue dispensing head 53 on the glue dispensing part 5 is in contact with the surface of the semiconductor device, the glue dispensing head 53 is pressed to drive the glue dispensing rod 52 to move into the outer shell 31, when the spherical glue dispensing head 53 is lifted upward, the diameter of the glue dispensing head 53 is in contact with the three sets of annular clamping plates 7, so that the three sets of annular clamping plates 7 are expanded outward to form a gap, and the glue in the outer shell 31 slides through the surface of the glue dispensing head 53 to the surface of the semiconductor to realize the glue dispensing operation on the semiconductor, and when the glue dispensing head 53 drives the glue dispensing rod 52 to move upward, the glue dispensing rod 52 drives the return spring 54 to be pressed, thereby avoiding the surface of the semiconductor from being in contact with the ports of the three sets of annular clamping plates 7, and affecting the discharge of the glue. By continuously contacting the semiconductor with the glue dispensing head 53, the discharge amount of the glue can be controlled according to the required amount of glue of the semiconductor, and the discharge amount of the glue is facilitated to be controlled.

[0040] In this embodiment, as shown in Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7 , the other end of the glue dispensing rod 52 is fixedly provided with a clamping rod 6, the fixed sleeve 51 is provided with oppositely arranged clamping columns 61, grooves are formed in the opposite faces of the two clamping columns 61, and the grooves between the two clamping columns 61 form a spiral groove 62, and the clamping rod 6 is slidingly matched with the spiral groove 62.

[0041] The bottom of the outer shell 31 is fixedly connected with an annular clamping plate 7, and the inner wall of the annular clamping plate 7 is provided with three groups of opening and closing pieces 71 around the center of the annular clamping plate 7, and each group of the opening and closing pieces 71 comprises a hinged arc-shaped plate 711 hingedly matched with the inner wall of the annular clamping plate 7, and a compression spring 712 is connected between the hinged arc-shaped plate 711 and the annular clamping plate 7, and the hinged arc-shaped plates 711 on the three groups of opening and closing pieces 71 are tightly attached to the outer wall of the dispensing head 53.

[0042] When the dispensing head 53 finishes dispensing glue on the semiconductor device, the electric sliding table 21 drives the dispensing device 2 to move upwards, and the reset spring 54 is arranged to reset the dispensing rod 52, and when the dispensing rod 52 is reset, the clamping rod 6 on the dispensing rod 52 is in contact with the spiral groove 62 on the two clamping columns 61, and then the dispensing rod 52 is deflected when the dispensing rod 52 is reset, and the dispensing rod 52 is deflected to drive the dispensing head 53 at the bottom to rotate, and when the dispensing head 53 rotates, the glue on the surface of the semiconductor is spread to the surface of the semiconductor in a rotating manner, and the accumulated glue is diffused outward, and in this way, the area of the glue in contact with the semiconductor can be diffused, and the subsequent packaging of the electronic element and the semiconductor is facilitated, and when the dispensing head 53 is reset, the three groups of hinged arc-shaped plates 711 are in contact with the outer wall of the dispensing head 53, and the three groups of hinged arc-shaped plates 711 can effectively scrape the glue on the outer wall of the dispensing head 53 into the outer shell 31, so that the glue drawing phenomenon in the dispensing process is effectively avoided, and the dispensing work of the semiconductor is effectively performed.

[0043] The use method and advantages of the semiconductor packaging dispensing device are as follows:

[0044] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 ,

[0045] S1: The slide 11 conveying the semiconductor conveys the semiconductor device to the lower side of the dispensing device 2, the lead screw sliding table 12 adjusts the position of the dispensing device 2 to correspond to the dispensing position of the semiconductor, and then the dispensing device 3 is driven by the electric sliding table 21 to move to the position of the semiconductor, so that the dispensing device 3 is in contact with the surface of the semiconductor, and the dispensing work of the semiconductor device is completed;

[0046] S2: The glue tank 23 beside the dispenser 3 continuously delivers glue into the spiral sleeve 34 through the connecting pipe 24, providing continuous glue supply during the dispensing process of the dispenser 3, and the rotation motor 32 drives the spiral conveying rod 33 to further deliver the glue in the spiral sleeve 34 to the position of the dispensing part 5, improving the glue delivery speed to avoid the interruption of the dispensing part 5 during the dispensing process of the semiconductor, affecting the dispensing work of the semiconductor;

