Server

Abstract

An embodiment of the present application provides a server, which includes a first circuit board, a second circuit board, a central processing unit, a PCIE card, a first signal cable, and a first power supply socket. The central processing unit is disposed on the first circuit board; the second circuit board has a first mounting slot, the PCIE card is disposed in the first mounting slot, one end of the first signal cable is electrically connected to the first circuit board, and the first signal cable extends to the first mounting slot to be electrically connected to the PCIE card; the first power supply socket is disposed on one side of the second circuit board, and the first power supply socket is used to supply power to the PCIE card. For the server provided by the embodiment of the present application, there is more space on the second circuit board of the server for arranging the PCIE card or other functional devices, thereby improving the computing power of the server.

Description

Technical Field

[0001] This application relates to the technical field of servers, and in particular, to a server. Background Art

[0002] With the rise of big data, cloud computing, and AI, the demand for the processing speed of server systems is getting higher and higher.

[0003] AI servers have strong image processing capabilities and computing capabilities. Therefore, with the rapid development of big data, cloud computing, and AI (Artificial Intelligence), AI servers have been widely used. GPU servers belong to a type of AI server. GPU servers include a main board, a daughter board, a central processing unit, and an image processing unit. The central processing unit is located on the main board and is electrically connected to the main board. The image processing unit is located on the daughter board and is electrically connected to the daughter board. The image processing unit is electrically connected to the central processing unit through the internal traces of the daughter board. When electrically connecting the image processing unit and the central processing unit through the internal traces of the daughter board, the signal transmission loss is relatively large. In addition, in order to expand the number of image processing units electrically connected to the central processing unit and extend the signal transmission link, an enhancement chip can be set between the central processing unit and the image processing unit. The enhancement chip is set on the daughter board, and the enhancement chip will occupy the space on the surface of the daughter board. In addition, in order to further increase the processing speed of the GPU server, the number of image processing units on the daughter board can be increased or an image processing unit with a higher computing speed can be used. Therefore, a new power supply connector needs to be added on the daughter board to supply power to the image processing unit, and the power supply connector will also occupy the space on the surface of the daughter board.

[0004] Therefore, in the related art, the space on the surface of the daughter board is occupied by the enhancement chip and the power supply connector, resulting in a relatively small space on the daughter board available for arranging the image processing unit and other functional devices. Summary of the Invention

[0005] An embodiment of this application provides a server. There is more space on the second circuit board of the server for arranging PCIE cards or other functional devices, thereby improving the computing power of the server.

[0006] A first aspect of an embodiment of this application provides a server, including a first circuit board, a second circuit board, a central processing unit, a PCIe card, a first signal cable, and a first power supply socket. The central processing unit is set on the first circuit board; the second circuit board has a first installation slot, the PCIE card is set in the first installation slot, one end of the first signal cable is electrically connected to the first circuit board, and the first signal cable extends to the first installation slot to be electrically connected to the PCIE card; the first power supply socket is set at one side of the second circuit board, and the first power supply socket is used to supply power to the PCIE card.

[0007] The server provided by the embodiment of the present application, by providing a first circuit board, a second circuit board, a central processing unit, a PCIE card, a first signal cable, and a first power supply socket, the central processing unit is arranged on the first circuit board; there are a plurality of first mounting slots on the second circuit board, the PCIE card is arranged in the first mounting slots, one end of the first signal cable is electrically connected to the first circuit board, and the first signal cable extends to the first mounting slots to be electrically connected to the PCIE card. By directly electrically connecting to the PCIE card through the first signal cable, the loss during signal transmission between the central processing unit and the PCIE card can be reduced. Therefore, there is no need to provide an enhancement chip on the second circuit board to extend the signal transmission link, which can avoid the enhancement chip occupying the position on the second circuit board, save the space on the second circuit board, and at the same time can also save costs. The first power supply socket is arranged at the side of the second circuit board, so that the space of the second circuit board occupied by the first power supply socket is small. Thus, there is more space on the second circuit board to arrange the PCIE card or other functional devices, thereby improving the computing power of the server.

[0008] In a possible implementation manner, for the server provided by the embodiment of the present application, the first circuit board and the second circuit board are arranged along the height direction of the server. The second circuit board has a first board surface and a second board surface opposite to each other along the height direction. The first board surface faces the first circuit board, the PCIE card is located on one side of the second board surface, the first mounting slots penetrate through the first board surface and the second board surface, and the first signal cable is arranged in the first mounting slots through the first board surface to be connected to the PCIE card. By setting the first mounting slots as through slots penetrating the second circuit board and enabling the first signal cable to pass through the first mounting slots to be electrically connected to the PCIE card, it is possible to avoid the first signal cable winding from the side of the second circuit board to the second board surface. Thus, the length of the first signal cable can be reduced, and the wiring of the first signal cable is relatively neat.

