Display backplane and display device

Abstract

The application provides a display backboard and a display device. The display backboard comprises: a display substrate having a through hole penetrating through the display substrate; at least one annular organic barrier wall arranged around the through hole; and an inorganic encapsulation layer covering the annular organic barrier wall and covering at least part of the surface of the display substrate adjacent to the annular organic barrier wall. The display substrate satisfies at least one of the following conditions: a first surface of the display substrate has a plurality of annular grooves arranged at intervals, the annular organic barrier wall is arranged on a convex between the annular grooves, the display backboard further comprises an organic buffer part arranged in the annular grooves and in communication with the annular organic barrier wall, and the inorganic encapsulation layer further covers the organic buffer part; the first surface of the display substrate is a flat surface, and a region of the inorganic encapsulation layer adjacent to the annular organic barrier wall has at least one slot hole penetrating through the inorganic encapsulation layer. When the inorganic encapsulation layer is subjected to relatively concentrated or large stress, the stress can be effectively released, and the inorganic encapsulation layer is prevented from being broken.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to display backplanes and display devices. Background Technology

[0002] As AMOLED display performance continues to improve, innovative technologies such as high brightness, high refresh rate, and narrow bezels have become widely adopted in end products. Currently, OLED displays, in pursuit of high color gamut, low power consumption, and extended lifespan, often employ punch-hole displays, requiring effective isolation and encapsulation around the punched area. However, current encapsulation technologies still face numerous challenges, such as encapsulation layer cracking. Summary of the Invention

[0003] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, one object of this invention is to provide a display backplate whose encapsulation structure at the through-holes is not easily broken, resulting in better encapsulation performance.

[0004] In one aspect of the present invention, a display back panel is provided. According to an embodiment of the present invention, the display back panel includes: a display substrate having a through-hole; at least one annular organic barrier wall surrounding the through-hole; and an inorganic encapsulation layer covering the annular organic barrier wall and at least a portion of the surface of the display substrate adjacent to the annular organic barrier wall, wherein the display substrate satisfies at least one of the following conditions: First, a first surface of the display substrate has a plurality of spaced-apart annular grooves, the annular organic barrier wall is disposed on a protrusion between the annular grooves, the display back panel further includes an organic buffer portion disposed in the annular groove and communicating with the annular organic barrier wall, and the inorganic encapsulation layer further covers the organic buffer portion; Second, the first surface of the display substrate is a flat surface, and the region of the inorganic encapsulation layer adjacent to the annular organic barrier wall has at least one through-hole in the inorganic encapsulation layer. Therefore, in the first configuration described above, when the inorganic encapsulation layer is subjected to relatively concentrated or large stress, the stress can be released to the organic buffer part, thereby effectively preventing the inorganic encapsulation layer from cracking and avoiding encapsulation failure, and thus improving the undesirable phenomenon of growing dark spot holes (GDSH) at the opening caused by encapsulation failure; in the second configuration, if the inorganic encapsulation layer cracks at a certain point, the slot can effectively prevent the crack from extending, so that the crack only occurs in a small area of ​​the inorganic encapsulation layer, thus not affecting the overall encapsulation effect, that is, avoiding encapsulation failure of the inorganic encapsulation layer.

[0005] According to an embodiment of the present invention, the annular groove includes a first groove and / or a second groove, wherein the width of the first groove is greater than the width of the second groove.

[0006] According to an embodiment of the present invention, the organic buffer portion located in the first groove is sequentially connected to a plurality of annular organic baffles to form a continuous structure.

[0007] According to an embodiment of the present invention, the organic buffer portion located in the first groove and the plurality of annular organic baffles are an integral structure obtained by the same process step.

[0008] According to an embodiment of the present invention, the surface of the organic buffer portion located in the first groove away from the display substrate is curved, and the curved surface is recessed in the direction close to the display substrate.

[0009] According to an embodiment of the present invention, the annular organic retaining walls include a plurality of spaced-apart annular organic retaining walls. There are two spaced-apart second grooves between two adjacent annular organic retaining walls, and the organic buffer portions disposed in the two spaced-apart second grooves between two adjacent annular organic retaining walls are not connected. The protrusions for setting the annular organic retaining walls have a second groove on both sides in the direction away from and close to the through hole. Each annular organic retaining wall is connected only to the organic buffer portion in the second groove adjacent to it.

[0010] According to an embodiment of the present invention, two second grooves spaced apart between two adjacent annular organic baffles are defined, and the surface of the display substrate located between the two second grooves is a predetermined area, and the inorganic encapsulation layer further covers the predetermined area.

