A backflow system for wafer cassette handling equipment

Abstract

The backflow system for wafer box conveying equipment comprises a rack, a first air filtering unit, a second air filtering unit, a baffle connecting piece and a lifting baffle, and the lifting baffle constitutes a sealed cabin box body. The sealed cabin is installed on the rack, the second air filtering unit is located at the lower side of the sealed cabin and is locked below the sealed cabin box body to provide filtered air for the sealed cabin, the lifting baffle is installed on the side of the sealed cabin box body through the two baffle connecting pieces, direct contact between the lifting baffle and the sealed cabin is effectively avoided, and the friction and dust generation phenomenon between the lifting baffle and the surrounding structure are avoided. The first air filtering unit is located at the top of the rack, and the first air filtering unit and the second air filtering unit are respectively located on the two sides of the lifting baffle.

Description

Technical Field

[0001] The present invention relates to the field of wafer box transport equipment, in particular to a backflow system for wafer box transport equipment. Background Art

[0002] As we all know, with the upgrading of my country's industry, people's requirements for products have increased. Traditional wafer box handling equipment mostly uses air filtration and sealing to prevent dust. However, during the handling process, the wafer box will inevitably be exposed to dust. Therefore, it can no longer meet the needs of current customers and industrial upgrades.

[0003] Therefore, the semiconductor wafer industry is currently favoring high-pressure dust control. Wafers refer to the silicon wafers used in the manufacture of silicon semiconductor integrated circuits. Foundries and integrators employ high-pressure dust control primarily due to the extremely complex and sophisticated manufacturing processes, resulting in varying degrees of process control and equipment control capabilities among various manufacturers. As auxiliary cleaning equipment for front-end and back-end processes, rapid cleaning and dust fallback prevention are crucial. However, during wafer cassette transport, both equipment utilize high-pressure dust removal, potentially resulting in higher pressure on one side and dust fallback within the handling equipment. This invention addresses this issue. Summary of the Invention

[0004] 1. Purpose of the invention

[0005] The present invention provides a backflow system for wafer box transport equipment to achieve the best dust prevention purpose.

[0006] 2. The technical solution adopted by the present invention.

[0007] The present invention proposes a backflow system for wafer box handling equipment, which includes a frame, a No. 1 air filter unit, a No. 2 air filter unit, a baffle connector, a lifting baffle and a sealed cabin box. The sealed cabin box is installed on the frame, the No. 2 air filter unit is located on the lower side of the sealed cabin box and is locked under the sealed cabin box to provide filtered air for the sealed cabin. The lifting baffle is installed on the side of the sealed cabin box through two baffle connectors, which effectively avoids direct contact between the lifting baffle and the sealed cabin and avoids dust generation caused by friction between the lifting baffle and surrounding structures; the No. 1 air filter unit is located on the top of the frame, and the No. 1 air filter unit and the No. 2 air filter unit are respectively located on both sides of the lifting baffle.

[0008] Furthermore, the frame is also equipped with an air passage plate and an axial flow fan. The air passage plate is provided with air outlet holes. The air passage plate is fixedly mounted on the frame and close to the sealed cabin box to form a closed space. The axial flow fan is installed at the bottom of the frame.

[0009] Further, when the sealed cabin is in the lowered state, the second air filtering unit continuously supplies filtered air into the sealed cabin, at this time, the air in the cabin flows to the space behind the equipment through the air flow plate, and then is extracted to the bottom of the machine table through the axial flow fan, forming a first air flow circulation.

[0010] Further, the side of the lifting baffle plate is also provided with a plurality of guide wheels, which cooperate with the baffle plate connecting piece to reduce the friction between the lifting baffle plate and the side of the sealed cabin.

[0011] Further, the first air filtering unit and the second air filtering unit are arranged in opposite directions.

[0012] Further, when the sealed cabin is in the raised state, the second air filtering unit continuously supplies filtered air, which is blown to the bottom of the wafer box positioning platform, and then dispersed to the surrounding to fill the sealed cabin to form a positive pressure, at this time, the opening direction of the sealed cabin is the gas exhaust port, forming a second air flow circulation, so that the possible particles in the cabin are discharged along the circulation.

[0013] Further, in order to avoid the situation that the internal particles of the connected process equipment are blown to the device due to excessive internal positive pressure, a first air filtering unit is installed, which forms a wind curtain-like air flow between the device and the process equipment.

[0014] 3, the technical effect produced by the application.

[0015] The application designs stable air flow circulation in the lowered and raised states of the sealed cabin, and the air filtering unit is composed of a U16 grade filter screen and a speed-adjustable centrifugal fan, which provides stable and reliable air supply for air flow circulation, and an additional air filtering unit is added to further prevent the possibility of external particle pollution of the wafer; some areas that may produce dust, such as the lifting baffle plate, are optimized in structure, and for example, the Z-axis area with a high probability of dust production is isolated in structure design to avoid the diffusion of particles to the sealed cabin area; at the same time, the structure lubrication of the device is all high-standard dust-free special lubricating grease, and the wiring part also adopts special dust-free drag chain to cover the wiring. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 is a sealed cabin structure schematic diagram

[0017] Fig. 2 is a sealed cabin air flow circulation structure schematic diagram (closed state).

[0018] Fig. 3 is a sealed cabin air flow circulation structure schematic diagram (open state).

