Display module and display device

Abstract

Embodiments of the present application disclose a display module and a display device. A driving chip is configured to generate a screen driving signal according to a signal transmitted by a first pin. A non-display area of the screen includes a plurality of first bonding terminals. The first bonding terminals are not connected to or not connected with circuit structures in a display area of the screen when the screen works according to the screen driving signal. By connecting the first pin and the first bonding terminal, the electrostatic protection circuit connected to the first pin and the electrostatic protection circuit connected to the first bonding terminal jointly bear the invading electrostatic load, the risk of the first pin and the related lines connected to the first pin being damaged is reduced, the electrostatic protection capability of the display module is improved, and the display performance and the touch performance of the display module are ensured. In addition, the technical solution of the present application can connect the idle first bonding terminal in the display module with the first pin of the driving chip, improve the electrostatic protection capability of the display module, and reduce the waste of resources.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the development of display technology, the requirements for the electrostatic protection capability of display devices are becoming increasingly stringent.

[0003] If static electricity is introduced to the pins of the driver chip, the pins and the related circuits connected to them will be at risk of being damaged.

[0004] However, existing display devices have poor electrostatic discharge (ESD) protection capabilities, making critical pins of the driver chip and related wiring easily damaged, affecting the display or touch performance of the display module. Furthermore, existing display devices have too many terminals on the screen, some of which are useless during operation. In other words, existing display devices suffer from both poor ESD protection and wasted terminal resources. Summary of the Invention

[0005] This invention provides a display module and a display device to improve the electrostatic discharge protection capability of the display module and display device, reduce the risk of damage to the key pins of the driver chip and the related circuits connected to them, ensure good display and touch performance, and make full use of the idle terminals on the screen to reduce resource waste.

[0006] In a first aspect, embodiments of the present invention provide a display module, including: a screen body and a driver chip, wherein the driver chip is disposed in the non-display area of ​​the screen body; the driver chip includes a plurality of first pins, and the driver chip is used to generate a screen body driving signal according to the signal transmitted by the first pins; the non-display area of ​​the screen body includes a plurality of first bonding terminals, wherein the first bonding terminals are not connected or not connected to the circuit structure in the display area of ​​the screen body when the screen body operates according to the screen body driving signal; at least some of the first pins are connected to the first bonding terminals.

[0007] Optionally, the screen includes a control switch electrically connected to a first bonding terminal. The control terminal of the control switch is connected to a driver chip. The first end of the control switch is connected to the first bonding terminal, and the second end of the control switch is connected to a signal line in the screen. The driver chip is used to control the control switch to turn off when the screen is working.

[0008] Optionally, the first bonding terminal is a test terminal of the screen test circuit on the screen body. The test terminal is used to connect test data signals when the screen body is tested. The switch of the screen test circuit is multiplexed as a control switch. The control switch is electrically connected to the test terminal in a one-to-one correspondence.

[0009] Optionally, the screen test circuit is a screen lighting test circuit, the signal line is a data line, and the test data signal is a data voltage;

[0010] Alternatively, the screen test circuit can be a screen touch test circuit, the signal lines can be touch signal lines, and the test data signals can be touch driving voltage or touch sensing voltage.

[0011] Optionally, the display module also includes a flexible circuit board, which includes a second pin and a third pin. The second pin is electrically connected to the first pin in a one-to-one correspondence, and the third pin is electrically connected to the first bonding terminal in a one-to-one correspondence. The flexible circuit board also includes connecting wires, through which the second pin and the third pin are connected to connect the corresponding first pin and the first bonding terminal.

[0012] Optionally, the display module also includes a connector, which includes multiple output ports; the connecting line includes a first connecting segment and a second connecting segment, the first end of the first connecting segment and the first end of the second connecting segment are connected to the same output port, the second end of the first connecting segment is connected to a second pin, and the second end of the second connecting segment is connected to a third pin; the line width of the second connecting segment is greater than the line width of the first connecting segment; and / or the line length of the second connecting segment is less than the line length of the first connecting segment.

[0013] Optionally, the non-display area includes a bonding area, which is provided with a second bonding terminal that is electrically connected to the first pin in a one-to-one correspondence; the second pin is electrically connected to the second bonding terminal, and the third pin is electrically connected to the first bonding terminal.

