High-precision inner cylindrical surface polishing device and polishing method

Abstract

The application discloses a high-precision inner cylindrical surface polishing device and a polishing method, and belongs to the technical field of polishing devices.The device comprises the following steps: rotating a base plate and a cylindrical polishing pad by using a rotating main shaft, so as to drive a circular ring product to rotate; the circular ring product is provided with elastic rollers with self-damping on the outer side of the circular ring product; the elastic rollers uniformly press the outer side of the circular ring product; a rotating speed difference exists between the circular ring product and the cylindrical polishing pad, so that the size of each radial area of the inner cylindrical surface of the circular ring product is uniformly removed by the cylindrical polishing pad; a swing shaft is used to drive a fork to move along the extension direction of the rotating main shaft, so as to indirectly drive the amplitude of the left and right movement of the circular ring product to be adjusted, and the size of each axial area of the inner cylindrical surface of the circular ring product is adjusted to be removed; and the high-precision polishing of each radial area of the inner cylindrical surface can be realized, and the cylindrical degree of the inner cylindrical surface can be accurately controlled.

Description

Technical Field

[0001] This invention belongs to the field of optical cold processing, specifically referring to a high-precision inner cylindrical surface polishing device and polishing method, which can polish the inner cylindrical surface of ring-shaped products. Background Technology

[0002] Optical ring glass products are similar in shape to glass tubes. To achieve their optical performance, not only is the cylindricity of the outer ring glass product required to be highly accurate, but the cylindricity of its inner cylindrical surface is also required to be extremely high. Currently available honing and drilling equipment cannot meet these cylindricity accuracy requirements. Therefore, a high-precision inner cylindrical surface polishing device is needed to polish the inner cylindrical surface of ring-shaped products, providing convenient and controllable operation for achieving precise inner cylindrical surface diameter and cylindricity. Summary of the Invention

[0003] The purpose of this invention is to provide a high-precision inner cylindrical surface polishing device and polishing method, which can achieve convenient and controllable operation in terms of the machining diameter and cylindricity accuracy of the inner cylindrical surface.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A high-precision inner cylindrical surface polishing device, comprising:

[0006] Polishing pad, chassis, rotary spindle, flexible roller, shift fork, and ejector pin;

[0007] The rotating spindle is connected to the chassis and is used to drive the rotation of the polishing pad through the chassis;

[0008] The chassis is fixedly connected to the rotating spindle on one side and to the polishing pad on the other side.

[0009] The polishing pad is cylindrical and fixed on the chassis. It is used to rotate under the drive of the rotating spindle to polish the inner cylindrical surface of the ring product to be processed.

[0010] The elastic roller is able to rotate freely with resistance along the axial direction of the elastic roller. It is fixed under the shift fork and its extension direction is basically parallel to the extension direction of the rotating spindle. It is set above the side of the polishing pad and is used to press against the outer surface of the ring product to be processed.

[0011] The lower end of the shift fork is fixed with the elastic roller, which is fixed on the ejector pin rod to fix the elastic roller.

[0012] The ejector pin rod has a fork fixed at its lower end along the vertical direction for fixing the ejector pin rod and setting it in a designated position.

[0013] Optionally, the upper end of the ejector pin rod has a replaceable pressure iron with a certain weight, so that the elastic roller presses against the outer side of the ring product under the weight of the pressure iron itself.

[0014] Optionally, it also features a connecting sleeve and a locking rod screw;

[0015] The ejector pin rod passes through the connecting sleeve and can slide up and down;

[0016] The locking rod screw can lock the ejector rod on the connecting sleeve, thereby fixing the position of the ejector rod, pressure iron, shift fork and self-damped elastic roller in the vertical direction.

[0017] Optionally, it also has a swing shaft, the rear end of the connecting sleeve is fixed to the swing shaft, the swing shaft can reciprocate along the extension direction of the rotating main shaft, thereby adjusting the polishing area of ​​the polishing pad by reciprocating the shift fork.

