Low noise amplifier

Abstract

The application belongs to the technical field of amplifiers, and discloses a low-noise amplifier, which comprises an input matching circuit, an amplification circuit, a power supply circuit and an output matching circuit; the output end of the input matching circuit is connected with the input end of the amplification circuit, the output end of the amplification circuit is connected with the first input end of the output matching circuit, and the output end of the power supply circuit is connected with the second input end of the output matching circuit; and the low-noise amplifier can obtain a smaller noise coefficient and a higher gain in a working frequency band, and the reliability of the low-noise amplifier is effectively improved.

Description

Technical Field

[0001] This invention belongs to the field of amplifier technology and relates to a low-noise amplifier. Background Technology

[0002] The radio frequency (RF) low-noise amplifier (LNOA) is a critical module in the entire RF receiver system, directly determining the system sensitivity. Key performance indicators (SPIs) in RF LNOA chip design include gain, noise figure, and stability. From the perspective of evaluating RF LNOA chip performance, high gain and low noise are important optimization goals; gain and noise performance need to be carefully considered within the operating frequency band. From the perspective of evaluating RF LNOA reliability, the stability factor is a key indicator of whether the LNOA can function properly. Stability not only requires the LNOA chip to be greater than 1 within the operating frequency band, but also must ensure that the designed LNOA chip remains greater than 1 from DC to more than four times the operating frequency, guaranteeing absolute stability of the LNOA.

[0003] However, in actual chip design, bond wire inductance has a significant impact on the stability of low-noise amplifier chips. Because the bond wire inductance causes feedback between the input and output signals, leading to oscillations, the influence of this feedback loop must be eliminated to ensure the reliability of the low-noise amplifier chip. Traditional methods to improve stability often involve adding a lossy network in series in the RF path, but this sacrifices gain and noise. Therefore, considering the external bond wire inductance, researching ways to improve the stability of low-noise amplifiers with minimal sacrifice of gain and noise is of great significance. Summary of the Invention

[0004] The purpose of this invention is to provide a low-noise amplifier to solve the problem that the inductance of the bonding wire causes feedback in the input and output circuits of the low-noise amplifier chip, thereby causing instability in the low-noise amplifier at high frequencies.

[0005] To achieve the above objectives, the technical solution adopted by this invention is as follows:

[0006] A low-noise amplifier includes an input matching circuit, an amplification circuit, a power supply circuit, and an output matching circuit.

[0007] The output terminal of the input matching circuit is connected to the input terminal of the amplifier circuit, the output terminal of the amplifier circuit is connected to the first input terminal of the output matching circuit, and the output terminal of the power supply circuit is connected to the second input terminal of the output matching circuit.

[0008] As a limitation, the input matching circuit includes an input port INA, a first inductor L1, a second inductor L2, a third inductor L3, a fourth inductor L4, a first capacitor C1, a second capacitor C2, a DC blocking capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a first resistor R1, a bias resistor R2, a third resistor R3, a fourth resistor R4, a first bonding wire inductor LB1, a second bonding wire inductor LB2, a third bonding wire inductor LB3, and a fourth bonding wire inductor LB4;

[0009] The first inductor L1, the first capacitor C1, the second capacitor C2, the first resistor R1, and the second bonded wire inductor LB2 constitute a bandpass filter; the second inductor L2, the fourth capacitor C4, and the third bonded wire inductor LB3 constitute a resonant circuit; the third inductor L3, the fifth capacitor C5, the third resistor R3, the fourth inductor L4, the sixth capacitor C6, the fourth resistor R4, and the fourth bonded wire inductor LB4 constitute a first high-frequency resonant selection network;

