A miniaturized TR assembly device with cooling function
By introducing irregularly shaped channels, heat dissipation pillars, and bimetallic sheets into the TR module, the problem of increased volume caused by the TR module cooling method was solved, achieving efficient cooling and miniaturized design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 成都贡爵微电子有限公司
- Filing Date
- 2023-10-07
- Publication Date
- 2026-05-19
AI Technical Summary
Existing TR module cooling methods increase module size, making miniaturization difficult and resulting in poor integration with the module.
It employs irregularly shaped channels, heat dissipation pillars, pads, and bimetallic strips, and through arc design and material selection, it achieves efficient heat dissipation and avoids increasing volume.
This achieves improved cooling efficiency and integration of TR modules without increasing their size, ensuring normal module operation.
Smart Images

Figure CN117279326B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of TR component technology, specifically a miniaturized TR component device with cooling function. Background Technology
[0002] In a general sense, a TR module refers to the part between the intermediate frequency (IF) and the antenna in a wireless transceiver system. One end of the TR module is connected to the antenna, and the other end is connected to the IF processing unit, thus forming a wireless transceiver system. It plays an important role in radar systems. The TR module also plays a very important role in wireless receiving systems. During operation, the TR module may overheat, so it is necessary to cool it down to ensure its normal operation.
[0003] Chinese patent discloses a miniaturized TR component device with cooling function (authorization announcement number CN212259652U). This patented technology, when in use, features fan blades. When external airflow blows the fan blades, it drives a auger shaft connected to the fan blades to rotate. The auger shaft drives the auger blades to rotate within the cylindrical body, promoting airflow within the outer shell and thus rapidly dissipating heat. A heat-conducting plate is installed between the top of the outer shell and the inner connecting plate, and the connection end between the heat-conducting plate and the inner connecting plate is coated with thermal grease, further promoting better heat dissipation and accelerating heat dissipation efficiency, thereby improving the heat dissipation efficiency of the outer shell. A ventilation mesh covers the grooved structure on the outer shell. The ventilation shroud serves to protect the wind turbine blades, and the connection point between the ventilation shroud and the top of the outer casing is coated with thermally conductive silicone grease, allowing heat from the top of the outer casing to be conducted to the ventilation shroud. This further accelerates heat dissipation as the wind turbine blades rotate. However, the cooling method described above uses blades to accelerate airflow for cooling, but the addition of blades results in poor integration between this component and the TR assembly, increasing the TR assembly's size and reducing its effectiveness. Currently, the poor integration between the cooling system and the TR assembly body leads to increased TR assembly size, hindering miniaturization and making it unsuitable as an integrated cooling function within the TR assembly body. Therefore, those skilled in the art provide a miniaturized TR assembly device with integrated cooling functionality to address the problems mentioned in the background art. Summary of the Invention
[0004] The purpose of this invention is to provide a miniaturized TR component device with a cooling function to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution:
[0006] A miniaturized TR component device with cooling function includes: a TR component body, a heat dissipation mechanism installed on the bottom of the TR component body for installation, a spacing opening disposed between the TR component bodies for spacing, and a guide mechanism fixedly installed below the heat dissipation mechanism.
[0007] The guiding mechanism includes: a first pad fixedly installed below the heat dissipation mechanism, a guide plate for guiding heat dissipation disposed below the first pad, and a second pad disposed below the guide plate;
[0008] The heat dissipation mechanism includes: a base installed at the bottom of the TR component body for installation, a through hole fixedly opened on the surface of the base, a bimetallic strip fitted inside the through hole, and a heat sink installed below the through hole.
[0009] In addition, the TR component itself is equipped with a discharge mechanism.
[0010] As a further embodiment of the present invention: the discharge mechanism includes: an inner core installed inside the TR component body, a shaped channel disposed on one side of the inner core, a heat insulation box connected to the lower end of the shaped channel, and a heat pipe connected to the bottom of the heat insulation box.
[0011] As a further embodiment of the present invention, it also includes: a pad fixedly disposed at the bottom of the TR component body, and a heat dissipation column for heat dissipation installed inside the pad.
[0012] As a further aspect of the present invention: the external shape of the irregular channel is an arc-shaped structure, and the irregular channel has a structure that is wider at the top and narrower at the bottom, and the irregular channel extends horizontally along the surface of the heat insulation box.
[0013] As a further aspect of the present invention: the lower end of the irregularly shaped channel is connected to the interior of the heat insulation box.
