Method for fitting xy axis movement path of pcb laser drilling machine, terminal and medium
By fitting the XY axis movement path in a PCB laser drilling machine, the problem of low efficiency in the existing technology is solved, the path is accurately simulated and optimized, and the processing efficiency and accuracy are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MFLEX YANCHENG CO LTD
- Filing Date
- 2023-09-25
- Publication Date
- 2026-07-10
AI Technical Summary
The lack of a fitting method for the XY axis movement path of PCB laser drilling machines in the existing technology leads to low processing efficiency and makes it impossible to intuitively observe the running trajectory of the planned path, which affects production efficiency.
This paper provides a method for fitting the XY axis movement path of a PCB laser drilling machine. By acquiring the point and boundary information on the path to be drilled, the fitting point is calculated, the XY axis movement path is output, the actual running trajectory of the machine is simulated, and the path planning is optimized.
It achieves accurate fitting of the XY axis movement path, provides real-time optimization guidance, reduces repeated paths, improves processing efficiency, and reduces accuracy errors.
Smart Images

Figure CN117206716B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of electronic technology, specifically relating to a fitting method, terminal, and medium for the XY axis movement path of a PCB laser drilling machine. Background Technology
[0002] PCB (Printed Circuit Board) is an important electronic component. It serves as the support for electronic components and the carrier for their electrical interconnection. Because it is manufactured using electronic printing techniques, it is called a "printed" circuit board.
[0003] The PCB manufacturing process includes drilling holes in the copper plate, which is accomplished using a multi-axis laser drilling machine. The main time-consuming steps in copper plate processing include laser ablation to create holes and laser travel time. The laser travel time is related to the length of the drilling path, as well as the laser's speed and acceleration.
[0004] Please see Figure 1 , Figure 1 Mark 1 represents the lens assembly, Mark 2 represents the laser cavity, Mark 3 represents the laser drilling platform (the flexible plate to be processed is placed on the laser drilling platform), and Mark 4 represents the processing range of the galvanometer axis. The moving parts of the laser drilling machine are divided into two parts: the AB axis movement inside the galvanometer device (hereinafter referred to as the galvanometer axis), and the XY axis movement of the laser drilling machine. The galvanometer device (hereinafter referred to as the galvanometer) moves relative to the laser drilling platform 3, and thus relative to the flexible plate to be processed, through the movement of the XY axis. After the laser is driven to the processing point by the galvanometer device, the laser emits laser light through the laser cavity 2, and processes the copper plate through the movement of the galvanometer axis inside the galvanometer device. Since the range of motion of the galvanometer axis is limited by the laser tilt angle, its range of motion cannot exceed a certain limit. A square area is usually pre-formed on the laser drilling platform 3 (e.g., ...). Figure 1 The machining range of the galvanometer shaft (4) means that a square area will be formed on the flexible plate to be processed during production. Additionally... Figure 1 The diagram also shows lens assembly 1, which is used in conjunction with the moving parts of the laser drilling machine, but will not be described in detail here.
[0005] In traditional machining methods, the XY axes and galvanometer axes of a laser drilling machine move independently. The XY axes first move the galvanometer to a fixed position relative to the platform, and then the galvanometer axis moves to perform machining at that position. Once all the points that the galvanometer axis can process (i.e., all points within the preset machining range of the laser drilling platform) have been processed, the XY axes move the galvanometer to the next position and continue the process until all points have been processed. This method is inefficient in actual production.
