Multifunctional intelligent gateway based on AIoT technology

Abstract

The application belongs to the field of gateway, and particularly relates to a multifunctional intelligent gateway based on AIoT technology, which comprises a box body, a box cover, a circuit board and a sound collector. The multifunctional intelligent gateway has the advantages that the heat dissipation fin is used to cool the heat conduction plate II, the heat conduction plate II is in contact with the chip on the circuit board, the heat conduction plate II absorbs the heat generated by the chip, and then the chip on the circuit board is cooled, so that the service life of the chip is guaranteed, the performance decline or burning of the chip caused by the excessively high operating temperature of the chip is avoided, the hot air is guided to each position in the box body, the air in the box body is heated, the damage of the electronic components caused by the condensation in the box body is avoided, the normal operation of the chip on the circuit board is not affected, the important element, i.e. the chip, in the gateway cannot be cooled, the working temperature of the chip in the gateway is excessively high, the service life of the chip is affected, and the chip is even burned due to overheating.

Description

Technical Field

[0001] This invention belongs to the field of gateways, specifically relating to a multifunctional smart gateway based on AIoT technology. Background Technology

[0002] Existing gateways have a simple functional structure. Apart from the necessary electronic components, they typically only have a simple fan for cooling the internal components. However, in many cases, gateways are installed outdoors and operate in high outdoor temperatures. Fans alone are insufficient to meet the cooling requirements of the gateway during operation and cannot effectively cool the critical components—chips—within the gateway. This leads to excessively high chip operating temperatures, affecting chip lifespan and even causing chips to overheat and burn out. In addition, when outdoor temperatures are low, condensation can easily form on the electronic components inside the gateway, leading to problems such as electronic component failure and short circuits. Existing gateways completely ignore this issue. Summary of the Invention

[0003] To overcome the shortcomings of the inability to dissipate heat from the critical components—chips—within the gateway, resulting in excessively high chip operating temperatures, affecting chip lifespan, or even causing chip overheating and burnout, this invention provides a multifunctional smart gateway based on AIoT technology.

[0004] Technical Solution: A multifunctional smart gateway based on AIoT technology includes a housing, a cover, a circuit board, and sound collectors. The cover is fixedly attached to the housing. The circuit board is fixedly attached to the housing. A sound collector is installed on the left and right sides of the housing. Each sound collector is located in a receiving cavity. The gateway also includes liquid guide tubes, heat sinks, a second heat-conducting plate, memory springs, a ventilation assembly, and a liquid cooling assembly. The liquid cooling assembly is connected to the housing for cooling. The cover is connected to a ventilation assembly for heat dissipation. Two liquid guide tubes are connected to the liquid cooling assembly. Two memory springs are connected to each liquid guide tube. All memory springs are connected to the liquid cooling assembly. Several heat sinks are fixedly attached to the two liquid guide tubes, and each heat sink contains an electric heating wire. All heat sinks are connected to a second heat-conducting plate, which contacts the chip on the circuit board.

[0005] Optionally, the liquid cooling assembly includes a cooler, a liquid inlet pipe, a fan, a ventilation pipe, a liquid inlet pipe, a heat-conducting plate, and a partition; the cooler is connected to the bottom of the housing; a liquid inlet pipe is connected to the left and right sides of the cooler; two fans are installed at the bottom and top of the housing, and heat dissipation vents are opened at corresponding positions of the housing and each fan; the two fans on the right are fixedly connected to a ventilation pipe; the two fans on the left are fixedly connected to another ventilation pipe; another liquid inlet pipe is connected to the upper part of each of the two ventilation pipes; the two fans on the left... One infusion tube is slidably connected to a guide tube; the two infusion tubes on the right are slidably connected to another guide tube; each infusion tube is fixedly connected to a corresponding memory spring; each ventilation tube has several heat-conducting plates that are staggered horizontally and equidistantly distributed vertically; each ventilation tube has a partition fixedly connected to the lower part of its inner wall; the cooler is connected to an inlet pipe; the inlet pipe is connected to the lower part of the two ventilation tubes, and the two inlets of the inlet pipe correspond to the lower part of a partition; the lower part of the partition and the inner wall of the ventilation tube form a liquid storage cavity.

