A single crystal silicon wafer grinding wheel and double-sided grinding device

Abstract

The application discloses a single crystal silicon wafer grinding wheel and a double-sided grinding device, and relates to the technical field of single crystal silicon wafer processing. The single crystal silicon wafer grinding wheel comprises a wheel disc body, a rough grinding ridge is arranged on one side of the disc surface of the wheel disc body, a driving rotating shaft for driving the wheel disc body is arranged on the other side of the disc surface of the wheel disc body, a plurality of rough grinding ridges are arranged at equal angles around the center position of the disc surface of the wheel disc body, the plurality of rough grinding ridges separate the disc surface of the wheel disc body into a plurality of plate surface regions, a channel is arranged on the wheel disc body, the channel is located in the plate surface region, and a fine grinding piece for fine grinding the single crystal silicon wafer is arranged in the channel in an extendable and retractable mode. The single crystal silicon wafer rough grinding and fine grinding processes can be conveniently and quickly adjusted.

Description

Technical Field

[0001] This invention relates to the field of single-crystal silicon wafer processing equipment, and in particular to a single-crystal silicon wafer grinding wheel and a double-sided grinding device. Background Technology

[0002] Currently, the grinding process for monocrystalline silicon wafers involves using grinding wheels to polish the surface of the wafer, resulting in a wafer with a highly smooth surface. During the grinding process, the grinding wheels need to be used in conjunction with polishing fluid to minimize unnecessary damage to the silicon wafer.

[0003] However, monocrystalline silicon wafers require surface grinding through a process of coarse grinding followed by fine grinding. In the actual use of monocrystalline silicon wafers, it is necessary to frequently change sandpaper of different grits, making it difficult to quickly adjust the coarse grinding and fine grinding processes. Summary of the Invention

[0004] This application provides a grinding wheel for monocrystalline silicon wafers and a double-sided grinding device, which facilitates quick adjustment of the coarse and fine grinding processes for monocrystalline silicon wafers.

[0005] This application provides a single-crystal silicon wafer polishing wheel and a double-sided polishing device, which adopts the following technical solution:

[0006] A grinding wheel for monocrystalline silicon wafers includes a wheel body. One side of the wheel body has coarse grinding ridges, and the other side of the wheel body has a drive shaft for driving the wheel body. Several coarse grinding ridges are arranged at equal angles around the center of the wheel body's surface, dividing the surface into several plate-like regions. The wheel body has channels located within these plate-like regions, and the interior of each channel contains retractable grinding elements for fine grinding of the monocrystalline silicon wafer.

[0007] By adopting the above technical solution, since monocrystalline silicon wafers require surface grinding through a process of coarse grinding followed by fine grinding, different grit sandpapers need to be replaced during actual use, which is cumbersome. Therefore, this solution uses coarse grinding ridges on the surface of the wheel body to achieve the grinding effect on the surface of the monocrystalline silicon wafer. In addition, a fine grinding component is provided inside the wheel body for telescopic movement. When the polishing surface of the fine grinding component passes over the grinding surface of the coarse grinding ridges until it contacts the monocrystalline silicon wafer, the surface of the monocrystalline silicon wafer is polished. The grinding and polishing of the monocrystalline silicon wafer can be achieved without replacing sandpaper of different grits, which facilitates quick adjustment of the coarse grinding and fine grinding processes of the monocrystalline silicon wafer.

[0008] Preferably, the coarse grinding rib is provided with a grinding toothed rib, the grinding toothed rib has a streamlined structure, and the grinding toothed rib is provided with a chamfered portion for contacting the surface of the single crystal silicon wafer.

[0009] By adopting the above technical solution, the grinding teeth set on the surface of the coarse grinding rib make the chamfered part abut against the surface of the silicon wafer. The rotating grinding teeth are used to grind the outer surface of the silicon wafer. The scrap generated during the silicon wafer grinding process will be guided along the chamfered part of the grinding teeth to the coarse grinding rib, and then guided along the streamlined lines of the coarse grinding rib to the disk surface of the wheel body. This avoids the scrap generated during the silicon wafer grinding process from sticking to the surface of the silicon wafer, which would affect the grinding and polishing of the silicon wafer.

[0010] Preferably, the interior of the coarse grinding rib is provided with a first spray hole and a second spray hole for columnar spraying of polishing liquid. There are multiple first spray holes and second spray holes, and the first spray holes and second spray holes are respectively located on both sides of the grinding rib. The first spray hole faces the outer surface of the single crystal silicon wafer, and the second spray hole faces the chamfered part.