[0011] According to an embodiment of the present invention, the annular region of the inorganic encapsulation layer on the same side of the annular organic barrier includes a plurality of spaced slots, and the plurality of slots are evenly distributed in the annular region.

[0012] According to an embodiment of the present invention, the slots in two different but adjacent annular regions are arranged alternately.

[0013] In another aspect, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the aforementioned display backplate. Therefore, the display device has good reliability, thereby improving the cost-effectiveness of the product. Those skilled in the art will understand that the display device possesses all the features and advantages of the aforementioned display backplate, which will not be elaborated further here. Attached Figure Description

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is a schematic diagram of the structure of a display back panel in the prior art;

[0016] Figure 2 This is a planar schematic diagram of the structure of the display back panel in the prior art;

[0017] Figure 3 It is a scanning electron microscope image of the crack in the inorganic encapsulation layer in the existing technology;

[0018] Figure 4 This is a schematic diagram of the structure of the display back panel in one embodiment of the present invention;

[0019] Figure 5 This is a plan view showing the structure of the back panel portion in one embodiment of the present invention;

[0020] Figure 6 This is a schematic diagram of the structure of the display back panel in another embodiment of the present invention;

[0021] Figure 7 This is a plan view showing the structure of the back panel portion in another embodiment of the present invention;

[0022] Figure 8 This is a schematic diagram of the structure of the display back panel in another embodiment of the present invention;

[0023] Figure 9 This is a plan view showing the structure of the back panel portion in another embodiment of the present invention. Detailed Implementation

[0024] The present invention will be explained below with reference to embodiments. Those skilled in the art will understand that the following embodiments are for illustrative purposes only and should not be considered as limiting the scope of the invention. Where specific techniques or conditions are not specified in the embodiments, they shall be performed in accordance with the techniques or conditions described in the literature in the art or in accordance with the product manual.

[0025] The present invention will now be described with reference to specific embodiments. It should be noted that these embodiments are merely descriptive and do not limit the present invention in any way.

[0026] In current technology, the encapsulation structure around the through-hole 11 can be as follows: Figure 1 and Figure 2 ( Figure 1 for Figure 2As shown in the cross-sectional view at CC', in this structure, the surrounding area of ​​the through hole 11 is encapsulated by the annular organic barrier 20 and the inorganic encapsulation layer 30, thereby effectively isolating the organic material from external water and oxygen erosion. However, the inventors have discovered that the current encapsulation structure has stress concentration areas (i.e., Figure 1 and Figure 3 The dashed area in the diagram indicates that under conditions of process forces and stress fluctuations, the inorganic packaging layer can crack, leading to packaging failure (e.g., ...). Figure 1 and Figure 3 This leads to the undesirable phenomenon of growing dark spot holes (GDSH) at the through-holes, which occurs frequently and is difficult to avoid in the process.

[0027] Accordingly, in one aspect, the present invention provides a display back panel. According to an embodiment of the present invention, referring to... Figures 4 to 7 ( Figure 4 for Figure 5 Cross-sectional view at point AA'. Figure 6 for Figure 7 (Cross-sectional view at BB'), the display backplate includes: a display substrate 10 having a through hole 11 penetrating the display substrate 10; at least one annular organic barrier 20 surrounding the through hole 11; and an inorganic encapsulation layer 30 covering the annular organic barrier 20 and at least a portion of the surface of the display substrate 10 adjacent to the annular organic barrier 20, wherein the display substrate 10 satisfies at least one of the following conditions: First, the first surface of the display substrate 10 has a plurality of annular grooves 12 spaced apart, the annular organic barrier 20 is disposed on a protrusion between the annular grooves 12, the display backplate further includes an organic buffer portion 40 disposed in the annular grooves 12 and communicating with the annular organic barrier 20, and the inorganic encapsulation layer 30 further covers the organic buffer portion 40; Second, the first surface of the display substrate 10 is a flat surface, and the inorganic encapsulation layer 30 adjacent to the annular organic barrier 20 has at least one slot 31 penetrating the inorganic encapsulation layer 30. Therefore, in the first configuration described above, when the inorganic encapsulation layer is subjected to relatively concentrated or large stress, the stress can be released to the organic buffer part, thereby effectively preventing the inorganic encapsulation layer from cracking and avoiding encapsulation failure, and thus improving the undesirable phenomenon of growing dark spot holes (GDSH) at the opening caused by encapsulation failure; in the second configuration, if the inorganic encapsulation layer cracks at a certain point, the slot can effectively prevent the crack from extending, so that the crack only occurs in a small area of ​​the inorganic encapsulation layer, thus not affecting the overall encapsulation effect, that is, avoiding encapsulation failure of the inorganic encapsulation layer.

