Display module and display device
By incorporating heat dissipation and ventilation devices into the flexible display module, the heat from the driver chip is carried away by airflow, thus solving the problem of excessively high driver chip temperature and enabling normal display and low-power operation of the display module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAMEN TIANMA DISPLAY TECH CO LTD
- Filing Date
- 2023-09-20
- Publication Date
- 2026-07-10
Smart Images
Figure CN117255535B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology
[0002] Among existing display technologies, Organic Light-Emitting Diode (OLED) displays possess numerous superior characteristics, including thinness, active light emission, fast response time, wide viewing angle, wide color gamut, high brightness, low power consumption, and the ability to fabricate flexible screens. These have attracted significant interest from the research and industrial communities, gradually making it the third-generation display technology after Liquid Crystal Displays (LCDs). OLEDs are diodes that emit light through carrier injection and recombination driven by an electric field, utilizing organic semiconductor materials and light-emitting materials. With the rapid development of OLED display technology, curved and flexible display products have quickly entered the market, and related technologies are advancing rapidly. In recent years, the creation of flexible display devices that can display images under bending conditions by forming display panels and wiring on flexible substrates made of flexible materials such as plastics has become the focus of next-generation display devices.
[0003] As full-screen smartphones become increasingly popular with consumers, the market demands higher screen-to-body ratios for display modules, requiring narrower bezels for flexible displays. The narrow bezel solution for flexible displays primarily relies on bending the bonding area to fold the driver chip to the back of the display module, where it is secured by adhesive tape.
[0004] Typically, there is no airflow around the driver chip, so the heat generated by the driver chip cannot dissipate, causing heat to accumulate at the driver chip. This leads to high temperatures and, in severe cases, may cause the driver chip to fail, affecting the use of the display module. Therefore, this is a technical problem that urgently needs to be solved in this field. Summary of the Invention
[0005] In view of this, the present invention provides a display module that solves the problem of how to avoid excessive temperature of the driver chip.
[0006] In a first aspect, this application provides a display module, including:
[0007] The display panel includes a bonding part, on which a flexible circuit board and a driver chip are bonded;
[0008] A heat dissipation device, the heat dissipation device including a blowing mode, the heat dissipation device and the driving chip are respectively electrically connected to the flexible circuit board;
[0009] The first tape is located on the side of the driver chip away from the bonding part. The orthographic projection of the first tape onto the plane where the light-emitting surface of the display module is located is within the orthographic projection of the bonding part onto the plane where the light-emitting surface of the display module is located. The edge of the first tape is adhered and fixed to the bonding part.
[0010] A ventilation device is included between the bonding part and the first tape. The ventilation device is connected to the heat dissipation device. When the temperature of the driver chip is higher than a preset value, the heat dissipation device starts the blowing mode and blows the cold air of the heat dissipation device between the first tape and the driver chip through the ventilation device.
[0011] Secondly, the present invention also provides a display device including the above-described display module.
[0012] Compared with the prior art, the display module and display device provided by the present invention achieve at least the following beneficial effects:
[0013] The present invention provides a display module and a display device. The display module includes: a display panel, the display panel including a bonding portion, the bonding portion bonding a flexible circuit board and a driver chip; a heat dissipation device, the heat dissipation device including a blowing mode, the heat dissipation device and the driver chip being electrically connected to the flexible circuit board respectively; a first adhesive tape, the first adhesive tape being located on the side of the driver chip away from the bonding portion, the orthographic projection of the first adhesive tape on the plane where the light-emitting surface of the display module is located being located within the orthographic projection of the bonding portion on the plane where the light-emitting surface of the display module is located, and the edge of the first adhesive tape being adhered and fixed to the bonding portion; a ventilation device is included between the bonding portion and the first adhesive tape, the ventilation device being connected to the heat dissipation device. When the temperature of the driver chip is higher than a preset value, the heat dissipation device activates the blowing mode, and the cooling air of the heat dissipation device is blown between the first adhesive tape and the driver chip through the ventilation device. With this solution, there is airflow around the driver chip, which can quickly remove the heat of the driver chip, thereby reducing the temperature of the driver chip and preventing heat from accumulating at the driver chip, affecting the normal operation of the driver chip, and thus ensuring the normal display of the display module.
[0014] Of course, any product implementing this invention does not necessarily need to achieve all of the technical effects described above at the same time.
[0015] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description
[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.
[0017] Figure 1This is a schematic diagram of the structure of a display module in the prior art;
[0018] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;
[0019] Figure 3 This is a schematic diagram of the structure between a bonding part, a driving chip, a first adhesive tape, and a heat dissipation device provided in an embodiment of the present invention;
[0020] Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure along section B-B'.
