Rapid drying device for electronic material manufacturing

Abstract

The application discloses a kind of quick drying device for electronic material manufacturing, applied in electronic material drying technical field, the application is by being provided with support column, storage tray, partition component and sealing assembly, support column can be fixed to storage tray, then partition component can be divided into several uniform spaces in storage tray, can realize the uniform distribution of electronic material placement, by being provided with drying assembly, flow component and turbulence component, drying assembly can be baked to the bottom of storage tray, so that heat is transferred to the bottom of electronic material in storage tray for drying, at this time, partition component rotates, so that electronic material rotates or flips, and is uniformly dried, hot air can enter the inside of partition component by flow component.

Description

Technical Field

[0001] This invention belongs to the field of electronic material drying technology, and specifically relates to a rapid drying device for electronic material manufacturing. Background Technology

[0002] Electronic materials refer to materials used in electronic and microelectronic technologies, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloys, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials, and other related materials. Electronic materials are the material basis for the development of modern electronic industry and science and technology, and at the same time, they are a technology-intensive discipline in the field of science and technology. Electronic materials come in a variety of shapes, such as granular and thin film materials.

[0003] Currently, Chinese invention patent CN112985000B discloses a rapid drying device for solid microparticle materials, including a vacuum assembly with an external vacuum pump and a container assembly located within the vacuum assembly for holding solid microparticle materials. The container assembly includes a sealed container lid and a container base. A microporous conduit is provided on the container lid for inserting solid microparticle materials and connecting the container assembly and the vacuum assembly. A stirring rotor with an external variable-speed motor is located inside the container base. The stirring rotor is equipped with guide vanes. This invention utilizes the stirring rotor guide vanes and microporous conduits to avoid the problem of prolonged drying time caused by increased material accumulation thickness. It also facilitates the rapid discharge of water inside the solid material accumulation through the microporous conduits, thus accelerating the drying speed. The container assembly is separate from the vacuum assembly, which helps prevent contamination of the vacuum assembly by different solid microparticle materials being dried.

[0004] Existing rapid drying equipment for electronic material manufacturing has the following disadvantages when in use:

[0005] 1. When drying electronic materials, the layout and arrangement of electronic materials cannot be reasonably arranged, sufficient spacing between electronic materials cannot be ensured, and overly dense stacking of electronic materials cannot be avoided.

[0006] 2. When electronic materials are dried by hot air, the drying rate of the surface in contact with the hot air is relatively fast, which can affect the uniformity of the electronic materials. Summary of the Invention

[0007] The purpose of this invention is to address a conventional rapid drying apparatus for electronic material manufacturing, the advantages of which are:

[0008] 1. Electronic materials can be evenly distributed in the storage tray according to their quantity, avoiding overly dense stacking of electronic materials;

[0009] 2. When granular electronic materials are dried by hot air, they can be turned and stirred, which can expose the wet parts to the dry surface and promote the evaporation of moisture.

[0010] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a rapid drying device for manufacturing electronic materials, comprising a base plate and a drying mechanism, wherein a storage mechanism is provided on the top of the base plate, the storage mechanism includes a support column, a storage tray is provided on the top of the support column, a partitioning component is provided in the storage tray to enable uniform distribution of electronic materials, a sealing component is provided on the top of the storage tray to prevent temperature diffusion in the storage tray, the drying mechanism is provided on the lower surface of the storage tray, the drying mechanism includes a drying component, the drying component is used in conjunction with the partitioning component, a flow component is provided above the drying component, a turbulence component is provided above the flow component, and both the flow component and the turbulence component are provided inside the partitioning component.

[0011] The above technical solution utilizes a base plate for support and fixation, a storage mechanism for partitioned placement of electronic materials to prevent accumulation, and a drying mechanism for rapid drying. Furthermore, the support columns, storage trays, partitioning components, and sealing components ensure uniform distribution of electronic materials. The support columns secure the storage trays, the partitioning components divide the trays into uniform spaces, and the sealing components retain heat from the hot air within the trays, preventing heat loss. The sealing components can be opened or closed to allow electronic materials to be placed inside. When placing or removing the tray, the drying component, flow component, and turbulence component are used. The drying component bakes the bottom of the storage tray, transferring heat to the bottom of the electronic materials inside for drying. At the same time, the partition component rotates, causing the electronic materials to rotate or tumble for uniform drying. Hot air enters the interior of the partition component through the flow component, and the rotation of the partition component diffuses the heat into the interior of the storage tray, drying the surface of the electronic materials. Meanwhile, the turbulence component agitates the air in the storage tray as the partition component rotates, causing airflow inside the storage tray, which helps to eliminate local temperature and humidity differences and improve the uniformity of drying.