[0018] Optionally, the polishing pad is a polyurethane polishing pad or a velvet polishing pad.

[0019] Optionally, the polishing pad has oblique slots.

[0020] Optionally, the diameter of the polishing pad is 85%-95% of the diameter of the annular product to be processed.

[0021] A polishing method utilizing the aforementioned high-precision inner cylindrical surface polishing device includes:

[0022] The polishing pad is attached to the cylindrical base, and the ring product to be processed is placed in the polishing pad. The base and polishing pad are rotated clockwise by rotating the spindle, which in turn drives the ring product to rotate clockwise. The inner cylindrical surface of the ring product is precisely polished using the cylindrical polishing pad.

[0023] By adjusting the up and down position of the ejector pin rod, the damped elastic roller presses against the outer cylindrical surface of the ring product. At the same time, polishing liquid is continuously added between the ring product and the cylindrical polishing pad for grinding, thereby achieving uniform grinding and removal of dimensions in each radial area of ​​the inner cylindrical surface of the ring product by the cylindrical polishing pad.

[0024] Optionally, the connecting sleeve, locking rod screw, ejector pin, pressure iron, and shift fork are driven by the swing shaft to reciprocate along the extension direction of the rotating spindle, indirectly adjusting the range of axial movement of the ring product, so that part of the inner cylindrical surface of the ring product does not contact the cylindrical polishing pad, and is suspended outside the cylindrical polishing pad and is not ground, thus adjusting the amount of size removed by grinding in each axial area of ​​the inner cylindrical surface of the ring product.

[0025] In summary, the present invention has the following advantages:

[0026] 1. High-precision polishing of each radial area of ​​the inner cylindrical surface is achieved by using a combination of elastic rollers and polishing pads;

[0027] 2. By using the swing shaft to drive the elastic roller to reciprocate, the range of the circular ring product's movement along the axial direction is indirectly adjusted, controlling the amount of dimension removed by grinding in each axial area, thus achieving precise and controllable cylindricity of the inner cylindrical surface. Attached Figure Description

[0028] Figure 1 This is a view of an inner cylindrical surface polishing apparatus according to a specific embodiment of the present invention;

[0029] Figure 2 This is a view of a cylindrical polishing pad according to a specific embodiment of the present invention;

[0030] Figure 3 This is a cross-sectional view of the cylindrical polishing pad in operation according to a specific embodiment of the present invention;

[0031] The technical features referred to by the reference numerals in the figure are as follows:

[0032] 1. Swing shaft; 2. Circular ring product; 3. Polishing liquid; 4. Polishing pad; 5. Base plate; 6. Rotary spindle; 7. Elastic roller; 8. Shift fork; 9. Locking rod screw; 10. Connecting sleeve; 11. Ejector pin rod; 12. Pressure iron. Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0034] The main features of this invention are as follows: a rotating spindle drives the chassis and cylindrical polishing pad to rotate, thereby causing the ring product to rotate as well. The outer surface of the ring product has a damped elastic roller that presses evenly against the outer surface of the ring product, creating a speed difference between the ring product and the cylindrical polishing pad. This allows the cylindrical polishing pad to evenly grind away the dimensions of each radial area of ​​the inner cylindrical surface of the ring product. Furthermore, a swing shaft drives a shift fork to move along the extension direction of the rotating spindle, indirectly adjusting the left-right movement of the ring product, thereby adjusting the amount of dimensions removed from each axial area of ​​the inner cylindrical surface of the ring product.

[0035] See Figure 1-3 A perspective view of a high-precision inner cylindrical surface polishing apparatus according to a specific embodiment of the present invention, as well as a view and a cross-sectional view of a polishing pad, are shown, including:

[0036] 4. Polishing pad; 5. Base plate; 6. Rotary spindle; 7. Flexible roller; 8. Shift fork; and 11. Ejector pin rod;

[0037] The rotating spindle 6 is connected to the chassis 5 and is used to drive the rotation of the polishing pad 4 through the chassis 5;

[0038] The chassis 5, optionally, is cylindrical, with one side fixedly connected to the rotating spindle 6 and the other side fixedly connected to the polishing pad 4;

[0039] Polishing pad 4, optional, has a cylindrical outer surface and is glued and fixed on the base plate 5. It is used to rotate under the drive of the rotating spindle 6 to polish the inner hole of the ring product 2 to be processed, i.e., the inner cylindrical surface.