[0021] Figure 5 yes Figure 3 A schematic diagram of another sectional view along section B-B';
[0022] Figure 6 yes Figure 3 A magnified view of a blowing pattern at point C;
[0023] Figure 7 yes Figure 3 A magnified view of a ventilation mode at point C;
[0024] Figure 8 yes Figure 3 A magnified view of another blowing pattern at point C;
[0025] Figure 9 yes Figure 3 A magnified view of another ventilation mode at point C;
[0026] Figure 10 yes Figure 3 A magnified view of another blowing pattern at point C;
[0027] Figure 11 yes Figure 3 A magnified view of another ventilation mode at point C;
[0028] Figure 12 This is a schematic diagram of the structure between the bonding part, the driving chip, the first adhesive tape and the heat dissipation device provided in another embodiment of the present invention;
[0029] Figure 13 yes Figure 3 A schematic diagram of a cross-sectional structure at section A-A';
[0030] Figure 14 yes Figure 3 Another sectional view of the structure at section A-A';
[0031] Figure 15This is a schematic diagram of the structure of the first adhesive tape provided in an embodiment of the present invention;
[0032] Figure 16 This is a schematic diagram of the structure of the driver chip provided in an embodiment of the present invention;
[0033] Figure 17 This is a schematic diagram of the structure of a display module before bending, provided in an embodiment of the present invention;
[0034] Figure 18 This is a schematic diagram of the structure of the display device provided in an embodiment of the present invention. Detailed Implementation
[0035] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the invention.
[0036] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.
[0037] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0038] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0039] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0040] Figure 1 This is a schematic diagram of the structure of a display module in the prior art; such as Figure 1 As shown, a typical display module 00' mainly includes, in sequence, a cover plate 51', a front portion of a display panel 2', a first support plate 3', a buffer layer 4', an adhesive layer 5', a second support plate 6', a back portion of the display panel 2', a driver chip 7', and a driver chip tape 8'. When the display module 00' is operating, the driver chip 7' may generate heat, which is conducted to adjacent film layers and ultimately released into the air.
[0041] Specifically, such as Figure 1 As shown, the heat conduction path of the driver chip 7' can be:
[0042] ①Driver chip 7' → Driver chip tape 8' → Air. In this path, the heat generated by the driver chip 7' radiates downwards, and then diffuses left and right and downwards and outwards through the driver chip tape 8', and is finally conducted to the air.
[0043] ② In the path from driver chip 7' to adhesive layer 5' to buffer layer 4', the heat generated by driver chip 7' radiates upwards and is then conducted through adhesive layer 5' and buffer layer 4', eventually reaching the air. In this path, the heat generated by driver chip 7' may be further conducted upwards after reaching buffer layer 4', potentially reaching the front surface of display panel 2'. Since the front surface of display panel 2' includes display area AA', when the heat generated by driver chip 7' is conducted into display area AA', it may affect the display.
[0044] In the existing design, the second support plate 6' and the adhesive layer 5' have poor thermal conductivity and slow heat conduction. Furthermore, there is no air flow around the driver chip 7', so the heat generated by the driver chip 7' cannot be dissipated. The heat accumulates at the driver chip 7', which will cause the driver chip 7' to have a high temperature. In severe cases, it may cause the driver chip 7' to fail, affecting the use of the flexible display module 00'.
[0045] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure between a bonding part, a driving chip, a first adhesive tape, and a heat dissipation device provided in an embodiment of the present invention; Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure along section B-B'; see reference. Figures 2-4 As shown, this embodiment provides a display module 00, including: a display panel 1, the display panel 1 including a bonding part 10, the bonding part 10 bonding a flexible circuit board 101 and a driver chip 102; a heat dissipation device 2, the heat dissipation device 2 including a blowing mode, the heat dissipation device 2 and the driver chip 102 being electrically connected to the flexible circuit board 101 respectively; a first adhesive tape 3, the first adhesive tape 3 being located on the side of the driver chip 102 away from the bonding part 10, the orthographic projection of the first adhesive tape 3 on the plane where the light-emitting surface of the display module 00 is located is within the orthographic projection of the bonding part 10 on the plane where the light-emitting surface of the display module 00 is located, and the edge of the first adhesive tape 3 being adhered and fixed to the bonding part 10; a ventilation device 4 is included between the bonding part 10 and the first adhesive tape 3, the ventilation device 4 being connected to the heat dissipation device 2, when the temperature of the driver chip 102 is higher than a preset value, the heat dissipation device 2 activates the blowing mode, and the ventilation device 4 blows the cold air of the heat dissipation device 2 between the first adhesive tape 3 and the driver chip 102.
[0046] Specifically, continue to refer to Figure 2As shown, the display module 00 provided in this embodiment includes a display panel 1, which includes a bonding part 10. In this embodiment, the bonding part 10 can be used to set multiple conductive pads (not shown in the figure) to bond a driver chip 102. Multiple electrical connection terminals (not shown in the figure) are provided on the flexible circuit board 101. One end of the driver chip 102 is electrically connected to the conductive pads, and the other end is electrically connected to the electrical connection terminals to realize the transmission of drive signals. Optionally, when the display panel 1 includes a display area AA, the display area AA in this embodiment can include multiple signal lines (such as scan lines or data lines). The driver chip 102 is used to realize electrical connection with the signal lines in the display area AA through the bonding part 10 of the display panel 1, thereby providing drive signals for the display panel 1 to realize the display function. In this embodiment, the method of electrical connection between the driver chip 102 and the signal lines in the display area AA is not described in detail. For details, please refer to the structure of the display panel 1 in the related art for understanding.
[0047] It should be noted that the shape and size of the display panel 1 are for illustrative purposes only and can be adjusted according to actual conditions. This application does not limit them in this regard.