[0006] To improve the operating efficiency of laser drilling machines, a method of linkage between the galvanometer axis and the XY axis is required. This can be roughly described as the simultaneous movement of the XY axis and the galvanometer axis, continuously processing along a pre-input hole path sequence. Because the XY axis has a slower speed, smaller acceleration, and larger error, while the galvanometer axis has a faster speed, larger acceleration, and smaller error, the movement of the XY axis should be rationally planned during PCB laser drilling to ensure the quality of copper plate processing. This involves maximizing the movement of the galvanometer axis to reduce accuracy errors caused by movement and improve the processing efficiency of laser drilling. In existing big data algorithms, there are many methods for path planning. Determining the optimal path using a particular method is a challenge. Current technology involves inputting the planned path into the laser drilling machine and observing its actual operation. However, this method requires repeated machine stops to verify the path's suitability and lacks direct on-site observation of the planned path's trajectory (requiring exporting machine operation data and using specialized software). This results in low efficiency, slow response times, and significant production disruptions. In other words, the planned drilling path represents the vector sum of AB-axis and XY-axis movements, making it impossible to determine the rationality of the XY-axis movement alone, thus hindering a direct assessment of its optimality. Therefore, a method is needed to offline fit a pre-input path planning sequence while allowing direct observation of the XY-axis trajectory, providing real-time guidance for path planning optimization. Furthermore, this fitting must accurately match the machine's actual operating trajectory. However, current technology lacks a method for fitting the XY-axis movement path of PCB laser drilling machines. Summary of the Invention
[0007] Therefore, the present invention provides a fitting method, terminal and medium for the XY axis movement path of a PCB laser drilling machine, which aims to solve the technical problem of the lack of a fitting method for the XY axis movement path of a PCB laser drilling machine in the prior art.
[0008] To solve the above-mentioned technical problems, the present invention provides a method for fitting the XY axis movement path of a PCB laser drilling machine, the fitting method comprising:
[0009] Obtain a point n on the drilling path in sequence. iand first boundary information, wherein the first boundary information includes x min x max y min y max ;
[0010] Based on point n i coordinates (x) i ,y i ) and the first boundary information, to determine the second boundary information, the second boundary information including x 2min x 2max y 2min y 2max ;
[0011] If the boundary dimension in the second boundary information does not exceed the preset dimension, it will be based on point n. i coordinates (x) i ,y i ), update the first boundary information;
[0012] When the boundary size in the second boundary information exceeds the preset size, the fitting point is calculated based on the first boundary information;
[0013] Once all points on the drilling path have been traversed, the XY axis movement path is output based on all the calculated fitted points.
[0014] Preferably, in the fitting method for the XY axis movement path of the PCB laser drilling machine, the step of when the boundary dimension in the second boundary information exceeds a preset dimension includes:
[0015] When the boundary dimension of the second boundary information is greater than half of the maximum machining range of the galvanometer axis on the laser drilling platform.
[0016] Preferably, in the fitting method for the XY axis movement path of the PCB laser drilling machine, the step of fitting the path based on point n... i coordinates (x) i ,y i In the step of determining the second boundary information, in addition to the first boundary information, the formula for calculating the second boundary information is:
[0017] x 2min =min{x i x min}、x 2max =max{x i x max}、y 2min =min{y i y min}、y 2max =max{y i y max};
[0018] Accordingly, the boundary size in the second boundary information is size = max{x} 2max -x 2min y 2max -y 2min}
[0019] Preferably, in the fitting method for the XY axis movement path of the PCB laser drilling machine, when the boundary dimension in the second boundary information does not exceed the preset dimension, the step is based on point n. i coordinates (x) i ,y i The step of updating the first boundary information includes:
[0020] If the boundary dimension in the second boundary information does not exceed the preset dimension, the first boundary information is updated, and the calculation formula is as follows:
[0021] Updated x min =min{x i x min}、x max =max{x i x max}、y min =min{y i y min}、y max =max{y i y max}
[0022] Preferably, in the fitting method for the XY-axis movement path of the PCB laser drilling machine, after the step of calculating the fitting point based on the first boundary information when the boundary dimension in the second boundary information exceeds the preset dimension, and before the step of outputting the XY-axis movement path based on all the calculated fitting points after all points on the drilling path have been traversed, the fitting method further includes:
[0023] Based on point n i coordinates (x) i ,y i ), initialize the first boundary information.