[0019] The serial number in the figure is explained: 1, rack, 2, sealed cabin, 3, first air filtering unit, 4, second air filtering unit, 5, baffle plate connecting piece, 6, lifting baffle plate, 7, air flow plate, 8, axial flow fan. DETAILED DESCRIPTION

[0020] Example

[0021] The present invention proposes a backflow system for wafer box transport equipment, combined with Figs. 1-3 The backflow system includes a frame 1, an air filter unit No. 1 3, an air filter unit No. 2 4, a baffle connector 5, a lifting baffle 6 and a sealed cabin 2. The sealed cabin 2 is installed on the frame, the air filter unit No. 2 3 is located at the lower side of the sealed cabin 2 and is locked under the sealed cabin 2 to provide filtered air for the sealed cabin 2. The lifting baffle 6 is installed on the side of the sealed cabin 2 through two baffle connectors 5, which effectively avoids direct contact between the lifting baffle 6 and the sealed cabin 2, and avoids the friction and dust generation caused by the lifting baffle 6 and the surrounding structures; the air filter unit No. 1 3 is located at the top of the frame, and the air filter unit No. 1 3 and the air filter unit No. 2 4 are respectively located on both sides of the lifting baffle.

[0022] The frame 1 is also provided with an air passage plate 7 and an axial flow fan 8. The air passage plate 7 is provided with an air outlet. The air passage plate 7 is fixedly mounted on the frame 1 and is close to the sealed cabin 2 so that the sealed cabin 2 forms a closed space. The axial flow fan 8 is mounted at the bottom of the frame 1.

[0023] When the sealed cabin 2 is in the lowered state, the No. 2 air filter unit 4 continuously delivers filtered air into the sealed cabin box. At this time, the gas in the cabin flows to the space behind the equipment through the air plate 7, and is then drawn out to the bottom of the machine through the axial flow fan 8, forming the first air flow circulation.

[0024] The side of the lifting baffle 6 is also equipped with multiple sets of guide wheels, which cooperate with the baffle connecting parts to reduce the friction between the lifting baffle 6 and the side of the sealed cabin box.

[0025] The first air filter unit 3 and the second air filter unit 4 are arranged in opposite directions.

[0026] When the sealed cabin 2 is in the raised state, the No. 2 air filter unit 4 continuously delivers filtered air, blows it to the bottom of the wafer box landing platform, and then radiates it to the surroundings to fill the sealed cabin body to form a positive pressure. At this time, the direction of the opening of the sealed cabin body is the gas vent, forming a second airflow circulation, so that any particles in the cabin can be discharged along this circulation.

[0027] In order to prevent the internal positive pressure of the connected process equipment from being too high and blowing the internal particles into our equipment, an air filter unit No. 1 3 was installed to form a wind curtain-like airflow between our equipment and the process equipment.

[0028] In the description of the specification, reference to "one embodiment", "an example", "a specific example" or the like means that a particular feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. The appearances of the phrases "in one embodiment", "an example", "a specific example" or the like in various places in the specification are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0029] The preferred embodiments of the application disclosed above are only to help explain the application. The preferred embodiments do not describe all the details of the application and limit the application to the specific embodiments described. Obviously, many modifications and variations can be made in light of the contents of the specification. The specification selects and specifically describes these embodiments in order to better explain the principles and practical application of the application, so that those skilled in the art can well understand and utilize the application. The application is limited only by the claims and their full scope and equivalents.

Claims

1. A backflow system for wafer cassette transport equipment, characterized by: The backflow system includes a rack, No. 1 air filter unit, No. 2 air filter unit, baffle connector, lifting baffle and sealed cabin box. The sealed cabin box is installed on the rack. No. 2 air filter unit is located on the lower side of the sealed cabin box and is locked under the sealed cabin box to provide filtered air for the sealed cabin box. The lifting baffle is installed on the side of the sealed cabin box through two baffle connectors, which effectively avoids direct contact between the lifting baffle and the sealed cabin and avoids the friction and dust generation that may be caused by the lifting baffle and the surrounding structure. The No. 1 air filter unit is located on the top of the rack, and the No. 1 air filter unit and the No. 2 air filter unit are located on both sides of the lifting baffle respectively. The frame is also equipped with an air plate and an axial flow fan. The air plate is provided with an air outlet. The air plate is fixedly mounted on the frame and is close to the sealed cabin box body to form a closed space. The axial flow fan is installed at the bottom of the frame. When the sealed cabin is in the raised state, the No. 2 air filter unit continuously delivers filtered air to the bottom of the wafer box landing platform, and then diffuses it to the surrounding area to fill the sealed cabin box to form a positive pressure. At this time, the direction of the sealed cabin box opening is the gas vent, forming a second airflow cycle, so that any particles in the cabin can be discharged along this cycle; The side of the lifting baffle is also equipped with multiple sets of guide wheels, which cooperate with the baffle connector to reduce the friction between the lifting baffle and the side of the sealed cabin box; In order to prevent the internal positive pressure of the connected process equipment from being too high and blowing the internal particles into the backflow system of the wafer box handling equipment, a No. 1 air filter unit is installed to form a wind curtain-like airflow between the backflow system of the wafer box handling equipment and the process equipment.

2. The backflow system for wafer box transport equipment according to claim 1, characterized in that: When the sealed cabin is in the lowered state, the No. 2 air filtration unit continuously supplies filtered air into the sealed cabin. At this time, the gas in the cabin flows through the air plate to the space behind the equipment, and is then drawn out to the bottom of the machine through the axial flow fan, forming the first air flow circulation.

3. The backflow system for wafer box transport equipment according to claim 1, characterized in that: The first air filter unit and the second air filter unit are arranged in opposite directions.

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