[0040] The elastic roller 7, optionally cylindrical, is able to rotate freely with resistance along the axial direction of the elastic roller 7. It is fixed under the shift fork 8 and extends in a direction substantially parallel to the extension direction of the rotating spindle 6. It is positioned above the side of the polishing pad 4 and is used to press against the outer surface of the ring product 2 to be processed.

[0041] The fork 8 has the elastic roller 7 fixed at its lower end and is fixed on the ejector pin 11 for fixing the elastic roller 7.

[0042] The ejector rod 11 is vertically oriented, and a fork 8 is fixed at its lower end to fix the ejector rod 11 and set it in a designated position. That is, the ejector rod 11 can adjust the position of the fork 8 and the elastic roller 7 in the vertical direction to adapt to different sizes of ring products to be processed.

[0043] Therefore, when the annular product 2 is fitted into the polishing pad, the rotating spindle 6 drives the base 5 and the cylindrical polishing pad 4 to rotate, thereby causing the annular product 2 to rotate as well. The elastic roller 2 presses against the outer surface of the annular product 2, creating a difference in rotational speed between the annular product 2 and the cylindrical polishing pad 4. During the rotation, polishing liquid 3 is continuously added between the annular product 2 and the cylindrical polishing pad 4, so that the radial areas of the inner cylindrical surface of the annular product 2 are uniformly ground and the dimensions are removed by the cylindrical polishing pad 4.

[0044] Furthermore, the upper end of the ejector pin 11 has a replaceable pressure iron 12, which has a certain weight, so that the elastic roller 7 presses against the outer side of the ring product 2 under the weight of the pressure iron 12 itself.

[0045] Therefore, the pressure applied to the outer side of the ring product 2 can be adjusted by using pressure irons of different weights, thereby adjusting the efficiency of grinding and removing dimensions from the inner cylindrical surface of the ring product 2.

[0046] Furthermore, the ejector rod 11 passes through the connecting sleeve 10 and can slide up and down. The locking rod screw 9 can lock the ejector rod 11 on the connecting sleeve 10, thereby fixing the position of the ejector rod 11, the pressure iron, the shift fork and the self-damped elastic roller in the vertical direction.

[0047] The rear end of the connecting sleeve 10 is fixed to the swing shaft 1. The swing shaft 1 can reciprocate along the extension direction of the rotating main shaft 6, that is, the direction of the central axis of the ring product to be processed. This drives the elastic roller 7 to reciprocate along the extension direction of the rotating main shaft 6 via the shift fork 8, thereby controlling the movement range of the ring product and adjusting the polishing area of ​​the polishing pad 4.

[0048] In other words, the elastic roller 7 can press against the ring product to be processed for polishing in the area it moves, and control the range of motion of the ring product. By adjusting the position of the swing shaft 1, the amount of size removed by grinding in each axial area of ​​the inner cylindrical surface of the ring product 2 can be controlled, thereby achieving precise and controllable cylindricity of the inner cylindrical surface of the ring product 2.

[0049] Among them, polishing pad 4 can be a polyurethane polishing pad or a velvet polishing pad, depending on the hardness of the product.

[0050] Further, see Figure 2 The polishing pad 4 has oblique grooves to facilitate the flow of polishing fluid between the ring product to be processed and the polishing pad, while ensuring that the polishing process will not be blocked.

[0051] The diameter of the polishing pad 4 can be 85%-95% of the diameter of the circular ring product to be processed, preferably 90%.

[0052] This invention further discloses a polishing method utilizing the aforementioned high-precision inner cylindrical surface polishing device.