[0047] S3: When the glue is delivered downward from the spiral sleeve 34, the glue contacts the outer wall of the circular table 41, and the glue flows to the bottom of the outer shell 31 through the discharge flow channel 42, so that a part of the glue is stored at the bottom of the outer shell 31, thereby ensuring sufficient glue for bonding the elements when the dispensing part 5 dispenses the glue for the semiconductor;

[0048] S4: When the electric sliding table 21 drives the dispensing equipment 2 to move towards the position of the semiconductor, the dispensing head 53 on the dispensing part 5 contacts the surface of the semiconductor device, and the dispensing head 53 is pressed to move the dispensing rod 52 into the outer shell 31. When the dispensing head 53 is a spherical body and is lifted upward, the diameter of the dispensing head 53 will contact the three sets of annular clamping plates 7, causing the three sets of annular clamping plates 7 to expand outward and form a gap, allowing the glue in the outer shell 31 to slide through the surface of the dispensing head 53 and fall onto the surface of the semiconductor, thereby achieving the dispensing work on the semiconductor. When the dispensing head 53 moves upward with the dispensing rod 52, the reset spring 54 is pressed, thereby avoiding the contact between the surface of the semiconductor and the ports of the three sets of annular clamping plates 7, affecting the discharge of the glue. This arrangement can control the amount of glue discharged by continuously contacting the semiconductor with the dispensing head 53 according to the required amount of glue for the semiconductor, facilitating the control of the amount of glue discharged.

[0049] S5: After the dispensing head 53 finishes dispensing the semiconductor device, the electric sliding table 21 drives the dispensing equipment 2 to move upward, and the reset spring 54 resets the dispensing rod 52. When the dispensing rod 52 is reset, the clamping rod 6 on the dispensing rod 52 contacts the spiral groove 62 on the two clamping columns 61, and the dispensing rod 52 is deflected while the dispensing rod 52 is reset, thereby rotating the dispensing head 53 at the bottom. When the dispensing head 53 rotates, it will spread the glue on the surface of the semiconductor to the surface of the semiconductor in a rotating manner, thereby facilitating the packaging of the subsequent electronic elements and the semiconductor. When the dispensing head 53 is reset, the three sets of hinged arc-shaped plates 711 contact the outer wall of the dispensing head 53, and the three sets of hinged arc-shaped plates 711 can effectively scrape the glue on the outer wall of the dispensing head 53 into the outer shell 31, thereby effectively avoiding the occurrence of glue drawing during the dispensing process and effectively dispensing the semiconductor.

[0050] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Various changes and improvements can be made to the present application without departing from the spirit and scope of the present application, and such changes and improvements fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A dispensing device for semiconductor packaging, characterized in that: The device includes a horizontally arranged body (1), the top of which is provided with a slide rail (11) for conveying semiconductors, and the top of which is also provided with a lead screw slide (12), and a dispensing device (2) is provided on the slide rail (12), the dispensing device (2) being located above the slide rail (11). The dispensing equipment (2) includes an electric slide (21) mounted on a screw slide (12), a support seat (22) is provided on the slide of the electric slide (21), a dispensing device (3) is provided on the support seat (22), and the dispensing device (3) is located above the slide rail (11). The dispensing device (3) includes a housing (31) that is detachably mounted on a support base (22). A fixing rod (4) is connected to the inner wall of the housing (31). A frustum (41) is fixed on the fixing rod (4). A discharge channel (42) is formed between the bottom of the frustum (41) and the inner wall of the housing (31). The bottom of the truncated cone (41) is fixedly connected to a dispensing component (5). The dispensing component (5) includes a fixed sleeve (51) fixedly disposed at the bottom of the truncated cone (41). A dispensing rod (52) is slidably disposed at the bottom of the fixed sleeve (51). One end face of the dispensing rod (52) is provided with a dispensing head (53). The dispensing head (53) extends outward from the outer shell of the outer shell (31). A return spring (54) is sleeved on the outer wall of the dispensing rod (52). The return spring (54) is located inside the fixed sleeve (51), and both ends of the return spring (54) are connected to the fixed sleeve (51) and the dispensing rod (52) respectively. The other end of the dispensing rod (52) is fixedly provided with a clamping rod (6), and the fixed sleeve (51) is provided with oppositely arranged clamping posts (61). The opposite surfaces of the two clamping posts (61) are provided with slots, and the slots between the two sets of clamping posts (61) form a spiral groove (62). The clamping rod (6) and the spiral groove (62) are slidably engaged. The bottom of the outer shell (31) is fixedly connected to an annular plate (7). The inner wall of the annular plate (7) is provided with three sets of opening and closing parts (71) around the center of the annular plate (7). Each of the three sets of opening and closing parts (71) includes a hinged arc plate (711). The hinged arc plate (711) is hinged to the inner wall of the annular plate (7). A pressure spring (712) is connected between the hinged arc plate (711) and the annular plate (7). The hinged arc plate (711) on the three sets of opening and closing parts (71) is tightly attached to the outer wall of the dispensing head (53).