[0014] Optionally, the first bonding terminals connected to different first pins may be different.

[0015] Optionally, at least one first pin is connected to a plurality of first bonding terminals.

[0016] Optionally, the display module further includes a first electrostatic discharge (ESD) protection circuit and a second ESD protection circuit. The first pin is connected to the first ESD protection circuit, and the first bonding terminal is connected to the second ESD protection circuit. The first ESD protection circuit connected to the first pin and the second ESD protection circuit connected to the first bonding terminal are different ESD protection circuits.

[0017] Optionally, the first electrostatic discharge (ESD) protection circuit is located in the driver chip, and the second ESD protection circuit is located in the screen.

[0018] Secondly, embodiments of the present invention also provide a display device, including the display module of the first aspect.

[0019] The display module and display device of this invention include a driver chip comprising multiple first pins, which generates a screen driving signal based on the signals transmitted by the first pins. The non-display area of ​​the screen includes multiple first bonding terminals, which are not connected to the circuit structure in the display area of ​​the screen during operation. By connecting or deconnecting the first pins and the first bonding terminals, the electrostatic discharge (ESD) protection circuits connected to the first pins and the ESD protection circuits connected to the first bonding terminals share the intruding ESD load, reducing the risk of damage to the first pins and related circuits connected to them, improving the ESD protection capability of the display module, ensuring the reliability of the signals transmitted by the first pins, and thus improving the reliability of the screen driving signal generated by the driver chip, ensuring the display performance and touch performance of the display module. Furthermore, the technical solution of this embodiment can connect idle first bonding terminals in the display module to the first pins of the driver chip, thereby sharing the ESD load borne by the first pins of the driver chip, improving the ESD protection capability of the display module, and reducing resource waste. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0026] As described in the background section, existing display devices suffer from both poor electrostatic discharge (ESD) protection and wasted terminal resources. The inventors have discovered that this problem arises because in existing display devices, the driver chip connects to a flexible circuit board (PCB) via key pins, and the PCB connects to the motherboard. The PCB transmits signals received from the motherboard to the key pins of the driver chip, enabling the driver chip to generate screen drive signals based on these signals and send them to the screen. This causes the screen to operate (including display and touch) under the drive of the screen drive signals. In existing technology, ESD testing of the display module typically involves applying static electricity to the connectors connected to the PCB. The static electricity travels through the PCB to the key pins of the driver chip. When this static electricity exceeds the load capacity of the ESD protection circuit of the key pin, the key pin and its connected wiring may be damaged. This prevents the key pin from properly receiving signals from the PCB, thus affecting the screen drive signals generated by the driver chip and ultimately impacting the display or touch performance of the display module. During the transportation and use of display devices, static electricity is inevitably introduced, which, for the same reason, affects the display and touch performance. Furthermore, before the driver chip is bonded to the display panel, there are usually a series of manufacturing processes. Therefore, corresponding terminals need to be placed on the screen to receive the signals required by these processes. After the display panel is bonded to the driver chip and the display panel leaves the factory, most of these terminals have no function for display or touch, thus remaining idle in the display device and wasting resources.

[0027] For the reasons stated above, this invention provides a display module. Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention, for reference. Figure 1 The display module includes a screen 100 and a driver chip 200. The driver chip 200 is located in the non-display area NAA of the screen 100. The driver chip 200 includes a plurality of first pins A1, which are used to generate a drive signal for the screen 100 based on the signal transmitted by the first pins A1. The non-display area NAA of the screen 100 includes a plurality of first bonding terminals B1. When the screen 100 operates according to the screen drive signal, the first bonding terminals B1 are not connected to or not connected to the circuit structure in the display area of ​​the screen 100. At least some of the first pins A1 are connected to the first bonding terminals B1.

[0028] Specifically, the screen 100 can be an organic light-emitting diode (OLED) display screen 100, a liquid crystal display screen 100, or a micro-LED display screen 100, or other types of display screen 100; this embodiment does not limit the specific type. The screen 100 may include a driving circuit layer and a display function layer, wherein the driving circuit layer includes a display driving circuit that drives the display function layer to perform the display. For example, when the screen 100 is an OLED display screen 100, the display function layer includes organic light-emitting diodes. In some embodiments of the present invention, the screen 100 may also include a touch function layer to realize the touch function of the display device. When the screen 100 includes a touch function layer, the driving circuit layer includes touch-related devices and circuitry.