[0010] One end of the input port INA is connected to the RF signal port IN of the external pad via the first bonding wire inductor LB1. The other end of the input port INA is connected to one end of the first inductor L1, the first capacitor C1, and the DC blocking capacitor C3. The other end of the first inductor L1 is connected to the other end of the first capacitor C1 and then connected to one end of the first resistor R1 via the second capacitor C2. The other end of the first resistor R1 is connected to one end of the first ground port GND1, and the other end of the first ground port GND1 is grounded via the second bonding wire inductor LB2. The other end of the DC blocking capacitor C3 is connected to one end of the second inductor L2, the third inductor L3, the fourth inductor L4, and the bias resistor R2. The output terminal is connected to the input terminal of the amplifier circuit; the other end of the bias resistor R2 is connected to the power-on terminal VG1; the other end of the second inductor L2 is connected to one end of the second ground port GND2 through the fourth capacitor C4, and the other end of the second ground port GND2 is grounded through the third bonding wire inductor LB3; the other end of the third inductor L3 is connected to one end of the third resistor R3 through the fifth capacitor C5; the other end of the fourth inductor L4 is connected to one end of the fourth resistor R4 through the sixth capacitor C6; the other end of the third resistor R3 and the other end of the fourth resistor R4 are connected to one end of the third ground port GND3, and the other end of the third ground port GND3 is grounded through the fourth bonding wire inductor LB4.

[0011] As a second limitation, the amplifier circuit includes a first transistor M1, a second transistor M2, a seventh capacitor C7, an eighth capacitor C8, a parasitic capacitance Cds, a fifth inductor L5, a bias resistor R5, a fifth bonded wire inductor LB5, and a sixth bonded wire inductor LB6.

[0012] The gate of the first transistor M1 is connected to the output of the input matching circuit as an input terminal. The drain of the first transistor M1 is connected to one end of the fifth inductor L5. The other end of the fifth inductor L5 is connected to one end of the seventh capacitor C7 and the source of the second transistor M2. The gate of the second transistor M2 is connected to the other end of the seventh capacitor C7, the eighth capacitor C8 and one end of the bias resistor R5. The other end of the eighth capacitor C8 is connected to one end of the fifth ground port GND5. The other end of the fifth ground port GND5 is grounded through the sixth bonding wire inductor LB6. The other end of the bias resistor R5 is connected to the power-on terminal VG2. The source of the first transistor M1 is connected to the fourth ground port GND4 and one end of the parasitic capacitance Cds. The other end of the fourth ground port GND4 is grounded through the fifth bonding wire inductor LB5. The other end of the parasitic capacitance Cds is connected to the drain of the second transistor M2 and then serves as the output terminal connected to the first input of the output matching circuit.

[0013] As a third limitation, the power supply circuit includes a seventh inductor L7, an eighth inductor L8, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a seventh bonded wire inductor LB7, and an eighth bonded wire inductor LB8.

[0014] The seventh inductor L7, the eighth inductor L8, the ninth capacitor C9, the tenth capacitor C10, the sixth resistor R6, the seventh resistor R7, and the seventh bonded wire inductor LB7 constitute the second high-frequency resonant selection network.

[0015] One end of the eighth resistor R8 is connected to the power supply VDD. The other end of the eighth resistor R8 is connected to one end of the seventh inductor L7, the eighth inductor L8, and the eleventh capacitor C11, and then connected as the output terminal to the second input terminal of the output matching circuit. The other end of the seventh inductor L7 is connected to one end of the sixth resistor R6 through the ninth capacitor C9. The eighth inductor L8 is connected to one end of the seventh resistor R7 through the tenth capacitor C10. The other end of the sixth resistor R6 is connected to the other end of the seventh resistor R7 and then connected to one end of the sixth grounding port GND6. The other end of the sixth grounding port GND6 is grounded through the seventh bonding wire inductor LB7. The other end of the eleventh capacitor C11 is connected to one end of the seventh grounding port GND7, and the other end of the seventh grounding port GND7 is grounded through the eighth bonding wire inductor LB8.

[0016] As a fourth limitation, the output matching circuit includes a sixth inductor L6, a twelfth capacitor C12, and a ninth bonded wire inductor LB9;

[0017] One end of the sixth inductor L6 is connected to the output of the power supply circuit as the second input terminal. The other end of the sixth inductor L6 is connected to one end of the twelfth capacitor C12 and then connected to the output of the amplifier circuit as the first input terminal. The other end of the twelfth capacitor C12 is connected to one end of the output port OUT1. The other end of the output port OUT1 is connected to the external output terminal OUT2 through the ninth bonding wire inductor LB9.