[0048] Reference Figure 2 As shown, the heat dissipation device 2 can be located on the side of the display panel 1 away from the light-emitting surface of the display module 00, and can dissipate heat on the side of the display panel 1 away from the light-emitting surface; the heat dissipation device 2 can be a fan, combined with... Figure 3 and Figure 4 As shown, the heat dissipation device 2 includes a blowing mode. The blowing mode of the heat dissipation device 2 can expel hot air, thereby lowering the surface temperature of the object and achieving a heat dissipation effect. The heat dissipation device 2 and the driving chip 102 are electrically connected to the flexible circuit board 101. The flexible circuit board 101 can read the temperature of the driving chip 102 within a preset time and drive the blowing mode of the heat dissipation device 2 to turn on and off according to the temperature of the driving chip 102. The preset time can be a few seconds or minutes, and can also be adjusted according to the actual situation. There is no limitation on this.
[0049] Combination Figure 3 and Figure 4As shown, the first adhesive tape 3 can be a driver chip tape, which can be a single-sided tape. This single-sided tape has adhesive on the side closest to the bonding portion 10. Specifically, the single-sided tape has adhesive around its four edges closest to the bonding portion 10, but no adhesive in the rest of the tape except for the edges. The middle of the single-sided tape can be adhesive-free. The first adhesive tape 3 is located on the side of the driver chip 102 away from the bonding portion 10. The orthographic projection of the first adhesive tape 3 onto the plane containing the light-emitting surface of the display module 00 lies within the orthographic projection of the bonding portion 10 onto the plane containing the light-emitting surface of the display module 00, thus adhering and fixing the edge of the first adhesive tape 3 to the bonding portion 10. A ventilation device 4 is included between the bonding part 10 and the first adhesive tape 3. The ventilation device 4 is fixed to the bonding part 10 near the driver chip 102 by the first adhesive tape 3. The ventilation device 4 is connected to the heat dissipation device 2. Since the heat dissipation device 2 includes a blowing mode, when the temperature of the driver chip 102 is higher than a preset value, the heat dissipation device 2 activates the blowing mode. The ventilation device 4 blows the cold air of the heat dissipation device 2 between the first adhesive tape 3 and the driver chip 102. It can be understood that the heat dissipation device 2 and the ventilation device 4 work together to make air flow around the driver chip 102, which quickly removes the heat of the driver chip 102, thereby reducing the temperature of the driver chip 102 and preventing heat from accumulating at the driver chip 102, which would affect the normal operation of the driver chip 102, and thus ensure the normal display of the display module 00. It should be noted that when the cold air from the heat dissipation device 2 is blown between the first tape 3 and the driver chip 102 through the ventilation device 4, the first tape 3 and the driver chip 102 are in a separated state; the above preset value can be adjusted according to the actual situation, and this application does not make specific limitations on it.
[0050] As can be seen from the above embodiments, the display module 00 provided in this embodiment achieves at least the following beneficial effects:
[0051] The display module 00 provided in this embodiment includes: a display panel 1, which includes a bonding part 10, on which a flexible circuit board 101 and a driver chip 102 are bonded; a heat dissipation device 2, which includes a blowing mode, and the heat dissipation device 2 and the driver chip 102 are electrically connected to the flexible circuit board 101; a first adhesive tape 3, which is located on the side of the driver chip 102 away from the bonding part 10, and the orthographic projection of the first adhesive tape 3 on the plane where the light-emitting surface of the display module 00 is located is within the orthographic projection of the bonding part 10 on the plane where the light-emitting surface of the display module 00 is located, and the edge of the first adhesive tape 3 is adhered and fixed to the bonding part 10; the bonding part 10 and the first adhesive tape 3 are bonded together; the bonding part 10 and the first adhesive tape 3 are bonded together; the bonding part 10 and the first adhesive tape 102 ... A ventilation device 4 is included between the first tape 3 and the heat dissipation device 2. When the temperature of the driver chip 102 is higher than the preset value, the heat dissipation device 2 starts the blowing mode and blows the cold air of the heat dissipation device 2 between the first tape 3 and the driver chip 102 through the ventilation device 4. With this scheme, the ventilation device 4 and the heat dissipation device 2 cooperate to make air flow around the driver chip 102, which quickly removes the heat of the driver chip 102, thereby reducing the temperature of the driver chip 102 and preventing heat from accumulating at the driver chip 102, which would affect the normal operation of the driver chip 102, and thus ensure the normal display of the display module 00.
[0052] In one alternative embodiment, Figure 5 yes Figure 3 A schematic diagram of another sectional view along section B-B'; see reference. Figure 5 As shown, the heat dissipation device 2 also includes an exhaust mode. When the temperature of the driver chip 102 is lower than a preset value, the heat dissipation device 2 starts the exhaust mode and the airflow generated by the heat dissipation device 2 is drawn away by the ventilation device 4, so that the first adhesive tape 3 adheres to the surface of the driver chip 102.
[0053] Specifically, in combination Figure 3 and Figure 5 As shown, the heat dissipation device 2 also includes an exhaust mode. When the temperature of the driver chip 102 is lower than a preset value, the heat dissipation device 2 activates the exhaust mode. The airflow generated by the heat dissipation device 2 is drawn away by the ventilation device 4, so that the first adhesive tape 3 is adsorbed onto the surface of the driver chip 102. Heat dissipation is achieved by the first adhesive tape 3 contacting the driver chip 102, which can also reduce the temperature of the driver chip 102 and ensure the normal display of the display module 00. It should be noted that the exhaust mode only operates once. As long as the airflow between the first adhesive tape 3 and the driver chip 102 is drawn away and the first adhesive tape 3 is adhered to the surface of the driver chip 102, the heat dissipation device 2 does not need to be in the exhaust mode for a long time. It can be understood that the heat dissipation device 2 stops working to reduce the power consumption of the whole machine.