[0014] As a further embodiment of the present invention: the external shapes of the first gasket, the guide plate and the second gasket are all arc-shaped, and the first gasket, the guide plate and the second gasket are equidistant and stacked along the same vertical line.
[0015] As a further embodiment of the present invention: the surface of the first gasket is provided with a channel, the upper surface of the guide piece is fixedly provided with an aluminum strip, and the upper surface of the second gasket is provided with a copper strip.
[0016] As a further embodiment of the present invention: several heat dissipation columns are evenly distributed inside the pad, and the upper end of the heat dissipation column penetrates to the bottom of the upper TR component body, and the adjacent heat dissipation columns are arranged at different heights.
[0017] As a further embodiment of the present invention: the through holes are interconnected with the heat sink, and the through holes are configured in a one-to-one correspondence with the bimetallic strips.
[0018] Compared with the prior art, the beneficial effects of the present invention are:
[0019] 1. By setting a space inside the TR module body, a shaped channel is installed on one side of the inner core inside the TR module body. The overall external structure of the shaped channel adopts an arc design, and the internal space of the shaped channel is wider at the top and narrower at the bottom. The heat generated by the inner core is led out through the shaped channel. The lower end of the shaped channel is connected to the heat pipe through a heat insulation box. Finally, the heat is led away from the inner core through the heat pipe. The shaped channel and the TR module body are integrated and connected. It is made of copper-aluminum alloy material, which has thermal conductivity.
[0020] 2. By setting heat dissipation columns at the bottom of the TR module body, the heat dissipation columns penetrate the bottom of the TR module body and enter the inner bottom of the TR module body. Together with the irregular channel, the internal heat of the TR module body is drawn out. There are several heat dissipation columns in the TR module body, and the irregular channel is set inside the TR module body and is connected with the TR module body. In the process of guiding heat dissipation of the TR module body, the volume of the TR module body will not be increased, and the connection with the TR module body will be improved.
[0021] 3. A gasket is placed below the TR module body. Gasket 1, guide plate and gasket 2 are stacked on top of each other to form an arc structure. The arc structure can dissipate the heat to both sides. Aluminum strips and copper strips are set on the surface of guide plate and gasket 2. The thermal conductivity of copper strips is higher than that of aluminum strips. From low to high, the heat is dissipated outward. Gasket 1, guide plate and gasket 2 and TR module body are combined with each other. While playing a role in heat dissipation, it also improves the bonding between the gasket and TR module body. It also becomes the TR module body's own cooling and heat dissipation structure.
[0022] 4. By setting a bimetallic strip inside the base, the bimetallic strip bends when heated. When the TR module body gets too hot, the bimetallic strip will bend and open the through hole below. The heat is then dissipated through the through hole in conjunction with the heat sink. This helps to prevent dust from entering the TR module body and affecting the heat dissipation and cooling of the TR module body itself. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of a miniaturized TR component device with cooling function.
[0024] Figure 2 This is an isometric structural diagram of the TR component body in a miniaturized TR component device with cooling function.
[0025] Figure 3 This is a schematic diagram of the internal structure of the TR component body in a miniaturized TR component device with cooling function.
[0026] Figure 4 This is a schematic diagram of the bottom structure of the TR component body in a miniaturized TR component device with cooling function.
[0027] Figure 5 This is a schematic diagram showing the internal exploded structure of the TR component body in a miniaturized TR component device with cooling function.
[0028] Figure 6 This is a schematic diagram of the structure of a gasket in a miniaturized TR component device with cooling function.
[0029] Figure 7 This is a schematic diagram of the bimetallic strip after deformation in a miniaturized TR component device with cooling function.
[0030] In the diagram: 1. TR component body; 101. Inner core; 102. Irregular channel; 103. Pad; 104. Heat sink column; 105. Insulation box; 106. Heat pipe; 2. Base; 201. Through hole; 202. Bimetallic strip; 203. Heat sink; 3. Spacing; 4. Gasket 1; 5. Guide plate; 6. Gasket 2; 7. Channel; 8. Aluminum strip; 9. Copper strip. Detailed Implementation
[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example
[0032] Please see Figures 1-3 The present invention provides a miniaturized TR component device with cooling function, including: TR component body 1, heat dissipation mechanism installed on the bottom of TR component body 1 for installation, and spacing openings 3 disposed between TR component bodies 1 for spacing.