[0028] In some embodiments, refer to Figures 4-7 The display back panel includes a plurality of spaced-apart annular organic baffles 20. In a first embodiment, the annular organic baffles 20 are arranged around the through hole 11, and the inorganic encapsulation layer 30 covers the annular organic baffles 20 and covers at least a portion of the surface of the display substrate 10 between two adjacent annular organic baffles 20. In a second embodiment, the inorganic encapsulation layer 30 adjacent to two adjacent annular organic baffles 20 has at least one slot 31 penetrating the inorganic encapsulation layer 30.

[0029] It should be noted that the aforementioned protrusion refers to the area of ​​the display substrate where the annular groove 12 is not provided, and not a raised structure on the first surface of the display substrate. The display substrate can be an array substrate with circuit structures such as thin-film transistors. For example, it may include a substrate, a buffer layer on one side of the substrate, an active layer on the side of the buffer layer away from the substrate, a gate insulating layer on the side of the buffer layer away from the substrate and covering the active layer, a gate on the side of the gate insulating layer away from the substrate, an interlayer dielectric layer on the gate insulating layer and covering the gate, and source and drain on the side of the interlayer dielectric layer away from the substrate, with the source and drain connected to the active layer via vias. It may further include a planarization layer on the side of the interlayer dielectric layer away from the substrate and covering the source and drain structures, etc. The first surface of the display substrate refers to the surface away from the substrate. Furthermore, the first surface of the display substrate 10 is a flat surface, which is also relative to the annular groove; that is, the first surface of the display substrate does not have an annular groove.

[0030] In embodiments of the present invention, the specific shape of the through-holes in the display substrate is not particularly required, and those skilled in the art can flexibly design them according to the design requirements of the display device. In some embodiments, the shape of the through-holes may be, but is not limited to, circular (as shown in the accompanying drawings), rectangular, elliptical, sector-shaped, hexagonal, etc.

[0031] In some embodiments of the present invention, the annular groove 12 includes a first groove 121 and / or a second groove 122, wherein the width of the first groove 121 is greater than the width of the second groove 122. In some embodiments, the width of the groove can be 8-12 micrometers, and the width of the second groove can be 2-4 micrometers. Furthermore, there are no special requirements for the depth of the annular groove, and those skilled in the art can flexibly choose according to the situation, as long as the annular groove does not etch the surrounding lines and does not affect the working performance of the display back panel. Of course, the depths of the first groove and the second groove can be the same or different, and those skilled in the art can flexibly choose according to the specific situation. In the embodiments of the present invention, the same display back panel product may include only the first groove, or only the second groove, or both the first groove and the second groove, and those skilled in the art can flexibly choose according to the actual product requirements.

[0032] To better describe the structure of the first and second grooves, the following detailed descriptions will be provided using annular groove 12 as the first groove 121 and annular groove 12 as the second groove 122 as examples:

[0033] In some embodiments of the present invention, the annular groove 12 is a first groove 121, such as... Figure 4 and Figure 5 As shown, the organic buffer portion 40 located in the first groove 121 is sequentially connected to multiple annular organic baffles 20 to form a continuous structure. That is, the multiple annular organic baffles are connected through the organic buffer portion to form a complete integrated structure. Thus, the annular organic baffles have organic buffer portions on both sides, either away from or near the through-hole. This allows the inorganic encapsulation layer corresponding to the sides of the annular baffles to effectively release stress to the organic buffer portion, thereby preventing breakage. In some specific embodiments, the organic buffer portion 40 located in the first groove 121 and the multiple annular organic baffles 20 are an integrated structure manufactured through the same process step. That is, the organic buffer portion 40 and the multiple annular organic baffles 20 are prepared from the same organic material, which simplifies the process and improves manufacturing efficiency.

[0034] In this embodiment, the inorganic encapsulation layer can be further made to completely cover the surface of the organic buffer portion that is not in contact with the display substrate. That is, the inorganic encapsulation layer not only covers the surface of the organic buffer portion away from the display substrate, but also further covers the end faces of the organic buffer portion away from and near the via. Figure 4 As shown, apart from the surface in contact with the display substrate, the remaining surfaces of the organic buffer and the annular organic barrier are covered by an inorganic encapsulation layer. This effectively prevents the organic material from coming into contact with external water and oxygen, thereby further improving the encapsulation effect.