2. The dispensing device for semiconductor packaging according to claim 1, characterized in that: A material box (23) is fixedly connected to the support base (22), and a connecting pipe (24) is provided between the material box (23) and the dispensing device (3).

3. The dispensing device for semiconductor packaging according to claim 2, characterized in that: A rotary motor (32) is fixedly connected to the outer wall of the support base (22). The main shaft of the rotary motor (32) is connected to a spiral conveying rod (33). The spiral conveying rod (33) is rotatably engaged with the outer shell (31). A spiral sleeve (34) is fixedly provided on the inner top of the outer shell (31). The spiral conveying rod (33) is located inside the spiral sleeve (34). One end of the connecting pipe (24) is connected to the spiral sleeve (34).

4. The dispensing device for semiconductor packaging according to claim 3, characterized in that: The bottom of the spiral sleeve (34) is open, the upper end face of the frustum (41) is smaller than the lower end face of the frustum (41), and the outer shell (31) is located below the frustum (41) with the arc surface gradually decreasing.

5. The method of using the dispensing device for semiconductor packaging according to claim 4, comprising the following steps: S1: The slide (11) for transporting semiconductors transports the semiconductor device to the bottom of the dispensing equipment (2). The screw slide (12) adjusts the position of the dispensing equipment (2) to correspond with the semiconductor dispensing area. Then, the electric slide (21) drives the dispensing device (3) to move towards the semiconductor position, so that the dispensing device (3) contacts the surface of the semiconductor, thus completing the dispensing work on the semiconductor device. S2: The material box (23) located next to the dispensing device (3) continuously conveys the glue into the spiral sleeve (34) through the connecting pipe (24), providing continuous material supply during the dispensing process of the dispensing device (3), and the rotating motor (32) drives the spiral conveying rod (33) to further convey the glue in the spiral sleeve (34) to the dispensing part (5), thereby increasing the glue conveying speed; S3: When the glue is conveyed downward by the spiral sleeve (34), the glue comes into contact with the outer wall of the frustum (41). The glue flows through the discharge channel (42) to the bottom of the housing (31), so that a portion of the glue is stored at the bottom of the housing (31). Thus, when the dispensing component (5) dispenses glue to the semiconductor to make the glue flow out quickly, there can be enough glue to bond the components. S4: When the electric slide (21) drives the dispensing equipment (2) to move toward the semiconductor, the dispensing head (53) on the dispensing part (5) contacts the surface of the semiconductor device. When the dispensing head (53) is pressed, it drives the dispensing rod (52) to move into the outer shell (31). When the dispensing head (53) is spherical and lifted upward, the diameter of the dispensing head (53) will contact the three sets of annular plates (7), causing the three sets of annular plates (7) to expand outward and create gaps so that the glue in the outer shell (31) can slide through the surface of the dispensing head (53) to the surface of the semiconductor to achieve the dispensing operation of the semiconductor. When the dispensing head (53) drives the dispensing rod (52) to move upward, it will cause the dispensing rod (52) to drive the return spring (54) to be pressed, thereby avoiding the semiconductor surface from contacting the port of the three sets of annular plates (7) and affecting the dispensing of glue. S5: After the dispensing head (53) finishes dispensing the semiconductor device, the electric slide (21) will drive the dispensing equipment (2) to move upward. The reset spring (54) will reset the dispensing rod (52). When the dispensing rod (52) is reset, the locking bar (6) on the dispensing rod (52) will contact the spiral groove (62) on the two locking posts (61). As a result, the dispensing rod (52) will deflect at the same time as it is reset. The deflection of the dispensing rod (52) will then drive the dispensing device to move upward. The bottom dispensing head (53) rotates, and when the dispensing head (53) rotates, it will spread the glue on the semiconductor surface to the semiconductor surface in a rotating manner, spreading the accumulated glue outward. When the dispensing head (53) is reset, the three sets of hinged arc plates (711) will contact the outer wall of the dispensing head (53). With the rotation of the dispensing head (53), the three sets of hinged arc plates (711) can effectively scrape the glue on the outer wall of the dispensing head (53) into the outer casing (31).

Images