[0006] Optionally, the ventilation assembly includes a fixed frame, a first fixed rod, a second fixed rod, a driver, fan blades, and a semicircular plate; the fixed frame is fixedly connected to the cover; the second fixed rod is rotatably connected to the fixed frame; the first fixed rod is rotatably connected inside the second fixed rod, and the first fixed rod passes through the second fixed rod; the first fixed rod is rotatably connected to the fixed frame; a fan blade is fixedly connected to both the first and second fixed rods, and the two fan blades are symmetrical to each other; a semicircular plate is fixedly connected to the second fixed rod, and another semicircular plate is fixedly connected to the cover, both semicircular plates are located in front of the two fan blades, and the two semicircular plates are distributed one in front of the other; the semicircular plate on the cover is in contact with the second fixed rod; two drivers are connected to the fixed frame; the two drivers are used to drive the first fixed rod and the second fixed rod to rotate, respectively.

[0007] Optionally, each of the two ventilation ducts has several air outlets on opposite sides, and each air outlet is equipped with a dust filter.

[0008] Optionally, it also includes baffles; a baffle is fixed to the upper part of each ventilation pipe, and each baffle corresponds to the opening of an infusion tube above it.

[0009] Optionally, it also includes a filter tank; each ventilation pipe is slidably connected to a filter tank at its lower part, and all filter tanks are slidably connected to the cover; each filter tank is in contact with a partition; the two ports of the liquid inlet pipe are located below each filter tank.

[0010] Optionally, it also includes a duct 1; a sound-receiving slot 1 is opened on both the left and right sides of the box body; the two sound-receiving slots 1 are respectively connected to a corresponding sound-receiving cavity; a sound-receiving slot 2 is opened on both the left and right sides of the box body; the two sound-receiving slots 2 are respectively connected to a corresponding sound-receiving cavity; each sound-receiving slot 1 and sound-receiving slot 2 has a sound-receiving port; another sound-receiving port is opened on the lower left and right sides of the box body; a dustproof net is installed in each sound-receiving port; a duct 1 is fixedly connected to the left and right sides of the box body; each duct 1 is connected to a sound-receiving port on the lower side of the box body; each duct 1 is connected to a sound-receiving slot 1.

[0011] Optionally, it also includes a second air duct, a first electric sealing plate, a second electric sealing plate, a third air duct, a third electric sealing plate, and a fourth electric sealing plate; each ventilation duct is connected to a second air duct at its upper part; each second air duct is connected to a second sound receiving slot; each second air duct is fixedly connected to a first electric sealing plate and a second electric sealing plate; each ventilation duct is connected to a third air duct at its lower part; each third air duct is fixedly connected to a third electric sealing plate and a fourth electric sealing plate; each third air duct is connected to a first air duct.

[0012] Optionally, it also includes a water-absorbing sleeve; each heat-conducting plate is fitted with a water-absorbing sleeve; the heat-conducting plate is fixedly connected to the ventilation pipe through the water-absorbing sleeve.

[0013] Optionally, each heat-conducting plate and its corresponding water-absorbing sleeve have several one-to-one ventilation holes, and the inner wall of the water-absorbing sleeve has several rectangular grooves that communicate with the ventilation holes.

[0014] The beneficial effects of this invention are as follows: When in use, this invention achieves cooling of the heat-conducting plate two through the heat sink. The heat-conducting plate two is in contact with the chip on the circuit board, and absorbs the heat generated by the chip through the heat-conducting plate two, thereby cooling the chip on the circuit board, ensuring the chip's lifespan, and avoiding situations such as performance degradation or burnout caused by excessively high chip operating temperature. The hot air is directed to various positions inside the box, thereby heating the air inside the box, preventing condensation inside the box from damaging electronic components, and at the same time preventing low temperature from affecting the normal operation of the chip on the circuit board.