[0009] In a possible implementation manner, for the server provided by the embodiment of the present application, the first signal cable includes a first connector, a first lead, and a second connector that are electrically connected in sequence. The first connector is electrically connected to the first circuit board. The second connector includes a signal socket and a first mounting portion. The first mounting portion is connected to the signal socket; the first mounting portion is located on one side of the first board surface, and there is a second mounting portion on the second circuit board. The first mounting portion is connected to the second mounting portion; the signal socket is arranged in the first mounting slots and extends out of the second board surface through the first mounting slots, and the PCIE card is plugged into the signal socket. By plugging the signal plug into the signal socket, while electrically connecting the PCIE card to the first signal cable, the PCIE card can also be fixed on the second circuit board. Thus, the structural components for connecting the PCIE card to the second circuit board are omitted. In addition, since the first mounting portion is located on one side of the first board surface, there is more space on the second board surface of the second circuit board to arrange the PCIE card or other functional devices.

[0010] In a possible implementation, the server provided by the embodiments of the present application has a protrusion on its side, and the first power supply socket is arranged on the protrusion. By arranging the first power supply socket on the protrusion extending from the first side, it is possible to avoid making major changes to the internal wiring of the second circuit board. Even if there are components on the first side, it is possible to avoid interference between the first power supply socket and the components at the first side. In addition, the area of the protrusion only needs to be slightly larger than the area of the projection of the first power supply socket on the protrusion. Therefore, the space occupied by the protrusion inside the chassis is also small.

[0011] In a possible implementation, the server provided by the embodiments of the present application further includes a power supply backplane and a first power supply cable. The first power supply cable is used to electrically connect the power supply backplane and the first power supply socket. The first power supply socket can be electrically connected to the power supply backplane through the first power supply cable, thereby increasing the electrical energy supplied to the second circuit board.

[0012] In a possible implementation, the server provided by the embodiments of the present application, the second circuit board further includes a second power supply socket and a second power supply cable. The second power supply socket is arranged on the side of the second circuit board. The number of the second power supply sockets, the number of the second power supply cables, and the number of the PCIE cards are the same. The second power supply socket is connected to the first power supply socket through the internal wiring of the second circuit board. One end of the second power supply cable is electrically connected to the second power supply socket, and the other end of the second power supply cable is electrically connected to the PCIE card. When the PCIE card is powered by the first power supply socket, only the first internal wiring is added to the second circuit board, and the remaining power supply circuits and the second copper bus are shared power supply circuits, resulting in less modification to the second circuit board.

[0013] In a possible implementation, the server provided by the embodiments of the present application, the number of the protrusions is at least two. The at least two protrusions are arranged at intervals along the side of the second circuit board, and the first power supply socket is arranged on each protrusion.

[0014] In a possible implementation, the server provided by the embodiments of the present application, the second circuit board further has a second installation slot, and the server further includes a network card, and the network card is inserted into the second installation slot.

[0015] In a possible implementation, the server provided by the embodiments of the present application, the second installation slot is located in the middle area of the second circuit board, so that the arrangement of the PCIE cards on the second circuit board is relatively neat.

[0016] In a possible implementation, the server provided by the embodiments of the present application, the server further includes a chassis, and the first circuit board, the second circuit board, and the power supply backplane are all located inside the chassis.

[0017] With reference to the accompanying drawings, these and other aspects, embodiments and advantages of the exemplary embodiments will become apparent from the following description. It should be understood, however, that the description and drawings are for illustrative purposes only and are not intended to define the limits of the present application, as detailed in the appended claims. Other aspects and advantages of the present application will be set forth in the following description, and in part will be apparent from the description, or may be learned by practice of the present application. In addition, the aspects and advantages of the present application may be realized and obtained by means and combinations particularly pointed out in the appended claims. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of a GPU server in the related art;

[0019] Figure 2 It is a schematic structural diagram of the server provided by the embodiment of the present application Figure 1 ;

[0020] Figure 3 It is a schematic structural diagram of the server provided by the embodiment of the present application Figure 2 ;

[0021] Figure 4 It is a schematic diagram of the electrical connection relationship of each component in the server provided by the embodiment of the present application;

[0022] Figure 5 is Figure 2 right side view of Figure 1 ;

[0023] Figure 6 is Figure 2 right side view of Figure 2 ;

[0024] Figure 7 It is a schematic structural diagram of the second circuit board and the power supply backplane in the server provided by the embodiment of the present application;

[0025] Figure 8 It is a schematic diagram of the electrical connection relationship between the second circuit board and the power supply backplane in the server provided by the embodiment of the present application Figure 1 ;

[0026] Figure 9 It is a schematic diagram of the electrical connection relationship between the second circuit board and the power supply backplane in the server provided by the embodiment of the present application Figure 2 .

[0027] Description of the Reference Numerals:

[0028] 100n, GPU server;

[0029] 110n, main board;

[0030] 120n, daughter board; 121n, first socket; 122n, second socket; 123n, internal wiring; 124n, enhancement chip; 125n, heat sink; 126n, power supply connector;

[0031] 130n, central processing unit;

[0032] 140n, image processor;

[0033] 150n, power backplane; 151n, first copper bar; 152n, second copper bar;

[0034] 100, server;

[0035] 110, first circuit board;

[0036] 111, third connector;

[0037] 120, second circuit board; 120a, first side; 120b, second side; 120c, third side; 120d, fourth side; 120e, first board surface; 120f, second board surface;

[0038] 121, first mounting slot;

[0039] 122, second mounting part; 1221, second mounting hole;

[0040] 123, protruding part;