[0035] In some embodiments, refer to Figure 4 As shown, the surface of the organic buffer portion 40 located in the first groove 121 away from the display substrate 10 is curved, and the curved surface is recessed in the direction close to the display substrate 10. The connection between the organic buffer portion and the annular organic barrier in the above structure is relatively smooth, which can better absorb the stress of the inorganic encapsulation layer. In some embodiments of the present invention, the curved structure can be formed by curing the organic material forming the organic buffer portion, thus saving the surface curvature treatment process and reducing the complexity of the manufacturing process.

[0036] In other embodiments of the present invention, the annular groove 12 is a second groove 122, such as... Figure 8 As shown, the display back panel includes multiple spaced-apart annular organic baffles 20. Two spaced-apart second grooves 122 are located between adjacent annular organic baffles 20. The organic buffer portions 40 located in the two spaced-apart second grooves 122 between adjacent annular organic baffles 20 are not connected (i.e., the two second grooves are separated by a partial structure of the display substrate, thus adjacent annular organic baffles are not connected by the organic buffer portions). The protrusions for the annular organic baffles 20 have a second groove 122 on both sides, one away from and one near the through-hole. Each annular organic baffle 20 is only connected to the organic buffer portion 40 in its adjacent second groove 122. Therefore, the organic buffer portions in the annular grooves on both sides of the annular organic baffles can effectively absorb the stress of the inorganic encapsulation layer, preventing cracking of the inorganic encapsulation layer at the edges of the annular organic baffles.

[0037] In this embodiment, the annular organic barrier and the organic buffer 40 in the second groove 122 can be prepared by the same material and process, which simplifies the process and improves the production efficiency.

[0038] Furthermore, in some embodiments, reference is made to... Figure 8 As shown, two spaced-apart second grooves 122 are defined between two adjacent annular organic baffles 20, and the surface of the display substrate located between the two second grooves 122 is a predetermined area S. The inorganic encapsulation layer 30 further covers the predetermined area S. In this way, the complete coverage of the inorganic encapsulation layer can better encapsulate and improve the encapsulation effect.

[0039] Furthermore, in this embodiment, the inorganic encapsulation layer can be made to completely cover the surface of the organic buffer portion that is not in contact with the display substrate. That is, the inorganic encapsulation layer should not only cover the surface of the organic buffer portion away from the display substrate, but also further cover the end faces of the organic buffer portion away from and near the via, such as... Figure 8As shown, apart from the surface in contact with the display substrate, the remaining surfaces of the organic buffer and the annular organic barrier are covered by an inorganic encapsulation layer. This effectively prevents the organic material from coming into contact with external water and oxygen, thereby further improving the encapsulation effect.

[0040] Regarding the second configuration method of the present invention, namely, the method of forming slots in the inorganic encapsulation layer, in some embodiments of the present invention, refer to... Figure 7 and Figure 9 ( Figure 9 The diagram only shows a partial view of the display substrate, the slots, and the inorganic encapsulation layer. For the annular region of the inorganic encapsulation layer 30 on the same side of the annular organic barrier 20 (i.e., the side of the annular organic barrier away from or near the through-hole), it includes multiple spaced slots 31, which are evenly distributed within the annular region. This allows for uniform stress release in the inorganic encapsulation layer, better mitigating concentrated stress and preventing cracking.

[0041] In some embodiments, the display back panel includes a plurality of spaced-apart annular organic baffles. For the annular region of the inorganic encapsulation layer 30 between two adjacent annular organic baffles 20 (i.e., including, for example, three annular baffles, the annular region being the region between the first and second annular organic baffles or the region between the second and third annular organic baffles), at least one slot 31 (the slot exposes a portion of the surface of the display substrate 10) may be included. When a plurality of spaced-apart slots 31 are provided, the plurality of slots 31 (i.e., multiple slots in the same annular region) are uniformly distributed within the annular region. In this way, the stress in the inorganic encapsulation layer can be released uniformly, thus better alleviating the concentrated stress in the inorganic encapsulation layer and preventing its cracking.

[0042] Furthermore, in some embodiments, the total arc length of at least one slot in the annular region of the inorganic encapsulation layer 30 between two adjacent annular organic barrier walls 20 does not exceed half the circumference of the annular region. This can better ensure the good encapsulation effect of the inorganic encapsulation layer and avoid affecting the encapsulation effect due to excessively large slot area. The size of the multiple slots can be the same or different, and there are no restrictions on this.