[0015] When outside air flows through multiple heat-conducting plates in the ventilation duct, dust in the outside air comes into contact with the moist heat-conducting plates, thus adhering to the dust in the outside air and preventing the dust in the outside air from coming into contact with the electronic components inside the box. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the first three-dimensional structure of the multi-functional smart gateway based on AIoT technology according to the present invention;

[0017] Figure 2This is a schematic diagram of a second three-dimensional structure of the multi-functional smart gateway based on AIoT technology according to the present invention;

[0018] Figure 3 This is an exploded three-dimensional structural diagram of the box body and lid of the multifunctional smart gateway based on AIoT technology of the present invention;

[0019] Figure 4 This is a three-dimensional structural diagram of the ventilation component of the multifunctional smart gateway based on AIoT technology of the present invention;

[0020] Figure 5 This is a three-dimensional cross-sectional structural diagram of the box of the multi-functional smart gateway based on AIoT technology of the present invention.

[0021] Figure 6 This is a partial three-dimensional cross-sectional structural diagram of the box of the multi-functional smart gateway based on AIoT technology of the present invention.

[0022] Figure 7 This is a three-dimensional cross-sectional structural diagram of the ventilation duct of the multifunctional smart gateway based on AIoT technology of the present invention.

[0023] Figure 8 This is a three-dimensional structural diagram of the filter tank of the multifunctional smart gateway based on AIoT technology of the present invention;

[0024] Figure 9 This is a three-dimensional exploded view of the heat-conducting plate and water-absorbing jacket of the multifunctional smart gateway based on AIoT technology of the present invention.

[0025] Figure 10 This is a schematic diagram of the combined three-dimensional structure of the air duct 2, electric sealing plate 1, and electric sealing plate 2 of the multi-functional smart gateway based on AIoT technology of the present invention.

[0026] Figure 11 This is a schematic diagram of the combined three-dimensional structure of the air duct three, electric sealing plate three, and electric sealing plate four of the multi-functional smart gateway based on AIoT technology of the present invention.

[0027] Figure 12 This is a three-dimensional structural diagram of the combination of infusion tube, fluid guide tube and heat sink of the multifunctional smart gateway based on AIoT technology of the present invention.

[0028] Figure 13 This is a partially exploded three-dimensional structural diagram of the multifunctional smart gateway based on AIoT technology of the present invention.

[0029] The markings in the attached diagram are: 1-box body, 2-box cover, 3-circuit board, 4-sound collector, 001-sound pickup slot one, 002-dustproof mesh, 003-sound pickup port, 004-sound pickup slot two, 005-ventilation hole, 006-air outlet, 007-rectangular slot, 101-fixed frame, 102-fixed rod one, 103-fixed rod two, 104-driver, 105-fan blade, 106-semi-circular disc, 201-cooler, 202-infusion tube, 203-fan. 204-Ventilation duct, 205-Liquid inlet duct, 206-Heat conduction plate one, 207-Baffle, 301-Liquid guide duct, 302-Heat sink, 303-Heat conduction plate two, 304-Memory spring, 401-Air guide duct one, 501-Baffle, 601-Filter tank, 701-Water absorption sleeve, 801-Air guide duct two, 802-Electric sealing plate one, 803-Electric sealing plate two, 804-Air guide duct three, 805-Electric sealing plate three, 806-Electric sealing plate four. Detailed Implementation

[0030] The embodiments of the present invention will be described below with reference to the accompanying drawings.

[0031] Example 1

[0032] A multi-functional smart gateway based on AIoT technology, such as Figures 1-8 and Figures 12-13 The device includes a housing 1, a cover 2, a circuit board 3, and a sound collector 4. The cover 2 is bolted to the housing 1. The circuit board 3 is bolted inside the housing 1. A sound collector 4 is installed on the left and right sides of the housing 1. Each sound collector 4 is located in a sound receiving cavity.

