A laser cutting method

Abstract

This invention discloses a laser cutting method, which includes hot-pressing a structure to be cut, applying an adhesive to a predetermined cutting area of ​​the hot-pressed structure, and finally cutting the hot-pressed and adhesive-coated structure using a laser cutting method. Through these steps, this invention improves the density of the structure to be cut, reduces the surface area exposed to oxygen, and effectively prevents discoloration or even shrinkage of the material due to high-temperature burning during the cutting process. This improves the smoothness and aesthetics of the cut of the final product, resulting in a higher yield rate.

Description

Technical Field

[0001] This invention relates to the field of product processing technology, specifically to a laser cutting method. Background Technology

[0002] Charging cables are essential components for wired charging of electronic products. In daily life, mobile phones, tablets, and other electronic devices mainly rely on charging cables for charging. As the frequency of electronic product use increases, the daily demand for charging also rises.

[0003] During the manufacturing process of charging cables, the ends of the wires need to be cut to ensure a neat finish for welding. Due to the small diameter of the wires, laser cutting is often used to ensure overall processing accuracy and efficiency. However, for wires made of materials with low ignition points, laser cutting directly vaporizes the material, which can cause the cut portion of the wire to shrink and turn black. For wires with a relatively loose structure, the heated areas can curl, resulting in uneven cuts and poor appearance. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a laser cutting method that ensures that the wire does not shrink, turn yellow or black during the cutting process, so that the finished wire has a neat cut and a good appearance.

[0005] This invention provides a laser cutting method for cutting wires with a braided structure, the laser cutting method comprising:

[0006] Provide the structure to be cut;

[0007] The structure to be cut is hot-pressed;

[0008] Apply the colloid to the predetermined cutting area of ​​the structure to be cut;

[0009] Laser cutting of the structure to be cut.

[0010] Furthermore, the hot pressing of the structure to be cut includes:

[0011] Hot-pressed for 5 seconds at 210℃ and 0.2MPa-0.8MPa pressure.

[0012] Further, applying the adhesive to the predetermined cutting area of ​​the structure to be cut includes:

[0013] Apply a predetermined thickness of adhesive to the pre-cut area using a dispensing machine.

[0014] Furthermore, the main component of the colloid is acrylate.

[0015] Furthermore, the laser cutting of the structure to be cut includes:

[0016] Check whether the colloid has cured;

[0017] Make a first incision along the extension direction of the structure to be cut;

[0018] Cut a second incision that intersects with the first incision.

[0019] Furthermore, the structure to be cut includes a conductor and a wrapping layer covering the outside of the conductor.

[0020] Furthermore, the wrapping layer includes an outer sheath layer close to the conductor and a braided layer wrapping the outer sheath layer, wherein the braided layer has a braided structure.

[0021] Furthermore, the predetermined thickness is greater than or equal to the thickness of the braided layer.

[0022] Furthermore, the outer coating layer is made of silicone.

[0023] Furthermore, the braided layer is polyethylene terephthalate.

[0024] This invention discloses a laser cutting method, which includes hot-pressing a structure to be cut, applying an adhesive to a predetermined cutting area of ​​the hot-pressed structure, and finally cutting the hot-pressed and adhesive-coated structure using a laser cutting method. Through these steps, this invention improves the density of the structure to be cut, reduces the surface area exposed to oxygen, and effectively prevents discoloration or even shrinkage of the material due to high-temperature burning during the cutting process. This improves the smoothness and aesthetics of the cut of the final product, resulting in a higher yield rate. Attached Figure Description

[0025] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings, in which:

[0026] Figure 1 This is a three-dimensional structural diagram of the structure to be cut provided in the comparative example of the present invention;

[0027] Figure 2 This is a three-dimensional structural diagram of the structure to be cut provided in an embodiment of the present invention;

[0028] Figure 3 This is a flowchart of the laser cutting method provided in the embodiments of the present invention;

[0029] Figure 4 This is a schematic diagram of a cutting process for a structure to be cut, provided in an embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1-Conductor; 2-Outer sheath; 3-Braided layer; 4-Wrapping layer; 5-First cut; 6-Second cut. Detailed Implementation

[0032] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0033] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0034] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0036] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0037] Figure 1 This is a three-dimensional structural diagram of the structure to be cut, provided as a comparative example of the present invention. For example... Figure 1As shown, the structure to be cut in the comparative example includes a conductor 1 and an outer sheath 2 wrapped around the conductor 1. The conductor 1 is made of metal, such as copper or aluminum, and is used to conduct electrical signals. The outer sheath 2 is made of TPU (Thermoplastic polyurethanes). The outer sheath 2 is mainly used to wrap and protect the conductor 1. However, the hardness range of TPU is Shore A 60A to 70D, which is in the medium to high hardness range. While it can provide support and protection for the internally wrapped conductor 1, it is not easy for users to bend during use. Furthermore, although TPU has good processing performance, the finished product has a relatively rough feel and high frictional resistance, which reduces the user experience. In addition, although TPU has good weather resistance, under sunlight, it easily reacts with negative ions in the air, causing the finished product to age and discolor, significantly reducing its lifespan.