[0012] The present invention is further configured such that: the partitioning component includes a rotating rod, partitioning disks, and a motor; the rotating rod bearing is sealed in the storage disk; both ends of the rotating rod penetrate the storage disk; the partitioning disks are disposed on the rotating rod; the number of partitioning disks is eight and they are arranged circumferentially; the partitioning disks divide the internal space of the storage disk into eight placement areas; the motor is disposed at one end of the rotating rod; the cross-section of the partitioning disk is trapezoidal; and the partitioning disks are hollow.

[0013] By adopting the above technical solution, a rotating rod, a partition disk, and a motor are set up. The partition disk evenly divides the internal space of the storage disk into eight parts, which allows electronic materials to be placed evenly in the storage disk. Then, the rotating rod is connected to the partition disk, and the output shaft of the motor drives the rotating rod and the partition disk to rotate. The rotation of the partition disk can flip or rotate the electronic materials inside the storage disk, so as to dry the electronic materials evenly.

[0014] The present invention is further configured such that: the sealing assembly includes an inlet and a sealing cover, the inlet is opened on the upper surface of the storage tray, the number of inlets is eight and arranged in a circle, the inlets are arranged corresponding to the eight placement areas into which the internal space of the storage tray is divided by the partition tray, and the sealing cover is hinged to the surface of the inlet.

[0015] By adopting the above technical solution, and by setting up an inlet and a sealing cover, electronic materials can be placed into the storage tray through the inlet when the sealing cover is opened. By setting up eight inlets, which correspond to the eight placement areas that divide the internal space of the storage tray into, the electronic materials can be evenly placed into the inside of the storage tray. Then, by closing the sealing cover, the inlet can be sealed to prevent heat loss from the storage tray and to better dry the electronic materials in the storage tray.

[0016] The present invention is further configured such that: the drying assembly includes a hot air blower, a connecting pipe and a drying chamber, the hot air blower is disposed on the upper surface of the base plate, one end of the connecting pipe is disposed on the output end of the hot air blower, the drying chamber is disposed on the other end of the connecting pipe, and the drying chamber is fixedly connected to the lower surface of the storage tray.

[0017] By adopting the above technical solution, a hot air blower, a connecting pipe, and a drying chamber are set up. First, the hot air blower is an existing technology that can heat the outside air to form a hot airflow. Then, the hot airflow is transmitted to the drying chamber through the connecting pipe, so that the hot airflow fills the drying chamber. Since the drying chamber is connected to the bottom of the storage tray, heat can be transferred to the inside of the storage tray through heat transfer, thereby drying the electronic materials inside the storage tray.

[0018] The present invention is further configured such that: the flow component includes a flow cavity, an inlet hole and an outlet hole, the flow cavity is opened inside the rotating rod, one end of the rotating rod extends into the interior of the drying cavity, the inlet hole is opened on the surface of the rotating rod, the number of inlet holes is several and arranged circumferentially, the inlet holes are correspondingly arranged with the partition plate, and the outlet hole is arranged on the surface of the partition plate, the number of outlet holes is several and arranged linearly.

[0019] By adopting the above technical solution, a flow cavity, an inlet hole, and an outlet hole are set up. The flow cavity is set in the rotating rod. When the drying cavity is filled with hot air, hot air continues to be introduced. The hot air will enter the interior of the partition plate along the flow cavity and the inlet hole. Then, by rotating the partition plate, the electronic materials inside the storage plate are rotated, and the hot air inside the partition plate is thrown out through the outlet hole to dry the sides of the electronic materials, thereby achieving uniform drying of the electronic materials.

[0020] The present invention is further configured such that: the spoiler assembly includes a spoiler plate and a through hole, the spoiler plate is disposed on the surface of the rotating rod, the spoiler plate is hollow, the number of spoiler plates is four and they are arranged circumferentially on the surface of the rotating rod, and the through hole is disposed at the contact point between the spoiler plate and the rotating rod.