[0041] 125, second power supply socket;

[0042] 126, second power supply cable;

[0043] 127, second mounting slot;

[0044] 130, central processing unit;

[0045] 140, PCIE card;

[0046] 141, signal plug;

[0047] 142, power interface;

[0048] 150, first signal cable; 150a, first end; 150b, second end;

[0049] 151, first connector;

[0050] 152, first lead; 1521, wire core;

[0051] 153, second connector; 1531, signal socket; 1532, first mounting part; 1532a, first mounting hole; 1533, fastener;

[0052] 160, First power supply socket;

[0053] 170, Housing;

[0054] 171, Bottom wall;

[0055] 172, Side wall;

[0056] 180, Power supply backplane;

[0057] 181, First copper bar;

[0058] 182, Second copper bar;

[0059] 183, First power supply cable;

[0060] 190, Network card;

[0061] L1, First internal wiring;

[0062] L2, Second internal wiring;

[0063] X, First direction;

[0064] Y, Second direction;

[0065] Z, Height direction. Detailed implementation manners

[0066] The terms used in the implementation manners part of this application are only used to explain the specific embodiments of this application, rather than aiming to limit this application. The implementation manners of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0067] For ease of understanding, first, the technical terms involved in the embodiments of this application are explained and described.

[0068] Central processing unit: The central processing unit (CPU for short) is the computing core and processing core of electronic devices such as servers. The central processing unit is mainly used to interpret instructions and process data.

[0069] Graphics processing unit: The graphics processing unit (GPU for short) is a microprocessor that specifically processes image operations on electronic devices such as servers.

[0070] GPU Server: GPU servers usually adopt a combination of a central processing unit and multiple graphics processing units. The central processing unit is responsible for multitask management and scheduling, and the graphics processing unit is responsible for image processing and parallel computing. Therefore, GPU servers have strong image processing and computing capabilities. GPU servers are widely used in various fields such as intelligent medical image analysis and security monitoring. GPU servers belong to a type of AI server (Artificial Intelligence).

[0071] PCIE Signal: The PCIE signal (Peripheral Component Interconnect Express, a high-speed connection standard for peripheral devices) is the signal for communication between the CPU and the PCIE card through the PCIE protocol. The PCIE link is the transmission link for transmitting the PCIE signal.

[0072] Solid State Drive: A solid state drive (SSD for short) is a hard drive made of a solid-state electronic storage chip array.

[0073] With the rapid development of big data, cloud computing, and AI, AI servers have been widely used. Below, taking the GPU server as an example, the structure of the AI server will be described.

[0074] Figure 1 It is a schematic diagram of the structure of a GPU server in the related art. Among them, in the related art, the GPU server is represented by 100n, and each component in the GPU server 100n is also suffixed with n to distinguish it from the server provided in the embodiment of the present application.

[0075] See Figure 1 As shown, the GPU server 100n includes a main board 110n, a daughter board 120n, a central processing unit 130n, and a graphics processing unit 140n. The central processing unit 130n can be soldered on the main board 110n and is electrically connected to the main board 110n.

[0076] Multiple first sockets 121n are soldered on the daughter board 120n, and the graphics processing unit 140n is plugged into the first sockets 121n to be electrically connected to the daughter board 120n. There is also a second socket 122n on the daughter board 120n. The second socket 122n is electrically connected to the first sockets 121n through the internal trace 123n on the daughter board 120n. The second socket 122n is used to be electrically connected to the main board 110n. Thus, the graphics processing unit 140n is electrically connected to the central processing unit 130n located on the main board 110n through the first sockets 121n, the internal trace 123n, and the second socket 122n in sequence.

[0077] To expand the number of image processors 140n electrically connected to the central processing unit 130n and to extend the transmission link between the central processing unit 130n and the graphics processing unit 140n, an enhancement chip 124n can be provided on the daughter board 120n. The enhancement chip 124n is located between the second socket 122n and the first socket 121n. The enhancement chip 124n is electrically connected to the first socket 121n and the second socket 122n respectively through internal traces 123n. Through one enhancement chip 124n, the central processing unit 130n can be electrically connected to multiple image processors 140n. In Figure 1 In , the central processing unit 130n is electrically connected to four image processors 140n through one enhancement chip 124n.

[0078] The enhancement chip 124n can be a Switch chip or a Retimer chip. However, the enhancement chip 124n occupies space on the daughter board 120n. In addition, a heat sink 125n usually needs to be provided on the enhancement chip 124n, and the volume of the heat sink 125n is also large, which will occupy more positions on the daughter board 120n, and the cost of the enhancement chip 124n is high.

[0079] In addition, when transmitting signals between the image processor 140n and the central processing unit 130n through the internal traces 123n of the daughter board 120n, the energy loss is large.

[0080] The GPU server 100n further includes a power backplane 150n. The power backplane 150n includes a first copper bar 151n and a second copper bar 152n. The first copper bar 151n connects the power backplane 150n and the main board 110n to supply power to the components on the main board 110n. The second copper bar 152n connects the power backplane 150n and the daughter board 120n to supply power to the components on the daughter board 120n.