[0054] In one alternative embodiment, combined with Figure 3 and Figure 4As shown, the temperature of the cold air does not exceed the temperature of the driver chip 102. When the temperature of the cold air exceeds the temperature of the driver chip 102, the temperature of the air in the display module 00 increases as the temperature in the display module 00 increases, making it impossible to ventilate and cool the driver chip 102. Therefore, it is necessary to set the temperature of the cold air to not exceed the temperature of the driver chip 102, which is beneficial for blowing the cold air between the first tape 3 and the driver chip 102, thereby dissipating heat from the driver chip 102.
[0055] In one alternative embodiment, Figure 6 yes Figure 3 A magnified view of a blowing pattern at point C; combined with... Figure 3 and Figure 6 As shown, in this embodiment, the ventilation device 4 includes a first ventilation pipe 41 and a second ventilation pipe 42. Both the first and second ventilation pipes 41 and 42 can be hollow pipes. A ventilation component 43 is provided on the first ventilation pipe 41, controlling whether the first ventilation pipe 41 is open. The side of the second ventilation pipe 42 away from the first adhesive tape 3 is connected to the heat dissipation device 2. When the temperature of the driver chip 102 is higher than a preset value, the heat dissipation device 2 activates the blowing mode. The first and second ventilation pipes 41 and 42 cooperate with each other. Since the second ventilation pipe 42 is connected to the heat dissipation device 2, air is supplied to the first adhesive tape 3 and the driver chip 102 through the second ventilation pipe 42. Cool air is provided between the first ventilation pipe 41 and the first tape 3. When the ventilation component 43 controls the first ventilation pipe 41 to open, the ventilation component 43 opens to allow cool air to enter between the first tape 3 and the driver chip 102, so that the first tape 3 and the driver chip 102 are separated. Through the cooperation of the heat dissipation device 2, the ventilation component 43 located in the first ventilation pipe 41 and the second ventilation pipe 42, the air around the driver chip 102 is circulated, and the heat on the surface of the driver chip 102 is carried away, thereby reducing the temperature of the driver chip 102 and preventing heat from accumulating at the driver chip 102, which would affect the normal operation of the driver chip 102, and thus ensuring the normal display of the display module 00.
[0056] Optionally, Figure 7 yes Figure 3 A magnified view of a ventilation pattern at point C; combined with... Figure 3 and Figure 7As shown, in this embodiment, the ventilation device 4 includes a first ventilation pipe 41 and a second ventilation pipe 42. Both the first and second ventilation pipes 41 and 42 can be hollow pipes. A ventilation component 43 is provided on the first ventilation pipe 41, controlling whether the first ventilation pipe 41 is open. The side of the second ventilation pipe 42 away from the first tape 3 is connected to the heat dissipation device 2. When the temperature of the driver chip 102 is lower than a preset value, the heat dissipation device 2 activates the blowing mode. The first and second ventilation pipes 41 and 42 cooperate with each other. Since the second ventilation pipe 42 is connected to the heat dissipation device 2, the heat dissipation device 2 draws airflow away through the second ventilation pipe 42. The ventilation component 43 controls the first ventilation pipe 41 to be blocked. Therefore, the ventilation component 43... Closing the circuit draws airflow away from the first tape 3 and the driver chip 102, causing the first tape 3 to adhere to the surface of the driver chip 102. The first tape 3 contacts the driver chip 102 to dissipate heat, which also reduces the temperature of the driver chip 102 and prevents heat from accumulating at the driver chip 102, thus affecting its normal operation and ensuring the normal display of the display module 00. Since the blowing mode only draws air once, as long as the airflow between the first tape 3 and the driver chip 102 is drawn away and the first tape 3 adheres to the surface of the driver chip 102, the heat dissipation device 2 does not need to be in the blowing mode for a long time. It can be understood that the heat dissipation device 2 stops working to reduce the power consumption of the whole machine.
[0057] In an optional embodiment, the ventilation component 43 is located inside the first ventilation pipe 41. The ventilation component 43 includes a fixed baffle 431 and a first movable baffle 432 disposed opposite to each other. The side of the fixed baffle 431 away from the first movable baffle 432 is connected to the pipe wall of the first ventilation pipe 41. One end of the first movable baffle 432 is connected to the pipe wall of the first ventilation pipe 41, and the other end is a free end.