[0011] By adopting the above technical solution, the first spray hole and the second spray hole are located on both sides of the grinding rack. The first spray hole sprays polishing liquid onto the surface of the monocrystalline silicon wafer to polish the monocrystalline silicon wafer. The polishing liquid sprayed through the second spray hole is used to wash away the scrap at the chamfered part to prevent the scrap from abrading the surface of the monocrystalline silicon wafer.

[0012] Preferably, the grinding part includes a cavity formed in the body of the wheel, the cavity is connected to the channel, a telescopic disc is slidably arranged inside the cavity, a plurality of polishing discs are provided on one side of the telescopic disc and penetrating inside the channel, and a driving component is provided on the other side of the telescopic disc.

[0013] By adopting the above technical solution, the telescopic disc is extended and retracted inside the cavity by activating the driving component, thereby controlling the extension and retraction of the polishing disc. When the polishing disc extends outside the channel and the polishing surface of the polishing disc passes through the coarse grinding ridge, the polishing effect on the single crystal silicon wafer is achieved by utilizing the contact between the polishing disc and the surface of the single crystal silicon wafer.

[0014] Preferably, a double-sided polishing apparatus for monocrystalline silicon wafers includes: a support frame;

[0015] A pair of housings arranged opposite each other, the pair of housings sliding synchronously on a support frame;

[0016] A pair of single-crystal silicon wafer grinding wheels are arranged opposite to each other, and the pair of single-crystal silicon wafer grinding wheels are respectively fixed on the corresponding pair of housings;

[0017] A driving element, which is mounted on a support frame and is used to drive a pair of housings;

[0018] A fixing assembly is disposed between a pair of housings and is used to fix a monocrystalline silicon wafer.

[0019] By adopting the above technical solution, since the grinding wheels for monocrystalline silicon wafers are easy to operate, in order to facilitate double-sided grinding of monocrystalline silicon wafers, the power supply of the driving element is turned on, causing a pair of monocrystalline silicon wafer grinding wheels to move relative to each other. When the pair of monocrystalline silicon wafer grinding wheels approach each other, the monocrystalline silicon grinding wheels contact the two side surfaces of the monocrystalline silicon wafer fixed on the fixed component. By using the monocrystalline silicon grinding wheels, the double-sided grinding of monocrystalline silicon can be achieved. The operation is simple and easy to implement.

[0020] Preferably, a liquid collecting block is provided on one side of the opposite side of the housing, and a liquid collecting tank is provided inside the liquid collecting block. The liquid collecting tank is located in the space below the single crystal silicon wafer grinding wheel and is used to collect the waste liquid generated during the grinding process of the single crystal silicon wafer grinding wheel.

[0021] By adopting the above technical solution, since the polishing slurry is sprayed onto the monocrystalline silicon wafer and the grinding rack, the polishing slurry mixes with the scrap material to form waste liquid during the grinding process. The waste liquid is easy to drip onto the support frame and dirty the support frame. Therefore, by providing a liquid collection block on the housing, the waste liquid drips into the liquid collection tank, which serves to temporarily store the waste liquid and prevent the waste liquid from dirtying the support frame.

[0022] Preferably, the housing has an internal cavity, and the housing has a drain port and a drain hole. The drain port is connected to the cavity and is vertically downward. The two ends of the drain hole are connected to the cavity and the collection tank, respectively.

[0023] By adopting the above technical solution, the waste liquid temporarily stored in the collection tank will enter the internal cavity of the shell through the drain hole, and be guided to a suitable position through the drain port to avoid excessive waste liquid overflowing from the collection tank, so as to properly treat the waste liquid.

[0024] Preferably, the fixing component includes a support column, the top of which is provided with a positioning block, and the upper surface of the positioning block is provided with a slot for matching the monocrystalline silicon wafer.

[0025] By adopting the above technical solution, the set support pillars can effectively provide a fixing platform for monocrystalline silicon wafers, and the slots on the positioning blocks can be used to achieve rapid positioning of monocrystalline silicon wafers.

[0026] Preferably, the slot is provided with a positioning perforation, and the interior of the positioning perforation is provided with a pressing block, one end of which faces the surface of the single crystal silicon wafer.

[0027] By adopting the above technical solution, the extrusion block inside the positioning perforation is pressed against both sides of the monocrystalline silicon wafer to clamp and fix the monocrystalline silicon wafer, thereby ensuring the stability of the monocrystalline silicon wafer during the processing.