[0029] The driver chip 200 connects the motherboard and the screen 100 of the display device. The driver chip 200 can receive output signals from the motherboard and generate screen 100 driving signals based on these signals. The motherboard output signals may include power signals required by digital circuits, MIPI (Mobile Industry Processor Interface) data signals, etc. The screen 100 driving signals include display driving signals and touch driving signals. The display driving signals include clock signals, high-level signals, low-level signals, and start signals required by the gate driving circuit on the screen 100, as well as data voltage signals required by the pixel circuits. The touch driving signals include touch driving voltages. The driver chip 200 includes multiple first pins A1. The driver chip 200 connects to the motherboard or to circuit devices on a flexible circuit board via the first pins A1. After the motherboard output signals are transmitted to the first pins A1, the driver chip 200 generates screen 100 driving signals based on the motherboard output signals received at the first pins A1. Therefore, the screen 100 driving signals generated by the driver chip 200 are related to the signals transmitted through the first pins A1.

[0030] The non-display area NAA of the screen 100 includes multiple first bonding terminals B1. When the screen 100 operates according to the screen driving signal, the first bonding terminals B1 are not connected to the circuit structure in the display area of ​​the screen 100. The operation of the screen 100 according to the screen driving signal includes the period from when the display module is powered on to when the display device is powered off. The operation of the screen 100 may include, but is not limited to, at least one of display, touch, and fingerprint recognition. The circuit structure of the display area of ​​the screen 100 includes circuit devices and signal lines. In this embodiment, when the screen 100 is operating, the first bonding terminals B1 are not connected to or not connected to the circuit structure in the display area of ​​the screen 100; therefore, the signal on the first bonding terminals B1 will not affect the performance of the screen 100. Before the screen 100 is bonded to the driver chip 200, the first bonding terminals B1 are connected to the circuit structure in the display area of ​​the screen 100, thereby enabling the pre-bonding process flow (e.g., testing process) of the driver chip 200. After completing the required process flow, the connection between the first bonding terminal B1 and the circuit structure in the display area of ​​the screen 100 can be cut off. This cutting off can be done by cutting the circuit (corresponding to the case where the first bonding terminal B1 and the circuit structure in the display area of ​​the screen 100 are not connected when the screen 100 is working after bonding with the driver chip 200), or it can be done by cutting or other processes (corresponding to the case where the first bonding terminal B1 and the circuit structure in the display area of ​​the screen 100 are not connected when the screen 100 is working after bonding with the driver chip 200). This embodiment does not make specific limitations here.

[0031] refer to Figure 1 Optionally, the display module also includes a first electrostatic discharge (ESD) protection circuit C1 and a second ESD protection circuit C2. The first pin A1 is connected to the first ESD protection circuit C1, and the first bonding terminal B1 is connected to the second ESD protection circuit C2. The first ESD protection circuit C1 connected to the first pin A1 and the second ESD protection circuit C2 connected to the first bonding terminal B1 are different ESD protection circuits.

[0032] Optionally, the first electrostatic discharge (ESD) protection circuit C1 is disposed in the driver chip 200, and the second ESD protection circuit C2 is disposed in the screen 100. Optionally, the first pin A1 and the first bonding terminal B1, which are electrically connected, are connected to multiple ESD protection circuits. Optionally, the first pin A1 and the first bonding terminal B1 are connected to the corresponding first ESD protection circuit C1 and second ESD protection circuit C2.

[0033] Optionally, the first electrostatic discharge (ESD) protection circuit C1 and / or the second ESD protection circuit C2 may include at least one diode, and / or at least one transistor. Alternatively, the first ESD protection circuit C1 and / or the second ESD protection circuit C2 may include a first diode and / or a second diode.

[0034] In the first electrostatic discharge (ESD) protection circuit C1, the anode of the first diode is electrically connected to the low-voltage DC signal line, and the cathode of the first diode is electrically connected to the first pin A1 to release low-voltage ESD. The anode of the second diode is electrically connected to the first pin A1, and the cathode of the second diode is electrically connected to the high-voltage DC signal line to release high-voltage ESD. The first diode and / or the second diode can be: the first terminal and the control terminal of a transistor are electrically connected, and the first and second terminals of the transistor can be equivalent to the cathode and anode of a diode, respectively.