[0058] Specifically, in combination Figure 3 and Figure 6As shown, in this embodiment, the ventilation component 43 is located inside the first ventilation pipe 41. The ventilation component 43 includes a fixed baffle 431 and a first movable baffle 432 disposed opposite to each other. The fixed baffle 431 can be located above the first ventilation pipe 41, and the first movable baffle 432 can be located below the first ventilation pipe 41. The side of the fixed baffle 431 away from the first movable baffle 432 is fixedly connected to the inner wall of the first ventilation pipe 41. The fixed baffle 431 can be connected to the inner wall of the first ventilation pipe 41 by welding or by adhesive bonding, as long as the fixed baffle 431 can be fixed to the inner wall of the first ventilation pipe 41. This application does not limit the specific method. One end of the first movable baffle 432 is fixedly connected to the inner wall of the first ventilation pipe 41. The connection method can be by adhesive bonding or by directly welding the first movable baffle 432 to the first ventilation pipe 41. This method is not limited. The other end of the first movable baffle 432 is a free end, located outside the fixed baffle 431. When the temperature of the driver chip 102 exceeds a preset value, the heat dissipation device 2 activates the blowing mode, and the free end of the first movable baffle 432 is blown open by cold air, allowing the first ventilation pipe 41 to be in a through state. Cold air can also enter between the first tape 3 and the driver chip 102, separating the first tape 3 and the driver chip 102. Through the cooperation of the fixed baffle 431, the first movable baffle 432, and the heat dissipation device 2, air circulates around the driver chip 102, carrying away the heat from the surface of the driver chip 102, thereby reducing the temperature of the driver chip 102 and ensuring the normal display of the display module 00. Since the overall structure of the ventilation component 43 is relatively simple, the manufacturing difficulty of the ventilation device 4 can also be reduced. Figure 7 As shown, when the temperature of the driver chip 102 is lower than the preset value, the heat dissipation device 2 starts the exhaust mode, the free end of the first movable baffle 432 closes, so that the first movable baffle 432 is attracted to the fixed baffle 431. If the inner surface of the free end of the first movable baffle 432 is attracted to the side of the fixed baffle 431 away from the driver chip 102, the first ventilation pipe 41 is blocked, the airflow between the first tape 3 and the driver chip 102 is drawn away, so that the first tape 3 adheres to the surface of the driver chip 102, and the driver chip 102 is dissipated through the contact of the first tape 3.
[0059] In an alternative embodiment, reference continues... Figure 6 and Figure 7As shown, in this embodiment, the elastic modulus of the fixed baffle 431 is greater than that of the first movable baffle 432. The larger the elastic modulus, the greater the stress of the elastic deformation of the material, that is, the greater the material stiffness. For example, the material of the fixed baffle 431 can be metal, and the material of the first movable baffle 432 can be plastic. Therefore, the material stiffness of the fixed baffle 431 is greater than that of the first movable baffle 432. When the temperature of the driving chip 102 is higher than the preset value, the heat dissipation device 2 starts the blowing mode, and the cold air of the second ventilation pipe 42 enters between the first tape 3 and the driving chip 102 to facilitate blowing open the free end of the first movable baffle 432.
[0060] It should be noted that the material of the fixed baffle 431 can also be plastic, as long as the material rigidity of the fixed baffle 431 is greater than that of the first movable baffle 432, and there is no limitation on this.
[0061] The density of the first movable baffle 432 can be less than the density of the fixed baffle 431. The fixed baffle 431 can be made of metal, while the first movable baffle 432 can be made of plastic. The density of metal materials such as stainless steel is generally 7930 kg / m³. 3 The density of plastic is generally around 1500 kg / m³. 3 Compared to metal and plastic of the same volume, plastic can reduce weight by about 80%. With this solution, the first movable baffle 432 is lighter. When the temperature of the driver chip 102 is higher than the preset value, the heat dissipation device 2 starts the blowing mode. The free end of the first movable baffle 432 is easily blown open by the cold air, so that the first ventilation pipe 41 is in a through state, and the cold air can also enter between the first tape 3 and the driver chip 102.
[0062] In one alternative embodiment, Figure 8 yes Figure 3 A magnified view of another blowing pattern at point C; Figure 9 yes Figure 3 A magnified view of another ventilation mode at point C; see reference. Figure 8 and Figure 9 As shown, the ventilation component 43 is located at the end of the first ventilation pipe 41 away from the first tape 3. The ventilation component 43 includes a second movable baffle 433. One end of the second movable baffle 433 is connected to the pipe wall of the first ventilation pipe 41, and the other end is a free end.
[0063] Specifically, refer to Figure 8As shown, in this embodiment, the ventilation component 43 is located at the end of the first ventilation pipe 41 away from the first adhesive tape 3. The ventilation component 43 includes a second movable baffle 433. One end of the second movable baffle 433 is fixedly connected to the inner wall of the first ventilation pipe 41. The connection method can be adhesive or direct welding of the second movable baffle 433 to the first ventilation pipe 41; there is no limitation on the method. The other end of the second movable baffle 433 is a free end. When the temperature of the driving chip 102 is higher than a preset value, the heat dissipation device 2 activates the blowing mode, and the free end of the second movable baffle 433 is blown open by cold air, so that the first ventilation pipe 41 is in a through state. Cold air can also enter between the first adhesive tape 3 and the driving chip 102, so that the first adhesive tape 3 and the driving chip 102 are in a separated state, carrying away the heat on the surface of the driving chip 102, thereby reducing the temperature of the driving chip 102. Since the ventilation component 43 only involves the second movable baffle 433, its overall structure is simpler, which better reduces the manufacturing difficulty of the ventilation device 4. (Refer to...) Figure 9 As shown, when the temperature of the driver chip 102 is lower than the preset value, the heat dissipation device 2 starts the exhaust mode, the free end of the second movable baffle 433 closes, so that the second movable baffle 433 is adsorbed on the port of the first ventilation pipe 41 away from the first tape 3, so that the first ventilation pipe 41 is blocked, thereby drawing away the airflow between the first tape 3 and the driver chip 102, so that the first tape 3 adheres to the surface of the driver chip 102, and heat dissipation is performed on the driver chip 102 through the contact of the first tape 3.