[0053] The ring product 2 to be processed is placed in the polishing pad 4. The inner cylindrical surface of the ring product 4 is precisely polished using the cylindrical polishing pad 4. The cylindrical polishing pad 4 is attached to the base 5 of the cylinder. The rotating spindle 6 drives the base 5 and the polishing pad 4 to rotate clockwise, thereby driving the ring product 2 to rotate clockwise as well. By adjusting the up and down position of the ejector rod 11, the damped elastic roller 7 presses against the outer cylindrical surface of the ring product 2. The outer cylindrical surface of the ring product 2 is subjected to uniform pressing friction resistance from the damped elastic roller 7, resulting in a difference in rotational speed between the ring product 2 and the cylindrical polishing pad 4. At the same time, polishing liquid 3 is continuously added between the ring product 2 and the cylindrical polishing pad 4 for grinding, thereby achieving uniform grinding and removal of dimensions in each radial area of ​​the inner cylindrical surface of the ring product 2 by the cylindrical polishing pad 4.

[0054] Furthermore, by driving the connecting sleeve 10, locking rod screw 9, ejector pin 11, pressure iron 12 and shift fork 8 to reciprocate along the extension direction of the rotating main shaft 6, the range of axial movement of the ring product 2 is indirectly adjusted, so that part of the inner cylindrical surface of the ring product 2 does not contact the cylindrical polishing pad 4, and part of the inner cylindrical surface of the ring product 2 is suspended outside the cylindrical polishing pad 4 and is not ground. The amount of dimension removed by grinding in each axial area of ​​the inner cylindrical surface of the ring product 2 is adjusted, thereby achieving precise and controllable cylindricity of the inner cylindrical surface of the ring product 2. Example

[0055] Taking a glass ring product 2 with an outer diameter of 120mm, an inner diameter of 90mm (wall thickness of 15mm) and a length of 100mm as an example; when polishing the inner cylindrical surface, a cylindrical polishing pad 4 with an outer diameter of 80mm and a length of 120mm can be selected; by adjusting the up and down position of the ejector pin 11, the gap between the elastic roller 7 and the cylindrical polishing pad 4 is made to be 10mm, ensuring that the elastic roller 7 with its own damping always presses against the outer cylindrical surface of the ring product 2 throughout the entire processing process, and a 2kg pressure iron 12 is used for pressure application.

[0056] Before processing, the circular ring product 2 is fitted onto the cylindrical polishing pad 4, and then the base 5 is installed and fixed on the rotating spindle 6. The movement range of the swing shaft 1 is adjusted to -25mm to 25mm. Before starting the machine, polishing liquid 3 is added, and then the rotating spindle 6 is started. At this time, the rotating spindle 6 drives the base 5 and polishing pad 4 to rotate clockwise, thereby driving the circular ring product 2 to rotate clockwise as well. Then the swing shaft 1 is started. The swing shaft 1 drives the connecting sleeve 10, locking rod screw 9, ejector pin 11, pressure iron 12 and shift fork 8 to reciprocate along the extension direction of the rotating spindle 6, indirectly adjusting the circular ring product 2 to reciprocate along the axial direction by -25mm to 25mm.

[0057] After polishing for a period of time, the cylindricity of the inner cylindrical surface of the ring product 2 is inspected. If the front and rear diameters of the inner cylindrical surface are larger than the middle diameter, the movement range of the swing shaft 1 is increased to -35mm to 35mm. By extending the time that the front and rear areas of the inner cylindrical surface are suspended and not removed by polishing and grinding, the speed at which the front and rear diameters of the inner cylindrical surface increase is slowed down, while the speed at which the middle diameter increases is accelerated. By adjusting the rotational speed of the spindle 6, the weight of the pressure iron 12, and the position, amplitude, and swing speed of the swing shaft 1, the cylindricity of the inner cylindrical surface of the ring product 2 reaches 300nm, while the surface roughness Ra reaches 2nm. This level of precision is difficult to achieve with traditional CNC machining tools.