[0033] It also includes a liquid guide tube 301, a heat sink 302, a second heat-conducting plate 303, a memory spring 304, a ventilation assembly, and a liquid cooling assembly; the liquid cooling assembly is connected inside the box body 1; the ventilation assembly is connected to the box cover 2; two liquid guide tubes 301 are connected to the liquid cooling assembly; two memory springs 304 are connected to each liquid guide tube 301; all memory springs 304 are connected to the liquid cooling assembly; several equidistant heat sinks 302 are fixed together by the two liquid guide tubes 301, and each heat sink 302 is provided with an electric heating wire; all heat sinks 302 are connected together to the second heat-conducting plate 303; the second heat-conducting plate 303 is in contact with the chip on the circuit board 3.

[0034] The liquid cooling assembly includes a cooler 201, a liquid inlet pipe 202, a fan 203, a ventilation pipe 204, a liquid inlet pipe 205, a heat-conducting plate 206, and a partition 207. The cooler 201 is connected to the bottom of the housing 1. A liquid inlet pipe 202 is connected to the left and right sides of the cooler 201. Two fans 203 are installed at the bottom and top of the housing 1, and each fan 203 has a corresponding heat dissipation vent. The two fans 203 on the right are connected to a ventilation pipe 204. The two fans 203 on the left are connected to another ventilation pipe 204. Each of the two ventilation pipes 204 has another liquid inlet pipe 202 connected to its upper part. One infusion tube 202 is slidably connected to a liquid guide tube 301; the two infusion tubes 202 on the right are slidably connected to another liquid guide tube 301; each infusion tube 202 is fixedly connected to a corresponding memory spring 304; each ventilation tube 204 is fixedly connected to several heat-conducting plates 206 that are staggered horizontally and equidistantly distributed vertically; each ventilation tube 204 has a partition 207 fixedly connected to the lower part of its inner wall; the cooler 201 is connected to an inlet pipe 205; the inlet pipe 205 is connected to the lower part of the two ventilation tubes 204, and the two openings of the inlet pipe 205 correspond to the lower part of a partition 207; the lower part of the partition 207 and the inner wall of the ventilation tube 204 form a liquid storage cavity.

[0035] The ventilation assembly includes a mounting bracket 101, a first mounting rod 102, a second mounting rod 103, a driver 104, fan blades 105, and a semi-circular blade 106. The mounting bracket 101 is bolted to the cover 2. The second mounting rod 103 is rotatably connected to the mounting bracket 101. The first mounting rod 102 is rotatably connected inside the second mounting rod 103, and the first mounting rod 102 passes through the second mounting rod 103. The first mounting rod 102 is rotatably connected to the mounting bracket 101. A fan blade is fixedly connected to each of the first mounting rod 102 and the second mounting rod 103. The two fan blades 105 are symmetrical to each other. A semi-circular piece 106 is fixedly attached to the second fixing rod 103, and another semi-circular piece 106 is fixedly attached to the cover 2. Both semi-circular pieces 106 are located in front of the two fan blades 105 and are distributed one in front of the other. The semi-circular piece 106 on the cover 2 is in contact with the second fixing rod 103. Two drivers 104 are connected to the fixing frame 101. The two drivers 104 are used to drive the first fixing rod 102 and the second fixing rod 103 to rotate, respectively.

[0036] Each of the two ventilation ducts 204 has three air outlets 006 on opposite sides, and each air outlet 006 is equipped with a dust filter.

[0037] The air outlets 006 on the two ventilation pipes 204 correspond to the circuit board 3, and the air blown out through the air outlets 006 dissipates heat from the circuit board 3.

[0038] It also includes a baffle 501; a baffle 501 is fixedly attached to the upper part of each ventilation pipe 204, and each baffle 501 corresponds to the opening of an infusion pipe 202 above it.

[0039] It also includes a filter tank 601; each ventilation pipe 204 has a filter tank 601 slidably connected to its lower part, and all filter tanks 601 are slidably connected to the cover 2; each filter tank 601 is in contact with a partition 207; the two ports of the liquid inlet pipe 205 are located below a filter tank 601 respectively.