[0081] To further increase the processing speed of the GPU server 100n, the number of image processors 140n on the daughter board 120n will be increased or image processors 140n with higher computing speeds will be used. Therefore, a new power supply connector 126n also needs to be added on the daughter board 120n. The power supply connector 126n is also electrically connected to the power backplane 150n. Through the power supply connector 126n, the electric energy supplied by the power backplane 150n to the daughter board 120n can be increased. The power supply connector 126n also occupies space on the surface of the daughter board 120n.

[0082] The space on the surface of the daughter board 120n is occupied by the enhancement chip 124n and the power supply connector 126n, resulting in less space available on the daughter board for arranging the image processors 140n and other functional devices, which is not conducive to improving the computing power of the GPU server.

[0083] Based on this, an embodiment of the present application provides a server. There is more space on the second circuit board of the server for arranging PCIe cards or other functional devices, thereby improving the computing power of the server.

[0084] Figure 2 Schematic structure of the server provided by the embodiment of the present application Figure 1 ; Figure 3 Schematic structure of the server provided by the embodiment of the present application Figure 2 ; Figure 4 Schematic diagram of the electrical connection relationship of each component in the server provided by the embodiment of the present application; Figure 5 For Figure 2 right side view of Figure 1 , wherein, Figure 3 the chassis of the server is omitted in Figure 5 the chassis and power backplane of the server are omitted in

[0085] Refer to Figures 2 to 5 As shown, the server 100 provided by the embodiment of the present application includes a first circuit board 110, a second circuit board 120, a central processing unit 130, a PCIe card 140, a first signal cable 150, and a first power supply socket 160. The central processing unit 130 is disposed on the first circuit board 110; there are a plurality of first mounting slots 121 on the second circuit board 120, the PCIe card 140 is disposed in the first mounting slot 121, one end of the first signal cable 150 is electrically connected to the first circuit board 110, and the first signal cable 150 extends to the first mounting slot 121 to be electrically connected to the PCIe card 140; the first signal cable 150 is used to transmit high-speed signals between the central processing unit 130 and the PCIe card 140, and the first power supply socket 160 is disposed on one side of the second circuit board 120, and the first power supply socket 160 is used to supply power to the PCIe card 140.

[0086] Please continue to refer to Figure 2 As shown, the server 100 further includes a chassis 170. The chassis 170 is a cuboid structure, and the chassis 170 includes a length direction X, a width direction Y, and a height direction Z. The chassis 170 includes a bottom wall 171, side walls 172, and an upper cover (wherein the upper cover is not shown in Figure 2 to clearly show the internal structure of the chassis 170), and the chassis 170 is used to support and accommodate each component in the server 100.

[0087] The first circuit board 110 and the second circuit board 120 are both located in the chassis 170, and the surfaces of the first circuit board 110 and the second circuit board 120 are both perpendicular to the height direction Z. The first circuit board 110 is the main board of the server 100, and the central processing unit 130 is disposed on the first circuit board 110 and electrically connected to the first circuit board 110. The number of central processing units 130 on the first circuit board 110 can be one, or two or more. In Figures 2 to 4 the illustrated embodiment, the number of central processing units 130 is two. A memory card, a baseboard management controller and other components and their peripheral circuits are also electrically connected to the first circuit board 110. To facilitate the electrical connection between the central processing unit 130 and other electronic devices on the first circuit board 110, the central processing unit 130 is usually disposed in the middle area of the first circuit board 110.

[0088] The second circuit board 120 is used to mount the PCIE cards 140 in the server 100. Usually, a plurality of PCIE cards 140 are disposed on the second circuit board 120. In Figures 2 to 4 the illustrated embodiment, eight PCIE cards 140 are disposed on the second circuit board 120. Disposing all the PCIE cards 140 on the second circuit board 120 can make the overall layout of the server 100 more compact and tidy. The PCIE cards 140 can be network cards, SSDs, GPUs, etc.

[0089] Specifically, the second circuit board 120 is provided with a plurality of first mounting slots 121, and the plurality of first mounting slots 121 are arranged at intervals along the length direction X or the width direction Y. In this embodiment, the plurality of first mounting slots 121 are arranged at intervals along the width direction Y, and the PCIE cards 140 are mounted on the first mounting slots 121. Among them, the PCIE cards 140 can be mounted on the first mounting slots 121 through fasteners.

[0090] As mentioned above, when transmitting signals between the PCIE cards 140 and the central processing unit 130 through the internal traces of the second circuit board 120, the loss is relatively large. In the embodiment of the present application, an external cable is provided to improve the problem of signal transmission loss.

[0091] Specifically, the server provided by the embodiment of the present application further includes a first signal cable 150. The first end 150a of the first signal cable 150 is electrically connected to the first circuit board 110 and then electrically connected to the central processing unit 130 on the first circuit board 110. The second end 150b of the first signal cable 150 directly extends to the first mounting slot 121 and is then electrically connected to the PCIE card 140. That is, the second end 150b of the first signal cable 150 can be directly electrically connected to the PCIE card 140 without passing through the internal wiring of the second circuit board 120. The cable is provided with a shielding layer. Therefore, the loss of the cable during signal transmission is less than that of the internal wiring of the circuit board. By directly electrically connecting the second end 150b of the first signal cable 150 to the PCIE card 140, the loss of signal transmission between the central processing unit 130 and the PCIE card 140 can be reduced. By providing multiple signal cables that connect the first circuit board 110 and the PCIE card 140 in one-to-one correspondence, there is no need to set an enhancement chip on the second circuit board 120, which can avoid the enhancement chip occupying the position on the second circuit board 120. These spaces on the second circuit board 120 can be used to set other functional devices of the PCIE card, and at the same time, the cost is saved.