[0024] Preferably, in the method for fitting the XY-axis movement path of the PCB laser drilling machine, the formula for calculating the fitting point in the step of calculating the fitting point based on the first boundary information when the boundary dimension in the second boundary information exceeds the preset dimension is:
[0025] (1)
[0026] Among them, (x) jy j (j) represents the coordinates of the j-th fitted point, where j is a positive integer starting from 1.
[0027] Preferably, in the fitting method for the XY-axis movement path of the PCB laser drilling machine, the step of outputting the XY-axis movement path based on all the calculated fitting points after all points on the drilling path have been traversed includes:
[0028] Once all points on the drilling path have been traversed, an ordered XY-axis movement path is obtained by following the order in which the fitted points were acquired.
[0029] Preferably, in the fitting method for the XY axis movement path of the PCB laser drilling machine, the step of sequentially acquiring a point n on the path to be drilled... i Before the step of obtaining the first boundary information, the fitting method further includes:
[0030] Initialize the first boundary information, x min =y min =+∞,x max =y max =-∞.
[0031] To achieve the above objectives, the present invention provides a terminal, the terminal comprising:
[0032] At least one processor; and,
[0033] A memory communicatively connected to the at least one processor; wherein,
[0034] The memory stores instructions that can be executed by the at least one processor, which enables the at least one processor to perform the above-described method for fitting the XY axis movement path of the PCB laser drilling machine.
[0035] To achieve the above objectives, the present invention provides a computer-readable storage medium storing a computer program, characterized in that, when the computer program is executed by a processor, it implements the above-described method for fitting the XY-axis movement path of a PCB laser drilling machine.
[0036] The technical solution provided by this invention has the following advantages:
[0037] The method for fitting the XY axis movement path of a PCB laser drilling machine provided by this invention first obtains a point n on the path to be drilled in sequence. i and first boundary information, wherein the first boundary information includes x min x max y min y max According to point ni coordinates (x) i ,y i ) and the first boundary information, to determine the second boundary information, the second boundary information including x 2min x 2max y 2min y 2max Furthermore, if the boundary dimension in the second boundary information does not exceed the preset dimension, it will be determined based on point n. i coordinates (x) i ,y i The first boundary information is updated; when the boundary size in the second boundary information exceeds the preset size, the fitting point is calculated based on the first boundary information; finally, when all the points on the drilling path have been traversed, the XY axis movement path is output based on all the calculated fitting points. In this way, the XY axis movement path of the PCB laser drilling machine can be accurately simulated, which makes it easier to estimate the path shape and length of the XY axis movement and better assist in the drilling path planning.
[0038] Furthermore, by sequentially traversing the points on the path to be drilled, and establishing several fitting points on the PCB laser drilling machine during the traversal, and connecting each fitting point in sequence, the resulting trajectory is regarded as the XY axis motion trajectory of the laser drilling machine.
[0039] Furthermore, the XY-axis movement path fitting method for a PCB laser drilling machine provided by this invention achieves the finding of the galvanometer axis center through points on the drilling path. This allows for accurate fitting of the XY-axis movement path that matches the actual running trajectory of the machine, providing real-time guidance for optimizing the XY-axis movement path. This facilitates adjustment and optimization of the XY-axis movement, allowing the galvanometer axis to bear more movement, and thus reasonably controlling the length of the XY-axis movement path and the upper limit of acceleration during movement. It also minimizes the occurrence of repeated paths, facilitating the rational planning of the galvanometer axis and XY-axis movement. This eliminates the need to input the path into the laser drilling machine and repeatedly verify it through actual machine operation. Moreover, the fitting process allows for intuitive observation of the XY-axis movement path, enabling direct comparison of the differences and advantages / disadvantages of different methods in determining the XY-axis movement path—a fast, simple, and convenient method. Attached Figure Description
[0040] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0041] Figure 1This is a schematic diagram of the moving part of a PCB laser drilling machine.
[0042] Figure 2 A schematic diagram of the original path for drilling holes in a PCB;
[0043] Figure 3 A schematic diagram of an embodiment of the fitting method for the XY axis movement path of the PCB laser drilling machine provided by the present invention;
[0044] Figure 4 This is a schematic diagram of an embodiment of the path fitted using the fitting method for the XY axis movement path of the PCB laser drilling machine of the present invention.