[0038] In view of the above-mentioned shortcomings of the structure to be cut provided in the comparative example, in order to improve the user experience of the structure to be cut after processing and forming, the present invention provides a structure to be cut. Figure 2 This is a three-dimensional structural diagram of the structure to be cut according to an embodiment of the present invention. The structure to be cut includes a conductor 1 and a wrapping layer 4 wrapped around the outside of the conductor 1. The conductor 1 is made of metal, such as copper or aluminum. The conductor 1 is used to conduct electrical signals. The wrapping layer 4 includes an outer sheath 2 close to the conductor 1 and a braided layer 3 wrapping the outer sheath 2.

[0039] The outer layer 2 is made of silicone, with a Shore hardness range of 0A to 70D, which is softer than TPU, making the finished cable easier to bend. Furthermore, silicone's safe temperature range is generally between -55°C and 300°C, allowing the finished product constructed from the silicone-encased structure to withstand various extreme environments. Even if the internal conductor 1 malfunctions and begins to heat up, it will not quickly cause the silicone to ignite, resulting in high product safety. This high safety allows for the use of fewer conductors 1 to produce a standard charging cable, or more conductors 1 to produce a fast charging cable. In addition, silicone is less prone to aging and discoloration than TPU, offering better durability.

[0040] Furthermore, the woven layer 3 wrapped around the outer layer 2 is made of PET (polyethylene glycol terephthalate). Specifically, the woven layer 3 is formed by weaving a synthetic fiber (also known as polyester fiber) obtained by spinning polyester, which is a product of the condensation polymerization of organic diacids and diols, into a mesh structure. Due to its woven structure, the woven layer 3 has good flexibility, which, when combined with silicone, gives the overall structure good bendability. Its material properties also contribute to excellent wrinkle resistance, elasticity, and dimensional stability in the finished product. In addition, PET has good electrical insulation properties, which, when combined with silicone, further enhances the safety of the finished product. Furthermore, PET is resistant to sunlight and abrasion, exhibiting good durability and a long service life.

[0041] The woven layer 3 is a woven structure composed of interwoven PET fibers. Its structure is soft, with large gaps between adjacent fibers and a certain degree of elasticity, which can enhance the user's visual and tactile experience. However, the structure to be cut is generally processed using high-precision, high-efficiency laser cutting. Laser cutting uses a focused, high-power-density laser beam to irradiate the predetermined cutting area of ​​the structure to be cut, causing the material at the irradiated area to rapidly melt, vaporize, ablate, or reach its ignition point. Simultaneously, a high-speed airflow coaxial with the beam blows away the molten material, achieving the cutting of the material. The loose structure of the outermost woven layer 3 of the structure to be cut can easily lead to cutting deviations, reducing product yield. Furthermore, PET has a low ignition point and strong shrinkage. The gaps between the woven PET fibers result in a large contact area between each PET fiber and oxygen. The high temperature generated by laser cutting can easily cause the PET fibers at the cut to vaporize, producing burrs and curling, further resulting in an uneven cut. In addition, the high temperature can also lead to combustion. When organic matter burns, it produces inorganic particles such as black smoke. These particles adhere to the woven layer 3, causing it to turn black or yellow, resulting in poor appearance.

[0042] In view of this, the present invention provides a laser cutting method that ensures that the cut of the structure to be cut will not curl or turn black when cutting a structure containing PET fibers. Figure 3 This is a flowchart of the laser cutting method provided in an embodiment of the present invention. Figure 3 As shown, the laser cutting method provided in this embodiment of the invention includes the following steps S100-S400:

[0043] Step S100: Provide the structure to be cut

[0044] Structure to be cut, such as Figure 2 As shown, the specific material and structure of the structure to be cut are as described above. The structure to be cut includes a conductor 1 and a wrapping layer 4 surrounding the conductor 1. The wrapping layer 4 includes an outer sheath 2 close to the conductor 1 and a braided layer 3 surrounding the outer sheath 2.

[0045] Step S200: Hot-press the structure to be cut

[0046] The high temperature and high pressure environment makes the structure of the wrapping layer 4 of the structure to be cut dense.