[0018] The present invention, by adopting the above-described technical solution, achieves the following technical advancements compared to existing technologies:

[0019] (1) This invention can not only significantly improve the stability of low noise amplifiers, but also effectively improve the noise and gain of low noise amplifiers;

[0020] (2) The present invention employs a bandpass filter, a resonant circuit and a first high-frequency resonant selection network in the input matching circuit, and adds a second high-frequency resonant selection network in the power supply circuit, which ensures that the low noise amplifier achieves a low noise figure and a high gain in the operating frequency band, while also ensuring that the low noise amplifier remains stable throughout the entire passband, effectively improving the reliability of the low noise amplifier.

[0021] In summary, the present invention can ensure that the low-noise amplifier achieves a small noise figure and high gain within the operating frequency band. Attached Figure Description

[0022] Figure 1 The diagram shown is a circuit schematic of an embodiment of the present invention.

[0023] Figure 2 The diagram shown is a circuit schematic of Comparative Scheme 1 in an embodiment of the present invention;

[0024] Figure 3 The diagram shown is a circuit schematic of Comparative Scheme 2 in an embodiment of the present invention;

[0025] Figure 4 The figure shown is a comparison chart of the stability coefficients of the embodiments of the present invention, Comparative Scheme 1, and Comparative Scheme 2.

[0026] Figure 5 The figure shown is a comparison chart of the minimum noise figure of the embodiment of the present invention, Comparative Scheme 1, and Comparative Scheme 2.

[0027] Figure 6 The diagram shows a comparison of the maximum available gain of the embodiments of the present invention, Comparative Scheme 1, and Comparative Scheme 2. Detailed Implementation

[0028] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] Example: A low-noise amplifier

[0030] like Figure 1 As shown, this embodiment fully considers the impact of external conditions on the low-noise amplifier and proposes a low-noise amplifier, including an input matching circuit, an amplification circuit, a power supply circuit, and an output matching circuit; the output terminal of the input matching circuit is connected to the input terminal of the amplification circuit, the output terminal of the amplification circuit is connected to the first input terminal of the output matching circuit, and the output terminal of the power supply circuit is connected to the second input terminal of the output matching circuit.

[0031] In this embodiment, the input matching circuit includes an input port INA, a first inductor L1, a second inductor L2, a third inductor L3, a fourth inductor L4, a first capacitor C1, a second capacitor C2, a DC blocking capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a first resistor R1, a bias resistor R2, a third resistor R3, a fourth resistor R4, a first bonding wire inductor LB1, a second bonding wire inductor LB2, a third bonding wire inductor LB3, and a fourth bonding wire inductor LB4.

[0032] One end of the input port INA is connected to the RF signal port IN of the external pad via the first bonding wire inductor LB1. The other end of the input port INA is connected to one end of the first inductor L1, the first capacitor C1, and the DC blocking capacitor C3. The other end of the first inductor L1 is connected to the other end of the first capacitor C1 and then connected to one end of the first resistor R1 via the second capacitor C2. The other end of the first resistor R1 is connected to one end of the first ground port GND1, and the other end of the first ground port GND1 is grounded via the second bonding wire inductor LB2. The other end of the DC blocking capacitor C3 is connected to one end of the second inductor L2, the third inductor L3, the fourth inductor L4, and the bias resistor R2, and then serves as the input... The output terminal is connected to the input terminal of the amplifier circuit; the other end of the bias resistor R2 is connected to the power-on terminal VG1; the other end of the second inductor L2 is connected to one end of the second ground port GND2 through the fourth capacitor C4, and the other end of the second ground port GND2 is grounded through the third bonding wire inductor LB3; the other end of the third inductor L3 is connected to one end of the third resistor R3 through the fifth capacitor C5; the other end of the fourth inductor L4 is connected to one end of the fourth resistor R4 through the sixth capacitor C6; the other end of the third resistor R3 and the other end of the fourth resistor R4 are connected to one end of the third ground port GND3, and the other end of the third ground port GND3 is grounded through the fourth bonding wire inductor LB4.