[0021] By adopting the above technical solution, a baffle and through holes are set up. The baffle is connected to the rotating rod. When the rotating rod rotates, it can drive the baffle to rotate. The baffle can agitate the airflow inside the storage tray, allowing the air inside the storage tray to circulate. This helps to eliminate local temperature and humidity differences and improve the uniformity of drying. At the same time, the hot airflow in the flow cavity can enter the baffle through the through holes and be discharged downwards into the storage tray, thereby drying the upper surface of the electronic material. At this time, the electronic material can be dried simultaneously from all sides, ensuring the uniformity of drying.

[0022] The present invention is further configured such that: a flow guide baffle is provided inside the flow cavity, the flow guide baffle is conical, and the flow guide baffle is correspondingly provided with the inlet hole.

[0023] By adopting the above technical solution, the backflow baffle can guide the hot airflow in the flow cavity, allowing part of the hot airflow to enter the interior of the partition plate, while the other part of the hot airflow continues to move upward and enters the interior of the baffle.

[0024] The present invention is further configured such that: the upper surface of the storage tray is provided with a pressure relief valve for balancing the air pressure inside and outside the storage tray, and the number of pressure relief valves is two and they are arranged symmetrically.

[0025] By adopting the above technical solution and setting a pressure relief valve, the pressure inside the storage disk can be adjusted to prevent hot air from continuously entering the storage disk. Excessive pressure inside the storage disk can easily affect the performance of electronic materials.

[0026] The invention is further configured such that: the bottom of the support column is welded to the base plate, and the partition plate is in contact with and rotatably connected to the inner bottom of the storage plate.

[0027] By adopting the above technical solution, and by setting the position of the support column and the connection relationship between the partition disk and the storage disk, the support column can support and fix the storage disk, the partition disk can rotate in the storage disk, and the electronic materials between the partition disks can be rotated or agitated.

[0028] The invention is further configured such that: the spoiler is disposed above the partition disk, and the spoiler and the partition disk are configured to correspond to the eight placement areas into which the internal space of the storage disk is divided.

[0029] By adopting the above technical solution, the position of the spoiler is set above the partition disk, which can circulate the air above the partition disk, and the hot air in the spoiler flows downward and can directly act on the upper surface of the electronic material.

[0030] In summary, the present invention has the following beneficial effects:

[0031] By setting a base plate, it can provide support and fixation. By setting a storage mechanism, electronic materials can be placed in sections to avoid the accumulation of electronic materials. By setting support columns, storage trays, partitioning components and sealing components, the support columns can fix the storage trays, and the partitioning components can divide the interior of the storage trays into several uniform spaces, so as to achieve uniform distribution of electronic materials.

[0032] By incorporating a drying component, a flow component, and a turbulence component, the drying component can bake the bottom of the storage tray, transferring heat to the bottom of the electronic materials inside for drying. At the same time, the partition component rotates, causing the electronic materials to rotate or tumble for uniform drying. Hot air can enter the interior of the partition component through the flow component, and the rotation of the partition component diffuses the heat into the interior of the storage tray, drying the surface of the electronic materials. Simultaneously, the turbulence component agitates the air in the storage tray as the partition component rotates, causing airflow inside the storage tray, which helps to eliminate local temperature and humidity differences and improve the uniformity of drying. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0034] Figure 2 This is a schematic diagram of the drying mechanism and storage mechanism of the present invention;

[0035] Figure 3 This is a schematic diagram of the drying assembly of the present invention;

[0036] Figure 4 This is a schematic diagram of the storage tray, motor, and sealing cover of the present invention;

[0037] Figure 5 This is the present invention. Figure 4 The front view;

[0038] Figure 6 This is the present invention. Figure 5 3D cross-sectional view at point AA;

[0039] Figure 7 This is a schematic diagram of the rotating rod, partition disk, and ejection hole of the present invention;

[0040] Figure 8 This is a schematic diagram of the rotating rod, inlet hole, and outlet hole of the present invention;

[0041] Figure 9 This is the invention Figure 6 Enlarged view of point A in the middle.

[0042] Reference numerals: 1. Base plate; 2. Drying mechanism; 3. Storage mechanism; 4. Guide baffle; 5. Pressure relief valve; 201. Drying assembly; 202. Flow assembly; 203. Turbulence assembly; 301. Support column; 302. Storage tray; 303. Partition assembly; 304. Sealing assembly; 2011. Hot air blower; 2012. Connecting pipe; 2013. Drying chamber; 2021. Flow chamber; 2022. Inlet hole; 2023. Spray hole; 2031. Turbulence plate; 2032. Through hole; 3031. Rotating rod; 3032. Partition plate; 3033. Motor; 3041. Feed inlet; 3042. Sealing cover. Implementation

[0043] The present invention will be further described in detail below with reference to the accompanying drawings.