[0047] Step S300: Apply colloid to the predetermined cutting area of ​​the structure to be cut.

[0048] Anaerobic adhesive is applied to the predetermined cutting area of ​​the structure to be cut using a dispensing machine to further increase the density of the coating layer 4 and give it higher hardness.

[0049] Step S400: Laser cut the structure to be cut

[0050] The structure to be cut is coated with colloid and cut using laser cutting equipment.

[0051] The purpose of step S200 is to reduce the gap between the structures to be cut, thereby reducing the contact area between the structures and oxygen, and avoiding deformation or even discoloration caused by high-temperature burning during laser cutting. The metal conductor 1 and the silicone outer layer 2 have relatively dense structures and high melting points. The PET braided layer 3, on the other hand, has a relatively loose structure and can withstand temperatures up to 220°C. Therefore, step S200 mainly increases the density of the braided layer 3.

[0052] Specifically, since PET can withstand temperatures up to 220°C, a higher hot-pressing temperature, without exceeding 220°C, will shorten the processing time. In this embodiment, the hot-pressing temperature is 210°C, and the hot-pressing time is 5 seconds. The equipment is actually maintained at 210±3°C, thus ensuring a constant temperature profile for the structure to be cut and improving the reliability of the hot-pressing process.

[0053] To better compress the structure of the braided layer 3, the air pressure of the hot press is set at 0.3-0.8 MPa, preferably 0.2 MPa-0.8 MPa. This pressure setting allows the braided layer 3 to reduce its volume and voids while also ensuring it adheres tightly to the outer layer 2, improving the bonding between the two. It also reduces the voids between the braided layer 3 and the outer layer 2, preventing the braided layer 3 from liquefying or vaporizing during laser ablation.

[0054] After hot pressing at 210℃ and 0.2MPa-0.8MPa for 5 seconds, the diameter of the structure to be cut before hot pressing was 3.05mm, and the diameter of the structure to be cut after hot pressing was compressed to 2.8mm-2.95mm. The diameter compression ratio of the structure to be cut before and after hot pressing was 91.8% to 96.7%. The density of the braided layer 3 before hot pressing was 100kg / m3-200kg / m3, and the density of the braided layer 3 after hot pressing was 500kg / m3-650kg / m3. The density ratio of the braided layer 3 before and after hot pressing was 2.5% to 6.5%. It can be seen that the loose structure of the braided layer 3 was changed to a certain extent, thereby reducing the contact area between the braided layer 3 and oxygen, shortening the PET burning time, reducing black smoke, and mitigating the blackening and yellowing of the finished product.

[0055] In some embodiments, the hot pressing temperature can be reduced and the hot pressing time extended, depending on the thickness of the braided layer 3 and the hot pressing equipment.

[0056] The purpose of step S300 is to further reduce the gaps in the braided layer 3, preventing it from burning and vaporizing during laser cutting. Furthermore, the cured colloid gives the braided layer 3 a certain degree of rigidity, which can prevent misalignment during cutting and reduce curling.

[0057] In this embodiment, a dispensing machine is used to apply a predetermined thickness of adhesive to a predetermined cutting area. To ensure that the braided layer 3, located away from the predetermined cutting area, remains loose, the predetermined cutting area extends circumferentially by at least 0.5 mm from the cut location. In actual production, the thicker the adhesive, the greater the required laser energy. Therefore, the adhesive thickness is maintained between 0.05 and 0.2 mm, with an optimal thickness of 0.1 mm. In this embodiment, the predetermined thickness is greater than or equal to the thickness of the braided layer 3, allowing the braided layer 3 to be completely immersed in the adhesive, achieving the effect of adhesive-reinforced braided layer 3.

[0058] In this embodiment, the colloid is an anaerobic adhesive that can cure at room temperature and possesses good heat resistance, vibration resistance, and micropore sealing properties. The colloid mainly contains monomers, initiators, accelerators and co-accelerators, stabilizers, dyes, and fillers. The monomers comprise 80%-95% by mass, and are acrylates. The anaerobic adhesive inhibits curing in an oxygen-rich environment; therefore, when the adhesive overflows the predetermined cutting area, it will not cure as long as that portion comes into contact with air and can be easily wiped away with a common solvent (such as acetone or isopropanol).

[0059] Furthermore, the colloidal brand used in this embodiment of the invention is Loctite 438, and the manufacturer is Henkel Loctite.

[0060] In some embodiments, other types of adhesives may be used, provided that the adhesive can cure within the braided layer 3 and enhance the strength of the braided layer 3. Furthermore, the adhesive may be applied in other ways, such as by manual dispensing.