[0033] The first inductor L1, the first capacitor C1, the second capacitor C2, the first resistor R1, and the second bonded wire inductor LB2 constitute a bandpass filter, which ensures that the signal only passes within the operating frequency band of the low-noise amplifier. The second inductor L2, the fourth capacitor C4, and the third bonded wire inductor LB3 constitute a resonant circuit. The third inductor L3, the fifth capacitor C5, the third resistor R3, the fourth inductor L4, the sixth capacitor C6, the fourth resistor R4, and the fourth bonded wire inductor LB4 constitute a first high-frequency resonant selection network. This network effectively isolates feedback signals at high frequencies. In this network, the third inductor L3, the fifth capacitor C5, the fourth inductor L4, and the sixth capacitor C6 are used for high-frequency resonance, while the third resistor R3 and the fourth resistor R4 increase flatness.

[0034] In this embodiment, the amplifier circuit includes a first transistor M1, a second transistor M2, a seventh capacitor C7, an eighth capacitor C8, a parasitic capacitance Cds, a fifth inductor L5, a bias resistor R5, a fifth bonded wire inductor LB5, and a sixth bonded wire inductor LB6.

[0035] The gate of the first transistor M1 is connected to the output of the input matching circuit as an input terminal. The drain of the first transistor M1 is connected to one end of the fifth inductor L5. The other end of the fifth inductor L5 is connected to one end of the seventh capacitor C7 and the source of the second transistor M2. The gate of the second transistor M2 is connected to the other end of the seventh capacitor C7, the eighth capacitor C8 and one end of the bias resistor R5. The other end of the eighth capacitor C8 is connected to one end of the fifth ground port GND5. The other end of the fifth ground port GND5 is grounded through the sixth bonding wire inductor LB6. The other end of the bias resistor R5 is connected to the power-on terminal VG2. The source of the first transistor M1 is connected to the fourth ground port GND4 and one end of the parasitic capacitance Cds. The other end of the fourth ground port GND4 is grounded through the fifth bonding wire inductor LB5. The other end of the parasitic capacitance Cds is connected to the drain of the second transistor M2 and then serves as the output terminal connected to the first input of the output matching circuit.

[0036] In this circuit, the gate of the first transistor M1 is connected to the bias resistor R2, and the applied terminal VG1 can provide DC bias to the first transistor M1 through the bias resistor R2. The gate of the second transistor M2 is connected to the bias resistor R5, and the applied terminal VG2 can provide DC bias to the transistor M2 through the bias resistor R5. The fifth inductor L5 is an interstage inductor, mainly used to improve gain and reduce noise. The eighth capacitor C8 is a bypass capacitor, mainly used to provide sufficient output swing for the circuit. Since the sixth bonding wire inductor LB6 is connected to the gate of the second transistor M2 through the eighth capacitor C8, the sixth bonding wire inductor LB6 will cause an inductor to be connected in series with the gate of the second transistor M2, which is very likely to form a negative resistance at the source of the second transistor M2, thereby generating oscillation. The conventional approach is to connect a resistor in series with the gate of the second transistor M2, but this method will worsen the noise and reduce the gain. Therefore, in this embodiment, a seventh capacitor C7 is connected in series between the gate and source of the second transistor M2. By connecting the seventh capacitor C7 in series, not only can the stability be improved, but a trade-off between gain and noise can also be achieved.

[0037] In this embodiment, the power supply circuit includes a seventh inductor L7, an eighth inductor L8, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a seventh bonded wire inductor LB7, and an eighth bonded wire inductor LB8. The seventh inductor L7, the eighth inductor L8, the ninth capacitor C9, the tenth capacitor C10, the sixth resistor R6, the seventh resistor R7, and the seventh bonded wire inductor LB7 constitute a second high-frequency resonant selection network. The eighth inductor L8, the tenth capacitor C10, the seventh inductor L7, and the ninth capacitor C9 are used for resonance at high frequencies. The sixth resistor R6 and the seventh resistor R7 increase flatness, attenuating high-frequency signals in the output signal and reducing the coupling of high-frequency signals to the ideal ground.

