A chip surface cleaning method

Abstract

The application discloses a chip surface cleaning method, which comprises the following steps: placing a chip to be cleaned in a chip box; providing a first adhesive film and sticking the chip by the first adhesive film; providing a second adhesive film, sticking the first adhesive film on the side opposite to the second adhesive film after the second adhesive film is tightened, and adhering the first adhesive film and the second adhesive film to be integrated; fixing the second adhesive film, peeling the first adhesive film from the second adhesive film, transferring the chip to the second adhesive film, and removing the impurities on the chip with the first adhesive film to clean the chip surface. Compared with the prior art, the chip surface cleaning method can remove the excess of the chip surface by the viscosity of the first adhesive film through twice adhesive film transfer, and can be compatible with more conventional wafer cleaning processes such as wet cleaning and dry cleaning after the chip is transferred to the film, and the chip surface cleaning method is simple and practical, low in cost, and remarkable in effect.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging technology, and in particular to a method for cleaning chip surfaces. Background Technology

[0002] During the manufacturing, storage, and use of IC chips, impurities such as silicon slag, dust particles, and metal objects can easily adhere to their surfaces. These impurities can easily cause chip damage or contamination during the chip mounting process, and may even lead to product quality risks such as pin failure, short circuit, and open circuit. Therefore, in order to remove impurities from the chip surface, the chip surface is usually cleaned before mounting to ensure the cleanliness of the chip surface and the performance of the packaged product.

[0003] Existing chip surface cleaning methods typically include wet cleaning, dry cleaning, mechanical cleaning, and optical cleaning. Wet cleaning has become the most commonly used method in the chip cleaning field due to its convenience and the availability of cleaning solutions. It usually uses wafer cleaning equipment to fix the chip and then clean it. However, since most chips are stored in waffle boxes or gel boxes, they are incompatible with wafer cleaning equipment. Furthermore, cleaning solutions tend to accumulate in waffle boxes or gel boxes. If the chip is removed separately, cleaned, and then put back into the box, the cleaning efficiency of the whole process is extremely low. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a chip surface cleaning method to solve the problems of low chip cleaning efficiency and incompatibility between chip cassettes and cleaning equipment in the prior art.

[0005] To achieve the above objectives, the present invention provides a chip surface cleaning method, comprising the following steps:

[0006] Place the chip to be cleaned in the chip box;

[0007] A first adhesive film is provided, and the chip is bonded together using the first adhesive film;

[0008] After providing a second adhesive film and stretching it taut, the side of the first adhesive film with the chip attached is placed opposite the second adhesive film, and the first adhesive film and the second adhesive film are attached and bonded together.

[0009] The second adhesive film is fixed, and the first adhesive film is peeled off from the second adhesive film, so that the chip is transferred to the second adhesive film, and the impurities on the chip are removed with the first adhesive film to clean the chip surface.

[0010] Furthermore, in the step of placing the chip to be cleaned into the chip box, the chip box has several regularly arranged placement slots with open tops, the chip to be cleaned is placed in the placement slots, and the working surface of the chip to be cleaned is exposed at the open end of the placement slot.

[0011] Furthermore, in the step of providing the first adhesive film and using the first adhesive film to adhere the chip, the first adhesive film has at least one adhesive surface, and the specific method for the first adhesive film to adhere the chip is as follows:

[0012] The first adhesive film is placed horizontally above the chip box with the adhesive side of the first adhesive film facing the chip, and an external force is applied to the side of the first adhesive film opposite to the chip to make the adhesive side of the first adhesive film adhere tightly to the working surface of the chip to be cleaned.

[0013] Furthermore, the first adhesive film is a blue film, the second adhesive film is a blue film, and the adhesiveness of the first adhesive film is less than or equal to that of the second adhesive film.