[0092] Please continue to refer to Figures 2 to 4 As shown, the server 100 further includes a power backplane 180, a first copper bar 181, and a second copper bar 182. The first copper bar 181 is electrically connected to the power backplane 180 and the first circuit board 110, and the second copper bar 182 is electrically connected to the power backplane 180 and the second circuit board 120.

[0093] The power backplane 180 is also located inside the chassis 170. The power backplane 180 can be installed on the side wall 172 of the chassis 170. A power conversion module is provided on the power backplane 180. The power conversion module is used to receive external power and convert it into a power supply suitable for the first circuit board 110 and the second circuit board 120 to supply power to the server. Specifically, the first copper bar 181 and the second copper bar 182 are led out from the power backplane 180. The first copper bar 181 is electrically connected to the first circuit board 110 to supply power to the central processing unit 130 and other components on the first circuit board 110. The second copper bar 182 is electrically connected to the second circuit board 120 to supply power to the PCIE card 140 and other components on the second circuit board 120.

[0094] When the number of PCIe cards 140 on the second circuit board 120 increases or the performance of the PCIe cards 140 on the second circuit board 120 improves, the overall power consumption of the second circuit board 120 increases. Therefore, it is necessary to increase the electrical energy supplied to the second circuit board 120. However, when increasing the electrical energy supplied to the second circuit board 120 by increasing the cross-sectional area of the second copper busbar 182, the increase in the cross-sectional area of the second copper busbar 182 causes the second copper busbar 182 to occupy a relatively large space in the server 100, resulting in a relatively large modification to the structure of the server 100. In addition, the larger the cross-sectional area of the copper busbar, the more the current-carrying capacity decreases after multiplying by the temperature coefficient. Therefore, as the cross-sectional area of the copper busbar increases, the change rate of the current-carrying capacity decreases, and the improvement effect of simply increasing the cross-sectional area of the second copper busbar 182 to increase its current-carrying capacity is limited.

[0095] The electrical energy supplied to the second circuit board 120 can be increased by providing a first power supply socket 160 on the side of the second circuit board 120. The server 100 further includes a first power supply cable 183. The first power supply socket 160 can be electrically connected to the power supply backplane 180 through the first power supply cable 183, thereby increasing the electrical energy supplied to the second circuit board 120 without changing the cross-sectional area of the second copper busbar 182.

[0096] Specifically, in this embodiment, the second circuit board 120 may have a rectangular structure. The second circuit board 120 includes a first side 120a, a second side 120b, a third side 120c, and a fourth side 120d. Among them, the first side 120a and the third side 120c extend along the width direction Y, and the second side 120b and the fourth side 120d extend along the length direction X. Please continue to refer to Figure 2 As shown, in this embodiment, the second side 120b, the third side 120c, and the fourth side 120d are all close to the side wall 172 of the chassis 170. Therefore, the first power supply socket 160 can be provided on one side of the first side 120a. In other embodiments, the first power supply socket 160 can also be provided on the second side 120b, the third side 120c, or the fourth side 120d.

[0097] Providing the first power supply socket 160 at the first side 120a of the second circuit board 120 can reduce the space occupied by the first power supply socket 160 on the second circuit board 120.

[0098] This is because, if the first power supply socket 160 is located in the middle area of the second circuit board 120, the entire first power supply socket 160 is located on the second circuit board 120. However, when the first power supply socket 160 is located on the side of the second circuit board 120, only the part of the first power supply socket 160 that is electrically connected to the second circuit board 120 needs to be located on the second circuit board 120, and the remaining part of the first power supply socket 160 can extend out of the side of the second circuit board 120.

[0099] In addition, there are more electronic components arranged in the middle area of the second circuit board 120. Since the first power supply socket 160 and the electronic components around it need to maintain an electrical clearance, when the first power supply socket 160 is located in the middle area of the second circuit board 120, the space occupied by the first power supply socket 160 on the second circuit board 120 is relatively large. When the first power supply socket 160 is located on the side of the second circuit board 120, the space occupied by the first power supply socket 160 on the second circuit board 120 is relatively small. The middle area on the second circuit board 120 can be used to set a larger number of PCIE cards 140 or other functional devices.

[0100] In addition, the first power supply cable 183 electrically connected to the first power supply socket 160 will not interfere with the electronic components on the second circuit board 120.