[0045] Figure 5 This is a schematic diagram of the actual operating path of a PCB laser drilling machine.
[0046] Figure 6 This is a schematic diagram of the first embodiment of the fitting method for the XY axis movement path of the PCB laser drilling machine of the present invention;
[0047] Figure 7 This is a schematic diagram of the terminal of the present invention.
[0048] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0049] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.
[0050] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0051] In this invention, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.
[0052] The following describes the implementation details of the fitting method for the XY axis movement path of the PCB laser drilling machine according to the first embodiment of the present invention. The following implementation details are provided for ease of understanding only and are not necessary for implementing this solution.
[0053] The specific process of this implementation method is as follows: Figure 6 As shown, it specifically includes:
[0054] Step S100: Obtain a point n on the drilling path in sequence. i and first boundary information, wherein the first boundary information includes x min x max y min y max ;
[0055] It should be understood that the drilling path is T = {n1, n2, ..., n}. k}, where n i Let n be the i-th point on path T. Obtain a point n on the drilling path in sequence. i That is, points in T are obtained in the order of i=1,2,...,k. In this embodiment, the drilling path is the drilling path on the copper plate, and correspondingly, the simulated fitting points are also the simulated XY axis paths.
[0056] It should be noted that when taking the first point and the first boundary information of the drilling path, the first boundary information usually needs to be initialized. For example, step S110 can be included before step S100 to initialize the first boundary information. min =y min =+∞,x max =y max =-∞; it can also be after step S100 and before step S200, including step S120, when point n i When n1 is the first point in the drilling path, n1 is used to initialize the first boundary information, or when n... i The first boundary information is initialized when the first point n1 in the drilling path is reached, x min =y min =+∞,x max =y max =-∞.
[0057] Specifically, n1 is used to initialize the first boundary information, which is x min =x max =x1, y min =y max =y1.
[0058] Step S200, based on point n i coordinates (x) i ,y i ) and the first boundary information, to determine the second boundary information, the second boundary information including x2min x 2max y 2min y 2max ;
[0059] It should be understood that the second boundary information refers to the first boundary information plus point n. i Subsequent boundary information.
[0060] Specifically, the formula for calculating the second boundary information is x. 2min =min{x i x min}、x 2max =max{x i x max}、y 2min =min{y i y min}、y 2max =max{y i y max Correspondingly, the boundary size in the second boundary information is size = max{x}. 2max -x 2min y 2max -y 2min}
[0061] Step S300: When the boundary dimension in the second boundary information does not exceed the preset dimension, it will be based on point n. i coordinates (x) i ,y i ), update the first boundary information;
[0062] It should be understood that if the boundary size of the second boundary information does not exceed the preset size, then the current addition point n is considered to be... i This can then be used to update the first boundary information; at this point, continue to take the next point n in T. i+1 Continue to determine the addition point n i+1 If the second boundary information exceeds the preset size, and the result is no, then update the first boundary information; continue to take the next point n in T. i+2 ... until the judgment result is yes, then proceed to step S400.
[0063] In this embodiment, the preset size is half of the maximum hole size that the galvanometer axis can drill on the laser drilling platform. Let the preset maximum machining range of the galvanometer axis be denoted as L (typically, the machining range of the galvanometer axis is a square with side length L), then the preset size is L / 2. Figure 1 As shown, Figure 1 The diagram shows the machining range of the galvanometer shaft.
[0064] Specifically, when the boundary dimension in the second boundary information does not exceed the preset dimension, the first boundary information is updated, and the calculation formula is as follows:
[0065] Updated x min =min{x i x min}、x max =max{x i x max}、y min =min{y i y min}、y max =max{y i y max}
[0066] Step S400: When the boundary size in the second boundary information exceeds the preset size, calculate the fitting point based on the first boundary information;
[0067] It should be understood that in this embodiment, the coordinates (x, y) of the fitting point are... j y j The calculation formula is as follows:
[0068] (1)
[0069] Among them, (x) j y j ) represents the j-th fitting point c j The coordinates of j are positive integers starting from 1.
