A spray cleaning device for wafer boxes after injection molding

Abstract

The application discloses a kind of wafer box injection-molded after spray cleaning device, specifically related to cleaning device technical field, including workbench, the opening is formed in the middle of the upper end of the workbench, the cleaning mechanism for cleaning wafer box is fixedly installed in the middle of the lower end of the workbench, the storage mechanism for storing wafer box is equipped in the upper side of the cleaning mechanism, the impurity removal mechanism for cleaning the inner cavity of cleaning mechanism is equipped in the middle of the inner cavity of the cleaning mechanism, the transmission mechanism for controlling impurity removal mechanism is equipped in the lower side of the right end of the cleaning mechanism.The wafer box injection-molded after spray cleaning device disclosed in the application, cleaning mechanism cooperates with storage mechanism, can let wafer box be cleaned by immersion and flushing two ways, can better the impurities on the surface of wafer box be cleaned, improve the cleaning effect of device, and wafer box will not be damaged when cleaning, and water resources can be recycled, reduce the waste of water resources.

Description

Technical Field

[0001] This invention relates to the field of cleaning equipment technology, and in particular to a spray cleaning device for wafer cassettes after injection molding. Background Technology

[0002] In the wafer manufacturing process, the control of contaminants is particularly important. Wafers are usually placed in wafer boxes for storage or transportation. It is necessary to further prevent particulate matter from being generated inside the wafer box and affecting the wafer. Therefore, the wafer box needs to be thoroughly cleaned after injection molding.

[0003] Chinese patent document CN217912033U discloses a spray cleaning device after injection molding of a wafer cassette, including a frame, a roller conveyor mounted on the frame, a first cleaning zone and a second cleaning zone arranged sequentially along its conveying direction on the roller conveyor, a splash guard provided in the first cleaning zone, and a plurality of first nozzles arranged between two adjacent rollers in the first cleaning zone, with the first nozzles facing upwards.

[0004] While this patented method can effectively clean wafer cassettes through multiple rinses in daily use, directly rinsing the wafer cassettes can easily damage them, preventing them from sealing properly and affecting subsequent normal use. Furthermore, the wafer cassettes need to be placed in advance for cleaning, making the device cumbersome to use. Directly rinsing the wafer cassettes also prevents water reuse, increasing water consumption. Summary of the Invention

[0005] The main objective of this invention is to provide a spray cleaning device for wafer cassettes after injection molding, which can effectively solve the problems of easily damaging wafer cassettes and the inability to reuse water resources.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A spray cleaning device for wafer cassettes after injection molding includes a workbench with an opening at the center of the upper part of the workbench. A cleaning mechanism for cleaning the wafer cassettes is fixedly installed at the center of the lower part of the workbench. A storage mechanism for storing the wafer cassettes is provided on the upper side of the cleaning mechanism. A cleaning removal mechanism for cleaning the inner cavity of the cleaning mechanism is provided in the center of the inner cavity of the cleaning mechanism. A transmission mechanism for controlling the cleaning removal mechanism is provided on the lower right side of the cleaning mechanism.

[0008] The cleaning mechanism includes a water storage tank. Two water pumps are symmetrically arranged inside the water storage tank. Several spray heads are provided on the upper side of the two water pumps that are close to each other. Several water pumping pipes are provided in the middle of the lower end of the two water pumps. A baffle plate is fixedly installed on the side of the lower end of the two spray heads that are close to each other.

[0009] Preferably, the pumping pipe includes a support pipe, a movable pipe is slidably installed inside the support pipe, a counterweight is fixedly installed on the lower side of the arc-shaped outer surface of the movable pipe, and a filter pipe is fixedly installed at the lower end of the movable pipe.

[0010] Preferably, the storage mechanism includes two air pumps, which are respectively located at the left and right ends of the water storage tank. Each air pump has a support frame on its front side, and the two support frames are slidably installed on the end face of the water storage tank. The output ends of the two air pumps are respectively connected to the two support frames. A storage frame is rotatably installed between the two support frames. A motor is located on the lower right side of the support frame on the right side. Two belt sets are located in the inner cavity of the support frame on the right side, and a connecting shaft is provided between the two belt sets.