[0044] Example 1, Reference Figure 1-9 A rapid drying apparatus for electronic material manufacturing includes a storage mechanism 3 on the top of a base plate 1. The storage mechanism 3 includes a support column 301, a storage tray 302 on top of the support column 301, a partitioning component 303 for uniformly distributing electronic materials within the storage tray 302, and a sealing component 304 on top of the storage tray 302 to prevent temperature diffusion. A drying mechanism 2 is located on the lower surface of the storage tray 302. By using the storage mechanism 3, electronic materials can be partitioned and placed to prevent thermal runaway. The system eliminates the accumulation phenomenon. Furthermore, by setting up a support column 301, a storage tray 302, a partitioning component 303, and a sealing component 304, the support column 301 can fix the storage tray 302. Then, the partitioning component 303 can divide the interior of the storage tray 302 into several uniform spaces, enabling the uniform distribution of electronic materials. Then, the sealing component 304 can retain the heat from the hot air in the storage tray 302, preventing heat loss. Moreover, the sealing component 304 can be opened or closed, allowing electronic materials to be placed into or removed from the storage tray 302.

[0045] like Figure 6 and Figure 8 As shown, the partitioning component 303 includes a rotating rod 3031, partitioning disks 3032, and a motor 3033. The rotating rod 3031 is sealed with a bearing in the storage disk 302, and both ends of the rotating rod 3031 penetrate the storage disk 302. The partitioning disks 3032 are mounted on the rotating rod 3031, and there are eight partitioning disks 3032 arranged circumferentially. The partitioning disks 3032 divide the internal space of the storage disk 302 into eight placement areas. The motor 3033 is located at one end of the rotating rod 3031. The partitioning disks 3032 have a trapezoidal cross-section. 32 is a hollow structure. By setting up a rotating rod 3031, a partition disk 3032, and a motor 3033, the partition disk 3032 evenly divides the internal space of the storage disk 302 into eight parts, which allows electronic materials to be evenly placed in the storage disk 302. Then, the rotating rod 3031 is connected to the partition disk 3032, and the output shaft of the motor 3033 drives the rotating rod 3031 and the partition disk 3032 to rotate. The rotation of the partition disk 3032 can flip or rotate the electronic materials inside the storage disk 302, so as to dry the electronic materials evenly.

[0046] like Figure 4 As shown, the sealing assembly 304 includes an inlet 3041 and a sealing cover 3042. The inlet 3041 is located on the upper surface of the storage tray 302. There are eight inlets 3041 arranged circumferentially. The inlets 3041 correspond to the eight placement areas divided into the internal space of the storage tray 302 by the partition tray 3032. The sealing cover 3042 is hinged to the surface of the inlet 3041. By setting the inlet 3041 and the sealing cover 3042, opening the sealing cover 3042 allows electronic materials to be passed through the inlet. 3041 is placed into the storage tray 302. By setting eight inlets 3041, which correspond to the eight placement areas divided into the internal space of the storage tray 302 by the partition tray 3032, electronic materials can be evenly placed into the interior of the storage tray 302. Then, the sealing cover 3042 is closed to seal the inlets 3041, preventing heat loss from the storage tray 302 and allowing for better drying of the electronic materials in the storage tray 302.

[0047] like Figure 1 As shown, the upper surface of the storage tray 302 is provided with a pressure relief valve 5 for balancing the air pressure inside and outside the storage tray 302. There are two pressure relief valves 5 arranged symmetrically. By setting the pressure relief valves 5, the pressure inside the storage tray 302 can be adjusted to prevent hot air from continuously entering the interior of the storage tray 302. Excessive pressure inside the storage tray 302 can easily affect the performance of electronic materials.

[0048] like Figure 2 and Figure 7As shown, the bottom of the support column 301 is welded to the base plate 1, and the partition disk 3032 is in contact with and rotatably connected to the inner bottom of the storage disk 302. By setting the position of the support column 301 and the connection relationship between the partition disk 3032 and the storage disk 302, the support column 301 can support and fix the storage disk 302, and the partition disk 3032 can rotate in the storage disk 302, so that the electronic materials between the partition disks 3032 can be rotated or agitated.