[0061] Step S400 is the step of cutting the structure to be cut using laser cutting, which mainly includes inspecting the structure to be cut and making the cut.

[0062] Step S400 specifically includes the following steps S410-S430:

[0063] Step S410: Check whether the colloid has cured;

[0064] Visually inspect or use instruments to check whether the colloid has cured, and test whether the hardness of the predetermined cutting area is higher than that of the structure to be cut after the colloid has been applied.

[0065] Step S420: Make a first cut 5 along the extension direction of the structure to be cut;

[0066] The extension direction of the first cut 5 is the same as the extension direction of the structure to be cut.

[0067] Step S430: Cut a second cut 6 that intersects with the first cut 5.

[0068] The second cut surrounds the structure to be cut. In this embodiment, the first cut 5 is perpendicular to the second cut 6.

[0069] Figure 4 This is a schematic diagram of a cutting structure provided in an embodiment of the present invention. When the user only needs to remove the outer wrapping layer 4 of the conductor 1, a first cut 5 and a second cut 6 are cut using laser cutting, and the depth of both cuts is equal to the thickness of the wrapping layer 4.

[0070] When the user needs to cut the entire structure to be cut, the second cut 6 is cut directly using laser cutting, and the cutting depth is greater than or equal to half the diameter of the entire structure.

[0071] In this embodiment of the invention, the density of the originally loosely structured braided layer 3 is first increased through a hot-pressing process, reducing the large gaps caused by the loose structure and mitigating the high-temperature vaporization phenomenon during the cutting process. Then, an adhesive is applied to the predetermined cutting area to increase the hardness of the braided layer 3 within that area, preventing it from curling or shifting during cutting. The adhesive is also filled into the gaps in the braided layer 3 within the predetermined cutting area, preventing contact between the braided layer 3 and oxygen, further reducing the area of ​​the braided layer 3 burned by the high temperature of the laser. These steps achieve non-destructive cutting of the structure to be cut, ensuring that the finished product is free of curling, has a smooth cut, and significantly improves the appearance of the cut surface, which may appear black or yellow.

[0072] In this embodiment of the invention, the structure to be cut is a data cable, charging cable, or other connecting cable of 3C (Computer, Communication, Consumer Electronics products). In other embodiments, this laser cutting method can also be applied to other wires, data transmission lines, etc., that require laser cutting to divide or partially strip the outer sheath 4. Only the hot-pressing parameters need to be adjusted according to the material and thickness of the sheath 4, and the thickness of the adhesive needs to be adjusted according to the thickness of the braided structure, so that the adhesive can wrap the braided structure.

[0073] This invention discloses a laser cutting method, which includes hot-pressing a structure to be cut, applying an adhesive to a predetermined cutting area of ​​the hot-pressed structure, and finally cutting the hot-pressed and adhesive-coated structure using a laser cutting method. Through these steps, this invention improves the density of the structure to be cut, reduces the surface area exposed to oxygen, and effectively prevents discoloration or even shrinkage of the material due to high-temperature burning during the cutting process. This improves the smoothness and aesthetics of the cut of the final product, resulting in a higher yield rate.

[0074] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser cutting method for cutting wires with a braided structure, characterized in that, The laser cutting method includes: A structure to be cut is provided, the structure to be cut includes a conductor (1) and a wrapping layer (4) wrapped around the outside of the conductor (1), the wrapping layer (4) includes an outer sheath (2) close to the conductor (1) and a braided layer (3) wrapping the outer sheath (2), wherein the braided layer (3) is a braided structure and the braided layer (3) is polyethylene terephthalate; The structure to be cut is hot-pressed for 5 seconds at 210℃ and 0.2MPa-0.8MPa pressure; An adhesive is applied to the predetermined cutting area of ​​the structure to be cut, wherein the main component of the adhesive is acrylate; Laser cutting of the structure to be cut.

2. The laser cutting method according to claim 1, characterized in that, The process of applying the adhesive to the predetermined cutting area of ​​the structure to be cut includes: Apply a predetermined thickness of adhesive to the pre-cut area using a dispensing machine.

3. The laser cutting method according to claim 1, characterized in that, The laser cutting of the structure to be cut includes: Check whether the colloid has cured; Make a first cut (5) along the extension direction of the structure to be cut. Cut a second cut (6) that intersects with the first cut (5).

4. The laser cutting method according to claim 2, characterized in that, The predetermined thickness is greater than or equal to the thickness of the braided layer (3).

5. The laser cutting method according to claim 1, characterized in that, The outer coating layer (2) is silicone.

Images