[0011] Preferably, the two belt groups are connected to each other via the connecting shaft, and the motor output end is connected to the belt group located on the right.

[0012] Preferably, the impurity removal mechanism includes two reciprocating screws, a movable block is provided on the left side of the inner cavity of the water storage tank, a pusher plate is rotatably installed at the lower end of the movable block, a rectangular plate is fixedly installed on the lower part of the inner wall of the right side of the water storage tank, a reciprocating screw is provided on the upper side of the rectangular plate, a movable block is provided on the front side of the upper end of the rectangular plate, a collection pipe is provided on the front side of the rectangular plate, and two meshing bevel gears are provided at the rear end of the reciprocating screw.

[0013] Preferably, both reciprocating screws penetrate the movable block.

[0014] Preferably, the transmission mechanism includes a lifting frame, which is connected to the support frame located on the right side. The lower end of the lifting frame is provided with a rack, and the lower rear side of the rack is provided with two gears 1, the lower front side of the rack is provided with two gears 2, and the front side of the gears 2 located on the left side is meshed with two gears 3. The lower side of the lifting frame is provided with a telescopic rod, which is connected to the rack.

[0015] Preferably, the gear one on the right side is connected to the gear three on the upper side by a belt, and the gear one on the left side is connected to the gear two on the right side by a belt.

[0016] Preferably, the gear one located on the right side is connected to the bevel gear located on the right side by a belt, and the gear two located on the right side is connected to the reciprocating screw one located on the front side by a belt.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The cleaning mechanism of this invention, used in conjunction with the storage mechanism, allows the wafer cassette to be cleaned through both soaking and rinsing. This effectively removes impurities from the surface of the wafer cassette, improving the cleaning effect of the device. Furthermore, the cleaning process does not damage the wafer cassette. The water used for rinsing is drawn from the soaking water and then flows into the water storage tank after rinsing, allowing the water resources to be recycled and reducing water waste.

[0019] 2. The workbench set up in this invention cleans the wafer cassette by moving the storage mechanism. After cleaning, the workers can directly seal the wafer cassette on the workbench, reducing the possibility of contamination during subsequent transportation. Before cleaning, the wafer cassette only needs to be placed in the storage frame, which reduces the labor intensity of the workers and makes the device more convenient to use.

[0020] 3. The impurity removal mechanism of this invention, through the control of the storage mechanism and the transmission mechanism, can collect impurities in the water storage tank without affecting the cleaning of the wafer cassette. When the device is not working, the movable block two can block the collection pipe, so that the impurities therein will not enter the water and affect the subsequent cleaning work, thus further improving the cleaning effect of the device. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall internal structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the internal structure of the cleaning mechanism of the present invention;

[0024] Figure 4 This is a schematic diagram of the internal structure of the water pumping pipe of the present invention;

[0025] Figure 5 This is a schematic diagram of the storage mechanism location structure of the present invention;

[0026] Figure 6 This is a schematic diagram of the position and structure of the impurity removal mechanism of the present invention;

[0027] Figure 7 This is a schematic diagram of the transmission mechanism structure of the present invention;

[0028] Figure 8 For the present invention Figure 7 Enlarged view of point A in the image;

[0029] Figure 9 This is a schematic diagram of the transmission mechanism of the present invention;

[0030] Figure 10 This is a diagram showing the working state of the impurity removal mechanism of the present invention during cleaning.