[0101] The server 100 provided by the embodiment of the present application, by setting the first circuit board 110, the second circuit board 120, the central processing unit 130, the PCIE card 140, the first signal cable 150 and the first power supply socket 160, the central processing unit 130 is arranged on the first circuit board 110; there are a plurality of first installation slots 121 on the second circuit board 120, the PCIE card 140 is arranged in the first installation slots 121, one end of the first signal cable 150 is electrically connected to the first circuit board 110, and the first signal cable 150 extends to the first installation slots 121 to be electrically connected to the PCIE card 140. By directly electrically connecting the first signal cable 150 to the PCIE card 140, the loss when the central processing unit 130 transmits signals to the PCIE card 140 can be reduced. Therefore, there is no need to set an enhancement chip on the second circuit board 120 to extend the signal transmission link, which can avoid the enhancement chip occupying the position on the second circuit board 120, save the space on the second circuit board 120, and at the same time can save costs. The first power supply socket 160 is arranged on the side of the second circuit board 120, so that the space occupied by the first power supply socket 160 on the second circuit board 120 is relatively small. Thus, there is more space on the second circuit board 120 to arrange the PCIE card 140 or other functional devices, thereby improving the computing power of the server 100.

[0102] Next, a specific manner of directly electrically connecting the first signal cable 150 to the PCIE card 140 will be described.

[0103] Please continue to refer to Figure 2 、 Figure 3 and Figure 5As shown, the first circuit board 110 and the second circuit board 120 are arranged along the height direction Z of the server 100. The second circuit board 120 has a first board surface 120e and a second board surface 120f that are opposite to each other along the height direction Z. The first board surface 120e faces the first circuit board 110. The PCIE card 140 is located on one side of the second board surface 120f. The first mounting slot 121 penetrates through the first board surface 120e and the second board surface 120f. The first signal cable 150 is passed through the first board surface 120e and is arranged in the first mounting slot 121 to be connected to the PCIE card 140.

[0104] The first circuit board 110 and the second circuit board 120 are usually arranged along the height direction Z. Thus, the size of the chassis 170 along the length direction X or the width direction Y can be reduced, and the compactness of the structure of the server 100 can be increased. In this embodiment, taking the first circuit board 110 being located below the second circuit board 120 along the height direction Z as an example, the electrical connection manner between the first signal cable 150 and the PCIE card 140 is described.

[0105] The first circuit board 110 can be installed on the bottom wall 171 of the chassis 170, and the second circuit board 120 can be installed on the side wall 172 of the chassis 170. Please continue to refer to Figure 5 As shown, the side of the second circuit board 120 facing the first circuit board 110 is represented by the first board surface 120e, and the side of the second circuit board 120 facing away from the first circuit board 110 is represented by the second board surface 120f.

[0106] The first mounting slot 121 is a through slot that penetrates through the first board surface 120e and the second board surface 120f along the height direction Z.

[0107] The first end 150a of the first signal cable 150 is electrically connected to the first circuit board 110. The second end 150b of the first signal cable 150 extends upward from the first circuit board 110, passes through the first mounting slot 121, and is electrically connected to the PCIE card 140 located on the second board surface 120f.

[0108] Setting the first mounting slot 121 as a through slot that penetrates through the second circuit board 120 and enabling the first signal cable 150 to pass through the first mounting slot 121 and be electrically connected to the PCIE card 140 can prevent the first signal cable 150 from winding around from the side of the second circuit board 120 to the second board surface 120f. Thus, the length of the first signal cable 150 can be reduced, and the wiring of the first signal cable 150 can be made neater.

[0109] Figure 6 For Figure 2 right side view Figure 2 .

[0110] Refer to Figure 2As shown in FIGS. 0 to 6, the first signal cable 150 includes a first connector 151, a first lead 152, and a second connector 153 that are electrically connected in sequence. The first connector 151 is electrically connected to the first circuit board 110. The second connector 153 includes a signal socket 1531 and a first mounting portion 1532. The first mounting portion 1532 is connected to the signal socket 1531. The first mounting portion 1532 is located on one side of the first board surface 120e. The second circuit board 120 has a second mounting portion 122. The first mounting portion 1532 is connected to the second mounting portion 122. The signal socket 1531 is inserted through the first mounting slot 121 and extends out of the second board surface 120f via the first mounting slot 121. The PCIE card 140 is plugged into the signal socket 1531.

[0111] Specifically, the first circuit board 110 also has a third connector 111. The first end 150a of the first signal cable 150 has a first connector 151. The first connector 151 is plugged into the corresponding third connector 111 on the first circuit board 110.

[0112] The second end 150b of the first signal cable 150 has a second connector 153. The first connector 151 and the second connector 153 are electrically connected by a first lead 152. Among them, the first lead 152 includes a plurality of wire cores 1521. These wire cores 1521 are used to connect to different pins in the first connector 151 and the second connector 153.

[0113] Next, the specific structure of the second connector 153 will be described.

[0114] Please continue to refer to Figure 6 As shown, the first mounting portion 1532 on the second connector 153 is used to fix the second connector 153 on the second circuit board 120. Specifically, in this embodiment, the first mounting portion 1532 is a lug extending from the signal socket 1531. The first mounting portion 1532 has a first mounting hole 1532a. The second mounting portion 122 has a second mounting hole 1221. Align the first mounting hole 1532a and the second mounting hole 1221, and screw a fastener 1533 into the first mounting hole 1532a and the second mounting hole 1221 to mount the second connector 153 on the second circuit board 120.

[0115] In other embodiments, one of the first mounting portion 1532 and the second mounting portion 122 can be a buckle, and the other can be a hook, as long as the first mounting portion 1532 and the second mounting portion 122 can reliably mount the second connector 153 on the second circuit board 120.