[0038] In this circuit, one end of the eighth resistor R8 is connected to the power supply VDD. The other end of the eighth resistor R8 is connected to one end of the seventh inductor L7, the eighth inductor L8, and the eleventh capacitor C11, and then serves as the output terminal connected to the second input terminal of the output matching circuit. The other end of the seventh inductor L7 is connected to one end of the sixth resistor R6 through the ninth capacitor C9. The eighth inductor L8 is connected to one end of the seventh resistor R7 through the tenth capacitor C10. The other end of the sixth resistor R6 is connected to the other end of the seventh resistor R7 and then to one end of the sixth grounding port GND6. The other end of the sixth grounding port GND6 is grounded through the seventh bonding wire inductor LB7. The other end of the eleventh capacitor C11 is connected to one end of the seventh grounding port GND7, and the other end of the seventh grounding port GND7 is grounded through the eighth bonding wire inductor LB8. The eleventh capacitor C11 is a bypass capacitor, whose main function is to provide sufficient output swing for the circuit. The power supply VDD is connected in series with the eighth resistor R8, which effectively ensures the stability of the circuit at low frequencies.

[0039] In this embodiment, the output matching circuit includes a sixth inductor L6, a twelfth capacitor C12, and a ninth bonding wire inductor LB9. One end of the sixth inductor L6 serves as the second input terminal and is connected to the output terminal of the power supply circuit. The other end of the sixth inductor L6 is connected to one end of the twelfth capacitor C12 and serves as the first input terminal and is connected to the output terminal of the amplifier circuit. The other end of the twelfth capacitor C12 is connected to one end of the output port OUT1. The other end of the output port OUT1 is connected to the external output terminal OUT2 through the ninth bonding wire inductor LB9.

[0040] Because the low-noise amplifier is externally bonded to an ideal ground via bonded wire inductors, crosstalk between signals is very severe. Specifically, a parasitic capacitance Cds is connected in series between the source of the first transistor M1 and the drain of the second transistor M2. The output signal is coupled to the ideal ground through the parasitic capacitance Cds and the eleventh capacitor C11. Due to the imperfect grounding, the output signal is coupled to the input through the second bonded wire inductor LB2, the third bonded wire inductor LB3, and the fourth bonded wire inductor LB4, thus causing oscillation. By adding a first high-frequency resonant selection network to the input matching circuit, the influence of the output signal on the input through the imperfect ground can be effectively reduced.

[0041] The working principle of this embodiment is as follows:

[0042] The signal enters the input port INA of the input matching circuit through the RF signal port IN of the external pad. The input matching circuit, which consists of a bandpass filter, a resonant circuit, and a first high-frequency resonant selection network, achieves input matching of the low-noise amplifier. Then, the signal is amplified by the first transistor M1 and the second transistor M2 in the amplification circuit and enters the output matching circuit to achieve output matching of the low-noise amplifier.

[0043] In this embodiment, the first bonded wire inductor LB1, the second bonded wire inductor LB2, the third bonded wire inductor LB3, and the fourth bonded wire inductor LB4 in the input matching circuit are bonded-to-ground inductors. Due to the presence of these inductors, a feedback loop exists between the output and input signals, which can easily lead to instability at a certain high-frequency band. By adding a first high-frequency resonant selection network to the input matching circuit, feedback at high frequencies can be effectively isolated. Simultaneously, by adding a second high-frequency resonant selection network to the power supply circuit, attenuation at high frequencies can be achieved. Since no lossy components are connected in series throughout the entire RF path, the input matching circuit consists only of a bandpass filter, a resonant circuit, and the first high-frequency resonant selection network, ensuring signal stability at high frequencies while maintaining low noise and high gain in the operating frequency band.

[0044] To further verify the effectiveness of the low-noise amplifier proposed in this embodiment, this embodiment is compared with... Figure 2 The low-noise amplifier shown without any network (denoted as Comparison Scheme 1) and Figure 3 The following comparison is made with a low-noise amplifier circuit (referred to as Comparison Scheme 2) that incorporates a series lossy component into the traditional scheme, resulting in the following: Figures 4-6 The chart shows a comparison of stability coefficient, minimum noise figure, and maximum usable gain.