[0031] In the diagram: 1. Workbench; 2. Cleaning mechanism; 3. Storage mechanism; 4. Impurity removal mechanism; 5. Transmission mechanism; 21. Water storage tank; 22. Pumping frame; 23. Spray head; 24. Pumping pipe; 25. Baffle plate; 241. Support pipe; 242. Movable pipe; 243. Counterweight; 244. Filter pipe; 31. Air pump; 32. Support frame; 33. Material storage box; 34. Motor; 35. Belt assembly; 36. Connecting shaft; 41. Reciprocating screw one; 42. Movable block one; 43. Push plate; 44. Rectangular plate; 45. Reciprocating screw two; 46. Movable block two; 47. Collection pipe; 48. Bevel gear; 51. Lifting frame; 52. Rack; 53. Gear one; 54. Gear two; 55. Gear three; 56. Telescopic rod. Detailed Implementation

[0032] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0033] Example 1

[0034] like Figure 1 and Figure 2 As shown, a spray cleaning device for wafer cassettes after injection molding includes a workbench 1 with an opening in the middle of the upper end. After cleaning the wafer cassettes with this device, they can be assembled on the workbench 1 for convenient subsequent use. It can also be used in conjunction with a drying device to dry the cleaned wafer cassettes. A cleaning mechanism 2 for cleaning the wafer cassettes is fixedly installed in the middle of the lower end of the workbench 1. The cleaning mechanism 2 cleans the wafer cassettes by soaking and rinsing, which can effectively remove impurities from the surface of the wafer cassettes. The water used for rinsing is drawn from the soaking water and flows back into the cleaning mechanism 2 after rinsing, so that the water resources can be recycled.

[0035] Then, the upper side of the cleaning mechanism 2 is provided with a storage mechanism 3 for storing wafer boxes. The wafer box to be cleaned is placed on the storage mechanism 3, which can drive the wafer box to move up and down to achieve the purpose of soaking. During the soaking process, the wafer box can be rotated to better clean the dust on the surface of the wafer box. The inner cavity of the cleaning mechanism 2 is provided with a cleaning mechanism 4 for cleaning the inner cavity of the cleaning mechanism 2. When the wafer box is cleaned in the cleaning mechanism 2, the impurities attached to it will fall into the water. The impurities are all made of plastic and will float on the water surface when the water is calm. The cleaning mechanism 4 collects the floating impurities to prevent the impurities from affecting the subsequent cleaning work.

[0036] Then, a transmission mechanism 5 for controlling the impurity removal mechanism 4 is provided on the lower right side of the cleaning mechanism 2. The storage mechanism 3 and the impurity removal mechanism 4 are connected through the transmission mechanism 5. The impurity removal mechanism 4 is driven by the up-and-down movement of the storage mechanism 3 to collect the impurities floating in the cleaning mechanism 2.

[0037] To further explain, in order to effectively clean the surface of the wafer cassette, such as... Figure 3 As shown, the cleaning mechanism 2 includes a water storage tank 21. The wafer cassette is cleaned in the water storage tank 21, making water replacement more convenient and preventing water splashing during cleaning. It is used in conjunction with the workbench 1 to facilitate subsequent processing by the staff. Two water pumps 22 are symmetrically arranged inside the water storage tank 21. The water pumps 22 are equipped with water pumps that can draw water from the water storage tank 21 upwards. Several spray heads 23 are provided on the upper side of the two water pumps 22 that are close to each other. After the wafer cassette is soaked in water, it will be moved upwards by the storage mechanism 3. During the movement, impurities in the water will re-adhere to the surface of the wafer cassette. The surface is then rinsed by the spray heads 23, which can effectively clean the impurities in the wafer cassette.

[0038] In addition, several water pumping pipes 24 are provided at the lower middle of the two water pumping frames 22. The water pump in the water pumping frame 22 will draw water from the water storage tank 21 through the water pumping pipes 24. The water inlet of the water pumping pipe 24 will be submerged in the water and will not draw water near the water surface. This prevents the water pump from drawing impurities from the water through the water pumping pipes 24, thus preventing the water pump from getting clogged and increasing the service life of the entire device. Baffle plates 25 are fixedly installed on the side of the lower end of the two spray heads 23 that are close to each other. The baffle plates 25 can block the flow of impurities to the sides. At the same time, when used in conjunction with the impurity removal mechanism 4, it is also convenient to collect impurities.