[0014] Furthermore, the first adhesive film is a UV film, the second adhesive film is a blue film, and the following steps are included before the step of fixing the second adhesive film:

[0015] The first and second adhesive films are exposed to light. After exposure, the adhesiveness of the first adhesive film decreases and becomes less than or equal to the adhesiveness of the second adhesive film.

[0016] Furthermore, the first adhesive film is a pyrolytic film, the second adhesive film is a blue film, and the following steps are included before the step of fixing the second adhesive film:

[0017] The first and second adhesive films are heated, and after heating, the adhesiveness of the first adhesive film decreases and becomes less than or equal to the adhesiveness of the second adhesive film.

[0018] Furthermore, the size of the first adhesive film is smaller than that of the second adhesive film, so that the second adhesive film has a fixed portion that does not overlap with the first adhesive film on the horizontal projection plane;

[0019] In the step of fixing the second adhesive film and peeling the first adhesive film off the second adhesive film to transfer the chip onto the second adhesive film, the specific method is as follows:

[0020] The second adhesive film is stretched and fixed with a crystal expansion ring, and the first adhesive film is peeled off in a predetermined direction relative to the film plane of the first adhesive film and / or the second adhesive film.

[0021] Furthermore, after the steps of fixing the second adhesive film, peeling the first adhesive film off the second adhesive film to transfer the chip onto the second adhesive film, and removing impurities on the chip with the first adhesive film to clean the chip surface, the method further includes the following steps:

[0022] Determine whether there are still impurities on the chip. If so, perform a second cleaning on the chip; otherwise, place the chip in a clean chip box for storage until use.

[0023] Furthermore, in the step of determining whether impurities still exist on the chip, if so, the chip is cleaned a second time; otherwise, the chip is placed in a clean chip container for storage until later use, the specific method for the second cleaning of the chip is as follows:

[0024] The second adhesive film with the chip attached is transferred to the cleaning equipment and fixed. The second adhesive film is controlled to rotate carrying the chip and simultaneously sprayed with cleaning solution onto the working surface of the chip. After the cleaning solution is completed, a preset gas is sprayed onto the working surface of the chip to dry the chip, thus completing the secondary cleaning.

[0025] Furthermore, the cleaning solution is deionized water, the cleaning time is 2-5 minutes, the spray pressure of the cleaning solution is 1-30 psi, and the number of cleaning cycles is 2-10; the preset gas is N2, the preset gas spray pressure is 10-70 psi, the preset gas spray cycle is 2-11, and the rotation speed of the second adhesion film carrying the chip is 200-1000 rpm.

[0026] This invention employs a two-stage adhesion and transfer process using a first adhesive film and a second adhesive film. The first transfer uses the first adhesive film to remove all chips from the chip cassette. The second transfer uses a second adhesive film with stronger or comparable adhesion to transfer the chips from the first to the second adhesive film. During the peeling of the first adhesive film, particles, dust, and other impurities on the chip are removed along with it, achieving chip cleaning. The entire process removes particles and other impurities without the need for specialized cleaning equipment, offering convenience, speed, high cleaning efficiency, and reduced cleaning costs. Furthermore, if oil stains or solution traces remain on the chip after particle impurities are removed, the method can supplement with wet or dry cleaning. In this case, since the chip is completely adhered to the second adhesive film, which is compatible with conventional wafer cleaning equipment, the second adhesive film can be directly fixed within the cleaning equipment. The chip remains stably adhered to the second adhesive film for a second cleaning, ensuring the quality of chip cleaning. Attached Figure Description

[0027] Figure 1 This is a flowchart of the chip surface cleaning method according to Embodiment 1 of the present invention.

[0028] Figure 2 This is a schematic diagram of the structure in step S102 where the first adhesive film is adhered to the chip.

[0029] Figure 3 This is a cross-sectional view of the chip-adhesive process during step S102, where the first adhesive film adheres to the chip.

[0030] Figure 4 This is a schematic diagram of the structure after the second adhesive film is fixed in step S104.