[0040] During use, the box 1 is installed and secured using the external mounting bracket, so that the box 1 is as follows: Figure 1As shown, during operation, when heat dissipation and cooling of the interior of the housing 1 are required, a driver 104 on the control bracket 101 is activated. The driver 104 drives the second fixing rod 103 and the fan blade 105 on the second fixing rod 103 to rotate, drawing air out of the housing 1 through the fan blade 105. At the same time, the cooler 201 is activated, and the coolant in the cooler 201 is input into the lower liquid delivery pipe 202, allowing the coolant to flow through the liquid guide pipe 301, and then through the upper liquid delivery pipe 202 into the ventilation pipe 204. The baffle 501 limits the flow of the coolant to the heat-conducting plate, increasing the contact area between the coolant and the heat-conducting plate, and simultaneously making the surface of the heat-conducting plate more convex. In a humid state, the coolant is repeatedly guided through several heat-conducting plates 206. Simultaneously, the fan 203 is activated, drawing outside air into the ventilation duct 204. This outside air flows through the ventilation duct 204, passing over multiple heat-conducting plates, and finally exits into the housing 1 through the air outlet 006 on the ventilation duct 204. As the outside air flows through the multiple heat-conducting plates in the ventilation duct 204, dust in the outside air comes into contact with the humid heat-conducting plates, thus adhering to the plates and preventing dust from contacting the electronic components inside the housing 1. The coolant, flowing over the heat-conducting plates, washes away the dust adhering to them, and then passes through the partition 20... 7. The coolant is guided to the filter tank 601. Dust is filtered through the filter tank 601 along with the coolant, and the dust in the coolant is collected in the filter tank 601. The filter tank 601 can be manually removed and cleaned periodically. The filtered coolant enters the lower part of the baffle 207 and forms a liquid storage chamber with the inner wall of the ventilation pipe 204. Then the coolant is introduced into the cooler 201 through the liquid inlet pipe 205. The heat conduction plate guides the coolant and cools it down at the same time. At the same time, the heat conduction plate absorbs the heat generated in the box 1 to cool the air in the box 1. The heat conduction plate also cools the air flowing in the ventilation pipe 204, so that the air finally passes through the air outlet 006. The exhaust air is at a low temperature, which, in conjunction with the fan blade 105, enables air circulation within the housing 1 to achieve a heat dissipation effect. At the same time, the low-temperature air further enhances the cooling effect within the housing 1, thereby ensuring a normal temperature within the housing 1 and the normal operation of the electronic components within the housing 1. When the coolant flows through the liquid guide pipe 301, it cools the heat sink 302, which in turn cools the heat conduction plate 303. The heat conduction plate 303 contacts the chip on the circuit board 3, absorbing the heat generated by the chip and thus cooling the chip on the circuit board 3. This ensures the lifespan of the chip and prevents performance degradation or burnout due to excessively high chip operating temperatures.

[0041] When the outside temperature is low, and the electronic components inside box 1 are working, there is a significant temperature difference between the surface temperature of the electronic components and the air temperature inside box 1. Condensation can easily occur on the electronic components, leading to short circuits. At this time, the cooler 201 and fan 203 are turned off, and the driver 104 that drives the second fixing rod 103 to rotate is turned off. The semicircular plate 106 on the second fixing rod 103 is misaligned with the semicircular plate 106 on the box cover 2 to form a disc, thus sealing the box cover 2. At this time, another driver 104 on the fixing frame 101 is activated. The driver 104 drives the first fixing rod 102 and the fan blade 105 on the first fixing rod 102 to rotate, simultaneously activating the electric heating wire inside the heat sink 302, thereby heating the heat sink 302. The heat sink 302 heats up and transfers heat to the liquid guide pipe 301 and the second heat conduction plate 30. 3. Memory spring 304 extends when heated, causing the liquid guide tube 301 to slide within the infusion tube 202. This, in turn, causes the liquid guide tube 301 to move the heat sink 302 and the second heat-conducting plate 303 away from the chip on the circuit board 3, separating the second heat-conducting plate 303 from the chip on the circuit board 3. This prevents the heated second heat-conducting plate 303 from directly contacting the chip. Simultaneously, the heat sink 302 and the second heat-conducting plate 303 heat the air inside the box 1. The fan blades 105 on the fixing rod 102 rotate and blow the hot air near the heat sink 302 and the second heat-conducting plate 303, directing the hot air to various locations inside the box 1, thereby heating the air inside the box 1 and ensuring a uniform temperature inside the box 1. This prevents a large temperature difference between the surface temperature of the electronic components and the air temperature inside the box 1 during operation, which could easily lead to condensation on the electronic components.