[0049] like Figure 8 As shown, the spoiler 2031 is positioned above the partition disk 3032. The spoiler 2031 and the partition disk 3032 correspond to the eight placement areas that divide the internal space of the storage disk 302. By setting the position of the spoiler 2031 above the partition disk 3032, the air above the partition disk 3032 can be circulated. Furthermore, the hot airflow in the spoiler 2031 flows downward and can directly act on the upper surface of the electronic materials.

[0050] Brief description of the usage process: First, the support column 301 fixes the storage tray 302. Then, the sealing cover 3042 is opened, and electronic materials can be placed into the storage tray 302 through the inlet 3041. By setting eight inlets 3041, which correspond to the eight placement areas divided into the internal space of the storage tray 302 by the partitioned tray 3032, the electronic materials can be evenly placed into the interior of the storage tray 302. Then, the sealing cover 3042 is closed, which seals the inlets 3041 to prevent heat loss from the storage tray 302 and allows for better drying of the electronic materials in the storage tray 302. The storage tray 302 is divided into eight equal parts by a partitioning disk 3032, allowing electronic materials to be evenly placed within it. A rotating rod 3031 connects to the partitioning disk 3032, and the output shaft of a motor 3033 drives both the rotating rod 3031 and the partitioning disk 3032 to rotate. This rotation of the partitioning disk 3032 flips or rotates the electronic materials inside the storage tray 302, ensuring even drying. A pressure relief valve 5 regulates the pressure inside the storage tray 302, preventing hot air from continuously entering and potentially affecting the performance of the electronic materials.

[0051] Example 2, Reference Figure 1-9The drying mechanism 2 is located on the lower surface of the storage tray 302. The drying mechanism 2 includes a drying component 201, which works in conjunction with the partitioning component 303. A flow component 202 is located above the drying component 201, and a turbulence component 203 is located above the flow component 202. Both the flow component 202 and the turbulence component 203 are located inside the partitioning component 303. By setting the drying component 201, the flow component 202, and the turbulence component 203, the drying component 201 can bake the bottom of the storage tray 302, allowing heat to be transferred into the storage tray 302. The bottom of the electronic materials is dried. At this time, the partition component 303 rotates, causing the electronic materials to rotate or tumble for uniform drying. Hot air can enter the interior of the partition component 303 through the flow component 202. The rotation of the partition component 303 diffuses the heat into the interior of the storage tray 302, drying the surface of the electronic materials. At the same time, the turbulence component 203 disturbs the air in the storage tray 302 as the partition component 303 rotates, causing the air inside the storage tray 302 to flow, which helps to eliminate local temperature and humidity differences and improve the uniformity of drying.

[0052] like Figure 3 As shown, the drying assembly 201 includes a hot air blower 2011, a connecting pipe 2012, and a drying chamber 2013. The hot air blower 2011 is disposed on the upper surface of the base plate 1. One end of the connecting pipe 2012 is disposed on the output end of the hot air blower 2011, and the drying chamber 2013 is disposed on the other end of the connecting pipe 2012. The drying chamber 2013 is fixedly connected to the lower surface of the storage tray 302. By setting up the hot air blower 2011, the connecting pipe 2012, and the drying chamber 2013, the hot air blower 2011, which is existing technology, can heat the outside air to form a hot airflow. Then, the hot airflow is transmitted to the drying chamber 2013 through the connecting pipe 2012, so that the hot airflow fills the drying chamber 2013. Since the drying chamber 2013 is connected to the bottom of the storage tray 302, heat can be transferred to the interior of the storage tray 302 through heat transfer, thereby drying the electronic materials inside the storage tray 302.

[0053] like Figure 8 and Figure 9As shown, the flow assembly 202 includes a flow cavity 2021, an inlet hole 2022, and an outlet hole 2023. The flow cavity 2021 is formed inside the rotating rod 3031, and one end of the rotating rod 3031 extends into the drying chamber 2013. The inlet hole 2022 is formed on the surface of the rotating rod 3031, and there are several inlet holes 2022 arranged circumferentially. The inlet holes 2022 are corresponding to the partition plate 3032. The outlet hole 2023 is formed on the surface of the partition plate 3032, and there are several outlet holes 2023 arranged linearly. By setting the flow cavity 2021... 021. The inlet hole 2022 and the outlet hole 2023 are connected to the flow chamber 2021, which is located in the rotating rod 3031. After the drying chamber 2013 is filled with hot air, hot air continues to flow in. The hot air will flow through the flow chamber 2021 and the inlet hole 2022 into the interior of the partition disk 3032. Then, as the partition disk 3032 rotates, the electronic materials inside the storage disk 302 are rotated. At the same time, the hot air inside the partition disk 3032 is thrown out through the outlet hole 2023 to dry the sides of the electronic materials, thereby achieving uniform drying of the electronic materials.