[0045] like Figure 4 The figure shown is a comparison of the stability coefficients of this embodiment with those of Comparative Scheme 1 and Comparative Scheme 2. When the operating frequency band of the low-noise amplifier is 5~6GHz, the stability coefficient is... Figure 4 As can be seen, Comparative Solution 1 is a low-noise amplifier circuit without any attenuation network. Within the operating frequency band, the stability coefficient of the low-noise amplifier is less than 1. Although it has high gain and a low stability coefficient, the circuit of Comparative Solution 1 will experience self-oscillation, causing damage to the actual chip. Therefore, Comparative Solution 1 is not feasible. Comparative Solution 2 is a low-noise amplifier circuit with a series lossy component, ensuring a stability coefficient greater than 1 within the operating frequency band, thus preventing self-oscillation of the chip. Compared to Comparative Solution 2, the low-noise amplifier circuit of this embodiment has higher stability within the operating frequency band. The low-noise amplifier of this embodiment not only achieves a stability greater than 1 across the entire frequency band but also exhibits high stability at high frequencies. Therefore, the low-noise amplifier of this embodiment can significantly improve stability.

[0046] like Figure 5 The figure shown is a comparison of the minimum noise figure of this embodiment with Comparative Scheme 1 and Comparative Scheme 2. As can be seen from the figure, within the operating frequency range, the low-noise amplifier of this embodiment has lower noise than the structure of Comparative Scheme 2.

[0047] like Figure 6 The figure shows a comparison of the maximum available gain of this embodiment with Comparative Scheme 1 and Comparative Scheme 2. As can be seen from the figure, the low-noise amplifier of this embodiment has a higher gain than Comparative Scheme 2.

[0048] Therefore, in order to ensure the reliability of the circuit, by Figures 4-6As can be seen, although Comparative Scheme 1 has higher gain and lower stability, its circuitry is prone to self-oscillation, which can damage the actual chip. Therefore, this scheme is not feasible and will not be chosen in practice. Comparative Scheme 2's circuit stability meets the requirements of the actual circuit, but its low-noise amplifier has lower gain and a worse noise figure. The low-noise amplifier circuit in this example, while ensuring stability across the entire frequency band, offers higher gain and a lower noise figure compared to Scheme 2. Therefore, Comparative Scheme 1 is not advisable. Compared to Comparative Scheme 2, the low-noise amplifier in this embodiment has the advantages of high stability, low noise figure, and high gain.

[0049] It should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions described in the above embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A low-noise amplifier, characterized in that, It includes input matching circuit, amplifier circuit, power supply circuit and output matching circuit; The output terminal of the input matching circuit is connected to the input terminal of the amplifier circuit, the output terminal of the amplifier circuit is connected to the first input terminal of the output matching circuit, and the output terminal of the power supply circuit is connected to the second input terminal of the output matching circuit. The input matching circuit includes an input port INA, a first inductor L1, a second inductor L2, a third inductor L3, a fourth inductor L4, a first capacitor C1, a second capacitor C2, a DC blocking capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a first resistor R1, a bias resistor R2, a third resistor R3, a fourth resistor R4, a first bonding wire inductor LB1, a second bonding wire inductor LB2, a third bonding wire inductor LB3, and a fourth bonding wire inductor LB4; The first inductor L1, the first capacitor C1, the second capacitor C2, the first resistor R1, and the second bonded wire inductor LB2 constitute a bandpass filter; The second inductor L2, the fourth capacitor C4, and the third bonded wire inductor LB3 constitute a resonant circuit; the third inductor L3, the fifth capacitor C5, the third resistor R3, the fourth inductor L4, the sixth capacitor C6, the fourth resistor R4, and the fourth bonded wire inductor LB4 constitute a first high-frequency resonant selection network. One end of the input port INA is connected to the RF signal port IN of the external pad via the first bonding wire inductor LB1. The other end of the input port INA is connected to one end of the first inductor L1, the first capacitor C1, and the DC blocking capacitor C3. The other end of the first inductor L1 is connected to the other end of the first capacitor C1 and then connected to one end of the first resistor R1 via the second capacitor C2. The other end of the first resistor R1 is connected to one end of the first ground port GND1, and the other end of the first ground port GND1 is grounded via the second bonding wire inductor LB2. The other end of the DC blocking capacitor C3 is connected to one end of the second inductor L2, the third inductor L3, the fourth inductor L4, and the bias resistor R2. The output terminal is connected to the input terminal of the amplifier circuit; the other end of the bias resistor R2 is connected to the power-on terminal VG1; the other end of the second inductor L2 is connected to one end of the second ground port GND2 through the fourth capacitor C4, and the other end of the second ground port GND2 is grounded through the third bonding wire inductor LB3; the other end of the third inductor L3 is connected to one end of the third resistor R3 through the fifth capacitor C5; the other end of the fourth inductor L4 is connected to one end of the fourth resistor R4 through the sixth capacitor C6; the other end of the third resistor R3 and the other end of the fourth resistor R4 are connected to one end of the third ground port GND3, and the other end of the third ground port GND3 is grounded through the fourth bonding wire inductor LB4.