[0116] The signal socket 1531 is partially inserted into the first mounting slot 121, and the signal socket 1531 partially extends out of the second board surface 120f. The PCIE card 140 is provided with a signal plug 141. By inserting the signal plug 141 into the signal socket 1531, the PCIE card 140 can be electrically connected to the first signal cable 150.

[0117] Since the signal socket 1531 is fixed to the second circuit board 120 via the first mounting portion 1532, by inserting the signal plug 141 into the signal socket 1531, while electrically connecting the PCIE card 140 to the first signal cable 150, the PCIE card 140 can also be fixed to the second circuit board 120. Thus, the structural member for connecting the PCIE card 140 and the second circuit board 120 is omitted. In addition, the first mounting portion 1532 is located on one side of the first board surface 120e, so that there is more space on the second board surface 120f of the second circuit board 120 to arrange the PCIE card 140 or other functional devices.

[0118] Next, the specific setting method of the first power supply socket 160 will be described.

[0119] Figure 7 It is a schematic structural diagram of the second circuit board and the power supply backplane in the server provided by the embodiment of the present application.

[0120] See Figure 7 As shown, taking the first power supply socket 160 being set on the first side 120a as an example for illustration. The first side 120a has a protruding portion 123, and the first power supply socket 160 is set on the protruding portion 123.

[0121] Specifically, the second circuit board 120 has a protruding portion 123 extending from the first side 120a.

[0122] By setting the first power supply socket 160 on the protruding portion 123 extending from the first side 120a, it is possible to avoid major modifications to the internal wiring of the second circuit board 120. Even if there are components on the first side 120a, it is possible to avoid interference between the first power supply socket 160 and the components at the first side 120a. In addition, the area of the protruding portion 123 only needs to be slightly larger than the area of the projection of the first power supply socket 160 on the protruding portion 123. Therefore, the space occupied by the protruding portion 123 in the chassis 170 is also small.

[0123] Figure 8 It is a schematic diagram of the electrical connection relationship between the second circuit board and the power supply backplane in the server provided by the embodiment of the present application Figure 1 ; Figure 9 It is a schematic diagram of the electrical connection relationship between the second circuit board and the power supply backplane in the server provided by the embodiment of the present application Figure 2 .

[0124] See Figure 7 and to Figure 9 As shown, the second circuit board 120 further includes a second power supply socket 125 and a second power supply cable 126. The second power supply socket 125 is disposed at the edge of the first side 120a. The number of the second power supply sockets 125, the number of the second power supply cables 126, and the number of the PCIE cards 140 are the same. The second power supply socket 125 is connected to the first power supply socket 160 through the first internal trace L1 of the second circuit board 120. One end of the second power supply cable 126 is electrically connected to the second power supply socket 125, and the other end of the second power supply cable 126 is electrically connected to the PCIE card 140.

[0125] First, the process of the second copper bar 182 supplying power to multiple PCIE cards 140 on the second circuit board 120 will be described.

[0126] See Figure 7 and Figure 8 As shown, multiple second power supply sockets 125 are arranged in sequence along the first side 120a. One side of the PCIE card 140 facing the first side 120a has a power interface 142. Both ends of the second power supply cable 126 are respectively plugged into the second power supply socket 125 and the power interface 142 through connectors. The second power supply socket 125 is also electrically connected to the second copper bar 182 through the second internal trace L2 of the second circuit board 120. Among them, the second internal trace L2 is shown by a dotted line in Figure 8 to distinguish it from the first internal trace L1.

[0127] That is to say, electric energy enters from the second copper bar 182, is distributed to different second power supply sockets 125 through the second internal trace L2 of the second circuit board 120, and then supplies power to the PCIE card 140 via the second power supply cable 126.

[0128] Next, the process of the first power supply socket 160 supplying power to multiple PCIE cards 140 on the second circuit board 120 will be described.

[0129] Please continue to see Figure 7 and Figure 8 As shown, in this embodiment, the first power supply socket 160 is electrically connected to different second power supply sockets 125 through the first internal trace L1 of the second circuit board 120, and then electrically connected to the PCIE card 140 via the second power supply cable 126. Electric energy enters from the first power supply socket 160, is distributed to different second power supply sockets 125 through the first internal trace L1 of the second circuit board 120, and then supplies power to the PCIE card 140 via the second power supply cable 126.

[0130] That is to say, when the PCIE card 140 is powered by the first power supply socket 160, only the first internal trace L1 is added on the second circuit board 120, and the remaining power supply circuits and the second copper bar 182 are shared power supply circuits, resulting in less modification to the second circuit board 120.

[0131] Please continue to refer to Figure 6 and Figure 7 As shown, the number of the protrusions 123 is at least two, and the at least two protrusions 123 are arranged at intervals along the side edge, and each protrusion 123 is provided with a first power supply socket 160.

[0132] The number of the protrusions 123 can be two, three or more than three, and is specifically set according to the power consumption of the PCIE card 140.