[0043] According to embodiments of the present invention, such as Figure 7 and Figure 9As shown, the slots 31 in two different but adjacent annular regions are staggered. In this way, the stress concentrated in the inorganic encapsulation layer can be released in a more evenly distributed area, rather than concentrated in a closely spaced area. This can better release stress and at the same time ensure the encapsulation effect of the inorganic encapsulation layer, avoiding the situation where the slots are too close together and affect the encapsulation effect in the vicinity.

[0044] In some embodiments, there are no special requirements for the width of the slot, and those skilled in the art can make flexible choices according to the actual situation, as long as the slot does not expose the annular organic retaining wall.

[0045] According to embodiments of the present invention, the materials of the inorganic encapsulation layer include, but are not limited to, silicon nitride, silicon oxide, or silicon oxynitride; the materials of the annular organic barrier and the organic buffer are organic insulating materials and can have a certain toughness, such as polyimide (PI), so that the stress released by the inorganic encapsulation layer can be well absorbed.

[0046] In another aspect, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the aforementioned display backplate. Therefore, the display device has good reliability, thereby improving the cost-effectiveness of the product. Those skilled in the art will understand that the display device possesses all the features and advantages of the aforementioned display backplate, which will not be elaborated further here.

[0047] According to embodiments of the present invention, there are no special requirements for the specific type of display device. Those skilled in the art can choose flexibly according to the actual situation. For example, the display device can be any display device with display function, such as a mobile phone, computer, iPad, Kindle, game console, etc.

[0048] Those skilled in the art will understand that, in addition to the display back panel described above, the display device also includes the structures or components necessary for conventional display devices. Taking a mobile phone as an example, in addition to the display back panel mentioned above, it also includes the cover plate, touch panel, fingerprint sensor, audio module, camera module, CPU, battery, back cover, mid-frame, and other structures or components necessary for mobile phones.

[0049] The terms "first" and "second" used in this document are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature marked "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0051] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A display back panel, characterized in that, include: The display substrate has a through-hole extending through the display substrate; At least one annular organic barrier wall is disposed around the through hole; An inorganic encapsulation layer covers the annular organic barrier and at least a portion of the surface of the display substrate adjacent to the annular organic barrier. The first surface of the display substrate has a plurality of spaced-apart annular grooves, and the annular organic barrier is disposed on the protrusions between the annular grooves. The display backplate also includes an organic buffer portion disposed in the annular grooves and connected to the annular organic barrier. The inorganic encapsulation layer further covers the organic buffer portion. The organic buffer portion and the annular organic barrier are integral structures manufactured by the same process step.

2. The display back panel according to claim 1, characterized in that, The annular groove includes a first groove and / or a second groove, wherein the width of the first groove is greater than the width of the second groove.

3. The display back panel according to claim 2, characterized in that, The organic buffer section located in the first groove is sequentially connected to a plurality of annular organic baffles to form a continuous structure.

4. The display back panel according to claim 3, characterized in that, The organic buffer section located in the first groove and the multiple annular organic baffles are an integral structure produced by the same process.

5. The display back panel according to claim 3, characterized in that, The surface of the organic buffer portion located in the first groove away from the display substrate is curved, and the curved surface is recessed in the direction close to the display substrate.

6. The display back panel according to claim 2, characterized in that, The device includes multiple spaced-apart annular organic retaining walls. There are two spaced-apart second grooves between two adjacent annular organic retaining walls. The organic buffer portions in the two spaced-apart second grooves between two adjacent annular organic retaining walls are not connected. The protrusions for setting the annular organic retaining walls have a second groove on both sides in the direction away from and near the through hole. Each annular organic retaining wall is connected only to the organic buffer portion in the second groove adjacent to it.

7. The display back panel according to claim 6, characterized in that, The second grooves, which are spaced apart between two adjacent annular organic barrier walls, are defined as a predetermined area, and the surface of the display substrate located between the two spaced second grooves is further covered by the inorganic encapsulation layer.

8. The display back panel according to claim 1, characterized in that, The annular region of the inorganic encapsulation layer on the same side of the annular organic barrier includes a plurality of spaced slots, and the plurality of slots are evenly distributed in the annular region.

9. The display back panel according to claim 8, characterized in that, The slots in two different but adjacent annular regions are staggered.

10. A display device, characterized in that, The display back panel includes any one of claims 1 to 9.

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