[0070] For example:
[0071] Obtain a point n1 on the drilling path and the first boundary information in sequence. The first boundary information can be obtained using formula x. min =y min =+∞,x max =y max =-∞ initialization, or it can be initialized using n1, x min =x max =x1, y min =y max =y1; Based on n1 and the first boundary information, determine the second boundary information; If the boundary size in the second boundary information does not exceed the preset size, update the first boundary information according to the coordinates (x1, y1) of point n1. At this time, the first boundary information is: x min =x max =x1, y min =y max =y1;
[0072] Continue to sequentially obtain a point n2 on the drilling path and the first boundary information (at this time x) min =x max =x1, y min =y max =y1); Based on n2 and the first boundary information, determine the second boundary information (x). 2min =min{x2, x min} (at this point, it is min{x1, x2}), x 2max =max{x2, x max} (at this point, it is max{x1, x2}), y 2min =min{y2,y min} (at this point, it is min{y1, y2}), y 2max =max{y2,y max (At this point, it is max{y2, y1})); The boundary size in the second boundary information does not exceed the preset size. The first boundary information will be updated according to the coordinates (x2, y2) of point n2. At this time, the first boundary information is: the updated x min =min{x2, x min}、x max =max{x2, x max}、y min =min{y2,y min}、y max =max{y2,y max};
[0073] Continue to obtain a point n on the drilling path in sequence. i And the first boundary information (x updated at this time) min Take min{x i-1 x min}、x max Take max{x i-1 x max}、y min Take min{y i-1 y min}、y max Take max{y i-1 y max}); According to n i And the first boundary information, to determine the second boundary information (x) 2min =min{x i x min}、x 2max =max{x i x max}、y 2min =min{y i ymin}、y 2max =max{y i y max If the boundary size in the second boundary information exceeds the preset size, the fitting point c1 is calculated based on the first boundary information.
[0074] This process continues until all points along the drilling path have been traversed, at which point the fitted point c can be obtained. j (j=1, 2,...). c1, c2,...,c j It is an ordered set of path points, generated in the order of traversing the drilling path.
[0075] Step S500: After all points on the drilling path have been traversed, the XY axis movement path is output based on all the calculated fitted points.
[0076] It should be understood that the XY axis movement path is fitted based on the drilling path and is ordered, so that the fitting of the XY axis movement path is more accurate.
[0077] Specifically, step S500 includes:
[0078] Once all points on the drilling path have been traversed, an ordered XY-axis movement path is obtained by following the order in which the fitted points were acquired.
[0079] The XY axis movement path can be formed by connecting the points in sequence according to the order in which the fitted points were generated.
[0080] For example, the fitted points obtained by traversing the path to be drilled include c1, c2, ... c t At this point, c1, c2, ..., c t Connecting them sequentially gives the simulated XY axis movement path.
[0081] In addition, after step S400 and before step S500, the fitting method further includes:
[0082] Step S600, based on point n i coordinates (x) i ,y i ), initialize the first boundary information.
[0083] It should be understood that, based on n i The fitted point c was calculated when the boundary size of the updated second boundary information exceeded L / 2. j Next, the first boundary information needs to be initialized before calculating the next fitting point. The initialized first boundary information is: x min =x max=x i y min =y max =y i .
[0084] Furthermore, Figure 4 This diagram illustrates an embodiment of the path fitted using the XY-axis movement path fitting method of the PCB laser drilling machine of the present invention. Figure 5 This diagram illustrates the actual operating path of a PCB laser drilling machine. (By comparison...) Figure 4 and Figure 5 It can be seen that the fitting method for the XY axis movement path of the PCB laser drilling machine using the present invention is very close to the actual running path of the PCB laser drilling machine, and can be accurately fitted.