[0042] Example 2

[0043] Based on Example 1, such as Figures 1-11 As shown, it also includes a duct 401; a sound-receiving slot 001 is opened on the left and right sides of the box body 1; the two sound-receiving slots 001 are respectively connected to a corresponding sound-receiving cavity; a sound-receiving slot 2 004 is opened on the left and right sides of the box body 1; the two sound-receiving slots 2 004 are respectively connected to a corresponding sound-receiving cavity; each sound-receiving slot 1 001 and sound-receiving slot 2 004 has a sound-receiving port 003; another sound-receiving port 003 is opened on the lower left and right sides of the box body 1; a dustproof net 002 is installed in each sound-receiving port 003; a duct 401 is fixedly connected to the left and right sides of the box body 1; each duct 401 is connected to a sound-receiving port 003 on the lower side of the box body 1; each duct 401 is connected to a sound-receiving slot 001.

[0044] It also includes air duct 2 801, electric sealing plate 1 802, electric sealing plate 2 803, air duct 3 804, electric sealing plate 3 805, and electric sealing plate 4 806; each ventilation duct 204 is connected to an air duct 2 801 at the top; each air duct 2 801 is connected to a sound receiving slot 2 004; each air duct 2 801 is fixedly connected to an electric sealing plate 1 802 and an electric sealing plate 2 803; each ventilation duct 204 is connected to an air duct 3 804 at the bottom; each air duct 3 804 is fixedly connected to an electric sealing plate 3 805 and an electric sealing plate 4 806; each air duct 3 804 is connected to an air duct 1 401.

[0045] The intelligent gateway can collect external sounds through the sound collector 4, analyze and judge them, and execute corresponding commands. During operation, it collects external sounds through multiple sound ports 003, and guides the sound into the sound receiving cavity where the sound collector 4 is located through the air duct 401, sound receiving slot 001, and sound receiving slot 2 004, thus ensuring the sensitivity of the sound collector 4. Simultaneously, the dustproof net 002 intercepts dust from the sound ports 003, preventing outside air from clogging the sound receiving holes on the sound collector 4, which could lead to reduced sensitivity or malfunction. When it is necessary to clean the dustproof net 002, the air duct 2 801 is controlled... The electric sealing plate 1 802 is closed, the electric sealing plate 2 803 is opened, the electric sealing plate 3 805 on the air duct 3 804 is closed, and the electric sealing plate 4 806 is opened. Then, all the fans 203 are turned on, so that the air blown out by the fans 203 is guided into the sound receiving slot 2 004 through the air duct 2 801, and then into the air duct 1 401 through the air duct 3 804. The air duct 1 401 guides a part of the air into the sound receiving slot 1 001, so that the air is blown out through each sound receiving port 003, thereby blowing away the dust on the dustproof net 002 in each sound receiving port 003, and avoiding excessive dust accumulation on the dustproof net 002, which affects the sound receiving effect.

[0046] Example 3

[0047] Based on Example 2, such as Figures 1-9 As shown, it also includes a water-absorbing sleeve 701; each heat-conducting plate 206 is fitted with a water-absorbing sleeve 701; the heat-conducting plate 206 is fixed to the ventilation pipe 204 through the water-absorbing sleeve 701, and the water-absorbing sleeve 701 absorbs the water vapor in the box 1.

[0048] Each heat-conducting plate 206 and its corresponding water-absorbing sleeve 701 have several one-to-one ventilation holes 005, and the inner wall of the water-absorbing sleeve 701 has several rectangular grooves 007 that communicate with the ventilation holes 005.