[0028] Preferably, the extrusion block is made of a flexible material and is disposed on the liquid collection block.

[0029] By adopting the above technical solution, since the liquid collection block is set on the shell, when a pair of shells approach each other, the extrusion block on the liquid collection block moves towards the two sides of the monocrystalline silicon wafer until the extrusion block passes through the positioning hole and abuts against the two sides of the monocrystalline silicon wafer, which is used to fix the monocrystalline silicon wafer in the slot. The linkage effect is good and it is convenient to quickly fix the position of the monocrystalline silicon wafer.

[0030] In summary, this application has the following beneficial effects:

[0031] 1. This single-crystal silicon wafer grinding wheel achieves the grinding effect on the surface of the single-crystal silicon wafer by providing coarse grinding ridges on the surface of the wheel body. In addition, a fine grinding component is provided inside the wheel body. When the polishing surface of the fine grinding component passes over the grinding surface of the coarse grinding ridges until it contacts the single-crystal silicon wafer, the surface of the single-crystal silicon wafer is polished. The grinding and polishing of the single-crystal silicon wafer can be achieved without changing sandpaper of different grits, which facilitates quick adjustment of the coarse grinding and fine grinding processes of the single-crystal silicon wafer.

[0032] 2. This monocrystalline silicon wafer double-sided polishing device, by activating the power supply of the driving element, causes a pair of monocrystalline silicon wafer polishing wheels to move relative to each other. When the pair of monocrystalline silicon wafer polishing wheels approach each other, the monocrystalline silicon polishing wheels contact the two side surfaces of the monocrystalline silicon wafer fixed on the fixed component. By using the monocrystalline silicon polishing wheels, the double-sided polishing effect of monocrystalline silicon is achieved. The operation is simple and easy to implement. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the single-crystal silicon wafer grinding wheel in this embodiment;

[0034] Figure 2 This is a schematic diagram of the overall structure of the coarse grinding strip in this embodiment;

[0035] Figure 3 This is a cross-sectional view of the coarsely ground rib in this embodiment;

[0036] Figure 4 This is an exploded view of the drive shaft and telescopic disc in this embodiment;

[0037] Figure 5 This is a schematic diagram of the overall structure of the single-crystal silicon wafer double-sided polishing device in this embodiment;

[0038] Figure 6 This is a schematic diagram of the internal structure of the driving element in this embodiment;

[0039] Figure 7 This is a schematic diagram of the overall structure of the shell in this embodiment;

[0040] Figure 8 This is an exploded view of the shell and the wheel body in this embodiment;

[0041] Figure 9 This is a schematic diagram of the internal structure of the fixed component in this embodiment.

[0042] Explanation of reference numerals in the attached drawings: 1. Wheel body; 2. Coarse grinding rib; 3. Drive shaft; 4. Channel; 5. Fine grinding part; 501. Cavity; 502. Telescopic disc; 503. Polishing disc; 504. Drive component; 50401. Electric telescopic rod; 50402. Through hole; 50403. Stop bar; 50404. Telescopic shaft; 50405. Matching groove; 6. Grinding rack; 7. Chamfered part; 8. First spray hole; 9. Second spray hole; 10. Support frame; 11. Housing 12. Driving element; 1201. Drive motor; 1202. Slide rod; 1203. Rotating rod; 1204. Connecting rod; 1205. Mounting plate; 1206. Fixed support column; 13. Fixed assembly; 1301. Support column; 1302. Positioning block; 1303. Slot; 1304. Positioning perforation; 1305. Extrusion block; 14. Support plate; 15. Liquid collection block; 16. Liquid collection tank; 17. Receiving cavity; 18. Drain outlet; 19. Drain hole. Detailed Implementation

[0043] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0044] Example: This invention discloses a grinding wheel for single-crystal silicon wafers and a double-sided grinding device, such as... Figure 1As shown, the single-crystal silicon wafer grinding wheel includes a wheel body 1. One side of the wheel body 1 has coarse grinding ridges 2, and the other side of the wheel body 1 has a drive shaft 3 for driving the wheel body 1. Several coarse grinding ridges 2 are arranged at equal angles around the center of the wheel body 1 surface, dividing the surface of the wheel body 1 into several plate-like areas. The wheel body 1 has channels 4 located within the plate-like areas. Fine grinding components 5 for fine grinding of the single-crystal silicon wafer are telescopically mounted inside the channels 4. Since the single-crystal silicon wafer needs to undergo both coarse and fine grinding... The traditional grinding method for surface polishing requires changing sandpaper of different grits, which is cumbersome. Therefore, this solution uses coarse grinding ridges 2 on the surface of the wheel body 1 to polish the surface of the monocrystalline silicon wafer. In addition, a fine grinding component 5 is provided inside the wheel body 1. When the polishing surface of the fine grinding component 5 passes over the grinding surface of the coarse grinding ridges 2 and comes into contact with the monocrystalline silicon wafer, the surface of the monocrystalline silicon wafer is polished. The grinding and polishing of the monocrystalline silicon wafer can be achieved without changing sandpaper of different grits, making the operation convenient.