[0085] To illustrate this more clearly, the following example is provided:
[0086] S1, from the drilling path T={n1, n2, ..., n k Take n in order i The value of i is incremented by 1 each time the coordinates of the next point are obtained. We start by taking values from n1, and initialize the first boundary information x before S1. min =y min =+∞,x max =y max =-∞;
[0087] S2, based on the coordinates (x1, y1) of n1 and the first boundary information, determine the second boundary information, x 2min =min{x1, x min}、x 2max =max{x1, x max}、y 2min =min{y1, y min}、y 2max =max{y1, y max};
[0088] S3, the boundary size of the second boundary information does not exceed L / 2, and will be based on point n i Given the coordinates (x1, y1), update the first boundary information x. min =x max =x1, y min =y max =y1;
[0089] S4, continue from the drilling path T={n1, n2, ..., n k Take n2 in order from};
[0090] S5, Based on the coordinates (x2, y2) of n2 and the first boundary information, determine the second boundary information, x 2min =min{x2, x min}、x 2max =max{x2, x max}、y 2min =min{y2,y min}、y 2max =max{y2,y max};
[0091] S6, the boundary size of the second boundary information exceeds L / 2, and the fitting point c1 is calculated based on the first boundary information;
[0092] S7, Based on the coordinates (x2, y2) of point n2, initialize the first boundary information: the initialized x min =x max =x2, y min =y max =y2.
[0093] S8, continue from the drilling path T={n1, n2, ..., n k Take n3 in order from}; ......
[0094] S X Once all points on the drilling path have been traversed, no more points are taken from the drilling path. Based on all the calculated fitted points, the XY axis movement path is output.
[0095] Please see Figure 3 , Figure 3 The example shown in the diagram has the first fitted point at point n. 10 When the boundary size of the second boundary information exceeds L / 2, c1 can be calculated. c1 is then calculated based on the bolded black boundary information (i.e., the boundary information formed by n1 to n9). After calculating c1, based on n... 10 Initialize the first boundary information, x min =x max =x 10 y min =y max =y 10 At this point, the second boundary information is x. 2min =x 2max =x 10 y 2min =y 2max =y 10 , Figure 3 This illustrates the state when the 10th point is reached, at which point x... ’The area shown represents the x value in the second boundary information at this point. 2min x 2max x min x max Continue iterating through n 11 ... to find the next fitted point.
[0096] The method for fitting the XY axis movement path of a PCB laser drilling machine provided by this invention first obtains a point n on the path to be drilled in sequence. i and first boundary information, wherein the first boundary information includes x min x max y min y max According to point n i coordinates (x) i ,y i ) and the first boundary information, to determine the second boundary information, the second boundary information including x 2min x 2max y 2min y 2max Furthermore, if the boundary dimension in the second boundary information does not exceed the preset dimension, it will be determined based on point n. i coordinates (x) i ,y i The first boundary information is updated; when the boundary size in the second boundary information exceeds the preset size, the fitting point is calculated based on the first boundary information; finally, when all the points on the drilling path have been traversed, the XY axis movement path is output based on all the calculated fitting points. In this way, the XY axis movement path of the PCB laser drilling machine can be accurately simulated, which makes it easier to estimate the path shape and length of the XY axis movement and better assist in the drilling path planning.
[0097] Furthermore, by sequentially traversing the points on the path to be drilled, and establishing several fitting points on the PCB laser drilling machine during the traversal, and connecting each fitting point in sequence, the resulting trajectory is regarded as the XY axis motion trajectory of the laser drilling machine.