[0054] like Figure 8 As shown, the spoiler assembly 203 includes a spoiler 2031 and a through hole 2032. The spoiler 2031 is disposed on the surface of the rotating rod 3031. The spoiler 2031 is hollow, and there are four spoilers 2031 arranged circumferentially on the surface of the rotating rod 3031. The through hole 2032 is disposed at the contact point between the spoiler 2031 and the rotating rod 3031. By setting the spoiler 2031 and the through hole 2032, the spoiler 2031 is connected to the rotating rod 3031. When the rotating rod 3031 rotates, it can drive the spoiler 2031. When the 031 rotates, the baffle 2031 can agitate the airflow inside the storage tray 302, allowing the air inside the storage tray 302 to circulate. This helps to eliminate local temperature and humidity differences and improve the uniformity of drying. At the same time, the hot airflow in the flow cavity 2021 can enter the baffle 2031 through the through hole 2032 and be discharged downwards into the storage tray 302, thereby drying the upper surface of the electronic material. At this time, the electronic material can be dried simultaneously from all sides, ensuring the uniformity of drying.

[0055] like Figure 9 As shown, a flow guide baffle 4 is provided inside the flow cavity 2021. The flow guide baffle 4 is conical and is correspondingly set with the inlet hole 2022. By setting the backflow baffle, the backflow baffle can guide the hot airflow in the flow cavity 2021, so that part of the hot airflow enters the interior of the partition plate 3032, and the other part of the hot airflow continues to move upward and enters the interior of the baffle 2031.

[0056] Brief description of the usage process: First, the hot air blower 2011, being existing technology, heats the outside air to form a hot airflow. This hot airflow is then transmitted to the drying chamber 2013 via the connecting pipe 2012, filling the chamber. Since the drying chamber 2013 is connected to the bottom of the storage tray 302, heat is transferred to the interior of the storage tray 302 through heat transfer, drying the electronic materials inside. Next, the flow chamber 2021 is located within the rotating rod 3031. Once the drying chamber 2013 is filled with hot air, more hot airflow is introduced. The hot airflow flows through the flow chamber 2021 and the inlet hole 2022 into the partitioned tray 3032. As the partitioned tray 3032 rotates, it simultaneously rotates the electronic materials inside the storage tray 302, and the hot airflow inside the partitioned tray 3032 is ejected through the ejector hole 2023, further drying the electronic materials. The surface is dried to achieve uniform drying of electronic materials. When the rotating rod 3031 rotates, it drives the baffle 2031 to rotate. The baffle 2031 agitates the airflow inside the storage tray 302, allowing air circulation inside the storage tray 302. This helps to eliminate local temperature and humidity differences and improve the uniformity of drying. At the same time, the hot airflow in the flow cavity 2021 can enter the baffle 2031 through the through hole 2032 and then be discharged downwards into the storage tray 302, thereby drying the upper surface of the electronic materials. At this time, the electronic materials can be dried simultaneously from all sides, ensuring the uniformity of drying. Then, the backflow baffle guides the hot airflow in the flow cavity 2021, allowing some of the hot airflow to enter the interior of the partition tray 3032, while the other part of the hot airflow continues to move upwards and enters the interior of the baffle 2031.