[0035] In the second electrostatic discharge (ESD) protection circuit C2, the anode of the first diode is electrically connected to the low-voltage DC signal line, and the cathode of the first diode is electrically connected to the first bonding terminal B1 to release low-voltage ESD. The anode of the second diode is electrically connected to the first bonding terminal B1, and the cathode of the second diode is electrically connected to the high-voltage DC signal line to release high-voltage ESD.

[0036] In the prior art, the first bonding terminal B1 is idle in the display module, resulting in resource waste. Specifically, the first pin A1 is connected to a flexible circuit board, the flexible circuit board is connected to a connector, and the connector is connected to the motherboard, thereby realizing the connection between the first pin A1 and the motherboard. During electrostatic discharge (ESD) testing, ESD is applied from the connector to the display module. The ESD is transmitted along conductive lines to the first pin A1 of the driver chip 200. The first pin A1 is connected to a corresponding ESD protection circuit. When the ESD exceeds the tolerance range of the ESD protection circuit connected to the first pin A1, it can cause damage to the first pin A1 or related lines connected to it. In this embodiment, by connecting at least some of the first pins A1 to the first bonding terminal B1, the ESD energy that would originally all reach the first pin A1 can partially reach the first bonding terminal B1, thus protecting the ESD protection circuit connected to the first pin A1. Figure 1 The electrostatic discharge protection circuit (ESD protection circuit C1) and the ESD protection circuit connected to the first bonding terminal B1 are described. Figure 1 The second electrostatic discharge (ESD) protection circuit (C2) shares the load of the incoming ESD, reducing the ESD energy borne by the first pin A1. This lowers the risk of damage to the first pin A1 and its connected circuitry. Since the drive signal for the screen 100 generated by the driver chip 200 is independent of the signal transmitted by the first bonding terminal B1, and the first bonding terminal B1 is not connected to the circuitry in the display area when the screen 100 is operating, ESD conduction to the first bonding terminal B1 has no impact on the display and touch performance of the display module. Similarly, when ESD is introduced during the transportation and use of the display device, the risk of damage to the first pin A1 and its connected circuitry is also reduced for the same reason; this will not be elaborated further here.

[0037] It should be noted that each first pin A1 is connected to at least one first electrostatic discharge protection circuit C1, and each first bonding terminal B1 is connected to at least one second electrostatic discharge protection circuit C2. Figure 1 The diagram only schematically shows a first electrostatic discharge (ESD) protection circuit C1 connected to a first pin A1 and a second ESD protection circuit C2 connected to a first bonding terminal B1.

[0038] In this embodiment, at least a portion of the first pins A1 and the first bonding terminal B1 are connected. Specifically, since the number of first bonding terminals B1 is limited, in this embodiment, some of the multiple first pins A1 can be connected to the first bonding terminal B1, and in particular, key pins among the multiple first pins A1 can be selected to be connected to the first bonding terminal B1. These key pins may include pins transmitting power signals required by the digital circuitry and pins transmitting MIPI data signals. It should be noted that when the number of first bonding terminals B1 is sufficient, each first pin A1 can be connected to a first bonding terminal B1, thereby reducing the risk of electrostatic discharge (ESD) damage to each first pin A1 and its connected circuitry.

[0039] The display module of this embodiment includes a screen and a driver chip. The driver chip includes multiple first pins and is used to generate screen driving signals based on signals transmitted from the first pins. The non-display area of ​​the screen includes multiple first bonding terminals. When the screen operates according to the screen driving signals, the first bonding terminals are not connected to or not connected to the circuit structure in the display area of ​​the screen. By connecting the first pins and the first bonding terminals, the electrostatic discharge (ESD) protection circuits connected to the first pins and the ESD protection circuits connected to the first bonding terminals share the intruding ESD load, reducing the risk of damage to the first pins and related lines connected to them, improving the ESD protection capability of the display module, ensuring the reliability of the signals transmitted by the first pins, and thus improving the reliability of the screen driving signals generated by the driver chip, ensuring the display performance and touch performance of the display module. In addition, the technical solution of this embodiment can connect the idle first bonding terminals in the display module to the first pins of the driver chip, thereby sharing the ESD load borne by the first pins of the driver chip, improving the ESD protection capability of the display module, and reducing resource waste.