[0031] Figure 5 This is a cross-sectional view of the first adhesive film being peeled off from the second adhesive film in step S104.

[0032] Figure 6 This is a flowchart of the chip surface cleaning method according to Embodiment 2 of the present invention.

[0033] Figure 7 This is a schematic diagram of the structure for the secondary cleaning of the chip in step S205.

[0034] Figure 8 This is a flowchart of the chip surface cleaning method according to Embodiment 3 of the present invention.

[0035] Figure 9 This is a flowchart of the chip surface cleaning method according to Embodiment 4 of the present invention.

[0036] The diagrams in the instruction manual are labeled as follows:

[0037] 1. Chip box, 11. Placement slot, 2. Chip, 3. First adhesive film, 4. Second adhesive film, 5. Diode ring, 6. Cleaning solution. Detailed Implementation

[0038] The following detailed description illustrates the specific implementation method:

[0039] Example 1

[0040] Please refer to Figure 1 This is a flowchart of a chip 2 surface cleaning method according to an embodiment of the present invention. The chip 2 surface cleaning method of this embodiment includes the following steps:

[0041] S101: Place the chip 2 to be cleaned into the chip box 1.

[0042] The chips 2 to be cleaned are placed one by one into the chip box 1. The chip box 1 has several regularly arranged placement slots 11, and the upper end of the placement slots 11 is open to allow each chip 2 to be placed in a corresponding placement slot 11 with the working surface of the chip 2 to be cleaned (i.e., the side of the chip 2 with exposed pins or solder pads, i.e., the side of the chip 2 that needs to be cleaned) facing out. In this embodiment, the placement slots 11 are arranged in a rectangular array to allow for a greater number of placement slots 11 to be provided in the chip box 1. To facilitate the placement and removal of the chips 2, the depth of the placement slots 11 is less than the thickness of the chips 2. When the chips 2 are placed in, the working surface of the chips 2 can be slightly higher than the surface of the chip box 1. Therefore, when the chips 2 are adhered, the first adhesion film 3 (described in step S102) can only contact the working surface of the chips 2 and not the surface of the chip box 1, so as to quickly adhere the chips 2. Of course, in the specific implementation of this embodiment, the chip box 1 can also be a waffle box or a gel box, and the chips 2 are stored in the waffle box or gel box in sequence. When cleaning, the first adhesive film 3 can directly stick the chips 2 from the waffle box or gel box, which is convenient and quick.

[0043] S102: Use the first adhesive film 3 to stick the chip 2 together.

[0044] Please refer to Figure 2 and Figure 3 First, a first adhesive film 3 of suitable size is provided. The size of the first adhesive film 3 is at least larger than the placement area of ​​the chip 2 in the chip cartridge 1, so as to allow all the chips 2 in the area covered by the first adhesive film 3 to be adhered at once. In this embodiment, the first adhesive film 3 is preferably a blue film, and at least one side of the first adhesive film 3 is adhesive to form the adhesive surface of the first adhesive film 3, which is used to adhere the chip 2 when in contact with it. It is understood that in some other embodiments, the size of the first adhesive film 3 can also be cut to a suitable size according to the required number and range of chips 2 to adhere the chips 2. The adhesiveness of the blue film can be selected as low viscosity, medium viscosity, or high viscosity blue film according to the size of the chip 2, the area of ​​the cleaned area, etc., and this embodiment does not limit the specific type.

[0045] Then, the first adhesive film 3 is used to detach the chip 2 from the chip cassette 1. Specifically, the first adhesive film 3 is placed horizontally above the chip cassette 1 with its adhesive side facing the working surface of the chip 2. External force is applied to the side of the first adhesive film 3 opposite to the chip 2 to ensure a tight bond between the adhesive side and the working surface of the chip 2 to be cleaned. Specifically, when the first adhesive film 3 is attached to the chip 2, an anti-static roller can be used to roll the side of the first adhesive film 3 opposite to the chip 2, or an anti-static scraper can be used to scrape the side of the first adhesive film 3 opposite to the chip 2. This ensures a tight bond between the first adhesive film 3 and the chip 2, facilitating stable adhesion of the chip 2 and ensuring sufficient contact with impurities on the working surface of the chip 2.