[0064] Optionally, the material of the second movable baffle 433 may include plastic, which is lightweight and has good impact resistance and wear resistance.
[0065] In one alternative embodiment, Figure 10 yes Figure 3 A magnified view of another blowing pattern at point C; see reference. Figure 10 As shown, in this embodiment, the ventilation component 43 includes a solenoid valve 434, which is electrically connected to the flexible circuit board 101. When the temperature of the driver chip 102 is higher than a preset value, the heat dissipation device 2 starts the blowing mode. The heat dissipation device 2 provides cold air through the second ventilation pipe 42. The solenoid valve 434 controls the first ventilation pipe 41 to be open, so the solenoid valve 434 opens to allow cold air to enter between the first tape 3 and the driver chip 102, so that the first tape 3 and the driver chip 102 are in a separated state, taking away the heat on the surface of the driver chip 102, thereby reducing the temperature of the driver chip 102, avoiding the accumulation of heat at the driver chip 102, which would affect the normal operation of the driver chip 102, and thus ensuring the normal display of the display module 00.
[0066] Figure 11 yes Figure 3 A magnified view of another ventilation mode at point C; see reference. Figure 11 As shown, when the temperature of the driver chip 102 is lower than the preset value, the heat dissipation device 2 starts the blowing mode. The heat dissipation device 2 and the solenoid valve 434 cooperate with each other. The solenoid valve 434 closes, making the first ventilation pipe 41 blocked. The heat dissipation device 2 draws the airflow between the first tape 3 and the driver chip 102 through the second ventilation pipe 42, adsorbing the first tape 3 onto the surface of the driver chip 102. The first tape 3 contacts the driver chip 102 to dissipate heat, which can also reduce the temperature of the driver chip 102 and prevent heat from accumulating at the driver chip 102, affecting the normal operation of the driver chip 102, thereby ensuring the normal display of the display module 00. At the same time, it can also reduce the power consumption of the whole machine.
[0067] In one alternative embodiment, Figure 12 This is a schematic diagram illustrating the structure between the bonding part, the driver chip, the first adhesive tape, and the heat dissipation device according to another embodiment of the present invention; combined with Figure 3 and Figure 12 As shown, the first ventilation pipe 41 and the second ventilation pipe 42 are respectively bonded between the binding part 10 and the first adhesive tape 3. For example, the first ventilation pipe 41 and the second ventilation pipe 42 are fixedly connected to the binding part 10 by the first adhesive tape 3. Of course, depending on the actual situation, other methods can also be used to fix the first ventilation pipe 41 and the second ventilation pipe 42 to the binding part 10. This application does not limit this; the adopted solution is easy to operate and reduces the manufacturing difficulty of the display module 00. The first ventilation pipe 41 and the second ventilation pipe 42 have the same air outlet direction. For example, the first ventilation pipe 41 and the second ventilation pipe 42 are arranged opposite to each other. When the temperature of the driver chip 102 is higher than the preset value, the heat dissipation device 2 starts the blowing mode. When cold air is blown in through the second ventilation pipe 42, the ventilation component 43 can be quickly controlled to ensure it is open. Figure 3 As shown; or, the air outlet directions of the first ventilation duct 41 and the second ventilation duct 42 intersect, as shown. Figure 12 As shown, it can be understood that the first ventilation pipe 41 and the second ventilation pipe 42 can be placed at different positions between the binding part 10 and the first tape 3, and can be adjusted according to the actual situation, without limitation.
[0068] In one alternative embodiment, Figure 13 yes Figure 3 A schematic diagram of a cross-sectional structure at section A-A'; Figure 14 yes Figure 3 Another sectional view of the structure at section A-A'; see reference. Figure 13 and Figure 14As shown, the cross-sectional shape of the first ventilation pipe 41 and the second ventilation pipe 42 is circular, elliptical or rectangular. The first ventilation pipe 41 and the second ventilation pipe 42 can adopt different cross-sectional shapes. When the cross-sectional shape of the first ventilation pipe 41 and the second ventilation pipe 42 is rectangular, it is convenient to fix the binding part 10. Of course, depending on the actual situation, the cross-sectional shape of the first ventilation pipe 41 and the second ventilation pipe 42 can also be other shapes, and there is no limitation on this.
[0069] In one alternative embodiment, Figure 15 This is a schematic diagram of the structure of the first adhesive tape provided in an embodiment of the present invention; combined with Figure 3 and Figure 15 As shown, the first tape 3 includes a first region 31 and a second region 32 surrounding the first region 31. For example, the shape of the first tape 3 can be rectangular. The second region 32 is located around the perimeter of the first region 31. The orthographic projection of the driver chip 102 on the bonding part 10 is located within the orthographic projection of the first region 31 on the bonding part 10. The orthographic projection of the second region 32 on the bonding part 10 does not overlap with the orthographic projection of the driver chip 102 on the bonding part 10. The ventilation device 4 is bonded to the bonding part 10 through the second region 32. It can be understood that the side of the second region 32 near the bonding part 10 is covered with adhesive, and the ventilation device 4 is bonded to the bonding part 10 through the second region 32. The side of the first region 31 near the driver chip 102 is not covered with adhesive. When the temperature of the driver chip 102 is too high, cold air is blown between the driver chip 102 and the first region 31 to remove the heat from the surface of the driver chip 102 and dissipate heat from the surface of the driver chip 102.