[0040] Figure 2 This is a schematic diagram of another display module provided in an embodiment of the present invention, for reference. Figure 2Based on the above technical solution, optionally, the screen body 100 includes a control switch 300 electrically connected to the first bonding terminal B1. The control terminal of the control switch 300 is connected to the driver chip 200. The first terminal of the control switch 300 is connected to the first bonding terminal B1, and the second terminal of the control switch 300 is connected to the signal line in the screen body 100. The driver chip 200 is used to control the control switch 300 to turn off when the screen body 100 is working.

[0041] Specifically, by including a control switch 300 in the screen 100, before the screen 100 is bonded to the driver chip 200, corresponding signals can be input to the control terminal and the first terminal of the control switch 300 via a pin connection. For example, if the control switch 300 needs to be turned on before the screen 100 is bonded to the driver chip 200, a turn-on control signal can be input to the control terminal of the control switch 300 to turn it on, and the signal required for the process flow can be provided to the first terminal of the control switch 300, allowing the control switch 300 to transmit the required signal to the signal line in the screen 100. After completing the corresponding process flow, the screen 100 is bonded to the driver chip 200. The driver chip 200 can be connected to the control terminal of the control switch 300. When the screen 100 is working, the driver chip 200 can output a shutdown control signal to the control terminal of the control switch 300, causing the control switch 300 to turn off. Therefore, when the screen 100 is working, the signal on the first bonding terminal B1 will not affect the display performance and touch performance of the screen 100. Thus, connecting at least some of the first pins A1 to the first bonding terminal B1 can improve the electrostatic discharge protection capability of the display module.

[0042] The number of control switches 300 can be one or more, and this embodiment does not specifically limit the number. In some embodiments of the present invention, the number of control switches 300 is one, in which case each first bonding terminal B1 is connected to the control switch 300; in other optional embodiments of the present invention, the number of control switches 300 is the same as the number of first bonding terminals B1, and the control switches 300 and the first bonding terminals B1 are electrically connected in a one-to-one correspondence.

[0043] Optionally, the first bonding terminal B1 is a test terminal of the test circuit of the screen 100 on the screen 100. The test terminal is used to connect test data signals when the screen 100 is tested. The switch multiplexing of the test circuit of the screen 100 is a control switch 300. The control switch 300 is electrically connected to the test terminal one by one.

[0044] Specifically, before bonding the screen 100 to the driver chip 200, the screen 100 needs to be tested. Testing the screen 100 typically involves inputting test signals via pin insertion. Specifically, during testing, a conduction control signal can be input to the control terminal of the control switch 300 via pin insertion, causing each control switch 300 to conduct. This connects (or connects to) the signal lines in the display area AA of the screen 100 to the first bonding terminal B1. Connecting the pin to the first bonding terminal B1 then transmits test data signals to the circuit structure in the display area AA of the screen 100, thereby completing the test of the screen 100. After the display module bonds the driver chip 200, the driver chip 200 outputs a shutdown control signal to the control terminal of the control switch 300, causing the first bonding terminal B1 to disconnect (or not connect or not be connected) from the circuit structure in the display area AA of the screen 100, preventing signal transmission to the signal lines in the display area AA of the screen 100. Therefore, at least some of the first pins A1 are connected to the first bonding terminal B1, and the first bonding terminal B1 and the first pins A1 share the electrostatic load, which can improve the electrostatic protection capability of the display module. Since the switch in the screen 100 test circuit is multiplexed as the control switch 300, there is no need to additionally fabricate the control switch 300 on the screen 100, ensuring a simpler manufacturing process for the screen 100. Furthermore, the structure of the screen 300 is relatively simple, and it does not increase the area of ​​the non-display area NAA, which is beneficial for achieving a narrow bezel.

[0045] Based on the above technical solution, in some optional embodiments of the present invention, the screen 100 test circuit is a screen 100 lighting test circuit (i.e., screen lighting test circuit), the driving signal line is a data line, and the test data signal is a data voltage.