2. The low-noise amplifier according to claim 1, characterized in that, The amplifier circuit includes a first transistor M1, a second transistor M2, a seventh capacitor C7, an eighth capacitor C8, a parasitic capacitance Cds, a fifth inductor L5, a bias resistor R5, a fifth bonded wire inductor LB5, and a sixth bonded wire inductor LB6. The gate of the first transistor M1 is connected to the output of the input matching circuit as an input terminal. The drain of the first transistor M1 is connected to one end of the fifth inductor L5. The other end of the fifth inductor L5 is connected to one end of the seventh capacitor C7 and the source of the second transistor M2. The gate of the second transistor M2 is connected to the other end of the seventh capacitor C7, the eighth capacitor C8 and one end of the bias resistor R5. The other end of the eighth capacitor C8 is connected to one end of the fifth ground port GND5. The other end of the fifth ground port GND5 is grounded through the sixth bonding wire inductor LB6. The other end of the bias resistor R5 is connected to the power-on terminal VG2. The source of the first transistor M1 is connected to the fourth ground port GND4 and one end of the parasitic capacitance Cds. The other end of the fourth ground port GND4 is grounded through the fifth bonding wire inductor LB5. The other end of the parasitic capacitance Cds is connected to the drain of the second transistor M2 and then serves as the output terminal connected to the first input of the output matching circuit.

3. The low-noise amplifier according to claim 1, characterized in that, The power supply circuit includes a seventh inductor L7, an eighth inductor L8, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a seventh bonded wire inductor LB7, and an eighth bonded wire inductor LB8. The seventh inductor L7, the eighth inductor L8, the ninth capacitor C9, the tenth capacitor C10, the sixth resistor R6, the seventh resistor R7, and the seventh bonded wire inductor LB7 constitute the second high-frequency resonant selection network. One end of the eighth resistor R8 is connected to the power supply VDD. The other end of the eighth resistor R8 is connected to one end of the seventh inductor L7, the eighth inductor L8, and the eleventh capacitor C11, and then connected as the output terminal to the second input terminal of the output matching circuit. The other end of the seventh inductor L7 is connected to one end of the sixth resistor R6 through the ninth capacitor C9. The eighth inductor L8 is connected to one end of the seventh resistor R7 through the tenth capacitor C10. The other end of the sixth resistor R6 is connected to the other end of the seventh resistor R7 and then connected to one end of the sixth grounding port GND6. The other end of the sixth grounding port GND6 is grounded through the seventh bonding wire inductor LB7. The other end of the eleventh capacitor C11 is connected to one end of the seventh grounding port GND7, and the other end of the seventh grounding port GND7 is grounded through the eighth bonding wire inductor LB8.

4. The low-noise amplifier according to claim 1, characterized in that, The output matching circuit includes a sixth inductor L6, a twelfth capacitor C12, and a ninth bonded wire inductor LB9. One end of the sixth inductor L6 is connected to the output of the power supply circuit as the second input terminal. The other end of the sixth inductor L6 is connected to one end of the twelfth capacitor C12 and then connected to the output of the amplifier circuit as the first input terminal. The other end of the twelfth capacitor C12 is connected to one end of the output port OUT1. The other end of the output port OUT1 is connected to the external output terminal OUT2 through the ninth bonding wire inductor LB9.

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