[0049] In humid weather, condensation forms water droplets that drip onto the electronic components inside housing 1, causing malfunctions and burnouts. The two lower fans 203 direct air upwards into the ventilation duct 204, while the two upper fans 203 expel air from the duct 204, ensuring unidirectional airflow. Simultaneously, the upper fans 203 generate suction to prevent air from escaping from the vent 006, thus avoiding the introduction of humid air into housing 1. The condensation of moisture in the humid air inside housing 1 can cause electronic component malfunctions or burnouts. Simultaneously, the air within the ventilation duct 204... The unidirectional airflow passes through the ventilation holes 005 on the heat-conducting plate 206 and the water-absorbing sleeve 701. When the air flows through the ventilation holes 005, the speed increases, which in turn generates negative pressure and suction effect through the rectangular groove 007, drawing the original air in the box 1 to the location of the water-absorbing sleeve 701. The water-absorbing sleeve 701 on the heat-conducting plate 206 absorbs the water vapor in the box 1, preventing the water vapor in the box 1 from condensing into water droplets and dripping onto the electronic components in the box 1, which could cause malfunctions and burnout. Furthermore, when the water vapor flows through the ventilation holes 005, the air flowing through the ventilation holes 005 will carry the water vapor out from the heat dissipation vent above.

[0050] It should be understood that the above description is for illustrative purposes only and is not intended to limit the invention. Those skilled in the art will understand that variations of the invention are included within the scope of the claims herein.

Claims

1. A multifunctional smart gateway based on AIoT technology, comprising a housing (1), a cover (2), a circuit board (3), and a sound collector (4); the cover (2) is fixedly attached to the housing (1); the circuit board (3) is fixedly attached inside the housing (1); a sound collector (4) is installed on the left and right sides of the housing (1); each sound collector (4) is located in a sound receiving cavity; characterized in that: It also includes a liquid guide tube (301), a heat sink (302), a second heat-conducting plate (303), a memory spring (304), a ventilation assembly, and a liquid cooling assembly; the box body (1) is connected to a liquid cooling assembly for cooling; the box cover (2) is connected to a ventilation assembly for ventilation and heat dissipation; two liquid guide tubes (301) are connected to the liquid cooling assembly; two memory springs (304) are connected to each liquid guide tube (301); all memory springs (304) are connected to the liquid cooling assembly; several heat sinks (302) are fixed together by the two liquid guide tubes (301), and each heat sink (302) is provided with an electric heating wire; all heat sinks (302) are connected together to a second heat-conducting plate (303); the second heat-conducting plate (303) is in contact with the chip on the circuit board (3); The liquid cooling assembly includes a cooler (201), a liquid inlet pipe (202), a fan (203), a ventilation pipe (204), a liquid inlet pipe (205), a heat-conducting plate (206), and a partition plate (207); the cooler (201) is connected to the bottom of the box (1); the cooler (201) is connected to a liquid inlet pipe (202) on the left and right sides; two fans (203) are installed on the lower and upper parts of the box (1), and heat dissipation vents are opened at the corresponding positions of the box (1) and each fan (203); the two fans (203) on the right are fixedly connected to a ventilation pipe (204); the two fans (203) on the left are fixedly connected to another ventilation pipe (204); another liquid inlet pipe (202) is connected to the upper part of each of the two ventilation pipes (204); the left Two infusion tubes (202) on the right are slidably connected to a liquid guide tube (301); two infusion tubes (202) on the right are slidably connected to another liquid guide tube (301); each infusion tube (202) is fixedly connected to a corresponding memory spring (304); several heat-conducting plates (206) are fixedly connected to each ventilation tube (204) with staggered left and right sides and equidistant vertical distribution; a partition (207) is fixedly connected to the lower part of the inner wall of each ventilation tube (204); an inlet pipe (205) is connected to the cooler (201); the inlet pipe (205) is connected to the lower part of the two ventilation tubes (204), and the two ports of the inlet pipe (205) are respectively connected to the lower part of a partition (207); the lower part of the partition (207) and the inner wall of the ventilation tube (204) form a liquid storage cavity.

