Piezoelectric thin film ultrasonic transducer encapsulation reinforcement method based on front-liner matching layer material

By employing a dual-layer surface passivation design technology that combines inorganic coatings and organic thick film filling, the acoustic impedance matching of the piezoelectric thin film ultrasonic transducer is optimized, solving the problems of low acoustic wave transmission efficiency and easy damage, and achieving higher device reliability and service life.

CN117163915BActive Publication Date: 2026-05-29INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
Filing Date
2023-08-16
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing piezoelectric thin-film ultrasonic transducers have low acoustic wave transmission efficiency, and the encapsulation and reinforcement process is difficult to control precisely, making them susceptible to damage from friction and stress.

Method used

A dual-layer surface passivation design technology combining inorganic coating and organic thick film filling is adopted. The acoustic impedance matching is optimized by a gradient model of multilayer front liner matching layer, and the matching layer is prepared by spin coating. The device is protected by an inorganic SiN passivation layer and an organic silicone layer.

Benefits of technology

It improves the efficiency of sound wave transmission, enhances the wear resistance and reliability of the device, and extends its service life.

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Abstract

The application discloses a piezoelectric thin film ultrasonic transducer packaging and reinforcing method based on a front lining matching layer material, relates to the technical field of ultrasonic transducer preparation, and is an improvement on the method based on the existing packaging and reinforcing technology, proposes a double-layer surface passivation design technology combining inorganic plating and organic thick film filling, solves the problem of low acoustic wave transmission efficiency caused by the large acoustic impedance difference between the piezoelectric thin film ultrasonic transducer and the solid structure, solves the problem that the piezoelectric thin film ultrasonic transducer is easily damaged due to contact with the measured structure and is subjected to friction, stress and the like during use through the front lining matching layer packaging and reinforcing process, and improves the reliability and service life of the device.
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