[0046] S103: Attach and bond the first adhesive film 3 to the second adhesive film 4.

[0047] First, a second adhesive film 4 is provided. The size of the second adhesive film 4 is preferably larger than that of the first adhesive film 3, so that the second adhesive film 4 has a fixed portion that does not overlap with the first adhesive film 3 on the horizontal projection plane, providing support or contact area when the second adhesive film 4 is stretched and fixed. In this embodiment, the second adhesive film 4 is preferably a blue film. The second adhesive film 4 also has at least one adhesive side to form an adhesive surface for contacting and bonding with the adhesive surface of the first adhesive film 3 and the back side of the chip 2 (the side facing away from the working surface). The adhesiveness of the second adhesive film 4 is preferably greater than or equal to the adhesiveness of the first adhesive film 3, so that the force exerted by the second adhesive film 4 on the chip 2 is greater than or equal to the force exerted by the first adhesive film 3 on the chip 2, so that when the first adhesive film 3 is separated from the second adhesive film 4 in a subsequent process, the chip 2 can remain on the second adhesive film 4, and impurities on the chip 2 can be carried away from the working surface of the chip 2 as the first adhesive film 3 is separated.

[0048] Then, the second adhesive film 4 is stretched. Specifically, to facilitate stable and uniform contact and adhesion between the chip 2 and the second adhesive film 4, when bonding the first adhesive film 3 and the second adhesive film 4, a die-expanding ring 5 is used to stretch the second adhesive film 4. During the stretching process, the die-expanding ring 5 contacts and presses against the fixed part around the second adhesive film 4, thereby achieving the stretching of the second adhesive film 4. When the die-expanding ring 5 stretches the second adhesive film 4, the fixed part of the second adhesive film 4 is fitted and stretched on the die-expanding ring 5.

[0049] Finally, the side of the first adhesive film 3 with the chip 2 attached (i.e., the adhesive side of the first adhesive film 3) is placed opposite the second adhesive film 4 (also the adhesive side of the second adhesive film 4), and the first adhesive film 3 carrying the chip 2 is directly attached to the adhesive side of the second adhesive film 4. External force is applied to make the first adhesive film 3, the chip 2, and the second adhesive film 4 laminated and bonded together. In practice, an anti-static roller or an anti-static scraper can also be used to roll or scrape the end of the first adhesive film 3 away from the chip 2, so that the chip 2 and the second adhesive film 4 can fully contact and adhere tightly.

[0050] S104: Peel off the first adhesive film 3 to remove impurities from the chip 2.

[0051] Please refer to Figure 4 and Figure 5 First, the second adhesive film 4 is fixed in place to facilitate the peeling of the first adhesive film 3 from the second adhesive film 4. During fixing, the expansion ring 5 that tightens the second adhesive film 4 can be used as a support to fix the second adhesive film 4, so as to facilitate the peeling of the first adhesive film 3.

[0052] Then, the first adhesive film 3 is peeled off from the second adhesive film 4, transferring the chip 2 onto the second adhesive film 4. Impurities on the chip 2 are removed along with the first adhesive film 3 to clean the surface of the chip 2. During peeling, the first adhesive film 3 is peeled off in a predetermined direction relative to the film plane of the first adhesive film 3 and / or the second adhesive film 4, thereby leaving the chip 2 on the second adhesive film 4. In this embodiment, when peeling off the first adhesive film 3, the predetermined direction is 180° ± 10° relative to the film plane of the first adhesive film 3 and / or the second adhesive film 4, preferably 180°.