[0046] Specifically, the display area of ​​the screen 100 may include an array of pixel circuits, with data lines connected to multiple pixel circuits. When the test circuit of the screen 100 is a dot-screen test circuit, by turning on the control switch 300 and inputting a data voltage to the first bonding terminal B1, the data voltage can be transmitted to the corresponding pixel circuit through the data line, thereby illuminating the pixels driven by the pixel circuit and realizing the dot-screen test of the screen 100. After the display device leaves the factory, when the screen 100 is working, the control switch 300 can be turned off by the driver chip 200.

[0047] In some optional embodiments of the present invention, the screen 100 test circuit is a screen 100 touch test circuit, the driving signal line is a touch signal line, and the test data signal is a touch driving voltage or a touch sensing voltage.

[0048] Specifically, the display area of ​​the screen 100 may include touch electrodes, which can be arranged in an array, and touch signal lines are connected to multiple touch electrodes. When the test circuit of the screen 100 is a touch test circuit, by turning on the control switch 300 and inputting a touch driving voltage to the first bonding terminal B1, the touch driving voltage can be transmitted to the corresponding touch electrode through the touch signal line. For example, when the electrode connected to the touch signal line is a transmitting electrode, the transmitting electrode receives the touch driving voltage, and the voltage on the corresponding sensing electrode changes. The touch test is completed by obtaining the touch sensing voltage on the sensing electrode when the touch is touched. After the display device leaves the factory, when the screen 100 is working, the control switch 300 can be turned off by the driver chip 200.

[0049] In some optional embodiments of the present invention, the screen testing circuit is a screen crack detection circuit, the driving signal line is a crack detection line, and the test data signal is a crack detection voltage.

[0050] Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present invention, for reference. Figure 3 Optionally, the display module also includes a flexible circuit board 400, which includes a second pin A2 and a third pin A3. The second pin A2 is electrically connected to the first pin A1 in a one-to-one correspondence, and the third pin A3 is electrically connected to the first bonding terminal B1 in a one-to-one correspondence.

[0051] The flexible circuit board 400 also includes a connecting line 500, through which the second pin A2 and the third pin A3 are connected to connect the corresponding first pin A1 and the first bonding terminal B1.

[0052] The second pin A2 and the third pin A3 can also be connected to an electrostatic discharge (ESD) protection circuit to enhance ESD protection capabilities.

[0053] Specifically, the flexible circuit board 400 is bonded to the non-display area NAA of the screen 100 and has pins that correspond one-to-one with the pins of the driver chip 200. The flexible circuit board 400 is also connected to the motherboard, thereby receiving output signals from the motherboard and transmitting them to the driver chip 200. The pins of the flexible circuit board 400 include a second pin A2 and a third pin A3. The second pin A2 is electrically connected one-to-one with the first pin A1 of the driver chip 200, thereby transmitting the motherboard output signals received from the motherboard to the first pin A1 of the driver chip 200. The third pin A3 is connected to the first bonding terminal B1 of the screen 100, thereby transmitting the signal from the third pin A3 of the flexible circuit board 400 to the first bonding terminal B1. In this embodiment, the flexible circuit board 400 includes a connecting line 500, which can connect the second pin A2 and the third pin A3. This allows the first pin A1 connected to the second pin A2 and the first bonding terminal B1 connected to the third pin A3 to be connected. In other words, by setting the connecting line 500 on the flexible circuit board 400, the first pin A1 and the first bonding terminal B1 of the driver chip 200 are connected. This ensures that when static electricity enters the driver chip 200 from the flexible circuit board 400, the electrostatic discharge protection circuit connected to the first pin A1 (which can be set in the driver chip) and the electrostatic discharge protection circuit connected to the first bonding terminal B1 (which can be set in the screen) jointly bear the intruding electrostatic load, reducing the risk of damage to the first pin A1 and the related lines connected to the first pin A1. Furthermore, since the connection between the first pin A1 and the first bonding terminal B1 is implemented on the flexible circuit board 400, when it is necessary to enable the first bonding terminal B1 of the screen body 100, it is only necessary to unbind the flexible circuit board 400 of the display module from the screen body 100 and then connect the screen body 100 to other flexible circuit boards 400 or circuit devices. There is no need to change the structure of the screen body 100. Therefore, the manufacturing of the screen body 100 can maintain the original masking steps and will not add any additional process steps to the manufacturing of the display module.