[0098] Furthermore, the XY-axis movement path fitting method for a PCB laser drilling machine provided by this invention achieves the finding of the galvanometer axis center through points on the drilling path. This allows for accurate fitting of the XY-axis movement path that matches the actual running trajectory of the machine, providing real-time guidance for optimizing the XY-axis movement path. This facilitates adjustment and optimization of the XY-axis movement, enabling the galvanometer axis to bear more movement and thus reasonably controlling the length of the XY-axis movement path and the upper limit of acceleration during movement. It also minimizes the occurrence of repeated paths, facilitating the rational planning of the galvanometer axis and XY-axis movement. This eliminates the need to repeatedly verify the path by inputting it into the laser drilling machine and observing its actual operation. It is important to emphasize that the fitting method of this invention does not aim for the shortest movement path, but rather to find the path to the galvanometer axis center to facilitate reasonable adjustment and optimization of the XY-axis movement, allowing the galvanometer axis to bear more movement and thus providing guidance for optimizing the real-time XY-axis movement path. Moreover, the fitting process allows for intuitive observation of the XY-axis movement path, enabling a direct comparison of the differences and advantages / disadvantages of different methods in determining the XY-axis movement path.
[0099] Subsequently, based on the optimized path, and with the design optimization of the XY axis moving speed and acceleration, the accuracy error caused by the movement of the XY axis in the laser drilling machine can be reduced and the processing efficiency of laser drilling can be improved due to the path optimization.
[0100] To achieve the above objectives, the present invention also provides a terminal, such as... Figure 7 As shown, the terminal includes at least one processor 701; and a memory 702 communicatively connected to the at least one processor 701; wherein the memory 702 stores instructions that can be executed by the at least one processor 701, the instructions being executed by the at least one processor 701 to enable the at least one processor 701 to perform the above-described fitting method for the XY axis movement path of the PCB laser drilling machine.
[0101] The memory 702 and processor 701 are connected via a bus, which can include any number of interconnecting buses and bridges, connecting various circuits of one or more processors 701 and memory 702. The bus can also connect various other circuits, such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art and therefore will not be described further herein. A bus interface provides an interface between the bus and the transceiver. The transceiver can be a single element or multiple elements, such as multiple receivers and transmitters, providing a unit for communicating with various other devices over a transmission medium. Data processed by processor 701 is transmitted over a wireless medium via an antenna, which further receives data and transmits it to processor 701.
[0102] Processor 701 is responsible for managing the bus and general processing, and can also provide various functions, including timing, peripheral interfaces, voltage regulation, power management, and other control functions. Memory 702 can be used to store data used by processor 701 during operation.
[0103] The technical solution provided by this invention has the following advantages:
[0104] The method for fitting the XY axis movement path of a PCB laser drilling machine provided by this invention first obtains a point n on the path to be drilled in sequence. i and first boundary information, wherein the first boundary information includes x min x max y min y max According to point n i coordinates (x) i ,y i ) and the first boundary information, to determine the second boundary information, the second boundary information including x 2min x 2max y 2min y 2max Furthermore, if the boundary dimension in the second boundary information does not exceed the preset dimension, it will be determined based on point n. i coordinates (x) i ,y i The first boundary information is updated; when the boundary size in the second boundary information exceeds the preset size, the fitting point is calculated based on the first boundary information; finally, when all the points on the drilling path have been traversed, the XY axis movement path is output based on all the calculated fitting points. In this way, the XY axis movement path of the PCB laser drilling machine can be accurately simulated, which makes it easier to estimate the path shape and length of the XY axis movement and better assist in the drilling path planning.
[0105] Furthermore, by sequentially traversing the points on the path to be drilled, and establishing several fitting points on the PCB laser drilling machine during the traversal, and connecting each fitting point in sequence, the resulting trajectory is regarded as the XY axis motion trajectory of the laser drilling machine.
[0106] Furthermore, the XY-axis movement path fitting method for a PCB laser drilling machine provided by this invention achieves the finding of the galvanometer axis center through points on the drilling path. This allows for accurate fitting of the XY-axis movement path that matches the actual running trajectory of the machine, providing real-time guidance for optimizing the XY-axis movement path. This facilitates adjustment and optimization of the XY-axis movement, allowing the galvanometer axis to bear more movement, and thus reasonably controlling the length of the XY-axis movement path and the upper limit of acceleration during movement. It also minimizes the occurrence of repeated paths, facilitating the rational planning of the galvanometer axis and XY-axis movement. This eliminates the need to input the path into the laser drilling machine and repeatedly verify it through actual machine operation. Moreover, the fitting process allows for intuitive observation of the XY-axis movement path, enabling direct comparison of the differences and advantages / disadvantages of different methods in determining the XY-axis movement path—a fast, simple, and convenient method.