[0053] The chip 2 surface cleaning method of this embodiment involves two adhesion transfers of the chip 2 using a first adhesive film 3 and a second adhesive film 4. In the first transfer, the first adhesive film 3 is used to remove all the chips 2 from the chip box 1. In the second transfer, the second adhesive film 4, which has a stronger or equivalent adhesion, is used to transfer the chips 2 from the first adhesive film 3 to the second adhesive film 4, thereby cleaning the chip 2. The entire process can remove impurities such as particles without the need for cleaning equipment, which is convenient, fast, and has high cleaning efficiency.

[0054] Example 2

[0055] Please refer to Figure 6 This is a flowchart of the chip surface cleaning method of this embodiment. The chip surface cleaning method of this embodiment includes the following steps:

[0056] S201: Place the chip 2 to be cleaned into the chip box 1.

[0057] S202: Provide a first adhesive film 3 of suitable size; use the first adhesive film 3 to stick the chip 2 from the chip box 1.

[0058] S203: Provide a second adhesive film 4; stretch the second adhesive film 4; then attach and bond the first adhesive film 3 to the second adhesive film 4.

[0059] S204: Fix the second adhesive film 4, peel the first adhesive film 3 off the second adhesive film 4 to remove impurities on the chip 2.

[0060] In this embodiment, steps S201 to S204 correspond one-to-one with steps S101 to S104 in Embodiment 1. For details, please refer to the relevant description in Embodiment 1; this embodiment will not repeat them. Furthermore, this embodiment also includes the following steps:

[0061] S205: Determine and perform a second cleaning on chip 2.

[0062] Specifically, observe the working surface of chip 2 to determine whether there are still impurities on chip 2. The impurities include solid impurities such as particles that were not thoroughly cleaned using the first adhesion film 3, and liquid impurities and traces such as solutions and oil stains. If so, chip 2 is cleaned a second time; otherwise, chip 2 is placed in a clean chip box 1 for storage until later use.

[0063] Please refer to Figure 7 During the secondary cleaning of chip 2, firstly, the second adhesive film 4, to which chip 2 is attached, is transferred to and fixed in a cleaning device. This cleaning device can be a conventional wafer cleaning system, equipped with a support platform to hold the second adhesive film 4 attached to chip 2. Then, the wafer cleaning system drives the support platform to rotate, thereby rotating the second adhesive film 4 and carrying chip 2. Simultaneously, cleaning solution 6 is sprayed onto the working surface of chip 2 to remove impurities. Finally, after the cleaning solution 6 has finished cleaning, a preset gas is sprayed onto the working surface of chip 2 to dry chip 2, completing the secondary cleaning. In this embodiment, the cleaning solution 6 is preferably deionized water; the cleaning time is 2-5 min, preferably 3 min; the spray pressure of the cleaning solution is 1-30 psi, preferably 10 psi; the number of cleaning cycles is 2-10, preferably 2; the preset gas is N2, the spray pressure of the preset gas is 10-70 psi, preferably 30 psi; the number of preset gas sprays is 2-11, preferably 2; the rotation speed of the second adhesion film carrying the chip is 200-1000 rpm, preferably 650 rpm.

[0064] In the chip 2 surface cleaning method of this embodiment, if oil stains, solution traces, etc. are still left on the chip 2 after the particulate impurities on the chip 2 are removed, a second cleaning is performed as a supplement. At this time, since the chip 2 is completely adhered to the second adhesion film 4, and the second adhesion film 4 is compatible with conventional wafer cleaning equipment, the second adhesion film 4 can be directly fixed in the cleaning equipment. The chip 2 is stably adhered to the second adhesion film 4 to perform a second cleaning of the chip 2 and ensure the cleaning effect of the chip 2.

[0065] Example 3

[0066] Please refer to Figure 8 This is a flowchart of the chip surface cleaning method of this embodiment. The chip surface cleaning method of this embodiment includes the following steps:

[0067] S301: Place the chip 2 to be cleaned into the chip box 1.