[0039] To further explain, in order to prevent impurities from appearing inside the water pump frame 22 and the spray head 23, such as Figure 4 As shown, the water pump 24 includes a support pipe 241, and a movable pipe 242 is slidably installed inside the support pipe 241. The support pipe 241 works in conjunction with the movable pipe 242 to allow the water pump to extend and retract, enabling the water pump 24 to adapt to different water levels. A counterweight 243 is fixedly installed on the lower side of the arc-shaped outer surface of the movable pipe 242. The overall weight of the movable pipe 242 is low, so the water pump frame 22 will automatically move upward under the buoyancy of the water, presenting a retracted state. The counterweight 243 can keep the water inlet of the water pump frame 22 in the water, preventing the pump from drawing out impurities. A filter pipe 244 is fixedly installed at the lower end of the movable pipe 242, and the filter pipe 244 also has a filter layer, further reducing the possibility of the water pump being blocked.

[0040] To further explain, in order to move the wafer cassette up and down, such as Figure 5As shown, the storage mechanism 3 includes two air pumps 31, which are respectively located at the left and right ends of the water storage tank 21. The two air pumps 31 have the function of extension and contraction, and the two air pumps 31 will extend and contract simultaneously, so that the wafer box can remain stable. Each air pump 31 has a support frame 32 on its front side, and the two support frames 32 are slidably installed on the end face of the water storage tank 21. The output ends of the two air pumps 31 are respectively connected to the two support frames 32. The support frame 32 is a right-angled U-shape, which allows the air pumps 31 to drive the support frame 32 to move up and down. The electrical components therein do not come into contact with water, which increases the safety of the device during use.

[0041] Then, a storage frame 33 is rotatably installed between the two support frames 32. The storage frame 33 is a grid box in which the wafer box can be placed. The buckle ensures that the wafer box will not be thrown out when the storage frame 33 rotates in water, and also ensures that impurities can be washed away from the grid. A motor 34 is located on the lower right side of the support frame 32 on the right side. Two belt groups 35 are located in the inner cavity of the support frame 32 on the right side. The belt group 35 consists of two pulleys connected by a belt for transmission. A connecting shaft 36 is provided between the two belt groups 35, and the two belt groups 35 are connected to each other through the connecting shaft 36. The output end of the motor 34 is connected to the belt group 35 on the right side. When the motor 34 is started, it can drive the storage frame 33 to rotate. The belt group 35 is located in the inner cavity of the support frame 32 and will not be soaked in water.

[0042] Specifically, the wafer cassette to be cleaned is placed in the storage frame 33. Two air pumps 31 are started to pull the support frame 32 and the storage frame 33 downward. When the storage frame 33 is submerged in water, allowing the wafer cassette to be immersed, the motor 34 can be started. Through the transmission of two belt sets 35 and the connecting shaft 36, the motor drives the storage frame 33 to rotate, thus cleaning the wafer cassette. After immersion, the air pump 31 can be started to push the storage frame 33 upward, and the cassette is rinsed through the spray head 23, improving the cleaning effect of the device.

[0043] To further explain, in order to collect floating impurities in the inner cavity of the water storage tank 21, such as... Figure 6 As shown, the impurity removal mechanism 4 includes two reciprocating screws 41, which are connected by a chain and can rotate simultaneously. A movable block 42 is provided on the left side of the inner cavity of the water storage tank 21. Both reciprocating screws 41 pass through the movable block 42. The movable block 42 is slidably connected to the reciprocating screws 41 through ball bearings. When the reciprocating screws 41 rotate, the rollers will drive the movable block 42 to move. A pusher plate 43 is rotatably installed at the lower end of the movable block 42. The pusher plate 43 can only rotate horizontally by 180 degrees and remains vertical in its natural state. The pusher plate 43 collects impurities on the water surface for easy collection later.