[0045] like Figure 2 As shown, the coarse grinding rib 2 is provided with a grinding tooth 6, which has a streamlined structure and a chamfered portion 7 for contacting the surface of the single-crystal silicon wafer. By using the grinding tooth 6 on the surface of the coarse grinding rib 2, the chamfered portion 7 abuts against the surface of the silicon wafer. The rotating grinding tooth 6 is used to grind the outer surface of the silicon wafer. The scrap generated during the grinding process is guided along the chamfered portion 7 of the grinding tooth 6 onto the coarse grinding rib 2, and then along the streamlined lines of the coarse grinding rib 2 onto the disk surface of the wheel body 1. This prevents the scrap generated during the grinding process from sticking to the surface of the silicon wafer, thus affecting the grinding and polishing process. The interior of the coarse grinding rib 2... The device is provided with a first spray hole 8 and a second spray hole 9 for spraying polishing liquid in a columnar manner. There are multiple first spray holes 8 and second spray holes 9. The first spray holes 8 and second spray holes 9 are located on both sides of the grinding rack 6. The first spray holes 8 face the outer surface of the monocrystalline silicon wafer, and the second spray holes 9 face the chamfered part 7. The first spray holes 8 spray polishing liquid onto the surface of the monocrystalline silicon wafer to polish the monocrystalline silicon wafer. The polishing liquid sprayed through the second spray holes 9 is used to wash away the scrap at the chamfered part 7 to prevent the scrap from abrading the surface of the monocrystalline silicon wafer.

[0046] like Figure 3As shown, the precision grinding component 5 includes a cavity 501 formed inside the wheel body 1. The cavity 501 is connected to the channel 4. A telescopic disk 502 is slidably arranged inside the cavity 501. Several polishing discs 503 are arranged on one side of the telescopic disk 502, which penetrate into the channel 4. A driving component 504 is arranged on the other side of the telescopic disk 502. By activating the driving component 504, the telescopic disk 502 is extended and retracted inside the cavity 501, thereby controlling the extension and retraction of the polishing discs 503. When the polishing discs 503 extend to the outside of the channel 4 and the polished surface of the polishing discs 503 passes through the coarse grinding ridge 2, the polishing effect on the single crystal silicon wafer is achieved by the contact between the polishing discs 503 and the surface of the single crystal silicon wafer.

[0047] like Figure 3-4 As shown, the driving component 504 includes an electric telescopic rod 50401 and a through hole 50402 located at the center of the driving shaft 3. A stop bar 50403 is provided on the inner wall of the through hole 50402. A telescopic shaft 50404 is connected to the output end of the electric telescopic rod 50401. The telescopic shaft 50404 passes through the through hole 50402, with one end connected to the output end of the electric telescopic rod 50401 and the other end connected to the telescopic disc 502. The outer side of 502 is provided with a matching groove 50405 that matches the cross-sectional shape of the baffle 50403. The electric telescopic rod 50401 is provided to make the telescopic shaft 50404 extend and retract inside the through hole 50402, thereby controlling the relative position between the polishing disc 503 and the coarse grinding strip 2. In addition, through the mutual matching between the baffle 50403 and the matching groove 50405, the telescopic shaft 50404 does not affect the rotation of the telescopic shaft 50404 and the drive shaft 3 during the extension and retraction process.