[0068] S302: Provide a first adhesive film 3 of suitable size; use the first adhesive film 3 to adhere the chip 2 to the chip cartridge 1. In this embodiment, the first adhesive film 3 is a UV film.

[0069] S303: Provide a second adhesive film 4; stretch the second adhesive film 4; then attach and bond the first adhesive film 3 to the second adhesive film 4.

[0070] S304: Expose the first adhesion film 3.

[0071] Specifically, the first adhesive film 3 and the second adhesive film 4 are exposed to light. After exposure, the adhesiveness of the first adhesive film 3 is reduced and becomes less than or equal to the adhesiveness of the second adhesive film 4, so that the first adhesive film 3 can be peeled off from the second adhesive film 4. Since the second adhesive film 4 is a blue film and the exposure is performed on one side of the first adhesive film 3, the viscosity of the second adhesive film 4 will not be affected or will be reduced to a lesser degree than that of the first adhesive film 3.

[0072] S305: Fix the second adhesive film 4, peel the first adhesive film 3 off the second adhesive film 4 to remove impurities from the chip 2.

[0073] In this embodiment, steps S301, S302, S303, and S305 correspond one-to-one with steps S101, S102, S103, and S104 in the embodiment. Except for the material of the first adhesive film 3, the other processes are the same. For details, please refer to the relevant description in Embodiment 1. This embodiment will not repeat the details.

[0074] In the chip surface cleaning method of this embodiment, a UV film is used as the first adhesive film 3. Its viscosity can be reduced by exposure. Thus, when the first adhesive film 3 is peeled off, it can be peeled off more easily and quickly, reducing the impact of the adhesiveness of the first adhesive film 3 on the surface of the chip 2, and avoiding the degradation of the quality of the chip 2 pins or the impact on its appearance.

[0075] Example 4

[0076] Please refer to Figure 9 This is a flowchart of the chip surface cleaning method of this embodiment. The chip surface cleaning method of this embodiment includes the following steps:

[0077] S401: Place the chip 2 to be cleaned into the chip box 1.

[0078] S402: Provide a first adhesive film 3 of suitable size; use the first adhesive film 3 to adhere the chip 2 to the chip cartridge 1. In this embodiment, the first adhesive film 3 is a pyrolytic film.

[0079] S403: Provide a second adhesive film 4; stretch the second adhesive film 4; then attach and bond the first adhesive film 3 to the second adhesive film 4.

[0080] S404: Heating the first adhesion film 3.

[0081] Specifically, the first adhesive film 3 and the second adhesive film 4 are heated. After heating, the viscosity of the first adhesive film 3 is reduced and becomes less than or equal to the viscosity of the second adhesive film 4, so that the first adhesive film 3 can be peeled off from the second adhesive film 4. Since the second adhesive film 4 is a blue film and the heating is carried out on one side of the first adhesive film 3, the viscosity of the second adhesive film 4 will not be affected or will be reduced to a lesser degree than that of the first adhesive film 3.

[0082] S405: Fix the second adhesive film 4, peel the first adhesive film 3 off the second adhesive film 4 to remove impurities from the chip 2.

[0083] In this embodiment, steps S401, S402, S403, and S405 correspond one-to-one with steps S101, S102, S103, and S104 in the embodiment. Except for the material of the first adhesive film 3, the other processes are the same. For details, please refer to the relevant description in Embodiment 1. This embodiment will not repeat the details.

[0084] In this embodiment of the chip surface cleaning method, a pyrolytic film is used as the first adhesive film 3. Its viscosity can be reduced by heating. Thus, when the first adhesive film 3 is peeled off, it can be peeled off more easily and quickly, reducing the impact of the adhesiveness of the first adhesive film 3 on the surface of the chip 2, and avoiding the degradation of the quality of the chip 2 pins or the impact on its appearance.

[0085] In specific implementations of Embodiments 3 and 4 of the present invention, the secondary cleaning step in Embodiment 2 can also be selected and executed according to the cleaning condition of the chip surface. The specific process is the same as or similar to that of Embodiment 2, and will not be described in detail here.