[0044] Then, a rectangular plate 44 is fixedly installed on the lower part of the inner wall on the right side of the water storage tank 21, which is used in conjunction with the pusher plate 43. When the movable block 42 drives the pusher plate 43 to the rectangular plate 44, the pusher plate 43 will rotate 90 degrees under the push of the rectangular plate 44, forming a sealed cavity with the rectangular plate 44, pushing all the impurities into it for easy collection. A reciprocating screw 45 is provided on the upper side of the rectangular plate 44, and a movable block 46 is provided on the front side of the upper end of the rectangular plate 44. When the reciprocating screw 45 rotates, it will drive the movable block 46 to move. When the movable block 46 moves, it will collect the impurities in the cavity. A collection pipe 47 is provided on the front side of the rectangular plate 44. The impurities will enter the collection pipe 47. When the device is not working, the movable block 46 will always be in contact with the collection pipe 47, so that the impurities cannot leak out. Two meshing bevel gears 48 are provided at the rear end of the reciprocating screw 45.

[0045] Specifically, when the reciprocating screw 41 rotates, it will drive the movable block 42 and the pusher plate 43 to move. When the movable block 42 and the pusher plate 43 move to the right, they will push the impurities on the water surface. When they come into contact with the rectangular plate 44, the pusher plate 43 and the rectangular plate 44 will form a sealed cavity to collect the impurities.

[0046] When the reciprocating screw 45 rotates, it will drive the movable block 46 to move. As the movable block 46 moves forward, it will push the impurities in the cavity into the collection pipe 47 for collection. When the storage frame 33 moves downward, the movable block 46 moves backward first, and then the pusher plate 43 moves to the right. When the storage frame 33 moves upward, the movable block 46 moves forward first, and then the pusher plate 43 moves to the left, so as to better collect the impurities.

[0047] It should be noted that when the pusher plate 43 moves to the left, impurities left by the washing will float on the water surface. However, the pusher plate 43 and the movable block 42 are rotatably connected. Under the action of friction with the surfaces of the two water pipes 24, the pusher plate 43 will rotate, causing the impurities to slide away from under the pusher plate 43. When the pusher plate 43 moves to the right, it will also rotate. However, the special shape of 90 degrees means that the pusher plate 43 will not affect the function of pushing impurities when it is slightly tilted.

[0048] The specific implementation method of this embodiment is as follows: Place the wafer cassette that needs to be cleaned in the storage frame 33, start the two air pumps 31, pull the support frame 32 and the storage frame 33 downward, and when the storage frame 33 is in the water and the wafer cassette is soaked, the motor 34 can be started to drive the storage frame 33 to rotate, so that the wafer cassette can be cleaned.

[0049] When the storage box 33 moves downward, the second reciprocating screw 45 will rotate, driving the second movable block 46 to move backward. Then the first reciprocating screw 41 will rotate, driving the first movable block 42 and the pusher plate 43 to move. When the first movable block 42 and the pusher plate 43 move to the right, they will push the impurities on the water surface. When they come into contact with the rectangular plate 44, the pusher plate 43 and the rectangular plate 44 will form a sealed cavity to collect the impurities.

[0050] After the wafer cassette is cleaned, when the storage frame 33 moves upward, the reciprocating screw 45 rotates first, and the pusher plate 43 drives the movable block 46 to move forward. During the forward movement of the movable block 46, impurities in the cavity are pushed into the collection tube 47 for collection. Then the reciprocating screw 41 rotates again, allowing the movable block 42 and the pusher plate 43 to reset.

[0051] Example 2

[0052] This embodiment is a further improvement on the impurity removal mechanism 4 based on the first embodiment, so that whether the storage frame 33 in the device moves up or down, the rectangular plate 44 will rotate first and then the reciprocating screw 41 will rotate.