[0048] like Figure 5As shown, a double-sided polishing device for monocrystalline silicon wafers includes: a support frame 10, on which a pair of oppositely arranged housings 11 are provided, the pair of housings 11 sliding synchronously on the support frame 10; a support plate 14 is provided on the top of the support frame 10, and a driving element 12 for driving the pair of housings 11 is provided on the support plate 14; the driving element 12 includes a drive motor 1201 and a sliding rod 1202 provided on the support frame 10; a rotating rod 1203 is connected to the output end of the drive motor 1201, the middle part of the rotating rod 1203 is connected to the output end of the drive motor 1201, and connecting rods 1204 are rotatably connected to both ends of the rotating rod 1203; one end of the connecting rod 1204 is connected to the rotating rod 1203, and the other end of the connecting rod 1204 is rotatably connected to a mounting plate 1205; the bottom of the mounting plate 1205... The unit is provided with a fixed support column 1206, which is connected to the housing 11. The sliding rod 1202 passes through the interior of the housing 11. By starting the drive motor 1201, the rotating rod 1203 is rotated, which in turn drives the connecting rod 1204, causing the mounting plate 1205 and the housing 11 to slide relative to each other on the sliding rod 1202, thereby driving the housing 11. The housing 11 is used to fix the aforementioned single crystal silicon wafer grinding wheels. By starting the power supply of the drive element 12, a pair of single crystal silicon wafer grinding wheels move relative to each other. A fixing component 13 for fixing single crystal silicon wafers is provided between the pair of housings 11. When the pair of single crystal silicon wafer grinding wheels approach each other, the single crystal silicon grinding wheels contact the two side surfaces of the single crystal silicon wafer fixed on the fixing component 13. By using the single crystal silicon grinding wheels, the double-sided grinding of single crystal silicon is achieved. The operation is simple and easy to implement.

[0049] like Figure 6 As shown, a liquid collecting block 15 is provided on one side of the pair of housings 11. The liquid collecting block 15 has a liquid collecting tank 16 inside. The liquid collecting tank 16 is located in the space below the single crystal silicon wafer grinding wheel and is used to collect the waste liquid generated during the grinding process of the single crystal silicon wafer grinding wheel. Since the polishing liquid is sprayed onto the single crystal silicon wafer and the grinding tooth 6, the polishing liquid mixes with the scrap material to form waste liquid during the grinding process. The waste liquid is easy to drip onto the support frame 10 and dirty the support frame 10. Therefore, by providing a liquid collecting block 15 on the housing 11, the waste liquid drips into the liquid collecting tank 16, which serves to temporarily store the waste liquid and prevent the waste liquid from dirtying the support frame 10.

[0050] like Figures 7-8 As shown, the housing 11 has an internal receiving cavity 17. The housing 11 has a drain port 18 and a drain hole 19. The drain port 18 is connected to the receiving cavity 17 and is vertically downward. The two ends of the drain hole 19 are connected to the receiving cavity 17 and the collection tank 16, respectively. Waste liquid temporarily stored in the collection tank 16 will pass through the drain hole 19 into the internal receiving cavity 17 of the housing 11, and be guided to a suitable position through the drain port 18 to avoid excessive waste liquid overflowing from the collection tank 16, so as to properly treat the waste liquid.

[0051] like Figure 9 As shown, the fixing component 13 includes a support column 1301, with a positioning block 1302 on the top of the support column 1301. The upper surface of the positioning block 1302 has a slot 1303 for matching the monocrystalline silicon wafer. The support column 1301 effectively provides a fixing platform for the monocrystalline silicon wafer, and the slot 1303 on the positioning block 1302 enables rapid positioning of the monocrystalline silicon wafer. The slot 1303 has a positioning through hole 1304, and a pressing block 1305 is located inside the positioning through hole 1304. One end of the pressing block 1305 faces the surface of the monocrystalline silicon wafer. Through the pressing block 1305 inside the positioning through hole 1304, the pressing block 1305... The extrusion block 1305 is pressed onto both sides of the monocrystalline silicon wafer to clamp and fix it, ensuring the stability of the monocrystalline silicon wafer during processing. The extrusion block 1305 is made of flexible material and is set on the liquid collection block 15. Since the liquid collection block 15 is set on the housing 11, when a pair of housings 11 approach each other, the extrusion block 1305 on the liquid collection block 15 moves towards both sides of the monocrystalline silicon wafer until it passes through the positioning hole 1304 and abuts against both sides of the monocrystalline silicon wafer, thus fixing the monocrystalline silicon wafer in the slot 1303. The linkage effect is good, making it convenient and quick to fix the position of the monocrystalline silicon wafer.

[0052] The working principle of the single-crystal silicon wafer double-sided polishing device is as follows: Before use, the user first places the single-crystal silicon wafer on the fixed component 13, and then turns on the power of the drive element 12. Under the action of the drive element 12, a pair of single-crystal silicon wafer polishing wheels move towards the fixed component 13 until the wheel body 1 abuts against the two sides of the single-crystal silicon wafer. By starting the motor on the back of the drive shaft 3, the wheel body 1 rotates on the two sides of the single-crystal silicon wafer, thus achieving double-sided polishing of the single-crystal silicon wafer.