[0057] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A rapid drying apparatus for manufacturing electronic materials, comprising a base plate (1) and a drying mechanism (2), characterized in that: A storage mechanism (3) is provided on the top of the base plate (1). The storage mechanism (3) includes a support column (301). A storage tray (302) is provided on the top of the support column (301). A partition component (303) is provided in the storage tray (302) to enable uniform distribution of electronic materials. A sealing component (304) is provided on the top of the storage tray (302) to prevent temperature diffusion in the storage tray (302). A drying mechanism (2) is provided on the lower surface of the storage tray (302). The drying mechanism (2) includes a drying component (201). The drying component (201) is used in conjunction with the partition component (303). A flow component (202) is provided above the drying component (201). A flow-disrupting component (203) is provided above the component (202). Both the flow component (202) and the flow-disrupting component (203) are located inside the partition component (303). The partition component (303) includes a rotating rod (3031), partition disks (3032), and a motor (3033). The rotating rod (3031) is sealed with a bearing in the storage disk (302). Both ends of the rotating rod (3031) penetrate the storage disk (302). The partition disks (3032) are located on the rotating rod (3031). There are eight partition disks (3032) arranged in a circle. The partition disks (3032) divide the internal space of the storage disk (302) into eight placement areas. The motor (3033) 3) Located at one end of the rotating rod (3031), the partition plate (3032) has a trapezoidal cross-section and is hollow. The drying assembly (201) includes a hot air blower (2011), a connecting pipe (2012), and a drying chamber (2013). The hot air blower (2011) is located on the upper surface of the base plate (1). One end of the connecting pipe (2012) is located at the output end of the hot air blower (2011). The drying chamber (2013) is located at the other end of the connecting pipe (2012). The drying chamber (2013) is fixedly connected to the lower surface of the storage tray (302). The flow assembly (202) includes a flow chamber (2021), an inlet hole (2022), and an outlet hole (2023). 2023), the flow chamber (2021) is opened inside the rotating rod (3031), one end of the rotating rod (3031) extends into the drying chamber (2013), the inlet hole (2022) is opened on the surface of the rotating rod (3031), the number of inlet holes (2022) is several and arranged circumferentially, the inlet holes (2022) are corresponding to the partition plate (3032), the ejection hole (2023) is arranged on the surface of the partition plate (3032), the number of ejection holes (2023) is several and arranged linearly, the turbulence assembly (203) includes a turbulence plate (2031) and a through hole (2032), the turbulence plate (2031) is arranged on the surface of the rotating rod (3031),The baffle (2031) is hollow, and there are four baffles (2031) arranged circumferentially on the surface of the rotating rod (3031). The through hole (2032) is set at the contact point between the baffle (2031) and the rotating rod (3031). When the drying chamber is filled with hot air, hot air continues to be introduced. The hot air will enter the interior of the partition plate along the flow chamber and the inlet hole. Then, as the partition plate rotates, the electronic materials inside the storage plate are rotated. At the same time, the hot air inside the partition plate is thrown out through the spray hole to dry the side of the electronic materials, so as to achieve uniform drying of the electronic materials. When the rotating rod rotates, it can drive the baffle to rotate. The baffle can agitate the airflow inside the storage plate, so that the air inside the storage plate can circulate, which helps to eliminate local temperature and humidity differences and improve the uniformity of drying. At the same time, the hot air in the flow chamber can enter the baffle through the through hole and be discharged downward along the baffle to the storage plate, thereby drying the upper surface of the electronic materials. , 2. The rapid drying apparatus for electronic material manufacturing according to claim 1, characterized in that: The sealing assembly (304) includes an inlet (3041) and a sealing cover (3042). The inlet (3041) is located on the upper surface of the storage tray (302). There are eight inlets (3041) arranged in a circle. The inlets (3041) and the partition tray (3032) are arranged to correspond to the eight placement areas into which the internal space of the storage tray (302) is divided. The sealing cover (3042) is hinged to the surface of the inlet (3041).

3. The rapid drying apparatus for electronic material manufacturing according to claim 1, characterized in that: The flow chamber (2021) is provided with a flow guide baffle (4), which is conical and is provided in correspondence with the inlet hole (2022).

4. The rapid drying apparatus for electronic material manufacturing according to claim 1, characterized in that: The upper surface of the storage tray (302) is provided with a pressure relief valve (5) for balancing the air pressure inside and outside the storage tray (302), and there are two pressure relief valves (5) arranged symmetrically.

5. The rapid drying apparatus for electronic material manufacturing according to claim 1, characterized in that: The bottom of the support column (301) is welded to the base plate (1), and the partition plate (3032) is in contact with and rotatably connected to the inner bottom of the storage plate (302).

6. The rapid drying apparatus for electronic material manufacturing according to claim 1, characterized in that: The spoiler (2031) is positioned above the partition disk (3032), and the spoiler (2031) and the partition disk (3032) are positioned to divide the internal space of the storage disk (302) into eight placement areas.

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