[0133] In this embodiment, the number of the protrusions 123 is two, and the two protrusions 123 are arranged at intervals along the first side edge 120a. Each protrusion 123 is provided with a first power supply socket 160. In Figure 8 one of the first power supply sockets 160 is connected to a part of the second power supply sockets 125, and the other first power supply socket 160 is connected to another part of the power supply sockets 125. In Figure 9 one of the first power supply sockets 160 is connected to all of the second power supply sockets 125, and the other power supply socket 160 is connected to all of the second power supply sockets 125. By providing two first power supply sockets 160, the electric energy supplied to the second circuit board 120 can be increased, thereby increasing the power supply capacity of the second circuit board 120, so that more PCIE cards 140 with higher quantity or computing speed can be provided on the second circuit board 120.

[0134] By directly electrically connecting the first signal cable 150 to the PCIE card 140, the enhancement chip on the second circuit board 120 can be omitted, and the space on the second circuit board 120 can be saved. By arranging the first power supply socket 160 on the edge of the second circuit board 120, the space occupied by the first power supply socket 160 on the second circuit board 120 can be reduced, and the saved space can be used to arrange other functional devices of the PCIE card and can reduce the wiring difficulty of the second circuit board 120. In this embodiment, the other functional device can be a network card 190.

[0135] Please continue to refer to Figure 7 and Figure 8 As shown, the second circuit board 120 further has a second installation slot 127, and the server 100 further includes a network card 190, and the network card 190 is inserted into the second installation slot 127.

[0136] Please continue to refer to Figure 8As shown, the second mounting slot 127 is located in the middle area of the second circuit board 120, and the number of the first mounting slots 121 on both sides of the second mounting slot 127 is the same.

[0137] In this embodiment, eight first mounting slots 121 are shown. Four first mounting slots 121 are provided on each side of the second mounting slot 127 along the length direction X. A PCIE card 140 can be provided on each first mounting slot 121. Four first mounting slots 121 are provided on each side of the second mounting slot 127 along the width direction Y, so that the arrangement of the PCIE cards 140 on the second circuit board 120 is relatively neat.

[0138] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "mounting", "connecting", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, or the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0139] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence.

[0140] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and not to limit them; although the technical solutions of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A server, characterized in that, It includes a first circuit board, a second circuit board, a central processing unit, a PCIE card, a first signal cable, and a first power supply socket. The central processing unit is arranged on the first circuit board; There is a first mounting slot on the second circuit board. The PCIE card is arranged in the first mounting slot. One end of the first signal cable is electrically connected to the first circuit board, and the first signal cable extends to the first mounting slot to be electrically connected to the PCIE card; The first power supply socket is arranged at one side edge of the second circuit board. The first power supply socket is used to supply power to the PCIE card. There is a protrusion on the side edge, and the first power supply socket is arranged on the protrusion; The server further includes a power supply backplane, a first copper bar, and a second copper bar. The first copper bar electrically connects the power supply backplane and the first circuit board. The second copper bar electrically connects the power supply backplane and the second circuit board. A power conversion module is arranged on the power supply backplane. The power conversion module is used to receive an external power supply and convert it into a power supply suitable for the first circuit board and the second circuit board; The second circuit board further includes a second power supply socket and a second power supply cable. The second power supply socket is arranged at the edge of the side of the second circuit board. Two ends of the second power supply cable are respectively connected to the second power supply socket and a power supply interface on the PCIE card through connectors; The second power supply socket is electrically connected to the second copper bar through a second internal trace of the second circuit board; The first power supply socket is electrically connected to different second power supply sockets through a first internal trace of the second circuit board.

2. The server according to claim 1, wherein The first circuit board and the second circuit board are arranged along the height direction of the server. The second circuit board has a first board surface and a second board surface opposite to each other along the height direction. The first board surface faces the first circuit board. The PCIE card is located on one side of the second board surface. The first mounting slot penetrates through the first board surface and the second board surface. The first signal cable is arranged in the first mounting slot through the first board surface to be connected to the PCIE card.

3. The server according to claim 2, wherein The first signal cable includes a first connector, a first lead wire, and a second connector that are electrically connected in sequence. The first connector is electrically connected to the first circuit board. The second connector includes a signal socket and a first mounting part. The first mounting part is connected to the signal socket; The first mounting part is located on one side of the first board surface. There is a second mounting part on the second circuit board. The first mounting part is connected to the second mounting part; The signal socket is arranged in the first mounting slot and extends out of the second board surface through the first mounting slot. The PCIE card is plugged into the signal socket.

4. The server according to claim 3, wherein The server further includes a first power supply cable. The first power supply cable is used to electrically connect the power supply backplane and the first power supply socket.

5. The server according to claim 4, characterized in that, The number of the second power supply sockets, the number of the second power supply cables, and the number of the PCIE cards are the same.

6. The server according to claim 5, wherein The number of the protruding parts is at least two, and the at least two protruding parts are arranged at intervals along the side of the second circuit board, and the first power supply socket is arranged on each of the protruding parts.

7. The server according to any one of claims 1 to 6, characterized in that, The second circuit board further has a second installation slot, and the server further includes a network card, and the network card is inserted into the second installation slot.

8. The server according to claim 7, wherein The second installation slot is located in the middle area of the second circuit board.

9. The server according to claim 4, wherein The server further includes a chassis, and the first circuit board, the second circuit board and the power supply backplane are all located in the chassis.

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