[0053] By using the drive component 504, the telescopic disk 502 is extended and retracted inside the cavity 501, thereby controlling the extension and retraction of the polishing disc 503. When the polishing disc 503 extends outside the channel 4 and the polishing surface of the polishing disc 503 passes over the coarse grinding strip 2, the polishing effect on the single crystal silicon wafer is achieved by using the contact between the polishing disc 503 and the surface of the single crystal silicon wafer.

[0054] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A grinding wheel for single-crystal silicon wafers, comprising a wheel disc body (1), characterized in that: The wheel body (1) has coarse grinding ribs (2) on one side of the disk surface and a drive shaft (3) for driving the wheel body (1) on the other side of the disk surface. Several coarse grinding ribs (2) are arranged at equal angles around the center of the disk surface of the wheel body (1). Several coarse grinding ribs (2) divide the disk surface of the wheel body (1) into several plate areas. The wheel body (1) has a channel (4) located in the plate area. The channel (4) has a fine grinding part (5) for fine grinding of single crystal silicon wafers that can be extended and retracted inside the channel (4). The coarse grinding rib (2) is provided with a grinding toothed rib (6), which has a streamlined structure and a chamfered portion (7) for contacting the surface of the single crystal silicon wafer. The interior of the coarse grinding rib (2) is provided with a first spray hole (8) and a second spray hole (9) for columnar spraying of polishing liquid. There are several of the first spray hole (8) and the second spray hole (9), and the first spray hole (8) and the second spray hole (9) are located on both sides of the grinding rib (6). The first spray hole (8) faces the outer surface of the single crystal silicon wafer, and the second spray hole (9) faces the chamfer (7).

2. The single-crystal silicon wafer grinding wheel according to claim 1, characterized in that: The precision grinding part (5) includes a cavity (501) opened in the wheel body (1), the cavity (501) is connected to the channel (4), a telescopic disc (502) is slidably arranged inside the cavity (501), a plurality of polishing discs (503) are provided on one side of the telescopic disc (502) and penetrate the channel (4), and a driving member (504) is provided on the other side of the telescopic disc (502).

3. A double-sided polishing device for single-crystal silicon wafers, characterized in that: The single-crystal silicon wafer double-sided polishing device includes: a support frame (10); A pair of housings (11) arranged opposite to each other slide synchronously on the support frame (10); A pair of single-crystal silicon wafer grinding wheels as described in any one of claims 1-2 are arranged opposite to each other, and the pair of single-crystal silicon wafer grinding wheels are respectively fixed on the corresponding pair of housings (11); A driving element (12) is disposed on a support frame (10) and is used to drive a pair of housings (11); A fixing component (13) is disposed between a pair of housings (11) and is used to fix a single-crystal silicon wafer.

4. The single-crystal silicon wafer double-sided polishing apparatus according to claim 3, characterized in that: A liquid collection block (15) is provided on one side of the opposite side of the pair of housings (11). The liquid collection block (15) is provided with a liquid collection tank (16) inside. The liquid collection tank (16) is located in the space below the single crystal silicon wafer grinding wheel and is used to collect the waste liquid generated during the grinding process of the single crystal silicon wafer grinding wheel.

5. The single-crystal silicon wafer double-sided polishing apparatus according to claim 4, characterized in that: The housing (11) has an internal cavity (17), and the housing (11) has a drain port (18) and a drain hole (19). The drain port (18) is connected to the cavity (17) and is vertically downward. The two ends of the drain hole (19) are connected to the cavity (17) and the collection tank (16) respectively.

6. The single-crystal silicon wafer double-sided polishing apparatus according to claim 3, characterized in that: The fixing component (13) includes a support column (1301), the top of which is provided with a positioning block (1302), and the upper surface of the positioning block (1302) is provided with a slot (1303) for matching the monocrystalline silicon wafer.

7. The single-crystal silicon wafer double-sided polishing apparatus according to claim 6, characterized in that: The slot (1303) is provided with a positioning through hole (1304), and the inside of the positioning through hole (1304) is provided with a pressing block (1305), one end of the pressing block (1305) facing the surface of the single crystal silicon wafer.

8. The single-crystal silicon wafer double-sided polishing apparatus according to claim 7, characterized in that: The extrusion block (1305) is made of flexible material and is disposed on the liquid collection block (15).

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