[0053] To further explain, in order to make the rectangular plate 44 rotate first and then the reciprocating screw 41 rotate, as follows: Figure 7 , Figure 8 as well as Figure 9 As shown, the transmission mechanism 5 includes a lifting frame 51, which is connected to the support frame 32 located on the right side. When the support frame 32 moves, it can drive the lifting frame 51 to move. The lower end of the lifting frame 51 is provided with a rack 52. The lower rear side of the rack 52 is provided with two gears 53, and the lower front side of the rack 52 is provided with two gears 54. The rack 52 can mesh with the gears 53 and 54 in sequence, and both gears 53 and 54 are rotatably connected to the end face of the water storage tank 21.

[0054] Then, two gears 55 mesh with the front side of the second gear 54 on the left. The gear 55 on the upper side rotates in the same direction as the second gear 54 on the left. The lower side of the lifting frame 51 is provided with a telescopic rod 56, which is connected to the rack 52 and used in conjunction with the lifting frame 51. It can drive the rack 52 to move left and right. When the rack 52 is on the right, it can mesh with the first gear 53 and the second gear 54 on the right. When the rack 52 is on the left, it can only mesh with the first gear 53 and the second gear 54 on the left.

[0055] Specifically, when the lifting frame 51 and the telescopic rod 56 push the rack 52 to the right, the rack 52 can mesh with the gear 1 53 and gear 2 54 on the right. At this time, it will first drive the gear 1 53 on the right to rotate, and then drive the gear 2 54 on the right to rotate.

[0056] When the lifting frame 51 and the telescopic rod 56 push the rack 52 to the left, the rack 52 can mesh with the first gear 53 and the second gear 54 on the left. At this time, the second gear 54 on the left will rotate first, and then the first gear 53 on the left will rotate.

[0057] It should be noted that the lifting frame 51 is equipped with an electric cylinder. When the lifting frame 51 moves the rack 52 downward, it will push the rack 52 to the right. When the lifting frame 51 moves the rack 52 upward, it will push the rack 52 to the left. The telescopic rod 56 is slidably connected to the rack 52 and will not affect the up and down movement of the rack 52.

[0058] To further explain, the gear 1 53 on the right side is connected to the gear 3 55 on the upper side by a belt, the gear 1 53 on the left side is connected to the gear 2 54 on the right side by a belt, the gear 1 53 on the right side is connected to the bevel gear 48 on the right side by a belt, and the gear 2 54 on the right side is connected to the reciprocating screw 1 41 on the front side by a belt.

[0059] Specifically, when the gear 53 on the right rotates, it will drive the bevel gear 48 to rotate, causing the reciprocating screw 45 to move the movable block 46. When the gear 54 on the right rotates, it will drive the two reciprocating screws 41 to rotate, causing the reciprocating screws 41 to move the movable block 42 and the pusher plate 43.

[0060] The specific implementation of this embodiment is as follows: When the lifting frame 51 drives the rack 52 to move downward, it will push the rack 52 to the right side. The rack 52 will mesh with the gear 1 53 and gear 2 54 on the right side in sequence. This will first drive the gear 1 53 on the right side to rotate. The gear 1 53 on the right side will drive the bevel gear 48 to rotate, so that the reciprocating screw 2 45 drives the movable block 2 46 to move. Then it will drive the gear 2 54 on the right side to rotate. The gear 2 54 on the right side will drive the two reciprocating screws 1 41 to rotate, so that the reciprocating screws 1 41 drive the movable block 1 42 and the pusher plate 43 to move.

[0061] When the lifting frame 51 moves the rack 52 upward, it will push the rack 52 to the left. The rack 52 will mesh with the first gear 53 and the second gear 54 on the left in sequence. It will first drive the second gear 54 on the left to rotate. The second gear 54 will drive the two third gears 55 to rotate. The third gear 55 will then drive the first gear 53 on the right to rotate. Then it will drive the first gear 53 on the left to rotate. The first gear 53 will drive the second gear 54 on the right to rotate.

[0062] This ensures that whether the storage box 33 moves upward or downward, the movable block 46 will move first, and then the pusher plate 43 will move, which can effectively collect impurities in the inner cavity of the water storage tank 21.