[0107] To achieve the above objectives, the present invention provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the above-described method for fitting the XY-axis movement path of a PCB laser drilling machine.
[0108] That is, those skilled in the art will understand that all or part of the steps in the methods described above can be implemented by a program instructing related hardware. This program is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.
[0109] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. Based on the embodiments of the present invention, those skilled in the art can make other variations or modifications without creative effort, and all such variations or modifications should fall within the scope of protection of the present invention.
Claims
1. A method for fitting the XY axis movement path of a PCB laser drilling machine, characterized in that, The fitting method includes: Obtain a point n on the drilling path in sequence. i and first boundary information, wherein the first boundary information includes x min x max y min y max ; Based on point n i coordinates (x) i ,y i ) and the first boundary information, to determine the second boundary information, the second boundary information including x 2min x 2max y 2min y 2max The second boundary information refers to the first boundary information plus point n. i Subsequent boundary information; If the boundary dimension in the second boundary information does not exceed the preset dimension, it will be based on point n. i coordinates (x) i ,y i The first boundary information is updated using the following formula: updated x min =min{x i x min }、x max =max{x i x max }、y min =min{y i y min }、y max =max{y i y max }; When the boundary dimension in the second boundary information exceeds the preset dimension, the fitting point is calculated based on the first boundary information. The step of when the boundary dimension in the second boundary information exceeds the preset dimension includes: when the boundary dimension of the second boundary information is greater than half of the maximum processing range of the galvanometer axis on the laser drilling platform. Once all points on the drilling path have been traversed, the XY axis movement path is output based on all the calculated fitted points. The formula for calculating the second boundary information is as follows: x 2min =min{x i ,x min }、x 2max =max{x i ,x max },and 2min =min{y i ,and min },and 2max =max{y i ,and max }; Accordingly, the boundary size in the second boundary information is size = max{x} 2max -x 2min y 2max -y 2min } 2. The fitting method for the XY axis movement path of the PCB laser drilling machine as described in claim 1, characterized in that, After the step of calculating the fitting point based on the first boundary information when the boundary size in the second boundary information exceeds the preset size, and before the step of outputting the XY axis movement path based on all the calculated fitting points after all points on the drilling path have been traversed, the fitting method further includes: Based on point n i coordinates (x) i ,y i ), initialize the first boundary information.
3. The fitting method for the XY axis movement path of the PCB laser drilling machine as described in claim 1, characterized in that, In the step of calculating the fitting point based on the first boundary information when the boundary size in the second boundary information exceeds the preset size, the formula for calculating the fitting point is as follows: ;(1) Among them, (x) j y j (j) represents the coordinates of the j-th fitted point, where j is a positive integer starting from 1.
4. The fitting method for the XY axis movement path of the PCB laser drilling machine as described in claim 1, characterized in that, The step of outputting the XY axis movement path based on all the calculated fitted points after all points on the drilling path have been traversed includes: Once all points on the drilling path have been traversed, an ordered XY-axis movement path is obtained by following the order in which the fitted points were acquired.
5. The fitting method for the XY axis movement path of the PCB laser drilling machine as described in claim 1, characterized in that, The step is to sequentially obtain a point n on the drilling path. i Before the step of obtaining the first boundary information, the fitting method further includes: Initialize the first boundary information, x min =y min =+∞,x max =y max =-∞.
6. A terminal, characterized in that, include: At least one processor; as well as, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the fitting method for the XY axis movement path of the PCB laser drilling machine as described in any one of claims 1 to 5.
7. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the fitting method for the XY axis movement path of the PCB laser drilling machine as described in any one of claims 1 to 5.