Claims

1. A chip surface cleaning method, characterized in that, Includes the following steps: Place the chip to be cleaned in the chip box; A first adhesive film is provided, and the chip is bonded together using the first adhesive film; After providing a second adhesive film and stretching it taut, the side of the first adhesive film with the chip attached is placed opposite the second adhesive film, and the first adhesive film and the second adhesive film are attached and bonded together. Fix the second adhesive film, peel the first adhesive film off the second adhesive film, transfer the chip onto the second adhesive film, and remove impurities on the chip with the first adhesive film to clean the chip surface; Determine whether impurities still exist on the chip. If so, perform a second cleaning; otherwise, store the chip in a clean chip container for later use. The specific method for the second cleaning of the chip is as follows: The second adhesive film with the chip attached is transferred to the cleaning equipment and fixed. The second adhesive film is controlled to rotate carrying the chip and simultaneously sprayed with cleaning solution onto the working surface of the chip. After the cleaning solution is completed, a preset gas is sprayed onto the working surface of the chip to dry the chip, thus completing the secondary cleaning.

2. The chip surface cleaning method according to claim 1, characterized in that, In the step of placing the chip to be cleaned into the chip box, the chip box has several regularly arranged placement slots with open tops. The chip to be cleaned is placed in the placement slots, and the working surface of the chip to be cleaned is exposed at the open end of the placement slot.

3. The chip surface cleaning method according to claim 2, characterized in that, In the step of providing a first adhesive film and using the first adhesive film to adhere the chip, the first adhesive film has at least one adhesive surface, and the specific method for using the first adhesive film to adhere the chip is as follows: The first adhesive film is placed horizontally above the chip box with the adhesive side of the first adhesive film facing the chip, and an external force is applied to the side of the first adhesive film opposite to the chip to make the adhesive side of the first adhesive film adhere tightly to the working surface of the chip to be cleaned.

4. The chip surface cleaning method according to claim 1, characterized in that, The first adhesive film is a blue film, the second adhesive film is a blue film, and the adhesiveness of the first adhesive film is less than or equal to that of the second adhesive film.

5. The chip surface cleaning method according to claim 1, characterized in that, The first adhesive film is a UV film, and the second adhesive film is a blue film. Prior to the step of fixing the second adhesive film, the following steps are also included: The first and second adhesive films are exposed to light. After exposure, the adhesiveness of the first adhesive film decreases and becomes less than or equal to the adhesiveness of the second adhesive film.

6. The chip surface cleaning method according to claim 1, characterized in that, The first adhesive film is a pyrolytic film, and the second adhesive film is a blue film. Prior to the step of fixing the second adhesive film, the following steps are also included: The first and second adhesive films are heated, and after heating, the adhesiveness of the first adhesive film decreases and becomes less than or equal to the adhesiveness of the second adhesive film.

7. The chip surface cleaning method according to claim 1, characterized in that, The size of the first adhesive film is smaller than the size of the second adhesive film, so that the second adhesive film has a fixed portion that does not coincide with the first adhesive film on the horizontal projection plane; In the step of fixing the second adhesive film and peeling the first adhesive film off the second adhesive film to transfer the chip onto the second adhesive film, the specific method is as follows: The second adhesive film is stretched and fixed with a crystal expansion ring, and the first adhesive film is peeled off in a predetermined direction relative to the film plane of the first adhesive film and / or the second adhesive film.

8. The chip surface cleaning method according to claim 1, characterized in that, The cleaning solution is deionized water, the cleaning time is 2-5 minutes, the spray pressure of the cleaning solution is 1-30 psi, and the number of cleaning cycles is 2-10. The preset gas is N2, the preset gas spray pressure is 10-70 psi, the preset gas spray cycle is 2-11, and the rotation speed of the second adhesion film carrying the chip is 200-1000 rpm.

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