[0070] In one alternative embodiment, Figure 16 This is a schematic diagram of the structure of the driver chip provided in an embodiment of the present invention; combined with Figure 2 and Figure 16 As shown, this embodiment also includes a detection element 1021, which is used to detect the temperature of the driver chip 102. The detection element 1021 can dynamically store the temperature parameters of the driver chip 102 in the internal storage unit 1022 of the driver chip 102. The flexible circuit board 101 can read the temperature parameters of the storage unit 1022 in the driver chip 102 once every preset time interval, so as to control the heat dissipation device 2 to start the blowing mode. When the heat dissipation device 2 includes a blowing mode, it is also convenient to control the heat dissipation device 2 to start the exhaust mode. It should be noted that the above-mentioned preset time can be a few seconds or minutes, and can also be adjusted according to the actual situation. This application does not limit it in this regard. It should be noted that the detection element 1021 and the storage unit 1022 are integrated inside the driver chip 102.
[0071] In one alternative embodiment, Figure 17 This is a schematic diagram of the structure of a display module before bending, provided in an embodiment of the present invention; see also Figure 17As shown, in this embodiment, the display panel 1 includes a display area AA and a bending area WA located on one side of the display area AA. The binding part 10 is located on the side of the bending area WA away from the display area AA, and the binding part 10 is bent toward the side away from the light-emitting surface of the display module 00. In the direction perpendicular to the light-emitting surface of the display module 00, the flexible circuit board 101 and the driving chip 102 are located on the side of the binding part 10 away from the light-emitting surface of the display module 00.
[0072] Specifically, the display panel 1 can be a flexible display panel 1, which can be a flexible organic light-emitting diode display panel 1. The display panel 1 includes a display area AA and a bending area WA located on one side of the display area AA. Optionally, the bending area WA can be located within the non-display area of the display panel 1, and the non-display area of the display panel 1 is at least partially arranged around the display area AA. In this embodiment, the binding part 10 is located on the side of the bending area WA away from the display area AA. It can be understood that since the display panel 1 in this embodiment is a flexible display panel 1, the binding part 10 being located on the side of the bending area WA away from the display area AA can be understood as follows: when the display panel 1 is flattened, in a direction parallel to the plane of the display panel 1, the binding part 10 is located on the side of the bending area WA away from the display area AA, and the binding part 10 is also located within the non-display area (not marked in the figure). In this embodiment, the bonding portion 10 can be bent toward the side opposite to the light-emitting surface of the display module 00, so that the bent bonding portion 10 is located on the side opposite to the light-emitting surface of the display module 00. At this time, in the direction perpendicular to the light-emitting surface of the display module 00, the flexible circuit board 101 and the driver chip 102 are located on the side of the bonding portion 10 opposite to the light-emitting surface of the display module 00. Therefore, a narrow bezel of the display module 00 can be achieved by bending the driver chip 102 to the back of the light-emitting surface of the display module 00. In other words, by bonding the flexible circuit board 101 and the driver chip 102 to the back of the bonding portion 10, the bezel of the display panel 1 can be reduced, that is, the portion of the display panel 1 not used for display can be reduced, thereby increasing the screen-to-body ratio of the display panel 1 and improving the user experience.
[0073] It should be noted that the shapes and sizes of the display area AA, the bonding part 10, the bending area WA, the driver chip 102, and the flexible circuit board 101 are for illustrative purposes only, and this application does not limit them.
[0074] Optionally, in one embodiment of the present invention, the display module 00 further includes a cover plate 5, which is located on the side of the display panel 1 away from the buffer layer 6, i.e., the cover plate 5 is disposed on the light-emitting side of the display panel 1. By providing the cover plate 5, the display panel 1 can be protected. Optionally, the display module 00 also includes optically clear adhesive (OCA, not shown in the figure), and the display panel 1 can be bonded to the cover plate 5 using the optical adhesive. Since the optical adhesive is colorless and transparent and has high light transmittance, it does not affect the display. At the same time, the optical adhesive has good bonding strength and can effectively fix the display panel 1 and the cover plate 5. In other embodiments of this application, the cover plate 5 and the display panel 1 can also be fixed in other ways, and this application does not limit this.
[0075] Optionally, in one embodiment of the present invention, the display module 00 further includes a polarizer 7, which is located between the optical adhesive (not shown in the figure) and the display panel 1. The polarizer 7 can be adhered to the light-emitting side of the display panel 1, or it can be fixed in other ways; this application does not limit this. In this embodiment, the cover plate 5 is fixed to the polarizer 7 by means of optical adhesive.
[0076] This embodiment provides a display device 200, including the aforementioned display module 00.
[0077] Based on the same inventive concept Figure 18 This is a schematic diagram of the structure of the display device provided in an embodiment of the present invention, with reference to... Figure 18 As shown, the present invention also provides a display device 200, which includes a display module 00, wherein the display module 00 is the display module 00 provided in the embodiments of the present invention. The embodiments of the display device provided in this application can be found in the above-described embodiments of the display module 00, and repeated descriptions will not be repeated. The device provided in this application can be embodied in any product or component with real-world functions, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.