2. The multifunctional smart gateway based on AIoT technology according to claim 1, characterized in that: The ventilation assembly includes a mounting bracket (101), a first mounting rod (102), a second mounting rod (103), a driver (104), fan blades (105), and a semi-circular blade (106); the mounting bracket (101) is fixedly attached to the cover (2); the second mounting rod (103) is rotatably connected to the mounting bracket (101); the first mounting rod (102) is rotatably connected inside the second mounting rod (103), and the first mounting rod (102) passes through the second mounting rod (103); the first mounting rod (102) is rotatably connected to the mounting bracket (101); a fan blade is fixedly attached to each of the first mounting rod (102) and the second mounting rod (103). The blades (105) are symmetrical to each other. A semicircular piece (106) is fixed on the second fixing rod (103), and another semicircular piece (106) is fixed on the cover (2). Both semicircular pieces (106) are located in front of the two blades (105) and are distributed one in front of the other. The semicircular piece (106) on the cover (2) is in contact with the second fixing rod (103). Two drivers (104) are connected on the fixing frame (101). The two drivers (104) are used to drive the first fixing rod (102) and the second fixing rod (103) to rotate, respectively.

3. The multifunctional smart gateway based on AIoT technology according to claim 1, characterized in that: The two ventilation pipes (204) each have several air outlets (006) on their opposite sides, and each air outlet (006) is equipped with a dust filter.

4. A multi-functional smart gateway based on AIoT technology according to claim 3, characterized in that: It also includes baffles (501); each ventilation pipe (204) is fixed with a baffle (501) at the top, and each baffle (501) corresponds to the opening of an infusion pipe (202) above it.

5. A multi-functional smart gateway based on AIoT technology according to claim 4, characterized in that: It also includes a filter tank (601); each ventilation pipe (204) is slidably connected to a filter tank (601) at the bottom, and all filter tanks (601) are slidably connected to the cover (2); each filter tank (601) is in contact with a partition (207); the two ports of the liquid inlet pipe (205) are located below a filter tank (601) respectively.

6. A multi-functional smart gateway based on AIoT technology according to any one of claims 3-5, characterized in that: It also includes a duct 1 (401); a sound receiving slot 1 (001) is opened on both the left and right sides of the box body (1); the two sound receiving slots 1 (001) are respectively connected to a corresponding sound receiving cavity; a sound receiving slot 2 (004) is opened on both the left and right sides of the box body (1); the two sound receiving slots 2 (004) are respectively connected to a corresponding sound receiving cavity; each sound receiving slot 1 (001) and sound receiving slot 2 (004) has a sound receiving port ( 003); The lower left and right sides of the box body (1) each have another sound inlet (003); Each sound inlet (003) is equipped with a dustproof net (002); The left and right sides of the box body (1) each have a duct (401) fixedly connected; Each duct (401) is connected to a sound inlet (003) on the lower side of the box body (1); Each duct (401) is connected to a sound inlet (001).

7. A multi-functional smart gateway based on AIoT technology according to claim 6, characterized in that: It also includes air duct 2 (801), electric sealing plate 1 (802), electric sealing plate 2 (803), air duct 3 (804), electric sealing plate 3 (805) and electric sealing plate 4 (806); each ventilation pipe (204) is connected to an air duct 2 (801) at the top; each air duct 2 (801) is connected to a sound receiving slot 2 (004); each air duct 2 (801) is fixedly connected to an electric sealing plate 1 (802) and an electric sealing plate 2 (803); each ventilation pipe (204) is connected to an air duct 3 (804) at the bottom; each air duct 3 (804) is fixedly connected to an electric sealing plate 3 (805) and an electric sealing plate 4 (806); each air duct 3 (804) is connected to an air duct 1 (401).

8. A multi-functional smart gateway based on AIoT technology according to claim 7, characterized in that: It also includes a water-absorbing sleeve (701); each heat-conducting plate (206) is fitted with a water-absorbing sleeve (701); the heat-conducting plate (206) is fixedly connected to the ventilation pipe (204) through the water-absorbing sleeve (701).

9. A multi-functional smart gateway based on AIoT technology according to claim 8, characterized in that: Each heat-conducting plate (206) and its corresponding water-absorbing sleeve (701) has several one-to-one ventilation holes (005), and the inner wall of the water-absorbing sleeve (701) has several rectangular grooves (007) that communicate with the ventilation holes (005).

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