[0054] Figure 4 This is a schematic diagram of another display module provided in an embodiment of the present invention. (Reference) Figure 4 Optionally, the display module also includes a connector 600, which includes multiple output ports; the connecting line 500 includes a first connecting segment 510 and a second connecting segment 520, the first end of the first connecting segment 510 and the first end of the second connecting segment 520 are connected to the same output port, the second end of the first connecting segment 510 is connected to a second pin A2, and the second end of the second connecting segment 520 is connected to a third pin A3; the line width of the second connecting segment 520 is greater than the line width of the first connecting segment 510; and / or the line length of the second connecting segment 520 is less than the line length of the first connecting segment 510.

[0055] The connector 600 may include multiple input ports, which connect to the motherboard of the display device. The output ports of the connector 600 connect to the pins of the flexible circuit board 400 (the pins of the flexible circuit board 400 include a second pin A2 and a third pin A3), and the pins of the flexible circuit board 400 connect to the pins of the driver chip 200 (the pins of the driver chip 200 include a first pin A1), thus enabling the connection between the motherboard and the driver chip 200. The flexible circuit board 400 also has a device area 410, which contains circuit components. Depending on the actual needs of the driver chip 200, some of the first pin A1 can be connected to the circuit components in the device area 410.

[0056] Specifically, the linewidth of the second connection segment 520 is greater than that of the first connection segment 510. This allows the charge transfer speed in the second connection segment 520 to be greater than that in the first connection segment 510. This facilitates the conduction of more electrostatic energy to the first bonding terminal B1, thereby further reducing the electrostatic energy reaching the first pin A1 and further reducing the risk of damage to the first pin A1 and its connected circuitry. Furthermore, since the screen driving signal generated by the driver chip 200 is independent of the signal transmitted through the first bonding terminal B1, even if the first bonding terminal B1 and its connected circuitry are damaged by electrostatic discharge due to excessive electrostatic load, it will not affect the display performance or touch performance of the display module.

[0057] The length of the second connecting segment 520 is shorter than that of the first connecting segment 510. This allows the time for charges simultaneously output from the same output port of connector 600 to reach the third pin A3 to be shorter than the time to reach the second pin A2. This facilitates the conduction of more electrostatic energy to the first bonding terminal B1, thereby further reducing the electrostatic energy reaching the first pin A1 and further reducing the risk of damage to the first pin A1 and its connected circuitry. Furthermore, since the screen driving signal generated by the driver chip 200 is independent of the signal transmitted through the first bonding terminal B1, even if the first bonding terminal B1 and its connected circuitry are damaged by electrostatic discharge due to excessive electrostatic load, it will not affect the display performance or touch performance of the display module.

[0058] Continue to refer to Figure 4 Optionally, the non-display area NAA includes a bonding area NAA1, which is provided with a second bonding terminal B2 that is electrically connected to the first pin A1 in a one-to-one correspondence; the second pin A2 is electrically connected to the second bonding terminal B2, and the third pin A3 is electrically connected to the first bonding terminal B1.

[0059] Specifically, the first pin A1 of the driver chip 200 can be connected to the corresponding first bonding terminal B1 via a line on the screen 100. The electrical connection between the second pin A2 of the flexible circuit board 400 and the second bonding terminal B2 can be achieved by crimping or conductive adhesive, and the electrical connection between the third pin A3 of the flexible circuit board 400 and the first bonding terminal B1 can be achieved by crimping or conductive adhesive.

[0060] It should be noted that, Figure 3 and Figure 4 The example shown only illustrates the case of three first bonding terminals B1. The number of first bonding terminals B1 can be greater than three. In this case, the orthographic projection of the control switch 300 and / or the signal line connecting the control switch 300 and the first bonding terminal B1 on the screen substrate overlaps with the orthographic projection of the driver chip 200 on the screen. In this case, insulation at the necessary locations can be achieved by providing an insulating layer between the control switch 300 and / or the signal line connecting the control switch 300 and the first bonding terminal B1 and the driver chip 200.