[0078] As can be seen from the above embodiments, the display module and display device provided by the present invention achieve at least the following beneficial effects:
[0079] The present invention provides a display module and a display device. The display module includes: a display panel, the display panel including a bonding portion, the bonding portion bonding a flexible circuit board and a driver chip; a heat dissipation device, the heat dissipation device including a blowing mode, the heat dissipation device and the driver chip being electrically connected to the flexible circuit board respectively; a first adhesive tape, the first adhesive tape being located on the side of the driver chip away from the bonding portion, the orthographic projection of the first adhesive tape on the plane where the light-emitting surface of the display module is located being located within the orthographic projection of the bonding portion on the plane where the light-emitting surface of the display module is located, and the edge of the first adhesive tape being adhered and fixed to the bonding portion; a ventilation device is included between the bonding portion and the first adhesive tape, the ventilation device being connected to the heat dissipation device. When the temperature of the driver chip is higher than a preset value, the heat dissipation device activates the blowing mode, and the cooling air of the heat dissipation device is blown between the first adhesive tape and the driver chip through the ventilation device. By adopting this solution, the heat of the driver chip is quickly removed, thereby reducing the temperature of the driver chip, avoiding the accumulation of heat at the driver chip, which would affect the normal operation of the driver chip, and thus ensuring the normal display of the display module.
[0080] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims
1. A display module, characterized in that, include: The display panel includes a bonding part, on which a flexible circuit board and a driver chip are bonded; A heat dissipation device, the heat dissipation device including a blowing mode, the heat dissipation device and the driving chip are respectively electrically connected to the flexible circuit board; The first tape is located on the side of the driver chip away from the bonding part. The orthographic projection of the first tape onto the plane where the light-emitting surface of the display module is located is within the orthographic projection of the bonding part onto the plane where the light-emitting surface of the display module is located. The edge of the first tape is adhered and fixed to the bonding part. A ventilation device is included between the bonding part and the first tape. The ventilation device is connected to the heat dissipation device. When the temperature of the driver chip is higher than a preset value, the heat dissipation device starts the blowing mode and blows the cold air of the heat dissipation device to the space between the first tape and the driver chip through the ventilation device. The heat dissipation device also includes an exhaust mode. When the temperature of the driver chip is lower than a preset value, the heat dissipation device activates the exhaust mode and draws away the airflow generated by the heat dissipation device through the ventilation device, so that the first tape adheres to the surface of the driver chip.
2. The display module according to claim 1, characterized in that, The temperature of the cold air does not exceed the temperature of the driver chip.
3. The display module according to claim 1, characterized in that, The ventilation device includes a first ventilation pipe and a second ventilation pipe. The first ventilation pipe is provided with a ventilation component, which controls whether the first ventilation pipe is open. The side of the second ventilation pipe away from the first tape is connected to the heat dissipation device.
4. The display module according to claim 3, characterized in that, The ventilation component is located inside the first ventilation duct. The ventilation component includes a fixed baffle and a first movable baffle arranged opposite to each other. The side of the fixed baffle away from the first movable baffle is connected to the wall of the first ventilation duct. One end of the first movable baffle is connected to the wall of the first ventilation duct, and the other end is a free end.
5. The display module according to claim 4, characterized in that, The elastic modulus of the fixed baffle is greater than that of the first movable baffle.
6. The display module according to claim 5, characterized in that, The material of the first movable baffle includes plastic.
7. The display module according to claim 3, characterized in that, The ventilation component is located at the end of the first ventilation pipe away from the first tape. The ventilation component includes a second movable baffle, one end of which is connected to the wall of the first ventilation pipe, and the other end is a free end.
8. The display module according to claim 3, characterized in that, The ventilation component includes a solenoid valve, which is electrically connected to the flexible circuit board.
9. The display module according to claim 3, characterized in that, The first ventilation pipe and the second ventilation pipe are respectively bonded between the binding part and the first tape, and the air outlet directions of the first ventilation pipe and the second ventilation pipe are the same; or, the air outlet directions of the first ventilation pipe and the second ventilation pipe intersect.
10. The display module according to claim 3, characterized in that, The cross-sectional shape of the first ventilation pipe and the second ventilation pipe is circular, elliptical or rectangular.
11. The display module according to claim 1, characterized in that, The first tape includes a first region and a second region surrounding the first region. The orthographic projection of the driving chip on the bonding portion is located within the orthographic projection of the first region on the bonding portion. The orthographic projection of the second region on the bonding portion does not overlap with the orthographic projection of the driving chip on the bonding portion. The ventilation device is bonded to the bonding portion through the second region.
12. The display module according to claim 1, characterized in that, It also includes a detection element for detecting the temperature of the driver chip.
13. The display module according to claim 1, characterized in that, The display panel includes a display area and a bent area located on one side of the display area. The binding part is located on the side of the bent area away from the display area, and the binding part is bent toward the side away from the light-emitting surface of the display module. In a direction perpendicular to the light-emitting surface of the display module, the flexible circuit board and the driving chip are located on the side of the bonding portion opposite to the light-emitting surface of the display module.
14. A display device, characterized in that, Includes the display module as described in any one of claims 1-13.