[0058] In summary, the present invention has the following advantages:

[0059] 1. High-precision polishing of each radial area of ​​the inner cylindrical surface is achieved by using a combination of elastic rollers and polishing pads;

[0060] 2. By using the swing shaft to drive the elastic roller to reciprocate, the range of movement of the ring product 2 along the axial direction is indirectly adjusted, thereby controlling the amount of size removed by grinding in each axial region and achieving precise and controllable cylindricity of the inner cylindrical surface.

[0061] The above description is a further detailed explanation of the present invention in conjunction with specific preferred embodiments. It should not be considered that the specific embodiments of the present invention are limited to this. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered to fall within the scope of protection of the present invention as defined by the submitted claims.

Claims

1. A high-precision inner cylindrical surface polishing device, characterized in that, The polishing pad, the base plate, the rotating main shaft, the elastic roller, the fork and the needle rod are included. The rotating main shaft is connected with the base plate and used to drive the rotation of the polishing pad through the base plate. One side of the base plate is fixedly connected with the rotating main shaft, and the other side is fixedly connected with the polishing pad. The polishing pad is fixedly attached to the base plate and used to rotate under the driving of the rotating main shaft to polish the inner cylindrical surface of the ring product to be processed. The elastic roller can freely rotate along the elastic roller axis with resistance, is fixed below the fork, has a direction of extension substantially parallel to the direction of extension of the rotating main shaft, is arranged above the side of the polishing pad, and is used to press against the outer surface of the ring product to be processed. The fork is fixed with the elastic roller at the lower end and is fixed on the needle rod to fix the elastic roller. The needle rod is fixed with the fork at the lower end along the vertical direction to fix the elastic roller and arrange it at a specified position. The upper end of the needle rod is provided with a replaceable pressing iron having a certain weight, so that the elastic roller is pressed against the outer side of the ring product under the weight of the pressing iron. The device also has a connecting sleeve and a lock rod screw. The needle rod is arranged in the connecting sleeve and can slide up and down. The lock rod screw can lock the needle rod on the connecting sleeve to fix the position of the needle rod, the pressing iron, the fork and the elastic roller with damping in the vertical direction. The device also has a swing shaft, the rear end of the connecting sleeve is fixed with the swing shaft, and the swing shaft can reciprocate along the direction of extension of the rotating main shaft to adjust the polishing area of the polishing pad through the reciprocating movement of the fork.

2. The inner cylindrical surface polishing device according to claim 1, wherein the polishing pad is a polyurethane polishing pad or a velvet polishing pad.

3. The inner cylindrical surface polishing device according to claim 1, wherein the polishing pad is provided with inclined slot holes.

4. The inner cylindrical surface polishing device according to claim 1, wherein the diameter of the polishing pad is 85%-95% of the diameter of the ring product to be processed.

5. A polishing method using the high-precision inner cylindrical surface polishing device according to any one of claims 1-4, comprising: attaching the polishing pad to the base plate of the cylinder, sleeving the ring product to be processed in the polishing pad, rotating the base plate and the polishing pad clockwise through the rotating main shaft to drive the ring product to rotate clockwise, and precisely polishing the inner cylindrical surface of the ring product by the cylindrical polishing pad. Adjusting the up-and-down position of the needle rod to press the elastic roller with damping against the outer cylindrical surface of the ring product, and continuously adding polishing liquid between the ring product and the cylindrical polishing pad to grind and remove the size of each radial area of the inner cylindrical surface of the ring product.

6. The polishing method according to claim 5, wherein ​ ​ ​ ​ ​ The connecting sleeve is driven by the swing shaft, the lock top rod screw, the top needle rod, the pressing iron and the shift fork to reciprocate along the extension direction of the rotating main shaft, indirectly shift the adjustment ring product to move along the axial direction, so that part of the inner cylindrical surface of the ring product does not contact the cylindrical polishing pad and is suspended outside the cylindrical polishing pad and is not ground, and the size of the ground and removed of each axial area of the inner cylindrical surface of the ring product is adjusted.

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