[0033] In addition, the TR component body 1 is equipped with a discharge mechanism.
[0034] The discharge mechanism includes: an inner core 101 installed inside the TR component body 1, a shaped channel 102 disposed on one side of the inner core 101, a heat insulation box 105 connected to the lower end of the shaped channel 102, and a heat pipe 106 connected to the bottom of the heat insulation box 105. The outer shape of the shaped channel 102 is arc-shaped, and the shaped channel 102 is wider at the top and narrower at the bottom. The shaped channel 102 extends horizontally along the surface of the heat insulation box 105, and the lower end of the shaped channel 102 is connected to the interior of the heat insulation box 105.
[0035] Specifically, by combining the irregular channel 102 with the TR component body 1 to form an integrated unit, a set of channels is set inside the TR component body 1 to dissipate heat inside the TR component body 1. The heat is conducted to the heat insulation box 105 through the irregular channel 102, and the heat is discharged through the heat pipe 106 at the bottom of the heat insulation box 105.
[0036] It also includes: a pad 103 fixedly installed at the bottom of the TR component body 1, and a heat dissipation column 104 installed inside the pad 103 for heat dissipation.
[0037] Several heat dissipation columns 104 are evenly distributed inside the pad 103, and the upper end of the heat dissipation column 104 extends into the bottom of the upper TR component body 1. Adjacent heat dissipation columns 104 are arranged at different heights.
[0038] Specifically, by setting heat dissipation columns 104 at the bottom of the TR component body 1, the heat dissipation columns 104 are made of copper material. The heat dissipation columns 104 are evenly distributed to conduct heat out of the interior of the TR component body 1, avoiding heat accumulation inside the TR component body 1 and facilitating internal cooling of the TR component body 1. Example
[0039] Please see Figures 1-2 and Figure 6 TR component body 1, heat dissipation mechanism installed at the bottom of TR component body 1 for installation, spacer opening 3 set between TR component bodies 1 for spacing, and guide mechanism fixedly installed below the heat dissipation mechanism.
[0040] The guiding mechanism includes: a first gasket 4 fixedly installed below the heat dissipation mechanism, a guide plate 5 for guiding heat dissipation located below the first gasket 4, and a second gasket 6 located below the guide plate 5.
[0041] The outer shapes of gasket 1 4, guide piece 5 and gasket 2 6 are all arc-shaped, and gasket 1 4, guide piece 5 and gasket 2 6 are stacked at equal intervals along the same vertical line;
[0042] Specifically, by using gasket 4, guide plate 5 and gasket 6, heat is discharged outward layer by layer. The heat flow will be discharged to both sides along the arc-shaped surface. Due to the arc-shaped design at both ends of the arc-shaped gasket 4, the space at both ends of the arc-shaped structure is open, which is conducive to the heat dissipating to both sides.
[0043] The surface of gasket 1 4 is provided with a channel 7, the upper surface of guide plate 5 is fixedly provided with an aluminum strip 8, and the upper surface of gasket 2 6 is provided with a copper strip 9.
[0044] Specifically, since the thermal conductivity of copper strip 9 is greater than that of aluminum strip 8, the heat dissipation difference between aluminum strip 8 and copper strip 9 is utilized to guide the heat from low to high, thereby further dissipating the heat. Example
[0045] Please see Figure 1 and Figure 6 as well as Figure 7 TR component body 1, heat dissipation mechanism installed at the bottom of TR component body 1 for installation, spacer opening 3 set between TR component bodies 1 for spacing, and guide mechanism fixedly installed below the heat dissipation mechanism.
[0046] The heat dissipation mechanism includes: a base 2 installed at the bottom of the TR component body 1 for mounting; a through hole 201 fixedly opened on the surface of the base 2; a bimetallic strip 202 fitted inside the through hole 201; and a heat sink 203 installed below the through hole 201. The through hole 201 and the heat sink 203 are interconnected, and the through hole 201 and the bimetallic strip 202 are arranged in a one-to-one correspondence.
[0047] Specifically, by covering the upper surface of the through hole 201 with a bimetallic strip 202, the bimetallic strip 202 will block the through hole 201 to prevent dust from entering when heat dissipation is not required due to the openness of the through hole 201. After the bimetallic strip 202 is deformed by heat, it will open the top of the through hole 201 to allow heat to pass through.