[0063] It should be noted that the specific installation methods, circuit connection methods, and control methods of the water pump 22, spray head 23, air pump 31, and motor 34 in this invention are all conventional designs, and will not be described in detail in this invention.

[0064] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A spray cleaning device for wafer cassette injection molding, comprising a workbench (1), characterized in that: The workbench (1) has an opening at the middle of its upper end. A cleaning mechanism (2) for cleaning wafer cassettes is fixedly installed at the middle of the lower end of the workbench (1). A storage mechanism (3) for storing wafer cassettes is provided on the upper side of the cleaning mechanism (2). A cleaning removal mechanism (4) for cleaning the inner cavity of the cleaning mechanism (2) is provided in the middle of the inner cavity of the cleaning mechanism (2). A transmission mechanism (5) for controlling the cleaning removal mechanism (4) is provided on the lower right side of the cleaning mechanism (2). The cleaning mechanism (2) includes a water storage tank (21). The water storage tank (21) has two water pumps (22) symmetrically arranged inside. Each of the two water pumps (22) has several spray heads (23) on the upper side of the end that is close to each other. Each of the two water pumps (22) has several water pumping pipes (24) in the middle of the lower end. Each of the two spray heads (23) has a baffle plate (25) fixedly installed on the side that is close to each other at the lower end. The storage mechanism (3) includes two air pumps (31), which are respectively located at the left and right ends of the water storage tank (21). Each air pump (31) has a support frame (32) on its front side. The two support frames (32) are slidably installed on the end face of the water storage tank (21). The output ends of the two air pumps (31) are respectively connected to the two support frames (32). A storage frame (33) is rotatably installed between the two support frames (32). A motor (34) is provided on the lower right side of the support frame (32) on the right side. Two belt groups (35) are provided in the inner cavity of the support frame (32) on the right side. A connecting shaft (36) is provided between the two belt groups (35). The impurity removal mechanism (4) includes two reciprocating screws (41), a movable block (42) is provided on the left side of the inner cavity of the water storage tank (21), a pusher plate (43) is rotatably installed at the lower end of the movable block (42), a rectangular plate (44) is fixedly installed on the lower part of the inner wall on the right side of the water storage tank (21), a reciprocating screw (45) is provided on the upper side of the rectangular plate (44), a movable block (46) is provided on the front side of the upper end of the rectangular plate (44), a collecting pipe (47) is provided on the front side of the rectangular plate (44), and two meshing bevel gears (48) are provided at the rear end of the reciprocating screw (45). The transmission mechanism (5) includes a lifting frame (51), which is connected to the support frame (32) located on the right side. The lower end of the lifting frame (51) is provided with a rack (52), and the lower rear side of the rack (52) is provided with two gears (53). The lower front side of the rack (52) is provided with two gears (54). The gears (54) located on the left side are meshed with two gears (55). The lower side of the lifting frame (51) is provided with a telescopic rod (56), which is connected to the rack (52). Both of the reciprocating screws (41) pass through the movable block (42); The gear 1 (53) located on the right side is connected to the gear 3 (55) located on the upper side by a belt, and the gear 1 (53) located on the left side is connected to the gear 2 (54) located on the right side by a belt. The gear one (53) located on the right side is connected to the bevel gear (48) located on the right side by a belt, and the gear two (54) located on the right side is connected to the reciprocating screw one (41) located on the front side by a belt.

2. The spray cleaning device for wafer cassette injection molding according to claim 1, characterized in that: The water pumping pipe (24) includes a support pipe (241), a movable pipe (242) is slidably installed in the inner cavity of the support pipe (241), a counterweight (243) is fixedly installed on the lower side of the arc-shaped outer surface of the movable pipe (242), and a filter pipe (244) is fixedly installed at the lower end of the movable pipe (242).

3. The spray cleaning device for wafer cassette injection molding according to claim 1, characterized in that: The two belt sets (35) are connected to each other via the connecting shaft (36), and the output end of the motor (34) is connected to the belt set (35) located on the right.

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