[0061] Based on the above embodiments, the first bonding terminals B1 connected to different first pins A1 are different. This arrangement ensures that different first pins A1 are not connected to each other, avoids mutual interference between signals transmitted by first pins A1 that transmit different signals, ensures the normal operation of the driver chip 200, and thus ensures good display and touch performance of the screen 100.

[0062] Based on the above embodiments, optionally, at least one first pin A1 is connected to multiple first bonding terminals B1. This arrangement allows the electrostatic energy that would otherwise all reach the first pin A1 to be shared by more first bonding terminals B1 and the first pin A1, further reducing the electrostatic load on the first pin A1, and consequently further reducing the risk of damage to the first pin A1 and related circuitry connected to it.

[0063] This invention also provides a display device. Figure 5 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, for reference. Figure 5 The display device 1 provided in this embodiment of the invention includes the display module 10 provided in any of the above embodiments of the invention. The display device can be... Figure 5 The mobile phone shown can also be a computer, television, smart wearable display device, etc., and the embodiments of the present invention do not make any special limitations on this.

[0064] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display module, characterized in that, include: The screen and the driver chip, wherein the driver chip is disposed in the non-display area of ​​the screen; The driver chip includes a plurality of first pins, and the driver chip is used to generate a screen driving signal according to the signal transmitted by the first pins. The non-display area of ​​the screen includes a plurality of first bonding terminals, wherein the first bonding terminals are not connected or not connected to the circuit structure in the display area of ​​the screen when the screen works according to the screen drive signal. At least a portion of the first pins are connected to the first bonding terminal; It also includes a flexible circuit board, which includes a second pin and a third pin, wherein the second pin is electrically connected to the first pin in a one-to-one correspondence, and the third pin is electrically connected to the first bonding terminal in a one-to-one correspondence. The flexible circuit board also includes a connecting line, through which the second pin and the third pin are connected to connect the corresponding first pin and the first bonding terminal; It also includes a connector, which includes multiple output ports; the connecting line includes a first connecting segment and a second connecting segment, the first end of the first connecting segment and the first end of the second connecting segment are connected to the same output port, the second end of the first connecting segment is connected to the second pin, and the second end of the second connecting segment is connected to the third pin; The line width of the second connecting segment is greater than the line width of the first connecting segment; and / or the line length of the second connecting segment is less than the line length of the first connecting segment.

2. The display module according to claim 1, characterized in that, The screen includes a control switch electrically connected to the first bonding terminal. The control terminal of the control switch is connected to the driver chip. The first terminal of the control switch is connected to the first bonding terminal, and the second terminal of the control switch is connected to a signal line in the screen. The driver chip is used to control the control switch to turn off when the screen is working.

3. The display module according to claim 2, characterized in that, The first bonding terminal is a test terminal of the screen test circuit on the screen body. The test terminal is used to connect test data signals when the screen body is tested. The switch of the screen test circuit is multiplexed as the control switch. The control switch is electrically connected to the test terminal in a one-to-one correspondence.

4. The display module according to claim 3, characterized in that, The screen testing circuit is a screen lighting testing circuit, the signal line is a data line, and the test data signal is a data voltage; Alternatively, the screen testing circuit may be a screen touch testing circuit, the signal line may be a touch signal line, and the test data signal may be a touch driving voltage or a touch sensing voltage.

5. The display module according to claim 1, characterized in that, The non-display area includes a bonding area, and the bonding area is provided with a second bonding terminal that is electrically connected to the first pin in a one-to-one correspondence. The second pin is electrically connected to the second bonding terminal, and the third pin is electrically connected to the first bonding terminal.

6. The display module according to claim 1, characterized in that, The first bonding terminals connected to the first pins are different.

7. The display module according to claim 1, characterized in that, At least one of the first pins is connected to a plurality of the first bonding terminals.

8. The display module according to any one of claims 1-7, characterized in that, The display module also includes a first electrostatic discharge (ESD) protection circuit and a second ESD protection circuit. The first pin is connected to the first electrostatic discharge (ESD) protection circuit, and the first bonding terminal is connected to the second ESD protection circuit. The first ESD protection circuit connected to the first pin and the second ESD protection circuit connected to the first bonding terminal are different ESD protection circuits.

9. The display module according to claim 8, characterized in that, The first electrostatic discharge (ESD) protection circuit is disposed in the driver chip, and the second ESD protection circuit is disposed in the screen.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

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