[0048] The working principle of this invention is:
[0049] When using this invention, when the internal heat of the TR component body 1 is high, the heat inside the TR component body 1 will be discharged outward through the irregular channel 102. The heat will enter the heat insulation box 105 along the irregular channel 102. A heat pipe 106 is connected to the bottom of the heat insulation box 105, and the heat is dissipated to the bottom of the TR component body 1 through the heat pipe 106. A heat dissipation column 104 is provided at the bottom of the TR component body 1. The upper end of the heat dissipation column 104 is inserted into the interior of the TR component body 1. Since the heat dissipation column 104 has different lengths and different depths inside the TR component body 1, it can conduct heat to different positions inside the TR component body 1. The heat is conducted downward to the base 2 below through the heat dissipation column 104. After the base 2 is heated, it covers the through hole 201. The bimetallic strip 202 on the surface can be bent by heat. After bending, the bimetallic strip 202 will no longer be inside the through hole 201, so that the top of the through hole 201 is opened, and the heat is discharged downward from the through hole 201 and discharged through the heat sink 203 below. After the heat is discharged, it will come into contact with the pad 4 set below. Since the pad 4 adopts an arc design, the heat flow will be discharged to both sides along the arc surface. Due to the arc design at both ends of the arc pad 4, there is a certain gap between it and the TR module body 1. The open space is conducive to the heat dissipation to both sides. Taking advantage of the heat dissipation difference between the aluminum strip 8 and the copper strip 9, the heat is guided from low to high and further discharged away from the TR module body 1, which is conducive to the heat dissipation of the TR module body 1.
[0050] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and utility model concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. A miniaturized TR component device with cooling function, characterized in that, include: TR component body (1), heat dissipation mechanism installed at the bottom of the TR component body (1) for installation, spacer opening (3) set between the TR component bodies (1) for spacing, and guide mechanism fixedly installed below the heat dissipation mechanism; The guiding mechanism includes: a first pad (4) fixedly installed below the heat dissipation mechanism, a guide plate (5) for guiding heat dissipation disposed below the first pad (4), and a second pad (6) disposed below the guide plate (5). The heat dissipation mechanism includes: a base (2) installed at the bottom of the TR component body (1) for installation; a through hole (201) fixedly opened on the surface of the base (2); a bimetallic strip (202) fitted inside the through hole (201); and a heat sink (203) installed below the through hole (201). In addition, the TR component body (1) is equipped with a discharge mechanism inside; The discharge mechanism includes: an inner core (101) installed inside the TR component body (1), a shaped channel (102) disposed on one side of the inner core (101), a heat insulation box (105) connected to the lower end of the shaped channel (102), and a heat pipe (106) connected to the bottom of the heat insulation box (105).
2. The miniaturized TR component device with cooling function according to claim 1, characterized in that, Also includes: A pad (103) is fixedly installed at the bottom of the TR component body (1), and a heat dissipation column (104) for heat dissipation is installed inside the pad (103).
3. A miniaturized TR component device with cooling function according to claim 1, characterized in that, The external shape of the irregular channel (102) is arc-shaped, and the irregular channel (102) is wider at the top and narrower at the bottom. The irregular channel (102) extends horizontally along the surface of the heat insulation box (105).
4. A miniaturized TR component device with cooling function according to claim 1, characterized in that, The lower end of the irregular channel (102) is connected to the interior of the heat insulation box (105).
5. A miniaturized TR component device with cooling function according to claim 1, characterized in that, The outer shapes of the first gasket (4), the guide plate (5) and the second gasket (6) are all arc-shaped, and the first gasket (4), the guide plate (5) and the second gasket (6) are equidistant and stacked along the same vertical line.
6. A miniaturized TR component device with cooling function according to claim 1, characterized in that, The surface of the first gasket (4) is provided with a channel (7), the upper surface of the guide plate (5) is fixedly provided with an aluminum strip (8), and the upper surface of the second gasket (6) is provided with a copper strip (9).
7. A miniaturized TR component device with cooling function according to claim 2, characterized in that, The heat dissipation columns (104) are evenly distributed inside the pad (103), and the upper end of the heat dissipation column (104) is inserted into the bottom of the upper TR component body (1). The adjacent heat dissipation columns (104) are set at different heights.
8. A miniaturized TR component device with cooling function according to claim 1, characterized in that, The through hole (201) is interconnected with the heat sink (203), and the through hole (201) is set in a one-to-one correspondence with the bimetallic strip (202).